PhotoIC Coupler (AlGaAs LED & PhotoIC)

20 Mbps type
Low input voltage and low power consumption achieved.High speed Photo Coupler with receiver circuit IC.
FEATURES
Capable of high speed communication (Transfer rate
2.2 Typ. 20 Mbps)
Low power consumption: LED forward current: 6 to
4.4 4.3 12 mA, Supply current: Max. 3 mA
High noise immunity (CMTI Min. 20 kV/μs)
Totem pole output Open drain output Guaranteed performance at high temperature (-40 to
+ Vcc + Vcc +105°C)
1 5 1 5
Isolation voltage: 3,750 Vrms
Control circuit
Control circuit

Vout Vout
4 4 Totem pole and Open drain output types available
ｰ GND ｰ GND
2 3 2 3
TYPICAL APPLICATIONS
Truth table Truth table Measuring equipment
LED Output LED Output FA (Factory Automation) network
ON L ON L I/O of high speed communication
OFF H OFF H
Microcomputer communication (SPI, I2C)
(Unit: mm) Note: Please contact our sales representative for automotive applications of PhotoMOS.

TYPES

Part No. Packing quantity

Figure of Supply
Transfer rate Tape and reel Tape and reel
output voltage Tube packing style Tube Tape and reel
packing style X* packing style Z*
Totem pole
APS1241S APS1241SX APS1241SZ
output Typ. 20 1-tube: 100 pcs. 1-reel: 1,000 pcs.
3 to 5 V DC
Open drain Mbps Outer carton: 2,000 pcs. Outer carton: 1,000 pcs.
APS2241S APS2241SX APS2241SZ
output
*Tape and reel packing style X: picked from the 1/2-pin side, tape and reel packing style Z: picked from the 3/4/5-pin side.

RATING

Totem pole output

Absolute maximum ratings (Ambient temperature: 25°C)
Item Symbol APS1241S Remarks
LED forward current IF 25 mA
LED reverse voltage VR 5V
Input

f = 100 Hz,
Peak forward current IFP 1A Duty Ratio = 0.1%,
1 shot
Supply voltage VCC 6V
Output

Output voltage V0 6V
Output current I0 10 mA
Power dissipation Pout 40 mW
I/O isolation voltage Viso 3,750 Vrms
(Avoid icing and
Ambient temperature (Operating) Topr -40 to +105°C
condensation)
Ambient temperature (Storage) Tstg -40 to +125°C

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PhotoIC Coupler (AlGaAs LED & PhotoIC) 20 Mbps type
Electrical characteristics (Unless otherwise specified, Ta = -40 to +105°C, VCC = 2.7 to 5.5V)
Item Symbol APS1241S Condition
Threshold input VCC = 5 V
Maximum IFHL 4 mA
current VO < 0.4 V
Minimum 1.45 V
LED dropout IF = 10 mA
Typical VF 1.6 V
Input

voltage Ta = 25°C
Maximum 1.8 V
f = 1 MHz
Input capacitance Typical Ct 20 pF VB = 0 V
Ta = 25°C
Low level supply
Maximum ICCL 3 mA IF = 9 mA
current
High level supply
Maximum ICCH 3 mA IF = 0 mA
current
Output

IF = 9 mA
Low level output
Maximum VOL 0.4 V IO = 4 mA
voltage
VCC = 5 V
IF = 0 mA
High level output
Minimum VOH 4V IO = -4 mA
voltage
VCC = 5 V

Item Symbol APS1241S Condition

Propagation delay VIN = 0→2.5 V, RIN = 100 Ω
Maximum tpHL 55 ns
time (H → L) CIN = 15 pF, CO = 15 pF
Propagation delay VIN = 2.5→0 V, RIN = 100 Ω
Maximum tpLH 55 ns
time (L → H) CIN = 15 pF, CO = 15 pF
Propagation delay
Maximum tpsk 30 ns −
skew
Pulse width VIN = 2.5 V/10 MHz, RIN = 100 Ω
Maximum |tpHL-tpLH| 30 ns
distortion CIN = 15 pF, CO = 15 pF
Transfer characteristics

VIN = 0→2.5 V, RIN = 100 Ω

Output fall time Typical tf 2 ns
CIN = 15 pF, CO = 15 pF
VIN = 2.5→0 V, RIN = 100 Ω
Output rise time Typical tr 2 ns
CIN = 15 pF, CO = 15 pF
Common mode VCM = 1000 Vp-ṕ, IF = 9 mA
transient immunity Minimum CML 20 kV/μs VCC = 5 V, VO(MAX) = 0.4 V
at low level output Ta = 25°C
Common mode VCM = 1000 Vp-ṕ, IF = 0 mA
transient immunity Minimum CMH 20 kV/μs VCC = 5 V, VO(MIN) = 4 V
at high level output Ta = 25°C
f = 1 MHz, VB = 0 V
I/O capacitance Typical Ciso 0.5 pF
Ta = 25°C
Initial I/O isolation 500 V DC, RH ≦ 60%
Minimum Riso 1,000 MΩ
resistance Ta = 25°C

Test circuit for ICCL Test circuit for ICCH

0.1μF 0.1μF
A A
Control circuit
Control circuit

ICCL ICCH
IF
VCC VCC

Test circuit for VOL Test circuit for VOH

0.1μF 0.1μF
Control circuit

Control circuit

IF VCC VCC
V VOL IO V VOH IO

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 PhotoIC Coupler (AlGaAs LED & PhotoIC) 20 Mbps type
Test circuit for propagation delay time
VIN = 0 ↔ 2.5 V
f = 10 MHz
Duty factor = 50%
tr=5ns tf=5ns

90%
0.1μF

Control circuit
VIN 50%
VCC OV 10%
CO tf tr
VOH
90%
VOUT 50%
CIN RIN
10%

tpHL tpLH

Test circuit for common mode transient immunity tr tf

1kV
90%
VCM
0.1μF VCC 10%
Control circuit

5V
VO IF=0mA
4V
VO
0.4V
IF=9mA
0V
800（V） -800（V）
CMH= CML=
t（μ
r s） t（μ
f s）
VCM

Recommended operating conditions

Please use under recommended operating conditions to obtain expected characteristics.
Item Symbol Min. Max. Unit
LED forward current IF 6 12 mA
Supply voltage VCC 2.7 5.5 V
LED off voltage VF (OFF) 0 0.8 V

REFERENCE DATA

Totem pole output

1.LED forward current vs. ambient 2.LED forward current vs. LED drop out 3.Threshold input current vs. ambient
temperature characteristics voltage characteristics temperature characteristics
Permissible ambient temperature: –40 to +105 °C Permissible ambient temperature: –40 to +105 °C Supply voltage: 5 V
Output voltage: ＜ 0.4 V
50 100 5
Threshold input current (mA)

40 4
LED forward current (mA)

LED forward current (mA)

10
30 Ta = 105°
C 3
85°
C
50°
C
25°
C
20 0°
C 2
1 -25°
C
-40°
C

10 1

0 0 0
-40 -20 0 20 40 60 80 100105 120 1.0 1.2 1.4 1.6 1.8 2.0 2.2 -40 -20 0 20 40 60 80 100105 120
Ambient temperature (°C) LED dropout voltage (V) Ambient temperature (°C)

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PhotoIC Coupler (AlGaAs LED & PhotoIC) 20 Mbps type
4.Low level/high level supply current vs. 5.Low level output voltage vs. ambient 6.High level output voltage vs. ambient
ambient temperature characteristics temperature characteristics temperature characteristics
Supply voltage: 5 V Supply voltage: 5 V; LED current: 9 mA Supply voltage: 5 V; LED current: 0 mA
Output current: 4 mA Output current: -4 mA
5 0.4 5
Low level/high level supply current (mA)

High level output voltage (V)

Low level output voltage (V)
4 4
0.3

3 3
0.2
2 2
ICCL（IF = 9 mA）
0.1
1 1
ICCH（IF = 0 mA）

0 0 0
-40 -20 0 20 40 60 80 100105 120 -40 -20 0 20 40 60 80 100105 120 -40 -20 0 20 40 60 80 100105 120
Ambient temperature (°C) Ambient temperature (°C) Ambient temperature (°C)

7.Propagation delay time (H → L/L → H) vs. 8.Pulse width distortion vs. ambient 9.Propagation delay time(H → L/L → H) vs.
ambient temperature characteristics temperature characteristics LED forward current characteristics
Supply voltage: 5 V Supply voltage: 5 V Supply voltage: 5 V
LED current: 9 mA LED current: 9 mA Ambient temperature: 25 °C
60 40 60

50 50
Propagation delay time (ns)

Propagation delay time (ns)

Pulse width distortion (ns)

20
40 40

tpLH tpLH
30 0 30
tpHL
20 20
-20 tpHL
10 10

0 -40 0
-40 -20 0 20 40 60 80 100105 120 -40 -20 0 20 40 60 80 100105 120 6 7 8 9 10 11 12
Ambient temperature (°C) Ambient temperature (°C) LED forward current (mA)

10.Pulse width distortion vs. LED forward

current characteristics
Supply voltage: 5 V
Ambient temperature: 25 °C
40
Pulse width distortion (ns)

20

-20

-40
6 7 8 9 10 11 12
LED forward current (mA)

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 PhotoIC Coupler (AlGaAs LED & PhotoIC) 20 Mbps type

RATING

Open drain output

Absolute maximum ratings (Ambient temperature: 25°C)
Item Symbol APS2241S Remarks
LED forward current IF 25 mA
LED reverse voltage VR 5V
Input

f = 100 Hz,
Peak forward current IFP 1A Duty Ratio = 0.1%
1shot
Supply voltage VCC 6V
Output

Output voltage V0 6V
Output current I0 25 mA
Power dissipation Pout 40 mW
I/O isolation voltage Viso 3,750 Vrms
(Avoid icing and
Ambient temperature (Operating) Topr -40 to +105°C
condensation)

Ambient temperature (Storage) Tstg -40 to +125°C

Electrical characteristics (Unless otherwise specified, Ta = -40 to +105°C, VCC = 2.7 to 5.5V)
Item Symbol APS2241S Condition
Threshold input VCC = 5 V
Maximum IFHL 4 mA
current VO < 0.6 V
Minimum 1.45 V
LED dropout IF = 10 mA
Typical VF 1.6 V
Input

voltage Ta = 25°C
Maximum 1.8 V
f = 1 MHz
Input capacitance Typical Ct 20 pF VB = 0 V
Ta = 25°C
Low level supply
Maximum ICCL 3 mA IF = 9 mA
current
High level supply
Maximum ICCH 3 mA IF = 0 mA
current
Output

IF = 9 mA
Low level output
Maximum VOL 0.6 V IO = 13 mA
voltage
VCC = 5 V
IF = 0 mA
High level output
Maximum VOH 50 μA VCC = 5.5 V
current
VO = 5.5 V

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PhotoIC Coupler (AlGaAs LED & PhotoIC) 20 Mbps type

Item Symbol APS2241S Condition

VIN = 0→2.5 V, RIN = 100 Ω
Propagation delay time
Maximum tpHL 60 ns CIN = 15 pF, RO = 360 Ω
(H → L)
CO = 15 pF

VIN = 2.5→0 V, RIN = 100 Ω

Propagation delay time
Maximum tpLH 60 ns CIN = 15 pF, RO = 360 Ω
(L → H)
CO = 15 pF
Propagation delay skew Maximum tpsk 40 ns −
VIN = 2.5 V/5 MHz, RIN = 100 Ω
Pulse width distortion Maximum |tpHL-tpLH| 35 ns CIN = 15 pF, RO = 360 Ω
CO = 15 pF

VIN = 0→2.5 V, RIN = 100 Ω

Output fall time Typical tf 1 ns CIN = 15 pF, RO = 360 Ω
CO = 15 pF

VIN = 2.5→0 V, RIN = 100 Ω

Output rise time Typical tr 18 ns CIN = 15 pF, RO = 360 Ω
CO = 15 pF
VCM = 1000 Vp-ṕ, IF = 9 mA
Common mode transient
Minimum CML 20 kV/μs VCC = 5 V, VO(MAX) = 0.8 V
immunity at low level output
Ta = 25°C
VCM = 1000 Vp-ṕ, IF = 0 mA
Common mode transient
Minimum CMH 20 kV/μs VCC = 5 V, VO(MIN) = 2 V
immunity at high level output
Ta = 25°C
f = 1 MHz, VB = 0 V
I/O capacitance Typical Ciso 0.5 pF
Ta = 25°C
Initial I/O isolation 500 V DC, RH ≦ 60%
Minimum Riso 1,000 MΩ
resistance Ta = 25°C

Test circuit for ICCL Test circuit for ICCH

0.1μF
Control circuit

A 0.1μF
A

Control circuit
ICCL ICCH
IF
VCC VCC

Test circuit for VOL Test circuit for IOH

0.1μF
Control circuit

0.1μF
Control circuit

IF VCC A VCC
IOH
VV OL IO VO

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 PhotoIC Coupler (AlGaAs LED & PhotoIC) 20 Mbps type
Test circuit for propagation delay time
VIN = 0 ↔ 2.5 V
f = 5 MHz
Duty factor = 50%
tr=5ns tf=5ns

0.1μF 90%

Control circuit
RO
VIN 50%
VO VCC
OV 10%
CO tf tr
VOH
90%
CIN RIN VOUT 50%
10%

tpHL tpLH

Test circuit for common mode transient immunity tr tf

1kV
90%
VCM
Control circuit

RO 0.1μF 10%
VO VCC 5V
IF=0mA
CO 2V
VO
0.8V
IF=9mA
0V
VCM 800（V） -800（V）
CMH= CML=
t（μ
r s） t（μ
f s）

Recommended operating conditions

Please use under recommended operating conditions to obtain expected characteristics.
Item Symbol Min. Max. Unit
LED forward current IF 6 12 mA
Supply voltage VCC 2.7 5.5 V
LED off voltage VF (OFF) 0 0.8 V

REFERENCE DATA

Open drain output

1.LED forward current vs. ambient 2.LED forward current vs. LED drop out 3.Threshold input current vs. ambient
temperature characteristics voltage characteristics temperature characteristics
Permissible ambient temperature: –40 to +105 °C Permissible ambient temperature: –40 to +105 °C Supply voltage: 5 V
Output voltage: ＜ 0.6 V
50 100 5
Threshold input current (mA)

40 4
LED forward current (mA)

LED forward current (mA)

10
30 Ta = 105°
C 3
85°
C
50°
C
25°
C
20 0°
C 2
1 -25°
C
-40°
C

10 1

0 0 0
-40 -20 0 20 40 60 80 100105 120 1.0 1.2 1.4 1.6 1.8 2.0 2.2 -40 -20 0 20 40 60 80 100105 120
Ambient temperature (°C) LED dropout voltage (V) Ambient temperature (°C)

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PhotoIC Coupler (AlGaAs LED & PhotoIC) 20 Mbps type
4.Low level/high level supply current vs. 5.Low level output voltage vs. ambient 6.Propagation delay time (H → L/L → H) vs.
ambient temperature characteristics temperature characteristics ambient temperature characteristics
Supply voltage: 5 V Supply voltage: 5 V; LED current: 9 mA Supply voltage: 5 V
Output current: 13 mA LED current: 9 mA
5 0.4 60
Low level/high level supply current (mA)

50

Propagation delay time (ns)

Low level output voltage (V)
4
0.3
40 tpLH
3
0.2 30
2 tpHL
20
ICCL（IF = 9 mA）
0.1
1
ICCH（IF = 0 mA） 10

0 0 0
-40 -20 0 20 40 60 80 100105 120 -40 -20 0 20 40 60 80 100105 120 -40 -20 0 20 40 60 80 100105 120
Ambient temperature (°C) Ambient temperature (°C) Ambient temperature (°C)

7.Pulse width distortion vs. ambient 8.Propagation delay time(H → L/L → H) vs. 9.Pulse width distortion vs. LED forward
temperature characteristics LED forward current characteristics current characteristics
Supply voltage: 5 V Supply voltage: 5 V Supply voltage: 5 V
LED current: 9 mA Ambient temperature: 25 °C Ambient temperature: 25 °C
40 60 40

50
Propagation delay time (ns)
Pulse width distortion (ns)

Pulse width distortion (ns)

20 20
40

tpLH
0 30 0

20
-20 tpHL -20
10

-40 0 -40
-40 -20 0 20 40 60 80 100105 120 6 7 8 9 10 11 12 6 7 8 9 10 11 12
Ambient temperature (°C) LED forward current (mA) LED forward current (mA)

DIMENSIONS CAD The CAD data of the products with a “CAD” mark can be downloaded from our Website. Unit: mm

CAD External dimensions Recommended mounting pad

(TOP VIEW)
0.5

1.27
1.2
4.4±0.2

6.8 ±0.4

0.8
6

±0.2
4.3
0.5

2.54
2.1±0.2

Tolerance: ±0.1
0.1

0.4
0.4 Terminal thickness: t = 0.15
1.27 1.27 General tolerance: ±0.1

SAFETY STANDARDS

UL (Recognized) CSA (Certified)

Part No. File No. File No. Remarks
Contact rating Contact rating
(Standard No.) (Standard No.)
PhotoIC APS1241S E191218
20 Mbps - (Certified by C-UL)
Coupler APS2241S (UL1577)

Note: For the latest information on compliance with safety standards, please refer to our website.

Please refer to "the latest product specifications"

when designing your product.
•Requests to customers:
https://industrial.panasonic.com/ac/e/salespolicies/

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 PhotoMOS® Cautions for Use

SAFETY WARNINGS
 o not use the product under conditions that exceed the range
D  heck the wiring diagrams in the catalog and be sure to
C
of its specifications. It may cause overheating, smoke, or fire. connect the terminals correctly. If the device is energized
Do not touch the recharging unit while the power is on. There with short circuit or any wrong connection, it may cause
is a danger of electrical shock. Be sure to turn off the power unexpected malfunction, abnormal heat or fire.
when performing mounting, maintenance, or repair operations
on the device (including connecting parts such as the terminal
board and socket).

PhotoMOS® Cautions for Use

Derating design
Derating is a significant factor for reliable design and product life. 5) When packing printed circuit boards and equipment, avoid using
Even if the conditions of use (temperature, current, voltage, etc.) of high-polymer materials such as foam styrene, plastic, and other
the product are within the absolute maximum ratings, reliability may materials which carry an electrostatic charge.
be lowered remarkably when continuously used in high load 6) When storing or transporting PhotoMOS®, the environment should
conditions (high temperature, high humidity, high current, high not be conducive to generating static electricity (for instance, the
voltage, etc.) Therefore, please derate sufficiently below the humidity should be between 45% and 60%), and PhotoMOS®
absolute maximum ratings and evaluate the device in the actual should be protected using conductive packing materials.
condition.
Moreover, regardless of the application, if malfunctioning can be Unused terminals
expected to pose high risk to human life or to property, or if products The No. 3 terminal is used with the circuit inside the device.
are used in equipment otherwise requiring high operational safety, in Therefore, do not connect it to the external circuitry with either
addition to designing double circuits, that is, incorporating features connection method A, B or C. (1 Form A 6-pin type)
such as a protection circuit or a redundant circuit, safety testing
should also be carried out. Short across terminals
Do not short circuit between terminals when device is energized,
 pplying stress that exceeds the absolute maximum
A since there is possibility of breaking of the internal IC.
rating
If the voltage or current value for any of the terminals exceeds the Surge voltages at the input
absolute maximum rating, internal elements will deteriorate because If reverse surge voltages are present at the input terminals, connect
of the overvoltage or overcurrent. In extreme cases, wiring may a diode in reverse parallel across the input terminals and keep the
melt, or silicon P/N junctions may be destroyed. reverse voltages below the reverse breakdown voltage.
Therefore, the circuit should be designed in such a way that the load Typical circuits are below shown.
never exceed the absolute maximum ratings, even momentarily. 1) 6-pin

Input voltage (for Voltage-sensitive type)

1 6
For rising and dropping ratio of input voltage(dv/dt), maintain Min.
100mV/ms. 2 5
3 4
Oscillation circuit and control circuit (for TSON)
The oscillation circuit and control circuit of product may be destroyed
by external noise, surge, static electricity and so on.
For noise effect to peripheral circuits when oscillation circuit 2) Power type
operates, please implement safety measures on the system before
use by verifying operation under the actual design.

 eterioration and destruction caused by discharge of

D
static electricity (for TSON/RF C×R3/RF C×R5/RF
C×R10)
This phenomenon is generally called static electricity destruction, 3 4
and occurs when static electricity generated by various factors is
discharged while the PhotoMOS® terminals are in contact, producing
internal destruction of the element.
1 2
To prevent problems from static electricity, the following precautions
and measures should be taken when using your device.
1) Employees handling PhotoMOS® should wear anti-static clothing
and should be grounded through protective resistance of 500kΩ
to 1MΩ.
2) A conductive metal sheet should be placed over the worktable.
Measuring instruments and jigs should be grounded.
3) When using soldering irons, either use irons with low leakage
current, or ground the tip of the soldering iron. (Use of low-voltage
soldering irons is also recommended.)
4) Devices and equipment used in assembly should also be
grounded.

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PhotoMOS® Cautions for Use
 ecommended LED forward current or recommended
R Output spike voltages
input voltage 1) If an inductive load generates spike voltages which exceed the
Design in accordance with the recommended operating conditions absolute maximum rating, the spike voltage shall be limited.
for each product. Representative circuit examples of AC/DC dual use type are
Since these conditions are affected by the operating environment, shown below. There are the same with DC only type.
ensure conformance with all relevant specifications. (1) 6-pin
1 6
 ED forward current vs. Ambient temperature
L
characteristics 2 5
Please keep the LED forward current to within the range given Load
3 4
below.

Clamp diode is
100
connected in parallel
with the load.

80 1 6
LED forward current (mA)

2 5
60
Load
3 4
40
CR snubber is
connected in parallel
20
with the load.

0 (2) Power type

-40 -20 0 20 40 60 8085 100
Ambient temperature (°C)

Ripple in the input power supply 1 2 3 4

If ripple is present in the input power supply, observe the following: Load
Clamp diode is
1) For LED forward current at Emin, please maintain the value connected in parallel
mentioned at “■Recommended LED forward current.” with the load.

2) Please make sure the LED forward current for Emax. is no higher
than 50 mA. 1 2 3 4
Load
CR snubber is
3) Please maintain the input voltage at least 4V for Emin. (GU, RF
connected in parallel
and Power voltage-sensitive type). with the load.

4) Please make sure the input voltage for Emax. is no higher than 6V
(GU and RF voltage-sensitive type). 4
1 2 3
Load A varistor is
5) Please make sure the input voltage for Emax. is no higher than 30V connected in parallel
(Power voltage-sensitive type). with PhotoMOS®

(3) TSON
1 4

Load
2 3
Emin. Emax.

Clamp diode is
connected in parallel
6) Please maintain the input voltage at least 3V for Emin. (for TSON)
with the load.
1 4
7) Please make sure the input voltage for Emax. is no higher than 5.5V.
(for TSON) Load
2 3

8) Please keep amplitude voltage of ripple within ±0.5V. (for TSON) CR snubber is
connected in parallel
with the load.
within ±0.5 V

Set voltage
2) When Clamp diode or CR Snubber is used in the circuit, the spike
voltages from the load are limited. But the longer wire may
within ±0.5 V become the inductance and cause the spike voltage. Keep the
wire as short as possible.

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 PhotoMOS® Cautions for Use
Reverse voltages at the input (for TSON) Input wiring pattern
If reverse voltages are present at the input terminals, for example, 1) With AQY* or AQW* series avoid installing the input (LED side)
connect a schottky barrier diode in reverse parallel across the input wiring pattern to the bottom side of the package if you require the
terminals and keep the reverse voltages below the reverse specified I/O isolation voltage (Viso) after mounting the PC board.
breakdown voltage. Typical circuit is shown below. Since part of the frame on the output side is exposed, it may
cause fluctuations in the I/O isolation voltage.
1 4
Portion of output side frame
2 3 (Output terminal side)

Continual DC bias (AQV259 and AQV258)

If a continual DC bias will be applied between the input and output, Input wiring
pattern (Input terminal side)
the breakdown voltage of the switching element MOSFET on the
output side may degrade. Therefore, be sure to test the product
under actual conditions. Example of circuits that will cause May not allow the prescribed I/O withstand
voltage (Viso) to be achieved
degradation of breakdown voltage of MOSFET is given below.
* Excluding reinforced insulation products and SSOP, SON, and TSON packages
1 6
E IF 2 5 2) Exposed terminals are electrically connected to internal elements.
IL
Be aware that contact with external circuits may cause
3 4
deterioration of insulation between input and output, leading to
Load destruction of internal elements.
3) If installed in proximity to other device, take care to avoid short
Cleaning solvents compatibility circuits between device, which may occur if exposed frames of
Cleaning the solder flux should use the immersion washing with an adjacent device come too close.
organic solvent. If you have to use ultrasonic cleaning, please adopt
the following conditions and check that there are no problems in the
actual usage.
• Frequency: 27 to 29kHz
• Ultrasonic output: No greater than 0.25W/cm2*
• Cleaning time: 30s or less
• Cleanser used: Asahiklin AK-225
• Others: Float PCB and the device in the cleaning solvent to
prevent from contacting the ultrasonic vibrator
* Applies to unit area ultrasonic output for ultrasonic baths

Notes for mounting

1) When different kinds of packages are mounted on PC boad,
temperature rise at soldering lead is highly dependent on
package size. Therefore, please set the lower temperature
soldering condition than the conditions of item “■Soldering”, and
confirm the temperature condition of actual usage before
soldering.
2) When soldering condition exceeds our recommendation, the
PhotoMOS® characteristics may be adversely affected. It may
occur package crack or bonding wire breaking because of
thermal expansion unconformity and resin strength reduction.
Please contact our sales office about the propriety of the
condition.
3) Please confirm the heat stress by using actual board because it
may be changed by board condition or manufacturing process
condition.
4) Solder creepage, wettability, or soldering strength will be affected
by the soldering condition or used soldering type. Please check
them under the actual production condition in detail.
5) Please apply coating when the device returns to a room
temperature.

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PhotoMOS® Cautions for Use
Soldering  bout the exposed terminals on the sides of the
A
1) Example of surface-mount terminal recommended conditions package (for VSSOP)
(1) IR (Infrared reflow) soldering method For VSSOP type, as shown in the following figure, part of the input
In case of automatic soldering, following conditions should be and output frames are exposed on the sides of the package. Due to
observed. (recommended condition reflow: Max. 2 times, this, please be keep in mind the cautions listed below.
measurement point: soldering lead) 1) Take care to avoid short circuits between exposed terminals,
t3 which may cause insulation deterioration between input and
T1 = 150 to 180°C output, leading to destruction of internal elements.
T3
T2 = 230°C 2) Since the exposed terminals are connected electrically to the
T2 T3 = 240 to 250°C* internal element, please refer to the item “■Deterioration and
t1 = 60 to 120 s destruction caused by discharge of static electricity”, and
T1
t2 = Within 30 s
t3 = Within 10 s implement sufficient measures to control static electricity.
*240 to 245°C for SON, VSSOP 3) When installing the devices in the vicinity, please keep in mind
and TSON package that if the exposed frames of adjacent devices get too close, a
t1 t2
short between devices may occur.

Part of frame on output side

(2) Other soldering methods
Other soldering methods (VPS, hot-air, hot plate, laser
heating, pulse heater, etc.) affect the PhotoMOS®
characteristics differently, please evaluate the device under
the actual usage.
(3) Manual soldering method Part of frame on input side
Temperature: 350 to 400°C, within 3s, electrical power 30 to
60W Adjacent mounting
When several PhotoMOS® are mounted closely each other or
2) Example of through hole terminal recommended conditions heat-generating components are mounted close to the PhotoMOS®,
(1) DWS soldering method the abnormal heating may occur. This abnormal heat may be
In case of automatic soldering, following conditions should be caused by the internal element when energized or thermal
observed. (recommended condition number of times: Max. 1 interference between the devices. The degree of temperature rise
time, measurement point: soldering lead *1) depends on the mounting layout of the devices and usage condition,
therefore please be sure to use PhotoMOS® with reduced load
T2 T1 = 120°C current after testing under the worst condition of the actual usage.
T2 = Max. 260°C
t1 = within 60 s
T1 Transportation and storage
t2+t3 = within 5 s
1) Extreme vibration during transport may deform the lead or
damage the PhotoMOS® characteristics. Please handle the outer
t1 t2 t3 and inner boxes with care.
2) Inadequate storage condition may degrade soldering,
*1 Solder temperature: Max. 260°C appearance, and characteristics. The following storage conditions
(2) Other soldering method (recommended condition: 1 time) are recommended:
Preheating: Max. 120°C, within 120s, measurement point: • Temperature: 0 to 45°C
soldering lead • Humidity: Max. 70%RH
Soldering: Max. 260°C, within 10s, measurement area: • Atmosphere: No harmful gasses such as sulfurous acid gas,
soldering temperature minimal dust.
(3) Manual soldering method 3) Storage before TSON, VSSOP, SON, SSOP, or SOP processing
Temperature: 350 to 400°C, within 3s, electrical power 30 to In case the heat stress of soldering is applied to the PhotoMOS®
60W which absorbs moisture inside of its package, the evaporation of
the moisture increases the pressure inside the package and it
may cause the package blister or crack. This device is sensitive
to moisture and it is packed in the sealed moisture-proof package.
Please make sure the following condition after unsealing.
* Please use the device immediately after unsealing.
(Within 30 days at 0 to 30°C and Max. 70%RH)
* If the device will be kept for a long time after unsealing, please
store in the another moisture-proof package containing silica gel.
(Please use within 90 days.)

Water condensation
Water condensation occurs when the ambient temperature changes
suddenly from a high temperature to low temperature at high
humidity, or the device is suddenly transferred from a low ambient
temperature to a high temperature and humidity. Condensation
causes the failures such as insulation deterioration. Panasonic
Corporation does not guarantee the failures caused by water
condensation. The heat conduction by the equipment the
PhotoMOS® is mounted may accelerate the water condensation.
Please confirm that there is no condensation in the worst condition
of the actual usage. (Special attention should be paid when high
temperature heating parts are close to the PhotoMOS®.)

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 PhotoMOS® Cautions for Use
Packing format
1) Tape and reel
Tape dimensions Dimensions of tape reel

Direction of picking 21±0.8

1.75±0.1
Tractor feed holes 1.5 +0.5
-0 dia.
0.2 ±0.05 2.2±0.2 4±0.1 2±0.5

2.4±0.2

180±3dia.
60 ±3dia.
TSON

±0.3
4-pin

12
Device mounted
on tape
±0.3 1.05±0.1dia.

5.5±0.1
1.2 2±0.1
4±0.1
13±0.5 dia.
(1) When picked from 1/2-pin side: Part No. AQY2C1R*PX (Shown above) 13±1.5 1.2±0.5
*Quality of material: Polystyrene (PS)
(2) When picked from 3/4-pin side: Part No. AQY2C1R*PZ

Direction of picking

Tractor feed holes 1.5 +0.5

ｰ0 dia.

1.75±0.1
0.4 ±0.05 4.0 ±0.1
2.4±0.2
2.5±0.2

±0.3
VSSOP

12.0
4-pin Device mounted
on tape
3.3±0.3 1±0.1dia. 8±0.1 2±0.1
5.5±0.1

(1) When picked from 1 and 4-pin side: Part No. AQY*TY (Shown above)
(2) When picked from 2 and 3-pin side: Part No. AQY*TW

Direction of picking
1.75±0.1

Tractor feed holes 1.5 +0.5

ｰ0 dia.

0.3±0.05 2.8±0.2 4±0.1

3.6±0.2

SON
±0.3

21±0.8
12

4-pin Device mounted 80 ±1dia.

on tape
1.5±0.1dia. 4±0.1 2±0.1
5.5±0.1

2±0.3
2±0.5

(1) When picked from 1 and 4-pin side: Part No. AQY*MY (Shown above)

250 ±2dia.
80 ±1 dia.
(2) When picked from 2 and 3-pin side: Part No. AQY*MW

Direction of picking
1.75±0.1

Tractor feed holes 1.50 +0.5

ｰ 0 dia.
0.3±0.05 3.0 ±0.1 4.0±0.1
5.1±0.2

13 ±0.5dia. 14±1.5 2 ±0.5

12.0±0.3

*Quality of material: Paper

SSOP
4-pin Device mounted
5.5±0.1

on tape
2.7±0.3 4.0±0.1
1.5+0.1
ｰ 0 dia.

(1) When picked from 1 and 4-pin side: Part No. AQY*VY, APV2111VY (Shown above)
(2) When picked from 2 and 3-pin side: Part No. AQY*VW, APV2111VW

Direction of picking
1.75±0.1

Tractor feed holes

0.3±0.05 1.55±0.05dia. 7.2±0.1
5.5±0.1
±0.3
4.7±0.1

SOP
12

4-pin Device mounted on tape

2.8±0.3 4±0.1 1.55±0.1dia.
12±0.1 2±0.1

(1) When picked from 1/2-pin side: Part No. AQY*SX, APV**21SX (Shown above)
(2) When picked from 3/4-pin side: Part No. AQY*SZ, APV**21SZ
Note: “ * ” indicates characters of number or alphabet.

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PhotoMOS® Cautions for Use

Tape dimensions Dimensions of tape reel

21±0.8
80 ±1dia.
Direction of picking

1.75±0.1
Tractor feed holes ±0.1
0.3±0.05 1.55±0.05dia. 4 7.2±0.1
2±0.5

5.5±0.1
±0.3

250 ±2dia.
80 ±1 dia.
6.9 ±0.1
SOP

12
6-pin Device mounted on tape
12±0.1 2±0.1 1.55±0.1dia.
2.8±0.3

(1) When picked from 1/2/3-pin side: Part No. AQV*SX (Shown above) *Quality of material: Paper 13 ±0.5dia. 14±1.5 2 ±0.5
(2) When picked from 4/5/6-pin side: Part No. AQV*SZ

Direction of picking

1.75±0.1
Tractor feed holes
0.3±0.05 1.55±0.05dia. 7.5±0.1

7.5±0.1
10.15±0.1

16±0.3
SOP
8-pin Device mounted 21±0.8
on tape
80 ±1dia.
4±0.1 1.55±0.1dia.
2.8±0.3
12±0.1 2±0.1

2±0.5
(1) When picked from 1/2/3/4-pin side: Part No. AQW*SX (Shown above)
(2) When picked from 5/6/7/8-pin side: Part No. AQW*SZ

250 ±2 dia.
80 ±1dia.
Direction of picking
1.75±0.1

Tractor feed holes

0.3±0.05 1.55±0.05dia. 7.5±0.1
7.5±0.1
11.15±0.1

16±0.3

SOP Device mounted *Quality of material: Paper 13 ±0.5dia. 17.5±1.5 2±1

16-pin on tape

4±0.1 1.55±0.1dia.
2.8±0.3 12±0.1 2±0.1

(1) When picked from 1/2/3/4/5/6/7/8-pin side: Part No. AQS*SX (Shown above)
(2) When picked from 9/10/11/12/13/14/15/16-pin side: Part No. AQS*SZ

21±0.8
80 ±1dia.

Direction of picking
1.75±0.1

Tractor feed holes ±0.1

4 2±0.5
0.3±0.05 1.5+0.1
ｰ0 dia. 10.2±0.1

DIP 4-pin 300 ±2 dia.

80 ±1dia.
5.5±0.1

12±0.3
5.25±0.1

Surface mount
terminal Device mounted on tape
12±0.1 2±0.1 1.55±0.1dia.
4.2±0.3

(1) When picked from 1/2-pin side: Part No. AQY*HAX, AQY210HLAX (Shown above) *Quality of material: Paper 13±0.5dia. 13.5±2.0 2±0.5
(2) When picked from 3/4-pin side: Part No. AQY*HAZ, AQY210HLAZ

21±0.8
80 ±1dia.
Direction of picking
1.75±0.1

Tractor feed holes

0.3±0.05 1.5+0.1
ｰ0 dia. 10.1±0.1 2±0.5
7.5±0.1

300±2dia.

DIP 6-pin
80±1dia.
±0.3
9.2±0.1

Surface mount
16

terminal Device mounted on tape

12±0.1 4±0.1 1.6±0.1dia.
4.5±0.3 2±0.1

(1) When picked from 1/2/3-pin side: Part No. AQV*AX (Shown above) *Quality of material: Paper 13 ±0.5dia. 17.5±2 2±0.5
(2) When picked from 4/5/6-pin side: Part No. AQV*AZ
Note: “ * ” indicates characters of number or alphabet.

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 PhotoMOS® Cautions for Use

Tape dimensions Dimensions of tape reel

Direction of picking

1.75±0.1
Tractor feed holes ±0.1
0.3 ±0.05
1.5+0.1
ｰ0 dia.
4 10.1±0.1

DIP 8-pin

7.5±0.1
Surface mount

10.2±0.1

±0.3
terminal

16
21±0.8
(Basic insulation Device mounted on tape
80 ±1dia.
type) 12±0.1 2±0.1 1.55±0.1dia.
4.5±0.3
2±0.5
(1) When picked from 1/2/3/4-pin side: Part No. AQW*AX (Shown above)
(2) When picked from 5/6/7/8-pin side: Part No. AQW*AZ

300±2dia.
80±1dia.
Direction of picking

1.75±0.1
Tractor feed holes
0.3±0.05 1.5 +0.1
ｰ0 dia.
4±0.1 10.2±0.1

DIP 8-pin

7.5±0.1
Surface mount

10.3±0.1

16±0.3
terminal *Quality of material: Paper 13 ±0.5dia. 17.5±2 2±0.5
(Reinforced Device mounted on tape
insulation type 12±0.1 2±0.1 1.55±0.1dia.
4.2±0.3

(1) When picked from 1/2/3/4-pin side: Part No. AQW*EHAX,

AQW210HLAX (Shown above)
(2) When picked from 5/6/7/8-pin side: Part No. AQW*EHAZ, AQW210HLAZ

21±0.8
100±1dia.
Direction of picking
±0.1

Tractor feed holes

1.75

0.3±0.05 1.55+0.05
ｰ 0.05 dia.
4.0±0.1 12.6±0.1
2±0.5
11.5 ±0.1

330±2 dia.
Power-DIP

100±1dia.
24.0 ±0.3

4-pin
9.7±0.1

SMD Device mounted

on tape

16.0±0.1 2.0±0.1 1.55±0.1 dia.

4.5±0.3

(1) When picked from 1/2-pin side: Part No. AQY*AX (Shown above) *Quality of material: Paper 13 ±0.5dia. 25.5±2 1.7±0.8
(2) When picked from 3/4-pin side: Part No. AQY*AZ

21±0.8
80 ±1dia.
Direction of picking
1.75±0.1

Tractor feed holes

0.3±0.05 1.5+0.1
ｰ0 dia. 10.1±0.1
2±0.5
7.5±0.1

DIP 6-pin
±0.3
9.2±0.1

300±2dia.
Surface mount 80±1dia.
16

terminal
Device mounted on tape
(Photovoltaic
MOSFET driver) 12±0.1 4±0.1 1.6±0.1dia.
±0.3
4.5
2±0.1

(1) When picked from 1/2/3-pin side: Part No. APV1122AX (Shown above) *Quality of material: Paper 13 ±0.5dia. 17.5±2 2±0.5
(2) When picked from 4/6-pin side: Part No. APV1122AZ
Note: “ * ” indicates characters of number or alphabet.

2) Tube
Devices are packaged in a tube so that 1-pin is on the stopper B
side. Observe correct orientation when mounting them on PC
boards.
(PD type) (SOP type)
Stopper B Stopper A

Stopper B (green) Stopper A (gray)

(DIP type) (Power type)

Stopper B Stopper A Green Gray
Stopper B Stopper A

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PhotoMOS® Cautions for Use
Current limit function (output current control) Adjacent mounting (for Power type)
1) Current limit function aims to increase resistance to surges when 1) When devices are mounted close together with the heat-
the switch is turned on. Before using this function, connect the generated devices, ambient temperature may rise abnormally.
varistor to the output as shown in the figure below. Mounting layout and ventilation should be considered.

1 4 2) When many devices are mounted close together, load current

Varistor Surge: 10×160μs 1.6kV should be reduced. (Refer to the data of “Load current in adjacent
2 3
mounting vs. Ambient temperature characteristics.”)
* Set the varistor voltage to 150 V or less.
Recommended load voltage
2) The current limit function capability can be lost if used longer than As a guide in selecting PhotoMOS®, please refer to the following
the specified time. Be sure to set the output loss to the Max. rate. table.
1) Power photoMOS® (1 Form A)
Short circuit protection circuit
Absolute maximum rating Recommended
The short circuit protection circuit is designed to protect circuits from
Load voltage Load current load voltage
excess current. Therefore, surge current may be detected as current
overload in which case the output current will be cut and the off AQZ102 60 V DC 4.0 A DC 5, 12, 24 V DC
state maintained. For this reason, please include the inrush current DC AQZ105 100 V DC 2.6 A DC 48 V DC
in the load current and keep it below the maximum load current. type AQZ107 200 V DC 1.3 A DC 100 V DC
Also, in order to maintain stability of internal IC operation, maintain AQZ104 400 V DC 0.7 A DC 200 V DC
an input current of at least 5 mA (Latch type), 10 mA (Non Latch 12 V AC
type). AQZ202 Peak AC, DC 60 V Peak AC, DC 3.0 A
5, 12, 24 V DC
24 V AC
AC/ AQZ205 Peak AC, DC 100 V Peak AC, DC 2.0 A
Photovoltaic MOSFET driver cautions for use DC
48 V DC
When two external MOSFETs are connected with a common source type 48 V AC
AQZ207 Peak AC, DC 200 V Peak AC, DC 1.0 A
terminal, oscillation may occur when operation is restored. 100 V DC
Therefore, please insert a 100 to 1,000 Ω resistor between the gate 120 V AC
AQZ204 Peak AC, DC 400 V Peak AC, DC 0.5 A
terminal of the first MOSFET and the gate terminal of the second 200 V DC
MOSFET.
2) Power photoMOS® (1 Form B)
A typical example of this is given in the circuit below.
Absolute maximum rating Recommended
1 6
Load voltage Load current load voltage
2 AC/
100 V AC
3 4 DC AQZ404 Peak AC, DC 400 V Peak AC, DC 0.5 A
200 V DC
type

3) Power photoMOS® Voltage-sensitive type (1 Form A)

Input LED current (for Standard type)
Absolute maximum rating Recommended
For rising and dropping ratio of input LED current (di/dt), maintain
Load voltage Load current load voltage
Min. 100 μA/s.
AQZ102D 60 V DC 3.6 A DC 5, 12, 24 V DC
Input voltage (for Power voltage-sensitive type) DC AQZ105D 100 V DC 2.3 A DC 48 V DC
For rising and dropping ratio of input voltage (dv/dt), maintain Min. type AQZ107D 200 V DC 1.1 A DC 100 V DC
100 mV/s. AQZ104D 400 V DC 0.6 A DC 200 V DC
12 V AC
AQZ202D Peak AC, DC 60 V Peak AC, DC 2.7 A
5, 12, 24 V DC
24 V AC
AC/ AQZ205D Peak AC, DC 100 V Peak AC, DC 1.8 A 48 V DC
DC
type AQZ207D Peak AC, DC 200 V Peak AC, DC 0.9 A 48 V AC
100 V DC
120 V AC
AQZ204D Peak AC, DC 400 V Peak AC, DC 0.45 A
200 V DC

4) Power photoMOS® High Capacity type (1 Form A)

Absolute maximum rating Recommended
Load voltage Load current load voltage

DC AQZ192 60 V DC 10 A DC 5, 12, 24 V DC
type AQZ197 200 V DC 5 A DC 100 V DC
12 V AC
AQZ202G Peak AC, DC 60 V Peak AC, DC 6 A
5, 12, 24 V DC
24 V AC
AC/ AQZ205G Peak AC, DC 100 V Peak AC, DC 4 A 48 V DC
DC
type AQZ207G Peak AC, DC 200 V Peak AC, DC 2 A 48 V AC
100 V DC
120, 240 V AC
AQZ206G2 Peak AC, DC 600 V Peak AC, DC 1 A
200, 400 V DC

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Please contact ..........

Electromechanical Control Business Division

1006, Oaza Kadoma, Kadoma-shi, Osaka 571-8506, Japan
industral.panasonic.com/ac/e/

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ASCTB387E 202002 Specifications are subject to change without notice.