Manufacturer Part Number

Device Identification Prefix Suffix

ST Family Package
HCF4XX BIR, BEY PDIP Memory Devices
MICROELECTRONICS 74AC/ACT Advanced CMOS M, M1R, Plastic SOIC Prefix Device Suffix
M74HC High Speed CMOS BMI MXXX XXXXX XX X X

Family
Speed
(Current) Package
Temperature

Family Package Prefix Device Suffix

ET21 Static RAM C Ceramic DIL
ETL21 Static RAM J Ceramic DIL XX X XXXX X XX X XX
ETC27 EPROM N Plastic DIL
MK41 Fast Static RAM Q UV Window Cerdip
MK45 Biport FIFO Family
(Discontinued)
MK48 Static RAM Temperature Technology
TS27 EPROM — 0°C to 70°C
TS28 EEPROM E –25°C to 70°C Package
TS59 EEPROM V –40°C to 85°C Speed
M –55°C to 125°C
Temperature Quality Level Temperature
— NMOS — Standard Quality Level
C CMOS B/B MIL-STD-883B
L Low Power Class B

Memory Part Number Identification Keys Prefix Device Suffix

U.V. Eprom & OTP Cone Time Programmable M XX X XXX X X XXX X X
Prefix Revision
M SGS Thomson Blank A, B Device
Family
Device Family Vcc Range
Type
27 EPROM Blank 5V +/- 10% Vcc
X +/- 5% Vcc Capacity
87 EPROM Latched
Revision
Type Speed
55 55ns Vcc Range
Blank NMOS
C CMOS 60 60ns Speed
V Low Voltage 70 70ns
80 80ns Package
Capacity 90 90ns Temperature
64 64K bit (x8) 100/10 100ns
256 256K bit (x8) 120/12 120ns
512 512K bit (x8) 150/15 150ns
1001 1 Meg bit (x8) 200/20 200ns
101 1 Meg bit (x8) Low Voltage 250/25 250ns
1024 1 Meg bit (x16) Package
2001 2M bit (x8)
201 2M bit (x8) Low Voltage F Ceramic DIP
4001 4M bit (x8) (window)
401 4M bit (x8) Low Voltage L LCCC (window)
4002 4M bit (x16) B PDIP
801 4M bit (x8) C PLCC (Stadard)
161 16M bit (x8/16) selectable K PLCC
160 16M bit (x8/16 (Low Voltage)
M PSO
N TSOP
Temperature
1 0 to 70C
6 -40 to 85C
3 -40 to 125C
 Manufacturer Part Number
Device Identification Prefix Suffix

ST Family Package
EF68XX Microprocessor C Ceramic DIP
MICROELECTRONICS TS68XXX Microprocessor E CLCC
(continued) & CRT Controllers J Cerdip
EF68XX Peripherals FN PLCC
MK68XXX Peripherals & P Plastic DIL
Data Comm R Pin Grid Array
EF93XX CRT Controllers
Temperature
L* 0°C to 70°C
V –40°C to 85°C
M –55°C to 125°C
*May be omitted

Quality Level
— Standard

Family Package
MK Standard Product P Gold Side-Brazed Ceramic DIP
MKJ MIL-M-38510 J Cerdip
MK8 MIL-STD-883B N Epoxy DIP
MKX MIL-Hi-Rel Screening to K Tin-Side-Brazed Ceramic DIP
Customers SCD T Ceramic DIP/Transparent Lid
MKI Ind. Hi-Rel Screening for E Ceramic Leadless Chip Carrier
–40°C to 85°C D Dual Density RAM-PAC
F Flat Pack

Memory Part Number Identification Keys Prefix Device Suffix

Flash EPROM M XX X A B C X X XXX X X
Prefix Revision
M SGS Thomson Blank A Supply
Vcc Range Type
Type
Blank 5V +/- 10% Vcc Size
F 5V +/- 10%
V 3.3V +/- 0.3V X +/- 5% Vcc Erase
Size Speed Organization
1 1 Meg 60 60ns Revision
2 2 Meg 70 70ns
80 80ns Vcc Range
3 3 Meg
8 8 Meg 90 90ns Speed
16 16 Meg 100 100ns
120 120ns Package
Erase 150 150ns Temperature
200 200ns
0 Bulk
1 Top Boot Block Package
2 Bottom Boot Block
4 Sector M PSQ
N TSOP
Organization C/K PLCC
B/P PDIP
0 X8/X16 Selectable
1 X8 Only Temperature
2 X16 Only
1 0 to 70°C
6 -40 to 85°C
3 -40 to 125°C

Memory Part Number Identification Keys Prefix Device Suffix

Flash EPROM 3V and 5V only M XX X XXX X XXX X X
Prefix Vcc Range
M SGS Thomson Blank 5v +/- 10% Vcc Device
X +/- 5% Vcc Family
Device Family
Speed Type
29 Flash
60 60ns Capacity
Type 70 70ns Vcc Range
F 5V single source 80 80ns
V 3.3V single source 90 90ns Speed
120 120ns Package
Package Temperature
M PSO
N TSOP
K PLCC
P PDIP
 Manufacturer Part Number
Device Identification Prefix Suffix

ST Capacity
MICROELECTRONICS 100T (128K x 8, 64K x 16)
Top Block
(continued) Temperature 100B (128K x 8, 64K x 16)
Bottom Block
1 0 to 70°C 200T (256K x 8, 128K x 16)
6 -40 to 85°C Top Block
3 -40 to 125°C 200B (256K x 8, 128K x 16)
Bottom Block
400T (512K x 8, 256K x 16)
Top Block
400B (512K x 8, 256K x 16)
Bottom Block
040 (512K x 8) Sectored
080 (1M x 8) Sectored
016 (2M x 8) Sectored

Memory Part Number Identification Keys Prefix Device Suffix

Serial EEPROM
ST XX XX XX X X X
Prefix Revision
ST SGS Thomson for EEPROMS Blank A, B, C, F Device
Package Family
Device Family
B PDIP 8 Type/
24 12C
25 12C (Low Voltage) M PSO8 Process ID
93 Microwire ML PSO14 Capacity
95 SPI Bus
28 EEPROM Temperature Revision
1 0 to 70°C Package
Type/Process ID 6 –40 to 85°C
3 –40 to 125°C Temperature
C CMOS (EEPROM)
E Extended 12C Bus Capacity
W Write Protect
CS Write Protect (Microwire) 01 1K
P SPI Bus 02 2K
LV Low Voltage (EEPROM) 04 4K
08 8K
16 16K
32 32K
64 64K

SGS-Thomson Microcontroller Part Number Prefix Device Suffix

Version Revision ST 62 T 00 B 6
— ROM (no character) B Plastic DIP
T OTP (PROM) (Dual In-Line Package) SGS
R ROMless D Ceramic DIP Thomson
P Piggyback (Dual In-Line Package)
E EPROM F Frit Seal DIP Family
F Flash Memory (Dual In-Line Package) Version
M Plastic SO
Family (Small Outline Package) Revision
62 General Purpose ST6 Family S Ceramic SO Special
63 Dedicated Video ST6 Family (Small Outline Package) Features
72 ST7 Family C,J Plastic LLCC
90 General Purpose ST9 Family (Leaded Chip Carrier) Temperature
92 Dedicated ST9 Family K LLCC Range
10 ST10 to BIT Family (Leadless Chip Carrier)
20 ST20 32 BIT Family L Ceramic LCC
Q,X Plastic QFP
Temperature Range (Quad Flat Package)
G Ceramic QFP
1.5 0 to +70°C (Consumer) (Quad Flat Package)
2 -40 to +125°C (Automotive)
3 -40 to +105°C (Automotive) R or PGA (Pin Grid Array)
Ceramic PGA
61 -40 to +85°C (Industrial) (Pin Grid Array)
E 55 to +125°C T Thin QFP
(Quad Flat Package)
 Manufacturer Part Number
Device Identification Prefix Suffix

ST INMOS
MICROELECTRONICS Type
1 Static RAM
Option
O Standard
Prefix Device Suffix
(continued) 2 Dynamic RAM I Optional Function IMS 1420 S 45 M
Package
Size (2n) K S Ceramic DIP Company
4 = 16K K Ceramic DIP, Solder Dipped
5 = 32K W Ceramic LCC Type
6 = 64K N Ceramic LCC, Solder Dipped Size
etc… P Plastic DIP
Speed Organization
Organization (2n) Bits 45 — 45ns Access Time Option
0 = x1 55 — 55ns Access Time
1 = x2 12 — 120ns Access Time Package
2 = x4 etc… Speed
etc… Screening
(Blank) Commercial Screening
M MIL-883C
E Extended Temperature
L Low Power