Texas Instruments BQ27441DRZR G1A - C473397

Product Sample & Technical Tools & Support &
Folder Buy Documents Software Community
bq27441-G1
SLUSBH1C – NOVEMBER 2013 – REVISED DECEMBER 2014
bq27441-G1 System-Side Impedance Track™ Fuel Gauge

1 Features 2 Applications
1• Single Series Cell Li-Ion Battery Fuel Gauge • Smartphones, Feature Phones, and Tablets
– Resides on System Board • Digital Still and Video Cameras
– Supports Embedded or Removable Batteries • Handheld Terminals
– Powered Directly from Battery with Integrated • MP3 or Multimedia Players
LDO
– Supports a Low-Value External Sense Resistor 3 Description
(10 mΩ) The Texas Instruments bq27441-G1 fuel gauge is a
microcontroller peripheral that provides system-side
• Battery Fuel Gauging Based on Patented
fuel gauging for single-cell Li-Ion batteries. The
Impedance Track™ Technology device requires minimal user configuration and
– Reports Remaining Capacity and State-of- system microcontroller firmware development.
Charge (SOC) with Smoothing Filter
The bq27441-G1 battery fuel gauge uses the
– Automatically Adjusts for Battery Aging, Self- patented Impedance Track™ algorithm for fuel
discharge, Temperature, and Rate Changes gauging, and provides information such as remaining
– Battery State-of-Health (Aging) Estimation battery capacity (mAh), state-of-charge (%), and
• Microcontroller Peripheral Supports: battery voltage (mV).
– 400-kHz I2C Serial Interface Battery fuel gauging with the bq27441-G1 fuel gauge
requires connections only to PACK+ (P+) and PACK–
– Configurable SOC Interrupt or
(P–) for a removable battery pack or embedded
Battery Low Digital Output Warning battery circuit. The tiny, 12-pin, 2.50 mm × 4.00 mm,
– Internal Temperature Sensor or small outline no-lead (SON) package is ideal for
Host-Reported Temperature space-constrained applications.
Device Information (1)

PART NUMBER PACKAGE BODY SIZE (NOM)
bq27441-G1 VSON (12) 2.50 mm × 4.00 mm
(1) For all available packages, see the orderable addendum at

the end of the datasheet.
4 Simplified Schematic
SCL SRN VSYS

I 2C Coulomb
Bus SDA
Counter
SRP
CPU Battery Pack
GPOUT
ADC BAT PACKP
BIN
Li -Ion
Cell
T Protection
VDD 1 µF IC
1.8 V 0.47 µF
LDO
VSS PACKN NFET NFET
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
bq27441-G1
SLUSBH1C – NOVEMBER 2013 – REVISED DECEMBER 2014 www.ti.com
Table of Contents
1 Features .................................................................. 1 8.12 SHUTDOWN and WAKE-UP Timing ...................... 9
2 Applications ........................................................... 1 8.13 Typical Characteristics ............................................ 9
3 Description ............................................................. 1 9 Detailed Description ............................................ 10
4 Simplified Schematic............................................. 1 9.1 Overview ................................................................. 10
9.2 Functional Block Diagram ....................................... 10
5 Revision History..................................................... 2
9.3 Feature Description................................................. 10
6 Device Comparison Table..................................... 3
9.4 Device Functional Modes........................................ 11
7 Pin Configuration and Functions ......................... 4
9.5 Programming........................................................... 11
8 Specifications......................................................... 5
10 Application and Implementation........................ 15
8.1 Absolute Maximum Ratings ...................................... 5
10.1 Application Information.......................................... 15
8.2 ESD Ratings.............................................................. 5
10.2 Typical Applications .............................................. 15
8.3 Recommended Operating Conditions...................... 5
11 Power Supply Recommendation ....................... 18
8.4 Thermal Information .................................................. 5
11.1 Power Supply Decoupling ..................................... 18
8.5 Supply Current ......................................................... 6
8.6 Digital Input and Output DC Characteristics ............ 6 12 Layout................................................................... 18
12.1 Layout Guidelines ................................................. 18
8.7 LDO Regulator, Wake-up, and Auto-Shutdown DC
Characteristics ........................................................... 7 12.2 Layout Example .................................................... 19
8.8 LDO Regulator, Wake-up, and Auto-shutdown AC 13 Device and Documentation Support ................. 20
Characteristics ........................................................... 7 13.1 Documentation Support ........................................ 20
8.9 ADC (Temperature and Cell Measurement) 13.2 Trademarks ........................................................... 20
Characteristics ........................................................... 7 13.3 Electrostatic Discharge Caution ............................ 20
8.10 Integrating ADC (Coulomb Counter) Characteristics 13.4 Glossary ................................................................ 20
................................................................................... 7
8.11 I2C-Compatible Interface Communication Timing
14 Mechanical, Packaging, and Orderable
Characteristics ........................................................... 8 Information ........................................................... 20
5 Revision History
Changes from Revision B (August 2014) to Revision C Page
• Changed simplified schematic by adding two 1 µF capacitors ............................................................................................. 1

• Added description for connecting 1-µF capacitor .................................................................................................................. 4
• Added information for connecting GPOUT ............................................................................................................................ 4
• Changed Handling Ratings to ESD Ratings........................................................................................................................... 5
• Changed connection description for BAT pin ...................................................................................................................... 18
• Changed recommend to required......................................................................................................................................... 18
• Added arrow to C BAT from text............................................................................................................................................. 19
Changes from Revision A (January 2014) to Revision B Page
• Added Handling Ratings table, Feature Description section, Device Functional Modes, Application and
Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation
Support section, and Mechanical, Packaging, and Orderable Information section ............................................................... 1
• Changed LiMnO4 to LiCoO2.................................................................................................................................................... 4
• Updated BAT pin description ................................................................................................................................................. 4
• Updated BIN pin description .................................................................................................................................................. 4
• Updated GPOUT pin description ........................................................................................................................................... 4
• Updated SRN and SRP pin descriptions................................................................................................................................ 4
• Changed the Ilkg parameters .................................................................................................................................................. 6
2 Submit Documentation Feedback Copyright © 2013–2014, Texas Instruments Incorporated
Product Folder Links: bq27441-G1

bq27441-G1
www.ti.com SLUSBH1C – NOVEMBER 2013 – REVISED DECEMBER 2014
Changes from Original (November 2013) to Revision A Page
• Changed the device status from Product Preview to Production Data .................................................................................. 1
6 Device Comparison Table
(1) (2) FIRMWARE

PART NUMBER BATTERY TYPE CHEM_ID DM_CODE
VERSION (3)
bq27441DRZR-G1A LiCoO2
0x0128 0x48
bq27441DRZT-G1A (4.2 V maximum charge)
1.09
bq27441DRZR-G1B (0x0109)
LiCoO2
0x0312 0x58
bq27441DRZT-G1B (4.3 to 4.35 V maximum charge)
(1) See the CHEM_ID subcommand to confirm the battery chemistry type.
(2) See the DM_CODE subcommand to confirm the Data Memory code.
(3) See the FW_VERSION subcommand to confirm the firmware version.
Copyright © 2013–2014, Texas Instruments Incorporated Submit Documentation Feedback 3

bq27441-G1
7 Pin Configuration and Functions
GPOUT
BIN
Pin Functions
PIN
TYPE (1) DESCRIPTION
NAME NUMBER
LDO regulator input and battery voltage measurement input. Kelvin sense connect to positive
BAT 6 PI, AI battery terminal (PACKP). Connect a capacitor (1 µF) between BAT and VSS. Place the capacitor
close to the gauge.
Battery insertion detection input. If OpConfig [BI_PU_EN] = 1 (default), a logic low on the pin is
detected as battery insertion. For a removable pack, the BIN pin can be connected to VSS
through a pulldown resistor on the pack, typically the 10-kΩ thermistor; the system board should
use a 1.8-MΩ pullup resistor to VDD to ensure the BIN pin is high when a battery is removed. If
the battery is embedded in the system, it is recommended to leave [BI_PU_EN] = 1 and use a
BIN 10 DI
10-kΩ pulldown resistor from BIN to VSS. If [BI_PU_EN] = 0, then the host must inform the gauge
of battery insertion and removal with the BAT_INSERT and BAT_REMOVE subcommands. A 10-
kΩ pulldown resistor should be placed between BIN and VSS, even if this pin is unused.
NOTE: The BIN pin must not be shorted directly to VCC or VSS and any pullup resistor on the BIN
pin must be connected only to VDD and not an external voltage rail.
This open-drain output can be configured to indicate BAT_LOW when the OpConfig
[BATLOWEN] bit is set. By default [BATLOWEN] is cleared and this pin performs an interrupt
function (SOC_INT) by pulsing for specific events, such as a change in state-of-charge. Signal
GPOUT 12 DO polarity for these functions is controlled by the [GPIOPOL] configuration bit. This pin should not
be left floating, even if unused; therefore, a 10-kΩ pullup resistor is recommended. If the device
is in shutdown mode, then toggling GPOUT will make the gauge exit shutdown. Therefore, it is
recommended to connect GPOUT to a GPIO of the host MCU.
NC 4, 9, 11 — No internal connection. May be left floating or tied to VSS.
SCL 2 DIO Slave I2C serial bus for communication with system (Master). Open-drain pins. Use with external
10-kΩ pullup resistors (typical) for each pin. If the external pullup resistors will be disconnected
SDA 1 DIO from these pins during normal operation, recommend using external 1-MΩ pulldown resistors to
VSS at each pin to avoid floating inputs.
SRN 7 AI Coulomb counter differential inputs expecting an external 10 mΩ, 1% sense resistor in the high-
side current path. Kelvin sense connect SRP to the positive battery terminal (PACKP) side of the
external sense resistor. Kelvin sense connect SRN to the other side of the external sense
SRP 8 AI resistor, the positive connection to the system (VSYS). See the Simplified Schematic. No
calibration is required. The fuel gauge is pre-calibrated for a standard 10 mΩ, 1% sense resistor.
1.8-V regulator output. Decouple with 0.47-μF ceramic capacitor to VSS. This pin is not intended
VDD 5 PO
to provide power for other devices in the system.
VSS 3 PI Ground pin
(1) IO = Digital input-output, AI = Analog input, P = Power connection

bq27441-G1
8 Specifications
8.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) (1)
MIN MAX UNIT
VBAT BAT pin input voltage range –0.3 6 V
SRP and SRN pins input voltage range –0.3 VBAT + 0.3 V
VSR
Differential voltage across SRP and SRN. ABS(SRP – SRN) 2 V
VDD VDD pin supply voltage range (LDO output) –0.3 2 V
VIOD Open-drain IO pins (SDA, SCL) –0.3 6 V
VIOPP Push-pull IO pins (BIN) –0.3 VDD + 0.3 V
TA Operating free-air temperature range –40 85 °C
Storage temperature, Tstg –65 150 °C
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
8.2 ESD Ratings

VALUE UNIT
(1)
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001 ±1500
V(ESD) Electrostatic discharge Charged-device model (CDM), per JEDEC specification JESD22- V
±250
C101 (2)
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
8.3 Recommended Operating Conditions

TA = 30°C and VREGIN = VBAT = 3.6 V (unless otherwise noted)
MIN TYP MAX UNIT
(1) External input capacitor for internal LDO
CBAT Nominal capacitor values specified. 0.1 μF
between BAT and VSS
Recommend a 5% ceramic X5R-type
External output capacitor for internal LDO capacitor located close to the device.
CLDO18 (1) 0.47 μF
between VDD and VSS
External pullup voltage for open-drain
VPU (1) 1.62 3.6 V
pins (SDA, SCL, GPOUT)
(1) Specified by design. Not production tested.
8.4 Thermal Information

THERMAL METRIC DRZ (12 PINS) UNIT
RθJA Junction-to-ambient thermal resistance 64.1
RθJCtop Junction-to-case (top) thermal resistance 59.8
RθJB Junction-to-board thermal resistance 52.7
°C/W
ψJT Junction-to-top characterization parameter 0.3
ψJB Junction-to-board characterization parameter 28.3
RθJCbot Junction-to-case (bottom) thermal resistance 2.4

bq27441-G1
8.5 Supply Current

TA = 30°C and VREGIN = VBAT = 3.6V (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
(1) (2)
ICC NORMAL mode current ILOAD > Sleep Current 93 μA
ISLP (1) SLEEP mode current ILOAD < Sleep Current (2) 21 μA
IHIB (1) HIBERNATE mode current ILOAD < Hibernate Current (2) 9 μA
Fuel gauge in host commanded
ISD (1) SHUTDOWN mode current SHUTDOWN mode. 0.6 μA
(LDO regulator output disabled)

(2) Wake Comparator Disabled.
8.6 Digital Input and Output DC Characteristics

TA = –40°C to 85°C, typical values at TA = 30°C and VREGIN = 3.6 V (unless otherwise noted)(Force Note1) (1)
VIH(OD) Input voltage, high (2) External pullup resistor to VPU VPU × 0.7 V
(3)
VIH(PP) Input voltage, high 1.4 V
VIL Input voltage, low (2) (3)
0.6 V
VOL Output voltage, low (2) 0.6 V
IOH Output source current, high (2) 0.5 mA
IOL(OD) Output sink current, low (2) –3 mA
(1)
CIN Input capacitance (2) (3) 5 pF
Input leakage current
0.1
Ilkg (SCL, SDA, BIN) μA
Input leakage current (GPOUT) 1

(2) Open Drain pins: (SCL, SDA, GPOUT)
(3) Push-Pull pin: (BIN)

bq27441-G1
8.7 LDO Regulator, Wake-up, and Auto-Shutdown DC Characteristics

TA = –40°C to 85°C, typical values at TA = 30°C and VREGIN = 3.6 V (unless otherwise noted)(Force Note1) (1)
VBAT BAT pin regulator input 2.45 4.5 V
VDD Regulator output voltage 1.8 V
VBAT undervoltage lock-out
UVLOIT+ 2 V
LDO wake-up rising threshold
VBAT undervoltage lock-out
UVLOIT– 1.95 V
LDO auto-shutdown falling threshold
GPOUT (input) LDO Wake-up rising LDO Wake-up from SHUTDOWN
VWU+ (1) 1.2 V
edge threshold (2) mode

(2) If the device is commanded to SHUTDOWN via I2C with VBAT > UVLOIT+, a wake-up rising edge trigger is required on GPOUT.
8.8 LDO Regulator, Wake-up, and Auto-shutdown AC Characteristics

TA = –40°C to 85°C, typical values at TA = 30°C and VREGIN = 3.6 V (unless otherwise noted)
(1) Time delay from SHUTDOWN
tSHDN SHUTDOWN entry time 250 ms
command to LDO output disable.
Minimum low time of GPOUT (input)
tSHUP (1) SHUTDOWN GPOUT low time 10 μs
in SHUTDOWN before WAKEUP
(1)
tVDD Initial VDD output delay 13 ms
Time delay from rising edge of
tWUVDD (1) Wake-up VDD output delay GPOUT (input) to nominal VDD 8 ms
output.
Time delay from rising edge of
tPUCD Power-up communication delay REGIN to the Active state. Includes 250 ms
firmware initialization time.
8.9 ADC (Temperature and Cell Measurement) Characteristics

TA = –40°C to 85°C; typical values at TA = 30°C and VREGIN = 3.6 V (unless otherwise noted) (Force Note1) (1)
VIN(BAT) BAT pin voltage measurement range Voltage divider enabled 2.45 4.5 V
tADC_CONV Conversion time 125 ms
Effective resolution 15 bits
(1) Specified by design. Not tested in production.
8.10 Integrating ADC (Coulomb Counter) Characteristics

TA = –40°C to 85°C; typical values at TA = 30°C and VREGIN = 3.6 V (unless otherwise noted)(Force Note1) (1)
VSR Input voltage range from BAT to BAT ± 25 mV
SRX pins
tSR_CONV Conversion time Single conversion 1 s
Effective Resolution Single conversion 16 bits
(1) Specified by design. Not tested in production.

bq27441-G1
8.11 I2C-Compatible Interface Communication Timing Characteristics

TA = –40°C to 85°C; typical values at TA = 30°C and VREGIN = 3.6 V (unless otherwise noted) (Force Note1) (1)
MIN TYP MAX UNIT
Standard Mode (100 kHz)
td(STA) Start to first falling edge of SCL 4 μs
tw(L) SCL pulse duration (low) 4.7 μs
tw(H) SCL pulse duration (high) 4 μs
tsu(STA) Setup for repeated start 4.7 μs
tsu(DAT) Data setup time Host drives SDA 250 ns
th(DAT) Data hold time Host drives SDA 0 ns
tsu(STOP) Setup time for stop 4 μs
t(BUF) Bus free time between stop and start Includes Command Waiting Time 66 μs
tf SCL or SDA fall time (1) 300 ns
(1)
tr SCL or SDA rise time 300 ns
fSCL Clock frequency (2) 100 kHz
Fast Mode (400 kHz)
td(STA) Start to first falling edge of SCL 600 ns
tw(L) SCL pulse duration (low) 1300 ns
tw(H) SCL pulse duration (high) 600 ns
tsu(STA) Setup for repeated start 600 ns
tsu(DAT) Data setup time Host drives SDA 100 ns
th(DAT) Data hold time Host drives SDA 0 ns
tsu(STOP) Setup time for stop 600 ns
t(BUF) Bus free time between stop and start Includes Command Waiting Time 66 μs
tf SCL or SDA fall time (1) 300 ns
tr SCL or SDA rise time (1) 300 ns
fSCL Clock frequency (2) 400 kHz

(2) If the clock frequency (fSCL) is > 100 kHz, use 1-byte write commands for proper operation. All other transactions types are supported at
400 kHz. (See I2C Interface and I2C Command Waiting Time.)
tSU(STA) tw(H) tw(L) tf tr t(BUF)
SCL
SDA
td(STA) tf tsu(STOP)
tr
th(DAT) tsu(DAT)
REPEATED STOP START

START
Figure 1. I2C-Compatible Interface Timing Diagrams

bq27441-G1
8.12 SHUTDOWN and WAKE-UP Timing
tPUCD tSHUP tPUCD

tVDD tSHDN tWUVDD
REGIN
VDD
I2C Bus SHUTDOWN_

ENABLE
SHUTDOWN
*
GPOUT
State Off WAKE-UP Active SHUTDOWN WAKE-UP Active
* GPOUT is configured as an input for wake-up signaling.
Figure 2. SHUTDOWN and WAKE-UP Timing Diagram
8.13 Typical Characteristics
0.14 10
0.12
5
0.1
Temperature Accuracy Error(%)
Voltage Accuracy Error (%)
0.08
-5
0.06
-10
0.04
0.02 -15
-40 -20 0 20 40 60 80 100 -40 -20 0 20 40 60 80 100
Temperature (°C) Temperature (°C)
Figure 3. Voltage Accuracy Figure 4. Temperature Accuracy

0
-0.1
-0.2
Current Accuracy Error (%)
-0.3
-0.4
-0.5
-0.6
-40 -20 0 20 40 60 80 100
Temperature (°C)
Figure 5. Current Accuracy

bq27441-G1
9 Detailed Description
9.1 Overview
The fuel gauge accurately predicts the battery capacity and other operational characteristics of a single Li-based
rechargeable cell. It can be interrogated by a system processor to provide cell information, such as state-of-
charge (SoC).
NOTE
The following formatting conventions are used in this document:
Commands: italics with parentheses() and no breaking spaces, for example, Control().
Data Flash: italics, bold, and breaking spaces, for example, Design Capacity.
Register bits and flags: italics with brackets [ ], for example, [TDA]
Data flash bits: italics, bold, and brackets [ ], for example, [LED1]
Modes and states: ALL CAPITALS, for example, UNSEALED mode.
9.2 Functional Block Diagram
SCL SRN VSYS

I 2C Coulomb
Bus SDA
Counter
SRP
CPU Battery Pack
GPOUT
ADC BAT PACKP
BIN
Li -Ion
Cell
T Protection
VDD 1 µF IC
1.8 V 0.47 µF
LDO
VSS PACKN NFET NFET
9.3 Feature Description

Information is accessed through a series of commands, called Standard Commands. Further capabilities are
provided by the additional Extended Commands set. Both sets of commands, indicated by the general format
Command), are used to read and write information contained within the control and status registers, as well as its
data locations. Commands are sent from system to gauge using the I2C serial communications engine, and can
be executed during application development, system manufacture, or end-equipment operation.
The key to the high-accuracy gas gauging prediction is Texas Instruments proprietary Impedance Track™
algorithm. This algorithm uses cell measurements, characteristics, and properties to create state-of-charge
predictions that can achieve high accuracy across a wide variety of operating conditions and over the lifetime of
the battery.
The fuel gauge measures the charging and discharging of the battery by monitoring the voltage across a small-
value sense resistor. When a cell is attached to the fuel gauge, cell impedance is computed based on cell
current, cell open-circuit voltage (OCV), and cell voltage under loading conditions.
The fuel gauge uses an integrated temperature sensor for estimating cell temperature. Alternatively, the host
processor can provide temperature data for the fuel gauge.
More details are found in the bq27441-G1 Technical Reference Manual (SLUUAC9).

bq27441-G1
9.4 Device Functional Modes

To minimize power consumption, the fuel gauge has several power modes: INITIALIZATION, NORMAL, SLEEP,
and HIBERNATE. The fuel gauge passes automatically between these modes, depending upon the occurrence
of specific events, though a system processor can initiate some of these modes directly. More details are found
in the bq27441-G1 Technical Reference Manual (SLUUAC9).
9.5 Programming
9.5.1 Standard Data Commands
The fuel gauge uses a series of 2-byte standard commands to enable system reading and writing of battery
information. Each standard command has an associated command-code pair, as indicated in Table 1. Because
each command consists of two bytes of data, two consecutive I2C transmissions must be executed both to
initiate the command function, and to read or write the corresponding two bytes of data. Additional details are
found in the bq27441-G1 Technical Reference Manual (SLUUAC9).
Table 1. Standard Commands

NAME COMMAND UNIT SEALED ACCESS
CODE
Control() CNTL 0x00 and 0x01 NA RW
Temperature() TEMP 0x02 and 0x03 0.1°K RW
Voltage() VOLT 0x04 and 0x05 mV R
Flags() FLAGS 0x06 and 0x07 NA R
NominalAvailableCapacity() 0x08 and 0x09 mAh R
FullAvailableCapacity() 0x0A and 0x0B mAh R
RemainingCapacity() RM 0x0C and 0x0D mAh R
FullChargeCapacity() FCC 0x0E and 0x0F mAh R
AverageCurrent() 0x10 and 0x11 mA R
StandbyCurrent() 0x12 and 0x13 mA R
MaxLoadCurrent() 0x14 and 0x15 mA R
AveragePower() 0x18 and 0x19 mW R
StateOfCharge() SOC 0x1C and 0x1D % R
InternalTemperature() 0x1E and 0x1F 0.1°K R
StateOfHealth() SOH 0x20 and 0x21 num / % R
RemainingCapacityUnfiltered() 0x28 and 0x29 mAh R
RemainingCapacityFiltered() 0x2A and 0x2B mAh R
FullChargeCapacityUnfiltered() 0x2C and 0x2D mAh R
FullChargeCapacityFiltered() 0x2E and 0x2F mAh R
StateOfChargeUnfiltered() 0x30 and 0x31 % R
TrueRemainingCapacity() 0x6A and 0x6B mAh R

bq27441-G1
9.5.2 Control(): 0x00 and 0x01

Issuing a Control() command requires a subsequent 2-byte subcommand. These additional bytes specify the
particular control function desired. The Control() command allows the system to control specific features of the
fuel gauge during normal operation and additional features when the device is in different access modes, as
described in Table 2. Additional details are found in the bq27441-G1 Technical Reference Manual (SLUUAC9).
Table 2. Control() Subcommands

CNTL FUNCTION CNTL DATA SEALED ACCESS DESCRIPTION
CONTROL_STATUS 0x0000 Yes Reports the status of device.
FW_VERSION 0x0002 Yes Reports the firmware version of the device.
DM_CODE 0x0004 Yes Reports the Data Memory Code number stored in NVM.
PREV_MACWRITE 0x0007 Yes Returns previous MAC command code.
CHEM_ID 0x0008 Yes Reports the chemical identifier of the battery profile used by the fuel
gauge.
BAT_INSERT 0x000C Yes Forces the Flags() [BAT_DET] bit set when the OpConfig [BIE] bit is 0.
BAT_REMOVE 0x000D Yes Forces the Flags() [BAT_DET] bit clear when the OpConfig [BIE] bit is
0.
SET_HIBERNATE 0x0011 Yes Forces CONTROL_STATUS [HIBERNATE] to 1.
CLEAR_HIBERNATE 0x0012 Yes Forces CONTROL_STATUS [HIBERNATE] to 0.
SET_CFGUPDATE 0x0013 No Force CONTROL_STATUS [CFGUPMODE] to 1 and gauge enters
CONFIG UPDATE mode.
SHUTDOWN_ENABLE 0x001B No Enables device SHUTDOWN mode.
SHUTDOWN 0x001C No Commands the device to enter SHUTDOWN mode.
SEALED 0x0020 No Places the device in SEALED access mode.
TOGGLE_GPOUT 0x0023 Yes Commands the device to toggle the GPOUT pin for 1 ms.
RESET 0x0041 No Performs a full device reset.
SOFT_RESET 0x0042 No Gauge exits CONFIG UPDATE mode.
EXIT_CFGUPDATE 0x0043 No Exits CONFIG UPDATE mode without an OCV measurement and
without resimulating to update StateOfCharge().
EXIT_RESIM 0x0044 No Exits CONFIG UPDATE mode without an OCV measurement and
resimulates with updated configuration data to update StateOfCharge().
9.5.3 Extended Data Commands

Extended data commands offer additional functionality beyond the standard set of commands. They are used in
the same manner; however, unlike standard commands, extended commands are not limited to 2-byte words.
The number of command bytes for a given extended command ranges in size from single to multiple bytes, as
specified in Table 3.
Table 3. Extended Commands

NAME COMMAND CODE UNIT SEALED ACCESS (1) (2)
UNSEALED ACCESS (1) (2)
OpConfig() 0x3A and 0x3B NA R R

DesignCapacity() 0x3C and 0x3D mAh R R
(2)
DataClass() 0x3E NA NA RW
(2)
DataBlock() 0x3F NA RW RW
BlockData() 0x40 through 0x5F NA R RW
BlockDataCheckSum() 0x60 NA RW RW
BlockDataControl() 0x61 NA NA RW
Reserved 0x62 through 0x7F NA R R
(1) SEALED and UNSEALED states are entered via commands to Control() 0x00 and 0x01.
(2) In SEALED mode, data cannot be accessed through commands 0x3E and 0x3F.

bq27441-G1
9.5.4 Communications
9.5.4.1 I2C Interface

The fuel gauge supports the standard I2C read, incremental read, quick read, one-byte write, and incremental
write functions. The 7-bit device address (ADDR) is the most significant 7 bits of the hex address and is fixed as
1010101. The first 8 bits of the I2C protocol are, therefore, 0xAA or 0xAB for write or read, respectively.
Host generated Gauge generated
S ADDR[6:0] 0 A CMD [7:0] A DATA [7:0] A P S ADDR[6:0] 1 A DATA [7:0] N P

(a) 1-byte write (b) quick read
S ADDR[6:0] 0 A CMD [7:0] A Sr ADDR[6:0] 1 A DATA [7:0] N P
(c) 1- byte read
S ADDR[6:0] 0 A CMD [7:0] A Sr ADDR[6:0] 1 A DATA [7:0] A ... DATA [7:0] N P

(d) incremental read
S ADDR[6:0] 0 A CMD[7:0] A DATA [7:0] A DATA [7:0] A ... A P
(e) incremental write

(S = Start , Sr = Repeated Start , A = Acknowledge , N = No Acknowledge , and P = Stop).
The quick read returns data at the address indicated by the address pointer. The address pointer, a register
internal to the I2C communication engine, increments whenever data is acknowledged by the fuel gauge or the
I2C master. “Quick writes” function in the same manner and are a convenient means of sending multiple bytes to
consecutive command locations (such as two-byte commands that require two bytes of data).
The following command sequences are not supported:
Attempt to write a read-only address (NACK after data sent by master):
Attempt to read an address above 0x6B (NACK command):
9.5.4.2 I2C Time Out

The I2C engine releases both SDA and SCL if the I2C bus is held low for 2 seconds. If the fuel gauge is holding
the lines, releasing them frees them for the master to drive the lines. If an external condition is holding either of
the lines low, the I2C engine enters the low-power SLEEP mode.

bq27441-G1
9.5.4.3 I2C Command Waiting Time

To ensure proper operation at 400 kHz, a t(BUF) ≥ 66 μs bus-free waiting time must be inserted between all
packets addressed to the fuel gauge. In addition, if the SCL clock frequency (fSCL) is > 100 kHz, use individual 1-
byte write commands for proper data flow control. The following diagram shows the standard waiting time
required between issuing the control subcommand the reading the status result. For read-write standard
command, a minimum of 2 seconds is required to get the result updated. For read-only standard commands,
there is no waiting time required, but the host must not issue any standard command more than two times per
second. Otherwise, the gauge could result in a reset issue due to the expiration of the watchdog timer.
S ADDR [6:0] 0 A CMD [7:0] A DATA [7:0] A P 66ms
S ADDR [6:0] 0 A CMD [7:0] A DATA [7:0] A P 66ms
S ADDR [6:0] 0 A CMD [7:0] A Sr ADDR [6:0] 1 A DATA [7:0] A DATA [7:0] N P 66ms
Waiting time inserted between two 1-byte write packets for a subcommand and reading results
(required for 100 kHz < fSCL £ 400 kHz)
S ADDR [6:0] 0 A CMD [7:0] A DATA [7:0] A DATA [7:0] A P 66ms
S ADDR [6:0] 0 A CMD [7:0] A Sr ADDR [6:0] 1 A DATA [7:0] A DATA [7:0] N P 66ms
Waiting time inserted between incremental 2-byte write packet for a subcommand and reading results
(acceptable for fSCL £ 100 kHz)
S ADDR [6:0] 0 A CMD [7:0] A Sr ADDR [6:0] 1 A DATA [7:0] A DATA [7:0] A
DATA [7:0] A DATA [7:0] N P 66ms
Waiting time inserted after incremental read
9.5.4.4 I2C Clock Stretching

A clock stretch can occur during all modes of fuel gauge operation. In SLEEP and HIBERNATE modes, a short ≤
100-µs clock stretch occurs on all I2C traffic as the device must wake-up to process the packet. In the other
modes (INITIALIZATION, NORMAL), a ≤ 4-ms clock stretching period may occur within packets addressed for
the fuel gauge as the I2C interface performs normal data flow control.

bq27441-G1
10 Application and Implementation
NOTE
Information in the following application section is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
10.1 Application Information

The bq27441-G1 fuel gauge is a microcontroller peripheral that provides system-side fuel gauging for single-cell
Li-Ion batteries. The device requires minimal configuration and uses One Time Programmable (OTP) Non-
Volatile Memory (NVM). Battery fuel gauging with the fuel gauge requires connections only to PACK+ and
PACK– for a removable battery pack or embedded battery circuit. To allow for optimal performance in the end
application, special considerations must be taken to ensure minimization of measurement error through proper
printed circuit board (PCB) board layout. Such requirements are detailed in Design Requirements.
10.2 Typical Applications
VPU VPU
R2 R3 R4 R5
U1
5.1 k 5.1 k 5.1 k 1.8 M
1 12
SDA SDA GPOUT GPOUT
2 11
SCL SCL NC
3 10
VSS BIN BIN
4 9
NC NC
PGND 5 8
VDD SRP
PWPD
C1 6 7
BAT SRN
0.47 µF
13
PGND PGND
R1 System Load/Charger
3
PACKP 3 VSYS
2 C2 0.010
BIN 2 BIN
1.0uF
1
Note: 1% Tol.
PACKN 1
J5
PGND
Figure 6. Typical Application
10.2.1 Design Requirements

As shipped from the Texas Instruments factory, many bq27441-G1 parameters in OTP NVM are left in the
unprogrammed state (zero) while some parameters directly associated with the CHEMID are preprogrammed.
This partially programmed configuration facilitates customization for each end application. Upon device reset, the
contents of OTP are copied to associated volatile RAM-based Data Memory blocks. For proper operation, all
parameters in RAM-based Data Memory require initialization — either by updating Data Memory parameters in a
lab/evaluation situation or by programming the OTP for customer production. Chapter 6 in the bq27441-G1
Technical Reference Manual (SLUUAC9) shows the default value and a typically expected value appropriate for
most of applications.
bq27441-G1
Typical Applications (continued)

10.2.2 Detailed Design Procedure
10.2.2.1 BAT Voltage Sense Input

A ceramic capacitor at the input to the BAT pin is used to bypass AC voltage ripple to ground, greatly reducing
its influence on battery voltage measurements. It proves most effective in applications with load profiles that
exhibit high-frequency current pulses (that is, cell phones) but is recommended for use in all applications to
reduce noise on this sensitive high-impedance measurement node.
10.2.2.2 Integrated LDO Capacitor

The fuel gauge has an integrated LDO with an output on the VDD pin of approximately 1.8 V. A capacitor of value
at least 0.47 μF should be connected between the VDD pin and VSS. The capacitor should be placed close to the
gauge IC and have short traces to both the VDD pin and VSS.
10.2.2.3 Sense Resistor Selection

Any variation encountered in the resistance present between the SRP and SRN pins of the fuel gauge will affect
the resulting differential voltage, and derived current, it senses. As such, it is recommended to select a sense
resistor with minimal tolerance and temperature coefficient of resistance (TCR) characteristics. The standard
recommendation based on best compromise between performance and price is a 1% tolerance, 50 ppm drift
sense resistor with a 1-W power rating.

bq27441-G1
Typical Applications (continued)

10.2.3 Application Curves
0.14 10
0.12
5
0.1
Temperature Accuracy Error(%)

Voltage Accuracy Error (%)
0.08
-5
0.06
-10
0.04
0.02 -15
-40 -20 0 20 40 60 80 100 -40 -20 0 20 40 60 80 100
Temperature (°C) Temperature (°C)
Figure 7. Voltage Accuracy Figure 8. Temperature Accuracy

0
-0.1
-0.2
Current Accuracy Error (%)
-0.3
-0.4
-0.5
-0.6
-40 -20 0 20 40 60 80 100
Temperature (°C)
Figure 9. Current Accuracy

bq27441-G1
11 Power Supply Recommendation
11.1 Power Supply Decoupling

The battery connection on the BAT pin is used for two purposes:
• To supply power to the fuel gauge
• To provide an input for voltage measurement of the battery.
A capacitor of value of at least 1 µF should be connected between BAT and VSS. The capacitor should be placed
close to the gauge IC and have short traces to both the BAT pin and VSS.
The fuel gauge has an integrated LDO with an output on the VDD pin of approximately 1.8 V. A capacitor of value
at least 0.47 µF should be connected between the VDD pin and VSS. The capacitor should be placed close to the
gauge IC and have short traces to both the VDD pin and VSS.
12 Layout
12.1 Layout Guidelines

• A capacitor of a value of at least 0.47 µF is connected between the VDD pin and VSS. The capacitor should be
placed close to the gauge IC and have short traces to both the VDD pin and VSS.
• It is required to have a capacitor of at least 1.0 µF connect between the BAT pin and VSS if the connection
between the battery pack and the gauge BAT pin has the potential to pick up noise. The capacitor should be
placed close to the gauge IC and have short traces to both the VDD pin and VSS.
• If the external pullup resistors on the SCL and SDA lines will be disconnected from the host during low-power
operation, it is recommend to use external 1-MΩ pulldown resistors to VSS to avoid floating inputs to the I2C
engine.
• The value of the SCL and SDA pullup resistors should take into consideration the pullup voltage and the bus
capacitance. Some recommended values, assuming a bus capacitance of 10 pF, can be seen in Table 4.
Table 4. Recommended Values for SCL and SDA Pullup Resistors

VPU 1.8 V 3.3 V
Range Typical Range Typical
RPU
400 Ω ≤ RPU ≤ 37.6 kΩ 10 kΩ 900 Ω ≤ RPU ≤ 29.2 kΩ 5.1 kΩ
• If the GPOUT pin is not used by the host, the pin should still be pulled up to VDD with a 4.7-kΩ or 10-kΩ
resistor.
• If the battery pack thermistor is not connected to the BIN pin, the BIN pin should be pulled down to VSS with a
10-kΩ resistor.
• The BIN pin should not be shorted directly to VDD or VSS.
• The actual device ground is pin 3 (VSS).
• The SRP and SRN pins should be Kelvin connected to the RSENSE terminals. SRP to the battery pack side of
RSENSE and SRN to the system side of the RSENSE.
• Kelvin connect the BAT pin to the battery PACKP terminal.

bq27441-G1
12.2 Layout Example

Vpullup (do not pull to gauge VDD) VDD (should be pulled up to gauge VDD)
RBIN
RSCL RSDA
GPOUT
SDA If battery pack thermistor will not
SDA GPOUT
be connected to BIN pin, a 10-k
There is an internal pull down on pulldown resistor should be
GPOUT connected to the BIN pin.
SCL
SCL NC The BIN pin should not be shorted
directly to VDD or VSS.
VSS BIN
NC NC
VDD SRP
CVDD
Place close BAT SRN

to gauge IC.
Trace to pin
and VSS
should be CBAT Kelvin connect BAT sense
short Via connects to Power Ground
line right at positive
battery terminal. The
leads must be short.
VSYS
RSENSE Battery Pack
PACK+
Li-Ion
Use copper pours for TS Cell
battery power path to +
minimize IR losses Kelvin connect SRP and RTHERM
SRN connections right at Protection
Rsense terminals IC
PACK-
NFET NFET
Figure 10. bq27441-G1 Board Layout

bq27441-G1
13 Device and Documentation Support
13.1 Documentation Support

13.1.1 Related Documentation
• bq27441-G1 Technical Reference Manual (SLUUAC9)
• bq27441 EVM: System-Side Impedance Track™ Technology User's Guide (SLUUAP4)
• Quickstart Guide for bq27441-G1 (SLUUAP7)
• Single Cell Gas Gauge Circuit Design (SLUA456)
• Key Design Considerations for the bq27500 and bq27501 (SLUA439)
• Single Cell Impedance Track Printed-Circuit Board Layout Guide (SLUA457)
• ESD and RF Mitigation in Handheld Battery Electronics (SLUA460)
13.2 Trademarks
Impedance Track is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
13.3 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
13.4 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
14 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

PACKAGE OPTION ADDENDUM
www.ti.com 19-Dec-2014
PACKAGING INFORMATION
Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) (6) (3) (4/5)
BQ27441DRZR-G1A ACTIVE SON DRZ 12 3000 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR -40 to 85 BQ27
& no Sb/Br) 441A
BQ27441DRZR-G1B ACTIVE SON DRZ 12 3000 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR -40 to 85 BQ27
& no Sb/Br) 441B
BQ27441DRZT-G1A ACTIVE SON DRZ 12 250 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR -40 to 85 BQ27
& no Sb/Br) 441A
BQ27441DRZT-G1B ACTIVE SON DRZ 12 250 Green (RoHS CU NIPDAU Level-2-260C-1 YEAR -40 to 85 BQ27
& no Sb/Br) 441B
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com 19-Dec-2014
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com 3-Feb-2015
TAPE AND REEL INFORMATION
*All dimensions are nominal

Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1
Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
BQ27441DRZR-G1A SON DRZ 12 3000 330.0 12.4 2.8 4.3 1.2 4.0 12.0 Q2
BQ27441DRZR-G1B SON DRZ 12 3000 330.0 12.4 2.8 4.3 1.2 4.0 12.0 Q2
BQ27441DRZT-G1A SON DRZ 12 250 180.0 12.4 2.8 4.3 1.2 4.0 12.0 Q2
BQ27441DRZT-G1B SON DRZ 12 250 180.0 12.4 2.8 4.3 1.2 4.0 12.0 Q2
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com 3-Feb-2015
*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
BQ27441DRZR-G1A SON DRZ 12 3000 367.0 367.0 35.0
BQ27441DRZR-G1B SON DRZ 12 3000 367.0 367.0 35.0
BQ27441DRZT-G1A SON DRZ 12 250 210.0 185.0 35.0
BQ27441DRZT-G1B SON DRZ 12 250 210.0 185.0 35.0
Pack Materials-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products Applications
Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive
Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications
Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers
DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps
DSP dsp.ti.com Energy and Lighting www.ti.com/energy
Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial
Interface interface.ti.com Medical www.ti.com/medical
Logic logic.ti.com Security www.ti.com/security
Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense
Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video
RFID www.ti-rfid.com
OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com
Wireless Connectivity www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2015, Texas Instruments Incorporated

Texas Instruments BQ27441DRZR G1A - C473397

Uploaded by

Copyright:

Available Formats

Texas Instruments BQ27441DRZR G1A - C473397

Uploaded by

Document Information

Original Title

Copyright

Available Formats

Share this document

Share or Embed Document

Sharing Options

Did you find this document useful?

Is this content inappropriate?

Copyright:

Available Formats

Texas Instruments BQ27441DRZR G1A - C473397

Uploaded by

Copyright:

Available Formats

Product Sample & Technical Tools & Support &

Folder Buy Documents Software Community

bq27441-G1 System-Side Impedance Track™ Fuel Gauge

Device Information (1)

(1) For all available packages, see the orderable addendum at

SCL SRN VSYS

• Changed simplified schematic by adding two 1 µF capacitors ............................................................................................. 1

Changes from Revision A (January 2014) to Revision B Page

2 Submit Documentation Feedback Copyright © 2013–2014, Texas Instruments Incorporated

Product Folder Links: bq27441-G1

Changes from Original (November 2013) to Revision A Page

6 Device Comparison Table

(1) (2) FIRMWARE

Copyright © 2013–2014, Texas Instruments Incorporated Submit Documentation Feedback 3

7 Pin Configuration and Functions

(1) IO = Digital input-output, AI = Analog input, P = Power connection

4 Submit Documentation Feedback Copyright © 2013–2014, Texas Instruments Incorporated

Product Folder Links: bq27441-G1

8.2 ESD Ratings

8.3 Recommended Operating Conditions

(1) Specified by design. Not production tested.

8.4 Thermal Information

Copyright © 2013–2014, Texas Instruments Incorporated Submit Documentation Feedback 5

8.5 Supply Current

(1) Specified by design. Not production tested.

8.6 Digital Input and Output DC Characteristics

(1) Specified by design. Not production tested.

6 Submit Documentation Feedback Copyright © 2013–2014, Texas Instruments Incorporated

Product Folder Links: bq27441-G1

8.7 LDO Regulator, Wake-up, and Auto-Shutdown DC Characteristics

(1) Specified by design. Not production tested.

8.8 LDO Regulator, Wake-up, and Auto-shutdown AC Characteristics

(1) Specified by design. Not production tested.

8.9 ADC (Temperature and Cell Measurement) Characteristics

(1) Specified by design. Not tested in production.

8.10 Integrating ADC (Coulomb Counter) Characteristics

(1) Specified by design. Not tested in production.

Copyright © 2013–2014, Texas Instruments Incorporated Submit Documentation Feedback 7

8.11 I2C-Compatible Interface Communication Timing Characteristics

(1) Specified by design. Not production tested.

tSU(STA) tw(H) tw(L) tf tr t(BUF)

REPEATED STOP START

Figure 1. I2C-Compatible Interface Timing Diagrams

8 Submit Documentation Feedback Copyright © 2013–2014, Texas Instruments Incorporated

Product Folder Links: bq27441-G1

8.12 SHUTDOWN and WAKE-UP Timing

tPUCD tSHUP tPUCD

I2C Bus SHUTDOWN_

State Off WAKE-UP Active SHUTDOWN WAKE-UP Active

* GPOUT is configured as an input for wake-up signaling.

Figure 2. SHUTDOWN and WAKE-UP Timing Diagram

8.13 Typical Characteristics

Figure 3. Voltage Accuracy Figure 4. Temperature Accuracy

Figure 5. Current Accuracy

Copyright © 2013–2014, Texas Instruments Incorporated Submit Documentation Feedback 9

9.2 Functional Block Diagram

SCL SRN VSYS

9.3 Feature Description

10 Submit Documentation Feedback Copyright © 2013–2014, Texas Instruments Incorporated