EliteDesk 800 G4

QuickSpecs HP EliteDesk 800 G4 and HP EliteOne 800 G4 Business Desktops PCs
Overview
HP EliteDesk 800 G4 Desktop Mini Business PC
1. USB Type-C™ 3.1 Gen 2 Port (charge support up to 5V/3A) 5. Universal Audio Jack with CTIA headset support
2. USB 3.1 Gen 2 Type A 6. Hard Drive activity light
3. USB 3.1 Gen 1 Type A (charge support up to 5V/1.5A) 7. Dual-state power button
4. Headphone connector
Not all configuration components are available in all regions/countries. Page 1

c06040430 – DA16286 – Worldwide — Version 36 — February 18, 2020
Overview
1. DisplayPort™ 1.2 5. RJ-45 Network Adapter

2. USB 3.1 Gen 2 Type A 6. Power connector
3. Configurable Option card slot (Choice of DisplayPort™ 1.2, 7. WLAN External Antenna Punchout
HDMI™ 2.0, VGA, USB Type-C™ with alt mode display, USB
8. Standard lock slot (10 mm)
Type-C™ with Power Delivery, Discrete Graphics Option Card
with DisplayPort™ 1.4, Thunderbolt 3.0, Serial Port, Fiber 9. Cover Release Thumbscrew
NIC) 10. WLAN Internal Antenna
4. USB 3.1 Gen 1 Type A 11. Padlock Loop
allows for wake from S4/S5 with keyboard/mouse when
connected and enabled in BIOS
Not Shown
Slots (1) Internal M.2 2230 connector for WLAN
(2) Internal M.2 SSD storage (2230 or 2280 connector)
Bays (1) 2.5- inch SATA drive Bay
Mounting Support for
- VESA 100 mounting system on bottom of PC chassis
- VESA Sleeve
- Quick Release Bracket
- B300/B500 Mounting bracket

Overview
HP EliteDesk 800 G4 Small Form Factor Business PC
1. Slim optical drive (optional) 6. USB 2.0 (charge support up to 5V/1.5A)

2. SD 4 Card Reader (optional) 7. Headphone connector
3. USB Type-C™ port (charge support up to 5V/3A) 8. Universal Audio Jack with CTIA headset support
4. USB 3.1 Gen2 ports (2) 9. Hard drive activity light
5. USB 2.0 port 10. Dual-state power button

Overview

(Rear Image)
1. Audio-in connector 6. Optional port (DisplayPort™ 1.2, HDMI, VGA or USB-C™)

(USB-C™ option has alt mode DisplayPort™ 1.2 or 15W
output) - shown here not installed
2. Audio-out connector for powered audio devices 7. RJ-45 (network) jack
3. Standard lock slot 8. USB 2.0 ports with wake from S4/S5 (2)
4. Dual-Mode DisplayPort™ 1.2 (2) 9. USB 3.1 Gen2 ports (2)
5. Optional serial port - shown here not installed 10. USB 3.1 Gen1 ports (2)
11. Optional Thunderbolt PCIe card - shown here installed
Not shown
Slots Bays
(2) PCI Express x16 graphics connectors; one wired as an x4 (1) 2.5" internal storage drive bay
(2) PCI Express x1 (2) 3.5” internal storage drive bay (convertible to 2.5”)
(2) internal M.2 SSD storage (2230 or 2280 connector) (1) 9.5 mm slim optical drive bay
(1) internal M.2 WLAN (2230 connector)

Overview
HP EliteDesk 800 G4 Tower Business PC
1. 5.25-inch Half-Height Drive Bay (behind bezel) 1. Audio-out jack for powered audio devices
2. Slim optical drive (optional) 2. Dual-Mode DisplayPort™ 1.2 (DP++) (2)
3. SD 4 Card Reader (optional) 3. Optional port (DisplayPort™ 1.2, HDMI, VGA or USB-C™)
(USB-C™ option has alt mode DisplayPort™ 1.2 or 15W
4. Dual-state power button output) – Shown here HDMI installed
5. Universal Audio Jack with CTIA headset support 4. USB 2.0 ports with wake from S4/S5 (2)
6. Headphone connector 5. USB 3.1 Gen2 ports (2)
7. USB 2.0 port (charge support up to 5V/1.5A) 6. USB 3.1 Gen1 ports (2)
8. USB 2.0 port 7. Standard lock slot
9. USB 3.1 Gen2 ports (2) 8. RJ-45 (network) jack
10. USB Type-C™ port (charge support up to 5V/3A) 9. Optional serial port – shown here installed
10. Power cord connector
11. Audio-in jack
Not shown
Slots Bays
(2) PCI Express x16 graphics connectors; one wired as an x4 (1) 2.5" internal storage drive bay
(2) PCI Express x1 (2) 3.5” internal storage drive bay (convertible to 2.5”)
(2) internal M.2 SSD storage (2230 or 2280 connector) (1) 5.25” half-height drive bay
(1) internal M.2 WLAN (2230 connector) (1) 9.5mm slim optical drive bay

Overview
HP EliteOne 800 G4 All-in-One Business PC (23.8” Touch and Non-Touch)
1. Camera (optional) 2. Speakers (optional)
Infrared (IR) and dual facing camera (optional)
1. Camera light 3. Full High Definition 5. Rear camera adjustment 7. Camera light
(FHD) camera wheel
2. IR camera light 4. IR camera 6. Digital microphones 8. FHD camera
Full High Definition (FHD) camera (optional)
1. Camera light 2. FHD camera 3. Digital microphones

Overview
1. Optical disc drive (optional) 3. Universal Audio Jack with CTIA headset support
2. Optical disc drive eject button (optional) 4. Headphone connector

Overview
Bottom components and rear ports (behind security cover)

1. USB 3.1 Gen 2 Type-A 8. Dual-Mode DisplayPort™ 1.2 (DP++) for integrated
2. USB 3.1 Gen 2 Type-A (charge support up to 5V/1.5A) graphics models or Dual-Mode DisplayPort™ 1.4
3. Audio line-out connector (DP++) for discrete graphics models
4 USB 3.1 Gen 2 Type-A ports (2)
5. RJ-45 (network) jack 9. HDMI connector
6. Power connector 10. SD card reader 4.0 (optional)
7. USB 3.1 Gen 1 Type-A ports (2) (keyboard/mouse wake 11. USB 3.1 Type-C™ Gen 2 port (charge support up to
capable) 5V/3A)
12. Dual-state power button
Not shown
Slots Bays
(1) internal M.2 PCIe x1 connector for optional wireless NIC (1) 2.5" internal storage drive bay
(2) internal M.2 PCIe x4 connector for optional m.2 SSD VESA
Support for VESA 100 mounting system on back of
PC chassis (mounting hardware sold separately)

Technical Specification - Processors

Rear and side components
1. Fingerprint reader (optional) 3. Adjustable height stand (optional)

2. Rear port cover


AT A GLANCE
• Choice of four form factors: Tower, Small Form Factor, Desktop Mini and All-In-One (touch/non-touch)
• Intel® Q370 chipset supporting Intel® 8th generation Core™ processors, featuring integrated Intel® UHD Graphics and
Intel® vPro™ Technology (available with Core i5 and Core i7 processors) 1,4
• Processors up to 95W on TWR, SFF and DM
• Intel® UHD graphics as well as optional discrete graphics
• Intel® Ethernet Connection I219LM GbE LOM integrated network connection
• DDR4 Synchronous Dynamic Random Access Memory (SDRAM) (Transfer rates up to 2666 MT/s)
• Support for up to three monitors via two standard DisplayPort™ 1.2 connectors and an optional third video port connector
which provides the following choices: HDMI, VGA, DisplayPort™ 1.2, or USB Type-C™ with DisplayPort™ 1.2 for all
platforms; USB Type-C™ with DisplayPort™ 1.2 and Power Delivery (PD) from Display for 800 G4 DM 35W (see Ports
section for port availability by platform). AiO supports up to two additional monitors via DisplayPort™ or HDMI
connectors.2
• Configurable 3rd rear I/O with video port (HDMI, DisplayPort™ 1.2, VGA, Type-C™ with DisplayPort™ 1.2) or Thunderbolt
3.0 (port on DM, PCIe card on TWR, SFF)
• Selection of discrete graphic cards to configure systems to up to 7 displays (TWR, SFF and DM 35W) 2
• VR ready cards on the 800 G4 TWR
• Models can be configured with multiple data drives in a RAID array
• Skype for Business certified (AiO)
• Audio by Bang & Olufsen (AiO)
• Intel® Unite™ available (AiO)
• Intel Unite needs to be configured at factory (AiO/DM)
• EN 60601-1-2: 2015 compliant (AiO)
• Enhanced Security With:
HP Sure Click
HP Sure Start Gen4
HP Sure Run
HP Sure Recover
HP Manageability Integration Kit
HP BIOSphere Gen4
HP Client Security Manager Gen4
Notification with HP Image Assistant Gen3
Multifactor Authentication features include fingerprint reader (optional) and IR webcam (optional) both Windows Hello
certified (AiO)
• High efficiency energy saving power supply options
• ENERGY STAR® certified. EPEAT® 2019 registered where applicable. EPEAT ® registration varies by country. See
http://www.epeat.net for registration status by country4. Search keyword generator on HP’s 3rd party option store for
solar generator accessories at http://www.hp.com/go/options.
• CCC, CECP and SEPA Certified (TWR/SFF/DM)
• CECP Certified (AiO)
• TCO Edge for AiO (AiO)
• PC chassis and all internal components and modules are manufactured with low halogen content 3
• Dust filter available for all platforms (except 65W and 95W Desktop Mini)
• Protected by HP Services, including limited warranties up to 3-3-3 (terms and conditions vary by country; certain
restrictions and exclusions apply); Care Packs available with up to 5 years Next Business Day Onsite Hardware Support
• Compliance with CE (Class B) / FCC (Class B) / UL (UL609501) / CSA (CSA C22.2 No.60950-1-07) / ICES-003 / CCC / VCCI
(Class B) / KCC (Class B)
1. Multi core is designed to improve performance of certain software products. Not all customers or software applications will necessarily benefit
from use of this technology. Performance and clock frequency will vary depending on application workload and your hardware and software
configurations. Intel’s numbering, branding and/or naming is not a measurement of higher performance
2. DisplayPort™ multi-stream monitors ‘daisy-chained’ together.
3. External power supplies, power cords, cables and peripherals are not low halogen. Service parts obtained after purchase may not be low
halogen.


4. Some functionality of vPro technology, such as Intel Active management technology and Intel Virtualization technology, requires additional
3rd party software in order to run. Availability of future "virtual appliances" applications for Intel vPro technology is dependant on 3rd party
software providers. Compatibility of this generation of Intel vPro technology-based hardware with with future "virtual appliances" is yet to be
determined.
5. Based on US EPEAT® registration according to IEEE 1680.1-2018 EPEAT®. Status varies by country. Visit www.epeat.net for more information.
NOTE: See important legal disclosures for all listed specs in their respective features sections
PRODUCT NAME
HP EliteOne 800 G4 23.8-inch Touch and Non-Touch All-in-One Business PC
OPERATING SYSTEM
Preinstalled Windows® 10 Pro 641
Windows® 10 Pro 64 (National Academic License)2
Windows® 10 Home 641
Windows® 10 Home Single Language 641
FreeDos 2.0
Web-supported only Windows® 10 Enterprise 641
1. Not all features are available in all editions or versions of Windows. Systems may require upgraded and/or separately purchased hardware,
drivers, software or BIOS update to take full advantage of Windows functionality. Windows 10 is automatically updated, which is always
enabled. ISP fees may apply and additional requirements may apply over time for updates. See http://www.windows.com/.
2. Some devices for academic use will automatically be updated to Windows 10 Pro Education with the Windows 10 Anniversary Update.
Features vary; see https://aka.ms/ProEducation for Windows 10 Pro Education feature information.
NOTE: Your product does not support Windows 8 or Windows 7
In accordance with Microsoft’s support policy, HP does not support the Windows® 8 or Windows 7 operating system on products configured
with Intel and AMD® 7th generation and forward processors or provide any Windows® 8 or Windows 7 drivers on
http://www.support.hp.com
CHIPSET
DM SFF TWR AiO
Intel® Q370 PCH-H– vPro™ X X X X


PROCESSORS
Intel® 8th Generation Core™ Processors DM SFF TWR AiO
Intel® Core™ i7 8700K Processor with Intel® UHD Graphics 630 (3.7GHz, up
to 4.7 GHz with Intel® Turbo Boost,12MB cache, 6 cores) 95W1 Supports X X X
Intel® vPro™Technology4
Intel® Core™ i7+ 8700K Processor with Intel® UHD Graphics 630 (3.7 GHz, up
to 4.7GHz with Intel® Optane™ Memory, 12 MB cache, 6 cores) 95W1,2 X X X
Supports Intel® vPro™Technology4
Intel® Core™ i7 8700 processor with Intel® UHD Graphics 630 (3.2 GHz, up to
4.6 GHz with Intel® Turbo Boost, 12 MB cache, 6 cores) 65W1,3 X X X X
Intel® Core™ i7+ 8700 processor (Core i7 and 16GB Intel® Optane™ memory)
with Intel® UHD Graphics 630 (3.2 GHz, up to 4.6 GHz with Intel® Turbo
X X X X
Boost, 12 MB cache, 6 cores) 65W1,2,3
Intel® Core™ i7 8700T processor with Intel® UHD Graphics 630 (2.4 GHz, up
to 4 GHz with Intel® Turbo Boost, 12 MB cache, 6 cores)1,3 X
Intel® Core™ i7+ 8700T Processor with Intel® UHD Graphics 630 (2.4 GHz, up
to 4.0 GHz with Intel® Optane™ Memory, 12 MB cache, 6 cores)1,2 X
Intel® Core™ i5 8600K Processor with Intel® UHD Graphics 630 (up to
3.6GHz, 9MB cache, 6 cores) 95W1 X X X
Intel® Core™ i5+ 8600K processor (Core i5 and 16GB Intel® Optane™
memory) with Intel® HD Graphics 630 (3.1 GHz, up to 4.3 GHz with Intel®
X X X
Turbo Boost, 9 MB cache, 6 cores)1,2,3
4.3 GHz with Intel® Turbo Boost, 9 MB cache, 6 cores)1,3 X X X X
X X X X
Boost, 9 MB cache, 6 cores)1,2,3
4.1 GHz with Intel® Turbo Boost, 9 MB cache, 6 cores)1,3 X X X X
X X X X
Boost, 9 MB cache, 6 cores)1,2,3
to 3.5 GHz with Intel® Turbo Boost, 9 MB cache, 6 cores)1,3 X
to 3.5 GHz with 16GB Intel® Optane™ Memory, 9 MB cache, 6 cores)1,2 X


to 3.7 GHz with Intel® Turbo Boost, 9 MB cache, 6 cores)1,3 X
to 3.7 GHz with 16GB Intel® Optane™ Memory, 9 MB cache, 6 cores)1,2 X
Intel® Core™ i3 8300 processor with Intel® UHD Graphics 630 (3.7 GHz, 8 MB
X X X X
cache, 4 cores)1
Intel® Core™ i3 8100 processor with Intel® UHD Graphics 630 (3.6 GHz, 6 MB
X X X X
cache, 4 cores)1
Intel® Core™ i3 8100T processor with Intel® UHD Graphics 630 (3.1 GHz, 6
X
MB cache, 4 cores)1
Intel® Core™ i3 8300T processor with Intel® UHD Graphics 630 (3.2 GHz, 8
X
MB cache, 4 cores)1
Intel® 8th Generation Pentium® Processors DM SFF TWR AiO

Intel® Pentium® Gold G5600 processor with Intel® UHD Graphics 630 (3.9
X X X X
GHz, 4 MB cache, 2 cores)1
X X X X
X X X X
Intel® Pentium® Gold G5400T processor with Intel® UHD Graphics 610 (3.1
X
Intel® Pentium® Gold G5500T processor with Intel® UHD Graphics 630 (3.2
X
Intel® 8th Generation Celeron™ Processors DM SFF TWR AiO

Intel® Celeron® G4900 processor with Intel® UHD Graphics 610 (3.1 GHz, 2
X X X X
MB cache, 2 cores)1
Intel® Celeron® G4900T processor with Intel® UHD Graphics 610 (2.9 GHz, 2
X
MB cache, 2 cores)1
Intel® Celeron® G4920 processor with Intel® UHD Graphics 610 (3.2 GHz, 2
X
MB cache, 2 cores)1
1: Multi-core is designed to improve performance of certain software products. Not all customers or software applications will necessarily benefit
from use of this technology. Performance and clock frequency will vary depending on application workload and your hardware and software
configurations. Intel’s numbering, branding and/or naming is not a measurement of higher performance.
2. Intel® Optane™ memory system acceleration does not replace or increase the DRAM in your system.
3. Intel® Turbo Boost technology requires a PC with a processor with Intel Turbo Boost capability. Intel Turbo Boost performance varies depending
on hardware, software and overall system configuration. See http://www.intel.com/technology/turboboost for more information.
4. Some functionality of vPro technology, such as Intel Active management technology and Intel Virtualization technology, requires additional
3rd party software in order to run. Availability of future "virtual appliances" applications for Intel vPro technology is dependant on 3rd party
software providers. Compatibility of this generation of Intel vPro technology-based hardware with with future "virtual appliances" is yet to be
determined.”


GRAPHICS
Integrated Intel® Graphics DM SFF TWR AiO
Intel® UHD Graphics 630 (integrated on 8th gen Core i7/i5/i3, Pentium®
X X X X
Gold G5600, G5500)
Intel® UHD Graphics 610 (integrated on 8th gen Pentium® Gold G5400,
X X X X
Celeron® G4900)
Optional Discrete Graphics Solutions DM SFF TWR AiO

AMD® Radeon™ RX 550 4GB 2DP 1HDMI Graphics Card X X
AMD® Radeon™ RX 560X 4GB GDDR5 X X
AMD® Radeon™ RX 580 4GB FH PCIe x16* X
AMD® Radeon™ RX 580 8GB FH GDDR5* X
AMD® Radeon™ R7 430 2GB VGA+DP Graphics Card X
AMD® Radeon™ R7 430 2GB GDDR5 64bit DP+VGA X
AMD® Radeon™ R7 430 2GB GDDR5 64bit 2DP X X
AMD® Radeon™ R7 430 2GB 2DP Graphics Card X X
AMD® Radeon™ 520 1GB VGA + DP Graphics Card X
NVIDIA® GeForce® GT 730 2GB DP DVI PCIe x8 GFX X X
NVIDIA® GeForce® GTX 1060 3GB Graphics Card* X
NVIDIA® GeForce® RTX 2080 8GB GDDR6* X
NVIDIA® GeForce® RTX 2060 6GB DP+HDMI+DVI-D X
NVIDIA® Quadro P620 2GB Graphics Card X
NVIDIA® Quadro P400 2GB Graphics Card X X
*Requires 500W chassis

NOTE: As of 2019, AMD Radeon™ RX 560 is renamed to AMD Radeon™ RX 560X
Adapters and Cables DM SFF TWR AiO

HP DisplayPort™ Cable X X X X
HP DisplayPort™ to DVI-D Adapter X X X X
HP DisplayPort™ to HDMI 4K Adapter X X X X
HP DisplayPort™ to VGA Adapter X X X X
HP USB-C™ to USB 3.0 X X X X
HP USB to Serial Port Adapter X X X X
STORAGE
3.5 inch SATA Hard Disk Drives (HDD) DM SFF TWR AiO
500GB 7200RPM 3.5in SATA HDD X X
1TB 7200RPM 3.5in SATA HDD X X
2TB 7200RPM 3.5in SATA HDD X X


2.5 inch SATA Hard Disk Drives (HDD) DM SFF TWR AiO
500GB 7200RPM 2.5in SATA HDD X X X X
1TB 7200RPM 2.5in SATA HDD X X X X
2TB 5400RPM 2.5in SATA HDD X X X X
500GB 7200RPM 2.5in Self Encrypted OPAL2 SATA HDD* X X X X
500GB 7200RPM 2.5in Self Encrypted Federal Information Processing X X X X
Standard SATA HDD*
2.5 inch SATA Solid State Hybrid Drives (SSHD) DM SFF TWR AiO
500GB 5400RPM 2.5in SATA SSHD X X X
1TB 5400RPM 2.5in SATA SSHD X X X
2TB 5400RPM 2.5in SATA SSHD X X X
2.5 inch Solid State Drives (SSD) DM SFF TWR AiO

128GB 2.5in SATA Three Layer Cell SSD X X X X
256GB 2.5in SATA Self Encrypted OPAL2 Three Layer Cell SSD* X X X X
512GB 2.5in SATA Self Encrypted OPAL2 Three Layer Cell SSD* X X X X
256GB 2.5in SATA Self Encrypted Federal Information Processing X X X X
Standard SSD*
512GB 2.5in SATA Self Encrypted Federal Information Processing X X X X
Standard SSD*
M.2 PCIe NVMe Solid State Drives (SSD) DM SFF TWR AiO
128GB M.2 2280 PCIe NVMe SSD X X X X
128GB M.2 2280 PCIe NVMe Three Layer Cell SSD X X X X
1TB M.2 2280 PCIe NVMe Three Layer Cell SSD X X X X
256GB M.2 2280 PCIe NVMe Self Encrypted OPAL2 Three Layer Cell
X X X X
SSD*
512GB M.2 2280 PCIe NVMe Self Encrypted OPAL2 Three Layer Cell
X X X X
SSD*
Optical Disc Drives DM SFF TWR AiO

HP 9.5mm Slim DVD-ROM Drive X X X
HP 9.5mm Slim DVD Writer Drive X X X
HP 9.5mm Slim Blu-Ray Writer Drive X X X
NOTE*: Storage Drivelock does not work with Self Encrypting or Optane based storage.


Media Card Reader DM SFF TWR AiO
SD 4.0 with 5-in-1 Interface (Supports SD, SDXC, SDHC, UHS-I, UHS-II) X X X
NOTE: For hard drives and solid state drives, GB = 1 billion bytes. TB = 1 trillion bytes. Actual formatted capacity is less. Up to 36 GB (for Windows 10) of system
disk is reserved for the system recovery software.
MEMORY
Memory Type DM SFF TWR AiO
DDR4-2666 (Transfer rates up to 2666 MT/s), 32 GB, 2 SODIMM X X
DDR4-2666 (Transfer rates up to 2666 MT/s), 64 GB, 4 DIMM X X
Memory Configuration DM SFF TWR AiO

4 GB (1 x 4 GB) X X X X
8 GB (2 x 4 GB) X X X X
8 GB (1 x 8 GB) X X X X
16 GB (2 x 8 GB) X X X X
16 GB (1 x 16 GB) X X X X
32 GB (2 x 16 GB) X X X X
32 GB (4 x 8 GB) X X
64 GB (4 x 16 GB) X X
128 GB (4 x 32GB) X
NOTE: For systems configured with more than 3 GB of memory and a 32-bit operating system, all memory may not be available due to system resource requirements.
Addressing memory above 4 GB requires a 64-bit operating system.
Memory modules support data transfer rates up to 2666 MT/s; actual data rate is determined by the system's configured processor. See processor specifications
for supported memory data rate.
NOTE: All memory slots are customer accessible / upgradeable.


NETWORKING/COMMUNICATIONS
Ethernet (RJ-45) Integrated DM SFF TWR AiO
Intel® I219-LM Gigabit Network Connection LOM (standard) X X X X
Intel® Ethernet I210-T1 PCIe x1 Gb Network Interface Card (optional) x X
Wireless1 DM SFF TWR AiO

Intel® 9560 802.11AC 2x2 with Bluetooth® M.2 Combo Card vPro™ X X X X
Intel® 9560 802.11AC 2x2 with Bluetooth® M.2 Combo Card non-vPro™ X X X X
Realtek RTL8822BE 802.11ac 2x2 with Bluetooth® M.2 Combo Card X X X
Realtek RTL8821CE 802.11ac 1x1 with Bluetooth® M.2 Combo Card X X X
Intel® 7265 802.11AC 2x2 with Bluetooth® M.2 Combo Card non-vPro™
X X
(Brazil)
Intel® 7265 802.11AC 2x2 M.2 Combo Card non-vPro™ with external
X X
antenna (Brazil)
1. Wireless access point and Internet service required and not included. Availability of public wireless access points limited. The specifications for the
802.11ac WLAN are draft specifications and are not final. If the final specifications differ from the draft specifications, it may affect the ability of the
notebook to communicate with other 802.11ac WLAN devices
KEYBOARDS AND POINTING DEVICES

Keyboards DM SFF TWR AiO
HP USB Conferencing Keyboard X X X X
HP Wireless Collaboration Keyboard X X X X
HP USB and PS/2 Washable Keyboard1 X X X X
HP USB Smart Card (CCID) Keyboard X X X X
HP USB Business Slim Keyboard X X X X
HP USB Keyboard X X X X
HP PS/2 Business Slim Keyboard1 X X
HP PS/2 Keyboard1 X X
HP Wireless Business Slim Keyboard and Mouse X X X X
Mouse DM SFF TWR AiO

HP PS/2 Mouse1 X X
HP USB Optical Mouse X X X X
HP USB Premium Mouse X X X X
HP USB 1000dpi Laser Mouse X X X X
HP USB and PS/2 Washable Mouse1 X X X
Antimicrobial USB Mouse2 X X X X
HP USB Hardened Mouse2 X X X X
1. PS/2 port not available on EliteOne 800 G4 AiOs

2. Not available in all regions


SECURITY
DM SFF TWR AiO
Trusted Platform Module (TPM) 2.0 (Infineon SLB9670). Common X X X X
Criteria EAL4+ Certified. FIPS 140-2 Level 2 Certified
Solenoid Lock & Intrusion Sensor X X
Intrusion Sensor for DM/AiO (integrated in the PCA, can be X X
enabled/disabled through BIOS)
Support for chassis cable lock devices X X X X
(10 mm or
smaller)
Support for chassis padlocks devices X X X
HP Fingerprint Reader (standard on 800 G4 AiO touch models and X
optional on non-touch models)
SATA port disablement (via BIOS) X X X X
Serial, USB enable/disable (via BIOS) X X X X
Intel® Identify Protection Technology (IPT)1 X X X X
Serial, parallel, USB enable/disable (via BIOS) X X X X
Optional USB Port Disable at factory (user configurable via BIOS) X X X X
Removable media write/boot control X X X X
Power-on password (via BIOS) X X X X
Setup password (via BIOS) X X X X
1. Models configured with Intel® Core™ processors have the ability to utilize advanced security protection for online transactions. IPT, used in conjunction with
participating web sites, provides double identity authentication by adding a hardware component in addition to the usual user name and password. IPT is
initialized through an HP Client Security module.


PORTS
I/O Ports – Standard DM SFF TWR AiO
USB 2.0 N/A 2 including 1 fast 2 including 1 fast N/A
charging (front); charging (front);
2 including wake 2 including wake
from S4/S5 (rear) from S4/S5 (rear)
USB 3.1 Gen 1 1 front, 2 rear 2 rear 2 rear 2 rear
USB 3.1 Gen 2 1 front, 2 rear 2 front; 2 rear 2 front; 2 rear 4 rear
USB Type-C™ 3.1 Gen 2 (15 W) 1 front; 1 rear 1 front; 1 rear 1 front; 1 rear 1 rear
(option) (option) (option)
Video 2 DisplayPort™ 1.2 2 DisplayPort™ 1.2 2 DisplayPort™ 1.2 For models with
(rear) (rear) (rear) integrated
1 Configurable 1 Configurable 1 Configurable graphics:
video port (rear) video port (rear) video port (rear) 1 DisplayPort™
(Choice of (Choice of (Choice of 1.2 (rear)
DisplayPort™ 1.2, DisplayPort™ 1.2, DisplayPort™ 1.2, 1 HDMI™ 2.0
HDMI™ 2.0, VGA, or HDMI™ 2.0, VGA, or HDMI™ 2.0, VGA, or (rear)
USB Type-C™ with USB Type-C™ with USB Type-C™ with
alt mode display alt mode display or alt mode display For models with
port and power 15W output) port or 15W discrete graphics:
delivery) output) 1 DisplayPort™
For models with 1.4 (rear)
discrete graphics: 1 HDMI™ 2.0
1 DisplayPort™ 1.4 (rear)
(rear)
Audio 1 Headphone 1 Headphone 1 Headphone 1 Line out (rear)

(front), (front), (front), 1 CTIA UAJ (side)
1 Universal Audio 1 Universal Audio 1 Universal Audio 1Audio out (side)
Jack with CTIA Jack with CTIA Jack with CTIA
headset support headset support headset support
(front)) (front)); (front));
1 Audio-out (rear), 1 Audio-out (rear),
1 Audio-in (rear) 1 Audio-in (rear)
Network Interface RJ45 RJ45 RJ45 RJ45
I/O Ports – Optional DM SFF MT

Serial (RS-232) 1 (rear)(option) 1 (rear) (option) 1 (rear) (option) N/A
Serial (RS-232) and PS/2 combination N/A 1 (rear) (option) 1 (rear) (option) N/A

I/O Ports – Internal Ports DM SFF TWR AiO

Internal SATA storage connector(s) N/A 3 4 2
Internal SATA storage connector (Data and
1 N/A N/A N/A
Power)
NOTE: For Desktop Mini with M.2 Storage config, there will be no SATA drive bracket. If you plan to use or upgrade the storage with any 2.5" SATA drive, please
select a DM SATA Drive Bracket (available as both factory configured and after market option).
Slots DM SFF TWR AiO

M.2 PCIe (1) M.2 PCIe x1 (1) M.2 PCIe x1 (1) M.2 PCIe x1 (1) M.2 PCIe x1
2230 (for WLAN) 2230 (for WLAN) 2230 (for WLAN) 2230 (for WLAN)
(2) M.2 PCIe x4 (2) M.2 PCIe x4 (2) M.2 PCIe x4 (2) M.2 PCIe x4
2280/2230 Combo 2280/2230 Combo 2280/2230 Combo 2280/2230
(for storage) (for storage) (for storage) Combo (for
storage)
PCI Express v3.0 x1 N/A 2 2 N/A
PCI Express v3.0 x16 (wired as x4) N/A 1 1 N/A
PCI Express v3.0 x16 N/A 1 1 N/A
Bays DM SFF TWR AiO

5.25" Half Height N/A N/A 1 N/A
9mm Slim Optical Disc Drive (ODD) N/A 1 1 1
SD Card Reader N/A 1 1 1
2.5" Internal Storage Drive 1 1 1 1
3.5" Internal Storage Drive N/A 2 2 N/A
NOTE: The TWR can support a single graphics card up to 75W. When configured with dual graphics cards support is limited to 35W for each.
NOTE II: SATA 2.5” internal storage drive cannot be selected if 2nd M.2, discrete graphic card, or 95W processor is selected.


SOFTWARE COMPONENTS AND APPLICATIONS WITH WINDOWS
BIOS
HP BIOSphere Gen4 17
HP DriveLock & Automatic DriveLock20
BIOS Update via Network
Master Boot Record Security
Power On Authentication
HP Secure Erase 18
Absolute Persistence Module 19
Pre-boot Authentication
HP Wireless Wakeup
Software
HP Native Miracast Support 15
HP Hotkey Support - CMIT
HP Recovery Manager
HP JumpStart
HP Support Assistant 21
HP Noise Cancellation Software
Buy Office (sold separately)
Intel® Unite (optional for AiOs)
Manageability Features
HP Driver Packs 22
HP System Software Manager (SSM)
HP BIOS Config Utility (BCU)
HP Client Catalog
HP Manageability Integration Kit Gen2 23
Ivanti Management Suite 24
HP Cloud Recovery39
Client Security Software

HP Client Security Suite Gen4 25 including:
HP Security Manager 26 (including Credential Manager, HP Password Manager, HP Spare Key)
HP Fingerprint Sensor 31
HP Device Access Manager
HP Power On Authentication
Windows Defender 27


Security Management
HP Secure Erase18
TPM 2.0 Embedded Security Chip shipped with Windows 10 (Common Criteria EAL4+ Certified) 32
SATA 0,1 port disablement (viaBIOS)
RAID configurations33
Serial, USB enable/disable (viaBIOS)
Power-on password (viaBIOS)
Setup password (viaBIOS)
Support for chassis padlocks and cable lock devices
Integrated hood sensor
HP Sure Click38
HP Sure Start Gen430
HP Sure Run35
HP Sure Recover36
15. Miracast is a wireless technology your PC can use to project your screen to TVs, projectors, and streaming
17. HP BIOSphere Gen4 requires Intel® or AMD® 8th Gen processors. Features may vary depending on the platform and configurations.
18. For the methods outlined in the National Institute of Standards and Technology Special Publication 800-88 "Clear" sanitation method.
19. Absolute agent is shipped turned off, and will be activated when customers activate a purchased subscription. Subscriptions can be
purchased for terms ranging multiple years. Service is limited, check with Absolute for availability outside the U.S. The Absolute Recovery
Guarantee is a limited warranty. Certain conditions apply. For full details visit:
http://www.absolute.com/company/legal/agreements/computrace-agreement. Data Delete is an optional service provided by
Absolute Software. If utilized, the Recovery Guarantee is null and void. In order to use the Data Delete service, customers must first sign a Pre-
Authorization Agreement and either obtain a PIN or purchase one or more RSA SecurID tokens from Absolute Software.
20. Storage Drivelock does not work with Self Encrypting or Optane based storage.
21. HP Support Assistant requires Windows and Internet access.
22. HP Driver Packs not preinstalled, however available for download at http://www.hp.com/go/clientmanagement.
23. HP Manageability Integration Kit can be downloaded from http://www.hp.com/go/clientmanagement.
24. Ivanti Management Suite subscription required.
25. HP Client Security Suite Gen4 requires Windows and Intel® or AMD® 8th generation processors.
26. HP Password Manager requires Internet Explorer or Chrome or FireFox. Some websites and applications may not be supported. User may
need to enable or allow the add-on / extension in the internet browser.
27. Windows Defender Opt in Windows 10 and internet connection required for updates.
30. HP Sure Start Gen4 is available on HP EliteBook products equipped with Intel® 8th generation processors
31. HP Fingerprint Sensor available on 800 G4 AiO touch models and optional on 800 G4 AiO non-touch models
32. Firmware TPM is version 2.0. Hardware TPM is v1.2, which is a subset of the TPM 2.0 specification version v0.89 as implemented by Intel
Platform Trust Technology (PTT).
33. RAID configuration is optional and does require a second hard drive. . RAID 1 is pre-installed and functionality will require a second hard
drive.
35. HP Sure Run is available on HP Elite products equipped with 8th generation Intel® or AMD® processors.
36. HP Sure Recover is available on HP Elite PCs with 8th generation Intel® or AMD® processors and requires an open, wired network connection.
Not available on platforms with multiple internal storage drives, Intel® Optane™. You must back up important files, data, photos, videos, etc.
before use to avoid loss of data.
38. HP Sure Click is available on select HP platforms and supports Microsoft® Internet Explorer, Google Chrome, and Chromium™. Supported
attachments include Microsoft Office (Word, Excel, PowerPoint) and PDF files in read only mode. Check
http://h20195.www2.hp.com/v2/GetDocument.aspx?docname=4AA7-0922ENW for all compatible platforms as they become
available.
39. HP Cloud Recovery is available for HP Elite and Pro desktops and laptops PCs with Intel® or AMD processors and requires an open, wired
network connection. Note: You must back up important files, data, photos, videos, etc. before use to avoid loss of data. Detail please refer to:
https://support.hp.com/us-en/document/c05115630


ENVIRONMENTAL & INDUSTRY
ENERGY STAR® certified models available
EPEAT® 2019 registered where applicable. EPEAT ® registration varies by country. See http://www.epeat.net for registration
status by country1. Search keyword generator on HP’s 3rd party option store for solar generator accessories at
http://www.hp.com/go/options.
Low halogen (chassis, all internal components and modules)2
TAA compliant models available
1. Based on US EPEAT® registration according to IEEE 1680.1-2018 EPEAT®. Status varies by country. Visit www.epeat.net for more information.
2. External power supplies, power cords, cables and peripherals are not Low Halogen. Service parts obtained after purchase may not be Low Halogen.
UNIT ENVIRONMENT AND OPERATING CONDITIONS

General Unit Operating Guidelines
• Keep the computer away from excessive moisture, direct moisture and the extremes of heat and cold, to ensure that unit
is operated within the specified operating range.
• Leave a 10.2 cm (4 in) clearance on all vented sides of the computer to permit the required airflow.
• Never restrict airflow into the computer by blocking any vents or air intakes.
• Do not stack computers on top of each other or place computers so near each other that they are subject to each other's
re-circulated or preheated air.
• Occasionally clean the air vents on the front, back, and any other vented side of the computer. Lint, dust and other
foreign matter can block the vents and limit the airflow.
• If the computer is to be operated within a separate enclosure, intake and exhaust ventilation must be provided on the
enclosure, and the same operating guidelines listed above will still apply.
Temperature Range Operating: 50° to 95° F (10° to 35° C)1

Non-operating: -22° to 140° F (-30° to 60° C)
Relative Humidity Operating: 10% to 90% (non-condensing at ambient)
Non-operating: 5% to 95% (non-condensing at ambient)
Maximum Altitude Operating: 5000m
(unpressurized) Non-operating: 50000ft (15240 m)
1. Operating temperature is de-rated 1.0 deg C per 300 m (1000 ft) to 3000 m (10,000 ft) above sea level, no direct sustained sunlight. Maximum rate of change is
10 deg C/Hr. The upper limit may be limited by the type and number of options installed.


HP EliteDesk 800 Desktop Mini G4 series
Eco-Label Certifications This product has received or is in the process of being certified to the following approvals and may
& declarations be labeled with one or more of these marks:
• IT ECO declaration
• US ENERGY STAR®
• EPEAT® 2019 registered where applicable. EPEAT® registration varies by country. See
http://www.epeat.net for registration status in your country*. Search keyword generator on HP’s
3rd party option store for solar generator accessories at http://www.hp.com/go/options.
*Based on US EPEAT® registration according to IEEE 1680.1-2018 EPEAT®. Status varies by country. Visit
http://www.epeat.net for more information.
System Configuration The configuration used for the Energy Consumption and Declared Noise Emissions data for the
Desktop model is based on a “Typically Configured Desktop.
Energy Consumption
(in accordance with US
115VAC, 60Hz 230VAC, 50Hz 100VAC, 50Hz
ENERGY STAR® test
method)
Normal Operation (Short
13.599 13.514 13.099
idle)
Normal Operation (Long
12.211 11.765 12.367
idle)
Sleep 1.318 1.312 1.322
Off 0.616 0.618 0.618
NOTE: Energy efficiency data listed is for an ENERGY STAR® compliant product if offered within the
model family. HP computers marked with the ENERGY STAR® Logo are compliant with the
applicable U.S. Environmental Protection Agency (EPA) ENERGY STAR® specifications for
computers. If a model family does not offer ENERGY STAR® compliant configurations, then energy
efficiency data listed is for a typically configured PC featuring a hard disk drive, a high efficiency
power supply, and a Microsoft Windows® operating system.
Heat Dissipation* 115VAC, 60Hz 230VAC, 50Hz 100VAC, 50Hz
Normal Operation
46.3726 46.0827 44.6676
(Short idle)
Normal Operation
41.6395 40.1187 42.1715
(Long idle)
Sleep 4.4944 4.4739 4.508
Off 2.1006 2.1074 2.1074
NOTE: Heat dissipation is calculated based on the measured watts, assuming the service level is
attained for one hour.
Declared Noise
Sound Power Sound Pressure
Emissions
(LWAd, bels) (LpAm, decibels)
(in accordance with
ISO 7779 and ISO 9296)
Typically Configured –
3.1 20
Idle
Fixed Disk – Random
4.4 33
writes
Longevity and Upgrading This product can be upgraded, possibly extending its useful life by several years. Upgradeable
features and/or components contained in the product may include:
Spare parts are available throughout the warranty period and or for up to “5” years after the end of
production.
Batteries This battery(s) in this product comply with EU Directive 2006/66/EC
Batteries used in the product do not contain:


Mercury greater the1ppm by weight
Cadmium greater than 20ppm by weight
Battery size: CR2032 (coin cell)

Battery type: Lithium
Additional Information • This product is in compliance with the Restrictions of Hazardous Substances (RoHS) directive -
2011/65/EC.
• This HP product is designed to comply with the Waste Electrical and Electronic Equipment (WEEE)
Directive – 2002/96/EC.
• This product is in compliance with California Proposition 65 (State of California; Safe Drinking
Water and Toxic Enforcement Act of 1986).
• Plastics parts weighing over 25 grams used in the product are marked per ISO11469 and ISO1043.
• This product contains 0% post-consumer recycled plastic (by wt.)
• This product is 95.1% recycle-able when properly disposed of at end of life.
Packaging Materials External: PAPER/Corrugated

Internal: PLASTIC/EPE (Expanded Polyethylene)
PLASTIC/Polyethylene low density
Material Usage This product does not contain any of the following substances in excess of regulatory limits (refer
to the HP General Specification for the Environment at
http://www.hp.com/hpinfo/globalcitizenship/environment/pdf/gse.pdf):
• Asbestos
• Certain Azo Colorants
• Certain Brominated Flame Retardants – may not be used as flame retardants in plastics
• Cadmium
• Chlorinated Hydrocarbons
• Chlorinated Paraffins
• Formaldehyde
• Halogenated Diphenyl Methanes
• Lead carbonates and sulfates
• Lead and Lead compounds
• Mercuric Oxide Batteries
• Nickel – finishes must not be used on the external surface designed to be frequently handled or
carried by the user.
• Ozone Depleting Substances
• Polybrominated Biphenyls (PBBs)
• Polybrominated Biphenyl Ethers (PBBEs)
• Polybrominated Biphenyl Oxides (PBBOs)
• Polychlorinated Biphenyl (PCB)
• Polychlorinated Terphenyls (PCT)
• Polyvinyl Chloride (PVC) – except for wires and cables, and certain retail packaging has been
voluntarily removed from most applications.
• Radioactive Substances
• Tributyl Tin (TBT), Triphenyl Tin (TPT), Tributyl Tin Oxide (TBTO)


Packaging Usage This product does not contain any of the following substances in excess of regulatory limits (refer
• Asbestos
• Cadmium
• Formaldehyde
End-of-life Management HP Inc. offers end-of-life HP product return and recycling programs in many geographic areas. To
and Recycling recycle your product, please go to: http://www.hp.com/go/reuse-recycle or contact your nearest
HP sales office. Products returned to HP will be recycled, recovered or disposed of in a responsible
manner.
The EU WEEE directive (2002/95/EC) requires manufacturers to provide treatment information for
each product type for use by treatment facilities. This information (product disassembly
instructions) is posted on the Hewlett Packard web site at: http://www.hp.com/go/recyclers. These
instructions may be used by recyclers and other WEEE treatment facilities as well as HP OEM
customers who integrate and re-sell HP equipment.
Global Citizenship Report
http://www.hp.com/hpinfo/globalcitizenship/gcreport/index.html
Eco-label certifications
http://www8.hp.com/us/en/hp-information/environment/ecolabels.html
ISO 14001 certificates:
http://www.hp.com/hpinfo/globalcitizenship/environment/pdf/PC_GBU_Product_Design_ISO_14K
_Certificate.pdf
and
http://www.hp.com/hpinfo/globalcitizenship/environment/pdf/cert.pdf


HP EliteDesk 800 Small Form Factor G4 series
Desktop model is based on a “Typically Configured Desktop.
Energy Consumption
ENERGY STAR® test
method)
Normal Operation
12.055 12.08 12.501
(Short idle)
Normal Operation
11.68 11.908 11.766
(Long idle)
Sleep 1.101 1.1644 1.1769
Off 0.6302 0.6258 0.9127
41.1076 41.1928 42.6284
idle)
39.8288 40.6063 40.1221
idle)
Sleep 3.7544 3.9706 4.0132
Off 2.149 2.134 2.1585
Declared Noise
Emissions
(in accordance with
3.3 25
Idle
3.3 25
writes
production.



2011/65/EC.

• Asbestos
• Cadmium
• Formaldehyde


Packaging Usage HP follows these guidelines to decrease the environmental impact of product packaging:
• Eliminate the use of heavy metals such as lead, chromium, mercury and cadmium in packaging
materials.
• Eliminate the use of ozone-depleting substances (ODS) in packaging materials.
• Design packaging materials for ease of disassembly.
• Maximize the use of post-consumer recycled content materials in packaging materials.
• Use readily recyclable packaging materials such as paper and corrugated materials.
• Reduce size and weight of packages to improve transportation fuel efficiency.
• Plastic packaging materials are marked according to ISO 11469 and DIN 6120 standards.
manner.
_Certificate.pdf
and


HP EliteDesk 800 Tower G4 series
EPEAT® 2019 registered where applicable. EPEAT® registration varies by country. See
Desktop model is based on a Typically Configured Desktop.
Energy Consumption
ENERGY STAR® test
method)
Normal Operation
17.22 W 15.78 W 17.40 W
(Short idle)
Normal Operation
16.51 W 15.22 W 16.42 W
(Long idle)
Sleep 1.38 W 1.36 W 1.39 W
Off 0.77 W 0.79 W 0.78 W
60 BTU/hr 54 BTU/hr 59 BTU/hr
idle)
idle)
Sleep 5 BTU/hr 5 BTU/hr 5 BTU/hr
Off 3 BTU/hr 3 BTU/hr 3 BTU/hr
Declared Noise
Emissions
(in accordance with
3.3 24
Idle
3.3 23
writes
production.




2011/65/EC.
Packaging Materials External: PAPER/Corrugated 145 g

Internal: PLASTIC/EPE (Expanded Polyethylene) 288 g
PLASTIC/Polyethylene low density 30 g
• Asbestos
• Cadmium
• Formaldehyde


materials.
manner.
_Certificate.pdf
and
HP EliteOne 800 G4 All-in-One Business PC

Energy Consumption
ENERGY STAR® test
method)
Normal Operation
21.984 22.242 21.696
(Short idle)
Normal Operation
11.351 11.604 11.222
(Long idle)
Sleep 4.108 4.119 3.988


Off 0.734 0.747 0.693
Normal Operation
74.9654 75.8452 73.9834
(Short idle)
Normal Operation
38.7069 39.5696 38.267
(Long idle)
Sleep 14.0083 14.0458 13.5991
Off 2.5029 2.5473 2.3631
Declared Noise
Emissions
(in accordance with
3.9 28
Idle
4.4 33
writes
production.


2011/65/EC.



• Asbestos
• Cadmium
• Formaldehyde
materials.
manner.
_Certificate.pdf
and


HP EliteOne 800 G4 Touch All-in-One Business PC
EPEAT® 2019 registered where applicable. EPEAT® registration varies by country. See
Energy Consumption
ENERGY STAR® test
method)
Normal Operation
21.98 W 22.24W 21.69 W
(Short idle)
Normal Operation
11.35 W 11.60 W 11.22W
(Long idle)
Sleep 4.10 W 4.11 W 3.98 W
Off 0.73 W 0.74 W 0.69 W
Normal Operation
(Short idle)
Normal Operation
(Long idle)
Declared Noise
Emissions
(in accordance with
3.2 20
Idle
3.5 28
writes
production.




2011/65/EC.

• Asbestos
• Cadmium
• Formaldehyde
materials.


manner.
_Certificate.pdf
and
HP EliteOne 800 G4 GPU Touch All-in-One Business PC

Notebook model is based on a Typically Configured Notebook.
Energy Consumption
ENERGY STAR® test
method)
Normal Operation
21.98 W 22.24W 21.69 W
(Short idle)
Normal Operation
11.35 W 11.60 W 11.22W
(Long idle)
Sleep 4.10 W 4.11 W 3.98 W
Off 0.73 W 0.74 W 0.69 W
Normal Operation
(Short idle)
Normal Operation
(Long idle)


Declared Noise
Emissions
(in accordance with
3.2 20
Idle
3.5 28
writes
production.


2011/65/EC.

• Asbestos
• Cadmium
• Formaldehyde


materials.
manner.
_Certificate.pdf
and


HP EliteOne 800 G4 Non-Touch All-in-One Business PC
http://www.epeat.net for registration status in your country*. Search keyword generator on HP’s 3rd
party option store for solar generator accessories at http://www.hp.com/go/options.
Energy Consumption
ENERGY STAR® test
method)
Normal Operation
21.98 W 22.24W 21.69 W
(Short idle)
Normal Operation
11.35 W 11.60 W 11.22W
(Long idle)
Sleep 4.10 W 4.11 W 3.98 W
Off 0.73 W 0.74 W 0.69 W
model family. HP computers marked with the ENERGY STAR® Logo are compliant with the applicable
U.S. Environmental Protection Agency (EPA) ENERGY STAR® specifications for computers. If a model
family does not offer ENERGY STAR® compliant configurations, then energy efficiency data listed is
for a typically configured PC featuring a hard disk drive, a high efficiency power supply, and a
Microsoft Windows® operating system.
Normal Operation
(Short idle)
Normal Operation
(Long idle)
Declared Noise
Emissions
(in accordance with
3.2 20
Idle
3.5 28
writes
production.




2011/65/EC.

Material Usage This product does not contain any of the following substances in excess of regulatory limits (refer to
the HP General Specification for the Environment at
• Asbestos
• Cadmium
• Formaldehyde
materials.


and Recycling recycle your product, please go to: http://www.hp.com/go/reuse-recycle or contact your nearest HP
sales office. Products returned to HP will be recycled, recovered or disposed of in a responsible
manner.
http://www.hp.com/hpinfo/globalcitizenship/environment/pdf/PC_GBU_Product_Design_ISO_14K_
Certificate.pdf
and
HP EliteOne 800 G4 GPU Non-Touch All-in-One Business PC

Eco-Label Certifications This product has received or is in the process of being certified to the following approvals and may be
& declarations labeled with one or more of these marks:
http://www.epeat.net for registration status in your country*. Search keyword generator on HP’s 3rd
party option store for solar generator accessories at http://www.hp.com/go/options.
Energy Consumption
ENERGY STAR® test
method)
Normal Operation
21.98 W 22.24W 21.69 W
(Short idle)
Normal Operation
11.35 W 11.60 W 11.22W
(Long idle)
Sleep 4.10 W 4.11 W 3.98 W
Off 0.73 W 0.74 W 0.69 W
model family. HP computers marked with the ENERGY STAR® Logo are compliant with the applicable
U.S. Environmental Protection Agency (EPA) ENERGY STAR® specifications for computers. If a model
Normal Operation
(Short idle)
Normal Operation
(Long idle)


Declared Noise
Emissions
(in accordance with
3.2 20
Idle
3.5 28
writes
production.


2011/65/EC.
• This product is in compliance with California Proposition 65 (State of California; Safe Drinking Water
and Toxic Enforcement Act of 1986).

• Asbestos
• Cadmium
• Formaldehyde


materials.
End-of-life HP Inc. offers end-of-life HP product return and recycling programs in many geographic areas. To
Management and recycle your product, please go to: http://www.hp.com/go/reuse-recycle or contact your nearest HP
Recycling sales office. Products returned to HP will be recycled, recovered or disposed of in a responsible
manner.
each product type for use by treatment facilities. This information (product disassembly instructions)
is posted on the Hewlett Packard web site at: http://www.hp.com/go/recyclers. These instructions
may be used by recyclers and other WEEE treatment facilities as well as HP OEM customers who
integrate and re-sell HP equipment.
http://www.hp.com/hpinfo/globalcitizenship/environment/pdf/PC_GBU_Product_Design_ISO_14K_C
ertificate.pdf
and
HP EliteDesk 800 G4 65W Desktop Mini Business PC

http://www.epeat.net for registration status in your country*. Search keyword generator on
HP’s 3rd party option store for solar generator accessories at
Notebook model is based on a “Typically Configured Notebook.


Energy Consumption
ENERGY STAR® test
method)
Normal Operation
3.59 W 3.64 W 3.46 W
(Short idle)
Normal Operation
3.11 W 3.14 W 3.04 W
(Long idle)
Sleep 0.63 W 0.67 W 0.63 W
Off 0.60 W 0.64 W 0.59 W
Note:
Energy efficiency data listed is for an ENERGY STAR® compliant product if offered within the model
family . HP computers marked with the ENERGY STAR® Logo are compliant with the applicable U.S.
Environmental Protection Agency (EPA) ENERGY STAR® specifications for computers. If a model

Normal Operation
(Short idle)
Normal Operation
(Long idle)
*NOTE: Heat dissipation is calculated based on the measured watts, assuming the service level is
Declared Noise
Emissions
(in accordance with
3.1 19
Idle
3.1 19
writes
• 3 USB ports
• 1 PC card slot (type I/II)
• 1 ExpressCard/54 slot
• 1 IEEE 1394 Port
• 2 SODIMM memory slots
• Optional expansion base docking station
• 1 multi-bay II storage port
• Interchangeable HDD
production.




Additional Information • This product is in compliance with the Restrictions of Hazardous Substances (RoHS) directive
- 2011/65/EC.
• This HP product is designed to comply with the Waste Electrical and Electronic Equipment
(WEEE) Directive – 2002/96/EC.
• This product is in compliance with California Proposition 65 (State of California; Safe
Drinking Water and Toxic Enforcement Act of 1986).
• Plastics parts weighing over 25 grams used in the product are marked per ISO11469 and
ISO1043.
• This product contains 24.1% post-consumer recycled plastic (by wt.)

Internal: PLASTIC/Polyethylene Expanded - EPE 32 g
PLASTIC/Polyethylene High density - HDPE 5g
The Plastic packaging material is made from 0% recycled content.
The paper packaging materials contains at least 25% recycled content.
• Asbestos
• Cadmium
• Formaldehyde
• Nickel – finishes must not be used on the external surface designed to be frequently
handled or carried by the user.


• Eliminate the use of heavy metals such as lead, chromium, mercury and cadmium in
packaging materials.
End-of-life Management Hewlett-Packard offers end-of-life HP product return and recycling programs in many geographic
and Recycling areas. To recycle your product, please go to: http://www.hp.com/go/reuse-recycle or contact your
nearest HP sales office. Products returned to HP will be recycled, recovered or disposed of in a
responsible manner.
HP, Inc. Corporate For more information about HP’s commitment to the environment:
Environmental
Information Global Citizenship Report
http://www.hp.com/hpinfo/globalcitizenship/environment/pdf/PC_GBU_Product_Design_IS
O_14K_Certificate.pdf
and


Energy Consumption
ENERGY STAR® test
method)
Normal Operation
3.59 W 3.64 W 3.46 W
(Short idle)
Normal Operation
3.11 W 3.14 W 3.04 W
(Long idle)
Sleep 0.63 W 0.67 W 0.63 W
Off 0.60 W 0.64 W 0.59 W
Note:

Normal Operation
(Short idle)
Normal Operation
(Long idle)
Declared Noise
Emissions
(in accordance with
2.9 19
Idle
2.9 19
writes
• 3 USB ports


production.


- 2011/65/EC.
ISO1043.

• Asbestos
• Cadmium
• Formaldehyde


responsible manner.
Environmental
and


Energy Consumption
ENERGY STAR® test
method)
Normal Operation
3.59 W 3.64 W 3.46 W
(Short idle)
Normal Operation
3.11 W 3.14 W 3.04 W
(Long idle)
Sleep 0.63 W 0.67 W 0.63 W
Off 0.60 W 0.64 W 0.59 W
Note:

Normal Operation
(Short idle)
Normal Operation
(Long idle)
Declared Noise Sound Power Sound Pressure

Emissions (LWAd, bels) (LpAm, decibels)
(in accordance with
Typically Configured – 2.8 19
Idle
Fixed Disk – Random 2.8 19
writes
• 3 USB ports


production.


- 2011/65/EC.
ISO1043.

• Asbestos
• Cadmium
• Formaldehyde


responsible manner.
Environmental
and

SERVICE AND SUPPORT

On-site Warranty15: Three-year (3-3-3) limited warranty delivers three years of on-site, next business day16 service for parts
and labor and includes free support 24 x 717. Three-year onsite and labor are not available in all countries. Service offers
terms up to 5 years by choosing an optional HP Care Pack. To choose the right level of service for your HP product, visit HP
Care Pack Central: http://www.hp.com/go/cpc.18
15. Terms and conditions may vary by country. Certain restrictions and exclusions apply. Other warranty variations may be offered in your
region.
16. On-site service may be provided pursuant to a service contract between HP and an authorized HP third-party provider, and is not
available in certain countries. Global service response times are based on commercially reasonable best effort and may vary by country.
17. Technical telephone support applies only to HP-configured and third-party HP qualified hardware and software. Toll-free calling and 24
x 7 support may not be available in some countries.
18. Service levels and response times for HP Care Packs may vary depending on your geographic location. Service starts on date of
hardware purchase. Restrictions and limitations apply. For details, visit www.hp.com/go/cpc. HP services are governed by the applicable HP
terms and conditions of service provided or indicated to Customer at the time of purchase. Customer may have additional statutory rights
according to applicable local laws, and such rights are not in any way affected by the HP terms and conditions of service or the HP Limited
Warranty provided with your HP Product.

Care Pack Central: http://www.hp.com/go/cpc. 18
region.


region.

region.
CERTIFICATION AND COMPLIANCE

Energy Efficiency Compliance
ENERGY STAR® certified; EPEAT® 2019 registered where applicable. EPEAT ® registration varies by country. See
http://www.epeat.net for registration status by country19
19. *Based on US EPEAT® registration according to IEEE 1680.1-2018 EPEAT®. Status varies by country. Visit www.epeat.net for more
information.


PROCESSORS
Intel® 8th Generation Core™ Processors
All HP EliteDesk 800 G4 Business PC models featuring this technology include processors that are part of the Intel® Stable
Image Platform Program (SIPP) designed to ensure the stability promise inherent in the value proposition of the HP EliteDesk
and EliteOne 800 G4 Business PC.
Intel® Advanced Management Technology (AMT) v12 – An advanced set of remote management features and functionality
which provides network administrators the latest and most effective tools to remotely discover, heal, and protect networked
client systems regardless of the system's health or power state. AMT 12 includes the following advanced management
functions:
• Support for configuration of Intel AMT 12.0 new capabilities

• No reset after provisioning
• Support changes to BIOS table 130
• Support for Microsoft Windows Server 2012 R2
• Support for New Microsoft SQL Server Versions including Standard and Enterprise editions
• Support for Intel SSD Prop 2500 Series
• Support for Intel Enterprise Digital Fence
• The Platform Discovery Utility can now discover these additional Intel products:
• Intel SSD Pro 2500 Series; Enterprise Digital Fence
• Intel Identity Protection Technology with One Time Password; Public Key Infrastructure; Multi Factor Authentication
• Intel Identity Protection Technology with Intel WiGig
• New Profile Editor and Profile Editor Plugin Interface
• New Required Permissions for Solutions Framework

Technical Specification - Display
DISPLAY PANEL SPECIFICATIONS

23.8" diagonal IPS widescreen WLED backlit anti-glare LCD (1920 x 1080) non-touch or optional touch
Projected Capacitive Touch supports up to 10 touch-points
Type IPS WLED Backlit LCD
Active area (mm) 527.04 x 296.46
Native Resolution (HxV) 1920 x 1080
Refresh Rate 60 Hz @ 1920 x 1080
Aspect ratio 16:09
Pixel pitch (HxV)(mm) 0.2745 x 0.2745
Contrast ratio (typical) 1000:01:00
Brightness (typical) 250nits
Viewing angle (typical) (HxV) 178 ° x 178 °
Backlight lamp life (to half brightness) 30,000 hours minimum
Color support Up to 16.7 million colors with the use of FRC technology
Color gamut (typical) NTSC 72%
Anti-glare Yes*
Response Time 14ms (Typical)
Default color temperature Warm (6500K)
1. All performance specifications represent the typical specifications provided by HP's component manufacturers; actual performance may vary either higher or
lower.
2. For All in One only
Intel® HD Graphics (integrated)
Adjustable Height Stand: Height - Vertical/Landscape Adjustment 101mm (±2 mm)

Portrait Adjustment 54mm (±2 mm)
Tilt Angle -5° to +20° (±3°) in landscape and portrait
Rotation (Swivel) 90° (±1°)
Pivot Clockwise 90°
Recline Stand: Height - Vertical Adjustment 178 mm (±2 mm)

Tilt Angle -5° to +65° (+/-3°)
Rotation (swivel) 360° swivel

Technical Specification - Storage
GRAPHICS
VGA Controller Integrated
Multimode capable; supports HDCP, Display Port Audio (2 streams), HBR2 link rates and Multi-
DisplayPort™ 1.2 Stream Technology for a maximum of 3 displays connected to any output controlled by Intel®
Graphics
Supports HDMI 2.0a features
HDMI (optional) Supports HDCP 2.2
Supports audio over HDMI
VGA (optional) VGA output
USB-C™ DP Alt Mode DisplayPort over the optional USB-C™ module
(optional)
The actual amount of maximum graphics memory can be >4GB. System memory is allocated
Memory for graphics as needed using Intel's Dynamic Video Memory Technology (DVMT), to provide an
optimal balance between graphics and system memory use.
Maximum Color Depth up to 10 bits/color
HEVC 10b Enc/Dec HW
VP9 10b Dec HW
Graphics/Video API Support HDR
Rec. 2020
DX12
Max. Resolution (VGA) 2048 x 1536@60Hz
Max. Resolution (HDMI) 4096 x 2160@60Hz
Max. Resolution (DP) 4096 x 2160@60Hz
AMD® Radeon™ RX 560X

Architecture Discrete GPU
AMD® GPU drives the integrated panel and all of the graphics output ports
DisplayPort Multimode capable; supports HDCP, HDR, Display Port Audio (6 streams max), DisplayPort HBR3
link rates and Multi-Stream Technology for a maximum of 5 displays (including the integrated
panel and all attached displays)
HDMI Supports HDMI 2.0b features
Supports HDCP 2.2, HDR
Memory 4GByte, 128bit wide GDDR5
Graphics/Video API Support DirectX 12
OpenCL 2.0
OpenGL 4.5
AMD® Unified Video Decoder (UVD)
Rear I/O connector 1 DP


Intel® UHD Graphics (integrated)
Graphics
Supports BT2020 and HDR playback (7th Gen processors only)
VGA (optional) VGA ouput
(optional)
The actual amount of maximum graphics memory can be >4GB. System memory is allocated for
Memory graphics as needed using Intel's Dynamic Video Memory Technology (DVMT), to provide an
HEVC 10b Enc/Dec HW
VP9 10b Dec HW
Rec. 2020
DX12
640x480 60 Hz640x480 67Hz
640x480 72Hz
640x480 75Hz
720x400 70Hz
800x600 60Hz
800x600 75Hz
1024x768 60Hz
34" UHD Supported 1024x768 75Hz
Resolutions and Refresh 1280x960 60Hz
Rates. Other resolutions 1280x720 60Hz
may also work. 1280x1024 60Hz
1280x1024 75Hz
1440x900 60Hz
1440x900 75Hz
1680x1050 60Hz
1920x1080 60Hz
3440x1440 60Hz (Native Resolution)
3440x1440 30Hz


NVIDIA® GeForce® GT730 2GB DP DVI PCIe x8 GFX
Engine Clock 902 MHz
Memory Clock 1250 MHz
Memory Size(width) 2 GB (64-bit)
Memory Type 256Mx32 GDDR5
Max. Resolution(DVI) 2560 x 1600 x 30 bpp @ 60Hz (Dual Link)
Max. Resolution(DP) 4096 x 2160 x 24 bpp @ 60 Hz (DP1.2)
Multi Display Support Up to 2 displays
HDCP Compliance Yes
Rear I/O connectors(bracket) DL DVI-I + DP
Cooling(active/passive) Active fan-sink (Active cooling with dynamic speed)
Total power consumption(W) 35 W
PCB form-factor with bracket 2-pin fan connector for fan sink power/speed control
NVIDIA® GeForce® GTX 1060 3 GB Graphics Card

Memory Size(width) 3 GB(192-bit)
Memory Type 128M x 32 GDDR5
Max. Resolution(DVI) 2560x1600@60Hz
Max. Resolution(HDMI) 4096x2160@60Hz
Max. Resolution(DP) 5120x3200@60Hz
Multi Display Support 4 displays
HDCP Compliance Yes
Rear I/O connectors(bracket) DVI-D+HDMI+DPx3
Total power consumption(W) <120W
PCB form-factor with bracket ATX (Full height) PCB with ATX dual slot bracket
AMD® Radeon™ RX550 4 GB FH PCIe x16

Engine Clock 1183MHz
Memory Clock 7 Gbps
Memory Type GDDR5
Max. Resolution(HDMI) 4096x2160 @ 60Hz
Max. Resolution(DP) 5120x2880 @ 60Hz
HDCP Compliance Yes
Rear I/O connectors(bracket) HDMI, DPx2
PCB form-factor with bracket ATX (Full height) PCB with ATX single slot bracket


AMD® Radeon™ RX580 4 GB FH PCIe x16
Memory Clock 8gbs
HDCP Compliance Yes
Rear I/O connectors(bracket) DP*3 + HDMI
AMD® Radeon™ RX580 8GB GDDR5 Graphics Card

HDCP Compliance Yes
Rear I/O connectors(bracket) HDMI + DPx3
AMD® Radeon™ 520 1GB Graphics Card

Memory Size(width) 1GB(32-bit)
Max. Resolution(VGA) 2048x1536
HDCP Compliance Yes
Rear I/O connectors(bracket) VGA+DP
PCB form-factor with bracket LP PCB with FH/LP bracket


NVIDIA® GeForce® RTX 2080 8GB GDDR6
Memory Size(width) 8GB (256-bit)
Max. Resolution(Virtual Link) 3840 x 2160@60Hz
Max. Resolution(HDMI) 4096 x 2160@60Hz
Max. Resolution(DP) 7680 x 4320@60Hz
HDCP Compliance Yes
Rear I/O connectors(bracket) DPx3 + HDMI + Virtual Link
NVIDIA® GeForce® RTX 2060 6 GB Graphics Card

Max. Resolution(DVI) 2560x1600@60Hz
HDCP Compliance Yes
Rear I/O connectors(bracket) DVI+HDMI+DP


NVIDIA® Quadro P620 2GB Graphics Card
HDCP Compliance Yes
Rear I/O connectors(bracket) mDPx4
PCB form-factor with bracket LP PCB with LP bracket
NVIDIA® Quadro P400 2GB Graphics Card

HDCP Compliance Yes
Rear I/O connectors(bracket) mDPx3
PCB form-factor with bracket LP PCB with LP bracket
AMD® Radeon™ R7 430 2GB VGA+DP Graphics Card

Max. Resolution(HDMI) 2048x1536
HDCP Compliance Yes


AMD® Radeon™ R7 430 2GB GDDR5 2DP Graphics Card
HDCP Compliance yes
Rear I/O connectors(bracket) DPx2
AMD® Radeon™ R7 430 2GB 2DP Graphics Card

HDCP Compliance Yes
Rear I/O connectors(bracket) 2DP


Graphics
VGA (optional) VGA Output
(optional)
HEVC 10b Enc/Dec HW
VP9 10b Dec HW
Rec. 2020
DX12
AMD® Radeon™ R7 430 2 GB VGA+DP Graphics Card

HDCP Compliance Yes
AMD® Radeon™ R7 430 2GB GDDR5 DP+VGA Graphics Card

HDCP Compliance yes
Rear I/O connectors(bracket) DP+VGA


AMD® Radeon™ R7 430 2GB GDDR5 2DP Graphics Card

HDCP Compliance yes
Rear I/O connectors(bracket) DPx2
AMD® Radeon™ R7 430 2 GB 2DP Graphics Card

Memory Size(width) 2GB(128-bit)
HDCP Compliance Yes
Rear I/O connectors(bracket) 2DP
NVIDIA® GeForce® GT730 2GB DP DVI PCIe x8 GFX

Memory Type 256Mx32 GDDR5
Max. Resolution(DVI) 2560 x 1600 x 30 bpp @ 60Hz (Dual Link)
Max. Resolution(DP) 4096 x 2160 x 24 bpp @ 60 Hz (DP1.2)
Multi Display Support Up to 2 displays
HDCP Compliance Yes
Rear I/O connectors(bracket) DL DVI-I + DP
Total power consumption(W) 35 W
PCB form-factor with bracket 2-pin fan connector for fan sink power/speed control


Intel® UHD Graphics (integrated)
DisplayPort™ 1.2 Stream Technology for a maximum of 3 displays (including the integrated panel and all
attached displays)
HDMI Supports HDCP 2.2
HEVC 10b Enc/Dec HW
VP9 10b Dec HW
Rec. 2020
DX12
AMD® Radeon™ RX 560X

Architecture Discrete GPU
AMD® GPU drives the integrated panel and all of the graphics output ports
DisplayPort Multimode capable; supports HDCP, HDR, Display Port Audio (6 streams max), DisplayPort HBR3
link rates and Multi-Stream Technology for a maximum of 5 displays (including the integrated
panel and all attached displays)
HDMI Supports HDMI 2.0b features
Supports HDCP 2.2, HDR
Memory 4GByte, 128bit wide GDDR5
Graphics/Video API Support DirectX 12
OpenCL 2.0
OpenGL 4.5
AMD® Unified Video Decoder (UVD)
Rear I/O connector 1 DP

STORAGE
500 GB 7200RPM 3.5in SATA HDD
Capacity 500 GB
Rotational Speed 7,200 rpm
Interface SATA 6.0 Gb/s
Buffer Size 16 MB
Logical Blocks 976,773,168
Seek Time 11 ms (Average)
Height 1 in/2.54 cm
Media diameter: 3.5 in/8.89 cm
Width Physical size: 4 in/10.2 cm
Operating Temperature 41° to 131° F (5° to 55° C)
NOTE: For hard drives and solid state drives, GB = 1 billion bytes. TB = 1 trillion bytes. Actual formatted capacity is less. Up to 36 GB (for Windows
10) of system disk is reserved for the system recovery software.
1 TB 7200RPM 3.5in SATA HDD

Capacity 1 TB
Interface SATA 6 Gb/s
Buffer Size 32 MB
Logical Blocks 1,953,525,168
Height 1 in/2.54 cm
Media diameter: 3.5 in/8.89 cm
Width (nominal) Physical size: 4 in/10.2 cm

Capacity 2 TB
Buffer Size 64 MB
Height 1.028 in/26.11 mm
Width (nominal) 4.0 in/101.6 mm

500 GB 7200RPM 2.5in SATA HDD

Capacity 500 GB
Buffer Size 16 MB
Height 0.267 in/6.8 mm (nominal)
Width (nominal) 2.75 in/70 mm (nominal)

Capacity 1 TB
Buffer Size 32 MB

Capacity 2 TB
Buffer Size 128 MB


500 GB 7200RPM 2.5in Self Encrypted OPAL2 SATA HDD
Capacity 500 GB
Architecture Self-Encrypting (SED) Solid State Drive with SATA interface
Buffer Size 32 MB
Width 2.75 in/70 mm (nominal)
500 GB 7200RPM 2.5in Self Encrypted Federal Information Processing Standard SATA HDD
Capacity 500 GB
Architecture Self-Encrypting (SED) Solid State Drive with SATA interface
Buffer Size 32 MB
500 GB 5400RPM 2.5in SATA SSHD

Capacity 500 GB
Drive Type Solid State Hybrid Drive (SSHD) technology with NAND Flash
Buffer Size 64 MB
NAND Flash 8 GB


1 TB 5400RPM 2.5in SATA SSHD
Capacity 1 TB
Buffer Size 64 MB
NAND Flash 8 GB
2 TB 5400RPM 2.5in SATA SSHD

Capacity 2 TB
Buffer Size 128 MB
NAND Flash 8 GB


128 GB 2.5in SATA Three Layer Cell SSD
Drive Weight <50g
Capacity 128 GB
Height 7mm
Length 100.45mm
Width 69.85mm
Interface SATA 3.0 (6Gb/s)
Performance Up to Random Read/Write = 70K/40K IOPS
Maximum Sequential Read Up to 530MB/s
Maximum Sequential Write Up to 380MB/s
Operating Temperature 0° to 70°C (32° to 158°F) [ambient temp]
Features DIPM; TRIM

Drive Weight <62g
Capacity 256 GB
Height 7mm
Length 100.45mm
Width 69.85mm
Features DIPM; TRIM


Drive Weight <50g
Capacity 512 GB
Height 7mm
Length 100.45mm
Width 69.85mm
Features DIPM; TRIM
256 GB 2.5in SATA Self Encrypted OPAL2 Three Layer Cell SSD
Drive Weight <50g
Capacity 256 GB
Height 7mm
Length 100.45mm
Width 69.85mm
Features DIPM; TRIM; TCG-OPAL2.0 security


512 GB 2.5in SATA Self Encrypted OPAL2 Three Layer Cell SSD
Drive Weight <50g
Capacity 512 GB
Height 7mm
Length 100.45mm
Width 69.85mm
Features DIPM; TRIM; TCG-OPAL2.0 security
256 GB 2.5in SATA Self Encrypted Federal Information Processing Standard SSD
Drive Weight <40g
Capacity 256 GB
Height 7mm
Length 100.45mm
Width 69.85mm
Features DIPM; TRIM; FIPS 140-2 security


512 GB 2.5in SATA Self Encrypted Federal Information Processing Standard SSD
Drive Weight <45g
Capacity 512 GB
Height 7mm
Length 100.45mm
Width 69.85mm
Features DIPM; TRIM; FIPS 140-2 security
128 GB M.2 2280 PCIe NVMe SSD

Drive Weight < 10g
Capacity 128GB
Height 2.38mm
Length 80mm
Width 22mm
Interface PCIE Gen3
Features APST; ASPM L1.2; NVME spec 1.2


Drive Weight < 10g
Capacity 256 GB
Height 2.38mm
Length 80mm
Width 22mm
Interface PCIE Gen3

Drive Weight < 10g
Capacity 512 GB
Height 2.38mm
Length 80mm
Width 22mm
Interface PCIE Gen3


128 GB M.2 2280 PCIe NVMe Three Layer Cell SSD
Drive Weight < 10g
Capacity 128 GB
Height 2.38mm
Length 80mm
Width 22mm
Interface PCIE Gen3x4

Drive Weight < 10g
Capacity 256GB
Height 2.38mm
Length 80mm
Width 22mm


Drive Weight < 10g
Capacity 512 GB
Height 2.38mm
Length 80mm
Width 22mm
1 TB M.2 2280 PCIe NVMe Three Layer Cell SSD

Drive Weight < 10g
Capacity 1 TB
Height 2.38mm
Length 80mm
Width 22mm


256 GB M.2 2280 PCIe NVMe Self Encrypted OPAL2 Three Layer Cell SSD
Drive Weight < 10g
Capacity 256 GB
Height 2.38mm
Length 80mm
Width 22mm
Features APST; ASPM L1.2; NVME spec 1.2; TCG-OPAL2 security
512 GB M.2 2280 PCIe NVMe Self Encrypted OPAL2 Three Layer Cell SSD
Drive Weight < 10g
Capacity 512 GB
Height 2.38mm
Length 80mm
Width 22mm
Features APST; ASPM L1.2; NVME spec 1.2; TCG-OPAL2 security


HP 9.5mm Slim DVD-ROM Drive
Height 9.5 mm height
Orientation Either horizontal or vertical
Interface type SATA/ATAPI
Dimensions (W x H x D) 5.04 x 0.37 x 5.0 in (128 x 9.5 x 127 mm) without bezel
Weight (max) Up to 0.31 lb (140g) without bezel
Read Speeds DVD+R/-R/+RW/
-RW/+R DL /-R DL Up to 8X
DVD-ROM Up to 8X
CD-ROM, CD-R Up to 24X
CD-RW Up to 24X
Access time Random: DVD-ROM: 170 ms (typical), CD-ROM: 170 ms (typical)
(typical reads, including Full stroke: DVD-ROM: 320 ms (typical), CD-ROM: 320 ms (typical)
settling)
Power Source Slimline SATA DC power receptacle
DC Power Requirement 5 VDC ± 5%-100 mV ripple p-p
DC Current 5 VDC (< 1000 mA typical, 1600 mA maximum)
Environmental conditions Temperature 41° to 122° F (5° to 50° C)
(operating - non-condensing) Relative Humidity 10% to 80%
Maximum Wet Bulb Temperature 84° F (29° C)
HP 9.5mm Slim DVD Writer Drive

Disc recording capacity Up to 8.5 GB DL or 4.7 GB standard
Weight (max) 0.31 lb (140 g)
Read Speeds DVD-R DL - Up to 6X
DVD+R - Up to 8X
DVD+RW - Up to 8X
DVD+R DL - Up to 6X
DVD-R - Up to 8X
DVD-RW - Up to 6X
CD-R - Up to 24X
CD-RW - Up to 10X
DVD-RW, DVD+RW - Up to 8X
DVD-R DL, DVD+R DL - Up to 8X
DVD+R, DVD-R - Up to 8X
DVD-ROM DL, DVD-ROM - Up to 8X
CD-ROM, CD-R - Up to 24X
CD-RW - Up to 24X
Write Speeds DVD-R DL Up to 6X
DVD+R Up to 8X
DVD+RW Up to 8X
DVD+R DL Up to 6X
DVD-R Up to 8X
DVD-RW Up to 6X
CD-R Up to 24X
CD-RW Up to 24X


Access time Random DVD-ROM: 170 ms (typical), CD-ROM: 170 ms (typical)
(typical reads, including Full Stroke DVD-ROM: 320 ms (typical), CD-ROM: 320 ms (typical)
settling) Stop Time 6 seconds (typical)
DC Current 5 VDC (< 1000 mA typical, 1600 mA maximum)
HP 9.5mm Slim Blu-Ray Writer Drive

Disc recording capacity Up to 128 GB QL, 100 GB TL, 50 GB DL or 25 GB standard SL
Weight (max) 0.29 lb (132 g)
BD-R Up to 4X
BD-RE Up to 2X
BD-R Up to 6X
BD-RE Up to 2X
DVD-R Up to 8X
DVD-RW Up to 6X
DVD+R Up to 8X
DVD+RW Up to 8X
DVD-RAM Up to 5X
CD-R Up to 24X
Write Speeds CD-RW Up to 10X
Read Speeds BD-R Up to 6X
BD-RE Up to 4X
BD-ROM Up to 6X
BD-R Up to 6X
BD-RE Up to 6X
DVD-ROM Up to 8X
DVD-R Up to 8X
DVD-RW Up to 8X
DVD+R Up to 8X
DVD+RW Up to 8X
BDMV (AACS Compliant
Disc)
Up to 6x/2x (Read/Play)
DVD-RAM Up to 5x
DVD-Video (CSS
Compliant Disc)
Up to 8x/4x (Read/Play)
CD-R/RW/ROM Up to 24x
CD-DA (DAE) Up to 24X/10X (Read/Play)
Access time Random BD-ROM: 205 ms (typical), DVD-ROM: 185 ms (typical),
(typical reads, including CD-ROM: 165 ms (typical)
settling) Full Stroke BD-ROM: 350 ms (typical), DVD-ROM: 345 ms (typical),
CD-ROM: 340 ms (typical)


DC Current 5 VDC -1200 mA typical, 2000 mA maximum

Technical Specification - Networking
NETWORKING AND COMMUNICATIONS

Intel® i219LM 10/100/1000 Integrated NIC
Connector
RJ-45
System Interface
PCI (Intel proprietary) + SMBus
Data rates supported
10 Mbit/s operation (10BASE-T; IEEE 802.3i; IEEE 802.3 clauses 13-14)
100 Mbit/s operation (100BASE-TX; IEEE 802.3u; IEEE 802.3 clauses 21-30)
1000 Mbit/s operation (1000BASE-T; IEEE 802.3ab; IEEE 8023 clauses 40)
Auto-Negotiation (Automatic Speed Selection)
Full Duplex Operation at all Speeds, Half Duplex operation at 10 and 100 Mbit/s
IEEE Compliance
IEEE 802.1p QoS (Quality of Service) Support
IEEE 802.1q VLAN support
IEEE 802.3x Flow Control (IEEE 802.3 clauses 31-32; configurable)
IEEE 802.3az EEE (Energy Efficient Ethernet)
Performance
TCP/IP/UDP Checksum Offload (configurable)
Protocol Offload (ARP & NS)
Large send offload and Giant send offload
Receiving Side Scaling
Jumbo Frame 9K
Power consumption
Cable Disconnetion: 25mW
100Mbps Full Run: 450mW
1000bp Full Run: 1000mW
WoL Enable(S3/S4/S5): 50mW
WoL Disable(S3/S4/S5): 25mW
Power
ACPI compliant – multiple power modes
Management
Situation-sensitive features reduce power consumption
Advanced link down power saving for reducing link down power consumption
Management Interface
Auto MDI/MDIX Crossover cable detection
IT Manageability
Wake-on-LAN from standby and hibernation (Magic Packet and Microsoft Wake-Up Frame);
Wake-on-LAN from off (Magic Packet only)
PXE 2.1 Remote Boot
Statistics Gathering (SNMP MIB II, Ethernet-like MIB, Ethernet MIB (802.3x, clause 30))
Comprehensive diagnostic and configuration software suite
Virtual Cable Doctor for Ethernet cable status


Security & Manageability
Intel® vPro™ support with appropriate Intel® chipset components
Intel® i210 10/100/1000 Add-on NIC

Connector
RJ-45
System Interface
PCI (Intel proprietary) + SMBus
Data rates supported
10 Mbit/s operation (10BASE-T; IEEE 802.3i; IEEE 802.3 clauses 13-14)
100 Mbit/s operation (100BASE-TX; IEEE 802.3u; IEEE 802.3 clauses 21-30)
1000 Mbit/s operation (1000BASE-T; IEEE 802.3ab; IEEE 8023 clauses 40)
Auto-Negotiation (Automatic Speed Selection)
Full Duplex Operation at all Speeds, Half Duplex operation at 10 and 100 Mbit/s
IEEE Compliance
IEEE 802.1p QoS (Quality of Service) Support
IEEE 802.1q VLAN support
IEEE 802.3x Flow Control (IEEE 802.3 clauses 31-32; configurable)
IEEE 802.3az EEE (Energy Efficient Ethernet)
Performance
TCP/IP/UDP Checksum Offload (configurable)
Protocol Offload (ARP & NS)
Large send offload and Giant send offload
Receiving Side Scaling
Jumbo Frame 9K
Power consumption
Cable Disconnetion: 25mW
100Mbps Full Run: 450mW
1000bp Full Run: 1000mW
WoL Enable(S3/S4/S5): 50mW
WoL Disable(S3/S4/S5): 25mW
Power
ACPI compliant – multiple power modes
Management
Situation-sensitive features reduce power consumption
Advanced link down power saving for reducing link down power consumption
Management Interface
Auto MDI/MDIX Crossover cable detection
IT Manageability
Wake-on-LAN from standby and hibernation (Magic Packet and Microsoft Wake-Up Frame);
Wake-on-LAN from off (Magic Packet only)
PXE 2.1 Remote Boot
Statistics Gathering (SNMP MIB II, Ethernet-like MIB, Ethernet MIB (802.3x, clause 30))
Comprehensive diagnostic and configuration software suite
Virtual Cable Doctor for Ethernet cable status


Security & Manageability
Intel® vPro™ support with appropriate Intel® chipset components
Intel® 9560 802.11AC 2x2 with Bluetooth® M.2 Combo Card vPro™
Wireless LAN Standards IEEE 802.11a
IEEE 802.11b
IEEE 802.11g
IEEE 802.11n
IEEE 802.11ac
Interoperability Wi-Fi certified
Frequency Band 802.11b/g/n
• 2.402 – 2.482 GHz
802.11a/n
• 4.9 – 4.95 GHz (Japan)
• 5.15 – 5.25 GHz
• 5.25 – 5.35 GHz
• 5.47 – 5.725 GHz
• 5.825 – 5.850 GHz
Data Rates • 802.11b: 1, 2, 5.5, 11 Mbps
• 802.11g: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
• 802.11a: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
• 802.11n: MCS 0 ~ MCS 15, (20MHz, and 40MHz)
• 802.11ac: MCS0 ~ MCS9, (1SS, and 2SS) (20MHz, 40MHz, ,80MHz & 160MHz)
Modulation Direct Sequence Spread Spectrum
BPSK, QPSK, CCK, 16-QAM, 64-QAM, 256-QAM
Security1 • IEEE and WiFi compliant 64 / 128 bit WEP encryption for a/b/g mode only
• AES-CCMP: 128 bit in hardware
• 802.1x authentication
• WPA, WPA2: 802.1x. WPA-PSK, WPA2-PSK, TKIP, and AES.
• WPA2 certification
• IEEE 802.11i
• Cisco Certified Extensions, all versions through CCX4 and CCX Lite
• WAPI
Network Architecture Ad-hoc (Peer to Peer)
Models Infrastructure (Access Point Required)
Roaming IEEE 802.11 compliant roaming between access points
Output Power2 • 802.11b: +18.5dBm minimum
• 802.11g: +17.5dBm minimum
• 802.11a: +18.5dBm minimum
• 802.11n HT20(2.4GHz): +15.5dBm minimum
• 802.11n HT40(2.4GHz): +14.5dBm minimum
• 802.11n HT20(5GHz): +15.5dBm minimum
• 802.11n HT40(5GHz): +14.5dBm minimum
• 802.11ac VHT80(5GHz): +11.5dBm minimum
• 802.11ac VHT160(5GHz): +11.5dBm minimum
Power Consumption • Transmit mode2.0 W
• Receive mode 1.6 W
• Idle mode (PSP) 180 mW (WLAN Associated)
• Idle mode 50 mW (WLAN unassociated)
• Connected Standby 10mW
• Radio disabled 8 mW
Power Management ACPI and PCI Express compliant power management
802.11 compliant power saving mode
Receiver Sensitivity3 802.11b, 1Mbps : -93.5dBm maximum
802.11b, 11Mbps : -84dBm maximum


802.11a/g, 6Mbps : -86dBm maximum
802.11n, MCS07 : -67dBm maximum
802.11ac, MCS0 : -84dBm maximum
Antenna type High efficiency antenna with spatial diversity, mounted in the display enclosure
Two embedded dual band 2.4/5 GHz antennas are provided to the card to support WLAN
MIMO communications and Bluetooth communications
Form Factor PCI-Express M.2 MiniCard
Dimensions Type 2230: 2.3 x 22.0 x 30.0 mm
Weight Type 2230: 2.8g
Operating Voltage 3.3v +/- 9%
Temperature Operating 14° to 158° F (–10° to 70° C)
Non-operating –40° to 176° F (–40° to 80° C)
Humidity Operating 10% to 90% (non-condensing)
Non-operating 5% to 95% (non-condensing)
Altitude Operating 0 to 10,000 ft (3,048 m)
Non-operating 0 to 50,000 ft (15,240 m)
LED Activity LED Amber – Radio OFF; LED White – Radio ON
1. Check latest software/driver release for updates on supported security features.
2. Maximum output power may vary by country according to local regulations.
3. Receiver sensitivity is measured at a packet error rate of 8% for 802.11b (CKK modulation) and a packet error rate of 10%
for 802.11a/g (OFDM modulation).
HP Integrated Module with Bluetooth 4.0/4.1/4.2/5.0 Wireless Technology
Bluetooth Specification 4.0/4.1/4.2/5.0 Compliant
Frequency Band 2402 to 2480 MHz
Number of Available Channels Legacy : 0~79 (1 MHz/CH)
BLE : 0~39 (2 MHz/CH)
Data Rates and Throughput Legacy : 3 Mbps data rate; throughput up to 2.17 Mbps
BLE : 1 Mbps data rate; throughput up to 0.2 Mbps
Legacy : Synchronous Connection Oriented links up to 3, 64 kbps, voice channels
Transmit Power The Bluetooth component shall operate as a Class II Bluetooth device with a maximum
transmit power of +4 dBm for BR and EDR.
Power Consumption Peak (Tx) 330 mW
Peak (Rx) 230 mW
Selective Suspend 17 mW
Range Legacy Up to 33 ft (10 m)
BLE Up to 99 ft (30 m)

Bluetooth Software Supported Microsoft Windows Bluetooth Software
Link Topology
Power Management Microsoft Windows ACPI, and USB Bus Support
Certifications FCC (47 CFR) Part 15C, Section 15.247 & 15.249
ETS 300 328, ETS 300 826
Low Voltage Directive IEC950
UL, CSA, and CE Mark
Bluetooth Profiles Supported BT4.1-ESR 5/6/7 Compliance
LE Link Layer Ping
LE Dual Mode
LE Link Layer
LE Low Duty Cycle Directed Advertising
LE L2CAP Connection Oriented Channels


Train Nudging & Interlaced Scan
BT4.2 ESR08 Compliance
LE Secure Connection- Basic/Full
LE Privacy 1.2 –Link Layer Privacy
LE Privacy 1.2 –Extended Scanner Filter Policies
LE Data Packet Length Extension
FAX Profile (FAX)
Basic Imaging Profile (BIP)2
Headset Profile (HSP)
Hands Free Profile (HFP)
Advanced Audio Distribution Profile (A2DP)
Security & Manageability Intel® vPro™ support with appropriate Intel® chipset components
Intel® 9560 802.11AC 2x2 with Bluetooth® M.2 Combo Card non-vPro™
IEEE 802.11b
IEEE 802.11g
IEEE 802.11n
IEEE 802.11ac
• 2.402 – 2.482 GHz
802.11a/n
• 4.9 – 4.95 GHz (Japan)
• 5.15 – 5.25 GHz
• 5.25 – 5.35 GHz
• 5.47 – 5.725 GHz
• 5.825 – 5.850 GHz
Data Rates • 802.11b: 1, 2, 5.5, 11 Mbps
• 802.11g: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
• 802.11a: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
• 802.11ac : MCS0 ~ MCS9, (1SS, and 2SS) (20MHz, 40MHz, ,80MHz & 160MHz)
• IEEE 802.11i
• WAPI
Output Power2 • 802.11b : +18.5dBm minimum
• 802.11g : +17.5dBm minimum
• 802.11a : +18.5dBm minimum
• 802.11n HT20(2.4GHz) : +15.5dBm minimum
• 802.11n HT40(2.4GHz) : +14.5dBm minimum
• 802.11n HT20(5GHz) : +15.5dBm minimum
• 802.11n HT40(5GHz) : +14.5dBm minimum
• 802.11ac VHT80(5GHz) : +11.5dBm minimum
• 802.11ac VHT160(5GHz) : +11.5dBm minimum


Dimensions Type 2230: 2.3 x 22.0 x 30.0 mm
Weight Type 2230: 2.8g
3. Receiver sensitivity is measured at a packet error rate of 8% for 802.11b (CKK modulation) and a packet error rate of
10% for 802.11a/g (OFDM modulation).
HP Integrated Module with Bluetooth 4.0/4.1/4.2/5.0 Wireless Technology
Bluetooth Specification 4.0/4.1/4.2/5.0 Compliant
BLE : 0~39 (2 MHz/CH)
Peak (Rx) 230 mW
Range Legacy Up to 33 ft (10 m)
BLE Up to 99 ft (30 m)
Bluetooth Software Supported Microsoft Windows Bluetooth Software
Link Topology


ETS 300 328, ETS 300 826
LE Link Layer Ping
LE Dual Mode
LE Link Layer
FAX Profile (FAX)
Realtek RTL8822BE 802.11ac 2x2 with Bluetooth® M.2 Combo Card

IEEE 802.11b
IEEE 802.11g
IEEE 802.11n
IEEE 802.11ac
• 2.402 – 2.482 GHz
802.11a/n
• 4.9 – 4.95 GHz (Japan)
• 5.15 – 5.25 GHz
• 5.25 – 5.35 GHz
• 5.47 – 5.725 GHz
• 5.825 – 5.850 GHz
Data Rates • 802.11b: 1, 2, 5.5, 11 Mbps
• 802.11g: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
• 802.11a: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
• 802.11ac : MCS0 ~ MCS9, (1SS, and 2SS) (20MHz, 40MHz, ,80MHz & 160MHz)
• IEEE 802.11i
• WAPI


Output Power2 • 802.11b: +14dBm minimum
• 802.11g: +12dBm minimum
• 802.11a: +12dBm minimum
• 802.11n HT20(2.4GHz): +12dBm minimum
• 802.11n HT40(2.4GHz): +12dBm minimum
• 802.11n HT20(5GHz): +10dBm minimum
• 802.11n HT40(5GHz): +10dBm minimum
• 802.11ac VHT80(5GHz): +10dBm minimum
Receiver Sensitivity3 802.11b, 1Mbps: -93.5dBm maximum
802.11b, 11Mbps: -84dBm maximum
802.11a/g, 6Mbps: -86dBm maximum
802.11a/g, 54Mbps: -72dBm maximum
802.11n, MCS07: -67dBm maximum
802.11n, MCS15: -64dBm maximum
802.11ac, MCS0: -84dBm maximum
802.11ac, MCS9: -59dBm maximum
Dimensions Type 2230 : 2.3 x 22.0 x 30.0 mm
Weight Type 2230 : 2.8g
HP Integrated Module with Bluetooth 4.0/4.1/4.2 Wireless Technology
Bluetooth Specification 4.0/4.1/4.2 Compliant
BLE : 0~39 (2 MHz/CH)
Legacy : Asynchronous Connection Less links 2178.1 kbps/177.1 kbps asymmetric (3-DH5) or
864 kbps symmetric (3-EV5)


Peak (Rx) 230 mW
Electrical Interface USB 2.0 compliant
Link Topology
ETS 300 328, ETS 300 826
LE Link Layer Ping
LE Dual Mode
LE Link Layer
FAX Profile (FAX)
Realtek RTL8821CE 802.11ac 1x1 with Bluetooth® M.2 Combo Card

IEEE 802.11b
IEEE 802.11g
IEEE 802.11n
IEEE 802.11ac
• 2.402 – 2.482 GHz
802.11a/n
• 4.9 – 4.95 GHz (Japan)
• 5.15 – 5.25 GHz
• 5.25 – 5.35 GHz
• 5.47 – 5.725 GHz
• 5.825 – 5.850 GHz
Data Rates • 802.11b: 1, 2, 5.5, 11 Mbps
• 802.11g: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
• 802.11a: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
• 802.11ac : MCS0 ~ MCS9, (1SS, and 2SS) (20MHz, 40MHz, and 80MHz)


• IEEE 802.11i
• WAPI
Output Power2 • 802.11b : +14dBm minimum
• 802.11g : +12dBm minimum
• 802.11a : +12dBm minimum
• 802.11n HT20(2.4GHz) : +12dBm minimum
• 802.11n HT40(2.4GHz) : +12dBm minimum
• 802.11n HT20(5GHz) : +10dBm minimum
• 802.11n HT40(5GHz) : +10dBm minimum
• 802.11ac VHT80(5GHz) : +10dBm minimum
Antenna type High efficiency antenna.
One embedded dual band 2.4/5 GHz antenna is provided to the card to support WLAN
communications and Bluetooth communications
Dimensions Type 2230 : 2.3 x 22.0 x 30.0 mm
Weight Type 2230 : 2.8g
HP Integrated Module with Bluetooth 4.0/4.1/4.2 Wireless Technology
Bluetooth Specification 4.0/4.1/4.2 Compliant


BLE : 0~39 (2 MHz/CH)
Legacy : Asynchronous Connection Less links 2178.1 kbps/177.1 kbps asymmetric (3-DH5) or
864 kbps symmetric (3-EV5)
Peak (Rx) 230 mW
Electrical Interface USB 2.0 compliant
Link Topology
Certifications ETS 300 328, ETS 300 826
LE Link Layer Ping
LE Dual Mode
LE Link Layer
FAX Profile (FAX)

Technical Specification – Input/Output Devices
I/O DEVICES
HP Conferencing Keyboard
1. Function Keys 6. End/Decline a Call

2. F11 Lync or Skype for Business Contact list[1] 7. Answer a Call
3. F12 Lync or Skype for Business Calendar[2] 8. Microphone Mute
4. Share Screen 9. Volume Up/Down
5. Stop Webcam 10. Audio Mute
1. Microsoft Lync 2013, or Skype for Business, or Microsoft Outlook 2013 Contact list
2. Microsoft Lync 2013, or Skype for Business, or Microsoft Outlook 2013 Calendar
HP USB Premium Keyboard

Keys 104, 105 layout (depending upon country)
Dimensions 17.04 x 5.55 x 0.52 in (433 x 141 x13.2 mm)
Physical Characteristics
(L x W x H)
Weight 1.54 lb. (698g)
Operating voltage 5 VDC, +/-5%
Power consumption 35mA (All LED on)
System interface USB Type A plug connector
Electrical
ESD Contact Discharge: 8 KV Air Discharge: 15 KV
EMI - RFI Conforms to FCC rules for a Class B computing device
Microsoft® PC 99 - 2001 Functionally compliant
Keycaps Low-profile design
Switch actuation 60±10g nominal peak force with tactile feedback
Switch life 10 million keystrokes (Life tester)
Mechanical
Switch type Contamination-resistant switch membrane
Key-leveling mechanisms For all double-wide and greater-length keys
Cable length 6 ft. (1.8 m)


Microsoft PC 99 - 2001 Mechanically compliant
Acoustics 43-dBA maximum sound pressure level
Operating temperature 50° to 122° F (10° to 50° C)
Non-operating temperature -22° to 140° F (-30° to 60° C)
Operating humidity 10% to 90% (non-condensing at ambient)
Non-operating humidity 20% to 80% (non-condensing at ambient)
Environmental Operating shock 40 g, six surfaces
Non-operating shock 80 g, six surfaces
Operating vibration 2-g peak acceleration
Non-operating vibration 4-g peak acceleration
Drop (out of box) 26 in (66 cm) on carpet, six-drop sequence
Drop (in box) 30 in (76.2 cm) on concrete, 16-drop sequence
Approvals UL, FCC, CE Mark, TUV GS, VCCI, BSMI, C-Tick, KC
Ergonomic compliance TUVGS
Kit contents Keyboard, QSP
Warranty Card Product Notice
Skylab USB Wired Keyboard

Keys 104, 105, 106, 107, 109 layout (depending upon country)
Dimensions 171.97 x 68.35 x 8.27 in (436.8± 1.5 x 137.6± 1.0 x 21.0±
Physical Characteristics
(L x W x H) 1.0 cm)
Weight 1.32 lb. (0.6± 0.08 kg)
Operating voltage 4.4-5.25VDC
Power consumption 50-mA maximum (with 5 VDC power supplied and three
LEDs ON)
Electrical System interface USB
ESD Contact Discharge: 2, 4,6,8KV
Air Discharge: 2, 4, 8,10,12.5KV
EMI - RFI Conforms to FCC rules for a Class B computing device
Keycaps Low-profile design
Switch actuation 60±10g nominal peak force with tactile feedback
Switch life 10 million keystrokes (Life tester)
Mechanical Switch type Contamination-resistant switch membrane
Key-leveling mechanisms For all double-wide and greater-length keys
Microsoft PC 99 - 2001 Mechanically compliant
Environmental Acoustics 43-dBA maximum sound pressure level

Operating temperature 50° to 122° F (10° to 50° C)

Non-operating temperature Minus 30 degrees to 60 degrees Celsius
Operating shock 40 g, six surfaces
Non-operating shock 80 g, six surfaces
Operating vibration 2-g peak acceleration
Non-operating vibration 4-g peak acceleration
Drop (out of box) 26 in (66 cm) on carpet, six-drop sequence
Drop (in box) 30 in (76.2 cm) on concrete, 16-drop sequence
Approvals UL, FCC, CE Mark, TUV GS, VCCI, BSMI, C-Tick, KC
Ergonomic compliance ANSI HFS 100, ISO 9241-4, and TUVGS
Kit contents Keyboard, Installation Guide, Warranty card, Safety and Comfort Guide

HP USB Premium Mouse

Dimensions (H x L x W) 4.21 x 2.64 x 1.52 in (107 x 67 x 38.7 mmm)
Weight 0.19lb (90g)
Environmental Operating temperature 50° to 122°F (10° to 50° C)
Non-operating temperature -22° to 140°F (-30° to 60° C)
Operating shock 50 g, 6 surfaces
Non-operating shock 80 g, 6 surfaces
Operating vibration 2 g peak acceleration
Non-operating vibration 4 g peak acceleration
Electrical Operating voltage 5 VDC, +/-5%
Power consumption 12mA
Mechanical Connector USB 2.0
Type 3D mouse (3 keys and wheel)
Resolution 800, 1200, 1600 DPI
Sensor Pixart PAN3606DL
Tracking speed Tracking acceleration 8G(max), 1G=9.8m/s2
Color Jack Black
Regulatory approvals Compliant UL, FCC, CE Mark, TUV GS, VCCI, BSMI, C-Tick, KC
HP USB Mouse
Dimensions
(H x L x W) 37mm*115mm*62.9mm
Weight 90 +10g/- 5 g
Color Black
Connector USB
Resolution 800 DPI sensitivity
Mechanical
Buttons Two primary buttons and clickable scroll wheel

Technical Specification – Audio/Multimedia
AUDIO/MULTIMEDIA
Type Integrated
HD Stereo Codec Conexant CX20632
Front: 1 - Headset connector supports a CTIA style headset and is re-taskable as a Line-in, Line-
out, Microphone-in or Headphone-out port
1 - Headphone port
Rear: Line-out
Line-in which is retaskable as a Microphone Input
Audio I/O Ports All ports are 3.5mm and support stereo
Internal Speaker Amplifier 2W class D mono amplifier for the internal speaker only. External speakers must be powered
Playback multi-streaming can be enabled in the audio control panel to allow independent audio
Multi-streaming Capable streams to be sent to/from the front and rear jacks or integrated speaker.
Independent sampling rates for DAC’s and ADC’s; supports resolutions from 16 to 24-bit; 44.1 kHz
Sampling to 192 kHz for DAC and 44.1 kHz to 96 kHz for ADC
Wavetable Syntheses Yes - Uses OS soft wavetable
Analog Audio Yes
# of Channels on Line-Out Stereo (Left & Right channels)
Internal Speaker Yes

Type Integrated
1 - Headphone port
Rear: Line-out
Line-in which is retaskable as a Microphone Input
All ports are 3.5mm and support stereo
Analog Audio Yes

Technical Specification – Audio/Multimedia

Type Integrated
Audio I/O Ports 1 - Headphone port
Analog Audio Yes

Bang & Olufsen Audio
Type Integrated
Side headset connector supports a CTIA style headset and is re-taskable as a Line-in, Line-out,
Microphone-in or Headphone-out port
Side headphone connector supports a headphone connections
Rear line out connector
Internal Speaker Amplifier 2W per channel class D stereo amplifier for the internal speakers only
Multi-streaming Capable streams to be sent to/from the front and rear jacks or integrated speakers.
Analog Audio Yes
Internal Speaker Yes - Stereo
INTEGRATED WEBCAM AND MICROPHONE

Integrated Webcam and Microphone
Optional integrated 2 MP Full HD RGB webcam & microphone; maximum resolution of 1920 x 1080
Optional integrated 2 MP Full HD RGB dual-facing webcam with IR sensor (user-facing) & microphone; maximum resolution of
1920 x 1080
NOTE: All HP devices which carry the Bang & Olufsen brand are custom-tuned with Bang & Olufsen’s acoustical engineers for precise sound experience in
business use.

Technical Specification - Power
POWER
Unit Environment and Operating Conditions
Operating: 5°C ~45°C
Temperature Range Non-Operating: -40°C ~66°C
Operating 5% to 90% relative humidity at max inlet temperature
Relative Humidity Non-Operating 5% to 90% relative humidity at max inlet temperature
(unpressurized) Non-operating: 50,000 ft. (15240 m)
HP EliteDesk 800 G4 Desktop Mini Business PC (35W)




DM SFF TWR AiO

65W EPS, 89% average
efficiency at 115V &
230Vac
External Power
efficiency at 115V & N/A N/A N/A
Supplies
230Vac
efficiency at 115V &
230Vac
80 PLUS Gold 500W active PFC / 80 180W active PFC / 80
PLUS Gold PLUS Gold*
87/90/87% efficient at 87/90/87% efficient at
N/A N/A 20/50/100% load 20/50/100% load
(115V) (115V)
*Available on models with
integrated graphics
80 PLUS Platinum N/A 250W active PFC / 80 250W active PFC / 80 210W active PFC / 80
PLUS Platinum PLUS Platinum PLUS Platinum*
90/92/89% efficient at 90/92/89% efficient at 90/92/89% efficient at
20/50/100% load 20/50/100% load 20/50/100% load
(115V) (115V) (115V)
91/93/90% efficient at 91/93/90% efficient at 91/93/90% efficient at
20/50/100% load 20/50/100% load 20/50/100% load
(230V) (230V) (230V)
*Available on models with
discrete graphics
Operating Voltage
Range 90Vac~264Vac 90Vac~264Vac 90Vac~264Vac 90Vac~264Vac
Rated Voltage Range 100Vac~240Vac 100Vac~240Vac 100Vac~240Vac 100Vac~240Vac
Rated Line Frequency 50HZ~60HZ 50HZ~60HZ 50HZ~60HZ 50HZ~60HZ
Operating Line
Frequency 47HZ~63HZ 47HZ~63HZ 47HZ~63HZ 47HZ~63HZ
Rated Input Current 65W≦1.6A
90W≦1.2A 500W≦6A 210W≦3A
150W≦2.2A 250W≦3A 250W≦3A 180W≦2.5A
Rated Input Current 65W≦1.6A
with Energy Efficient* 90W≦1.2A 500W≦6A 210W≦3A
Power Supply 150W≦2.2A 250W≦3A 250W≦3A 180W≦2.5A
DC Output +19.5VV +12V +12V +12V

DM SFF TWR AiO
Current Leakage (NFPA Less than 500 Less than 500 Less than 500 Less than 500
99: 2102) microamps of leakage microamps of leakage microamps of leakage microamps of leakage
current at 120 Vac with current at 120 Vac with current at 120 Vac with current at 120 Vac with
the ground wire the ground wire the ground wire the ground wire
disconnected, as disconnected, as disconnected, as disconnected, as
required for Non-patient required for Non-patient required for Non-patient required for Non-
Electrical Appliances Electrical Appliances Electrical Appliances patient Electrical
and Equipment used in a and Equipment used in a and Equipment used in a Appliances and
patient care facility or patient care facility or patient care facility or Equipment used in a
that contact patients in that contact patients in that contact patients in patient care facility or
normal use. Per section normal use. Per section normal use. Per section that contact patients in
10.3.5.1. 10.3.5.1. 10.3.5.1. normal use. Per section
Less than 100 Less than 100 Less than 100 10.3.5.1.
microamps of leakage microamps of leakage microamps of leakage Less than 100
current at 120 Vac with current at 120 Vac with current at 120 Vac with microamps of leakage
the ground wire intact the ground wire intact the ground wire intact current at 120 Vac with
with normal polarity, as with normal polarity, as with normal polarity, as the ground wire intact
required for Non-patient required for Non-patient required for Non-patient with normal polarity, as
Electrical Appliances Electrical Appliances Electrical Appliances required for Non-
and Equipment used in a and Equipment used in a and Equipment used in a patient Electrical
patient care facility or patient care facility or patient care facility or Appliances and
that contact patients in that contact patients in that contact patients in Equipment used in a
normal use. Per section normal use. Per section normal use. Per section patient care facility or
10.3.5.1. 10.3.5.1. 10.3.5.1. that contact patients in
normal use. Per section
10.3.5.1.
Power Supply Fan N/A 70mm variable speed 70mm variable speed N/A
Power cord length 6.0 ft. (1.83 m) 6.0 ft. (1.83 m) 6.0 ft. (1.83 m) 6.0 ft. (1.83 m)
External Power
Adapter External power supply Internal power supply Internal power supply Internal power supply
Dimensions 65W: 113.5mm x 55mm 165mm x 95mm x 165mm x 95mm x 135mm x 100mm x
x 30mm 73mm 73mm 19.52mm
90W: 132mm x 57mm x
30mm
150W: 160mm x 80mm
x 40mm
Total Cord Length 6.0 ft. (1.83 m) 6.0 ft. (1.83 m) 6.0 ft. (1.83 m) 6.0 ft. (1.83 m)
The harmonic input current requirements must be met under the following operating conditions:
Load Requirements: 50% and 100%
Input Voltage: 230Vac/50Hz.
For active power factor correction the power factor at 50% &100% loads shall be greater than 0.9 over the entire nominal input
voltage range (100-127VAC and 200-240VAC).
Condition Standard Efficiency 82/85/82% 85/88/85% 87/90/87% 90/92/89% Input Voltage

10% of Rated
- 75% 81% 84% 84% 115Vac/60HZ
Load
20% of Rated
- 82% 85% 87% 90% 115Vac/60HZ
Load
50% of Rated - 85% 88% 90% 92% 115Vac/60HZ
Load PF>0.9 PF>0.9 PF>0.9 PF>0.9 PF>0.95
100% of Rated 70% 82% 85% 87% 89% 115Vac/60HZ
Load PF>0.9 PF>0.9 PF>0.9 PF>0.9 PF>0.9 230Vac/50HZ
Technical Specification – Weights and Dimensions
WEIGHTS & DIMENSIONS

DM SFF TWR AiO
Chassis (W x D x H) 3.94 x 13.3 x 12.13 in 6.1 x 14.6 x 14.4 in See table below.
177x175x34mm
100 x 338 x 308 mm 154 x 370 x 365 mm
System Volume 10.4 L 20.8 L See table below.
1.05L
634 cu in 1269 cu in
System Weight 6.13 kg See table below.
1.05 kg 9.86 kg
13.5 lb
2.31 lb 21.74 lb
Max Supported See table below.

35 kg 35 kg
Weight
0 77 lb 77 lb
(desktop
orientation)
Stand Dimensions 160x117x18.5mm 151.8x200x37.2mm N/A See table below.
Packaging (W x D x 15.71 x 19.65 x 9.06 in 11.77 x 18.82 x 20.35 in See table below.
497 x128 x223mm
H) 399 x 499 x 230 mm 299 x 478 x 517 mm
Shipping Weight 2.95 kg 9 kg 11.34 kg See table below.
6.49 lb 19.82 lb 24.98 lb
Multipack
20.28x16.54x25 in
Packaging
515x420x636 mm
(10 units)
Palletization 18-units per layer 6 units per layer 8 units per layer 10-units per layer
Profile 5 or 6 layers max 10 layers max 4 layers ax 4-layers max
depending on details of 60 units per pallet 32 units per pallet 40-units per pallet (sea)
air freight 1200*1000*2438 mm 1200*1000*2203 mm 1200 x 1000 x 2470 mm
90 or 108 units per (include the pallet) (include the pallet)
pallet
depending on details of
air freight
45.354 x 39.13 x 57.80
in, 1152 x 994 x 1468
mm
(include pallet)

ALL-IN-ONE WEIGHTS AND DIMENSIONS
Weight with Touch Panel
Product Weight Without Stand Adjustable Height Recline Stand

Unboxed 13.29 lbs. Stand 21.12lbs
6.03kg 19.24 lbs. 9.58kg
8.73kg
Shipping Weight Without Stand Adjustable Height Recline Stand
Boxed 20.64-21.15lbs Stand 28.66-28.88 lbs.
9.4-9.45kg 26.68 lbs. 13-13.1kg
12.1kg
Pallet (10units) Stand (10units) (10units)
233.73lbs 293.21lbs 313.06lbs
106kg 133 kg 142kg
Weight without Touch Panel
Product Weight Without Stand Adjustable Height Recline Stand

Unboxed 13.51-13.62 lbs. Stand 21.34-21.44 lbs.
6.13-6.18kg 19.46-19.68lbs 9.68-9.73kg
8.93 kg
Boxed 20.86-21.06lbs Stand 28.88lbs
9.5-9.55kg 26.89-27.12 lbs. 13.1kg
12.2-12.3 kg
Pallet 21.2 x 2.12 x 13.46 in Stand 0 degrees 0 degrees
539.6 x 53.8 x 341.79 21.2 x 7.1 x 18.4 in 21.2 x 10.3 x 10.63 in
mm 539.6 x 180.28 x 467.7 539.6 x 261.8 x
mm 269.98 mm
Dimensions (W x D x H)
Product Without Stand Adjustable Height Recline Stand

Dimensions 21.2 x 2.12 x 13.46 in Stand 0 degrees 0 degrees
539.6 x 53.8 x 341.79 21.2 x 7.1 x 18.4 in 21.2 x 10.3 x 10.63 in
mm 539.6 x 180.28 x 467.7 539.6 x 261.8 x
mm 269.98 mm
Shipping Dimensions
Shipping Without Stand Adjustable Height Recline Stand

Dimensions 27.17 x 10.08 x Stand 27.17 x 10.08 x
Boxed 21.46(H) in 27.17 x 10.08 x 26.22(H) in
690 x 256 x 545(H) 26.22(H) in 690 x 256 x 666(H)
mm 690 x 256 x 666(H) mm
mm
Shipping Without Stand Adjustable Height Recline Stand
Dimensions (10 units) Stand (10 units) (10 units)
Pallet 47.24 x 39.37 x 47.24 x 39.37 x 47.24 x 39.37 x
24.02(H) in 28.94(H) in 28.94(H) in
1200 x 1000 x 610(H) 1200 x 1000 x 735(H) 1200 x 1000 x 735(H)
mm mm mm
Technical Specifications – Miscellaneous Features
MISCELLANEOUS FEATURES
Management Features
• Advanced Configuration and Power Management Interface (ACPI). Allows the system to wake from a low power mode.
Controls system power consumption, making it possible to place individual cards and peripherals in a low-power or
powered-off state without affecting other elements of the system.
• Intel® Wired for Management support; industry wide initiative to make Intel® architecture based PCs, servers and mobile
computers more inherently manageable out-of-the-box and over the network
• Dual State Power Button; acts as both an on/off button and a suspend-to-sleep button
Serviceability Features
• Dual colored power LED on front of computer to indicate either normal or fault condition
• Diagnostic LED Explanation Table:
o Power LED will blink red 2 to 5 times, then blink white 2 or more times, then repeat (with beep tones for each
blink initially):
▪ 2 red + 2 white User must provide file for BIOS recovery (USB storage typically)
▪ 2 red + 3 white User must enter a key sequence to proceed with recovery by policy
▪ 2 red + 4 white BIOS recovery is in progress
▪ 3 red + 2 white Memory could not be initialized
▪ 3 red + 3 white Graphics adaptor could not be found
▪ 3 red + 4 white Power supply failure / not connected
▪ 3 red + 5 white Processor not installed
▪ 3 red + 6 white Current processor does not support an enabled feature
▪ 4 red + 2 white Processor has exceeded its temperature threshold / system thermal shutdown
▪ 4 red + 3 white System internal temperature has exceeded its threshold
▪ 5 red + 2 white System controller firmware is not valid
▪ 5 red + 3 white System controller detected BIOS is not executing
▪ 5 red + 4 white BIOS could not complete initialization / PCA failure
▪ 5 red + 5 white System controller rebooted the system after a health or recovery timer triggered
• HP PC Hardware Diagnostics UEFI:
o This utility enables hardware level testing outside the operating system on many components. The diagnostics
can be invoked by pressing F2 at POST, and is available as a download from HP Support
• System/Emergency ROM
• Flash ROM
• CMOS Battery Holder for easy replacement
• Flash Recovery with Video Configuration Record Software5 Aux Power LED on System PCA
• Processor ZIF Socket for easy Upgrade
• Over-Temp Warning on Screen (Requires IM Agents)
• Clear Password Jumper
• DIMM Connectors for easy Upgrade
• Clear CMOS Button
• NIC LEDs (integrated) (Green & Amber)
• Dual Color Power and HD LED - To Indicate Normal Operations and Fault Conditions
• Color coordinated cables and connectors
• Tool-less Hood Removal
• Front power switch
• System memory can be upgraded without removing the system board or any internal components
• Tool-less Hard Drive, CD & Diskette Removal (For MT, SFF, and DM only)
• Green Pull Tabs, and Quick Release Latches for easy Identification
Technical Specifications – Miscellaneous Features
Additional Features Description

Tower Orientation Product can be oriented as either a desktop (horizontal) or a tower (vertical) for MT,
SFF, and DM only
Drive Lock Implementation of the industry standard ATA Security feature set. When enabled, it
prevents software access to user data on the drive until one or two user-defined
passwords are provided.
Boot Sectors Protection MBR and GPT sectors of the hard drive are critical to booting the operating system. By
saving the MBR or GPT data (depending on the how the OS was installed), the BIOS will
be able to monitor for changes and allow the user to override them with the backup
copy at boot-up.
Drive Protection System DPS Access through F10 Setup during Boot
A diagnostic hard drive self- test. It scans critical physical components and every
sector of the hard drive for physical faults and then reports any faults to the user
Running independently of the operating system, it can be accessed through a
Windows-based diagnostics utility or through the computer's setup procedure. It
produces an evaluation on whether the hard drive is the source of the problem and
needs to be replaced
The system expands on the Self-Monitoring, Analysis, and Reporting Technology
(SMART), a continuously running systems diagnostic that alerts the user to certain
types of failures
SMART Technology (Self-Monitoring, Allows hard drives to monitor their own health and to raise flags if imminent failures
Analysis and Reporting Technology) were predicted
SMART I - Drive Failure Prediction Predicts failures before they occur. Tracks fault prediction and failure indication
parameters such as re-allocated sector count, spin retry count, calibration retry count
SMART II - Off-Line Data Collection By avoiding actual hard drive failures, SMART hard drives act as "insurance" against
unplanned user downtime and potential data loss from hard drive failure
SMART III - Off-Line Read Scanning with IOEDC: I/O Error Detection Circuitry
Defect Reallocation
SMART IV - End-to-End CRC for hard Detects errors in Read/Write buffers on HDD cache RAM
drives
Technical Specifications – After Market Options
AFTER MARKET OPTIONS
Graphics Solutions DM SFF TWR AiO Part Number

AMD® Radeon™ RX 550 4GB 2DP Card X 3TK71AA
AMD® Radeon™ R7 430 2GB 2DP Card X X 3MQ82AA
HP DisplayPort To HDMI True 4k Adapter X X X X 2JA63AA
HP DVI Cable Kit X X X X DC198A
HP HDMI Standard Cable Kit X X X X T6F94AA
HP DisplayPort Cable Kit X X X X VN567AA
HP DisplayPort To VGA Adapter X X X X AS615AA
HP DisplayPort To DVI-D Adapter X X X X FH973AA
Desktop Mini Accessories DM Part Number

HP Desktop Mini G4 Port Cover Kit X (95W and discrete GPU skus not supported) 1ZE52AA
HP G4 Mini 2.5-inch SATA Drive Bay Kit X (95W and discrete GPU skus not supported, cannot
3TK91AA
use in conjunction with Thunderbolt 3 and Fiber NIC)
HP Desktop Mini LockBox V2 X (95W and discrete GPU skus not supported) 3EJ57AA
HP Desktop Mini 500GB HDD/I/O Expansion Module X (Either one) K9Q82AA
HP Desktop Mini DVD-Writer ODD Expansion Module K9Q83AA
HP Desktop Mini I/O Expansion Module K9Q84AA
HP Desktop Mini Security/Dual VESA Sleeve v2 X (95W and discrete GPU skus not supported) 2JA32AA
HP Desktop Mini Vertical Chassis Stand X G1K23AA
HP DM VESA Power Supply Holder Kit X (95W and discrete GPU skus not supported) *Must use
1RL87AA
with Dual VESA Sleeve V2
Data Storage Drives DM SFF TWR AiO Part Number

HP 256GB SATA TLC Non-SED Solid State X (95W and discrete GPU skus
Drive not supported, cannot use in
X X X P1N68AA
conjunction with Thunderbolt 3
and Fiber NIC)
HP PCIe NVME TLC 256GB SSD M.2 Drive X X X X 1CA51AA
HP PCIe NVME TLC 512GB SSD M.2 Drive X X X X X8U75AA
HP PCIe NVME TLC 512GB SSD PCIe Drive X X Z4L70AA
HP 500GB 7200PRM SATA 6.0Gb/s 3.5”
X X QK554AA
Hard Drive
HP 1TB 7200rpm SATA 6Gb/s 3.5” Hard
X X QK555AA
Drive
HP SATA SuperMulti JB Drive X QS208AA
HP 9.5mm Slim Removable SATA 500GB X X X T7G14AA
HP 9.5mm G4 8/6/4 SFF G4 400 SFF/MT
X 1CA53AA
DVD Writer
Input Devices DM SFF TWR AiO Part

Number
HP USB (Grey) SmartCard CCID Keyboard X X J7H70AA
HP USB Antimicrobial Business Slim Keyboard and Mouse
X X X Z9H50AA
(China Only)
HP USB Business Slim CCID SmartCard Keyboard X X X X Z9H48AA
HP USB Business Slim (Grey) Keyboard (EMEA Only) X X X X Z9H49AA
HP USB Business Slim Keyboard X X X X N3R87AA
HP USB Business Slim Keyboard and Mouse and Mousepad X X X T4E63AA
HP USB Collaboration Keyboard X X X Z9N38AA
HP USB Conferencing Keyboard X K8P74AA
HP USB Keyboard X X X X QY776AA
HP USB Keyboard and Mouse Healthcare Edition X X X X 1VD81AA
HP USB Premium Keyboard X X X X Z9N40AA
HP USB PS/2 Washable Keyboard & Mouse X X X X BU207AA
HP Wireless Business Slim Keyboard and Mouse X X X X N3R88AA
HP Wireless Collaboration Keyboard X X X Z9N39AA
HP Wireless Premium Keyboard X X X Z9N41AA
HP PS/2 Business Slim Keyboard X X N3R86AA
HP USB Grey v2 Mouse (EMEA only) X X X X Z9H74AA
HP USB Premium Mouse X X X X 1JR32AA
HP PS/2 Mouse X X QY775AA
HP USB 1000dpi Laser Mouse X X X X QY778AA
HP USB Hardened Mouse X X X X P1N77AA
HP USB Mouse X X X X QY777AA
System Memory DM SFF TWR AiO Part

Number
HP 4GB DDR4-2666 DIMM X X 3TK85AA
HP 4GB DDR4-2666 SODIMM X X 3TK86AA
Multimedia Devices DM SFF TWR AiO Part

Number
HP Business Headset v2 X X X X T4E61AA
HP USB Business Speakers v2 X X X N3R89AA
Security Devices DM SFF TWR AiO Part Number
HP Solenoid Lock & Hood Sensor (SFF) X 1CA50AA

HP Solenoid Lock & Hood Sensor (MT) X J6L42AA
HP Business PC Security Lock v3 Kit X X 3XJ17AA
HP Dual Head Keyed Cable Lock X X T1A64AA
HP Keyed Cable Lock 10mm X X X X T1A62AA
HP Master Keyed Cable Lock 10mm X X X T1A63AA
Stands and Accessories DM SFF TWR AiO Part

Number
HP B300 PC Mounting Bracket X 2DW53AA
HP B500 PC Mounting Bracket X 2DW52AA
x (95W and discrete GPU skus
HP Single Monitor Arm not supported) X BT861AA
HP 800 G4/G4 AIO Adjustable Height
Stand X Z9H66AA
HP 800 G4/G4 AIO Recline Stand X Z9H67AA
I/O Devices DM SFF TWR AiO Part

Number
x (discrete GPU skus not
X X 3TK72AA
HP DisplayPort Port Flex IO supported)
3TK73AA
HP Fiber NIC Port Flex IO not supported)
X X 3TK74AA
HP HDMI Port Flex IO (400/600/800) supported)
3TK77AA
HP Thunderbolt 3.0 Port Flex IO not supported)
HP Thunderbolt 3.0 PCIe Card X X 4CX35AA
X X 3TK78AA
HP Type-C™ USB 3.1 Gen2 Port Flex IO supported)
HP Type-C™ USB 3.1 Gen2 Port with PD x (65W & 95W and discrete GPU
3TK79AA
Flex IO skus not supported)
X X 3TK80AA
HP VGA Port Flex IO supported)
3TK76AA
HP Serial Port Flex IO supported)
HP Internal Serial Port (600/705/800) X X 3TK82AA
HP PCIe x1 Parallel Port Card X X N1M40AA
HP 800/600/400 G4 Serial/ PS/2 Adapter X X 1VD82AA
Communication Devices DM SFF TWR AiO Part

Number
Intel® 9260 802.11ac non-vPro™ PCIe x1
X X 3TK89AA
Card
Realtek 8822BE 802.11ac PCIe x1 Card X X 3TK90AA
Intel® Optane Memory DM SFF TWR AiO Part

Number
Intel® Optane Memory 16GB (Cache) X X X X 1WV97AA
© Copyright 2020 HP Development Company, L.P. All rights reserved.

The information contained herein is subject to change without notice. The only warranties for HP products are set forth in the
express limited warranty statements accompanying such products. Nothing herein should be construed as constituting an
additional warranty. HP shall not be liable for technical or editorial errors or omissions contained herein. Microsoft and Windows
are registered trademarks or trademarks of Microsoft Corporation in the U.S. and/or other countries. Intel, Celeron, Core, Pentium
are registered trademarks or trademarks of Intel Corporation in the U.S. and/or other countries. Bluetooth  is a trademark of its
proprietor, used by HP, Inc. under license. USB Type-C™ and USB-C™ are trademarks of USB Implementers Forum. NVIDIA, GeForce
and NVS are trademarks and/or registered trademarks of NVIDIA Corporation in the U.S. and other countries. AMD and Radeon are
trademarks of Advanced Micro Devices, Inc. ENERGY STAR is a registered trademark owned by the U.S. Environmental Protection
Agency. DisplayPort™ and the DisplayPort™ logo are trademarks owned by the Video Electronics Standards Association (VESA®) in
the United States and other countries.
Change Log
Date Version History Action Description of Change

June 6, 2018 From v1 to v2 Add Environmental section
June 15, 2018 From v2 to v3 Add Adjustable Height and Recline Stand
June 19, 2018 From v3 to v4 Update Environmental specs for micro tower buisiness
June 19, 2018 From v4 to v5 Update Environmental Tab for Non-Touch All-in-One Business PC and
Touch All-in-One Business PC
June 20, 2018 From v5 to v6 Update Environmental tabs
June 20, 2018 From v6 to v7 Update Weights & Dimensions
July 19, 2018 From v7 to v8 Update Note for SATA Drive Bracket added to Internal Ports section
Refresh Rate added to Panel specs
August 2, 2018 From v8 to v9 Update Palletization profile corrected for DM
SFF Call out image changed
USB sentence reduced in the call outs specs and rest of QS
2.5 SSHD corrected to include SFF and TWR
August 21, 2018 From v9 to v10 Update Windows Home removed
August 24, 2018 From v10 to v11 Update Intel® Core™ i7-8700 Processors corrected
Windows Home returned back
August 30, 2018 From v11 to v12 Update Environmental table for AiO GPU fixed
September 19, 2018 From v12 to v13 Update NVIDIA GeForce GT730 2GB DP DVI PCIe x8 GFX added to
Graphics section for MT and SFF.
September 27, 2018 From v13 to v14 Update Rear I/O connector added to AMD Radeon RX 560 graphic card
Last bullet added to “At a Glance” section
October 11, 2018 From v14 to v15 Update Footnote 33 updated to Raid 1 configuration
November 2, 2018 From v15 to v16 Update Note added to Optional Discrete Graphics Solutions
November 14, 2018 From v16 to v17 Update Max. Resolution added to Intel® UHD Graphics and AMD
Radeon™ 560
December 10, 2018 From v17 to v18 Update NVIDIA® Quadro P620 2GB Graphics Card added to Tower
business Graphics sections
December 17, 2018 From v18 to v19 Update AMD Radeon™ R7 430 Graphics 2GB GDDR5 64bit 2DP, AMD
Radeon™ R7 430 Graphics 2GB GDDR5 64bit DP+VGA, AMD
Radeon™ RX 580 Graphics 8GB GDDR5 and NVIDIA® GeForce®
RTX 2080 8GB GDDR6_Added to graphics
January 3, 2019 From v19 to v20 Update Response Time specs added to DISPLAY PANEL SPECIFICATIONS
February 1, 2019 From v20 to v21 Update HP PhoneWise, HP ePrinter + Jet advantage, HP Velocity, and
HP WorkWise removed.
February 11, 2019 From v21 to v22 Update Support for “VESA 100 mounting system on bottom of PC
chassis” added to mounting in call outs section for DM
February 13, 2019 From v22 to v23 Update I210 NIC switched to “Add-on” instead of “integrated”
February 27, 2019 From v23 to v24 Update Typo corrected in the title: M.2 PCIe NVMe Solid State Drives
(SSD)
March 6, 2019 From v24 to v25 Update Type C port USB port (2.0 or 3.0) and PORTS information
charging capability statement update and PORTS information,
on USB type C port, (15W) added.
March 12, 2019 From v25 to v26 Update Declared Noise Emissions values for EliteDesk 800 Small Form
Factor G4 series updated
March 26, 2019 From v26 to v27 Update HP Solenoid Lock & Hood Sensor (SFF) part number corrected
in AMO section
April 16, 2019 From v27 to v28 Update HP 9.5mm Slim DVD Writer Drive write speed updated
May 20, 2019 From v28 to v29 Update Check marks for AiO in Solid State Hybrid Drives (SSHD)
removed
Change Log
June 5, 2019 From v29 to v30 Update 128GB memory (4 x 32GB) on 800 G4 TWR
June 26, 2019 From v30 to v31 Update HP Cloud Recovery and it´s disclaimer added to software
section
Note II added to Bays section
Intel Unite needs to be configured at factory (AiO/DM) adde to
At a Glance section
EPEAT references updated
July 29, 2019 From v31 to v32 Update AMD Radeon™ 520 1GB and • NVIDIA GeForce RTX 2060
6GB added to Graphics
AMD® Radeon™ RX550 4GB 2DP able to SFF
August 20, 2019 From v32 to v33 Update Bays specs, and references updated
Disclaimer added to SFF call outs back image
Cable lock slot upgraded to Standard
September 17, 2019 From v33 to v34 Update Note added to Graphics sectoin
October 31, 2019 From v34 to v35 Update EPEAT references updated / Power Factor table added to PS
February 18, 2020 From v15 to v36 Update Drivelock note and disclaimer added

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QuickSpecs HP EliteDesk 800 G4 and HP EliteOne 800 G4 Business Desktops PCs

HP EliteDesk 800 G4 Desktop Mini Business PC

Not all configuration components are available in all regions/countries. Page 1

HP EliteDesk 800 G4 Desktop Mini Business PC

1. DisplayPort™ 1.2 5. RJ-45 Network Adapter

Not all configuration components are available in all regions/countries. Page 2

HP EliteDesk 800 G4 Small Form Factor Business PC

1. Slim optical drive (optional) 6. USB 2.0 (charge support up to 5V/1.5A)

Not all configuration components are available in all regions/countries. Page 3

HP EliteDesk 800 G4 Small Form Factor Business PC

1. Audio-in connector 6. Optional port (DisplayPort™ 1.2, HDMI, VGA or USB-C™)

Not all configuration components are available in all regions/countries. Page 4

HP EliteDesk 800 G4 Tower Business PC

Not all configuration components are available in all regions/countries. Page 5

1. Camera (optional) 2. Speakers (optional)

Infrared (IR) and dual facing camera (optional)

Full High Definition (FHD) camera (optional)

1. Camera light 2. FHD camera 3. Digital microphones

Not all configuration components are available in all regions/countries. Page 6

Not all configuration components are available in all regions/countries. Page 7

Bottom components and rear ports (behind security cover)

Not all configuration components are available in all regions/countries. Page 8

Technical Specification - Processors

Rear and side components

1. Fingerprint reader (optional) 3. Adjustable height stand (optional)

Not all configuration components are available in all regions/countries. Page 9

Technical Specification - Processors

Not all configuration components are available in all regions/countries. Page 10

Technical Specification - Processors

Not all configuration components are available in all regions/countries. Page 11

Technical Specification - Processors

Not all configuration components are available in all regions/countries. Page 12

Technical Specification - Processors

Intel® 8th Generation Pentium® Processors DM SFF TWR AiO

Intel® 8th Generation Celeron™ Processors DM SFF TWR AiO

Not all configuration components are available in all regions/countries. Page 13

Technical Specification - Processors

Optional Discrete Graphics Solutions DM SFF TWR AiO

*Requires 500W chassis

Adapters and Cables DM SFF TWR AiO

Not all configuration components are available in all regions/countries. Page 14

Technical Specification - Processors

2.5 inch Solid State Drives (SSD) DM SFF TWR AiO

Optical Disc Drives DM SFF TWR AiO

Not all configuration components are available in all regions/countries. Page 15

Technical Specification - Processors

Memory Configuration DM SFF TWR AiO

Not all configuration components are available in all regions/countries. Page 16

Technical Specification - Processors

Wireless1 DM SFF TWR AiO

KEYBOARDS AND POINTING DEVICES

Mouse DM SFF TWR AiO

1. PS/2 port not available on EliteOne 800 G4 AiOs

Not all configuration components are available in all regions/countries. Page 17

Technical Specification - Processors

Not all configuration components are available in all regions/countries. Page 18

Technical Specification - Processors

Audio 1 Headphone 1 Headphone 1 Headphone 1 Line out (rear)

I/O Ports – Optional DM SFF MT

Not all configuration components are available in all regions/countries. Page 19