TPS61042 Constant Current LED Driver: 1 Features 3 Description
TPS61042 Constant Current LED Driver: 1 Features 3 Description
TPS61042 Constant Current LED Driver: 1 Features 3 Description
TPS61042
SLVS441D – DECEMBER 2002 – REVISED DECEMBER 2014
4 Typical Application
L1
4.7 μH D1
CO†
3 8 100 nF
Vin VIN SW
1.8 V to 6 V
5 CTRL OVP 7
6 GND LED 1
Cin
4 FB RS 2
4.7 μF
Rs
Enable/PWM Brightness Control 13 Ω
100 Hz to 50 kHz
†
Larger output capacitor values of 1 µF and larger, reduce the LED ripple current and improve line regulation.
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
TPS61042
SLVS441D – DECEMBER 2002 – REVISED DECEMBER 2014 www.ti.com
Table of Contents
1 Features .................................................................. 1 8.3 Feature Description................................................... 9
2 Applications ........................................................... 1 8.4 Device Functional Modes........................................ 10
3 Description ............................................................. 1 9 Application and Implementation ........................ 11
4 Typical Application ................................................ 1 9.1 Application Information............................................ 11
9.2 Typical Application ................................................. 16
5 Revision History..................................................... 2
6 Pin Configuration and Functions ......................... 3 10 Power Supply Recommendations ..................... 21
7 Specifications......................................................... 3 11 Layout................................................................... 21
11.1 Layout Guidelines ................................................. 21
7.1 Absolute Maximum Ratings ...................................... 3
11.2 Layout Example .................................................... 21
7.2 ESD Ratings ............................................................ 4
7.3 Recommended Operating Conditions....................... 4 12 Device and Documentation Support ................. 22
7.4 Thermal Information .................................................. 4 12.1 Device Support...................................................... 22
7.5 Electrical Characteristics........................................... 5 12.2 Documentation Support ....................................... 22
7.6 Typical Characteristics .............................................. 6 12.3 Trademarks ........................................................... 22
12.4 Electrostatic Discharge Caution ............................ 22
8 Detailed Description .............................................. 8
12.5 Glossary ................................................................ 22
8.1 Overview ................................................................... 8
8.2 Functional Block Diagram ......................................... 8 13 Mechanical, Packaging, and Orderable
Information ........................................................... 22
5 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
• Added Device Information table, Feature Description section, Device Functional Modes, Application and
Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation
Support section, and Mechanical, Packaging, and Orderable Information section ............................................................... 1
• Added the equation number to all the equations ................................................................................................................... 9
LED 1 8 SW
RS 2 Exposed 7 OVP
Thermal
VIN 3 Die Pad 6 GND
FB 4 5 CTRL
Pin Functions
PIN
I/O DESCRIPTION
NAME NO.
Combined enable and PWM control pin. If CTRL is constantly pulled high, the device is enabled and the
CTRL 5 I internal LED switch (Q2) is constantly turned on. When CTRL is pulled to GND, the device is disabled.
Apply a PWM signal (100 Hz to 50 kHz) to this pin to control the brightness of the LEDs
FB 4 I Feedback. FB regulates the LED current through the sense resistor by regulating the voltage across RS to
252 mV.
GND 6 GND
LED 1 I Input of the LED switch (Q2). Connect the LEDs to this pin.
OVP 7 I Overvoltage protection. OVP is connected to the output capacitor of the converter.
RS 2 O Output of the internal LED switch. The sense resistor that programs the LED current is connected to RS.
SW 8 I Drain of the integrated switch (Q1)
VIN 3 I Input supply pin.
7 Specifications
7.1 Absolute Maximum Ratings
(1)
over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
(2)
V(VIN) Supply voltages –0.3 7 V
V(Rs) , V(CTRL), V(FB) Voltages –0.3 Vin + 0.3 V
V(SW), V(LED) Voltages (2) 30 V
V(OVP) Voltage 30 V
Continuous power dissipation See Thermal Information Table
Operating junction temperature range –40 150 °C
Storage temperature, TSTG –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to network ground terminal.
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
90 88
88 86 IO = 15 mA
86 84
VI = 4.2V
Efficiency – %
Efficiency – %
84
82
82 VI = 3.6V 80
80
78
78
VI = 2.4V 76
76
74 74
72 4 LEDs ≈ 13 V, CO = 1 μF 72 4 LEDs ≈ 13 V, CO = 1 μF
70 70
0.1 1 10 100 1 2 3 4 5 6
IO – Output Current – mA VI – Input Voltage – V
40 TA = 85°C 256
35 254
TA = 25°C
30 252
25 TA = - 40°C 250
20 248
15 246
10 244
5 242
0 240
1.8 2.4 3.0 3.6 4.2 4.8 5.4 6.0 - 40 - 15 10 35 60 85
VI - Input Voltage - V TA - Free-Air Temperature - °C
Figure 3. Operating Quiescent Current into VIN Figure 4. Feedback Voltage vs Temperature
vs Input Voltage and Temperature
60 500
40 450
VCC = 3.6 V
20 400
0 350
- 20 300
VCC = 5 V VCC = 2.4 V
- 40 250
- 60 200
- 40 - 15 10 35 60 85 −40 −15 10 35 60 85
TA - Free-Air Temperature - °C TA − Free-Air Temperature − °C
Figure 5. Feedback Current vs Temperature Figure 6. rds(on) Main Switch (Q1) vs Temperature
600 1.6
rds(on) − On-State Resistance − mΩ
TA = 27°C
Figure 7. rds(ON) Main Switch (Q1) vs Input Voltage Figure 8. rds(on) LED Switch (Q2) vs Temperature
3.0 20
TA = 25°C
rds(on) - On-State Resistance - Ω
2.5
IO - Output Current - mA
15
2.0
1.0
5 fPWM = 25 kHz
0.5
0.0 0
1.8 2.4 3.0 3.6 4.2 4.8 5.4 6.0 0 20 40 60 80 100
VI - Input Voltage - V Duty Cycle - %
Figure 9. rds(on) LED Switch (Q2) vs Input Voltage Figure 10. Average LED Current vs PWM Duty Cycle on
CTRL Pin
8 Detailed Description
8.1 Overview
The TPS61042 operates like a standard boost converter but regulates the voltage across the sense resistor (RS)
instead of the output voltage. This gives an accurate regulated LED current independent of the input voltage and
number of LEDs connected. With integrated overvoltage protection (OVP) the TPS61042 is configured as a
current source with overvoltage protection ideally suited to drive LEDs. With the 30V internal switch, the device
can generate output voltages of up to 27.5 V and has an internal 500mA MOSFET switch (Q1). This allows
several LEDs to be connected in series to the output. The internal LED switch (Q2) in series with the LEDs has a
maximum current rating of 60 mA and disconnects the LEDs from ground during shutdown. The LED switch is
driven by a PWM signal applied to the control pin (CTRL), which directly controls the LED brightness. With this
control method the LED brightness depends on the PWM duty cycle only and is independent of the PWM
frequency and amplitude.
EN
EN SW
UVLO VREF
VIN
Bias 0.252 V
Control Gate Q1
Logic Driver
Thermal
Shutdown
OVP
Enable Current R1
EN
CTRL Control Limit 2 MΩ
Logic Softstart
R2
6 μs Max 30 kΩ
On Time
PWM
GND Gate
Drive
Overvoltage Protection
+
– 0.4 V LED
Q2
Error
Comparator
FB – RS
400 ns Min
+ Off Time
VREF
8.3.3 Softstart
All inductive step-up converters exhibit high in-rush current during start-up if no special precautions are taken.
This can cause voltage drops at the input rail during start-up, which may result in an unwanted or premature
system shutdown.
The TPS61042 limits this in-rush current during start-up by increasing the current limit in two steps starting from
ILIM/4 for 256 switch cycles to ILIM/2 for the next 256 switch cycles and then full current limit. See Figure 23 for
typical start-up behavior.
tp toff
ton ton
High
Low
Minimum Minimum
On-Time t Off-Time
to Enable to Disable
the Device the Device
D = tp/t
(50 μs) (32 ms)
The CTRL timing diagram is shown in Figure 11. To enable the device, the CTRL signal must be high for 50 µs.
The PWM signal can then be applied with a pulse width (tp) greater or smaller than tON. To force the device into
shutdown mode, the CTRL signal must be low for at least 32 ms. Requiring the CTRL pin to be low for 32mS
before the device enters shutdown allows for PWM dimming frequencies as low as 100 Hz. The device is
enabled again when a CTRL signal is high for a period of 50 µs minimum. See Figure 10 for the PWM duty cycle
versus LED current characteristic.
This CTRL pin must be terminated.
8.3.5 Applying a PWM Signal to the CTRL Pin with an On-Time tp≤2.5µs
In such a case the on-time of the PWM signal, tp, must be >2.5μs until the softstart is completed. The softstart is
completed after 512 switching cycles. To simply, estimate the softstart time, multiply the period of the PWM
signal times 512, and add 50μs to it. For a 50-kHz signal this would be 10.3ms as a minimum softstart time
period. After the softstart time is completed the PWM on time can be reduced to tp >400ns.
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
VIN SW
PWM
CTRL OVP
100 Hz to 50 kHz
GND LED
FB RS
Rs
VIN SW
Enable: CTRL = High
CTRL OVP
Disable: CTRL = Low
GND LED
FB RS
R1
VADJ I1
R (Brightness Control)
PWM
Rs Vs
Signal
R2
In Figure 13 the LED current is determined by the voltage applied to R2 (V(adj)) and the selection of R1, R2 and
the sense resistor (RS). In this configuration, the LED current is linear controlled instead of pulsed as in the
configuration before. To select the resistor values following steps are required.
1. Select the voltage V(adjmax) to turn the LEDs off. → V(adjmax) (e.g. 3.3 V)
2. Select the voltage V(adjmin) to turn the LEDs fully on. → V(adjmin) (e.g. 0.0 V)
3. Select the maximum and minimum LED current IO(max) and IO(min). → (e.g. IO(max) = 20 mA, IO(min) = 0 mA)
4. Calculate R2 to achieve a feedback current in the range of I1 = 3 µA to 10 µA as the LEDs are fully turned
on:
Vref - Vadj(min)
R2 =
I1 (5)
5. Calculation of R1
IO(max) ´ R2 + Vadj(min) - IO(min) ´ R2 - Vadj(max)
R1 = Vref ´
Vadj(max) ´ IO(max) + Vref ´ IO(min) - Vadj(min) ´ IO(min) - Vref ´ IO(max) (6)
6. Calculation of the sense voltage (VS) at maximum LED current
æ R1 ö R1
VS = Vref ´ ç 1 + ÷ - ´ Vadj(min)
è R2 ø R2 (7)
7. Calculation of the required sense resistor (RS)
VS
RS =
IO(max) (8)
VIN SW
PWM Brightness Control
CTRL OVP
100 Hz to 50 kHz
GND LED
Enable (EN) FB RS
Figure 14. Separate Enable and PWM Control Using a Schottky Diode
VIN SW
PWM Brightness Control
100 Hz to 50 kHz CTRL OVP
GND LED
Enable (EN) FB RS
FB RS
Figure 16. Separate Enable and PWM Control Using an AND Gate
CO
4.7 μF
VIN
1.8 V to 6 V
VIN SW
CTRL OVP
C(IN)
4.7 μF GND LED
FB RS
RS
Enable/PWM Brightness 13Ω
Control 100 HZ to 50 kHz
Figure 17. TPS61042 With Low LED Ripple Current and Higher Accuracy Using a 4.7 µF Output Capacitor
L1
Sumida CDRH3D16–6R8 D1
6.8 μH Zetex ZHCS400
CO
1 μF
VIN
2.7 V to 6 V VIN SW
CTRL OVP
C(IN)
4.7 μF GND LED
FB RS
RS
Enable/PWM Brightness 13Ω
Control 100 HZ to 50 kHz
L1
10.0 μH D1
Coilcraft DO1605T–103MX Zetex ZHCS400
CO
VIN 100 nF
2.7 V to 6 V VIN SW
CTRL OVP
CIN
4.7 μF GND LED
FB Rs
RS
Enable/PWM Brightness 6.5 Ω R1 R2
Control 100 HZ to 50 kHz 30 Ω 30 Ω
L1 D1
4.7 μH ZHCS400
CO
100 nF
VCC = 1.8 V to 6 V
VIN SW
CTRL OVP
C(IN)
4.7 μF GND LED
FB RS
R1 RS
10 kΩ
Analog Brightness Control 13Ω
3.3 V LED Off
0 V ILED = 20 mA R2
120 kΩ
L1 D1
4.7 μH ZHCS400
CO
100 nF
VCC = 1.8 V to 6 V
VIN SW
CTRL OVP
CIN
4.7 μF GND LED
FB RS
R1 RS
10 kΩ
3.3 V PWM Signal 13Ω
0 % LEDs on
R R2
100 % LEDs Off
C 120 kΩ
CO
VIN 1 μF
1.8 V to 6 V
VIN SW
CTRL OVP
C(IN)
4.7 μF GND LED
FB RS
RS
Enable/PWM Brightness 13 Ω
Control 100 HZ to 50 kHz
Figure 22. TPS61042 With 1,0 mm Total System Height. Efficiency = 82.7%@VI = 3.0 V/19 mA
Vsw
Vout 5V/Div
10V/Div
Vout
500mV/Div
CTRL
1V/Div LED Current
20mA/Div
Input Current
100mA/Div
Vsw
Vsw
5V/Div
5V/Div
Vout
50mV/Div
Vout
500mV/Div
LED Current
20mA/Div
LED Current
20mA/Div
11 Layout
GND VIN
CIN
FB VIN RS LED
4 3 2 1
RSENSE
TPS61042
L LED
5 6 7 8
COUT DIODE
Figure 27. Layout Example
12.3 Trademarks
PowerPAD is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
12.4 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
12.5 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
www.ti.com 10-Dec-2020
PACKAGING INFORMATION
Orderable Device Status Package Type Package Pins Package Eco Plan Lead finish/ MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) Ball material (3) (4/5)
(6)
TPS61042DRBR ACTIVE SON DRB 8 3000 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 85 BHS
TPS61042DRBRG4 ACTIVE SON DRB 8 3000 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 85 BHS
TPS61042DRBT ACTIVE SON DRB 8 250 RoHS & Green NIPDAU Level-2-260C-1 YEAR BHS
TPS61042DRBTG4 ACTIVE SON DRB 8 250 RoHS & Green NIPDAU Level-2-260C-1 YEAR BHS
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com 10-Dec-2020
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com 16-Oct-2020
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com 16-Oct-2020
Pack Materials-Page 2
PACKAGE OUTLINE
DRB0008A SCALE 4.000
VSON - 1 mm max height
PLASTIC SMALL OUTLINE - NO LEAD
3.1 B
A
2.9
C
1 MAX
SEATING PLANE
0.05 DIM A
0.00 0.08 C
OPT 1 OPT 2
1.5 0.1 (0.1) (0.2)
4X (0.23)
EXPOSED (DIM A) TYP
THERMAL PAD
4 5
2X
1.95 1.75 0.1
8
1
6X 0.65
0.37
8X
0.25
PIN 1 ID 0.1 C A B
(OPTIONAL)
(0.65) 0.05 C
0.5
8X
0.3
4218875/A 01/2018
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.
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EXAMPLE BOARD LAYOUT
DRB0008A VSON - 1 mm max height
PLASTIC SMALL OUTLINE - NO LEAD
(1.5)
(0.65)
SYMM
8X (0.6)
(0.825)
8X (0.31) 1 8
SYMM
(1.75)
(0.625)
6X (0.65)
4
5
(R0.05) TYP
( 0.2) VIA
TYP (0.23)
(0.5)
(2.8)
EXPOSED EXPOSED
METAL METAL
4218875/A 01/2018
NOTES: (continued)
4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature
number SLUA271 (www.ti.com/lit/slua271).
5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown
on this view. It is recommended that vias under paste be filled, plugged or tented.
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EXAMPLE STENCIL DESIGN
DRB0008A VSON - 1 mm max height
PLASTIC SMALL OUTLINE - NO LEAD
(0.65)
4X (0.23)
SYMM
METAL
8X (0.6) TYP
4X
(0.725)
8X (0.31) 1 8
(2.674)
SYMM
(1.55)
6X (0.65)
4
5
(R0.05) TYP
(1.34)
(2.8)
EXPOSED PAD
84% PRINTED SOLDER COVERAGE BY AREA
SCALE:25X
4218875/A 01/2018
NOTES: (continued)
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
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