QuickSpecs PDF

QuickSpecs HP Pro Series 400 G9 Desktops PCs
Overview
HP Pro Mini 400 G9 Desktop PC
1. Type-C® SuperSpeed USB 20Gbps signaling rate port 4. Combo Audio Jack with CTIA and headset support
(charge support up to 5V/3A) 5. Dual-state power button
2. Type-A SuperSpeed USB 10Gbps signaling rate port 6. Hard drive activity light
3. Type-A SuperSpeed USB 10Gbps signaling rate port (charge
support up to 5V/1.5A)
Not Shown
(2) M.2 (1 as M.2 2230 socket for WLAN/BT and 1 as M.2
2280 socket for storage)
(1) 2.5" internal storage drive bay
Not all configuration components are available in all regions/countries. Page 1

c08017709 – DA 16998 – Worldwide — Version 12 — June 28, 2022
Overview
1. 2x Dual Mode DisplayPort™ 1.4a(DP++) 7. Type-A SuperSpeed USB 10Gbps signaling rate port
2. HDMI 2.1 8. Flex Port 22, choice of:
3. 2x Type-A SuperSpeed USB 5Gbps signaling rate port • 2x Type-A Hi-Speed USB 480Mbps signaling rate port
(Supporting wake from S4/S5 with keyboard/mouse • Serial
connected and enabled in BIOS) • 2nd External Antenna
4. Cover release thumbscrew 9. RJ45 network connector
5. Standard cable lock slot (10 mm) 10. External WLAN antenna opening2
6. Flex Port 1, choice of: 11. Power connector
• DisplayPort™1.4a • VGA 12. Retractable Padlock loop
with HBR3 • Serial1
• HDMI 2.0a
• Type-C® SuperSpeed USB 10Gbps signaling rate port w/
DisplayPort™ Alt Mode and power intake via USB Type-C®
Power Delivery up to 100W
1. Sold separately or as an optional feature.

2. Must be configured at time of purchase.

Standard Features and Configurable Components (availability may vary by country)
HP Pro SFF 400 G9 Desktop PC
1. Slim optical drive (optional) 5. SD card 4.0 reader (optional)

2. (1) Type-C® SuperSpeed USB 10Gbps signaling rate port 6. Combo Audio Jack with CTIA and OMTP and headset
support
3. (1) Type-A SuperSpeed USB 10Gbps signaling rate port 7. Dual-state power button
4. (2) Type-A SuperSpeed USB 10Gbps signaling rate port 8. Hard drive activity light
Not Shown
(1) PCI Express x16
(1) PCI Express x1
(2) M.2 (1 as M.2 2230 socket for WLAN/BT/storage1 and 1 as M.2 2280 socket for storage)
1. Must be configured at time of purchase.

1. Audio line-out connector 7. (2) Type-A Hi-Speed USB 480Mbps signaling rate port
2. Dual-Mode DisplayPort™ 1.4a (DP++) (Supporting wake from S4/S5 with keyboard/mouse
connected and enabled in BIOS)
3. Serial Port (Optional) 8. (3) Type-A SuperSpeed USB 5Gbps signaling rate port
4. HDMI 1.4 9. Internal WLAN antenna cover (optional)
5. Flex Port, choice of: 10. Standard cable lock slot
• DisplayPort™1.4 • VGA 11. HP Business PC Security Lock slot
• HDMI 2.1 • Serial 12. Integrated accessory cable lock
• Dual Type-A SuperSpeed USB 5Gbps signaling rate 13. Power cord connector
• Type-C® SuperSpeed USB 10Gbps signaling rate with
DisplayPort™ Alt mode
6. RJ45 network connector
Not Shown
Port Bay
Optional PS/2 (2 ports) & serial port card1 (connected with (1) 9.5mm internal optical drive bay
mainboard via flyer cable) (1) 3.5" internal storage drive bay
Optional parallel port1
Optional 4 Serial Port PCIe Card1 (1 to 4 serial port dongle)
1. Each of the legacy options will occupy one rear slot.

HP Pro Tower 400/480 G9 PCI Desktop PC
1. Slim optical drive (optional) 5. SD card 4.0 reader (optional)2

2. Hard drive activity light 6. (2) Type-A SuperSpeed USB 10Gbps signaling rate port
3. Dual-state power button 7. (1) Type-A SuperSpeed USB 10Gbps signaling rate port
4. Combo Audio Jack with CTIA and OMTP headset support 8. (1) Type-C® SuperSpeed USB 10Gbps signaling rate port
Not Shown
(1) PCI Express x16
(1) PCI Express x1
(1) PCI x1
(2) M.2 (1 as M.2 2230 socket for WLAN/BT/storage1 and 1 as M.2 2280 socket for storage)
(1) Front Flex Port – Dual SuperSpeed USB Type-A 5Gbps signaling rate2
1. Optional
2. SD card and front flex port can only select one at the same time

HP Pro Tower 400/480 G9 PCI Desktop PC
1. Audio line-out connector 6. (3) Type-A SuperSpeed USB 5Gbps signaling rate port
2. Dual-Mode DisplayPort™ 1.4a (DP++) 7. Internal WLAN antenna cover (optional)
3. HDMI 1.4 8. HP Business PC Security Lock slot
4. Flex Port, choice of: 9. RJ45 network connector
• DisplayPort™1.4 • VGA 10. Serial port (optional)
• HDMI 2.1 • Serial 11. Integrated keyboard/mouse wire hoop
• Dual Type-A SuperSpeed USB 5Gbps signaling rate 12. Pad lock
• Type-C® SuperSpeed USB 10Gbps signaling rate with 13. Power cord connector
DisplayPort™ Alt mode)
14. Standard cable lock slot
5. (2) Type-A Hi-Speed USB 480Mbps signaling rate
(Supporting wake from S4/S5 with keyboard/mouse
connected and enabled in BIOS)
Not Shown
Port Bay
Optional PS/2 (2 ports) & serial port card (connected with (1) 9.5mm internal optical drive bay
mainboard via flyer cable) 1 (2) 3.5” internal storage drive bay
Optional parallel port1
Optional 4 Serial Port PCIe Card1 (1 to 4 serial port dongle)
1. Each of the legacy options will occupy one rear slot


HP ProOne 440 23.8 inch G9 All-in-One Desktop PC (Touch/Non-Touch)
1. Pull-up webcam (optional) 6. Power button

2. Combo Audio Jack with CTIA and OMTP headset support 7. Power activity light
3. Speakers (optional) 8. Type-C® SuperSpeed USB 10Gbps signaling rate port (charge
4. SD media card reader (optional) support up to 5V/3A)
5. On-screen display (OSD) buttons 9. Type-A SuperSpeed USB 10Gbps signaling rate port (charge
support up to 5V/1.5A)
5MP webcam with 5MP webcam with

5MP webcam (optional)
Infrared (IR) sensors (optional) Infrared (IR) / Color Light Sensor (optional)
1. Dual microphones 1. Dual microphones 1. Dual microphones

2. Webcam light 2. Webcam light 2. Webcam light
3. 5MP webcam 3. IR/5MP webcam 3. IR/5MP/CLS webcam
4. IR light 4. IR light


HP ProOne 440 23.8 inch G9 All-in-One Desktop PC (Touch & Non-Touch)
1. Pull-up webcam (optional) 6. (2) Type-A SuperSpeed USB 5Gbps signaling rate port
2. Optical disc drive (optional) (Supporting wake in from S4/S5 with keyboard/mouse
connected and enabled BIOS)
3. Standard cable lock slot 7. Dual-Mode DisplayPort™ 1.4 (DP++)
4. Flex Port, choice of: 8. RJ45 network connector
• DisplayPort™ • Serial 9. (2) Type-A SuperSpeed USB 5Gbps signaling rate port
• HDMI 2.0a • Type-C 10. Power connector
5. HDMI-in
1. Availability may vary by country


AT A GLANCE
• Choice of four form factors: Tower, Small Form Factor, Mini Desktop and All-in-One.
• HP developed and engineered UEFI V2.7 BIOS supporting security, manageability and software image stability.
• Latest commercial class Intel Q670 chipsets supporting latest Intel® 12th Generation Core™ processors, featuring
integrated Intel® UHD Graphics.
o Intel Standard Manageability (ISM) comes standard for Intel® Core™ and Pentium™ configurations.
o Optional Intel® vPro™ Technology upgrade with selected Core™ i5 and Core™ i7 processors (vPro™ is optional and
requires factory configuration).
• Processors support up to 65W for TWR/SFF/AiO and up to 35W for Mini Desktop.
• Choice of Windows 11 Professional, Windows 11 Home, and FreeDOS.
• Integrated 10/100/1000 Ethernet Controller, with optional Wi-Fi 6E, Wi-Fi 6 (802.11ax) and Wi-Fi 5 (802.11ac) and
Bluetooth®.
• Up to 64GB of DDR4 Synchronous Dynamic Random Access Memory (SDRAM).
• Support for up to three video outputs via three standard video connectors and an optional third video port connector which
provides the following choices: DisplayPort™, HDMI, VGA, or USB Type-C® with DisplayPort™ Output on TWR/SFF/Mini.
• Power consumption of Desktop Mini PC varies per configuration, for the best user experience, please connect PC power
cord while using USB-C® cable via Super Speed USB Type-C® port in the rear side of the platform.
• Reduce clutter on Mini Desktop with single cable connection for power and video through USB Type-C® enabled displays
with the optional USB- Type-C® port w/ DisplayPort Alt Mode and power intake via USB Type-C® Power Delivery up to
100W; reduce desktop footprint with the DM mounted behind a USB-C™ enabled display.
• New flexibility is delivered by the All-in-One that can be used as a full PC or as an additional display for another desktop or
laptop PC via the new HDMI-in functionality.
• Monitor Mode disassociates Panel from CPU for a true monitor experience.
• Optional Serial port available on all form factors.
• Multiple HDD data drives set up in a SATA RAID array for TWR/SFF and support RAID 1 configured from factory.
• M.2 raid array available on AiO.
• Integrated accessory cable lock helps secure cabled mouse and keyboard on TWR/SFF.
• Trusted Platform Module (TPM) 2.0.
• HP BIOSphere Gen6.
• HP Client Security Manager Gen6.
• HP Sure Click.
• HP Manageability Integration Kit Gen4.
• HP Image Assistant Gen5.
• HP Support Assistant.
• High efficiency energy saving power supply.
• ENERGY STAR® certified. EPEAT® registered where applicable.
• TUV Low Blue Light certified for All-in-One.
• Low halogen.
• All form factors undergo MIL-STD tests.1
• Dust filter available for TWR/SFF/Mini Desktop.
• Protected by HP Services, including limited warranty up to 1-1-1 (terms and conditions vary by country; certain restrictions
and exclusions apply); Care Packs available with up to 5 years Next Business Day Onsite Hardware Support.
• Compliance with CE (Class B) / FCC (Class B) / UL / UL62368-1) / CSA ( / CSA C22.2 No. 62368-1) / ICES-003 / CCC / VCCI
(Class B) / KCC (Class B).
1. MIL-STD testing is not intended to demonstrate fitness for U.S. Department of Defense contract requirements or for military use. Test results are
not a guarantee of future performance under these test conditions. Accidental damage requires an optional HP Accidental Damage Protection Care
Pack.
NOTE: See important legal disclosures for all listed specs in their respective features sections.


PRODUCT NAME
HP Pro Tower 400 G9 PCI Desktop PC
HP ProOne 440 23.8 inch G9 All-in-One Desktop PC
OPERATING SYSTEM
Preinstalled Windows 11 Pro1
Windows 11 Pro Education1
Windows 11 Home - HP recommends Windows 11 Pro for business1
Windows 11 Home Single Language - HP recommends Windows 11 Pro for business1
Windows 11 Pro (Windows 11 Enterprise available with a Volume Licensing Agreement)1
Windows 10 Pro (available through downgrade rights from Windows 11 Pro)1,3
FreeDOS
1. Device comes with Windows 10 and a free Windows 11 upgrade or may be preloaded with Windows 11. Upgrade timing may vary by device.
Features and app availability may vary by region. Certain features require specific hardware (see Windows 11 Specifications).
2. Not all features are available in all editions or versions of Windows. Systems may require upgraded and/or separately purchased hardware,
drivers, software or BIOS update to take full advantage of Windows functionality. Windows is automatically updated and enabled. High speed
interneet and Microsoft account required. ISP fees apply and additional requirements may apply over time for updates.
See http://www.windows.com.
3. This system is preinstalled with Windows 10 Pro software and also comes with a license for Windows 11 Pro software and provision for
recovery software. You may only use one version of the Windows software at a time. Switching between versions will require you to uninstall one
version and install the other version. You must back up all data (files, photos, etc.) before uninstalling and installing operating systems to avoid
loss of your data.
CHIPSET
Mini SFF TWR AiO
Intel® Q670 X X X X


PROCESSORS
Intel® 12th Generation Core™ Processors Mini SFF TWR AiO
Intel® Core™ i7-12700 Processor1
65W
2.1 GHz base frequency
Up to 4.9 GHz max. turbo frequency with Intel® Turbo Boost
Technology2
25 MB cache, 12 cores, 20 threads X X X*
Intel® UHD Graphics 770
Supports DDR4 memory up to 3200 MT/s data rate
Supports Intel® vPro™ Technology and Intel® Stable Image
Platform Program (SIPP)3
Intel® Core™ i7-12700T Processor1

35W
Technology 3.02
25 MB cache, 12 cores, 20 threads X X

65W
Technology2
18 MB cache, 6 cores, 12 threads X X X

35W
Up to 4.6 GHz max. turbo frequency with Single P-core turbo
Technology
18 MB cache, 6 cores, 12 threads X X
NOTE*: Only available with discrete graphics card.


Mini SFF TWR AiO
65W
Technology2
18 MB cache, 6 cores, 12 threads X X X

35W
Up to 4.4 GHz max. turbo frequency with Single P-core Turbo
Technology18 MB cache, 6 cores, 12 threads
X X

65W
X X X
Technology2
18 MB cache, 6 cores, 12 threads
35W
Up to 4.2 GHz max. turbo frequency with Single P-core Turbo
Technology X X


Mini SFF TWR AiO
60W
Up to 4.4 GHz max. turbo frequency with Single P-Core
technology X X X

35W
Up to 4.2 GHz max. turbo frequency with Single P-Core
technology X X

60W
Technology2 X X X

35W
Up to 4.1 GHz max. turbo frequency with Single P-core
X X
Technology12 MB cache, 4 cores, 8 threads


Intel® Pentium® Processors
Mini SFF TWR AiO
(For FY22 Mini 400, need to add Pentium/ Celeron 35W CPU)
Intel® Pentium® Gold G-7400 Processor1
46W
X X X
Intel® Pentium® Gold G-7400T Processor1
35W
X X
Intel® Celeron® 6900 Processor1
46W
X X
Intel® Celeron® 6900T Processor1
35W
X X
1. Multi-core is designed to improve performance of certain software products. Not all customers or software applications will necessarily
benefit from use of this technology. Performance and clock frequency will vary depending on application workload and your hardware and
software configurations. Intel’s numbering, branding and/or naming is not a measurement of higher performance.
2. Intel® Turbo Boost technology requires a PC with a processor with Intel Turbo Boost capability. Intel Turbo Boost performance varies depending
on hardware, software and overall system configuration. See www.intel.com/technology/turboboost for more information.
3. For full Intel® vPro™ functionality, Windows, a vPro supported processor, vPro enabled chipset, vPro enabled WLAN card and discrete TPM 2.0
are required. See https://www.intel.com/content/www/us/en/architecture-and-technology/vpro/vpro-platform-general.html.


GRAPHICS
Integrated Graphics Mini SFF TWR AiO
Intel® UHD Graphics 770 (integrated on 12th gen Core i7, Core i5-12500
X X X X
and Core i5-12500T)
Intel® UHD Graphics 730 (integrated on Core i3/i5-12400, i5-12400T) X X X X
Intel® UHD Graphics 710 (integrated on Pentium® Gold and Celeron®) X X X X
Optional Discrete Graphics Solutions

NVIDIA T400 2GB LP PCIe x16 Blower Fan 3 mini DP Graphics X X
NVIDIA® T400 4GB Graphics Card X X
AMD Radeon™ 6300M with 2 GB GDDR6 Graphics X
Adapters and Cables

HP DisplayPort™ Cable X X X X
HP DisplayPort™ to DVI-D Adapter X X X X
HP DisplayPort™ to HDMI True 4K Adapter X X X X
HP DisplayPort™ to VGA Adapter X X X X
HP USB to Serial Port Adapter X X X X
STORAGE
3.5 inch SATA Hard Disk Drives (HDD) Mini SFF TWR AiO
500GB* 7200RPM 3.5in SATA HDD X X
1TB* 7200RPM 3.5in SATA HDD X X
2.5 inch SATA Hard Disk Drives (HDD)

500GB* 7200RPM 2.5in SATA HDD X X
500GB 7200RPM 2.5in Self Encrypted OPAL2 SATA HDD** X X
M.2 PCIe NMVe Solid State Drives (SSD)

256GB* M.2 2280 PCIe NVMe SSD X X X X
512GB* M.2 2280 PCIe NVMe SSD X X X X
1TB M*.2 2280 PCIe NVMe SSD X X X
256GB* M.2 2280 PCIe NVMe Three Layer Cell SSD X X X X
512GB* M.2 2280 PCIe NVMe Three Layer Cell SSD X X X X
1TB* M.2 2280 PCIe NVMe Three Layer Cell SSD X X X X
2TB* M.2 2280 PCIe NVMe Three Layer Cell SSD X X X X
256GB* M.2 2280 PCIe NVMe Self Encrypted OPAL2 Three Layer Cell SSD** X X X X


512GB* M.2 2280 PCIe NVMe Self Encrypted OPAL2 Three Layer Cell SSD** X X X X
* For hard drives and solid state drives, GB = 1 billion bytes. TB = 1 trillion bytes. Actual formatted capacity is less. Up to 36 GB (for Windows) of
system disk is reserved for the system recovery software
**Storage DriveLock does not work with Self Encrypting or Optane based storage
Optical Disc Drives Mini SFF TWR AiO

HP 9.5mm Slim DVD-ROM Drive1 X X X
HP 9.5mm Slim DVD Writer Drive2 X X X
HP 9.5mm Slim Blu-Ray Writer Drive3 X X X
1. HD-DVD disks cannot be played on this drive. No support for DVD-RAM. Actual speeds may vary. Don’t copy copyright-protected materials.
Double Layer discs can store more data than single layer discs. Discs burned with this drive may not be compatible with many existing single-layer
DVD drives and players.
2. Don't copy copyright-protected materials.
3. With Blu-Ray, certain disc, digital connection, compatibility and/or performance issues may arise, and do not constitute defects in the product.
Flawless playback on all systems is not guaranteed. In order for some Blu-ray titles to play, they may require a DVI or HDMI digital connection and
your display may require HDCP support. HD-DVD movies cannot be played on this Desktop PC.
Media Card Reader Mini SFF TWR AiO

SD 4.0 with 5-in-1 Interface (Supports SD, SDXC, SDHC, UHS-I, UHS-II) X X
SD 3.0 with 4-in-1 Interface (Supports SD, SDXC, SDHC, UHS-I) X
MEMORY
Mini SFF TWR AiO
DDR4-3200 (Transfer rates up to 3200 MT/s), Max 64 GB, 2 SO-DIMM X X
DDR4-3200 (Transfer rates up to 3200 MT/s), Max 64 GB, 2 U-DIMM X X
Memory Configuration
4GB (4GB x 1) X X X X
16GB (16GB x 1) X X X X
32GB (16GB x 2) X X X X
32GB (32GB x 1) X X X X
64GB (32GB x 2) X X X X
NOTE: For systems configured with more than 3GB of memory and a 32-bit operating system, all memory may not be available due to system
resource requirements. Addressing memory above 4GB requires a 64-bit operating system.
NOTE: Memory modules support data transfer rates up to 3200 MT/s respectively depending on memory module used; actual data rate is
determined by the system's configured processor. See processor specifications for supported memory data rate.
NOTE: All memory slots are customer accessible / upgradeable.
NOTE: Memory speed 3200 MT/s can be achieved via two UDIMMs per channel (2DPC) when populated with the same part number.


NETWORKING/COMMUNICATIONS
Ethernet (RJ-45) Mini SFF TWR AiO
Intel® I219-LM 1 Gigabit Network Connection LOM (vPro) X X
Intel® Ethernet I225-T1 GbE NIC X X
Wireless
Intel® Wi-Fi 6E1 AX211 802.11ax 2x2 with Bluetooth® M.2 Combo Card
X X X X
vPro™2
Intel® Wi-Fi 6E1 AX211 802.11ax 2x2 with Bluetooth® M.2 Combo Card
X X X
non-vPro™2
Realtek Wi-Fi61 RTL8852BE 802.11ax 2x2 with Bluetooth® M.2 Combo
X X X X
Card
Realtek RTL8821CE 802.11ac3 1x1 with Bluetooth® M.2 Combo Card X X X X
1. Wireless access point and Internet service required and sold separately. Availability of public wireless access points limited. Wi-Fi 6 (802.11ax)
is backwards compatible with prior 802.11 specs.
2. Wi-Fi 6 is designed to support gigabit data rate when transferring files between two devices connected to the same router. Requires a wireless
router, sold separately, that supports 80MHz and higher channels.
3. Wireless access point and internet service required and sold separately. Availability of public wireless access points limited. Wi-Fi 5 (802.11 ac)
is backwards compatible with prior 802.11 specs.
NOTE: Intel Wi-Fi 6E modules are available on Elite Tower and SFF G9, but the 6GHz band is not available.
KEYBOARDS AND POINTING DEVICES

Keyboards Mini SFF TWR AiO
HP Business Slim PS/2 Wired Keyboard X X
HP Wired Desktop 320K Keyboard X X X X
HP USB Business Slim Wired SmartCard CCID Keyboard X X X X
HP 125 Wired Keyboard X X X X
HP 125 AntiMicrobial Wired Keyboard (China Only) X X X X
Keyboard & Mouse Combo

HP 655 Wireless Keyboard and Mouse Combo X X X X
Mouse
HP PS/2 Mouse X X
HP Wired Desktop 320M Mouse X X X X
HP 125 Wired Mouse X X X X
HP 125 Wired Antimicrobial Mouse (China Only) X X X X
HP 128 Wired Laser Mouse X X X X
NOTE: Availability may vary by country

SECURITY
Mini SFF TWR AiO
TPM 2.0 (FW: 15.21) endpoint security controller (Infineon SLB9672)
shipped with Windows 10. Common Criteria EAL4+ Certified. FIPS 140-2 X X X X
Level 2 Certified.
Intrusion Sensor (Optional) X X
Intrusion Sensor (integrated in the system board, can be enabled/disabled
X X
through BIOS)
Support for chassis cable lock devices X
(10 mm
X X X
barrel or
smaller)
Support for chassis padlocks devices X X X
Support for table lock X
SATA port disablement (via BIOS) X X X X
Serial, USB enable/disable (via BIOS) X X X X
Intel® Identify Protection Technology (IPT)1 X X X X
Removable media write/boot control X X X X
Power-on password (via BIOS) X X X X
Setup password (via BIOS) X X X X
1. Models configured with Intel® Core™ processors have the ability to utilize advanced security protection for online transactions. IPT, used in
conjunction with participating web sites, provides double identity authentication by adding a hardware component in addition to the usual user
name and password. IPT is initialized through an HP Client Security module


PORTS
Internal Slots and Ports Mini SFF TWR AiO
M.2 PCIe (1) M.2 PCIe x1 2230 (1) M.2 PCIe x1 (1) M.2 PCIe x1 (1) M.2 PCIe x1
(for WLAN/BT) 2230 (for 2230 (for 2230 (for WLAN)
(1) M.2 PCIe x4 2280 WLAN/BT/storage1) WLAN/BT/storage1) (1) M.2 PCIe x4
(for storage) (1) M.2 PCIe x4 (1) M.2 PCIe x4 2280 (for storage)
2280 (for storage) 2280 (for storage) (1) M.2 PCIe x3
2280 (for storage)
PCI Express v4.0 x1 1 1
PCI Express v4.0 x16 1 1
PCI x1 1
SATA port 3 3
Integrated SATA storage connector 1 1
NOTE: For Desktop Mini with M.2 Storage config, there will be no SATA drive bracket. If you plan to use or upgrade the storage with any 2.5" SATA
drive, please select a DM SATA Drive Bracket (available as both factory configured and after market option).
1. Optional.
Bays Mini SFF TWR AiO

9.5mm Slim Optical Disc Drive (ODD) 1 1 11
SD Card Reader1 (optional) 1 1 1
2.5" Internal Storage Drive 1 1
3.5" Internal Storage Drive 1 2
1. Must be configured at time of purchase

2. Need to be configured at the time of purchase, either SATA or the ODD can only be selected one at the same time.
Standard User Accessible Ports Mini SFF TWR AiO

Type-A Hi-Speed USB 480Mbps signaling rate port 2 (rear) 2 (rear)
Type-A SuperSpeed USB 5Gbps signaling rate port 2 (rear) 3 (rear) 3 (rear) 2 (rear)
Type-A SuperSpeed USB 10Gbps signaling rate port 2 (front) 2 (rear)
3 (front) 3 (front)
1 (rear) 1 (side)
Type-C® SuperSpeed USB 10Gbps signaling rate
1 (front) 1 (front) 1 (side)
port
Type-C® SuperSpeed USB 20Gbps signaling rate
1 (front)
port
Video 2 DisplayPort™ 1 DisplayPort™ 1 DisplayPort™ 1.4 1 DisplayPort™
1.4 (rear) 1.4 (rear) (rear) 1.4 (rear)
1 HDMI 2.1 1 HDMI 1.4 (rear) 1 HDMI 1.4 (rear)
(rear)
Audio 1 Combo Audio 1 Combo Audio 1 Combo Audio Jack 1 Combo Audio
Jack with CTIA Jack with CTIA & with CTIA & OMTP Jack with CTIA
and headset OMTP and and headset support and OMTP
support (front) headset support (front) headset
(front) 1 Audio Line- support (side)
1 Audio Line- out/Line-in (rear)
out/Line-in
(rear)


Network Interface 1 RJ45 (rear) 1 RJ45 (rear) 1 RJ45 (rear) 1 RJ45 (rear)
1. Upgradeable to SuperSpeed USB 10Gbps signaling rate port if configured with additional digital video port via Flex Port 1 and/or Intel® vPro™
Rear Configurable Non-PCIe/PCI Slot User Accessible Ports

Flexible Port 1, choice of one
Mini SFF TWR AiO
of the following:
Type-A USB 2 Type-A SuperSpeed 2 Type-A SuperSpeed USB
USB 5Gbps signaling 5Gbps signaling rate port
rate port (rear)
Type-C® USB 1 SuperSpeed USB 1 SuperSpeed USB 1 SuperSpeed USB 10Gbps 1 SuperSpeed USB
10Gbps signaling rate 10Gbps signaling rate signaling rate port w/ 10Gbps signaling rate
port w/ DisplayPort™ port w/ DisplayPort™ DisplayPort™ Alt Mode port w/ DisplayPort™
Alt Mode and power Alt Mode Alt Mode
intake via USB Type-C®
Power Delivery up to
100W
Video 1 DisplayPort™ 1.4 or 1 DisplayPort™ 1.4 or 1 DisplayPort™ 1.4 or 1 DisplayPort™ 1.4 or
HDMI 2.1 or VGA HDMI 2.1 or VGA HDMI 2.1 or VGA HDMI 2.0a or USB-C
Serial (RS-232) 11 1 1 1
1. Sold separately or as an optional feature
(1) Flexible Port 2, choice of

Mini SFF TWR AiO
one of the following:
Type-A USB 2 Hi-Speed USB 2 Type-A SuperSpeed
480Mbps signaling USB 5Gbps signaling rate
rate port1 port2 (front)
Serial (RS-232) 11
2nd External antenna 11
1. Must be configured at time of purchase

2. Front flex IO – Dual USB port and SD card reader can only select one at the same time.


USB SPECIFICATION AND MARKETING NAME MAPPING TABLE
Marketing Name Technical Terminology
Hi-Speed USB 480Mbps signaling rate USB 2.0
SuperSpeed USB 5Gbps signaling rate USB 3.2 Gen 1
SuperSpeed USB 10Gbps signaling rate USB 3.2 Gen 2
SuperSpeed USB 20Gbps signaling rate USB 3.2 Gen 2x2


SOFTWARE COMPONENTS AND APPLICATIONS WITH WINDOWS
Software
HP Easy Clean1
HP QuickDrop2
HP PC Hardware Diagnostics UEFI
HP Desktop Support Utilities
HP Privacy Settings
HP Setup Integrated OOBE
HP Support Assistant3
Touchpoint Customizer for Commercial
myHP
HP Notifications
HP Connection Optimizer
HP Smart Support4
Buy Microsoft Office (sold separately)
Manageability Features
HP Connect for Microsoft Endpoint Manager5
HP Image Assistant Gen5 (download)
HP Manageability Integration Kit (download)6
HP Client Management Script Library (download)
HP Patch Assistant (download)7
HP Driver Packs (download)
HP Cloud Recovery8
HP Client Catalog (download)
Security Management
HP Wolf Security for Business9:
HP Sure Click10
HP Sure Sense11
HP Sure Start Gen712
HP Tamper Lock
HP Sure Admin13
BIOS
HP BIOSphere Gen614
HP Secure Erase15
HP DriveLock & Automatic DriveLock
BIOS Update via Network
Absolute Persistence Module16
TPM 2.017 Embedded Security Chip (Common Criteria EAL4+ Certified) (FIPS 140-2 Level 2 Certified)
1. HP Easy Clean requires Windows 10 RS3 and will disable the keyboard, touchscreen, and clickpad only. Ports are not disabled. See user guide for
cleaning instructions.
2. HP Quick Drop requires Internet access and Windows 10 or higher PC preinstalled with HP QuickDrop app and either an Android device (phone or
tablet) running Android 7 or higher with the Android HP QuickDrop app, and /or an iOS device (phone or tablet) running iOS 12 or higher with the
iOS HP QuickDrop app.
3. HP Support Assistant requires Windows and Internet Access
4. HP Smart Support automatically collects the telemetry necessary upon initial boot of the product to deliver device-level configuration data and
health insights and is available preinstalled on select products, or it can be downloaded. For more information about how to enable HP Smart
Support or to download, please visit http://www.hp.com/smart-support.
5. HP Connect for Microsoft Endpoint Manager is available from the Azure Market Place for HP Pro, Elite, Z and Point-of-Sale PCs managed with
Microsoft Endpoint Manager. Subscription to Microsoft Endpoint Manager required and sold separately. Network connection required.
6. HP Manageability Integration Kit can be downloaded from http://www.hp.com/go/clientmanagement.


7. HP Patch Assistant available on select HP PCs with the HP Manageability Kit that are managed through Microsoft System Center Configuration
Manager. HP Manageability Integration Kit can be downloaded from http://www8.hp.com/us/en/ads/clientmanagement/overview.html.
8. HP Cloud Recovery is available for Z by HP, HP Elite and Pro desktops and laptops PCs with Intel® or AMD processors and requires an open, wired
network connection. Note: You must back up important files, data, photos, videos, etc. before use to avoid loss of data. Detail, please refer to:
https://support.hp.com/us-en/document/c05115630.
9. HP Wolf Security for Business requires Windows 10 or higher, includes various HP security features and is available on HP Pro, Elite, RPOS and
Workstation products. See product details for included security features and OS requirement.
10. HP Sure Click requires Windows 10 Pro or higher or Enterprise. See https://bit.ly/2PrLT6A_SureClick for complete details.
11. HP Sure Sense is available on select HP PCs with Windows 10 Pro, Windows 10 Enterprise, Windows 11 Pro, or Windows 11 Enterprise OS.
12. HP Sure Start Gen7 is available on select HP PCs and requires Windows 10 and higher
13. HP Sure Admin requires Windows 10 or higher, HP BIOS, HP Manageability Integration Kit from http://www.hp.com/go/clientmanagement
and HP Sure Admin Local Access Authenticator smartphone app from the Android or Apple store.
14. HP BIOSphere Gen6 features may vary depending on the platform and configuration.
15. HP Secure Erase for the methods outlined in the National Institute of Standards and Technology Special Publication 800-88 "Clear" sanitation
method. HP Secure Erase does not support platforms with Intel® Optane™.
16. Absolute firmware module is shipped turned off and can only be activated with the purchase a license subscription and full activation of the
software agent. License subscriptions can be purchased for terms ranging multiple years. Service is limited, check with Absolute for availability
outside the U.S. Certain conditions apply. For full details visit: http://www.absolute.com/about/legal/agreements/absolute.
17. In some scenarios, machines pre-configured with Windows OS or FreeDOS might ship with TPM turned off.


UNIT ENVIRONMENT AND OPERATING CONDITIONS
General Unit Operating Guidelines
• Keep the computer away from excessive moisture, direct moisture and the extremes of heat and cold, to ensure that unit
is operated within the specified operating range.
• Leave a 10.2 cm (4 in) clearance on all vented sides of the computer to permit the required airflow.
• Never restrict airflow into the computer by blocking any vents or air intakes.
• Do not stack computers on top of each other or place computers so near each other that they are subject to each other's
re-circulated or preheated air.
• Occasionally clean the air vents on the front, back, and any other vented side of the computer. Lint, dust and other foreign
matter can block the vents and limit the airflow.
• If the computer is to be operated within a separate enclosure, intake and exhaust ventilation must be provided on the
enclosure, and the same operating guidelines listed above will still apply.
Temperature Range Operating: 5° to 35° C1

Non-Operating for AiO: -20° to 60° C1
Non-Operating for MT/SFF/DM: -30° to 60° C1
Relative Humidity Operating: 5% to 90% (non-condensing at ambient)
Non-operating: 5% to 90% (non-condensing at ambient)
Maximum Altitude Operating: 5000m
(unpressurized) Non-operating: 50000ft (15240 m)
1. Operating temperature is de-rated 1.0 deg C per 300 m (1000 ft) to 3000 m (10,000 ft) above sea level, no direct sustained sunlight. Maximum
rate of change is 10 deg C/Hr. The upper limit may be limited by the type and number of options installed.


ENVIRONMENTAL & INDUSTRY
Eco-Label Certifications This product has received or is in the process of being certified to the following approvals and may be
& declarations labeled with one or more of these marks:
• IT ECO declaration
• US ENERGY STAR®
• US Federal Energy Management Program (FEMP)
• EPEAT Gold registered in the United States. See http://www.epeat.net for registration
status in your country.
• TCO Certified
• China Energy Conservation Program (CECP)
• China State Environmental Protection Administration (SEPA)
• Taiwan Green Mark
• Korea Eco-label
• Japan PC Green label
• Commission Regulation (EC) No 617/2013 (ErP Lot 3)
System Configuration The configuration used for the Energy Consumption and Declared Noise Emissions data for the
Desktop model is based on a Typically Configured Desktop.
Energy Consumption
(in accordance with US
115VAC, 60Hz 230VAC, 50Hz 100VAC, 60Hz
ENERGY STAR® test
method)
Normal Operation
7.23 W 7.31 W 7.07 W
(Short idle)
Normal Operation
2.16 W 2.24 W 2.01 W
(Long idle)
Sleep 2.14 W 2.21 W 1.99 W
Off 0.62 W 0.7 W 0.47 W
NOTE: Energy efficiency data listed is for an ENERGY STAR® certified product if offered within the model family.
HP computers marked with the ENERGY STAR® Logo are certified with the applicable U.S. Environmental
Protection Agency (EPA) ENERGY STAR® specifications for computers. If a model family does not offer ENERGY
STAR® certified configurations, then energy efficiency data listed is for a typically configured PC featuring a hard
disk drive, a high efficiency power supply, and a Microsoft Windows® operating system.
Heat Dissipation* 115VAC, 60Hz 230VAC, 50Hz 100VAC, 50Hz
Normal Operation
24.7 BTU/hr 25 BTU/hr 24.2 BTU/hr
(Short idle)
Normal Operation
7.4 BTU/hr 7.7 BTU/hr 6.9 BTU/hr
(Long idle)
Sleep 7.3 BTU/hr 7.6 BTU/hr 6.8 BTU/hr
Off 2.1 BTU/hr 2.41 BTU/hr 1.6 BTU/hr
NOTE: Heat dissipation is calculated based on the measured watts, assuming the service level is attained for one
hour.
Declared Noise
Emissions Sound Power Sound Pressure
(in accordance with (LWAd, bels) (LpAm, decibels)
ISO 7779 and ISO 9296)
Typically Configured –
2.7 16
Idle


Fixed Disk – Random
2.7 16
writes
Longevity and upgrading This product can be upgraded, possibly extending its useful life by several years. Upgradeable
features and/or components contained in the product may include:
• 2 SODIMM memory slots
• Interchangeable M.2 PCIe NVME SSD & 2.5” SATA HDD
Spare parts are available throughout the warranty period and or for up to “5” years after the end of
production.
Batteries This battery(s) in this product comply with EU Directive 2006/66/EC
Batteries used in the product do not contain:

Mercury greater than 1ppm by weight
Cadmium greater than 20ppm by weight
Battery size: CR2032 (coin cell)

Battery type: Lithium
Additional Information • This product is in compliance with the Restrictions of Hazardous Substances (RoHS) directive -
2011/65/EC.
• This HP product is designed to comply with the Waste Electrical and Electronic Equipment (WEEE)
Directive – 2002/96/EC.
• This product is in compliance with California Proposition 65 (State of California; Safe Drinking Water
and Toxic Enforcement Act of 1986).
• Plastics parts weighing over 25 grams used in the product are marked per ISO11469 and ISO1043.
• This product contains a minimum of 35% post-consumer recycled (PCR) plastic (by wt.); including
10% ITE-derived post-consumer recycled plastic.*
• This product is 95.1% recycle-able when properly disposed of at end of life.
*Recycled plastic content percentage is based on the definition set in the IEEE 1680.1-2018 standard.
Packaging Materials External: PAPER/Paper 562g
(vary by country) Internal: PAPER/Molded Pulp 79g
PLASTIC/Polyethylene low density - LDPE 16g
Material Usage This product does not contain any of the following substances in excess of regulatory limits (refer to
the HP General Specification for the Environment at
http://www.hp.com/hpinfo/globalcitizenship/environment/pdf/gse.pdf):
• Asbestos
• Certain Azo Colorants
• Certain Brominated Flame Retardants – may not be used as flame retardants in plastics
• Cadmium
• Chlorinated Hydrocarbons
• Chlorinated Paraffins
• Formaldehyde
• Halogenated Diphenyl Methanes
• Lead carbonates and sulfates
• Lead and Lead compounds
• Mercuric Oxide Batteries
• Nickel – finishes must not be used on the external surface designed to be frequently handled or
carried by the user.
• Ozone Depleting Substances
• Polybrominated Biphenyls (PBBs)
• Polybrominated Biphenyl Ethers (PBBEs)
• Polybrominated Biphenyl Oxides (PBBOs)
• Polychlorinated Biphenyl (PCB)
• Polychlorinated Terphenyls (PCT)


• Polyvinyl Chloride (PVC) – except for wires and cables, and certain retail packaging has been
voluntarily removed from most applications.
• Radioactive Substances
• Tributyl Tin (TBT), Triphenyl Tin (TPT), Tributyl Tin Oxide (TBTO)
Packaging Usage HP follows these guidelines to decrease the environmental impact of product packaging:
• Eliminate the use of heavy metals such as lead, chromium, mercury and cadmium in packaging
materials.
• Eliminate the use of ozone-depleting substances (ODS) in packaging materials.
• Design packaging materials for ease of disassembly.
• Maximize the use of post-consumer recycled content materials in packaging materials.
• Use readily recyclable packaging materials such as paper and corrugated materials.
• Reduce size and weight of packages to improve transportation fuel efficiency.
• Plastic packaging materials are marked according to ISO 11469 and DIN 6120 standards.
End-of-life Management HP Inc. offers end-of-life HP product return and recycling programs in many geographic areas. To
and Recycling recycle your product, please go to: http://www.hp.com/go/reuse-recycle or contact your nearest HP
sales office. Products returned to HP will be recycled, recovered or disposed of in a responsible
manner.
The EU WEEE directive (2002/95/EC) requires manufacturers to provide treatment information for
each product type for use by treatment facilities. This information (product disassembly
instructions) is posted on the Hewlett Packard web site at: http://www.hp.com/go/recyclers. These
instructions may be used by recyclers and other WEEE treatment facilities as well as HP OEM
customers who integrate and re-sell HP equipment.
Global Citizenship Report
http://www.hp.com/hpinfo/globalcitizenship/gcreport/index.html
Eco-label certifications
http://www8.hp.com/us/en/hp-information/environment/ecolabels.html
ISO 14001 certificates:
http://www.hp.com/hpinfo/globalcitizenship/environment/pdf/PC_GBU_Product_Design_ISO_14K_
Certificate.pdf
and
http://www.hp.com/hpinfo/globalcitizenship/environment/pdf/cert.pdf


• TCO Certified
• Korea Eco-label
Energy Consumption
ENERGY STAR® test
method)
Normal Operation
12.1240 W 12.1460 W 12.0990 W
(Short idle)
Normal Operation
(Long idle) 10.3820 W 10.4110 W 10.3460 W
Sleep 0.9410 W 0.9380 W 0.9420 W

Off 0.7770 W 0.7750 W 0.7750 W
Normal Operation
41.3428 W 41.4179 W 41.2576 W
(Short idle)
Normal Operation
35.4026 W 35.5015 W 35.2799 W
(Long idle)
Sleep 3.2088 W 3.1986 W 3.2122 W
Off 2.6496 W 2.6428 W 2.6428 W
hour.
Declared Noise
3.3 23
Idle


3.4 24.1
writes
Longevity and Upgrading This product can be upgraded, possibly extending its useful life by several years. Upgradeable
• 2 DIMM memory slots
• Interchangeable M.2 PCIe NVME SSD & 2.5”/3.5” SATA HDD
production.


2011/65/EC.
Packaging Materials External: PAPER/Corrugated 1019g
(vary by country) Internal: PAPER/Molded pulp 434g
PLASTIC/Polyethylene low density 29g
• Asbestos
• Cadmium
• Formaldehyde


materials.
manner.
HP Inc. Corporate For more information about HP’s commitment to the environment:
Environmental
Information Global Citizenship Report
Certificate.pdf
and


• TCO Certified
• Korea Eco-label
Energy Consumption
ENERGY STAR® test
method)
Normal Operation
12.6930 W 12.6980 W 12.6900 W
(Short idle)
Normal Operation
10.9580 W 10.9770 W 10.9590 W
(Long idle)
Sleep 0.9940 W 0.9940 W 0.9890 W
Off 0.8030 W 0.8020 W 0.7990 W
Normal Operation
43.2831 W 43.3002 W 43.2729 W
(Short idle)
Normal Operation
37.3668 W 37.4316 W 37.3702 W
(Long idle)
Sleep 3.3895 W 3.3895 W 3.3725 W
Off 2.7382 W 2.7348 W 2.7246 W
hour.
Declared Noise
3.1 21
Idle
3.2 22
writes


production.


2011/65/EC.
• This product is in compliance with the IEEE 1680.1 (EPEAT) standard at the <Gold> level, see
www.epeat.net
• This product contains 44.4% post-consumer recycled plastic (by wt.)
Packaging Materials External: PAPER/Corrugated 1110 g
(vary by country) PAPER/Molded Pulp 654 g
Internal: PLASTIC/Polyethylene low density - LDPE 32 g
• Asbestos
• Cadmium
• Formaldehyde


materials.
manner.
Environmental
Certificate.pdf
and


• TCO Certified
• Korea Eco-label
Energy Consumption
ENERGY STAR® test
method)
Normal Operation
Data available at mid of Dec Data available at mid of Dec Data available at mid of Dec
(Short idle)
Normal Operation
(Long idle)
Sleep Data available at mid of Dec Data available at mid of Dec Data available at mid of Dec
Off Data available at mid of Dec Data available at mid of Dec Data available at mid of Dec
Normal Operation
(Short idle)
Normal Operation
(Long idle)
Sleep Data available at mid of Dec Data available at mid of Dec Data available at mid of Dec
Off Data available at mid of Dec Data available at mid of Dec Data available at mid of Dec
hour.
Declared Noise
Data available at mid of Dec Data available at mid of Dec
Idle
Data available at mid of Dec Data available at mid of Dec
writes


Longevity and upgrading This product can be upgraded, possibly extending its useful life by several years. Upgradeable
production.


2011/65/EC.
• This product is in compliance with the IEEE 1680.1 (EPEAT) standard at the <Gold> level, see
www.epeat.net
• This product contains 44.4% post-consumer recycled plastic (by wt.)
(vary by country) PAPER/Molded Pulp 654 20 g
Internal: PLASTIC/Polyethylene low density - LDPE 32 g
• Asbestos
• Cadmium
• Formaldehyde


materials.
manner.
Environmental
Certificate.pdf
and


• TCO Certified
• Korea Eco-label
Desktop model is based on a “Typically Configured Desktop”.
Energy Consumption
ENERGY STAR® test
method)
Normal Operation
14.4900 W 14.5100 W 14.4700 W
(Short idle)
Normal Operation
1.5300 W 1.5300 W 1.5100 W
(Long idle)
Sleep 1.5100 W 1.5100 W 1.5100 W
Off 0.8900 W 0.8900 W 0.8900 W
Normal Operation
(Short idle)
Normal Operation
(Long idle)
Sleep 5.2 BTU/hr 5.2 BTU/hr 5.2 BTU/hr
Off 3 BTU/hr 3 BTU/hr 3 BTU/hr
hour.
Declared Noise
2.8 15
Idle
2.8 15
writes


Optical Drive – Sequential
4.7 36.0
reads
• 2 SODIMM memory slots
• Interchangeable 2.5” SATA HDD
production.


2011/65/EC.
(vary by country) Internal: PLASTIC/Polyethylene Expanded - EPE 683 g
PLASTIC/Polyethylene low density - LDPE 42 g
• Asbestos
• Cadmium
• Formaldehyde


materials.
manner.
Global Citizenship Report
Certificate.pdf
and

SERVICE AND SUPPORT

On-site Warranty1: One-year (1-1-1) limited warranty delivers one year of on-site, next business day2 service for parts and
labor support. Service offers terms up to 5 years by choosing an optional HP Care Pack. To choose the right level of service for
your HP product, visit HP Care Pack Central: http://www.hp.com/go/cpc.3
1. Terms and conditions may vary by country. Certain restrictions and exclusions apply. Other warranty variations may be offered in your region.
2. On-site service may be provided pursuant to a service contract between HP and an authorized HP third-party provider and is not available in
certain countries. Global service response times are based on commercially reasonable best effort and may vary by country.
3. Service levels and response times for HP Care Packs may vary depending on your geographic location. Service starts on date of hardware
purchase. Restrictions and limitations apply. For details, visit www.hp.com/go/cpc. HP services are governed by the applicable HP terms and
conditions of service provided or indicated to Customer at the time of purchase. Customer may have additional statutory rights according to
applicable local laws, and such rights are not in any way affected by the HP terms and conditions of service or the HP Limited Warranty provided
with your HP Product.

Technical Specifications - Processors
PROCESSORS
12th Generation Intel® 12th Generation Core™ Processors1
All HP ProDesk & ProOne 400 Business PC models featuring this technology include processors that are part of the Intel®
Stable Image Platform Program (SIPP) designed to ensure the stability promise inherent in the value proposition of the HP
ProDesk and ProOne 400 Business PC.
Intel® Advanced Management Technology (AMT)1 v16 – An advanced set of remote management features and functionality
which provides network administrators the latest and most effective tools to remotely discover, heal, and protect networked
client systems regardless of the system's health or power state. AMT 16 includes the following advanced management
functions:
• Support for configuration of Intel AMT 16.0 capabilities

• No reset after provisioning
• Support for Intel Enterprise Digital Fence
• The Platform Discovery Utility can now discover these additional Intel products:
o Intel Identity Protection Technology with One Time Password
o Public Key Infrastructure
o Multi Factor Authentication
• Profile Editor and Profile Editor Plugin Interface
• Required Permissions for Solutions Framework
1. Intel® Active Management Technology requires an Intel® AMT-enabled chipset, network hardware and software, as well as connection with a
power source and a corporate network connection. Setup requires configuration by the purchaser and may require scripting with the management
console or further integration into existing security frameworks to enable certain functionality. It may also require modifications of
implementation of new business processes.

Technical Specifications - Display Panel Specifications
DISPLAY PANEL SPECIFICATIONS

NOTE: All specifications represent the typical specifications provided by HP's component manufacturers; actual performance may vary either
higher or lower.
23.8" diagonal IPS widescreen WLED backlit anti-glare LCD (1920 x 1080)
Projected Capacitive Touch supports up to 10 touch-points
Support HW low blue light feature
Type IPS WLED Backlit LCD
Active area (mm) 527.04 x 296.46
Native Resolution (HxV) 1920 x 1080
Refresh Rate 60 Hz @ 1920 x 1080
Aspect ratio 16:9
Pixel pitch (HxV)(mm) 0.2745 x 0.2745
Contrast ratio 1000:1
Brightness* 300nits*
Viewing angle (HxV) 178° x 178°
Backlight lamp life (to half brightness) 30,000 hours minimum
Color support Up to 16.7 million colors with 8 Bit(6 Bit + FRC)
Color gamut sRGB 99%
Anti-glare Yes
Response Time 14ms
Default color temperature Warm (6500K)
*Actual brightness will be lower with touchscreen
23.8" diagonal IPS widescreen WLED backlit anti-glare LCD (1920 x 1080) non-touch
Support HW low blue light feature
Type IPS WLED Backlit LCD
Active area (mm) 527.04 x 296.46
Native Resolution (HxV) 1920 x 1080
Refresh Rate 60 Hz @ 1920 x 1080
Aspect ratio 16:9
Pixel pitch (HxV)(mm) 0.2745 x 0.2745
Contrast ratio 1000:1
Brightness* 250nits*
Viewing angle (HxV) 178° x 178°
Backlight lamp life (to half brightness) 30,000 hours minimum
Color support Up to 16.7 million colors with 8 Bit(6 Bit + FRC)
Color gamut NTSC 72%
Anti-glare Yes
Response Time 14ms
Default color temperature Warm (6500K)

Technical Specifications - Display Panel Specifications
*Actual brightness will be lower with touchscreen

Technical Specifications - All-in-One Stand Specifications
ALL-IN-ONE STAND SPECIFICATIONS

Cantilever Stand (Fixed Tilt Angle -5° to +20°
Height Tilt Stand) Rotation (Swivel) None
Pivot None


Adjustable Height Stand Height Adjustment (Landscape Mode) 5.12 in / 130mm
Height Adjustment (Portrait Mode) N/A
Tilt Angle -5° to +20°
Rotation (Swivel) ±45°
Pivot None


No Stand Tilt Angle None
(VESA COVER with EPS Holder) None
Rotation (Swivel)
Pivot None
Adjustable Height Stand Height Adjustment (Landscape Mode) 5.12 in / 130mm

Height Adjustment (Portrait Mode) N/A
Tilt Angle -5° to +20°
Rotation (Swivel) ±45°
Pivot None

Technical Specifications – Graphics
GRAPHICS
Intel® UHD Graphics (integrated)
Graphics Controller Integrated
DisplayPort™ Multimode capable; supports HDCP, Display Port Audio (2 streams), HBR2 link rates and Multi-
Stream Technology for a maximum of 4 displays connected to any output controlled by Intel®
Graphics
HDMI Supports HDMI 2.0a features
Supports HDCP 2.2
Supports audio over HDMI
VGA VGA output
USB-C® DP Alt Mode DisplayPort™ over the USB-C® module
Memory The actual amount of maximum graphics memory can be >4GB. System memory is allocated
for graphics as needed using Intel's Dynamic Video Memory Technology (DVMT), to provide an
optimal balance between graphics and system memory use.
Maximum Color Depth up to 10 bits/color
Graphics/Video API Support HEVC 10b Enc/Dec HW
VP9 10b Dec HW
HDR
Rec. 2020
DX12
Max. Resolution (VGA) 2048 x 1536@60Hz
Max. Resolution (HDMI) 4096 x 2160@60Hz
Max. Resolution (DP) 4096 x 2160@60Hz
AMD Radeon™ 6300M with 2 GB GDDR6 Graphics

Memory 2 GB 64-bit wide frame buffer operating at 1125MHz.
Controller Clock Speed AMD Radeon™ 6300M GPU operating at 1024 MHz
Architecture Hybrid Graphics
AMD GPU uses Intel graphics controller for display control
Bus Connection PCIE 4.0 x4
Graphics /API support DIRECTX 12, Open GL 4.6, Open CL2.0, UVD, Mantle, AMD LiquidVR™
Display support Same as for the Intel integrated graphics solution
NVIDIA® Quadro T400 2GB Graphics Card

Engine Clock 2100 MHz
Memory Clock 5001 MHz
Memory Size (width) 2GB (64-bit)
Memory Type 256M x 16 GDDR6
Max. Resolution (DP) 7680x4320@120Hz
Multi Display Support 4 displays
HDCP Compliance Yes
Rear I/O connectors (bracket) mDPx3
Cooling (active/passive) Active fan-sink (Active cooling with dynamic speed)
Total power consumption (W) 30W
PCB form-factor with bracket LP PCB with LP bracket

Technical Specifications – Graphics

NVIDIA® T400 4GB Graphics Card
Engine Clock 2100 MHz
Memory Clock 5001 MHz
Memory Size (width) 4GB (64-bit)
Memory Type 512M x 16 GDDR6
Max. Resolution (DP) 7680x4320@120Hz
Multi Display Support 4 displays
HDCP Compliance Yes
Rear I/O connectors (bracket) mDPx3
Cooling (active/passive) Active fan-sink (Active cooling with dynamic speed)
Total power consumption (W) 30W
PCB form-factor with bracket LP PCB with LP bracket

Technical Specifications – Storage
STORAGE
500GB 7200RPM 3.5in SATA HDD
Capacity 500GB
Rotational Speed 7,200 rpm
Interface SATA 6.0 Gb/s
Buffer Size 32MB
Logical Blocks 976,773,168
Seek Time 11 ms (Average)
Height 1in/2.54cm
Width Media diameter: 3.5 in/8.89 cm
Physical size: 4 in/10.2 cm
Operating Temperature 41° to 131° F (5° to 55° C)
NOTE: For storage drives, GB = 1 billion bytes. TB = 1 trillion bytes. Actual formatted capacity is less. Up to 36GB (for Windows) is reserved for
system recovery software.
1TB 7200RPM 3.5in SATA HDD

Capacity 1TB
Interface SATA 6 Gb/s
Buffer Size 64MB
Logical Blocks 1,953,525,168
Height 1in/2.54cm
Width (nominal) Media diameter: 3.5 in/8.89 cm

Capacity 2TB
Buffer Size 128MB
Height 1.028in/26.11mm
Width (nominal) Media diameter: 3.5 in/8.89 cm


500GB 7200RPM 2.5in SATA HDD
Capacity 500GB
Buffer Size Up to 128MB
Height 0.283in/7.2mm (Max)
Width (nominal) 2.75 in/70 mm (nominal)

Capacity 1TB
Height 0.283 in/7.2 mm (Max)
Width (nominal) 2.75 in/70 mm (nominal)

Capacity 1TB
Seek Time 12ms (Average)
Height 0.283in/7.2mm (Max.)
Width (nominal) 2.75in/70mm (nominal)


Capacity 2TB
Buffer Size 128MB
Height 0.374in/9.5mm (nominal)
Width (nominal) 2.75in/70mm (nominal)
500GB 7200RPM 2.5in Self Encrypted Federal Information Processing Standard SATA HDD
Capacity 500GB
Architecture Self-Encrypting (SED) Solid State Drive with SATA interface
Buffer Size 128MB
Height 0.283in/7.2mm (Max.)
Width 2.75in/70mm (nominal)
256GB M.2 2280 PCIe NVMe SSD

Drive Weight < 10g
Capacity 256 GB
Height 2.3 mm
Length 80 mm
Width 22 mm
Interface PCIe NVMe
Maximum Sequential Read 3200 MB/s ±20%
Maximum Sequential Write 2000 MB/s ±20%
Operating Temperature 0° to 70°C (32° to 158°F) [ambient temp]
Features TRIM; L1.2


512GB M.2 2280 PCIe NVMe SSD
Drive Weight < 10g
Capacity 512 GB
Height 2.3 mm
Length 80 mm
Width 22 mm
Interface PCIe NVMe
Features TRIM; L1.2
1TB M.2 2280 PCIe NVMe SSD

Drive Weight < 10g
Capacity 1 TB
Height 2.3 mm
Length 80 mm
Width 22 mm
Interface PCIe NVMe
Features TRIM; L1.2
256GB M.2 2280 PCIe NVMe Three Layer Cell SSD

Drive Weight < 10g
Capacity 256 GB
Height 2.3 mm
Length 80 mm
Width 22 mm
Interface PCIE Gen4x4
Features TRIM; L1.2; Pyrite 2.0

512GB M.2 2280 PCIe NVMe Three Layer Cell SSD

Drive Weight < 10g
Capacity 512 GB
Height 2.3 mm
Length 80 mm
Width 22 mm
1TB M.2 2280 PCIe NVMe Three Layer Cell SSD

Drive Weight < 10g
Capacity 1 TB
Height 2.3 mm
Length 80 mm
Width 22 mm
2TB M.2 2280 PCIe NVMe Three Layer Cell SSD

Drive Weight < 10g
Capacity 2 TB
Height 2.3 mm
Length 80 mm
Width 22 mm


256GB M.2 2280 PCIe NVMe Self Encrypted OPAL2 Three Layer Cell SSD
Drive Weight < 10g
Capacity 256 GB
Height 2.3 mm
Length 80 mm
Width 22 mm
Features TRIM; L1.2; TCG Opal 2.0
512GB M.2 2280 PCIe NVMe Self Encrypted OPAL2 Three Layer Cell SSD
Drive Weight < 10g
Capacity 512 GB
Height 2.3 mm
Length 80 mm
Width 22 mm
Features TRIM; L1.2; TCG Opal 2.0

HP 9.5mm Slim DVD-ROM Drive

Height 9.5 mm height
Orientation Either horizontal or vertical
Interface type SATA/ATAPI
Dimensions (W x H x D) 5.04 x 0.37 x 5.0 in (128 x 9.5 x 127 mm) without bezel
Weight (max) Up to 0.31 lb (140g) without bezel
Read Speeds DVD+R/-R/+RW/
-RW/+R DL /-R DL Up to 8X
DVD-ROM Up to 8X
CD-ROM, CD-R Up to 24X
CD-RW Up to 24X
Access time
(typical reads, including Random: DVD-ROM: 170 ms (typical), CD-ROM: 170 ms (typical)
settling) Full stroke: DVD-ROM: 320 ms (typical), CD-ROM: 320 ms (typical)
Source Slimline SATA DC power receptacle
DC Power Requirement 5 VDC ± 5%-100 mV ripple p-p
Power DC Current 5 VDC (< 1000 mA typical, 1600 mA maximum)
Temperature 41° to 122° F (5° to 50° C)
Environmental conditions Relative Humidity 10% to 80%
(operating - non-condensing) Maximum Wet Bulb Temperature 84° F (29° C)


HP 9.5mm Slim DVD Writer Drive
Disc recording capacity Up to 8.5 GB DL or 4.7 GB standard
Weight (max) 0.31 lb (140 g) Without bezel
Write Speeds DVD-R DL - Up to 6X
DVD+R - Up to 8X
DVD+RW - Up to 8X
DVD+R DL - Up to 6X
DVD-R - Up to 8X
DVD-RW - Up to 6X
CD-R - Up to 24X
CD-RW - Up to 10X
Read Speeds DVD-RW, DVD+RW - Up to 8X

DVD-R DL, DVD+R DL - Up to 8X
DVD+R, DVD-R - Up to 8X
DVD-ROM DL, DVD-ROM - Up to 8X
CD-ROM, CD-R - Up to 24X
CD-RW - Up to 24X
Access time Random DVD-ROM: 170 ms (typical), CD-ROM: 170 ms (typical)
(typical reads, including Full Stroke DVD-ROM: 320 ms (typical), CD-ROM: 320 ms (typical)
settling) Stop Time 6 seconds (typical)
Power DC Current 5 VDC (< 1000 mA typical, 1600 mA maximum)
HP 9.5mm Slim Blu-Ray Writer Drive

Disc recording capacity Up to 128 GB QL, 100 GB TL, 50 GB DL or 25 GB standard SL
Weight (max) 0.29 lb (132 g)
Write Speeds BD-R SL/DL Up to 6X
BD-R TL/QL Up to 4X
BD-RE Up to 2X
DVD-R Up to 8X
DVD-RW Up to 6X
DVD+R Up to 8X
DVD+RW Up to 8X
DVD-RAM Up to 5X
CD-R Up to 24X
CD-RW Up to 10X


Read Speeds BD-ROM Up to 6X
BD-R Up to 6X
BD-RE SL/DL Up to 6X
BD-RE TL Up to 4X
DVD-ROM Up to 8X
DVD-R Up to 8X
DVD-RW Up to 8X
DVD+R Up to 8X
DVD+RW Up to 8X
BDMV (AACS Compliant
Disc)
Up to 6x/2x (Read/Play)
DVD-RAM Up to 5x
DVD-Video (CSS
Compliant Disc)
Up to 8x/4x (Read/Play)
CD-R/RW/ROM Up to 24x
CD-DA (DAE) Up to 24X/10X (Read/Play)
Random BD-ROM: 205 ms (typical), DVD-ROM: 185 ms (typical),
Access time CD-ROM: 165 ms (typical)
(typical reads, including Full Stroke BD-ROM: 350 ms (typical), DVD-ROM: 345 ms (typical),
settling) CD-ROM: 340 ms (typical)
Power DC Current 5 VDC -1200 mA typical, 2000 mA maximum

Technical Specifications – Networking
NETWORKING AND COMMUNICATIONS

Intel® I219v 1 Gigabit Network Connection LOM (non-vPro)
Connector RJ-45
System Interface PCI (Intel proprietary) + SMBus
Data rates supported 1. 10 Mbit/s operation (10BASE-T; IEEE 802.3i; IEEE 802.3 clauses 13-14)
2. 100 Mbit/s operation (100BASE-TX; IEEE 802.3u; IEEE 802.3 clauses 21-30)
3. 1000 Mbit/s operation (1000BASE-T; IEEE 802.3ab; IEEE 802.3 clauses 40)
4. Auto-Negotiation (Automatic Speed Selection)
Full Duplex Operation at all Speeds, Half Duplex operation at 10, 100 & 1000 Mbit/s
IEEE Compliance IEEE 802.1p QoS (Quality of Service) Support
IEEE 802.1q VLAN support
IEEE 802.3x Flow Control (IEEE 802.3 clauses 31-32; configurable)
IEEE 802.3az EEE (Energy Efficient Ethernet)
IEEE 802.3i 10BASE-T
IEEE 802.3u 100BASE-TX
IEEE 802.3ab 1000BAE-T
IEEE 802.3bz 2.5GBASE-T
Performance TCP/IP/UDP Checksum Offload (configurable)
Protocol Offload (ARP & NS)
Large send offload and Giant send offload
Receiving Side Scaling (Hash Mode only)
Jumbo Frame 9K
Power consumption Cable Disconnection: 25mW
100Mbps Full Run: 450mW
1000bps Full Run: 1000mW
WoL Enable(S3/S4/S5): 50mW
WoL Disable(S3/S4/S5): 25mW
Power ACPI compliant – multiple power modes
Management Situation-sensitive features reduce power consumption
Advanced link down power saving for reducing link down power consumption
Management Interface Auto MDI/MDIX Crossover cable detection
IT Manageability Wake-on-LAN from modern standby or sleep state (Magic Packet and Microsoft Wake-Up Frame);
Wake-on-LAN from off (Magic Packet only)
PXE 2.1 Remote Boot
Statistics Gathering (SNMP MIB II, Ethernet-like MIB, Ethernet MIB (802.3x, clause 30))
Comprehensive diagnostic and configuration software suite
Virtual Cable Doctor for Ethernet cable status
Security & Manageability Intel® non-vPro™ support with appropriate Intel® chipset components
Intel® I219-LM 1 Gigabit Network Connection LOM (vPro)

Connector RJ-45
Data rates supported 10 Mbit/s operation (10BASE-T; IEEE 802.3i; IEEE 802.3 clauses 13-14)
100 Mbit/s operation (100BASE-TX; IEEE 802.3u; IEEE 802.3 clauses 21-30)
1000 Mbit/s operation (1000BASE-T; IEEE 802.3ab; IEEE 8023 clauses 40)
Auto-Negotiation (Automatic Speed Selection)
Full Duplex Operation at all Speeds, Half Duplex operation at 10 and 100 Mbit/s


Receiving Side Scaling (Hash Mode Only)
Jumbo Frame 9K
1000bp Full Run: 1000mW
WoL Enable (S3/S4/S5): 50mW
WoL Disable (S3/S4/S5): 25mW
PXE 2.1 Remote Boot
Security & Manageability Intel® vPro™ support with appropriate Intel® chipset components
Intel® I225-LM 2.5 Gigabit Network Connection LOM (non-vPro)

Connector RJ-45
Data rates supported 1. 10 Mbit/s operation (10BASE-T; IEEE 802.3i; IEEE 802.3 clauses 13-14)
2. 100 Mbit/s operation (100BASE-TX; IEEE 802.3u; IEEE 802.3 clauses 21-30)
3. 1000 Mbit/s operation (1000BASE-T; IEEE 802.3ab; IEEE 802.3 clauses 40)
4. 2.5 Gbit/s operation (2.5GBASE-T; IEEE 802.3bz Clause 126)
5. Auto-Negotiation (Automatic Speed Selection)
Full Duplex Operation at all Speeds, Half Duplex operation at 10, 100 & 1000 Mbit/s
IEEE 802.3i 10BASE-T
IEEE 802.3u 100BASE-TX
IEEE 802.3ab 1000BAE-T
IEEE 802.3bz 2.5GBASE-T
Receiving Side Scaling (Hash Mode Only)
Jumbo Frame 9K
1000bp Full Run: 1000mW
WoL Enable (S3/S4/S5): 50mW
WoL Disable (S3/S4/S5): 25mW


PXE 2.1 Remote Boot
Security & Manageability Intel® non-vPro™ support with appropriate Intel® chipset components
Realtek 802.11a/b/g/n/ac (1x1) WiFi and Bluetooth® 4.2 Combo1

Wireless LAN Standards IEEE 802.11a
IEEE 802.11b
IEEE 802.11g
IEEE 802.11n
IEEE 802.11ac
IEEE 802.11d
IEEE 802.11e
IEEE 802.11h
IEEE 802.11i
IEEE 802.11k
IEEE 802.11r
IEEE 802.11v
Interoperability Wi-Fi certified modules
Frequency Band 802.11b/g/n
• 2.402 – 2.482 GHz
802.11a/n/ac
• 4.9 – 4.95 GHz (Japan)
• 5.15 – 5.25 GHz
• 5.25 – 5.35 GHz
• 5.47 – 5.725 GHz
• 5.825 – 5.850 GHz
Data Rates • 802.11b: 1, 2, 5.5, 11 Mbps
• 802.11g: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
• 802.11a: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
• 802.11n: max 150Mbps
• 802.11ac: max 433.3Mbps
Modulation Direct Sequence Spread Spectrum
BPSK, QPSK, CCK, 16-QAM, 64-QAM, 256-QAM
Security2 • IEEE and WiFi certified 64 / 128 bit WEP encryption for a/b/g mode only
• AES-CCMP: 128 bit in hardware
• 802.1x authentication
• WPA, WPA2: 802.1x. WPA-PSK, WPA2-PSK, TKIP, and AES.
• WPA2 certification
• IEEE 802.11i
• WAPI
Network Architecture Ad-hoc (Peer to Peer)

Models
Infrastructure (Access Point Required)
Roaming IEEE 802.11 compliant roaming between access points
Output Power3 • 802.11b: +14dBm minimum
• 802.11g: +12dBm minimum


• 802.11a: +12dBm minimum
• 802.11n HT20(2.4GHz): +12dBm minimum
• 802.11n HT20(5GHz): +10dBm minimum
• 802.11ac VHT80(5GHz): +10dBm minimum
Power Consumption • Transmit mode 2.0 W
• Receive mode 1.6 W
• Idle mode (PSP) 180 mW (WLAN Associated)
• Idle mode 50 mW (WLAN unassociated)
• Connected Standby 10mW
• Radio disabled 8 mW
Power Management ACPI and PCI Express compliant power management

802.11 compliant power saving mode
Receiver Sensitivity4 802.11b, 1Mbps: -93.5dBm maximum
802.11b, 11Mbps: -84dBm maximum
802.11a/g, 6Mbps: -86dBm maximum
802.11n, MCS07: -67dBm maximum
802.11ac, MCS0: -84dBm maximum
Antenna type High efficiency antenna.
One embedded dual band 2.4/5 GHz antenna is provided to the card to support WLAN
communications and Bluetooth communications
Form Factor PCI-Express M.2 MiniCard
Dimensions Type 2230: 2.3 x 22.0 x 30.0 mm
Weight Type 2230: 2.8g
Operating Voltage 3.3v +/- 9%
Temperature Operating: 14° to 158° F (–10° to 70° C)
Non-operating: –40° to 176° F (–40° to 80° C)
Humidity Operating: 10% to 90% (non-condensing)
Non-operating: 5% to 95% (non-condensing)
Altitude Operating: 0 to 10,000 ft (3,048 m)
Non-operating: 0 to 50,000 ft (15,240 m)
LED Activity LED Amber – Radio OFF;
LED OFF – Radio ON
HP Integrated Module with Bluetooth 4.0/4.1/4.2 Wireless Technology
Bluetoothâ Specification 4.0/4.1/4.2 Compliant
Frequency Band 2402 to 2480 MHz
Number of Available Channels Legacy: 0~79 (1 MHz/CH)
BLE: 0~39 (2 MHz/CH)
Data Rates and Throughput Legacy: 3 Mbps data rate; throughput up to 2.17 Mbps
BLE: 1 Mbps data rate; throughput up to 0.2 Mbps
Legacy: Synchronous Connection Oriented links up to 3, 64 kbps, voice channels
Legacy: Asynchronous Connection Less links 2178.1 kbps/177.1 kbps asymmetric (3-DH5) or
864 kbps symmetric (3-EV5)
The Bluetooth component shall operate as a Class II Bluetooth device with a maximum
transmit power of + 4 dBm for BR and EDR.


Peak (Tx) 330 mW
Peak (Rx) 230 mW
Selective Suspend 17 mW
Transmit Power USB 2.0 compliant
Power Consumption Microsoft Windows Bluetooth Software
Bluetooth® Software Supported Microsoft Windows ACPI, and USB Bus Support
Link Topology
Power Management FCC (47 CFR) Part 15C, Section 15.247 & 15.249
Certifications 4.0/4.1/4.2 Compliant
Power Management ETS 300 328, ETS 300 826
Certifications Low Voltage Directive IEC950
UL, CSA, and CE Mark

Bluetooth Profiles Supported BT4.1-ESR 5/6/7 Compliance
LE Link Layer Ping
LE Dual Mode
LE Link Layer
LE Low Duty Cycle Directed Advertising
LE L2CAP Connection Oriented Channels
Train Nudging & Interlaced Scan
BT4.2 ESR08 Compliance
LE Secure Connection- Basic/Full
LE Privacy 1.2 –Link Layer Privacy
LE Privacy 1.2 –Extended Scanner Filter Policies
LE Data Packet Length Extension
FAX Profile (FAX)
Basic Imaging Profile (BIP)2
Headset Profile (HSP)
Hands Free Profile (HFP)
Advanced Audio Distribution Profile (A2DP)
1. Wi-Fi 5 is designed to support gigabit data rate when transferring files between two devices connected to the same router.
Requires a wireless router, sold separately, that supports 80MHz and higher channels. Wireless access point and internet service
required and sold separately. Availability of public wireless access points limited. Wi-Fi 5 (802.11 ac) is backwards compatible with
prior 802.11 specs.
3. Check latest software/driver release for updates on supported security features.
3. The FCC has declared as of September 1, 2014 products that utilize passive scanning on channel 12/13 and are capable of
transmitting must fully comply with requirements of 15.247 or otherwise disable those channels.
4. Receiver sensitivity is measured at a packet error rate of 8% for 802.11b (CKK modulation) and a packet error rate of 10% for
802.11a/g (OFDM modulation).
Realtek RTL8852AE 802.11ax 2x2 Wi-Fi + BT5.2 (802.11ax 2x2, supporting gigabit data rate)1
IEEE 802.11b
IEEE 802.11g
IEEE 802.11n
IEEE 802.11ac
IEEE 802.11ax
IEEE 802.11d
IEEE 802.11e
IEEE 802.11h


IEEE 802.11i
IEEE 802.11k
IEEE 802.11r
IEEE 802.11v
Frequency Band 802.11b/g/n/ax
• 2.402 – 2.482 GHz
802.11a/n/ac/ax
• 4.9 – 4.95 GHz (Japan)
• 5.15 – 5.25 GHz
• 5.25 – 5.35 GHz
• 5.47 – 5.725 GHz
• 5.825 – 5.850 GHz
Data Rates • 802.11b: 1, 2, 5.5, 11 Mbps
• 802.11g: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
• 802.11a: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
• 802.11n: max 300Mbps
• 802.11ac: max 866.7Mbps
• 802.11ax: max 1201Mbps
BPSK, QPSK, CCK, 16-QAM, 64-QAM, 256-QAM, 1024QAM
• IEEE 802.11i
• WAPI
Models
Output Power3 • 802.11b: +18.5dBm minimum
• 802.11g: +17.5dBm minimum
• 802.11a: +18.5dBm minimum
• 802.11n HT20(2.4GHz): +15.5dBm minimum
• 802.11n HT20(5GHz): +15.5dBm minimum
• 802.11ac VHT80(5GHz): +11.5dBm minimum
• 802.11ax HE40(2.4GHz): +10dBm minimum
• 802.11ax HE80(5GHz): +10dBm minimum
Power Consumption • Transmit mode:2.5 W
• Receive mode:2 W
• Idle mode (PSP): 180 mW (WLAN Associated)
• Idle mode:50 mW (WLAN unassociated)
• Connected Standby/Modern Standby: 10mW
• Radio disabled: 8 mW


•802.11ax, MCS11(HE40): -57dBm maximum
Antenna type High efficiency antenna with spatial diversity, mounted in the display enclosure
Two embedded dual band 2.4/5 GHz antennas are provided to the card to support WLAN
MIMO communications and Bluetooth communications
Dimensions 1. Type 2230: 2.3 x 22.0 x 30.0 mm
2. Type 1216: 1.67 x 12.0 x 16.0 mm
Weight 1. Type 2230: 2.8g
2. Type 126: 1.3g
HP Integrated Module with Bluetooth 4.0/4.1/4.2/5.0/5.1/5.2 Wireless Technology
Bluetooth® Specification 4.0/4.1/4.2/5.0/5.1 Compliant/5.2 Compliant
Legacy: Asynchronous Connection Less links 2178.1 kbps/177.1 kbps asymmetric (3-DH5)
or 864 kbps symmetric (3-EV5)
Transmit Power The Bluetooth component shall operate as a Class II Bluetooth device with a maximum
Power Consumption Peak (Tx): 330 mW
Peak (Rx): 230 mW
Selective Suspend: 17 mW
Bluetooth® Software Supported Link Microsoft Windows Bluetooth Software
Topology
Power Management Microsoft Windows ACPI, and USB Bus Support
Certifications FCC (47 CFR) Part 15C, Section 15.247 & 15.249
Certifications Low Voltage Directive IEC950


LE Link Layer Ping
LE Dual Mode
LE Link Layer
FAX Profile (FAX)
BT5.1
ESR9/10 Compliance
LE Advertisement Extensions
Channel Selection Algo
Limited High Duty Cycle Non-Connectable Advertising
2Mbps LE
LE Long Range
router, sold separately, that supports 80MHz and higher channels. Wireless access point and Internet service required and sold separately.
Availability of public wireless access points limited. Wi-Fi 6 (802.11ax) is backwards compatible with prior 802.11 specs.
3. The FCC has declared as of September 1, 2014 products that utilize passive scanning on channel 12/13 and are capable of transmitting must
fully comply with requirements of 15.247 or otherwise disable those channels.
4. Receiver sensitivity is measured at a packet error rate of 8% for 802.11b (CKK modulation) and a packet error rate of 10% for 802.11a/g (OFDM
modulation).
Realtek RTL8852BE 802.11ax 2x2 Wi-Fi + BT5.2 (802.11ax 2x2, supporting gigabit data rate)1
IEEE 802.11b
IEEE 802.11g
IEEE 802.11n
IEEE 802.11ac
IEEE 802.11ax
IEEE 802.11d
IEEE 802.11e
IEEE 802.11h
IEEE 802.11i
IEEE 802.11k
IEEE 802.11r
IEEE 802.11v
• 2.402 – 2.482 GHz
802.11a/n/ac/ax
• 4.9 – 4.95 GHz (Japan)


• 5.15 – 5.25 GHz
• 5.25 – 5.35 GHz
• 5.47 – 5.725 GHz
• 5.825 – 5.850 GHz
Data Rates • 802.11b: 1, 2, 5.5, 11 Mbps
• 802.11g: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
• 802.11a: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
• 802.11n: max 300Mbps
• 802.11ac: max 866.7Mbps
• 802.11ax: max 1201Mbps
BPSK, QPSK, CCK, 16-QAM, 64-QAM, 256-QAM, 1024QAM
• IEEE 802.11i
• WAPI
Models
Output Power3 • 802.11b: +18.5dBm minimum
• 802.11g: +17.5dBm minimum
• 802.11a: +18.5dBm minimum
• 802.11ac VHT80(5GHz): +11.5dBm minimum
Power Consumption • Transmit mode:2.5 W
• Receive mode:2 W
• Idle mode (PSP): 180 mW (WLAN Associated)
• Idle mode:50 mW (WLAN unassociated)
• Connected Standby/Modern Standby: 10mW
• Radio disabled: 8 mW


2. Type 1216: 1.67 x 12.0 x 16.0 mm
2. Type 126: 1.3g
Bluetoothâ Specification 4.0/4.1/4.2/5.0/5.1 Compliant/5.2 Compliant
Peak (Rx): 230 mW
Electrical Interface Microsoft Windows Bluetooth Software
Bluetooth® Software Supported Microsoft Windows ACPI, and USB Bus Support
Link Topology
Power Management FCC (47 CFR) Part 15C, Section 15.247 & 15.249
Certifications ETS 300 328, ETS 300 826
Low Voltage Directive IEC950

Peak (Tx): 330 mW
Peak (Rx): 230 mW
Power Management Microsoft Windows Bluetooth Software
Certifications


LE Link Layer Ping
LE Dual Mode
LE Link Layer
FAX Profile (FAX)
BT5.1
ESR9/10 Compliance
2Mbps LE
LE Long Range
modulation).
Intel AX211 Wi-Fi 6E +BT 5.2 M.2 160MHz CNVi WW WLAN1

IEEE 802.11b
IEEE 802.11g
IEEE 802.11n
IEEE 802.11ac
IEEE 802.11ax
IEEE 802.11d
IEEE 802.11e
IEEE 802.11h
IEEE 802.11i
IEEE 802.11k
IEEE 802.11r
IEEE 802.11v
Interoperability Wi-Fi certified
• 2.402 – 2.482 GHz
802.11a/n/ac/ax
• 4.9 – 4.95 GHz (Japan)
• 5.15 – 5.25 GHz
• 5.25 – 5.35 GHz
• 5.47 – 5.725 GHz


• 5.825 – 5.850 GHz
• 5.955 – 6.415 GHz
• 6.435 – 6.515 GHz
• 6.535 – 6.875 GHz
• 6.895 – 7.115 GHz
Data Rates • 802.11b: 1, 2, 5.5, 11 Mbps
• 802.11g: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
• 802.11a: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
• 802.11n: max 300Mbps
• 802.11ac: 1733Mbps
• 802.11ax: max 2.4Gbps
OFDM, BPSK, QPSK, CCK, 16-QAM, 64-QAM, 256-QAM

, 1024QAM
Security2 • IEEE and WiFi compliant 64 / 128 bit WEP encryption for a/b/g mode only
• IEEE 802.11i
• WAPI
Models
Receiver Sensitivity4 •802.11b, 1Mbps: -93.5dBm maximum
•802.11b, 11Mbps: -84dBm maximum


• 802.11a/g, 6Mbps: -86dBm maximum
• 802.11n, MCS07: -67dBm maximum
• 802.11ac, MCS0(VHT80): -84dBm maximum
• 802.11ac, MCS9(VHT160): -58.5dBm maximum
•802.11ax, MCS11(HE160): -53.5dBm maximum
2. Type 1216: 1.67 x 12.0 x 16.0 mm
2. Type 1216: 1.3g
LED Activity LED Amber – Radio OFF; LED OFF – Radio ON
Bluetooth® Specification 4.0/4.1/4.2/5.0/5.1/5.2 Compliant
transmit power of + 9.5 dBm for BR and EDR.
Peak (Rx): 230 mW
Bluetooth® Software Supported Microsoft Windows Bluetooth Software
Link Topology
Certifications


LE Link Layer Ping
LE Dual Mode
LE Link Layer
FAX Profile (FAX)
BT5.2
ESR9/10 Compliance
2Mbps LE
LE Long Range
modulation).


Intel AX211 Wi-Fi 6E +BT 5.2 M.2 vPro 160MHz CNVi WW WLAN1
IEEE 802.11b
IEEE 802.11g
IEEE 802.11n
IEEE 802.11ac
IEEE 802.11ax
IEEE 802.11d
IEEE 802.11e
IEEE 802.11h
IEEE 802.11i
IEEE 802.11k
IEEE 802.11r
IEEE 802.11v
Interoperability Wi-Fi certified
• 2.402 – 2.482 GHz
802.11a/n/ac/ax
• 4.9 – 4.95 GHz (Japan)
• 5.15 – 5.25 GHz
• 5.25 – 5.35 GHz
• 5.47 – 5.725 GHz
• 5.825 – 5.850 GHz
• 5.955 – 6.415 GHz
• 6.435 – 6.515 GHz
• 6.535 – 6.875 GHz
• 6.895 – 7.115 GHz
Data Rates • 802.11b: 1, 2, 5.5, 11 Mbps
• 802.11g: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
• 802.11a: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
• 802.11n: max 300Mbps
• 802.11ac: 1733Mbps
• 802.11ax: max 2.4Gbps
OFDM, BPSK, QPSK, CCK, 16-QAM, 64-QAM, 256-QAM
, 1024QAM
Security2 • IEEE and WiFi compliant 64 / 128 bit WEP encryption for a/b/g mode only
• IEEE 802.11i
• WAPI
Models Infrastructure (Access Point Required)


Receiver Sensitivity4 •802.11b, 1Mbps: -93.5dBm maximum
•802.11b, 11Mbps: -84dBm maximum
• 802.11ac, MCS9(VHT160): -58.5dBm maximum
•802.11ax, MCS11(HE160): -53.5dBm maximum
2. Type 1216: 1.67 x 12.0 x 16.0 mm
2. Type 1216: 1.3g
LED Activity LED Amber – Radio OFF; LED OFF – Radio ON
Bluetooth® Specification 4.0/4.1/4.2/5.0/5.1/5.2 Compliant


transmit power of + 9.5 dBm for BR and EDR.
Peak (Rx): 230 mW
Bluetooth® Software Supported Microsoft Windows Bluetooth Software
Link Topology
Certifications

LE Link Layer Ping
LE Dual Mode
LE Link Layer
FAX Profile (FAX)
BT5.2
ESR9/10 Compliance
2Mbps LE
LE Long Range
modulation).

Technical Specifications – Input/Output Devices
I/O DEVICES
HP Business Slim Standalone USB/PS2 Wired Keyboard
Physical Characteristics Keys 104, 105, 106, 107, 109 layout (depending upon country)
Dimensions 171.97 x 68.35 x 8.27 in (436.8± 1.5 x 137.6± 1.0 x 21.0±
(L x W x H) 1.0 cm)
Weight 1.32 lb (0.6± 0.08 kg)
Electrical Operating voltage 4.4-5.25VDC
Power consumption 50-mA maximum (with 5 VDC power supplied and three
LEDs ON)/
System interface USB or PS/2
ESD Contact Discharge: 2, 4,6,8KV
Air Discharge: 2, 4, 8,10,12.5KV
EMI – RFI Conforms to FCC rules for a Class B computing device
Mechanical Keycaps Low-profile design
Switch actuation 60±12.5g nominal peak force with tactile feedback
Switch life 10 million keystrokes (Life tester)
Switch type Contamination-resistant switch membrane
Key-leveling mechanisms For all double-wide and greater-length keys
Cable length 6 ft (1.8 m)
Environmental Acoustics 43-dBA maximum sound pressure level
Operating temperature 50° to 122° F (10° to 50° C)
Non-operating temperature Minus 30 degress to 60 degress Celsius
Operating humidity 10% to 90% (non-condensing at ambient)
Non-operating humidity 20% to 80% (non-condensing at ambient)
Operating shock 40 g, six surfaces
Non-operating shock 80 g, six surfaces
Operating vibration 2-g peak acceleration
Non-operating vibration 4-g peak acceleration
Drop (out of box) 26 in (66 cm) on carpet, six-drop sequence
Drop (in box) 30 in (76.2 cm) on concrete, 16-drop sequence
Approvals UL, FCC, CE Mark, TUV GS, VCCI, BSMI, RCM, KCC
Ergonomic compliance ANSI HFS 100, ISO 9241-4, and TUVGS


HP USB Business Slim Wired SmartCard CCID Keyboard
Physical Characteristics Keys 104, 105, 109 layout (depending upon country)
Dimensions 17.34 x 5.68 x 0.78in (440.6 x 144.5 x 1.98 cm)
(L x W x H)
Weight 1.32 lb (598g)
Electrical Operating voltage 5 VDC, +/-5%
Power consumption 100mA (All LED on)
System interface USB Type A plug connector
ESD Contact Discharge: 8 KV Air Discharge: 12.5 KV
EMI - RFI Conforms to FCC rules for a Class B computing device
Switch actuation 60±10g nominal peak force with tactile feedback
Non-operating temperature -22° to 140° F (-30° to 60° C)
Approvals CE Marking, TUV, EAC, FCC, cULus/CSAus, ICES, RCM, VCCI, KCC, BSMI
Ergonomic compliance ISO 9241-4, TUVGS


HP 125 (AntiMicrobial) Wired Keyboard (China only)
Physical Characteristics Keys 104/105/107/109layout (depending upon country)
Dimensions 436 x 138 x24.7 mm
(L x W x H)
Weight 471g
Electrical Operating voltage 5V +- 5%
Power consumption 50mA
System interface USB Type A plug connector
ESD Contact Discharge: 8 KV Air Discharge: 12.5 KV
Switch actuation 55±10g nominal peak force with tactile feedback
Cable length 1.8 m
Approvals UL, cUL, FCC, CE, TUV GS, VCCI, BSMI, RCM, KCC, USB-IF, WHQL, EN/IEC 60601-1
Ergonomic compliance ANSI HFS 100, ISO 9241-4, and TUVGS

HP 655 wireless Keyboard

Physical Characteristics Keys 104, 105, 107,109 layouts
Dimensions 16.86 x 4.55 x 0.71 in (428.22 x 115.47 x 18.06 mm)
(L x W x H)
Weight 0.96 lb (435g)
Power consumption 20 mA Max (All LED on)
System interface 2.4GHz Wireless
ESD Contact Discharge: 8 KV Air Discharge: 15 KV
Mechanical Keycaps Plunger, 2.0 mm key travel
Key actuation 60±10g nominal peak force with tactile feedback
Key life 10 million keystrokes (Life tester)
Key structure type Rubber dome & Membrane
Environmental Operating temperature 50° to 122° F (10° to 50° C)
Approvals CB, CE, FCC, cULus, ICES, IC, I TRC, TRA, CASA, UA, EAC, CNC, ANATEL, NOM-NYCE SCT, IFETEL,
MPTC, RCM, BIS, PosTel, VCCI, TELEC, KC, MCMC, IDA, BSMI, NCC, DWLF&M, TP-BY, MOC
Ergonomic compliance TUVGS
HP Wired Desktop 320K Keyboard

Keys 104, 105, 107,109 layouts
Physical Characteristics Dimensions(L x W x H) 18.86*4.55*0.66 in (426.2 x 110.9 x 16.7 mm)
Weight 1.00 lb(452g)
Operating voltage 5 VDC, +/-5%
Power consumption 50 mA Max (All LED on)
Electrical
System interface USB Port
ESD Contact Discharge: 8 KV Air Discharge: 15 KV (Class B)


European Standard EN 55022: 2006+A1: 2007, Class B.
EMI - RFI
FCC/CFR 47 : Part 15 Class B
Mechanical Keycaps 2.0mm +/-0.2mm at 120gf Key travel
Operating temperature 10° C to 90° C
Non-operating temperature -30° C to 95° C
Operating humidity N/A
Operating shock N/A
i. Half-Sine Shock – End-Use Handling, Non-Operational

Sample size: 5pcs.
Condition: Sample power off.
Axis: X, Y, Z axis (all 6 faces) – sample normal mode of operation.
Number of shocks: 1 shock/face.
Pulse duration: < 3 ms
Velocity change: 50lps (inch-per-second)- 65lps desired.
ii. Trapezoidal Shock- Transportation Environment, Non-Operational

Non-operating shock
Sample size: 5pcs.
Orientation: All six faces: Front, Rear, Left, Right, Bottom, and Top.
Configuration: As intended for shipment
Environmental
Minimum faired acceleration: 30G’s. Test also at 40 and 50G’s to find
margin.
Velocity change: 266lps (inch-per-second) for product mass (m)
20<m<40lbs.
Frequency (Hz) Slope (dB/oct) PSD (g2/Hz)

5-350 0 0.0001
Operating vibration 350-500 -6 -
500 - 0.00005
(~0.21Gnms)
Total Test time: 10 minutes
5.100 0 0.015
Non-operating vibration 100-137 -6 -
137-350 0 0.008
350-500 -6 -
500 - 0.0039
Drop (out of box) 76cm on carpet, six-drop sequence
10 times drop including 6 faces, one corner and 3 edges on rigid surface.
Drop (in box)
Drop Height: 91cm
Approvals CB, CE, FCC, ICES, EAC, NOM-NYCE SCT, RCM, BIS, VCCI, KC, BSMI


HP Wired Desktop 320M Mouse
Keys Left/right key
Physical Characteristics Dimensions(L x W x H) 4.09 x2.50 x 1.40 in (103.8x 63.4 x 35.5 mm)
Weight 0.16 lb(72g)
Operating voltage 5 VDC, +/-0.25V
Power consumption 100 mA Max
Electrical System interface USB Port

ESD Contact Discharge: 8 KV Air Discharge: 15 KV (Class B)
European Standard EN 55022: 2006+A1: 2007, Class B.
EMI - RFI
FCC/CFR 47 : Part 15 Class B
Keycaps 0.3mm key travel
Key actuation 75±20g
Mechanical Key life 1million cycles
Key structure type Tact Switch
Key-leveling mechanisms N/A
Operating temperature 10° to 90° C
Non-operating temperature -30° C to 95° C
Operating humidity N/A
Operating shock N/A
i. Half-Sine Shock – End-Use Handling, Non-Operational
Sample size: 5pcs.
Axis: X, Y, Z axis (all 6 faces) – sample normal mode of operation.
Pulse duration: < 3 ms
Velocity change: 50lps (inch-per-second)- 65lps desired.
Environmental ii. Trapezoidal Shock- Transportation Environment, Non-Operational
Non-operating shock
Sample size: 5pcs.
Orientation: All six faces: Front, Rear, Left, Right, Bottom, and Top.
Configuration: As intended for shipment
Minimum faired acceleration: 30G’s. Test also at 40 and 50G’s to find
margin.
Velocity change: 266lps (inch-per-second) for product mass (m)
20<m<40lbs.
5-350 0 0.0001
Operating vibration 350-500 -6 -
500 - 0.00005
(~0.21Gnms)


Total Test time: 10 minutes
5.100 0 0.015
Non-operating vibration 100-137 -6 -
137-350 0 0.008
350-500 -6 -
500 - 0.0039
Drop (out of box) 76cm on carpet, six-drop sequence
Drop (in box) N/A
Approvals CB, CE, FCC, cULus, ICES, EAC, NOM-NYCE SCT, RCM, VCCI, KC, BSMI
HP 655 wireless Mouse

Dimensions (H x L x W) 4.74 x 2.75 x 1.63 in (120.29 x 69.97 x41.39 mm)
Weight 0.194lb (88g)
Power consumption (typical) 10 mA Max
Resolution 1,200 DPI (Default)
Sensor Pixart PAW3222DB-TJDS
Tracking speed 10G(max), 1G=9.8m/s2
Tracking acceleration 2.4GHz Wireless
Mechanical Color Jack Black
Regulatory approvals Compliant CB, CE, FCC, cULus, ICES, IC, TRC, TRA, ICASA, UA, EAC, CNC,
ANATEL, NOM-NYCE SCT, IFETEL, MPTC, RCM, PosTel, VCCI,
TELEC, KC, MCMC, IDA, BSMI, NCC, DWLF&M, TP-BY, MOC
Ergonomic compliance Compliant TUVGS

HP PS/2 Mouse
Dimensions (H x L x W) 4.53 x 2.48 x1.46 in (115.2x 63 x37 mm)
Weight 0.22lb (101.6g)
Non-operating temperature (-4° to 140° F )(-20° to 60° C)
Electrical Tracking speed 30 inch/sec (max)
Tracking acceleration 8G(max), 1G=9.8m/s2
System interface PS/2
Mechanical Switch actuation 60±15g nominal peak force with tactile feedback
Color Jack Black
Regulatory approvals Compliant UL, FCC, CE Mark, TUV GS, VCCI, BSMI, RCM, KCC
HP USB 125 (Antimicrobial)/128 Laser Mouse (China only)

Dimensions (H x L x W) 112 x 63 x 36.2 mm (L x W x H)
Weight 85 g
Power consumption (typical) 100mA
Resolution 1,200 DPI
Sensor Optical/ Laser USB mouse sensor
Tracking speed 30 inch/sec (max)


Tracking acceleration 8G(max), 1G=9.8m/s2
Mechanical Connector USB
Color Jack Black
Regulatory approvals Compliant UL, FCC, CE Mark, TUV GS, VCCI, BSMI, RCM, KCC, EAC

Technical Specifications – Audio/Multimedia
AUDIO/MULTIMEDIA
Type Integrated
HD Stereo Codec Realtek ALC3252
Audio I/O Ports Front: Headset connector supports a CTIA and style headset and is retaskable as a Line-in, Line-
out, Microphone-in or Headphone-out port
Internal Speaker Amplifier 2W class D mono amplifier for the internal speaker only. External speakers must be powered
Multi-streaming Capable Playback multi-streaming can be enabled in the audio control panel to allow independent audio
streams to be sent to/from the front jacks or integrated speaker.
Sampling Supports resolutions from 16 to 24-bit; 44.1 kHz
to 192 kHz for DAC and ADC
Wavetable Syntheses Yes - Uses OS soft wavetable
Analog Audio Yes
# of Channels on Line-Out Stereo (Left & Right channels)
Internal Speaker Yes

Type Integrated
Audio I/O Ports Front: Headset connector supports a CTIA and style headset and is retaskable as a Line-in, Line-
out, Microphone-in or Headphone-out port
Rear: Line-out, port, 3.5mm and support stereo and retasking
streams to be sent to/from the front and rear jacks or integrated speaker.
Sampling Supports resolutions from 16 to 24-bit; 44.1 kHz to 192 kHz for DAC and ADC
Analog Audio Yes


Type Integrated
Audio I/O Ports Front: Headset connector supports a CTIA and style headset and is retaskable as a Line-in, Line-out,
Microphone-in or Headphone-out port
Rear: Line-out, Line-in*, 3.5mm and support stereo and retasking
streams to be sent to/from the front and rear jacks or integrated speaker.
Analog Audio Yes
*NOTE: Line-in port only available on product with legacy PCI version

Type Integrated
Audio I/O Ports Front: 3.5mm headset connector supports an OMTP or CTIA style headset and is re-taskable as a
Line-in, Line-out, Microphone-in or Headphone-out port
Rear: Line-out, Line-in*, 3.5mm and support stereo and retasking
Internal Speaker Amplifier 2W per channel class D stereo amplifier for the internal speakers only
Multi-streaming Capable Playback multi-streaming allows independent audio streams to be sent to/from the side jack and
integrated speakers.
Wavetable Syntheses Yes – Uses OS Soft Wavetable
Analog Audio Yes
HP ProOne 440 G9 24 All-in-One PC

Type Integrated
Audio I/O Ports Side 3.5mm headset connector supports an OMTP or CTIA style headset and is re-taskable as a
Line-in, Line-out, Microphone-in or Headphone-out port
Internal Speaker Amplifier 2W per channel class D stereo amplifier for the internal speakers only
Multi-streaming Capable Playback multi-streaming allows independent audio streams to be sent to/from the side jack and
integrated speakers.
Wavetable Syntheses Yes – Uses OS Soft Wavetable
Analog Audio Yes
Internal Speaker Yes - Stereo


INTEGRATED WEBCAM AND MICROPHONE
Optional integrated 5 MP RGB webcam & microphone; maximum resolution of 2592 x 1944
Optional integrated 5 MP RGB webcam with IR sensor & microphone; maximum resolution of 2592 x 1944

Technical Specifications – Power
POWER
Mini SFF TWR AiO
External Power Supplies1 90W EPS, active PFC, 88% N/A N/A 120W EPS, active PFC,
average efficiency at 88% average efficiency
115V & 89% at 230Vac at 115V & 89% at
230Vac
150W EPS, active PFC,
88% efficiency in
115Vac / 89%
efficiency in 230Vac
88% average efficiency
at 115V & 89% at
230Vac
89% average efficiency
at 115V / 230Vac
80 PLUS Gold N/A 180W active PFC / 80 180W active PFC / 80 N/A
PLUS Gold PLUS Gold
87/90/87% efficient at 87/90/87% efficient at
20/50/100% load 20/50/100% load
(115V) (115V)
90/92/89% efficient at 90/92/89% efficient at
20/50/100% load 20/50/100% load
(230V) (230V)
80 PLUS Platinum N/A 240W active PFC / 80 260W active PFC / 80 N/A
PLUS Platinum PLUS Platinum
90/92/89% efficient at 400Wactive PFC / 80
20/50/100% load PLUS Platinum
(115V) 90/92/89% efficient at
91/93/90% efficient at 20/50/100% load
20/50/100% load (115V)
(230V) 91/93/90% efficient at
20/50/100% load
(230V)
Operating Voltage Range 90Vac~264Vac 90Vac~264Vac 90Vac~264Vac 90Vac~264Vac
Rated Voltage Range 100Vac~240Vac 100Vac~240Vac 100Vac~240Vac 100Vac~240Vac
Rated Line Frequency 50HZ~60HZ 50HZ~60HZ 50HZ~60HZ 50HZ~60HZ
Operating Line Frequency 47HZ~63HZ 47HZ~63HZ 47HZ~63HZ 47HZ~63HZ
Rated Input Current with 65W≦1.6A 180W Gold ≦ 2.3A 180W≦2.3A 120W≦1.7A
Energy Efficient* Power 90W≦1.7A 240W Platinum ≦ 2.9A 260W≦3.1A 150W≦2.5A
Supply 400W≦5.2A 180W≦2.5A
230W≦3.5A
DC Output +19.5V +12V +12V +19.5V

Current Leakage (NFPA 99: Less than 500 microamps Less than 500 Less than 500 Less than 500
2012) of leakage current at 264 microamps of leakage microamps of leakage microamps of leakage
Vac with the ground wire current at 264 Vac with current at 264 Vac with current at 264 Vac with


disconnected, as required the ground wire the ground wire the ground wire
for Non-patient Electrical disconnected, as disconnected, as disconnected, as
Appliances and required for Non- required for Non- required for Non-
Equipment used in a patient Electrical patient Electrical patient Electrical
patient care facility or Appliances and Appliances and Appliances and
that contact patients in Equipment used in a Equipment used in a Equipment used in a
normal use. Per section patient care facility or patient care facility or patient care facility or
10.3.5.1. that contact patients in that contact patients in that contact patients in
Less than 100 microamps normal use. Per section normal use. Per section normal use. Per section
of leakage current at 264 10.3.5.1. 10.3.5.1. 10.3.5.1.
Vac with the ground wire Less than 100 Less than 100 Less than 100
intact with normal microamps of leakage microamps of leakage microamps of leakage
polarity, as required for current at 264 Vac with current at 264 Vac with current at 264 Vac with
Non-patient Electrical the ground wire intact the ground wire intact the ground wire intact
Appliances and with normal polarity, as with normal polarity, as with normal polarity, as
Equipment used in a required for Non- required for Non- required for Non-
patient care facility or patient Electrical patient Electrical patient Electrical
that contact patients in Appliances and Appliances and Appliances and
normal use. Per section Equipment used in a Equipment used in a Equipment used in a
10.3.5.1. patient care facility or patient care facility or patient care facility or
that contact patients in that contact patients in that contact patients in
normal use. Per section normal use. Per section normal use. Per section
10.3.5.1. 10.3.5.1. 10.3.5.1.
Power Supply Fan N/A 50mm variable speed 70mm variable speed N/A
Power cord length* 6.0 ft. (1.83 m) 6.0 ft. (1.83 m) 6.0 ft. (1.83 m) 6.0 ft. (1.83 m)
Dimensions 65W: 90 x 51 x 28.5mm / 200 x 85 x 53 mm 165 x 95 x 73 mm 120W: 138mm x
102 x 55 x 30mm 68.5mm x 25.4mm
90W: 126 x 50 x 30mm 150W: 148 x 75.5 x 25.
4mm
180W: 165.5mm x
79mm x 25.4mm
230W: 180mm x 88mm
x 25.4mm
1. External power supplies, power cords, cables and peripherals are not low halogen. Service parts obtained after purchase may not be low
halogen.
*NOTE: 2m for India
The power supply shall comply with harmonic input current requirements as detailed in EN61000-3-2 and JEIDA MITI standards.
The harmonic input current requirements must be met under the following operating conditions:
Load Requirements: 50% and 100%
Input Voltage: 230Vac/50Hz.
For active power factor correction the power factor at 50% &100% loads shall be greater than 0.9 over the entire nominal input
voltage range (100-127VAC and 200-240VAC).
Condition Standard Efficiency 82/85/82% 85/88/85% 87/90/87% 90/92/89% Input Voltage

10% of Rated Load - 75% 81% 84% 86% 115Vac/60HZ
20% of Rated Load - 82% 85% 87% 90% 115Vac/60HZ
- 85% 88% 90% 92% 115Vac/60HZ
50% of Rated Load
PF>0.9 PF>0.9 PF>0.9 PF>0.9 PF>0.95
100% of Rated Load 70% 82% 85% 87% 89% 115Vac/60HZ


PF>0.9 PF>0.9 PF>0.9 PF>0.9 PF>0.9 230Vac/50HZ

Technical Specifications – Weights and Dimensions
WEIGHTS & DIMENSIONS 1

DM SFF
Chassis (W x D x H) 6.97 x 6.89 x 1.35 in 10.63 x 12.12 x 2.74 in
177 x 175 x 34.2 mm 270 x 308 x 95 mm
System Volume 64 cu in 481.85 cu in
1.05 L 7.9 L
System Weight1 2.74 lbs 9.59 lbs
1.25 kg 4.35 kg
Max Supported Weight N/A 10.42 lbs
(desktop orientation) 4.73 kg
Packaging Dimension 19.57 x 5.04 x 8.78 in 15.52 x 19.65 x 8.07 in
(W x D x H) (497 x 128 x 223 mm) (394 x 499 x 205 mm)
MPP: 19.61 x 9.25 x 5.20 in MPP: 15.52 x 19.65 x 8.07 in
(498 x 235 x 132 mm) (394 x 499 x 205 mm)
Shipping Weight 6.52 lbs (2.97 kg) 15.31 lbs (6.95 kg)
MPP: 7.50 lbs (3.40 kg) MPP: 15.97 lbs (7.25 kg)
Palletization Profile (Fabricated EPE) 18-units per layer 6-units per layer
5 or 6 layers max depending on details 11 layer max
of air freight 66 per pallet
90 or 108 units per pallet depending on 47.24 x 39.37 x 93.90 in, 1200 x 1000 x
details of air freight 2380 mm (including pallet)
45.354 x 39.13 x 57.80 in, 1152 x 994 x
1468 mm (include pallet)
Palletization Profile (Molded Pulp) 10-units per layer 6-units per layer
10 to 19 layers max depending on 11 layer max
details of freight 66 per pallet
100 or 190 units per pallet depending 47.24 x 39.37 x 93.90 in, 1200 x 1000 x
on details of freight 2380 mm (including pallet)
46.26 x 39.21 x 103.74 in, 1175 x 996 x
2635 mm (including pallet)
1. Packaging material used will vary by country
2. Configured with 1 HDD & 1 ODD; DM configured with 1 HDD only


TWR
Chassis (W x D x H) 6.1 x 12.13 x 13.27 in
155x 308 x 337 mm
System Volume 981.9 cu in
16.1 L
System Weight1 11.7 lbs
5.31 kg
Max Supported Weight 14.5 lbs
(desktop orientation) 6.58 kg
Packaging Dimension 15.75 x 19.65 x 11.30 in
(W x D x H) (400 x 499 x 287 mm)
MPP: 15.75 x 19.65 x 11.30 in
(400 x 499 x 287 mm)
Shipping Weight 17.69 lbs (8.03 kg)
MPP: 18.5 lbs (8.4 kg)
Palletization Profile (Fabricated EPE) 6-units per layer
8 layer max
48 per pallet
47.24 x 39.37 x 95.12 in, 1200 x 1000 x 2416 mm
(including pallet)
Palletization Profile (Molded Pulp) 6-units per layer
8 layer max
48 per pallet
47.24 x 39.37 x 95.12 in, 1200 x 1000 x 2416 mm
(including pallet)
1. Packaging material used will vary by country
2. Configured with 1 HDD & 1 ODD; DM configured with 1 HDD only


ALL-IN-ONE DIMENSIONS 1
Without Stand Cantilever Stand
Adjustable Height Stand
(VESA Cover Plate) (Fixed Height Tilt Stand)
cm/kg inch/lbs cm/kg inch/lbs cm/kg inch/lbs
Width 53.93 cm 21.23 in 53.93 cm 21.23 in 53.93 cm 21.23 in

Length/Depth 8.96 cm 3.53 in 18.70 cm 7.36 in 22.5 cm 8.85 in
Product 37.94 ~ 50.94
Height 35.36 cm 13.92 in 40.28 cm 15.85 in 14.93 ~ 20.05 in
cm
Weight 6.93 kg 15.28 lbs 7.315 kg 16.12 lbs 7.775kg 17.57 lbs

Package
Height 46.2 cm 18.19 in 46.2 cm 18.19 in 46.2 cm 18.19 in
Weight 10.85 kg 23.92 lbs 12.04 kg 26.54 lbs 12.69 kg 27.98 lbs

Palletization Height 198.8 cm 78.27 in 198.8 cm 78.27 in 198.8 cm 78.27 in
for Sea/Rail Weight 260.4 kg 574.08 lbs 288.96 kg 663.96 kg 304.56 kg 671.52 lbs
Qty / Layer 6 6 6
Layers 4 4 4
Qty / Pallet via Sea/Rail 24 24 24

Qty / Pallet via Air 18 18 18
1. Packaging material used will vary by country.
2. Configured with 1 HDD & 1 ODD.
3. Package weight is based on EPE package.
4. Actual system weight will depend on the system configuration.

Miscellaneous Features
MISCELLANEOUS FEATURES
Management Features
• Advanced Configuration and Power Management Interface (ACPI). Allows the system to wake from a low power mode.
Controls system power consumption, making it possible to place individual cards and peripherals in a low-power or
powered-off state without affecting other elements of the system.
• Intel® Wired for Management support; industry wide initiative to make Intel® architecture based PCs, servers and mobile
computers more inherently manageable out-of-the-box and over the network
• Dual State Power Button; acts as both an on/off button and a suspend-to-sleep button
Serviceability Features
• Dual colored power LED on front of computer to indicate either normal or fault condition
• Diagnostic LED Explanation Table:
o Power LED will blink red 2 to 5 times, then blink white 2 or more times, then repeat (with beep tones for each
blink initially):
▪ 2 red + 2 white User must provide file for BIOS recovery (USB storage typically)
▪ 2 red + 3 white User must enter a key sequence to proceed with recovery by policy
▪ 2 red + 4 white BIOS recovery is in progress
▪ 3 red + 2 white Memory could not be initialized
▪ 3 red + 3 white Graphics adaptor could not be found
▪ 3 red + 4 white Power supply failure / not connected
▪ 3 red + 5 white Processor not installed
▪ 3 red + 6 white Current processor does not support an enabled feature
▪ 4 red + 2 white Processor has exceeded its temperature threshold / system thermal shutdown
▪ 4 red + 3 white System internal temperature has exceeded its threshold
▪ 5 red + 2 white System controller firmware is not valid
▪ 5 red + 3 white System controller detected BIOS is not executing
▪ 5 red + 4 white BIOS could not complete initialization / mainboard failure
▪ 5 red + 5 white System controller rebooted the system after a health or recovery timer triggered
• HP PC Hardware Diagnostics UEFI:
o This utility enables hardware level testing outside the operating system on many components. The diagnostics
can be invoked by pressing F2 at POST, and is available as a download from HP Support
• System/Emergency ROM
• Flash ROM
• CMOS Battery Holder for easy replacement
• Flash Recovery with Video Configuration Record Software
• 1 Aux Power LED on System PCA
• Processor ZIF Socket for easy Upgrade
• Over-Temp Warning on Screen (Requires IM Agents)
• DIMM Connectors for easy Upgrade
• Clear CMOS Button
• NIC LEDs (integrated) (Green & Amber)
• Dual Color Power and HD LED - To Indicate Normal Operations and Fault Conditions
• Color coordinated cables and connectors
• Tool-less Hood Removal
• Front power switch
• System memory can be upgraded without removing the system board or any internal components
• Tool-less Hard Drive, memory & optical drive Removal (For MT, SFF, and DM only)
• Green Pull Tabs, and Quick Release Latches for easy Identification

Miscellaneous Features
Additional Features Description
Product Orientation Microtower (MT) can be oriented in a tower (vertical) orientation.
Small Form Factor (SFF) can be oriented as either a desktop (horizontal) or a tower
(vertical) with optional vertical stand.
Desktop Mini (DM) can be oriented as either a desktop (horizontal) or a tower (vertical)
with optional vertical stand.
Boot Sectors Protection MBR and GPT sectors of the hard drive are critical to booting the operating system. By
saving the MBR or GPT data (depending on the how the OS was installed), the BIOS will
be able to monitor for changes and allow the user to override them with the backup
copy at boot-up.
Drive Protection System DPS Access through F10 Setup during Boot
A diagnostic hard drive self- test. It scans critical physical components and every sector
of the hard drive for physical faults and then reports any faults to the user
Running independently of the operating system, it can be accessed through a Windows-
based diagnostics utility or through the computer's setup procedure. It produces an
evaluation on whether the hard drive is the source of the problem and needs to be
replaced
The system expands on the Self-Monitoring, Analysis, and Reporting Technology
(SMART), a continuously running systems diagnostic that alerts the user to certain
types of failures
SMART Technology (Self-Monitoring, Allows hard drives to monitor their own health and to raise flags if imminent failures
Analysis and Reporting Technology) were predicted
SMART I - Drive Failure Prediction Predicts failures before they occur. Tracks fault prediction and failure indication
parameters such as re-allocated sector count, spin retry count, calibration retry count
SMART II - Off-Line Data Collection By avoiding actual hard drive failures, SMART hard drives act as "insurance" against
unplanned user downtime and potential data loss from hard drive failure
SMART III - Off-Line Read Scanning with IOEDC: I/O Error Detection Circuitry
Defect Reallocation
SMART IV - End-to-End CRC for hard Detects errors in Read/Write buffers on HDD cache RAM
drives

After Market Options
AFTER MARKET OPTIONS

Graphics Solutions Mini SFF TWR AiO Part Number
NVIDIA T400 2GB GDDR6 3mDP X X 340K8AA
HP DisplayPort™ To HDMI True 4k Adapter X X X X 2JA63AA
HP DVI Cable Kit X X DC198A
HP HDMI Standard Cable Kit X X X X T6F94AA
HP DisplayPort™ Cable Kit X X X X VN567AA
HP DisplayPort™ To VGA Adapter X X X X AS615AA
HP DisplayPort™ To DVI-D Adapter X X X X FH973AA
Desktop Mini Accessories Mini SFF TWR AiO Part Number

HP Desktop Mini Port Cover v3 X 13L69AA
HP Desktop Mini 2.5" SATA Drive Bay kit v2 X 13L70AA
HP Desktop Mini LockBox V2 X 3EJ57AA
HP Desktop Mini DVD-Writer ODD Expansion Module X K9Q83AA
HP Desktop Mini Security/Dual VESA Sleeve v3 X 13L67AA
HP Desktop Mini Security/Dual VESA Sleeve v3 With
X 13L68AA
Power Supply Holder
HP B250 PC Mounting Bracket X 8RA46AA
HP B300 PC Mounting Bracket X 2DW53AA
HP B300 PC Mounting Bracket with Power Supply
X 7DB37AA
Holder
HP Desktop Mini Vertical Chassis Stand X G1K23AA
B550 PC Mounting Bracket X 16U00AA
HP DM Power Supply Holder Kit v2 X 7DB38AA
HP Quick Release Bracket 2 X 6KD15AA
HP Single Monitor Arm X BT861AA
HP Integrated Work Center Stand 5 X G1V61AA
Data Storage Drives Mini SFF TWR AiO Part Number

HP PCIe NVME TLC 256GB SSD M.2 Drive X X X X 1CA51AA
HP PCIe NVME TLC 512GB SSD M.2 Drive X X X X X8U75AA
HP PCIe Gen 4 NVME TLC M.2 512GB SSD X X X X 406L8AA
HP PCIe Gen 4 NVME TLC M.2 1TB SSD X X X X 406L7AA
HP 500GB 7200PRM SATA 6.0Gb/s 3.5” Hard Drive X X QK554AA
HP 1TB 7200rpm SATA 6Gb/s 3.5” Hard Drive X X QK555AA
HP 9.5mm G3 8/6/4 SFF G4 400 SFF/MT DVD Writer X X 1CA53AA
HP SFF SATA DVD-Writer ODD X 52D76AA
HP TWR SATA DVD-Writer ODD X 52D77AA


Input Devices Mini SFF TWR AiO Part Number
HP Wired Desktop 320K Keyboard X X X X 9SR37AA
HP USB Business Slim CCID SmartCard Keyboard X X X X Z9H48AA
HP Wired Desktop 320MK Mouse and Keyboard X X X X 9SR36AA
HP Wired Desktop 320M Mouse X X X X 9VA80AA
HP 655 Wireless Keyboard and Mouse Combo X X X X 4R009AA
HP 455 Programmable Wireless Keyboard X X X X 4R177AA
HP 125 Wired Keyboard X X X X 266C9AA
HP 125 Wired Mouse X X X X 265A9AA
HP 128 Laser Wired Mouse X X X X 265D9AA
HP 225 Wired Mouse and Keyboard Combo X X X X 286J4AA
HP 225 Antimicrobial Wired Mouse and Keyboard
X X X X 286K3AA
Combo (China Only)
System Memory Mini SFF TWR AiO Part Number

HP 4GB DDR4-3200 UDIMM X X 13L78AA
HP 4GB DDR4-3200 SODIMM X X 13L79AA
Multimedia Devices Mini SFF TWR AiO Part Number

HP S101 Speaker Bar X X X 5UU40AA
HP Stereo 3.5mm Headset G2 X X X X 428K7AA
HP Stereo USB Headset G2 X X X X 428K6AA
HyperX Cloud MIX – Gaming Headset (Black-
X X X X 4P5K9AA
Gunmetal)
HyperX Cloud Flight – Wireless Gaming Headset
X X X X 4P5L4AA
(Black-Red)
HyperX Cloud Stinger Core – Gaming Headset (Black) X X X X 4P4F4AA
HyperX Cloud Core + 7.1 Gaming Headset (Black) X X X X 4P4F2AA
HyperX SoloCast USB WHT Microphone (Black) X X X X 4P5P8AA
Communication Devices Mini SFF TWR AiO Part Number

Intel® Ethernet I225-T1 GbE NIC X X 406L9AA
Security Devices Mini SFF TWR AiO Part Number

HP Business PC Security Lock v3 Kit X X X 3XJ17AA


HP Keyed Cable Lock 10mm X X X X T1A62AA
HP Master Keyed Cable Lock 10mm X X X X T1A63AA
Stands and Mounting Accessories Mini SFF TWR AiO Part Number
HP B250 PC Mounting Bracket X 8RA46AA
HP B300 PC Mounting Bracket X 2DW53AA
HP B550 PC Mounting Bracket X 16U00AA
HP Quick Release Bracket 2 X X 6KD15AA
HP Single Monitor Arm X BT861AA
HP ProOne G9 VESA Plate with Power Supply Holder X 56P78AA
HP ProOne G9 Height Adjustable Stand X 13L65AA
I/O Devices Mini SFF TWR AiO Part Number

HP DisplayPort Port Flex IO v2 X X X 13L54AA
HP HDMI Port Flex IO v2 X X X 13L55AA
HP Type-C USB 3.1 Gen2 Port Flex IO v2 X X 13L59AA
HP Type-C USB 3.1 Gen2 Port with 100W PD Flex IO v2 X 13L60AA
HP VGA Port Flex IO v2 X X X 13L53AA
HP Serial Port Flex IO v2 X X X 13L56AA
HP Serial Port Flex IO 2nd X 13L57AA
HP Internal Serial Port (400) X 3TK81AA
HP PCIe x1 Parallel Port Card X X N1M40AA
HP 800/600/400 G3 Serial/ PS/2 Adapter X X 1VD82AA
HP USB to Serial Port Adapter X X X X J7B60AA
HP USB-C to Display Port Adapter X X X X N9K78AA
HP Serial Port Flex IO v3 X X X 5B895AA
HP Thunderbolt 3.0 Flex IO v3 X 440A5AA
HP USB-C To DisplayPort Adapter X X X X N9K68AA
HP Single Mini Display Port Adapter to Display Port
X 2MY05AA
Adapter
NOTE: For more detail on HP I/O Devices please refer to the HP FLEX IO Option Cards QuickSpecs. URL is:
http://h20195.www2.hp.com/v2/GetDocument.aspx?docname=c06042607

© Copyright 2022 HP Development Company, L.P. The information contained herein is subject to change without notice. The only
warranties for HP products are set forth in the express limited warranty statements accompanying such products. Nothing herein
should be construed as constituting an additional warranty. HP shall not be liable for technical or editorial errors or omissions
contained herein. Microsoft and Windows are registered trademarks or trademarks of Microsoft Corporation in the U.S. and/or other
countries. Intel, Celeron, Core, Pentium are registered trademarks or trademarks of Intel Corporation in the U.S. and/or other
countries. Bluetoothâ is a trademark of its proprietor, used by HP, Inc. under license. USB Type-C™ and USB-C™ are trademarks of
USB Implementers Forum. NVIDIA, GeForce and NVS are trademarks and/or registered trademarks of NVIDIA Corporation in the U.S.
and other countries. AMD and Radeon are trademarks of Advanced Micro Devices, Inc. ENERGY STAR is a registered trademark
owned by the U.S. Environmental Protection Agency. DisplayPort™ and the DisplayPort™ logo are trademarks owned by the Video
Electronics Standards Association (VESA®) in the United States and other countries.

Change Log
Date Version History Action Description of Change

March 22, 2022 From v1 to v2 Correction 440 G9 Environmental table edited
March 23, 2022 From v2 to v3 Addition Environmental information added to AiO table
March 24, 2022 From v3 to v4 Correction AiO Environmental information table
April 14, 2022 From v4 to v5 Addition Type-C® SuperSpeed USB 20Gbps signaling rate port for DM
April 21, 2022 From v5 to v6 Removal HSA Fusion for Commercial and HSA Telemetry for Commercial removed
May 6, 2022 From v6 to v7 Addition Environmental information added SFF and Pro Tower
May 10, 2022 From v7 to v8 Addition Declared Noise Emissions values added to DM environmental Table
June 2, 2022 From v8 to v9 Removal 12700T and 6900T processors removed for SFF / T400 graphic card
corrected
June 9, 2022 From v9 to v10 Update Environmental tables certifications updated
June 27, 2022 From v10 to v11 Addition Power consumption bullet added to At a glance section
June 28, 2022 From v11 to v12 Update Intel® Core™ i7-12700 Processor updated to 4.9 GHz max. turbo
frequency
From v12 to v13
From v13 to v14
From v14 to v15
From v15 to v16
From v16 to v17
From v17 to v18
From v18 to v19
From v19 to v20
From v20 to v21
From v21 to v22
From v22 to v23


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QuickSpecs HP Pro Series 400 G9 Desktops PCs

HP Pro Mini 400 G9 Desktop PC

Not all configuration components are available in all regions/countries. Page 1

HP Pro Mini 400 G9 Desktop PC

1. Sold separately or as an optional feature.

Not all configuration components are available in all regions/countries. Page 2

Standard Features and Configurable Components (availability may vary by country)

HP Pro SFF 400 G9 Desktop PC

1. Slim optical drive (optional) 5. SD card 4.0 reader (optional)

1. Must be configured at time of purchase.

Not all configuration components are available in all regions/countries. Page 3

Standard Features and Configurable Components (availability may vary by country)

HP Pro SFF 400 G9 Desktop PC

1. Each of the legacy options will occupy one rear slot.

Not all configuration components are available in all regions/countries. Page 4

Standard Features and Configurable Components (availability may vary by country)

HP Pro Tower 400/480 G9 PCI Desktop PC

1. Slim optical drive (optional) 5. SD card 4.0 reader (optional)2

Not all configuration components are available in all regions/countries. Page 5

Standard Features and Configurable Components (availability may vary by country)

HP Pro Tower 400/480 G9 PCI Desktop PC

1. Each of the legacy options will occupy one rear slot

Not all configuration components are available in all regions/countries. Page 6

Standard Features and Configurable Components (availability may vary by country)

1. Pull-up webcam (optional) 6. Power button

5MP webcam with 5MP webcam with

1. Dual microphones 1. Dual microphones 1. Dual microphones

Not all configuration components are available in all regions/countries. Page 7

Standard Features and Configurable Components (availability may vary by country)

Not all configuration components are available in all regions/countries. Page 8

Standard Features and Configurable Components (availability may vary by country)

Not all configuration components are available in all regions/countries. Page 9

Standard Features and Configurable Components (availability may vary by country)

Not all configuration components are available in all regions/countries. Page 10

Standard Features and Configurable Components (availability may vary by country)

Intel® Core™ i7-12700T Processor1

Intel® Core™ i5-12600 Processor1

Intel® Core™ i5-12600T Processor1

NOTE*: Only available with discrete graphics card.

Not all configuration components are available in all regions/countries. Page 11

Standard Features and Configurable Components (availability may vary by country)

Intel® Core™ i5-12500T Processor1

Intel® Core™ i5-12400 Processor1

Not all configuration components are available in all regions/countries. Page 12

Standard Features and Configurable Components (availability may vary by country)

Intel® Core™ i3-12300T Processor1

Intel® Core™ i3-12100 Processor1

Intel® Core™ i3-12100T Processor1

Not all configuration components are available in all regions/countries. Page 13

Standard Features and Configurable Components (availability may vary by country)

Not all configuration components are available in all regions/countries. Page 14

Standard Features and Configurable Components (availability may vary by country)

Optional Discrete Graphics Solutions

Adapters and Cables

2.5 inch SATA Hard Disk Drives (HDD)

M.2 PCIe NMVe Solid State Drives (SSD)

Not all configuration components are available in all regions/countries. Page 15

Standard Features and Configurable Components (availability may vary by country)

Optical Disc Drives Mini SFF TWR AiO