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    3048421

    Uploaded by

    Philippe Velha

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    © All Rights Reserved
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    3048421

    Uploaded by

    Philippe Velha
    27 views2 pages

    Copyright

    © © All Rights Reserved

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    Copyright:

    © All Rights Reserved
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    27 views2 pages

    3048421

    Uploaded by

    Philippe Velha

    Copyright:

    © All Rights Reserved
    Download as PDF, TXT or read online from Scribd
    Download as pdf or txt
    of 2

    SMD291SNL

    Datasheet revision 1.2 www.chipquik.com

    Solder Paste No-Clean SAC305 in 5cc Syringe 15g T3 Mesh

    Product Highlights
    Printing speeds up to 100mm/sec Excellent wetting compatibility on most board finishes
    Long stencil life Dispense grade
    Wide process window Compatible with enclosed print heads
    Clear residue Passes BONO test @1.56%
    Low voiding RoHS II and REACH compliant

    Specifications
    Alloy: Sn96.5/Ag3.0/Cu0.5
    Mesh Size: T3
    Micron (µm) Range: 25-45
    Flux Type: Synthetic No-Clean
    Flux Classification: REL0
    Metal Load: 87% Metal by Weight
    Melting Point: 217-220°C (423-428°F)
    Packaging: 5cc/15g Syringe
    Shelf Life: Refrigerated >6 months, Unrefrigerated >2 months *See notes below:

    *Shelf Life Notes: Chip Quik® solder paste is good past its quoted shelf life, regardless of refrigeration. Before use, visually
    inspect the solder paste to ensure it is not dried out or clumpy, or check stencil release. If stored in a jar, stir the product
    thoroughly for 2-3 minutes before inspection and use.

    Chip Quik® solder paste is manufactured using Made in USA high quality synthetic flux and precision atomized metal
    powder. Chip Quik® solder paste is guaranteed for 12 months from date of manufacture, regardless of refrigeration. If you
    have any issues with our solder paste, please contact Chip Quik® directly for no charge warranty replacement. Please retain
    original bill of sale, and solder paste in original container as we may request its return for internal R&D testing purposes.

    Printer Operation
    Print Speed: 25-100mm/sec
    Squeegee Pressure: 70-250g/cm of blade
    Under Stencil Wipe: Once every 10-25 prints, or as necessary

    Stencil Life
    >8 hours @ 20-50% RH 22-28°C (72-82°F)
    >4 hours @ 50-70% RH 22-28°C (72-82°F)

    Stencil Cleaning
    Automated stencil cleaning systems for both stencil and misprinted boards. Manual cleaning using isopropyl alcohol (IPA).

    Storage and Handling


    Refrigerate at 3-8°C (37-46°F). Do not freeze. Allow 4 hours for solder paste to reach an operating temperature of 20-25°C
    (68-77°F) before use.

    Transportation
    This product has no shipping restrictions. Shipping below 0°C (32°F) or above 25°C (77°F) for normal transit times by ground
    or air will not impact this product’s stated shelf life.

    1 © 1994-2017 Chip Quik® Inc.


    Recommended Profile
    Reflow profile for Sn96.5/Ag3.0/Cu0.5 solder assembly, designed as a starting point for process optimization.

    249°C (480°F)

    217°C (423°F)

    175°C (347°F)
    Temperature

    150°C (302°F)

    25°C (77°F)
    0sec 90sec 180sec 210sec 240sec 270sec
    Time

    Test Results
    Test J-STD-004 or other Test Requirement Result
    requirements as stated
    Copper Mirror IPC-TM-650: 2.3.32 L: No breakthrough
    Corrosion IPC-TM-650: 2.6.15 L: No corrosion
    Quantitative Halides IPC-TM-650: 2.3.28.1 L: <0.5%
    Electrochemical Migration IPC-TM-650: 2.6.14.1 L: <1 decade drop (No-clean)
    Surface Insulation Resistance 85°C, IPC-TM-650: 2.6.3.7 L: ≥100MΩ (No-clean)
    85% RH @ 168 Hours
    Tack Value IPC-TM-650: 2.4.44 64g
    Viscosity – Malcom @ 10 RPM/25°C IPC-TM-650: 2.4.34.4 Print: 155-215, Dispense: 125-170
    3
    (x10 mPa/s)
    Visual IPC-TM-650: 3.4.2.5 Clear and free from precipitation
    Conflict Minerals Compliance Electronic Industry Citizenship Compliant
    Coalition (EICC)
    REACH Compliance Articles 33 and 67 of Regulation (EC) Contains no substance >0.1% w/w that
    No 1907/2006 is listed as a SVHC or restricted for
    use in solder materials

    Conforms to the following Industry Standards:


    J-STD-004B, Amendment 1 (Solder Fluxes): Yes
    J-STD-005A (Solder Pastes): Yes
    J-STD-006C, Amendments 1 & 2 (Solder Alloys and Fluxed/Non-Fluxed Solders): Yes
    RoHS 2 Directive 2011/65/EU: Yes

    2 © 1994-2017 Chip Quik® Inc.

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