Tmag 5231

TMAG5231
SLYS042D – AUGUST 2021 – REVISED SEPTEMBER 2022
TMAG5231 Low-Power, Hall Effect Switch
1 Features 3 Description
• Low power consumption: The TMAG5231 is a 2nd-generation, low-power Hall-
– 10-Hz versions: 1.3 µA at 3 V effect switch sensor, specifically designed to optimize
– 20-Hz versions: 2 µA at 3 V the total system cost for compact, battery-operated
– 216-Hz versions: 16 µA at 3 V consumer and industrial applications.
• 1.65-V to 5.5-V operating VCC range When the applied magnetic flux density exceeds the
• Magnetic threshold option (typical BOP): operating point (BOP) threshold, the device outputs a
– 1.8 mT with 0.6-mT hysteresis low voltage. The output stays low until the flux density
– 2.85 mT with 1.35-mT hysteresis decreases to less than the release point (BRP), and
– 3 mT with 0.8-mT hysteresis then the device outputs a high voltage. Omnipolar
– 40 mT with 6.5-mT hysteresis magnetic response allows the output to be sensitive
• Omnipolar response to both north and south magnetic fields.
• Push-pull output
• Industry-standard package and pinout The TMAG5231 is able to operate at very low current
– SOT-23 package consumption. To achieve 2 μA of current consumption
– X2SON package the device is internally power cycled at a 20-Hz rate.
• Operating temperature range: –40°C to +125°C The TMAG5231 is available in the industry-standard
package and pinout SOT-23 as well as X2SON.
2 Applications
• Cell phones, laptops, or tablet case sensing The device operates at a VCC range of 1.65 V to 5.5 V
• Electricity meter tamper detection as well as an extended temperature range of –40°C to
• E-locks 125°C.
• Smoke detectors Package Information(1)
• Home appliance open/close detection PART NUMBER PACKAGE BODY SIZE (NOM)
• Medical devices SOT-23 (3) 2.92 mm × 1.30 mm
• IoT systems TMAG5231
X2SON (4) 1.10 mm × 1.40 mm
• Valve and solenoid position detection
• Contactless diagnostics or activation (1) For all available packages, see the orderable addendum at
the end of the data sheet.
VCC
Low-Power
VCC LDO
Oscillator
OUT
Output
X Amp
control
Chopper
stabiliza on
GND
Block Diagram
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
TMAG5231
SLYS042D – AUGUST 2021 – REVISED SEPTEMBER 2022 www.ti.com
Table of Contents
1 Features............................................................................1 8.1 Overview..................................................................... 8
2 Applications..................................................................... 1 8.2 Functional Block Diagram........................................... 8
3 Description.......................................................................1 8.3 Feature Description.....................................................8
4 Revision History.............................................................. 2 8.4 Device Functional Modes..........................................11
5 Device Comparison......................................................... 3 9 Application and Implementation.................................. 12
6 Pin Configuration and Functions...................................3 9.1 Application Information............................................. 12
7 Specifications.................................................................. 4 9.2 Typical Applications.................................................. 14
7.1 Absolute Maximum Ratings........................................ 4 9.3 Power Supply Recommendations.............................19
7.2 ESD Ratings............................................................... 4 9.4 Layout....................................................................... 19
7.3 Recommended Operating Conditions.........................4 10 Device and Documentation Support..........................21
7.4 Thermal Information....................................................4 10.1 Support Resources................................................. 21
7.5 Electrical Characteristics.............................................5 10.2 Trademarks............................................................. 21
7.6 Magnetic Characteristics.............................................5 10.3 Electrostatic Discharge Caution..............................21
7.7 Typical Characteristics................................................ 6 10.4 Glossary..................................................................21
8 Detailed Description........................................................8 11 Mechanical and Packaging Information.................... 21
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision C (June 2022) to Revision D (September 2022) Page

• Changed Device Information table to Package Information .............................................................................. 1
• Changed the package information in Device Comparison table.........................................................................3
• Moved the Power Supply Recommendations and Layout sections to the Application and Implementation
section.............................................................................................................................................................. 19
Changes from Revision B (March 2022) to Revision C (June 2022) Page

• Changed data sheet status from Production Mixed to Production Data............................................................. 1
• Added Additional Magnetic Threshold option to Features section......................................................................1
• Added TMAG5231A1C TMAG5231A2D, and TMAG5231C1D to Device Comparison table.............................3
• Added TMAG5231xxC to Electrical Characteristics table...................................................................................5
• Added TMAG5231Axx to the Magnetic Characteristics table.............................................................................5
Changes from Revision A (November 2021) to Revision B (March 2022) Page

• Changed data sheet status from Production Data to Production Mixed............................................................. 1
• Added Advanced Information DMR (X2SON) package to the data sheet.......................................................... 1
• Changed the Device Comparison table.............................................................................................................. 3
Changes from Revision * (August 2021) to Revision A (November 2021) Page

• Changed data sheet status from Advanced Information to Production Data......................................................1
• Added the FA and FD device versions............................................................................................................... 1
2 Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated
Product Folder Links: TMAG5231

TMAG5231
www.ti.com SLYS042D – AUGUST 2021 – REVISED SEPTEMBER 2022
5 Device Comparison
Table 5-1. Device Comparison
TYPICAL TYPICAL MAGNETIC OUTPUT SENSOR SAMPLING PACKAGES
VERSION
THRESHOLD HYSTERESIS RESPONSE TYPE ORIENTATION RATE AVAILABLE
Omnipolar SOT-23
TMAG5231A1C 1.8 mT 0.6 mT Push-pull Z 10 Hz
active Low X2SON
Omnipolar SOT-23
TMAG5231A2D 1.8 mT 0.6 mT Push-pull Z 20 Hz
active High X2SON
Omnipolar SOT-23
TMAG5231B1D 2.85 mT 1.35 mT Push-pull Z 20 Hz
active Low X2SON
Omnipolar SOT-23
TMAG5231C1D 3 mT 0.8 mT Push-pull Z 20 Hz
active Low X2SON
Omnipolar SOT-23
TMAG5231C1G 3 mT 0.8 mT Push-pull Z 216 Hz
active Low X2SON
Omnipolar SOT-23
TMAG5231H1D 40 mT 6.5 mT Push-pull Z 20 Hz
active Low X2SON
6 Pin Configuration and Functions
GND VCC
1 4
VCC 1
Thermal
3 GND Pad
2 3
OUT 2
NC OUT
Figure 6-2. DMR Package 4-Pin X2SON Top View
Figure 6-1. DBZ Package 3-Pin SOT-23 Top View
Table 6-1. Pin Functions

PIN
I/O DESCRIPTION
NAME SOT-23 (3) X2SON (4)
GND 3 1 — Ground reference
2 3 O Omnipolar output that responds to north and south magnetic
OUT
poles
1 4 — 1.65-V to 5.5-V power supply. TI recommends connecting this pin
VCC
to a ceramic capacitor to ground with a value of at least 0.1 µF.
— 2 — No connect. This pin is not connected to the silicon. It should be
NC left floating or tied to ground. It should be soldered to the board
for mechanical support.
— PAD — No connect. This pin should be left floating or tied to ground. It
Thermal Pad
should be soldered to the board for mechanical support.
Copyright © 2022 Texas Instruments Incorporated Submit Document Feedback 3

TMAG5231
7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
Power Supply Voltage VCC –0.3 5.5
V
Output Pin Voltage OUT GND – 0.3 VCC + 0.3
Output Pin current OUT –5 5 mA
Magnetic Flux Density, BMAX Unlimited T
Junction temperature, TJ Junction temperature, TJ 150 °C
Storage temperature, Tstg –65 150 °C
(1) Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum
Ratings do not imply functional operation of the device at these or any other conditions beyond those listed
under Recommended Operating Conditions. If used outside the Recommended Operating Conditions but within
the Absolute Maximum Ratings, the device may not be fully functional, and this may affect device reliability,
functionality, performance, and shorten the device lifetime.
7.2 ESD Ratings

VALUE UNIT
Human body model (HBM), per ANSI/ESDA/
±5500
JEDEC JS-001, all pins(1)
V(ESD) Electrostatic discharge V
Charged device model (CDM), per ANSI/ESDA/
± 500
JEDEC JS-002, all pins(2)
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
VCC Power supply voltage 1.65 5.5 V
Vo Output voltage 0 5.5 V
Io Output current –5 5 mA
TA Ambient temperature –40 125 °C
7.4 Thermal Information

TMAG5231 TMAG5231
THERMAL METRIC(1) SOT-23 (DBZ) X2SON (DMR) UNIT
3 PINS 4 PINS
RθJA Junction-to-ambient thermal resistance 227.4 218.4
RθJC(top) Junction-to-case (top) thermal resistance 122.7 174.1
RθJB Junction-to-board thermal resistance 61.2 172.4
°C/W
ΨJT Junction-to-top characterization parameter 21.3 11.9
ΨJB Junction-to-board characterization parameter 60.8 167.2
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A 144.9
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.

TMAG5231
7.5 Electrical Characteristics

for VCC = 1.65 V to 5.5 V, over operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
PUSH-PULL OUTPUT DRIVER
VOH High-level output voltage IOUT = -0.5 mA Vcc-0.35 Vcc-0.1 V
VOL Low-level output voltage IOUT = 0.5 mA 0.1 0.3 V
TMAG5231xxG
fs Frequency of magnetic sampling 136 216 374 Hz
ts Period of magnetic sampling 2.67 4.63 7.35 ms
ICC(AVG) Average current consumption Vcc = 3 V over temperature 16 µA
TMAG5231xxD
fs Frequency of magnetic sampling 13 20 29 Hz
ts Period of magnetic sampling 50 ms
ICC(AVG) Average current consumption Vcc = 3 V over temperature 2 3 µA
TMAG5231xxC
fs Frequency of magnetic sampling 7 10 14.5 Hz
ts Period of magnetic sampling 77 100 143 ms
ICC(AVG) Average current consumption Vcc = 3 V over temperature 1.3 µA
ALL VERSIONS
ICC(PK) Peak current consumption 0.8 1.25 2 mA
ICC(SLP) Sleep current consumption 0.8 1.4 µA
tON Power-on time 65 140 425
µs
tACTIVE Active time period 45 60 75
7.6 Magnetic Characteristics

for VCC = 1.65 V to 5.5 V
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
TMAG5231Axx
BOP Magnetic threshold operate point ±0.9 ±1.8 ±2.7 mT
BRP Magnetic release operate point Temperature = 25 °C ±0.3 ±1.2 ±2.2 mT
BHYS Magnetic hysteresis ±0.1 ±0.6 ±1.4 mT
TMAG5231B1D
BOP Magnetic threshold operate point ±1.9 ±2.85 ±3.8
Temperature = 25 °C
BRP Magnetic release operate point ±0.5 ±1.5 ±2.5 mT
BHYS Magnetic hysteresis ±0.5 ±1.35 ±2.2
TMAG5231Cxx
BOP Magnetic threshold operate point ±2 ±3 ±4
TMAG5231H1D
BOP Magnetic threshold operate point ±30 ±40 ±50

TMAG5231
7.7 Typical Characteristics

2.5 2.5
BOPS BOPN BRPS BRPN BOPS BOPN BRPS BRPN
1.5 1.5
Magnetic Threshold (mT)

0.5 0.5
-0.5 -0.5
-1.5 -1.5
-2.5 -2.5
-40 -25 -10 5 20 35 50 65 80 95 110 125 1.65 2.65 3.65 4.65 5.5
Temperature (C) Supply Voltage (V)
VCC = 3 V TA = 25°C
Figure 7-1. 1.8 mT Threshold vs. Temperature Figure 7-2. 1.8 mT Threshold vs. Supply Voltage
5 5
3 3

1 1
-1 -1
-3 -3
-5 -5
-40 -25 -10 5 20 35 50 65 80 95 110 125 1.65 2.65 3.65 4.65 5.5
VCC = 3 V TA = 25°C
5 5
4
3 3
2
1 1
0
-1 -1
-2
-3 -3
-4
-5 -5
-40 -25 -10 5 20 35 50 65 80 95 110 125 1.65 2.65 3.65 4.65 5.5
VCC = 3 V TA = 25°C

TMAG5231
4 4
VCC = 1.65 V VCC = 1.65 V
VCC = 3 V VCC = 3 V
VCC = 5.5 V VCC = 5.5 V
3 3
Supply Current (A)

2 2
1 1
0 0
-40 -25 -10 5 20 35 50 65 80 95 110 125 -40 -25 -10 5 20 35 50 65 80 95 110 125
Temperature (C) Temperature (C)
Magnetic Threshold = 1.8 mT Magnetic Threshold = 1.8 mT

Sampling Rate = 10 Hz Sampling Rate = 20 Hz
Figure 7-7. ICC vs. Temperature Figure 7-8. ICC vs. Temperature
4 4
VCC = 1.65 V VCC = 1.65 V
VCC = 3 V VCC = 3 V
VCC = 5.5 V VCC = 5.5 V
3 3

2 2
1 1
0 0
-40 -25 -10 5 20 35 50 65 80 95 110 125 -40 -25 -10 5 20 35 50 65 80 95 110 125
Temperature (C) Temperature (C)
Magnetic Threshold = 2.85 mT Magnetic Threshold = 3.0 mT

Sampling Rate = 20 Hz Sampling Rate = 20 Hz
Figure 7-9. ICC vs. Temperature Figure 7-10. ICC vs. Temperature
4
VCC = 1.65 V
VCC = 3 V
VCC = 5.5 V
3
0
-40 -25 -10 5 20 35 50 65 80 95 110 125
Temperature (C)
Magnetic Threshold = 3.0 mT
Magnetic Threshold = 40 mT
Sampling Rate = 216 Hz
Sampling Rate = 20 Hz
Figure 7-11. ICC vs. Temperature
Figure 7-12. ICC vs. Temperature

TMAG5231
8 Detailed Description
8.1 Overview
The TMAG5231 device is a magnetic sensor with a digital output that indicates when the magnetic flux density
threshold has been crossed. The output consists of a push-pull turning low when a field is present or turning
high when no field is present. As an omnipolar switch the output is sensitive to both the South and the North
Pole. The device integrates a Hall Effect element, analog signal conditioning, and a low-frequency oscillator
that enables ultra-low average power consumption. To achieve low-power consumption the device periodically
measures magnetic flux density, updates the output, and enters into a low-power sleep state. With a supply
range of 1.65 V to 5.5 V, this device is designed for battery-operated applications.
8.2 Functional Block Diagram
VCC
Low-Power
VCC LDO
Oscillator
OUT
Output
X Amp
control
Chopper
stabiliza on
GND
8.3 Feature Description
8.3.1 Magnetic Flux Direction
Figure 8-1 shows that the TMAG5231 device is sensitive to the magnetic field component that is perpendicular to
the top of the package.
B
SOT-23
X2SON
PCB
Figure 8-1. Direction of Sensitivity
Magnetic flux that travels from the bottom to the top of the package is considered positive in this data sheet. This
condition exists when a south magnetic pole is near the top of the package. Magnetic flux that travels from the
top to the bottom of the package results in negative millitesla values.

TMAG5231
positive B negative B
N S
S N
PCB PCB
Figure 8-2. Flux Direction Polarity
8.3.2 Magnetic Response

The TMAG5231 is an omnipolar switch. Figure 8-3 shows the output responds to both north and south poles.
OUT
BHYS BHYS
VCC
0V
B
north BOP BRP 0 mT BRP BOP south
Figure 8-3. Omnipolar Functionality

TMAG5231
8.3.3 Output Type

The TMAG5231 has a push-pull CMOS output that can drive the output voltage near VCC or ground level.
VCC
Output Output
Control
Figure 8-4. Push-Pull Output (Simplified)
8.3.4 Sampling Rate

When the TMAG5231 powers up, the device measures the first magnetic sample and sets the output within the
tON time. The output is latched, and the device enters an ultra low power sleep state. After each tS time has
passed, the device measures a new sample and updates the output if necessary. If the magnetic field does not
change between periods, the output also does not change.
VCC
1.65 V
tON
time
tACTIVE
ICC tS tS
ICC(PK)
time
Output
VCC
Invalid 1st sample 2nd sample 3rd sample
GND
time
Figure 8-5. Timing Diagram

TMAG5231
8.3.5 Hall Element Location

The sensing element inside the device is in the center of both packages when viewed from the top. Figure 8-6
shows the tolerances and side-view dimensions.
SOT-23
Top View
SOT-23
Side View
centered 650 µm
±70 µm ±80 µm
X2SON
Top View
X2SON
Side View
centered 250 µm
±60 µm ±50 µm
Figure 8-6. Hall Element Location
8.4 Device Functional Modes

The TMAG5231 device has one mode of operation that applies when the Recommended Operating Conditions
are met.

TMAG5231
9 Application and Implementation

Note
Information in the following applications sections is not part of the TI component specification,
and TI does not warrant its accuracy or completeness. TI’s customers are responsible for
determining suitability of components for their purposes, as well as validating and testing their design
implementation to confirm system functionality.
9.1 Application Information

The TMAG5231 device is typically used to detect the proximity of a magnet. The magnet is often attached to a
movable component in the system.
9.1.1 Defining the Design Implementation
The first step of design is identifying your general design implementation, which means you will define whether
you are detecting a magnet sliding past the sensor, moving head-on toward the sensor, or swinging toward the
sensor on a hinge. Figure 9-1 shows examples for each of the aforementioned design implementations.
Figure 9-1. Design Implementations
With each implementation, the objective is to design the system such that the spatial coordinates of the transition
region fall within the spatial coordinates associated with the BOP maximum and BRP minimum specifications.
Figure 9-2 shows a head-on example that shows how the location corresponding to the device BOPMAX
and BRPMIN fall within the desired transition region. To facilitate rapid design iteration, TI’s Magnetic Sensing
Proximity Tool is leveraged in the following design examples.

TMAG5231
Figure 9-2. Head-On Example

TMAG5231
9.2 Typical Applications

9.2.1 Hinge
XZ-Plane Displacement Dimensions
*Dimensions not to scale
XY-Plane Displacement Dimensions

*Magnet offsets when magnet oriented at 0°
Figure 9-3. Typical Application Diagram
9.2.1.1 Design Requirements

Table 9-1 lists the design parameters for this example.
Table 9-1. Design Parameters
DESIGN PARAMETER EXAMPLE VALUE
VCC 3.3 V
Switch Region 5° to 15°
Max Magnet 1/4" ( 6.35 mm)
Max Magnet Width or Length 1" (25.4 mm)
Fixture Width 12" (304.8 mm)
Fixture Length 9" (228.6 mm)
Sensor Distance From Hing Origin 0.23622" (6 mm)
Center Of Magnet Offset From Hinge Origin ≥(6 mm – Magnet Height/2)

TMAG5231
9.2.1.2 Detailed Design Procedure

Due to the complex non-linear behavior magnets and the number of variables that can influence it, some
experimentation is required to solve for a design that will work. This application uses a simple axial, dipole, block
magnet. Other shapes might be considered for different field strengths or prices. A neodymium type of magnet
(N52) is used. At the time of this writing, N52 can be commonly found with heights of 1/16", 1/8", 3/16", and 1/4".
As price often increases with size, the first design attempt will be with a 1/16" thick magnet, which has a width
and length equal to 0.25". Based on the sensor distance from hinge origin and fixture dimension constraints,
there is a lot of flexibility on where the sensor can be placed. Due to other hardware within the fixture, the
TMAG5231B1DQDBZ sensor is placed 8" (203.2 mm) from the origin. From there, the user can assess a design
with the following displacement dimensions.
Figure 9-4 shows that the b-field magnitude for the TMAG5231B1DQDBZ is not adequate for the spatial
constraints of 5° and 15°, as the Bz magnitude only surpasses the BRP minimum. There are a few options
on how to proceed. As the BOP(Max) does not fall within our range,the user must increase field strength. This can
be accomplished with a thicker magnet or by adjusting sensor and magnet z-offsets. The magnet cannot get any
closer due to enclosure constraints, therefore the only option allowed is to increase the magnet thickness. After a
few more iterations with the tool, a 0.25" × 0.25" × 0.25" magnet can work (see Figure 9-5 and Figure 9-6).
9.2.1.3 Application Curves
Figure 9-4. B-Field Hypothesis One Figure 9-5. B-Field Hypothesis Two
Figure 9-6. Thresholds

TMAG5231
9.2.2 Head-On

VCC 3.3 V
Between 10 mm and 30 mm from
Switch Region
sensor fixture Surface
Sensor Distance From Equipment Outer Surface 0.0787" (2 mm)
Magnet Length <1" (25.4 mm)
Magnet Width <1" (25.4 mm)
Magnet Height <1/4" (6.35 mm)
Magnet Type N42

TMAG5231

In this particular case, there are several N42 magnets available from other prior projects. As the desired
transition region is where the magnet surface is at least 12 mm (10 mm + 2 mm) away from the sensor, we try an
initial design with one of our larger magnets (3/8" × 3/16" × 3/16"). Figure 9-8 shows the respective curve for this
magnet along the movement along with the magnetic thresholds of the TMAG5231B1DQDBZ.
While the Bz magnitude adequately exceeds the BOPMAX, it does not quite reach the BRPMIN. Therefore, the user
must make some adjustments so that Bz falls below BRPMIN within the desired operating range. To reduce Bz,
there are a few options. The user can offset the magnet or choose a smaller magnet. After iterating through
increasing x-offsets and y-offsets as well as decreasing magnet thicknesses, the user can eventually find a
solution that works. In this case, a 3/8" × 3/16" × 1/16" N42 magnet with no x or y offset from the sensor center is
used. Figure 9-9 and Figure 9-10 shows the curves corresponding to the final magnet parameters.
9.2.2.3 Application Curve
Figure 9-8. B-Field Hypothesis One Figure 9-9. B-Field Hypothesis Two
Figure 9-10. Thresholds

TMAG5231
9.2.3 Slide-By
*Y-offset when magnet x displacement = 0

VCC 3.3 V
Magnet Range Of Motion <0.433" (11 mm)
Sensor Distance From Equipment Outer Surface >0.236" (6 mm)
Magnet Length <1/2" (12.7 mm)
Magnet Width <1/2" (12.7 mm)
Magnet Height <1/8" (3.175 mm)
Magnet Type N42

TMAG5231

For this particular case involving the TMAG5231B1DQDBZ, the user can arbitrarily start with a 1/8" × 1/8" ×
1/16" magnet, a z-offset of 7 mm (>6 mm), and an initial displacement of one half of the magnet length (1/8"/2
= 1/16") and serendipitously get something that works (see Figure 9-12 and Figure 9-13). Had the B-field not
exceeded BOPMAX, the user could try moving the magnet closer on the z-axis, made the magnet larger, or
changed the magnet to one with higher permeability. Alternatively, if the b-field was too large, the magnet can be
moved further away in each axis or a smaller magnet can be used.
9.2.3.3 Application Curve
Figure 9-12. B-Field Hypothesis Figure 9-13. Thresholds
9.3 Power Supply Recommendations

The TMAG5231 device is powered from 1.65-V to 5.5-V DC power supplies. A decoupling capacitor close to the
device must be used to provide local energy with minimal inductance. TI recommends using a ceramic capacitor
with a value of at least 0.1 µF.
9.4 Layout
9.4.1 Layout Guidelines
Magnetic fields pass through most non-ferromagnetic materials with no significant disturbance. Embedding Hall
effect sensors within plastic or aluminum enclosures and sensing magnets on the outside is common practice.
Magnetic fields also easily pass through most printed circuit boards (PCBs), which makes the placement of the
magnet on the opposite side possible.

TMAG5231
9.4.2 Layout Examples
VCC
GND
OUT
Figure 9-14. SOT-23 Layout Example
GND VCC
Thermal
Pad
NC OUT
Figure 9-15. X2SON Layout Example

TMAG5231
10 Device and Documentation Support

10.1 Support Resources
TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight
from the experts. Search existing answers or ask your own question to get the quick design help you need.
Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do
not necessarily reflect TI's views; see TI's Terms of Use.
10.2 Trademarks
TI E2E™ is a trademark of Texas Instruments.
All trademarks are the property of their respective owners.
10.3 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled
with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric changes could cause the device not to meet its published
specifications.
10.4 Glossary
TI Glossary This glossary lists and explains terms, acronyms, and definitions.
11 Mechanical and Packaging Information

The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

PACKAGE OPTION ADDENDUM
www.ti.com 23-Jun-2023
PACKAGING INFORMATION
Orderable Device Status Package Type Package Pins Package Eco Plan Lead finish/ MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) Ball material (3) (4/5)
(6)
TMAG5231A1CQDBZR ACTIVE SOT-23 DBZ 3 3000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 1A1C Samples
TMAG5231A1CQDMRR ACTIVE X2SON DMR 4 3000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 A1C Samples
TMAG5231A2DQDBZR ACTIVE SOT-23 DBZ 3 3000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 1A2D Samples
TMAG5231A2DQDMRR ACTIVE X2SON DMR 4 3000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 A2D Samples
TMAG5231B1DQDBZR ACTIVE SOT-23 DBZ 3 3000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 1B1D Samples
TMAG5231B1DQDMRR ACTIVE X2SON DMR 4 3000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 B1D Samples
TMAG5231C1DQDBZR ACTIVE SOT-23 DBZ 3 3000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 1C1D Samples
TMAG5231C1DQDMRR ACTIVE X2SON DMR 4 3000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 C1D Samples
TMAG5231C1GQDBZR ACTIVE SOT-23 DBZ 3 3000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 1C1G Samples
TMAG5231C1GQDMRR ACTIVE X2SON DMR 4 3000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 C1G Samples
TMAG5231H1DQDBZR ACTIVE SOT-23 DBZ 3 3000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 1H1D Samples
TMAG5231H1DQDMRR ACTIVE X2SON DMR 4 3000 RoHS & Green SN Level-1-260C-UNLIM -40 to 125 H1D Samples
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com 23-Jun-2023
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com 4-Aug-2023
TAPE AND REEL INFORMATION
REEL DIMENSIONS TAPE DIMENSIONS

K0 P1
B0 W
Reel
Diameter
Cavity A0
A0 Dimension designed to accommodate the component width
B0 Dimension designed to accommodate the component length
K0 Dimension designed to accommodate the component thickness
W Overall width of the carrier tape
P1 Pitch between successive cavity centers
Reel Width (W1)

QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE
Sprocket Holes
Q1 Q2 Q1 Q2
Q3 Q4 Q3 Q4 User Direction of Feed
Pocket Quadrants
*All dimensions are nominal

Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1
Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
TMAG5231A1CQDBZR SOT-23 DBZ 3 3000 178.0 9.0 3.15 2.77 1.22 4.0 8.0 Q3
TMAG5231A1CQDMRR X2SON DMR 4 3000 179.0 8.4 1.27 1.57 0.5 4.0 8.0 Q1
TMAG5231A2DQDBZR SOT-23 DBZ 3 3000 178.0 9.0 3.15 2.77 1.22 4.0 8.0 Q3
TMAG5231A2DQDMRR X2SON DMR 4 3000 179.0 8.4 1.27 1.57 0.5 4.0 8.0 Q1
TMAG5231B1DQDBZR SOT-23 DBZ 3 3000 180.0 8.4 3.2 2.85 1.3 4.0 8.0 Q3
TMAG5231B1DQDMRR X2SON DMR 4 3000 179.0 8.4 1.27 1.57 0.5 4.0 8.0 Q1
TMAG5231C1DQDBZR SOT-23 DBZ 3 3000 178.0 9.0 3.15 2.77 1.22 4.0 8.0 Q3
TMAG5231C1DQDMRR X2SON DMR 4 3000 179.0 8.4 1.27 1.57 0.5 4.0 8.0 Q1
TMAG5231C1GQDBZR SOT-23 DBZ 3 3000 178.0 9.0 3.15 2.77 1.22 4.0 8.0 Q3
TMAG5231C1GQDMRR X2SON DMR 4 3000 179.0 8.4 1.27 1.57 0.5 4.0 8.0 Q1
TMAG5231H1DQDBZR SOT-23 DBZ 3 3000 178.0 9.0 3.15 2.77 1.22 4.0 8.0 Q3
TMAG5231H1DQDMRR X2SON DMR 4 3000 179.0 8.4 1.27 1.57 0.5 4.0 8.0 Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com 4-Aug-2023
TAPE AND REEL BOX DIMENSIONS
Width (mm)
H
W
*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
TMAG5231A1CQDBZR SOT-23 DBZ 3 3000 180.0 180.0 18.0
TMAG5231A1CQDMRR X2SON DMR 4 3000 200.0 183.0 25.0
TMAG5231A2DQDBZR SOT-23 DBZ 3 3000 180.0 180.0 18.0
TMAG5231A2DQDMRR X2SON DMR 4 3000 200.0 183.0 25.0
TMAG5231B1DQDBZR SOT-23 DBZ 3 3000 210.0 185.0 35.0
TMAG5231B1DQDMRR X2SON DMR 4 3000 200.0 183.0 25.0
TMAG5231C1DQDBZR SOT-23 DBZ 3 3000 180.0 180.0 18.0
TMAG5231C1DQDMRR X2SON DMR 4 3000 200.0 183.0 25.0
TMAG5231C1GQDBZR SOT-23 DBZ 3 3000 180.0 180.0 18.0
TMAG5231C1GQDMRR X2SON DMR 4 3000 200.0 183.0 25.0
TMAG5231H1DQDBZR SOT-23 DBZ 3 3000 180.0 180.0 18.0
TMAG5231H1DQDMRR X2SON DMR 4 3000 200.0 183.0 25.0
Pack Materials-Page 2
GENERIC PACKAGE VIEW
DMR 4 X2SON - 0.4 mm max height
1.1 x 1.4, 0.5 mm pitch PLASTIC SMALL OUTLINE - NO LEAD
This image is a representation of the package family, actual package may vary.
Refer to the product data sheet for package details.
4229480/A
www.ti.com
PACKAGE OUTLINE
DMR0004A SCALE 9.000
X2SON - 0.4 mm max height
PLASTIC SMALL OUTLINE - NO LEAD
1.15 A
B
1.05
PIN 1 INDEX AREA
1.45
1.35
(0.13) TYP
C
0.4 MAX
SEATING PLANE
0.05 NOTE 4
0.00 0.08 C
2X 0.5
SYMM
2 3
NOTE 4
EXPOSED
THERMAL PAD
5 SYMM
0.6 0.1
0.25
4X
PIN 1 ID 0.15
(OPTIONAL)
1 4
0.27
4X
0.17
0.8 0.1 0.1 C B A
0.05 C
4222825/B 05/2022
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.
4. Quantity and shape of side wall metal may vary.
www.ti.com
EXAMPLE BOARD LAYOUT
DMR0004A X2SON - 0.4 mm max height
2X (0.5)
4X (0.22)
(R0.05) TYP
1 4
4X (0.4)
5
SYMM
(0.6)
(1.4)
( 0.2) VIA
2 3
SYMM
(0.8)
LAND PATTERN EXAMPLE

SCALE:35X
0.05 MAX 0.05 MIN

ALL AROUND ALL AROUND
METAL SOLDER MASK
OPENING
SOLDER MASK
OPENING METAL UNDER
SOLDER MASK
NON SOLDER MASK SOLDER MASK
DEFINED DEFINED
(PREFERRED)
SOLDER MASK DETAILS
4222825/B 05/2022
NOTES: (continued)
5. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature
number SLUA271 (www.ti.com/lit/slua271).
6. Vias are optional depending on application, refer to device data sheet. If all or some are implemented, recommended via locations are shown.
It is recommended that vias under paste be filled, plugged or tented.
www.ti.com
EXAMPLE STENCIL DESIGN
DMR0004A X2SON - 0.4 mm max height
2X (0.5)
4X (0.22)
(R0.05) TYP
1 4
4X (0.4)
5
SYMM
(0.57)
(1.4)
METAL
TYP
2 3
SYMM
(0.76)
SOLDER PASTE EXAMPLE

BASED ON 0.1 mm THICK STENCIL
EXPOSED PAD 5:
90% PRINTED SOLDER COVERAGE BY AREA
SCALE:50X
4222825/B 05/2022
NOTES: (continued)
7. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
www.ti.com
PACKAGE OUTLINE
DBZ0003A SCALE 4.000
SOT-23 - 1.12 mm max height
SMALL OUTLINE TRANSISTOR
2.64 C
2.10
1.12 MAX
1.4
B A
1.2 0.1 C
PIN 1
INDEX AREA
0.95 (0.125)
3.04
1.9 2.80
3
(0.15)
NOTE 4
2
0.5
3X
0.3
0.10
0.2 C A B (0.95) TYP
0.01
0.25
GAGE PLANE 0.20
TYP
0.08
0.6
TYP SEATING PLANE
0 -8 TYP 0.2
4214838/D 03/2023
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Reference JEDEC registration TO-236, except minimum foot length.
4. Support pin may differ or may not be present.
www.ti.com
EXAMPLE BOARD LAYOUT
DBZ0003A SOT-23 - 1.12 mm max height
PKG
3X (1.3)
1
3X (0.6)
SYMM
3
2X (0.95)
(R0.05) TYP
(2.1)
LAND PATTERN EXAMPLE

SCALE:15X
SOLDER MASK
SOLDER MASK METAL METAL UNDER OPENING
OPENING SOLDER MASK
0.07 MAX 0.07 MIN

ALL AROUND ALL AROUND
NON SOLDER MASK SOLDER MASK

DEFINED DEFINED
(PREFERRED)
SOLDER MASK DETAILS
4214838/D 03/2023
NOTES: (continued)
4. Publication IPC-7351 may have alternate designs.

5. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
www.ti.com
EXAMPLE STENCIL DESIGN
DBZ0003A SOT-23 - 1.12 mm max height
PKG
3X (1.3)
1
3X (0.6)
SYMM
3
2X(0.95)
(R0.05) TYP
(2.1)
SOLDER PASTE EXAMPLE

BASED ON 0.125 THICK STENCIL
SCALE:15X
4214838/D 03/2023
NOTES: (continued)
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
7. Board assembly site may have different recommendations for stencil design.
www.ti.com
IMPORTANT NOTICE AND DISCLAIMER
TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATA SHEETS), DESIGN RESOURCES (INCLUDING REFERENCE
DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS”
AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY
IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD
PARTY INTELLECTUAL PROPERTY RIGHTS.
These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate
TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable
standards, and any other safety, security, regulatory or other requirements.
These resources are subject to change without notice. TI grants you permission to use these resources only for development of an
application that uses the TI products described in the resource. Other reproduction and display of these resources is prohibited. No license
is granted to any other TI intellectual property right or to any third party intellectual property right. TI disclaims responsibility for, and you
will fully indemnify TI and its representatives against, any claims, damages, costs, losses, and liabilities arising out of your use of these
resources.
TI’s products are provided subject to TI’s Terms of Sale or other applicable terms available either on ti.com or provided in conjunction with
such TI products. TI’s provision of these resources does not expand or otherwise alter TI’s applicable warranties or warranty disclaimers for
TI products.
TI objects to and rejects any additional or different terms you may have proposed. IMPORTANT NOTICE
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2023, Texas Instruments Incorporated

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TMAG5231

SLYS042D – AUGUST 2021 – REVISED SEPTEMBER 2022

TMAG5231 Low-Power, Hall Effect Switch

Changes from Revision C (June 2022) to Revision D (September 2022) Page

Changes from Revision B (March 2022) to Revision C (June 2022) Page

Changes from Revision A (November 2021) to Revision B (March 2022) Page

Changes from Revision * (August 2021) to Revision A (November 2021) Page

2 Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated

Product Folder Links: TMAG5231

6 Pin Configuration and Functions

Table 6-1. Pin Functions

Copyright © 2022 Texas Instruments Incorporated Submit Document Feedback 3

7.2 ESD Ratings

7.3 Recommended Operating Conditions

7.4 Thermal Information

4 Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated

Product Folder Links: TMAG5231

7.5 Electrical Characteristics

7.6 Magnetic Characteristics

Copyright © 2022 Texas Instruments Incorporated Submit Document Feedback 5

7.7 Typical Characteristics

Magnetic Threshold (mT)

Magnetic Threshold (mT)

6 Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated

Product Folder Links: TMAG5231

Supply Current (A)

Magnetic Threshold = 1.8 mT Magnetic Threshold = 1.8 mT

Supply Current (A)

Magnetic Threshold = 2.85 mT Magnetic Threshold = 3.0 mT

Copyright © 2022 Texas Instruments Incorporated Submit Document Feedback 7

Figure 8-1. Direction of Sensitivity

8 Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated

Product Folder Links: TMAG5231

Figure 8-2. Flux Direction Polarity

8.3.2 Magnetic Response

Copyright © 2022 Texas Instruments Incorporated Submit Document Feedback 9

8.3.3 Output Type

Figure 8-4. Push-Pull Output (Simplified)

8.3.4 Sampling Rate

Invalid 1st sample 2nd sample 3rd sample

10 Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated

Product Folder Links: TMAG5231

8.3.5 Hall Element Location

Figure 8-6. Hall Element Location

8.4 Device Functional Modes

Copyright © 2022 Texas Instruments Incorporated Submit Document Feedback 11

9 Application and Implementation

9.1 Application Information

Figure 9-1. Design Implementations

12 Submit Document Feedback Copyright © 2022 Texas Instruments Incorporated

Product Folder Links: TMAG5231

Figure 9-2. Head-On Example

Copyright © 2022 Texas Instruments Incorporated Submit Document Feedback 13

9.2 Typical Applications

XZ-Plane Displacement Dimensions

*Dimensions not to scale

XY-Plane Displacement Dimensions

*Dimensions not to scale

Figure 9-3. Typical Application Diagram