WS2815B

Intelligent control LED

integrated light source
Features and Benefits
 The control circuit and RGB chip are integrated in a 5050 components, to form an external control pixel.
 12V power supply voltage can effectively reduce the working current of the whole pixel, reduce the voltage drop of
the circuit board, and maximize the consistency of the mixed light when the pixel is transmitted over a long
distance.
 Using the built-in signal reshaping circuit to achieve the signal waveform shaping, and no distortion of waveform of
signal takes place.
 The gray levels of each pixel are of 256 levels, which achieves “256*256*256=16777216” full-color display, and
the refresh frequency reaches to 2KHz.
 Serial cascade interface, data receiving and decoding depend on just one signal line.
 Dual-signal wires version, signal break-point continuous transmission.
 Any two point the distance more than 5M transmission signal without any increase circuit.
 When the refresh rate is 30fps, cascade numbers is at least 1024 pixels.
 Data transmitting at speeds of up to 800Kbps.
 Good color consistency reliability, high cost-effective.
 NO extra components needed, even the capacitor.

Applications
 Consumer Electronics.
 Landscape lighting fields.
 Computer peripheral products, games devices and machinery equipment etc.

General description
WS2815B is an intelligent control LED light source that the control circuit and RGB chip are integrated in a package of
5050 components. Its internal include intelligent digital port data latch and signal reshaping amplification drive circuit.
Also include a precision internal oscillator and a 12V voltage programmable constant current control part,
which achieves highly consistent color effect.

The data transfer protocol use single NZR communication mode. After the pixel power-on reset, the DIN port receive
data from controller, the first pixel collect initial 24bit data then sent to the internal data latch, the other data which
reshaping by the internal signal reshaping amplification circuit sent to the next cascade pixel through the DO port. After
transmission for each pixel, the signal to reduce 24bit. Every pixel adopts auto-reshaping transmit technology, making
the pixel cascade numbers are not limited to the signal transmission, only relate to the speed of signal transmission.
Refresh Frequency updates to 2KHz, Low Frame Frequency and no Flicker appear in HD Video Camera.
RESET time>280μs, it won’t cause wrong reset while interruption, it supports the lower frequency and inexpensive
MCU.
Integrated circuit chips enable the circuit control simpler, neater and more reliable while NO extra components needed.

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integrated light source
Mechanical Dimensions

Top View Back View Side View Solder Pad

PIN Configuration

PIN Function
NO. Symbol PIN Function description
IC POWER SUPPLY.Can be hung up
1 VCC VCC
or add a filter capacitor between GND
2 VDD VDD LED POWER SUPPLY, connect to “+12V”
3 DO DO Control data signal output
4 DIN 1 DIN 1 Input Control data 1 signal input
5 GND GND Data & Power Grounding
6 DIN 2 DIN 2 Input Control data 2 signal input

Absolute Maximum Ratings

Parameter Symbol Ratings Unit
Power supply voltage VDD +9.5~+13.5 V
Logical Input Voltage VI 3.7-5.3 V
Working Temperature Topt -25～+85 ℃
Storage Temperature Tstg -40~+105 ℃

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Electrical Characteristics (TA=25℃, Vcc=5V, VSS=0V)

Parameter Symbol Min. Tpy. Max. Unit Conditions

Input Current II —— —— ±1 µA VI=VDD/VSS

High-level Input VIH 0.7VCC —— —— V DIN, SET

Low-level Input VIL —— —— 0.3 VCC V DIN, SET

Switching Characteristics (TA=25℃, Vcc=5V, VSS=0V)

Parameter Symbol Min Tpy Max Unit Condition
Transmission Delay Time TPLZ —— —— 300 ns CL=15pF, DIN→DOUT, RL=10KΩ

Fall time TTHZ —— —— 120 µs CL=300pF, OUTR/OUTG/OUTB

Input-capacitance CI —— —— 15 pF ——

LED Characteristics
Quiescent Current: <2.1mA Condition
Parameter Symbol Color
Min Tpy Max Unit (Working current)
RED 200 310 400
Brightness IV GREEN 600 800 1000 mcd 12mA
BLUE 150 190 300
RED 620 623 630
Wavelength λd GREEN 510 520 520 nm 12mA
BLUE 465 471 475

Data Transfer Time

T0H 0-code, High-level time 220ns~380ns

T1H 1-code, High-level time 580ns~1µs

T0L 0-code, Low-level time 580ns~1µs

T1L 1-code, Low-level time 580ns~1µs

RES Frame unit, Low-level time > 280µs

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Sequence chart Cascade method
T0L
0 code
T0H

1 code
T1L D1 D2 D3 D4
T1H DIN DO DIN DO DIN DO

Treset PIX1 PIX2 PIX3

RET code

Data Transmission Method

Note: D1 is the data from MCU, and D2, D3, D4 are from Cascade Circuits.

Composition of 24bit data

G7 G6 G5 G4 G3 G2 G1 G0 R7 R6 R5 R4 R3 R2 R1 R0 B7 B6 B5 B4 B3 B2 B1 B0

Note: Data transmit in order of GRB, high bit data is first.

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Packing Standard

Carrier tape

Packing: 1K/Reel: 167*12mm

4.5K/Reel: 327*12mm

Anti-static bag

Product Label

The foam protective layer

Guard against damp/ Keep dry

Top SMD LED Using Instructions

1. Summary
To make the best use of WORLDSEMI’s LED, please refer to the below precautions, they are of same usage
method as other electronic components.

2. Cautions
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2.1. Dust & Cleaning
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The surface of the LED is encapsulated with modified epoxy resin because it plays a very good role in protecting
the optical performance and aging resistance. The modified epoxy resin is easy to stick with dust and must be kept
clean. When there’s a certain amount of dust on the surface of the LED, it won’t affect brightness, but dust proof
should be taken care of. Promoting the use of unsealed package in preference to others and the assembled LEDs
should be placed in a clean container.

Avoid using the organic solvents to clean the dust on the LED surface and it’s necessary to confirm whether the
cleaning fluid will dissolve the LED.

Do not clean the LEDs by the ultrasonic. Some parameters affecting the LED performance must be evaluated if
have no alternative but to the ultrasonic cleaning method, such as ultrasonic power, baking time and assembly
conditions, etc.

2.2. Moisture-proof packaging

TOP SMD LEDs are moisture sensitive components. LEDs are packaged in aluminum foil bag to prevent the
from absorbing moisture during transport and storage. A desiccant is placed in the bags to absorb moisture. If the
LED absorbs moisture, then it evaporates and expands when in reflow process, which may break the colloid from
the bracket and damage the optical performance of LED. For this reason, moisture-proof packaging is to prevent the
from absorbing moisture during transport and storage. The moisture resistance rating of WORLDSEMI’s LED is:
LEVEL 5a.

Tabel I - IPC/JEDEC J-STD-020 Moisture/Reflow Sensitivity Classification

MSL Level Workshop Life

Time Conditions
LEVEL1 Unlimited ≤30℃/85%RH
LEVEL2 1 Year ≤30℃/60%RH
LEVEL2a 4 Weeks ≤30℃/60%RH
LEVEL3 168 Hours ≤30℃/60%RH
LEVEL4 72 Hours ≤30℃160%RH
LEVEL5 48 Hours ≤30℃/60%RH
LEVEL5a 24 Hours ≤30℃/60%RH
LEVEL6 Take-out and Use immediately ≤30℃/60%RH

2.3. Management after unpacking

1. Please use the LED under the condition of “T<30℃，RH<60%”.

2. Use up within 24 hours after removing from packages.
3. We would recommend to do dehumidification if they exceed the valid storage period of products or dampened
due to other reasons.

2.4. Dehumidification Operation:75℃>24H

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 WS2815B
Intelligent control LED
integrated light source
3. SMT Reflow

Refer to the parameters listed below, the experimental results prove that the TOP SMD LED meets the JEDEC
J-STD-020C standards. As a general guideline, it is recommended to follow the SMT reflow temperature curve
recommended by the solder paste manufacturer.

Curve Description Lead-free

The lowest preheat temperature (Tsmin) Reflow
150℃
The highest preheat temperature (Tsmax) 200℃
Preheating time (Tsmin to Tsmax) (ts) 60-180 S
Average rate of temperature rise (Tsmax to Tp) <3℃/S
LIQUID REGION temperature (TL) 217℃
LIQUID REGION Holding Time (tL) 60-150 S
Peak Temperature (Tp) 240℃
High Temperature Region(Tp=-5℃) Holding <10 S
Time (tp)Rate
Cooling <6℃/S
Room Temperature to Peak Holding Time <6 min

Remarks: 1. These general guidelines may not apply to all PCB designs and reflow soldering configurations.

2. All temperatures referred are measured on the surface of the package body.

4. Assembly Precautions

1. Clip the LED from its 2. Neither directly touch the 3. Not to be double stacke 4. Can not be stored in or
side. gel surface with the hand or d, it may damage its applied in the acidic sites of
sharp instrument, it may internal circuit. PH<7.
damage its internal circuit.

Modify Record www.ledstriplightings.com

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Intelligent control LED
integrated light source
Version № Status Bar Modify Content Summary Date Reviser Approved
V1.0 N New 20180820 Shen JinGuo Yin HuaPing
V1.1 M Correct brightness value, timing range value, 20190507 Shen JinGuo Yin HuaPing
patch matters needing attention

V1.2 M Modify product description 20200519 Shen JinGuo Yin HuaPing

V1.3 M Modify product description 20210401 DongLe Yin HuaPing

Remarks:
1．Initial version: V1.0；Parameter added or modified, version number plus "0.1", for example: V1.0→ V1.1
2．Major version design or more parameters modified, version number plus “1.0”, for example: V1.0→V2.0
3．With no version number attached to part number
4．Status bar: N--New, A--Add, M--Modify, D--Delete

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