W78E52C/W78E052C Data Sheet

8-BIT MICROCONTROLLER
Table of Contents-
1. GENERAL DESCRIPTION ......................................................................................................... 2
2. FEATURES ................................................................................................................................. 2
3. PIN CONFIGURATIONS ............................................................................................................ 3
4. PIN DESCRIPTION..................................................................................................................... 4
5. FUNCTIONAL DESCRIPTION ................................................................................................... 5
5.1 Timers 0, 1, and 2........................................................................................................... 5
5.2 New Defined Peripheral.................................................................................................. 5
5.3 Watchdog Timer ............................................................................................................. 7
5.4 Clock ............................................................................................................................... 9
5.5 Power Management........................................................................................................ 9
5.6 Reset............................................................................................................................... 9
6. SECURITY BITS ....................................................................................................................... 10
6.1 Lock Bit ......................................................................................................................... 10
6.2 MOVC Inhibit................................................................................................................. 10
6.3 Encryption ..................................................................................................................... 10
7. ELECTRICAL CHARACTERISTICS......................................................................................... 11
7.1 Absolute Maximum Ratings .......................................................................................... 11
7.2 D.C. Characteristics...................................................................................................... 11
7.3 A.C. Characteristics ...................................................................................................... 13
8. TIMING WAVEFORMS ............................................................................................................. 16
8.1 Program Fetch Cycle .................................................................................................... 16
8.2 Data Read Cycle........................................................................................................... 16
8.3 Data Write Cycle........................................................................................................... 17
8.4 Port Access Cycle......................................................................................................... 17
9. TYPICAL APPLICATION CIRCUITS ........................................................................................ 18
9.1 Expanded External Program Memory and Crystal ....................................................... 18
9.2 Expanded External Data Memory and Oscillator ......................................................... 19
10. PACKAGE DIMENSIONS ......................................................................................................... 20
10.1 40-pin DIP ..................................................................................................................... 20
10.2 44-pin PLCC ................................................................................................................. 20
10.3 44-pin PQFP ................................................................................................................. 21
11. REVISION HISTORY ................................................................................................................ 22

Publication Release Date: November 6, 2006

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1. GENERAL DESCRIPTION
The W78E052C is an 8-bit microcontroller which can accommodate a wider frequency range with low
power consumption. The instruction set for the W78E052C is fully compatible with the standard 8051.
The W78E052C contains an 8K bytes Flash EPROM; a 256 bytes RAM; four 8-bit bi-directional and
bit-addressable I/O ports; an additional 4-bit I/O port P4; three 16-bit timer/counters; a hardware
watchdog timer and a serial port. These peripherals are supported by eight sources two-level interrupt
capability. To facilitate programming and verification, the Flash EPROM inside the W78E052C allows
the program memory to be programmed and read electronically. Once the code is confirmed, the user
can protect the code for security.
The W78E052C microcontroller has two power reduction modes, idle mode and power-down mode,
both of which are software selectable. The idle mode turns off the processor clock but allows for
continued peripheral operation. The power-down mode stops the crystal oscillator for minimum power
consumption. The external clock can be stopped at any time and in any state without affecting the
processor.

2. FEATURES
• Fully static design 8-bit CMOS microcontroller
• Wide supply voltage of 4.5V to 5.5V
• 256 bytes of on-chip scratchpad RAM
• 8 KB On-chip Flash EPROM
• 64 KB program memory address space
• 64 KB data memory address space
• Four 8-bit bi-directional ports
• One extra 4-bit bit-addressable I/O port, additional INT2 / INT3
(available on 44-pin PLCC/QFP package)
• Three 16-bit timer/counters
• One full duplex serial port(UART)
• Watchdog Timer
• Eight sources, two-level interrupt capability
• EMI reduction mode
• Built-in power management
• Code protection mechanism
• Packages:
− Lead Free (RoHS) DIP 40: W78E052C40DL
− Lead Free (RoHS) PLCC 44: W78E052C40PL
− Lead Free (RoHS) PQFP 44: W78E052C40FL

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3. PIN CONFIGURATIONS

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4. PIN DESCRIPTION
SYMBOL DESCRIPTIONS
EXTERNAL ACCESS ENABLE: This pin forces the processor to execute out of
external ROM. It should be kept high to access internal ROM. The ROM address and
EA
data will not be presented on the bus if EA pin is high and the program counter is
within on-chip ROM area.
PROGRAM STORE ENABLE: PSEN enables the external ROM data onto the Port 0
PSEN address/ data bus during fetch and MOVC operations. When internal ROM access is
performed, no PSEN strobe signal outputs from this pin.
ADDRESS LATCH ENABLE: ALE is used to enable the address latch that separates
ALE
the address from the data on Port 0.
RESET: A high on this pin for two machine cycles while the oscillator is running resets
RST
the device.
CRYSTAL1: This is the crystal oscillator input. This pin may be driven by an external
XTAL1
clock.
XTAL2 CRYSTAL2: This is the crystal oscillator output. It is the inversion of XTAL1.
VSS GROUND: Ground potential
VDD POWER SUPPLY: Supply voltage for operation.
PORT 0: Port 0 is a bi-directional I/O port which also provides a multiplexed low order
P0.0−P0.7 address/data bus during accesses to external memory. The Port 0 is also an open-
drain port and external pull-ups need to be connected while in programming.
PORT 1: Port 1 is a bi-directional I/O port with internal pull-ups. The bits have alternate
functions which are described below:
P1.0−P1.7
T2(P1.0): Timer/Counter 2 external count input
T2EX(P1.1): Timer/Counter 2 Reload/Capture control
PORT 2: Port 2 is a bi-directional I/O port with internal pull-ups. This port also provides
P2.0−P2.7
the upper address bits for accesses to external memory.
PORT 3: Port 3 is a bi-directional I/O port with internal pull-ups. All bits have alternate
functions, which are described below:
RXD(P3.0) : Serial Port receiver input
TXD(P3.1) : Serial Port transmitter output
INT0 (P3.2) : External Interrupt 0
P3.0−P3.7
INT1 (P3.3) : External Interrupt 1
T0(P3.4) : Timer 0 External Input
T1(P3.5) : Timer 1 External Input
WR (P3.6) : External Data Memory Write Strobe
RD (P3.7) : External Data Memory Read Strobe
PORT 4: Another bit-addressable bidirectional I/O port P4. P4.3 and P4.2 are alternative
P4.0-P4.3 function pins. It can be used as general I/O port or external interrupt input sources
( INT2 / INT3 ).

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5. FUNCTIONAL DESCRIPTION
The W78E052C architecture consists of a core controller surrounded by various registers, five general
purpose I/O ports, 256 bytes of RAM, three timer/counters, and a serial port. The processor supports
111 different opcodes and references both a 64K program address space and a 64K data storage
space.

5.1 Timers 0, 1, and 2

Timers 0, 1, and 2 each consist of two 8-bit data registers. These are called TL0 and TH0 for Timer 0,
TL1 and TH1 for Timer 1, and TL2 and TH2 for Timer 2. The TCON and TMOD registers provide
control functions for timers 0 and 1. The T2CON register provides control functions for Timer 2.
RCAP2H and RCAP2L are used as reload/capture registers for Timer 2.
The operations of Timer 0 and Timer 1 are the same as in the W78C51. Timer 2 is a special feature of
the W78E54B: it is a 16-bit timer/counter that is configured and controlled by the T2CON register. Like
Timers 0 and 1, Timer 2 can operate as either an external event counter or as an internal timer,
depending on the setting of bit C/T2 in T2CON. Timer 2 has three operating modes: capture, auto-
reload, and baud rate generator. The clock speed at capture or auto-reload mode is the same as that
of Timers 0 and 1.

5.2 New Defined Peripheral

In order to be more suitable for I/O, an extra 4-bit bit-addressable port P4 and two external interrupt
INT2 , INT3 has been added to either the PLCC or QFP 44 pin package. And description follows:

INT2 / INT3

Two additional external interrupts, INT2 and INT3 , whose functions are similar to those of external
interrupt 0 and 1 in the standard 80C52. The functions/status of these interrupts are
determined/shown by the bits in the XICON (External Interrupt Control) register. The XICON register is
bit-addressable but is not a standard register in the standard 80C52. Its address is at 0C0H. To
set/clear bits in the XICON register, one can use the "SETB (/CLR) bit" instruction. For example,
"SETB 0C2H" sets the EX2 bit of XICON.

XICON - external interrupt control (C0H)

PX3 EX3 IE3 IT3 PX2 EX2 IE2 IT2

PX3: External interrupt 3 priority high if set

EX3: External interrupt 3 enable if set
IE3: If IT3 = 1, IE3 is set/cleared automatically by hardware when interrupt is detected/serviced
IT3: External interrupt 3 is falling-edge/low-level triggered when this bit is set/cleared by software
PX2: External interrupt 2 priority high if set
EX2: External interrupt 2 enable if set
IE2: If IT2 = 1, IE2 is set/cleared automatically by hardware when interrupt is detected/serviced
IT2: External interrupt 2 is falling-edge/low-level triggered when this bit is set/cleared by software

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Eight-source interrupt information:

POLLING ENABLE INTERRUPT
VECTOR
INTERRUPT SOURCE SEQUENCE WITHIN REQUIRED TYPE
ADDRESS
PRIORITY LEVEL SETTINGS EDGE/LEVEL
External Interrupt 0 03H 0 (highest) IE.0 TCON.0
Timer/Counter 0 0BH 1 IE.1 -
External Interrupt 1 13H 2 IE.2 TCON.2
Timer/Counter 1 1BH 3 IE.3 -
Serial Port 23H 4 IE.4 -
Timer/Counter 2 2BH 5 IE.5 -
External Interrupt 2 33H 6 XICON.2 XICON.0
External Interrupt 3 3BH 7 (lowest) XICON.6 XICON.3

PORT4
Another bit-addressable port P4 is also available and only 4 bits (P4<3:0>) can be used. This port
address is located at 0D8H with the same function as that of port P1, except the P4.3 and P4.2 are
alternative function pins. It can be used as general I/O pins or external interrupt input sources ( INT2 ,
INT3 ).
Example:
P4 REG 0D8H
MOV P4, #0AH ; Output data "A" through P4.0−P4.3.
MOV A, P4 ; Read P4 status to Accumulator.
ORL P4,#00000001B ; Set bit P4.0
ANL P4,#11111101B ; Clear bit P4.1

Reduce EMI Emission

Because of on-chip ROM, when a program is running in internal ROM space, the ALE will be unused.
The transition of ALE will cause noise, so it can be turned off to reduce the EMI emission if it is
useless. Turning off the ALE signal transition only requires setting the bit 0 of the AUXR SFR, which is
located at 08Eh. When ALE is turned off, it will be reactivated when the program accesses external
ROM/RAM data or jumps to execute an external ROM code. The ALE signal will turn off again after it
has been completely accessed or the program returns to internal ROM code space. The AO bit in the
AUXR register, when set, disables the ALE output. In order to reduce EMI emission from oscillation
circuitry, W78E052C allows user to diminish the gain of on-chip oscillator amplifiers by using
programmer to clear the B7 bit of security register. Once B7 is set to 0, a half of gain will be
decreased. Care must be taken if user attempts to diminish the gain of oscillator amplifier, reducing a
half of gain may affect the external crystal operating improperly at high frequency above 24 MHz. The
value of R and C1,C2 may need some adjustment while running at lower gain.

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***AUXR - Auxiliary register (8EH)

- - - - - - - AO
AO: Turn off ALE output.

Power-off Flag
***PCON - Power control (87H)

- - - POF GF1 GF0 PD IDL

POF: Power off flag. Bit is set by hardware when power on reset. It can be cleared by software
to determine chip reset is a warm boot or cold boot.
GF1, GF0: These two bits are general-purpose flag bits for the user.
PD: Power down mode bit. Set it to enter power down mode.
IDL: Idle mode bit. Set it to enter idle mode.

The power-off flag is located at PCON.4. This bit is set when VDD has been applied to the part. It can
be used to determine if a reset is a warm boot or a cold boot if it is subsequently reset by software.

5.3 Watchdog Timer

The Watchdog timer is a free-running timer which can be programmed by the user to serve as a
system monitor, a time-base generator or an event timer. It is basically a set of dividers that divide the
system clock. The divider output is selectable and determines the time-out interval. When the time-out
occurs a system reset can also be caused if it is enabled. The main use of the Watchdog timer is as a
system monitor. This is important in real-time control applications. In case of power glitches or electro-
magnetic interference, the processor may begin to execute errant code. If this is left unchecked the
entire system may crash. The watchdog time-out selection will result in different time-out values
depending on the clock speed. The Watchdog timer will de disabled on reset. In general, software
should restart the Watchdog timer to put it into a known state. The control bits that support the
Watchdog timer are discussed below.

Watchdog Timer Control Register

Bit: 7 6 5 4 3 2 1 0
ENW CLRW WIDL - - PS2 PS1 PS0
Mnemonic: WDTC Address: 8FH
ENW : Enable watch-dog if set.
CLRW : Clear watch-dog timer and prescaler if set. This flag will be cleared automatically
WIDL : If this bit is set, watch-dog is enabled under IDLE mode. If cleared, watch-dog is disabled
under IDLE mode. Default is cleared.

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PS2, PS1, PS0: Watch-dog prescaler timer select. Prescaler is selected when set PS2~0 as follows:

PS2 PS1 PS0 PRESCALER SELECT

0 0 0 2
0 0 1 4
0 1 0 8
0 1 1 16
1 0 0 32
1 0 1 64
1 1 0 128
1 1 1 256

The time-out period is obtained using the following equation:

1
× 2 14 × PRESCALER × 1000 × 12 mS
OSC
Before Watchdog time-out occurs, the program must clear the 14-bit timer by writing 1 to WDTC.6
(CLRW). After 1 is written to this bit, the 14-bit timer, prescaler and this bit will be reset on the next
instruction cycle. The Watchdog timer is cleared on reset.

ENW
W IDL

IDLE
EXTERNAL
RESET

INTERNAL
14-BIT TIMER RESET
OSC 1/12 PRESCALER CLEAR

W atchdog Timer Block Diagram CLRW

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Typical Watch-Dog time-out period when OSC = 20 MHz

PS2 PS1 PS0 WATCHDOG TIME-OUT PERIOD

0 0 0 19.66 mS
0 0 1 39.32 mS
0 1 0 78.64 mS
0 1 1 157.28 mS
1 0 0 314.57 mS
1 0 1 629.14 mS
1 1 0 1.25 S
1 1 1 2.50 S

5.4 Clock
The W78E052C is designed to be used with either a crystal oscillator or an external clock. Internally,
the clock is divided by two before it is used. This makes the W78E052C relatively insensitive to duty
cycle variations in the clock. The W78E052C incorporates a built-in crystal oscillator. To make the
oscillator work, a crystal must be connected across pins XTAL1 and XTAL2. In addition, a load
capacitor must be connected from each pin to ground. An external clock source should be connected
to pin XTAL1. Pin XTAL2 should be left unconnected. The XTAL1 input is a CMOS-type input, as
required by the crystal oscillator.

5.5 Power Management

Idle Mode
The idle mode is entered by setting the IDL bit in the PCON register. In the idle mode, the internal
clock to the processor is stopped. The peripherals and the interrupt logic continue to be clocked. The
processor will exit idle mode when either an interrupt or a reset occurs.

Power-down Mode
When the PD bit of the PCON register is set, the processor enters the power-down mode. In this
mode all of the clocks are stopped, including the oscillator. The only way to exit power-down mode is
by a reset.

5.6 Reset
The external RESET signal is sampled at S5P2. To take effect, it must be held high for at least two
machine cycles while the oscillator is running. An internal trigger circuit in the reset line is used to
deglitch the reset line when the W78E052C is used with an external RC network. The reset logic also
has a special glitch removal circuit that ignores glitches on the reset line.
During reset, the ports are initialized to FFH, the stack pointer to 07H, PCON (with the exception of bit
4) to 00H, and all of the other SFR registers except SBUF to 00H. SBUF is not reset.

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6. SECURITY BITS
During the on-chip Flash EPROM operation mode, the ROM can be programmed and verified
repeatedly. Until the code inside the ROM is confirmed OK, the code can be protected. The protection
of ROM and those operations on it are described below.
The W78E052C has a Security Register which can not be accessed in normal mode. These registers
can only be accessed from the Flash EPROM operation mode. Those bits of the Security Register can
not be changed once they have been programmed from high to low. They can only be reset through
erase-all operation. The Security Register is addressed in the Flash EPROM operation mode by
address #0FFFFh.

0000h
8KB On-chip ROM

Program Memory

Security Bits 1FFFh

B7 Reserved B2 B1 B0
Reserved
B0 : Lock bit, logic 0 : active
B1 : MOVC inhibit,
logic 0 : the MOVC instruction in external memory
cannot access the code in internal memory.
logic 1 : no restriction.
B2 : Encryption
logic 0 : the encryption logic enable Security Register 0FFFFh
logic 1 : the encryption logic disable
B7 : Osillator Control
logic 0 : 1/2 gain
logic 1 : Full gain
Default 1 for all security bits. Reserved bits must be kept in logic 1.

Special Setting Register

6.1 Lock Bit

This bit is used to protect the customer's program code in the W78E052C. It may be set after the
programmer finishes the programming and verifies sequence. Once this bit is set to logic 0, both the
ROM data and Special Setting Register can not be accessed again.
6.2 MOVC Inhibit
This bit is used to restrict the accessible region of the MOVC instruction. It can prevent the MOVC
instruction in external program memory from reading the internal program code. When this bit is set to
logic 0, a MOVC instruction in external program memory space will be able to access code only in the
external memory, not in the internal memory. A MOVC instruction in internal program memory space
will always be able to access the ROM data in both internal and external memory. If this bit is logic 1,
there are no restrictions on the MOVC instruction.
6.3 Encryption
This bit is used to enable/disable the encryption logic for code protection. Once encryption feature is
enabled, the data presented on port 0 will be encoded via encryption logic. Only whole chip erase will
reset this bit.

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7. ELECTRICAL CHARACTERISTICS
7.1 Absolute Maximum Ratings
PARAMETER SYMBOL MIN. MAX. UNIT
DC Power Supply VDD−VSS -0.3 +7.0 V
Input Voltage VIN VSS -0.3 VDD +0.3 V
Operating Temperature TA 0 70 °C
Storage Temperature TST -55 +150 °C
Note: Exposure to conditions beyond those listed under Absolute Maximum Ratings may adversely affect the life and reliability
of the device.

7.2 D.C. Characteristics

(VCC−VSS = 5V ±10%, TA = 25° C, unless otherwise specified.)

SPECIFICATION
PARAMETER SYMBOL TEST CONDITIONS UNIT
MIN. MAX.
Operating Voltage VDD 4.5 5.5 V
Operating Current IDD No load VDD = 5.5V - 20 mA
Idle mode VDD =
Idle Current IIDLE - 6 mA
5.5V
Power-down mode
Power Down Current IPWDN - 50 µA
VDD = 5.5V
Input Current VDD = 5.5V
IIN1 -50 +10 µA
P1, P2, P3 VIN = 0V or VDD
Logical 1-to-0 Transition VDD = 5.5V
ITL -550 - µA
Current P1, P2, P3 (*1) VIN = 2.0V (*1)
Input Current VDD = 5.5V
IIN2 -10 +300 µA
RST (*2) VIN = VDD
Input Leakage Current VDD = 5.5V
ILK -10 +10 µA
P0, EA 0V < VIN < VDD
Output Low Voltage VDD = 4.5V
VOL1 - 0.45 V
P1, P2, P3 IOL1 = +2 mA
Output Low Voltage VDD = 4.5V
(*3)
VOL2 - 0.45 V
ALE, IN T1 , P0 IOL2 = +4 mA
Output High Voltage VDD = 4.5V
VOH1 2.4 - V
P1, P2, P3 IOH1 = -100 µA

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DC Characteristics, continued

SPECIFICATION
PARAMETER SYMBOL TEST CONDITIONS UNIT
MIN. MAX.
Output High Voltage VDD = 4.5V
(*3)
VOH2 2.4 - V
ALE, PSEN , P0 IOH2 = -400 µA
Input Low Voltage
VIL1 VDD = 4.5V 0 0.8 V
(Except RST)
Input Low Voltage
VIL2 VDD = 4.5V 0 0.8 V
RST (*4)
Input Low Voltage
VIL3 VDD = 4.5V 0 0.8 V
XTAL1 (*4)
Input High Voltage
VIH1 VDD = 4.5V 2.4 VDD +0.2 V
(Except RST)
Sink Current VDD = 4.5V
ISK1 4 12 mA
P1, P2, P3, P4 VS = 0.45V
Input High Voltage
VIH2 VDD = 4.5V 0.67 VDD VDD +0.2 V
RST (*4)
Input High Voltage
VIH3 VDD = 4.5V 0.67 VDD VDD +0.2 V
XTAL1 (*4)
Sink Current VDD = 4.5V
ISK2 8 16 mA
P0, ALE, PSEN (*3) VS = 0.45V
Source Current VDD = 4.5V
ISR1 -100 -250 uA
P1, P2, P3, P4 VS = 2.4V
Source Current VDD = 4.5V
ISR2 -8 -14 mA
P0, ALE, PSEN (*3) V = 2.4V
Notes:
*1. Pins P1, P2 and P3 source a transition current when they are being externally driven from 1 to 0. The transition current
reaches its maximum value when VIN is approximately 2V.
*2. RST pin has an internal pull-down resistor.
*3. P0, ALE, PSEN are in the external access memory mode.
*4. XTAL1 is a CMOS input and RST is a Schmitt trigger input.

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7.3 A.C. Characteristics

The AC specifications are a function of the particular process used to manufacture the part, the
ratings of the I/O buffers, the capacitive load, and the internal routing capacitance. Most of the
specifications can be expressed in terms of multiple input clock periods (TCP), and actual parts will
usually experience less than a ±20 nS variation. The numbers below represent the performance
expected from a 0.6micron CMOS process when using 2 and 4 mA output buffers.

Clock Input Waveform

XTAL1
T CH
T CL

F OP, TCP

PARAMETER SYMBOL MIN. TYP. MAX. UNIT NOTES

Operating Speed FOP 0 - 40 MHz 1
Clock Period TCP 25 - - nS 2
Clock High TCH 10 - - nS 3
Clock Low TCL 10 - - nS 3
Notes:
1. The clock may be stopped indefinitely in either state.
2. The TCP specification is used as a reference in other specifications.
3. There are no duty cycle requirements on the XTAL1 input.

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Program Fetch Cycle

PARAMETER SYMBOL MIN. TYP. MAX. UNIT NOTES
Address Valid to ALE Low TAAS 1 TCP -∆ - - nS 4
Address Hold from ALE Low TAAH 1 TCP -∆ - - nS 1, 4
ALE Low to PSEN Low TAPL 1 TCP -∆ - - nS 4
R E S Low to Data Valid TPDA - - 2 TCP nS 2
Data Hold after PSEN High TPDH 0 - 1 TCP nS 3
Data Float after PSEN High TPDZ 0 - 1 TCP nS
ALE Pulse Width TALW 2 TCP -∆ 2 TCP - nS 4
PSEN Pulse Width TPSW 3 TCP -∆ 3 TCP - nS 4
Notes:
1. P0.0−P0.7, P2.0−P2.7 remain stable throughout entire memory cycle.
2. Memory access time is 3 TCP.
3. Data have been latched internally prior to PSEN going high.
4. "∆" (due to buffer driving delay and wire loading) is 20 nS.

Data Read Cycle

PARAMETER SYMBOL MIN. TYP. MAX. UNIT NOTES
ALE Low to RD Low TDAR 3 TCP -∆ - 3 TCP +∆ nS 1, 2
RD Low to Data Valid TDDA - - 4 TCP nS 1
Data Hold from RD High TDDH 0 - 2 TCP nS
Data Float from RD High TDDZ 0 - 2 TCP nS
RD Pulse Width TDRD 6 TCP -∆ 6 TCP - nS 2
Notes:
1. Data memory access time is 8 TCP.
2. "∆" (due to buffer driving delay and wire loading) is 20 nS.

Data Write Cycle

PARAMETER SYMBOL MIN. TYP. MAX. UNIT
ALE Low to WR Low TDAW 3 TCP -∆ - 3 TCP +∆ nS
Data Valid to WR Low TDAD 1 TCP -∆ - - nS
Data Hold from WR High TDWD 1 TCP -∆ - - nS
WR Pulse Width TDWR 6 TCP -∆ 6 TCP - nS
Note: "∆" (due to buffer driving delay and wire loading) is 20 nS.

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Port Access Cycle

PARAMETER SYMBOL MIN. TYP. MAX. UNIT
Port Input Setup to ALE Low TPDS 1 TCP - - nS
Port Input Hold from ALE Low TPDH 0 - - nS
Port Output to ALE TPDA 1 TCP - - nS
Note: Ports are read during S5P2, and output data becomes available at the end of S6P2. The timing data are referenced to
ALE, since it provides a convenient reference.

Program Operation
PARAMETER SYMBOL MIN. TYP. MAX. UNIT
VPP Setup Time TVPS 2.0 - - µS
Data Setup Time TDS 2.0 - - µS
Data Hold Time TDH 2.0 - - µS
Address Setup Time TAS 2.0 - - µS
Address Hold Time TAH 0 - - µS
CE Program Pulse Width for TPWP 290 300 310 µS
Program Operation
OECTRL Setup Time TOCS 2.0 - - µS
OECTRL Hold Time TOCH 2.0 - - µS
OE Setup Time TOES 2.0 - - µS

OE High to Output Float TDFP 0 - 130 nS

Data Valid from OE TOEV - - 150 nS

Note: Flash data can be accessed only in flash mode. The RST pin must pull in VIH status, the ALE pin must pull in VIL status,
and the PSEN pin must pull in VIH status.

Publication Release Date: November 6, 2006

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8. TIMING WAVEFORMS
8.1 Program Fetch Cycle

S1 S2 S3 S4 S5 S6 S1 S2 S3 S4 S5 S6
XTAL1

TALW
ALE
TAPL

PSEN
TPSW
TAAS

PORT 2
TPDA
TAAH TPDH, TPDZ

PORT 0
Code A0-A7 Data A0-A7 Code A0-A7 Data A0-A7

8.2 Data Read Cycle

S4 S5 S6 S1 S2 S3 S4 S5 S6 S1 S2 S3
XTAL1

ALE

PSEN

PORT 2 A8-A15

A0-A7 DATA
PORT 0
T DAR T DDA
T DDH, T DDZ
RD

T DRD

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Timing Waveforms, continued

8.3 Data Write Cycle

S4 S5 S6 S1 S2 S3 S4 S5 S6 S1 S2 S3
XTAL1

ALE

PSEN

PORT 2 A8-A15

PORT 0 A0-A7 DATA OUT

TDAD T DWD
WR

T DAW T DWR

8.4 Port Access Cycle

S5 S6 S1

XTAL1

ALE
TPDS T PDH T PDA

PORT DATA OUT

INPUT
SAMPLE

Publication Release Date: November 6, 2006

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9. TYPICAL APPLICATION CIRCUITS

9.1 Expanded External Program Memory and Crystal

VDD
VDD
31 39 AD0 AD0 3 D0 Q0 2 A0 A0 10 11 AD0
EA P0.0 A0 O0
P0.1 38 AD1 AD1 4 D1 Q1 5 A1 A1 9 A1 O1 12 AD1
19 P0.2 37 AD2 AD2 7 D2 Q2 6 A2 A2 8 A2 13 AD2
XTAL1 O2
10 u P0.3 36 AD3 AD3 8 D3 Q3 9 A3 A3 7 A3 O3 15 AD3
P0.4 35 AD4 AD4 13 D4 Q4 12 A4 A4 6 A4 O4 16 AD4
R 18 34 AD5 AD5 14 15 A5 A5 5 17 AD5
XTAL2 P0.5 D5 Q5 A5 O5
CRYSTAL P0.6 33 AD6 AD6 17 D6 Q6 16 A6 A6 4 A6 O6 18 AD6
P0.7 32 AD7 AD7 18 D7 Q7 19 A7 A7 3 A7 O7 19 AD7
8.2 K 9 RST A8 25
GND 1 A8
P2.0 21 A8 OC A9 24 A9
C1 C2 22 A9 11 A10 21
P2.1 G A10
12 INT0 23 A10 A11 23
P2.2 A11
13 INT1 P2.3 24 A11 74373 A12 2 A12
14 T0 P2.4 25 A12 A13 26 A13
15 T1 P2.5 26 A13 A14 27 A14
P2.6 27 A14 A15 1 A15
1 P1.0 P2.7 28 A15
2 GND 20 CE
P1.1
3 P1.2 RD 17 22
OE
4 P1.3 WR 16
5 P1.4 PSEN 29 27512
6 P1.5 ALE 30
7 P1.6 TXD 11
8 P1.7 10
RXD
W78E52B

Figure A

CRYSTAL C1 C2 R
16 MHz 30P 30P -
24 MHz 15P 15P -
33 MHz 10P 10P 6.8K
40 MHz 5P 5P 4.7K

Above table shows the reference values for crystal applications (full gain).

Note: C1, C2, R components refer to Figure A.

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Typical Application Circuits, continued

9.2 Expanded External Data Memory and Oscillator

V DD
V DD
31 P0.0 39 AD0 AD0 3 D0 Q0 2 A0 A0 10 A0 D0 11 AD0
EA 38 AD1 A1 AD1
P0.1 AD1 4 D1 Q1 5 A1 9 A1 D1 12
19 XTAL1 P0.2 37 AD2 AD2 7 D2 Q2 6 A2 A2 8 A2 D2 13 AD2
10 u OSCILLATOR P0.3 36 AD3 AD3 8 D3 Q3 9 A3 A3 7 A3 D3 15 AD3
P0.4 35 AD4 AD4 13 D4 Q4 12 A4 A4 6 A4 D4 16 AD4
18 XTAL2 P0.5 34 AD5 AD5 14 D5 Q5 15 A5 A5 5 A5 D5 17 AD5
P0.6 33 AD6 AD6 17 D6 Q6 16 A6 A6 4 A6 D6 18 AD6
8.2 K P0.7 32 AD7 AD7 18 19 A7 A7 3 A7 19 AD7
D7 Q7 D7
9 RST A8 25 A8
P2.0 21 GND 1 A9
A8 OC 24 A9
P2.1 22 A9 11 A10 21
12 INT0 G A10
P2.2 23 A10 A11 23 A11
13 INT1 P2.3 24 A11 74373 A12 2 A12
14 P2.4 25 A12 A13 26 A13
T0
15 P2.5 26 A13 A14 1 A14
T1 P2.6 27 A14
1 P2.7 28 GND 20 CE
P1.0 22
2 OE
3 P1.1 RD 27
P1.2 17
4 WR 16 WR
P1.3 29
5 PSEN 20256
P1.4
6 30
P1.5 ALE
7 11
P1.6 TXD
8 10
P1.7 RXD
W78E52B

Figure B

Publication Release Date: November 6, 2006

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10. PACKAGE DIMENSIONS

10.1 40-pin DIP

Dimension in inch Dimension in mm

Symbol
Min. Nom. Max. Min. Nom. Max.
A 0.210 5.334

A1 0.010 0.254

A2 0.150 0.155 0.160 3.81 3.937 4.064

B 0.016 0.018 0.022 0.406 0.457 0.559

B1 0.048 0.050 0.054 1.219 1.27 1.372

c 0.008 0.010 0.014 0.203 0.254 0.356

D
D 2.055 2.070 52.20 52.58
40 21
E 0.590 0.600 0.610 14.986 15.24 15.494

E1 0.540 0.545 0.550 13.72 13.84 13.97

e1 0.090 0.100 0.110 2.286 2.54 2.794

E1 L 0.120 0.130 0.140 3.048 3.302 3.556

a 0 15 0 15

eA 0.630 0.650 0.670 16.00 16.51 17.01

1 20
S 0.090 2.286

Notes:
E 1. Dimension D Max. & S include mold flash or
S
c tie bar burrs.
A A2
2. Dimension E1 does not include interlead flash.
A1 Base Plane
3. Dimension D & E1 include mold mismatch and
are determined at the mold. parting line.
L Seating Plane
4. Dimension B1 does not include dambar
protrusion/intrusion.
B
e1 eA 5. Controlling dimension: Inches.
a
B1
6. General appearance spec. should be based on
final visual inspection spec.

10.2 44-pin PLCC

HD
D

6 1 44 40
Symbol Dimension in inch Dimension in mm
Min. Nom. Max. Min. Nom. Max.
7 39 A 0.185 4.699

A1 0.020 0.508

A2 0.145 0.150 0.155 3.683 3.81 3.937

b1 0.026 0.028 0.032 0.66 0.711 0.813

HE
b 0.016 0.018 0.022 0.406 0.457 0.559
E GE
c 0.008 0.010 0.014 0.203 0.254 0.356

D 0.648 0.653 0.658 16.46 16.59 16.71

E 0.648 0.653 0.658 16.46 16.59 16.71

e 0.050 BSC 1.27 BSC

17 29 GD 0.590 0.610 0.630 14.99 15.49 16.00

GE 0.590 0.610 0.630 14.99 15.49 16.00

18 28
c HD 0.680 0.690 0.700 17.27 17.53 17.78

HE 0.680 0.690 0.700 17.27 17.53 17.78

L 0.090 0.100 0.110 2.296 2.54 2.794
y 0.004 0.10
L
A2 A Notes:
1. Dimension D & E do not include interlead
flash.
θ 2. Dimension b1 does not include dambar
e b A1 protrusion/intrusion.
Seating Plane b1 y
3. Controlling dimension: Inches
4. General appearance spec. should be based
GD on final visual inspection spec.

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Package Dimensions, continued

10.3 44-pin PQFP

HD
D Dimension in inch Dimension in mm
Symbol
44 34
Min. Nom. Max. Min. Nom. Max.
A --- --- --- --- --- ---

A1 0.002 0.01 0.02 0.05 0.25 0.5

A2 0.075 0.081 0.087 1.90 2.05 2.20

1 33
b 0.01 0.014 0.018 0.25 0.35 0.45

c 0.004 0.006 0.010 0.101 0.152 0.254

D 0.390 0.394 0.398 9.9 10.00 10.1

E HE E 0.390 0.394 0.398 9.9 10.00 10.1

e 0.025 0.031 0.036 0.635 0.80 0.952

HD 0.510 0.520 0.530 12.95 13.2 13.45

11
HE 0.510 0.520 0.530 12.95 13.2 13.45

L 0.025 0.031 0.037 0.65 0.8 0.95

L1 0.051 0.063 0.075 1.295 1.6 1.905

y 0.003 0.08
12 e b
22
θ 0 7 0 7

Notes:
1. Dimension D & E do not include interlead
c flash.
2. Dimension b does not include dambar
A2 A protrusion/intrusion.
3. Controlling dimension: Millimeter
θ
A1 4. General appearance spec. should be based
See Detail F y L
Seating Plane on final visual inspection spec.
L1 Detail F

Publication Release Date: November 6, 2006

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11. REVISION HISTORY

VERSION DATE PAGE DESCRIPTION
A1 Nov. 26, 2004 - Initial issued
A2 April 20, 2005 23 Add Important Notice
A3 May 11, 2005 2 Add Lead Free (RoHS) parts
November 6, Remove block diagram
A4
2006 2 Remove all Leaded parts

Important Notice
Winbond products are not designed, intended, authorized or warranted for use as components
in systems or equipment intended for surgical implantation, atomic energy control
instruments, airplane or spaceship instruments, transportation instruments, traffic signal
instruments, combustion control instruments, or for other applications intended to support or
sustain life. Further more, Winbond products are not intended for applications wherein failure
of Winbond products could result or lead to a situation wherein personal injury, death or
severe property or environmental damage could occur.
Winbond customers using or selling these products for use in such applications do so at their
own risk and agree to fully indemnify Winbond for any damages resulting from such improper
use or sales.

Headquarters Winbond Electronics Corporation America Winbond Electronics (Shanghai) Ltd.

No. 4, Creation Rd. III, 2727 North First Street, San Jose, 27F, 2299 Yan An W. Rd. Shanghai,
Science-Based Industrial Park, CA 95134, U.S.A. 200336 China
Hsinchu, Taiwan TEL: 1-408-9436666 TEL: 86-21-62365999
TEL: 886-3-5770066 FAX: 1-408-5441798 FAX: 86-21-62365998
FAX: 886-3-5665577
http://www.winbond.com.tw/
Taipei Office Winbond Electronics Corporation Japan Winbond Electronics (H.K.) Ltd.
9F, No.480, Rueiguang Rd., 7F Daini-ueno BLDG, 3-7-18 Unit 9-15, 22F, Millennium City,
Neihu District, Taipei, 114, Shinyokohama Kohoku-ku, No. 378 Kwun Tong Rd.,
Taiwan, R.O.C. Yokohama, 222-0033 Kowloon, Hong Kong
TEL: 886-2-8177-7168 TEL: 81-45-4781881 TEL: 852-27513100
FAX: 886-2-8751-3579 FAX: 81-45-4781800 FAX: 852-27552064

Please note that all data and specifications are subject to change without notice.
All the trademarks of products and companies mentioned in this datasheet belong to their respective owners.

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