MX27C4000

4M-BIT [512K x8] CMOS EPROM

FEATURES

• 512K x 8 organization • Operating current: 40mA

• Single +5V power supply • Standby current: 100uA
• +12.5V programming voltage • Package type:
• Fast access time: 90/100/120/150 ns - 32 pin plastic DIP
• Totally static operation - 32 pin PLCC/SOP
- 32 pin TSOP
• Completely TTL compatible

GENERAL DESCRIPTION
The MX27C4000 is a 5V only, 4M-bit, One Time programmers may be used. The MX27C4000 supports
Programmable Read Only Memory. It is organized as a intelligent fast programming algorithm which can result
512K words by 8 bits per word, operates from a single in programming time of less than two minutes.
+5 volt supply, has a static standby mode, and features
fast single address location programming. All program- This EPROM is packaged in industry standard 32 pin
ming signals are TTL levels, requiring a single pulse. For dual-in-line packages, 32 lead PLCC, 32 lead SOP, and
programming outside from the system, existing EPROM 32 lead TSOP packages.

PIN CONFIGURATIONS
32 PDIP/SOP 32 PLCC 32 TSOP
VCC
VPP
A12

A15

A16

A18

A17

VPP 1 32 VCC A11 1 32 OE

A16 2 31 A18 A9 2 31 A10
4 1 32 30 A8 3 30 CE
A15 3 30 A17 A7 5 29 A14
A14 A13 4 29 Q7
A12 4 29
A6 A13 A14 5 28 Q6
A7 5 28 A13
A8 A17 6 27 Q5
MX27C4000

A6 6 27 A8 A5
A18 7 26 Q4
A5 7 26 A9 A4 A9
VCC 8 25 Q3
A4 8 25 A11 MX27C4000
A3 9 MX27C4000 25 A11 VPP 9 24 GND
A3 9 24 OE
A16 10 23 Q2
A2 10 23 A10 A2 OE
A15 11 22 Q1
A1 11 22 CE A1 A10 A12 12 21 Q0
A0 12 21 Q7 A7 13 20 A0
A0 CE
Q0 13 20 Q6 A6 14 19 A1
Q1 14 19 Q5 Q0 13 21 Q7 A5 15 18 A2
14 17 20
Q2 15 18 Q4 A4 16 17 A3
GND 16 17 Q3
Q1

Q2

GND

Q3

Q4

Q5

Q6

BLOCK DIAGRAM PIN DESCRIPTION

CE
CONTROL OUTPUT Q0~Q7 SYMBOL PIN NAME
LOGIC BUFFERS
OE
A0~A18 Address Input
Q0~Q7 Data Input/Output
. .
Y-DECODER Y-SELECT CE Chip Enable Input
. .
. . OE Output Enable Input
A0~A18 .
.
4M BIT
ADDRESS
. .
CELL
VPP Program Supply Voltage
INPUTS X-DECODER
. .
MAXTRIX VCC Power Supply Pin (+5V)
. .
. .
GND Ground Pin
VCC
VSS

P/N: PM00192 1 REV. 3.8, AUG. 26, 2003

 MX27C4000

FUNCTIONAL DESCRIPTION AUTO IDENTIFY MODE

THE PROGRAMMING OF THE MX27C4000 The auto identify mode allows the reading out of a binary
code from an EPROM that will identify its manufacturer
When the MX27C4000 is delivered, or it is erased, the and device type. This mode is intended for use by
chip has all 4M bits in the "ONE" or HIGH state. programming equipment for the purpose of
"ZEROs" are loaded into the MX27C4000 through the automatically matching the device to be programmed
procedure of programming. with its corresponding programming algorithm. This
mode is functional in the 25°C ± 5°C ambient
For programming, the data to be programmed is applied temperature range that is required when programming
with 8 bits in parallel to the data pins. the MX27C4000.

Vcc must be applied simultaneously or before Vpp, and To activate this mode, the programming equipment
removed simultaneously or after Vpp. When must force 12.0 ± 0.5 V on address line A9 of the device.
programming an MXIC EPROM, a 01uF capacitor is Two identifier bytes may then be sequenced from the
required across Vpp and ground to suppress spurious device outputs by toggling address line A0 from VIL to
voltage transients which may damage the device. VIH. All other address lines must be held at VIL during
auto identify mode.

FAST PROGRAMMING Byte 0 ( A0 = VIL) represents the manufacturer code,

and byte 1 (A0 = VIH), the device identifier code. For the
The device is set up in the fast programming mode when MX27C4000, these two identifier bytes are given in the
the programming voltage VPP = 12.75V is applied, with Mode Select Table. All identifiers for manufacturer and
VCC = 6.25 V and OE = VIH (Algorithm is shown in device codes will possess odd parity, with the MSB (Q7)
Figure 1). The programming is achieved by applying a defined as the parity bit.
single TTL low level 100us pulse to the CE input after
addresses and data line are stable. If the data is not
verified, an additional pulse is applied for a maximum of READ MODE
25 pulses. This process is repeated while sequencing
through each address of the device. When the The MX27C4000 has two control functions, both of
programming mode is completed, the data in all address which must be logically satisfied in order to obtain data
is verified at VCC = VPP = 5V ± 10%. at the outputs. Chip Enable (CE) is the power control
and should be used for device selection. Output Enable
(OE) is the output control and should be used to gate
PROGRAM INHIBIT MODE data to the output pins, independent of device selection.
Assuming that addresses are stable, address access
Programming of multiple MX27C4000s in parallel with time (tACC) is equal to the delay from CE to output (tCE).
different data is also easily accomplished by using the Data is available at the outputs tOE after the falling edge
Program Inhibit Mode. Except for CE and OE, all like of OE's, assuming that CE has been LOW and
inputs of the parallel MX27C4000 may be common. A addresses have been stable for at least tACC - tOE.
TTL low-level program pulse applied to an MX27C4000
CE input with VPP = 12.5 ± 0.5 V and CE LOW will
program that MX27C4000. A high-level CE input inhibits STANDBY MODE
the other MX27C4000s from being programmed.
The MX27C4000 has a CMOS standby mode which
reduces the maximum VCC current to 100 uA. It is
PROGRAM VERIFY MODE placed in CMOS standby when CE is at VCC ± 0.3 V.
The MX27C4000 also has a TTL-standby mode which
Verification should be performed on the programmed reduces the maximum VCC current to 1.5 mA. It is
bits to determine that they were correctly programmed. placed in TTL-standby when CE is at VIH. When in
The verification should be performed with OE and CEat standby mode, the outputs are in a high-impedance
VIL, and VPP at its programming voltage. state, independent of the OE input.

P/N: PM00192 REV. 3.8, AUG. 26, 2003

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 MX27C4000

TWO-LINE OUTPUT CONTROL FUNCTION SYSTEM CONSIDERATIONS

To accommodate multiple memory connections, a two- During the switch between active and standby
line control function is provided to allow for: conditions, transient current peaks are produced on the
rising and falling edges of Chip Enable. The magnitude
1. Low memory power dissipation, of these transient current peaks is dependent on the
2. Assurance that output bus contention will not output capacitance loading of the device. At a minimum,
occur. a 0.1 uF ceramic capacitor (high frequency, low inherent
It is recommended that CE be decoded and used as the inductance) should be used on each device between
primary device-selecting function, while OE be made a VCC and GND to minimize transient effects. In addition,
common connection to all devices in the array and to overcome the voltage drop caused by the inductive
connected to the READ line from the system control bus. effects of the printed circuit board traces on EPROM
This assures that all deselected memory devices are in arrays, a 4.7 uF bulk electrolytic capacitor should be
their low-power standby mode and that the output pins used between VCC and GND for each eight devices.
are only active when data is desired from a particular The location of the capacitor should be close to where
memory device. the power supply is connected to the array.

MODE SELECT TABLE

PINS
MODE CE OE A0 A9 VPP OUTPUTS
Read VIL VIL X X VCC DOUT
Output Disable VIL VIH X X VCC High Z
Standby (TTL) VIH X X X VCC High Z
Standby (CMOS) VCC±0.3V X X X VCC High Z
Program VIL VIH X X VPP DIN
Program Verify VIH VIL X X VPP DOUT
Program Inhibit VIH VIH X X VPP High Z
Manufacturer Code(3) VIL VIL VIL VH VCC C2H
Device Code(3) VIL VIL VIH VH VCC 40H

NOTES:
1. VH = 12.0 V ± 0.5 V
2. X = Either VIH or VIL
3. A1 - A8 = A10 - A18 = VIL(For auto select)
4. See DC Programming Characteristics for VPP voltage during programming.

P/N: PM00192 REV. 3.8, AUG. 26, 2003

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 MX27C4000

FIGURE 1. FAST PROGRAMMING FLOW CHART

START

ADDRESS = FIRST LOCATION

VCC = 6.25V
VPP = 12.75V

X=0

PROGRAM ONE 100us PULSE

INTERACTIVE INCREMENT X
SECTION

YES
X = 25?

NO

FAIL
VERIFY BYTE
?

PASS

NO
INCREMENT ADDRESS LAST ADDRESS

FAIL
YES

VCC = VPP = 5.25V

VERIFY SECTION
FAIL
VERIFY ALL BYTES DEVICE FAILED
?

PASS
DEVICE PASSED

P/N: PM00192 REV. 3.8, AUG. 26, 2003

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 MX27C4000

SWITCHING TEST CIRCUITS

DEVICE 1.8K ohm

+5V
UNDER
TEST

DIODES = IN3064
CL
6.2K ohm OR EQUIVALENT

CL = 100 pF including jig capacitance

SWITCHING TEST WAVEFORMS

2.0V 2.0V
AC driving levels TEST POINTS
0.8V 0.8V

INPUT OUTPUT

AC TESTING: (1) AC driving levels are 2.4V/0.4V for commercial grade for MX27C4000-10/12/15.
(2) AC driving levels are 3.0V/0V for MX27C4000-90.
(3) Input pulse rise and fall times are < 10ns.

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 MX27C4000

ABSOLUTE MAXIMUM RATINGS NOTICE:

Stresses greater than those listed under ABSOLUTE
RATING VALUE MAXIMUM RATINGS may cause permanent damage to the
Ambient Operating Temperature -10°C to 70°C device. This is a stress rating only and functional operation
of the device at these or any other conditions above those
Storage Temperature -65°C to 125°C indicated in the operational sections of this specification is not
Applied Input Voltage -0.5V to 7.0V implied. Exposure to absolute maximum rating conditions for
extended period may affect reliability.
Applied Output Voltage -0.5V to VCC + 0.5V
VCC to Ground Potential -0.5V to 7.0V NOTICE:
Specifications contained within the following tables are sub-
V9 & VPP -0.5V to 13.5V ject to change.

DC/AC Operating Conditions for Read Operation

MX27C4000
-90 -10 -12 -15
Operating Temperature -10°C to 70°C -10°C to 70°C -10°C to 70°C -10°C to 70°C
Vcc Power Supply 5V ± 10% 5V ± 10% 5V ± 10% 5V ± 10%

DC CHARACTERISTICS
SYMBOL PARAMETER MIN. MAX. UNIT CONDITIONS
VOH Output High Voltage 2.4 V IOH = -0.4mA
VOL Output Low Voltage 0.4 V IOL = 2.1mA
VIH Input High Voltage 2.0 VCC + 0.5 V
VIL Input Low Voltage -0.3 0.8 V
ILI Input Leakage Current -10 10 uA VIN = 0 to 5.5V
ILO Output Leakage Current -10 10 uA VOUT = 0 to 5.5V
ICC3 VCC Power-Down Current 100 uA CE = VCC ± 0.3V
ICC2 VCC Standby Current 1.5 mA CE = VIH
ICC1 VCC Active Current 40 mA CE = VIL, f=5MHz, Iout = 0mA
IPP VPP Supply Current Read 10 uA CE = OE = VIL, VPP = 5.5V

CAPACITANCE
SYMBOL PARAMETER TYP. MAX. UNIT CONDITIONS
CIN Input Capacitance 8 12 pF VIN = 0V
COUT Output Capacitance 8 12 pF VOUT = 0V
CVPP VPP Capacitance 18 25 pF VPP = 0V

P/N: PM00192 REV. 3.8, AUG. 26, 2003

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 MX27C4000

AC CHARACTERISTICS
27C4000-90 27C4000-10 27C4000-12 27C4000-15

SYMBOL PARAMETER MIN. MAX. MIN. MAX. MIN. MAX. MIN. MAX. UNIT CONDITIONS
tACC Address to Output Delay 90 100 120 150 ns CE = OE = VIL
tCE Chip Enable to Output Delay 90 100 120 150 ns OE = VIL

tOE Output Enable to Output Delay 40 45 50 65 ns CE = VIL

tDF OE High to Output Float, 0 25 0 30 0 35 0 50 ns
or CE High to Output Float

tOH Output Hold from Address, 0 0 0 0 ns

CE or OE which ever occurred first

DC PROGRAMMING CHARACTERISTICS TA = 25°C± 5°C

SYMBOL PARAMETER MIN. MAX. UNIT CONDITIONS
VOH Output High Voltage 2.4 V IOH = -0.40mA
VOL Output Low Voltage 0.4 V IOL = 2.1mA
VIH Input High Voltage 2.0 VCC + 0.5 V
VIL Input Low Voltage -0.3 0.8 V
ILI Input Leakage Current -10 10 uA VIN = 0 to 5.5V
VH A9 Auto Select Voltage 11.5 12.5 V
ICC3 VCC Supply Current (Program & Verify) 50 mA
IPP2 VPP Supply Current(Program) 30 mA CE = VIL, OE = VIH
VCC1 Fast Programming Supply Voltage 6.00 6.50 V
VPP1 Fast Programming Voltage 12.5 13.0 V

AC PROGRAMMING CHARACTERISTICS TA = 25°C± 5°C

SYMBOL PARAMETER MIN. MAX. UNIT CONDITIONS
tAS Address Setup Time 2.0 us
tOES OE Setup Time 2.0 us
tDS Data Setup Time 2.0 us
tAH Address Hold Time 0 us
tDH Data Hold Time 2.0 us
tDFP Out put Enable to Output Float Delay 0 130 ns
tVPS VPP Setup Time 2.0 us
tPW PGM Program Pulse Width 95 105 us
tVCS VCC Setup Time 2.0 us
tOE Data valid from OE 150 ns

P/N: PM00192 REV. 3.8, AUG. 26, 2003

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 MX27C4000

WAVEFORMS

READ CYCLE

ADDRESS
DATA ADDRESS
INPUTS
tACC

CE

tCE

OE
tDF

DATA
VALID DATA
OUT
tOE tOH

FAST PROGRAMMING ALGORITHM WAVEFORM

PROGRAM PROGRAM VERIFY

VIH

Addresses VIL

tAH
tAS Hi-z

DATA DATA IN STABLE DATA OUT VALID

tDS tDH tDFP
VPP1

VPP VCC

tVPS
VCC1
tVCS
VCC VCC

VIH

CE
VIL

tPW tOES tOE

VIH Max

OE VIL

P/N: PM00192 REV. 3.8, AUG. 26, 2003

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 MX27C4000

ORDERING INFORMATION

PLASTIC PACKAGE
PART NO. ACCESS TIME OPERATING STANDBY OPERATING PACKAGE
(ns) CURRENT MAX.(mA) CURRENT MAX.(uA) TEMPERATURE
MX27C4000PC-90 90 40 100 -10°C to 70°C 32 Pin DIP
MX27C4000QC-90 90 40 100 -10°C to 70°C 32 Pin PLCC
MX27C4000MC-90 90 40 100 -10°C to 70°C 32 Pin SOP
MX27C4000PC-10 100 40 100 -10°C to 70°C 32 Pin DIP
MX27C4000QC-10 100 40 100 -10°C to 70°C 32 Pin PLCC
MX27C4000MC-10 100 40 100 -10°C to 70°C 32 Pin SOP
MX27C4000PC-12 120 40 100 -10°C to 70°C 32 Pin DIP
MX27C4000QC-12 120 40 100 -10°C to 70°C 32 Pin PLCC
MX27C4000MC-12 120 40 100 -10°C to 70°C 32 Pin SOP
MX27C4000TC-12 120 40 100 -10°C to 70°C 32 PIn TSOP
MX27C4000PC-15 150 40 100 -10°C to 70°C 32 Pin DIP
MX27C4000QC-15 150 40 100 -10°C to 70°C 32 Pin PLCC
MX27C4000MC-15 150 40 100 -10°C to 70°C 32 Pin SOP
MX27C4000TC-15 150 40 100 -10°C to 70°C 32 Pin TSOP

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 MX27C4000

PACKAGE INFORMATION

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 MX27C4000

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 MX27C4000

REVISION HISTORY

Revision No. Description Page Date

3.0 1) Eliminate Interactive Programming Mode. 5/29/1997
2) MX27C4000-90 AC driving levels changed from 2.4V/0.4V to 3.0V/0V.
3.1 IPP1 100uA -----> 10uA 7/17/1997
3.2 Change TSOP Orientation. 4/09/1998
3.3 Cancel ceramic DIP package type P1,2,9,10 MAR/01/2000
3.4 Cancel "Ultraviolet Erasable" wording in General Description P1 AUG/20/2001
To modify Package Information P10~13
3.5 Remove industrial grade P5,6,9 AUG/13/2002
3.6 To modify Package Information P10~13 NOV/19/2002
3.7 1. To extend the operating temperature from -10°C~70°C P6,9 JUN/19/2003
2. To modify 32-PDIP/PLCC package Information P10,12
3.8 To modify 32-PLCC package information P12 AUG/26/2003
A1: from 0.50mm(0.020 inch)/nom. to 0.58mm(0.023 inch)/nom.
from 0.66mm(0.026 inch)/nom. to 0.81mm(0.032 inch)/nom.

P/N: PM00192 REV. 3.8, AUG. 26, 2003

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 MX27C4000

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