TCA0372
TCA0372
TCA0372
DW SUFFIX
PLASTIC PACKAGE 16
CASE 751G 1
SOP (12+2+2)L
Inv. TCA0372DW
Input
VCC 1 16 Output A
Output
Output B 2 15 NC
Noninv. NC 3 14 NC
Input 4 13
VEE/Gnd VEE/Gnd
Thermal 5 12
Protection
NC 6 11 NC
Inputs –B 7 10 Input –A
VEE
Inputs +B 8 9 Input +A
(Top View)
ORDERING INFORMATION
TCA0372DP1
Operating
Device Temperature Range Package Output A 1 – 8
Inputs A
+
TCA0372DW SOP (12+2+2) L VCC 2 7
Output B 3 + 6
TCA0372DP1 TJ = –40°
40° to +150°C
150°C Plastic DIP Inputs B
– 5
VEE/Gnd 4
TCA0372DP2 Plastic DIP
(Top View)
This document contains information on a new product. Specifications and information herein Motorola, Inc. 1996 Rev 1
are subject to change without notice. 1
MOTOROLA ANALOG IC DEVICE DATA
TCA0372
MAXIMUM RATINGS
Rating Symbol Value Unit
Supply Voltage (from VCC to VEE) VS 40 V
Input Differential Voltage Range VIDR (Note 1) V
Input Voltage Range VIR (Note 1) V
Junction Temperature (Note 2) TJ +150 °C
Storage Temperature Range Tstg –55 to +150 °C
DC Output Current IO 1.0 A
Peak Output Current (Nonrepetitive) I(max) 1.5 A
DC ELECTRICAL CHARACTERISTICS (VCC = +15 V, VEE = –15 V, RL connected to ground, TJ = –40° to +125°C.)
Characteristics Symbol Min Typ Max Unit
Input Offset Voltage (VCM = 0) VIO mV
TJ = +25°C — 1.0 15
TJ, Tlow to Thigh — — 20
Average Temperature Coefficient of Offset Voltage ∆VIO/∆T — 20 — µV/°C
Input Bias Current (VCM = 0) IIB — 100 500 nA
Input Offset Current (VCM = 0) IIO — 10 50 nA
Large Signal Voltage Gain AVOL 30 100 — V/mV
VO = ±10 V, RL = 2.0 k
Output Voltage Swing (IL = 100 mA) VOH V
TJ = +25°C 14.0 14.2 —
TJ = Tlow to Thigh 13.9 — —
TJ = +25°C VOL — –14.2 –14.0
TJ = Tlow to Thigh — — –13.9
Output Voltage Swing (IL = 1.0 A) VOH V
VCC = +24 V, VEE = 0 V, TJ = +25°C 22.5 22.7 —
VCC = +24 V, VEE = 0 V, TJ = Tlow to Thigh 22.5 — —
VCC = +24 V, VEE = 0 V, TJ = +25°C VOL — 1.3 1.5
VCC = +24 V, VEE = 0 V, TJ = Tlow to Thigh — — 1.5
Input Common Mode Voltage Range VICR V
TJ = +25°C VEE to (VCC –1.0)
TJ = Tlow to Thigh VEE to (VCC –1.3)
Common Mode Rejection Ratio (RS = 10 k) CMRR 70 90 — dB
Power Supply Rejection Ratio (RS = 100 Ω) PSRR 70 90 — dB
Power Supply Current ID mA
TJ = +25°C — 5.0 10
TJ = Tlow to Thigh — — 14
NOTES: 1. Either or both input voltages should not exceed the magnitude of VCC or VEE.
2. Power dissipation must be considered to ensure maximum junction temperature (TJ) is not exceeded.
AC ELECTRICAL CHARACTERISTICS (VCC = +15 V, VEE = –15 V, RL connected to ground, TJ = +25°C, unless otherwise noted.)
Characteristics Symbol Min Typ Max Unit
Slew Rate (Vin = –10 V to +10 V, RL = 2.0 k, CL = 100 pF) SR 1.0 1.4 — V/µs
AV = –1.0, TJ = Tlow to Thigh
Gain Bandwidth Product (f = 100 kHz, CL = 100 pF, RL = 2.0 k) GBW MHz
TJ = 25°C 0.9 1.4 —
TJ = Tlow to Thigh 0.7 — —
Phase Margin TJ = Tlow to Thigh φm — 65 — Degrees
RL = 2.0 k, CL = 100 pF
Gain Margin Am — 15 — dB
RL = 2.0 k, CL = 100 pF
Equivalent Input Noise Voltage en — 22 — nV/ √ Hz
RS = 100 Ω, f = 1.0 to 100 kHz
Total Harmonic Distortion THD — 0.02 — %
AV = –1.0, RL = 50 Ω, VO = 0.5 VRMS, f = 1.0 kHz
NOTE: In case VEE is disconnected before VCC, a diode between VEE and Ground is recommended to avoid damaging the device.
Figure 1. Supply Current versus Suppy Voltage Figure 2. Output Saturation Voltage
with No Load versus Load Current
6.5 VCC
VCC–1.0
5.5
VCC–2.0
4.5
VCC+2.0
3.5
VCC+1.0
2.5 VEE
0 2.0 4.0 6.0 8.0 10 12 14 16 18 20 0 0.5 1.0
VCC, |VEE|, SUPPLY VOLTAGE (V) IL, LOAD CURRENT (A)
Figure 3. Voltage Gain and Phase Figure 4. Phase Margin versus Output
versus Frequency Load Capacitance
80 80 70
VCC = +15 V VCC = +15 V
VEE = –15 V φ m , PHASE MARGIN (DEGREES) VEE = –15 V
60 RL = 2.0 kΩ 90 60 RL = 2.0 kΩ
PHASE (DEGREES)
AV = –100
GAIN (dB)
40 100 50
20 110 40
120 30
–20 130 20
1.0 10 100 1000 10000 0 0.4 0.8 1.2 1.6 2.0
f, FREQUENCY (kHz) CL, OUTPUT LOAD CAPACITANCE (nF)
Figure 5. Small Signal Transient Response Figure 6. Large Signal Transient Response
RL = 50 Ω E1 + + E2
VS/2 – –
t, TIME (100
µs/DIV)
VS
Rx 0.1 µF
0.1 µF
R7 10 k
Vin R1
+ +
10 k R3
– 5.0 Ω –
R6 R8 10 k
10 k
R2 R5
10 k 10 k
2R3 R1
For circuit stability, ensure that Rx >
@
where, RM = internal resistance of motor.
RM
The voltage available at the terminals of the motor is: VM +
2 (V1 – S)
V
2
)
|Ro| IM @
where, |Ro| =
2R3 R1 @ and IM is the motor current.
Rx
THERMAL INFORMATION
The maximum power consumption an integrated circuit This must be greater than the sum of the products of the
can tolerate at a given operating ambient temperature can be supply voltages and supply currents at the worst case
found from the equation: operating condition.
TJ(max) = Maximum operating junction temperature
TJ(max)–TA as listed in the maximum ratings section.
PD(TA) = TA = Maximum desired operating ambient
RθJA (typ)
temperature.
where, PD(TA) = power dissipation allowable at a given RθJA(typ) = Typical thermal resistance junction–to–
operating ambient temperature. ambient.
OUTLINE DIMENSIONS
DW SUFFIX
PLASTIC PACKAGE
CASE 751G–02
(SOP (12+2+2)L)
ISSUE A
–A–
16 9
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
–B– 8X P 2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE MOLD
0.010 (0.25) M B M
PROTRUSION.
1 8 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER
SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
J PROTRUSION. ALLOWABLE DAMBAR
16X D PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN
EXCESS OF D DIMENSION AT MAXIMUM
0.010 (0.25) M T A S B S MATERIAL CONDITION.
F MILLIMETERS INCHES
DIM MIN MAX MIN MAX
A 10.15 10.45 0.400 0.411
R X 45 _ B 7.40 7.60 0.292 0.299
C 2.35 2.65 0.093 0.104
D 0.35 0.49 0.014 0.019
C F 0.50 0.90 0.020 0.035
–T– G 1.27 BSC 0.050 BSC
SEATING M J 0.25 0.32 0.010 0.012
14X G K PLANE K 0.10 0.25 0.004 0.009
M 0_ 7_ 0_ 7_
P 10.05 10.55 0.395 0.415
R 0.25 0.75 0.010 0.029
DP2 SUFFIX
PLASTIC PACKAGE
CASE 648–08
ISSUE R
NOTES:
–A– 1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
16 9 3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
B 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
1 8 5. ROUNDED CORNERS OPTIONAL.
INCHES MILLIMETERS
DIM MIN MAX MIN MAX
F C L A 0.740 0.770 18.80 19.55
B 0.250 0.270 6.35 6.85
S C 0.145 0.175 3.69 4.44
D 0.015 0.021 0.39 0.53
SEATING F 0.040 0.70 1.02 1.77
–T– PLANE G 0.100 BSC 2.54 BSC
H 0.050 BSC 1.27 BSC
H K M J 0.008 0.015 0.21 0.38
J K 0.110 0.130 2.80 3.30
G L 0.295 0.305 7.50 7.74
D 16 PL
M 0_ 10 _ 0_ 10 _
0.25 (0.010) M T A M S 0.020 0.040 0.51 1.01
OUTLINE DIMENSIONS
DP1 SUFFIX
PLASTIC PACKAGE
CASE 626–05
ISSUE K
8 5
NOTES:
–B– 1. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
1 4 2. PACKAGE CONTOUR OPTIONAL (ROUND OR
SQUARE CORNERS).
3. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
F
MILLIMETERS INCHES
NOTE 2 –A– DIM MIN MAX MIN MAX
L A 9.40 10.16 0.370 0.400
B 6.10 6.60 0.240 0.260
C 3.94 4.45 0.155 0.175
D 0.38 0.51 0.015 0.020
C F 1.02 1.78 0.040 0.070
G 2.54 BSC 0.100 BSC
H 0.76 1.27 0.030 0.050
–T– J J 0.20 0.30 0.008 0.012
N K 2.92 3.43 0.115 0.135
SEATING
PLANE L 7.62 BSC 0.300 BSC
M M ––– 10_ ––– 10_
D K N 0.76 1.01 0.030 0.040
H G
0.13 (0.005) M T A M B M
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the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and
specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters which may be provided in Motorola
data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals”
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*TCA0372/D*
8 ◊ MOTOROLA ANALOG IC DEVICE DATA
TCA0372/D