Power Relay JSL Series: 1 POLE - 8A Polarized Latching Type
Power Relay JSL Series: 1 POLE - 8A Polarized Latching Type
Power Relay JSL Series: 1 POLE - 8A Polarized Latching Type
POWER RELAY
1 POLE - 8A Polarized Latching Type
JSL Series
n FEATURES
l Small footprint
- Width: 10mm
- Height: 12.5mm
l High insulation
- Insulation distance: 8 mm (between coil and contacts)
- Dielectric strength: 5,000 VAC (between coil and contacts)
- Surge strength: 10,000 V (between coil and contacts)
l Plastic materials
- UL 94 flame class V-0
l RoHS compliant.
Please see page 6 for more information
n PARTNUMBER INFORMATION
JSL D 12 M N - K
[Example] (a) (b) (c) (d) (e) (f )
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n SPECIFICATION
* Minimum switching loads mentioned above are reference values. Please perform the confirmation test with actual load
before production since reference values may vary according to switching frequencies, environmental conditions and expected
reliability levels.
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n COIL RATING
1 coil 2 coils
Coil
Operating range Coil Resistance Operating range Coil Resistance
Code
Min. VDC Max. VDC +/- 10% (Ohm) Min. VDC Max. VDC +/- 10% (Ohm)
3 2.4 5.4 41 2.4 5.4 19
5 4 9 114 4 9 53
12 9.6 21.2 655 9.6 21.2 300
24 19.2 42.2 2,304 19.2 42.2 1,200
Note: All values in the table are valid for 20°C and zero contact current.
* Specified operate values are valid for pulse wave voltage.
n SAFETY STANDARDS
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n CHARACTERISTIC DATA
n REFERENCE DATA
n COIL POLARITY
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n DIMENSIONS Unit: mm +/- = Set, (+)/(-) = Reset
JSL-M type
l Dimensions l Schematics l PC board mounting
(BOTTOM VIEW) hole layout
(BOTTOM VIEW)
JSL type
l Dimensions l Schematics l PC board mounting
(BOTTOM VIEW) hole layout
(BOTTOM VIEW)
JSL-DM type
l Dimensions l Schematics l PC board mounting
(BOTTOM VIEW) hole layout
(BOTTOM VIEW)
JSL-D type
l Dimensions l Schematics l PC board mounting
(BOTTOM VIEW) hole layout
(BOTTOM VIEW)
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http://www.fujitsu.com/downloads/MICRO/fcai/relays/lead-free-letter.pdf
l Lead free solder plating on relay terminals is Sn-3.0Ag-0.5Cu, unless otherwise specified.
This material has been verified to be compatible with PbSn assembly process.
3. Moisture Sensitivity
l Moisture Sensitivity Level standard is not applicable to electromechanical relays, unless otherwise indicated.
4. Tin Whiskers
l Dipped SnAgCu solder is known as presenting a low risk to tin whisker development. No considerable length
whisker was found by our in house test.
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