100N10 Etc
100N10 Etc
100N10 Etc
100N10
N-Channel PowerTrench® MOSFET
100V, 75A, 10mΩ
Features
Applications
• RDS(on) = 8.2mΩ ( Typ.)@ VGS = 10V, ID = 75A
DC to DC converters / Synchronous Rectification
• Fast switching speed
TO-220
G D S
S
Thermal Characteristics
Symbol Parameter Ratings Units
RθJC Thermal Resistance, Junction to Case 0.72
RθCS Thermal Resistance, Case to Sink Typ. 0.5 oC/W
1/5
100N10
Electrical Characteristics
Symbol Parameter Test Conditions Min. Typ. Max. Units
Off Characteristics
BVDSS Drain to Source Breakdown Voltage ID = 250µA, VGS = 0V, TJ = 25oC 100 - - V
∆BVDSS Breakdown Voltage Temperature
ID = 250µA, Referenced to 25oC - 0.1 - V/oC
/ ∆TJ Coefficient
VDS = 100V, VGS = 0V - - 1
IDSS Zero Gate Voltage Drain Current µA
VDS = 100V, VGS = 0V, TJ = 150oC - - 500
IGSS Gate to Body Leakage Current VGS = ±20V, VDS = 0V - - ±100 nA
On Characteristics
VGS(th) Gate Threshold Voltage VGS = VDS, ID = 250µA 2.5 - 4.5 V
RDS(on) Static Drain to Source On Resistance VGS = 10V, ID = 75A - 8.2 10 mΩ
gFS Forward Transconductance VDS = 10V, ID = 37.5A (Note 4) - 110 - S
Dynamic Characteristics
Ciss Input Capacitance - 5500 7300 pF
VDS = 25V, VGS = 0V
Coss Output Capacitance - 530 710 pF
f = 1MHz
Crss Reverse Transfer Capacitance - 220 325 pF
Qg(tot) Total Gate Charge at 10V - 76 100 nC
Qgs Gate to Source Gate Charge VDS = 50V, ID = 75A - 30 - nC
VGS = 10V
Qgd Gate to Drain “Miller” Charge (Note 4, 5) - 20 - nC
Switching Characteristics
td(on) Turn-On Delay Time - 70 150 ns
tr Turn-On Rise Time VDD = 50V, ID = 75A - 265 540 ns
td(off) Turn-Off Delay Time VGS = 10V, RGEN = 25Ω - 125 260 ns
tf Turn-Off Fall Time (Note 4, 5) - 115 240 ns
Notes:
1: Repetitive Rating: Pulse width limited by maximum junction temperature
2: L = 0.13mH, IAS = 75A, VDD = 25V, RG = 25Ω, Starting TJ = 25oC
3: ISD ≤ 75A, di/dt ≤ 200A/µs, VDD ≤ BVDSS, Starting TJ = 25oC
4: Pulse Test: Pulse width ≤ 300µs, Duty Cycle ≤ 2%
5: Essentially Independent of Operating Temperature Typical Characteristics
2/5
100N10
6.5 V
ID,Drain Current[A]
100 6.0 V 100
5.5 V o
150 C
o
-55 C
o
10 25 C
10 *Notes: *Notes:
1. 250µs Pulse Test 1. VDS = 20V
o
2. TC = 25 C 2. 250µs Pulse Test
5 1
0.1 1 5 2 4 6 8 10 12
VDS,Drain-Source Voltage[V] VGS,Gate-Source Voltage[V]
0.015
100
RDS(ON) [Ω],
o
150 C
VGS = 10V
0.010
o
25 C
VGS = 20V 10
0.005
*Notes:
1. VGS = 0V
o
*Note: TJ = 25 C 2. 250µs Pulse Test
0.000 1
0 50 100 150 200 250 300 350 0.2 0.4 0.6 0.8 1.0 1.2 1.4
ID, Drain Current [A] VSD, Body Diode Forward Voltage [V]
Crss = Cgd
VDS = 25V
8
6000 Ciss
Capacitances [pF]
*Note: 6
1. VGS = 0V
4000 2. f = 1MHz
Coss
4
2000
Crss 2
*Note: ID = 75A
0 0
0.1 1 10 30 0 15 30 45 60 75 90
VDS, Drain-Source Voltage [V] Qg, Total Gate Charge [nC]
3/5
100N10
2.5
Drain-Source On-Resistance
1.1
BVDSS, [Normalized]
RDS(on), [Normalized]
2.0
1.0 1.5
1.0
0.9
*Notes: 0.5 *Notes:
1. VGS = 0V 1. VGS = 10V
2. ID = 250µA 2. ID = 75A
0.8 0.0
-100 -50 0 50 100 150 200 -100 -50 0 50 100 150 200
o o
TJ, Junction Temperature [ C] TJ, Junction Temperature [ C]
Figure 9. Maximum Safe Operating Area Figure 10. Maximum Drain Current
vs. Case Temperature
500
20µs
100µs 75
100
ID, Drain Current [A]
1ms
ID, Drain Current [A]
10ms
1 *Notes: 25
o
1. TC = 25 C
o
2. TJ = 175 C
3. Single Pulse
0.1
1 10 100 200 0
VDS, Drain-Source Voltage [V] 25 50 75 100 125 o 150 175
TC, Case Temperature [ C]
0.5
Thermal Response [ZθJC]
0.2
0.1
0.1
0.05 PDM
0.02 t1
0.01 t2
0.01
Single pulse
*Notes:
o
1. ZθJC(t) = 0.72 C/W Max.
2. Duty Factor, D=t1/t2
3. TJM - TC = PDM * ZθJC(t)
1E-3
-5 -4 -3 -2 -1 0
10 10 10 10 10 10
Rectangular Pulse Duration [sec]
4/5
100N10
Mechanical Dimensions
TO-220
9.90 ±0.20 4.50 ±0.20
1.30 ±0.10
(8.70)
2.80 ±0.10
(1.70)
+0.10
ø3.60 ±0.10 1.30 –0.05
18.95MAX.
(3.70)
15.90 ±0.20
9.20 ±0.20
(1.46)
(3.00)
(45°
)
(1.00)
13.08 ±0.20
10.08 ±0.30
10.00 ±0.20
5/5