Service Man CH

TM
CARDIOCAP II
CH-SERIES
SERVICE MANUAL
All specifications subject to change without notice
Document No. 878910- 1
March 22nd, 1996
Datex-Engstrom Division, Instrumentarium Corp.

P.O.Box 446 SF-00101 Helsinki Finland
Until Oct. 11th, 1996 Tel. +358 0 39411 Fax +358 0 146 3310
After Oct. 12th, 1996 Tel. +358 9 39411 Fax +358 9 146 3310
DATEX CARDIOCAP™ II CH-SERIES SERVICE MANUAL 1-1
1 CONTENTS .......................................................................................................... PAGE

Table of Contents ...................................................................................................... 1-1
List of Figures.. ........................................................................................................ 1-4
List of Tables ............................................................................................................ 1-7
2 WARNINGS AND CAUTIONS.. .............................................................................. 2- 1

Warnings .................................................................................................................... .2-1
Cautions ...................................................................................................................... 2-3
3 INTRODUCTION AND APPLICABILITY OF THIS MANUAL ......................... 3-1

3.1 Introduction and applicability of this manual ............................................... 3-1
3.2 Summary of revision changes ......................................................................... 3-3
3.3 Manual updates ................................................................................................ 3-4
3 . 3 . 1 CARDIOCAP™ II CH-series service manual changes.. .................. 3-4
3.3.2 Record of manual updates carried out .............................................. 3-5
3.4 Software changes ............................................................................................. 3-6
4 GENERAL DESCRIPTION.. .................................................................................... 4- 1

4.1 Typical performance of CARDIOCAP™ II CH-SERIES
monitor ............................................................................................................ 4-1
4.2 Technical specifications of CARDIOCAP™ II CH-SERIES
monitor ............................................................................................................ 4-7
4.3 Principle of operation .................................................................................... 4-11
4.3.1 Principle of ECG measurement ....................................................... 4-11
4.3.2 Principle of Respiratory rate measurement.. ................................... 4-11
4.3.3 Principle of NIBP measurement.. ..................................................... 4-12
4.3.4 Principle of SpO 2 measurement ....................................................... 4-13
4.4 General block diagram .................................................................................. 4-17
4.5 Wiring diagram ............................................................................................. 4-19
4.6 External connector configurations.. .............................................................. 4-20
4.6.1 Input/Output specifications.. ............................................................ 4-20
4.6.2 Connectors ......................................................................................... 4-20
5 DETAILED DESCRIPTION O F MODULES............................................................. 5-1

5.1 ECG Board ...................................................................................................... 5-1
5.2 RESP Board ...................................................................................................... 5-6
5.3 I P T (Invasive-Pleth-Temperature) Board....................................................... 5- 12
December 10th, 1993/3

5.4 NIBP Measurement ....................................................................................... 5-17

5.4.1 NIBP board ........................................................................................ 5-17
5.4.2 Pneumatic unit .................................................................................. 5-27
5.4.3 NIBP air pump .................................................................................. 5-27
5.4.4 Safety valve ...................................................................................... 5-28
5.4.5 NIBP tubing ...................................................................................... 5-28
5.4.6 Twin hose ......................................................................................... 5-28
5.4.7 Blood pressure cuff ........................................................................... 5-29
5.5 SpO2 Measurement.. ...................................................................................... 5-30
5.5.1 SpO2 Measuring Board.. .................................................................... 5-30
5.5.2 SpO2 Processor Board.. ...................................................................... 5-35
5.6 CPU Board .................................................................................................... 5-38
5.7 Video ASIC Board.. ....................................................................................... 5-43
5.8 Power Supply Board ...................................................................................... 5-46
5.9 Mother Board ................................................................................................ 5-51
5.10 Keyboard ....................................................................................................... 5-51
5.11 Loudspeaker Unit ......................................................................................... 5-51
5.12 Internal connector configurations.. ............................................................... 5-55
6 SERVICE AND TROUBLESHOOTING .................................................................. 6-1

6.1 General service information ........................................................................... 6-1
6.2 Disassembly and reassembly ........................................................................... 6-2
6.3 Troubleshooting .............................................................................................. 6-4
6.3.1 Monitor start-up sequence .................................................................. 6-4
6.3.2 Troubleshooting in general ................................................................. 6-5
6.3.3 ECG board troubleshooting ............................................................... .6-7
6.3.4 RESP board troubleshooting .............................................................. .6-8
6.3.5 IPT board troubleshooting .................................................................. 6-9
6.3.6 NIBP board troubleshooting ............................................................. 6-10
6.3.7 SpO2 measuring electronics troubleshooting.. .................................. 6-12
6.3.8 SpO2 processor board troubleshooting ............................................. 6-14
6.3.9 CPU board troubleshooting .............................................................. 6-15
6.3.9.1 Instructions after replacing the software or CPU
board ........................................................................................... 6-15
6.3.10 Video ASIC board troubleshooting .................................................. 6-16
6.3.11 Power supply board troubleshooting.. .............................................. 6-17
6.3.12 Mother board/Keyboard troubleshooting.. ...................................... 6-18
6.3.13 Loudspeaker troubleshooting ............................................................ 6-18
6.4 Service mode ................................................................................................. 6-19
ADJUSTMENTS.. ..................................................................................................... 7-1

7.1 ECG board adjustment.. ................................................................................. 7-1
7.2 RESP board adjustment .................................................................................. 7-2
7.3 IPT board adjustment.. .................................................................................... 7-3
March 22nd, 1996/4

7.4 NIBP board adjustment.. ................................................................................. 7-4

7.5 SpO2 processor board adjustment ................................................................... 7-5
7.6 CPU board adjustment .................................................................................... 7-5
7.7 Video display unit (Philips) adjustment ......................................................... 7-6
8 FUNCTIONAL FIELD CHECK PROCEDURE ..................................................... 8-1

8.1 Preoperative check list .................................................................................... 8-1
8.2 Checks after component replacements ........................................................... 8-3
8.3 Preventive maintenance check list.. ................................................................ 8-5
9 SPARE PARTS ......................................................................................................... 9-1

9.1 Spare parts ....................................................................................................... 9-1
9.2 Service accessories ......................................................................................... 9-4a
12 APPENDICES ......................................................................................................... 12-1
A COMPUTER OUTPUT ........................................................................................... 12-1
B CCP-104 GRAPHICS PRINTER ............................................................................ 12-5
C TRILINGUAL LIST OF ERROR MESSAGES.. ................................................... 12-6
March 22nd, 1996/4

List o f Figures................................................................................................................ PAGE
Absorption coefficients of oxy- and deoxy-hemoglobin in the red and

near-infrared regions ............................................................................................ 4-14
Absorption of infrared light in the finger ........................................................... 4-15
Finger sensor parts layout and schematic diagram .............................................. 4-16
General block diagram .......................................................................................... 4-18
Wiring diagram ...................................................................................................... 4-19
ECG board block diagram ...................................................................................... 5-3
ECG board parts layout (CH, CH-2, CH-S, CH-2S) ............................................ 5-4
ECG board schematic diagram (CH, CH-2, CH-S, CH-2S) .............................. .5-4a
ECG board parts layout (CH-R, CH-1R, CH-RS, CH-1RS)

(board modification level 5 and higher) ................................................................. 5-5
ECG board schematic diagram (CH-R, CH-1R, CH-RS, CH-1RS)

(board modification level 5 and higher) ................................................................ 5-5a
RESP board block diagram ..................................................................................... 5-7
RESP board parts layout and schematic diagram

(board modification level 5 and higher) ............................................................... 5-11
IPT board block diagram ...................................................................................... 5-14
IPT board (board modification level 4 and higher) and

IPT connector board parts layouts and IPT connector board
schematic diagram ................................................................................................. 5-15
IPT board schematic diagrams ............................................................................ 5-16a
Block Diagram of NIBP System (USA Version) ................................................... 5-24
NIBP board parts layout and schematic diagram

(part 1 ) (board modification level 4 and lower). .................................................. 5-25
5.10a NIBP board schematic diagram

(part 2) (board modification level 4 and lower) ................................................... 5-25a
March 22nd, 1996/4

5.11 NIBP board parts layout schematic diagram

(part 1) (board modification level 5 and higher)....................................................5-26
5.11a NIBP board schematic diagram

(part 2) (board modification level 5 and higher) .................................................5-26a
5.12 SpO2 measuring board block diagram, parts layout

and timing diagram ............................................................................................. 5-32
5.13 SpO2 measuring board schematic diagram ......................................................... 5-33
5.14 SpO 2 measuring board signal waveforms...............................................................5-34a
5.15 SpO2 processor board block diagram and parts layout

(board modification level 6 and higher)................................................................ 5-36
5.16 SpO2 processor board schematic diagram

(board modification level 6 and higher) .............................................................. 5-37
5.17 CPU board block diagram and parts layout...........................................................5-40
5.18 CPU board schematic diagram (part 1) .............................................................. 5-41
5.19 CPU board jumper configuration and schematic diagram

(part 2) .................................................................................................................. 5-42
5.20 Video ASIC board parts layout............................................................................ 5-44
5.21 Video ASIC board schematic diagram ................................................................ 5-45
5.22 Power supply board block diagram....................................................................... 5-47
5.23 Transformer diagram and power supply board signal waveforms..............................5-48
5.24 Power supply board parts layout and schematic diagram

(part 1) ................................................................................................................. 5-49
5.25 Power supply board schematic diagram (part 2) ................................................. 5-50
5.26 Mother board parts layout and schematic diagram

(board modification level 3 and higher)................................................................ 5-52
5.27 Keyboard parts layout and schematic diagram.......................................................5-53
5.28 Loudspeaker unit parts layout and schematic diagram........................................5-54
March 22nd, 1996/4

7.1 Video display unit adjustment .............................................................................. 7-6
9.1 Exploded pictures of the monitor ........................................................................ 9-5
9.2 ECG, IPT, and RESP board assembly .................................................................. 9-6
9.3 Pneumatic unit parts layout.. ................................................................................ 9-7
March 22nd, 1996/4

List of Tables.. ............................................................................................................... PAGE
4.1 Pin order of the ECG connector ........................................................................... 4-20
4.2 Pin order of the invasive pressure connector (PRESSURE 1)............................. 4-21
4.3 Pin order of the invasive pressure connector (PRESSURE 2). ............................ 4-21
4.4 Pin order of the pulse oximeter sensor connector (SpO2) .................................... 4-21
4.5 Pin order of the SERIAL & ANALOG connector.. .............................................. 4-22
4.6 Pin order of the AUX I/O connector.. .................................................................. 4-23
5.1 Video ASIC board (X1) - Mother board (X1). ..................................................... 5-55
5.2 Main CPU board (X1) - Mother board (X2). ....................................................... 5-56
5.3 SpO 2 processor board (X1) - Mother board (X3). ................................................ 5-57
5.4 NIBP board (X1) - Mother board (X4). ................................................................ 5-58
5.5 Power supply board (X10) - Mother board (X5). ................................................. 5-59
5.6 SpO2 measuring board (X2) - SpO2 processor board (X2). .................................. 5-60
5.7 Keyboard (X1) - Mother board (X8) .................................................................... 5-60
5.8 ECG board - Mother board (X12). ........................................................................ 5-61
5.9 IPT board - Mother board (X10). .......................................................................... 5-61
5.10 Power supply board - Mother board (X6). ............................................................ 5-61
5.1 1 ECG board - RESP board (X7) ............................................................................ 5-62
5.12 Mother board test connector (X13). ....................................................................... 5-62
5.13 Video ASIC board (X2) - Video unit main pc board (X13). ............................... 5-62
5.14 Front panel SpO 2 connector - SpO 2 measuring board (X1). ................................ 5-63
5.15 Power supply board (X1) - Line transformer.. ..................................................... 5-63
5.16 Power supply board (X3) - Fan ............................................................................. 5-63
5.17 Power supply board (X6) - Video unit main pc board.. ...................................... 5-64
March 22nd, 1996/4

Power supply board (X8) - Loudspeaker .............................................................. 5-64
NIBP board (X2) - NIBP Pump.. ........................................................................... 5-64
General troubleshooting chart.. ................................................................................. 6-5
ECG board troubleshooting chart.. ........................................................................... 6-7
RESP board troubleshooting chart ........................................................................... 6-8
IPT board troubleshooting chart.. ............................................................................ 6 - 9
NIBP board troubleshooting chart.. ........................................................................ 6-10
SpO 2 measuring electronics troubleshooting chart ................................................ 6-13
Power supply board troubleshooting chart ............................................................ 6-17

2 WARNINGS AND CAUTIONS

WARNINGS
A WARNING indicates that there is a possibility of injury to

yourself or others.
PROPER GROUNDING: For protection against shock hazards:
Connect this monitor to a three-wire, grounded, hospital

grade receptacle.
The power cord and plug must be intact and undamaged.
Do not remove the grounding prong from the power plug. Do not
use extension cords or adapters of any type.
Replace the power cord if it becomes cracked, frayed, broken or

otherwise damaged.
Confirm that AC-operated equipment used with the

monitor is properly grounded.
Do not perform any testing or maintenance on medical

instruments while they are being used to monitor a patient.
Do not break or bypass the patient isolation barrier when

testing ECG, Invasive-Pleth-Temp or SpO2 measuring
boards.
Use only defibrillation protected invasive pressure sensors on

DATEX-ENGSTROM Monitors.
EXPLOSION HAZARD: Do not use this monitor in the presence

of flammable anesthetics.
FUSE REPLACEMENT: Replace the fuse with a fuse of the same

type and with the same rating.
PATIENT SAFETY: Do not modify patient cables.
Use only patient cables and accessories approved by DATEX-

ENGSTROM. Other cables and accessories may damage the
monitor or interfere with measurement.
Do not use ECG during MRI.
March 22nd, 1996/4

ELECTRIC SHOCK HAZARDS:
High Voltage is present within the CRT display unit.
In case of mechanical damage, inspect the integrity of the

patient isolation circuits, CRT unit, the power supply
transformer and power entry module.
Do not immerse the monitor in any liquid.
Do not immerse the SpO2 sensor in any liquid.
Do not use a sensor that is suspected of being immersed in liquid.

It may cause burns during electrosurgery.
Switch the power off and unplug the power cord before
cleaning or service.
Do not touch any exposed wiring or conductive surface while the

cover is off and the monitor is energized. The voltages present
when the electric power is connected to the monitor can cause
injury or death.
Perform a final electrical safety check and current leakage

test after doing any repair or calibration procedure to the
monitor.
The manufacturer accepts no responsibility for any

modifications made to the monitor outside the factory.
March 22nd, 1996/4

CAUTIONS
A CAUTION indicates a condition that may lead to equipment

damage or malfunction.
The tests and repairs described in this manual should only

be done by trained personnel with proper tools and test
equipment. Unauthorized service may void the monitor
warranty.
Check the rear panel voltage setting before connecting the

monitor to AC mains power outlet.
Leave space behind the monitor to allow for proper

ventilation.
Clean or replace the fan filter regularly.
Before use, allow five minutes for warm-up and note any
error messages or deviations from expected operation. See
the Operator’s Manual.
Switch the monitor off before making any connections with

external equipment.
Do not use ammonia-, phenol-, or acetone-based cleaners.

These cleaners may damage the monitor surface.
Electrostatic discharge through the PC boards may damage

the components.
Before replacing and repairing PC boards, wear a static control

wrist strap.
Handle all PC boards by their non-conductive edges and use anti-

static containers when transporting them.
Do not apply tension to the power cord.
Do not autoclave the monitor nor sensors.
Do not gas sterilize the monitor.
March 22nd, 1996/4

3 INTRODUCTION AND APPLICABILITY OF THIS MANUAL
3.1 Introduction and applicability of this manual

This service manual (Doc. No. 878910) provides information
required to maintain and repair the DATEX-ENGSTROM
CARDIOCAP™ II CH-series monitors. This manual is applicable
for the current production revision of the monitors. Differences
between monitor revisions are summarized in Section 3.2 and the
technical details of earlier revisions given in Chapter 11. Section
3.3 lists the hardware changes made to the monitor and Section 3.4
the software changes.
The revision of a monitor is changed when technical changes are

made to the monitor resulting in new spare parts that are
incompatible with earlier units. The last two digits of the monitor
type designation denote the revision of the monitor (e.g. CH-RS-
23-00 is a revision -00 unit).
Major parts, assemblies, and PC boards will have ID code stickers

indicating the modification level of the production documentation.
The code is shown as xxxxxx-y, where the “xx...” represents the
part number and “y” the revision level, which is referred to when
hardware changes are indicated in this manual.
March 22nd, 1996/4

The following list shows the models and their monitoring

parameters.
MODEL MONITORING PARAMETERS
CH ECG, NIBP, Temp

CH-2 ECG, NIBP, Temp, 2 x invBP
CH-R ECG, NIBP, Temp, Resp*)
CH-1R ECG, NIBP, Temp, invBP, Resp*)
CH-S ECG, NIBP, Temp, SpO2
CH-2S ECG, NIBP, Temp, SpO2, 2 x invBP
CH-RS ECG, NIBP, Temp, SpO2, Resp
CH-1RS ECG, NIBP, Temp, SpO2, invBP, Resp
*) Manufacturing discontinued from revision -04 on.
This manual describes all the functions offered by the

CARDIOCAP™ II CH-series monitors. Some of the functions
may not be available in the monitor you are using.
Please review the Operator’s Manual to obtain a clear

understanding of the monitor.
The manufacturer reserves the right to make changes in product

specifications at any time and without prior notice. The
information in this document is believed to be accurate and
reliable; however the manufacturer assumes no responsibility for its
use.
March 22nd, 1996/4

3.2 Summary of revision changes

Revision -00
Initial production revision of the monitor.
Revision -01
The main differences to the revision -00 are:
- Main software
- NIBP software
- SpO2 software
- NIBP tubing redesigned
- One of the NIBP measurement patient groups, NEONATAL is

changed to INFANT. The specification of INFANT is 5 kg or
more, one to twelve months old.
Revision -02
Current production revision of the monitor. The main differences

to the revision -01 are:
- Main software
- NIBP software (except for Germany)
- SpO2 software
- High speed main CPU board (p/n 880523) installed to replace the
existing board (p/n 878822)
- Enlarged fan airway inlet and larger dust filter
- Power supply board modified
- ECG board modified
- NIBP pneumatic unit modified
March 20th, 1992/2

DATEX CARDIOCAP™ II CH-SERIES SERVICE MANUAL 3-3a
Revision -03
The main differences to the revision -02 are:
- Main software
- SpO2 software
- SpO2 measuring board
Revision -04
Current production revision of the monitor. The main differences

to the revision -03 are:
- CE approval and marking accordingly
- Improved EMC protection including new ECG board, IPT board

and SpO 2 board. The main mechanical modifications have been
made on the rear panel, which now has a transformer case and a
new mains switch.
- Video control board has been replaced by video ASIC board.
March 22nd, 1996/4

3.3 Manual updates
3.3.1 CARDIOCAP™ II CH-series service manual changes

This is update number 3. We have made the following changes to
this manual:
- started printing on both sides of pages to decrease manual

thickness.
- gave up costly extensive pages.
Carry out the update by making the changes shown under this
update number in the list below:
- replace pages which already exist in the manual.
- insert pages which do not exist yet in the manual after the
previous entry in numerical or an alphabetical order.
- of all the pages removed from the manual, the following pages
should be filed in chapter 11. All other pages are thrown away.
5-5, 5a, 11, 11a, 15, 16, 33, 33a, 33b, 34, 34a, 34b, 37, 37a, 42,
45, 52
After having made the changes required, replace Section 3.3.1 of

the manual with this one and sign the record of updates in Section
3.3.2.
No Page Change Date
1 3-3 Revision 01 introduced. September 2nd, 1991
3-7,8 Revision 01 software added.
4-1...6 Typical performance revised.
4-12 Note on neonatal changed.
4-16 Figures changed.
5-16 A7 pin 15 corrected to pin 16.
5-24 Neonatal changed to infant.
5-25 Program Eprom text location corrected.
5-27...29 Neonatal changed to infant.
5-42 CPU board jumper table revised.

5-50 Power supply board schematic diagram replaced.
6-6 Cuff occlusion message added.
9-1...4 Spare parts list revised.
9-7 Pneumatic unit illustration changed.
12-3 Status string corrected.
12-4 Capnomac text deleted.
3-3 Revision 02 introduced. 20th March 1992
3-7, 9...11 Text revised. Revision 02 software described.
4-6 Trends table revised.
4-12...14 Principles of measurement revised.
4-22 Pin order table revised.
5-4 ECG board modified.
5-29 Pediatric cuff renamed to Child.
5-38...42 High speed CPU board introduced.
5-49, 50 Power supply board modified.
6-15 CPU board troubleshooting text revised.
7-4 R31 corrected to R6 in NIBP board adjustment
7-5 CPU board adjustment text revised.
9-1...4 Spare parts list revised.
9-7 Pneumatic unit parts layout changed.
12-1...6 Appendices pages revised. Page 12-5 removed.
1-1...8 Contents revised. 10th December 1993
3-3a Revision 03 added.
3-7, 9, 12 Text revised. Revision 03 software described.
4-3...6 Text revised.
4-5 Max. cuff pressure limited to 330 mmHg.

DATEX CARDIOCAP™ II CH-SERIES SERVICE MANUAL 3-4b
4-16 Text and figure revised.
4-21 Table 4.4 revised.
4-22, 23 Tables revised.
4-24 Page removed.
5-4...4a Page layout changed.
5-5...5a ECG board parts layout and schematic diagram updated. Page
layout changed
5-11 RESP board schematic diagram updated.
5-15...16 IPT board parts layout and schematic diagram updated. Page
layout changed.
5-24 Text and figure revised.
5-25...26a Page layout changed.
5-28 Safety valve check added.
5-32...34a SpO2 measuring board changed. Page layout changed.
5-36...37 SpO2 processor board parts layout and schematic diagram

updated. Page layout changed.
5-40...42 Jumper position changed. Page layout changed.

5-44...45 Video control board parts layout, timing diagram and schematic
diagram updated. Page layout changed.
5-48...50 Page layout changed.
5-52 Mother board parts layout schematic diagram updated.
5-55, 56 Tables revised.
5-63 Table 5.15 revised.

6-1 Text revised.
6-5...6 Error messages added.

6-15 Text added.
6-19 Service mode introduced.

DATEX CARDIOCAP™ II CH-SERIES SERVICE MANUAL 3-4c
9- 1...4 Spare parts added.
9-5 Figure revised. Page layout changed.
12-1...4 Text revised. The status characters of the standard string and
status code interpretation added.
12-16...17 Page layout changed.
12-21 Trilingual list of error messages added.
Company name & phone info changed. 22nd March 1996
1-1 Table of Contents updated
1-4 List of Figures updated
1-7 List of Tables updated
2-1 ECG/MRI warning added to Patient Safety
3-1 Panasonic Service Manual deleted
3-2 Note “Manufacturing discontinued...” added.
3-3a Revision 04 introduced
3-4c Revision 04 manual changes introduced
3-5 Revision 04 introduced
3-12 Word “current” deleted
3-13 New page added for 04 softwares
4-5 Word “Germany” replaced by
“in adaptation 70 monitors”.
4-10 Power req. changed from 100/115/220/240
to 100/115/220-240
4-16,17 Probe changed to sensor
4-21 Table 4.2: Pins 6-8 to not connected
Pin 9 to P Ground
5-4,4a ECG board parts layout and schematic changed
March 22nd, 1996/4

DATEX CARDIOCAP™ II CH-SERIES SERVICE MANUAL 3-4d
5-5,5a ECG board parts layout and schematic changed
5-12,13 IPT Board text revised
5-14...16 IPT board artworks changed
5-32...34 SpO2 meas. board artworks changed.
5-39 Caution text revised.
5-43 Video control board changed to Video ASIC
board, text revised
5-44,45 New artworks for Video ASIC board
5-46 Supply voltage changed from +15 V to +5 V.
5-47 Power supply board block diagram changed
5-48 Transformer diagram changed
5-62 Video control board changed to Video ASIC
board
5-63 Probe changed to sensor
6-6 New message “NIBP INACTIVE ? SELF CHECKING...
and explanation added
6-16 Video control board changed to Video
ASIC board, text revised
7-6 New section 7.7 Video Display Unit (Philips)
Adjustments and one new artwork
9-1...5 Spare parts list and exploded monitor parts
pictures updated
12-6 CCK-104 Keyboard chapter deleted, old
appendix D (Trilingual list of error
messages) becomes appendix C.
March 22nd, 1996/4

3.3.2 Record of manual updates carried out
Update Carried out by

number Name Date
1 DATEX September 2nd, 1991
2 DATEX March 20th, 1992
3 DATEX December 10th, 1993
4 DATEX-ENGSTROM March 22nd, 1996
10
11
12
13
14
15
16
17
18
19
20
March 22nd, 1996/4

3.4 Software changes

The software code (six numbers) and revision number (if other
than initial revision) are displayed on the screen during the startup
sequence.
The initial production software versions are as follows.
ITEM DESCRIPTION ORDER No.
CPU board
Software EPROM (-, 2, R, 1R) (English) 878107
(-, 2, R, 1R) (German) 878108
(-, 2, R, 1R) (French) 878109
(-, 2, R, 1R) (Germany) 878110
(S, 2S, RS, 1RS) (English) 878111
(S, 2S, RS, 1RS) (German) 878112
(S, 2S, RS, 1RS) (French) 878113
(S, 2S, RS, 1RS) (Germany) 878114
NIBP board
NIBP software EPROM 877039
EPROM (Germany) 877040
SpO2 processor board

SpO2 software EPROM 875360
September 2nd, 1991/1

The production revision 01 softwares are as follows.
CPU board
(-, 2, R, 1R) (German) 879426
(-, 2, R, 1R) (French) 879427
(-, 2, R, 1R) (Germany) 879428
(S, 2S, RS, 1RS) (English) 879529
(S, 2S, RS, 1RS) (German) 879430
(S, 2S, RS, 1RS) (French) 879431
(S, 2S, RS, 1RS) (Germany) 879432
NIBP board

SpO2 software EPROM 878105
The following changes have been made to the initial software

version.
Main software
- Graphic trends are available in two pages:

First page: HR, SpO2, NIBP, invBP1, invBP2
Second page: SpO2, RR
- 4 and 8 hour trends added. Trends also in numeric form (HR,

NIBP, invBP1, SpO2).
- Numeric trends printed in CCP printer.
- Real time ECG waveform displayed while viewing the trend.
- PROBE OFF/NO PROBE alarm sequences revised.
- Audible ECG leads off alarms added.
- Return from deeper menu levels to the first menu level can be
short cut by hitting the respective menu hardkey.
- Straight access from a parameter menu to another is possible

without pressing the RETURN TO MONITOR key.
- ECG displayed in cascade form if pleth waveform is selected to

the lowest display field.

- CO 2 waveform from DATEX-ENGSTROM Ultima monitor can

be displayed on the third display field.
- Audible indication of NIBP measurement readiness is available.
NIBP software
- NIBP autocycling mode is interrupted if a cuff loose state is

detected.
- Cuff occlusion alarm is added.
SpO2 software
- Two level measuring light intensity adjustment is done

automatically.
- Averaging time is selectable between 5 and 10 seconds.
NOTE: To upgrade CARDIOCAP II monitors from 00 to 01

revision, all three new software (CPU, NIBP, and SpO2) should
be installed simultaneously because none of the revision 00
software is compatible with revision 01 software.
NOTE: All three new software (CPU, NIBP, and SpO2) can be
installed in revision 00 monitors simply by replacing the
software EPROMs and shorting the jumper X2 pins 1 and 2 on
the CPU board.
March 22nd, 1996/4

CPU board
(-, 2, R, 1R) (German) 880789
(-, 2, R, 1R) (French) 880790
(-, 2, R, 1R) (Germany) 880791
(S, 2S, RS, 1RS) (English) 880784
(S, 2S, RS, 1RS) (German) 880785
(S, 2S, RS, 1RS) (French) 880786
(S, 2S, RS, 1RS) (Germany) 880787
NIBP board

S p O 2 software EPROM 878105
The following changes have been made to the revision 01 software

version.
Main software
- More complete numeric trends presentation
- More complete real time waveform presentation
- Capable of recognizing the hardware and software levels of the

main CPU board, NIBP and SpO2 modules of the monitor:
16 MHz CPU board or 11.7 MHz CPU board
NIBP hardware of CARDIOCAP II or NIBP of

CARDIOCAP I
SpO2 hardware of CARDIOCAP II or SpO2 of

CARDIOCAP I
- Automatically, when setting the system up, adjusts the

intermodular communication protocols and menu structures on the
screen accordingly. That is why this software can be installed also
into CARDIOCAP II revisions 00 and 01 units as well as into
CARDIOCAP I units (with the main CPU board p/n 878822).
- The patient group PEDIATRIC is renamed to CHILD.

NOTE: This new software can be installed into all CARDIOCAP

II revision 01 units without any modifications. Note that some
new features need the new high speed main CPU board to be
activated.

II revision 00 units with main CPU board jumper modifications
(pins 1 and 2 shorted in jumpers X2 and X4).
NIBP software
- Improved performance in cases like small children, moving and

shivering patients, high blood pressures, low blood pressures,
strong and weak pulses.

II revision 00 and 01 units without any modifications.
- Improved performance in NO PROBE conditions.

II revision 01 units without any modifications.

II revision 00 units together with rev 01 or 02 main software
after the CPU board jumper modifications (pins 1 and 2 shorted
in jumpers X2 and X4).
Upgrading
To upgrade CARDIOCAP II units from 00/01 to 02 revision, all

three new software (CPU, NIBP, and SpO2) should be installed
simultaneously as well as the high speed CPU board.
If the new high speed CPU board is not desired, the three new
softwares can simply be installed into CARDIOCAP II units 01
revision monitors. All three new softwares (CPU, NIBP, and SpO2)
should be installed simultaneously.
If the new high speed CPU board is not desired, the three new
softwares can be installed into CARDIOCAP II units 00 revision
monitors with the CPU board jumper modification. All three new

software (CPU, NIBP, and SpO2) should be installed

simultaneously.
NOTE: All three new softwares have to be installed at the same

time. None of the previous revision softwares are compatible
with the new softwares.
March 20th, 1992/2

CPU board
(-, 2, R, 1R) (German) 882598
(-, 2, R, 1R) (French) 882599
(-, 2, R, 1R) (Germany) 882600
(S, 2S, RS, 1RS) (English) 882593
(S, 2S, RS, 1RS) (German) 882594
(S, 2S, RS, 1RS) (French) 882595
(S, 2S, RS, 1RS) (Germany) 882596
NIBP board

SpO 2 software EPROM 882881
The following changes have been made to the revision 02 software

version.
Main software
- Automatically, when starting up the monitor the real-time clock

and the EEPROM are checked. A warning message “MEMORY
CIRCUIT FAILURE / CALL SERVICE” will be displayed if:
- The real-time clock is in disorder or has stopped.
- A fault has been detected in the memory circuit D4.
- If the temperatures or the invasive pressures have not been

calibrated after a factory reset the following messages will be
displayed:
- TEMPERATURE NOT CALIBRATED, RECALIBRATE
- INVASIVE BP NOT CALIBRATED, RECALIBRATE
March 22nd, 1996/4

CPU board
Software EPROM (-, 2) (English) 882597
(-, 2) (German) 882598
(-, 2) (French) 882599
(S, 2S, RS, 1RS) (English) 882593
(S, 2S, RS, 1RS) (German) 882594
(S, 2S, RS, 1RS) (French) 882595
NIBP board

SpO 2 software EPROM 882881
March 22nd, 1996/4

4 GENERAL DESCRIPTION
4.1 Typical performance of CARDIOCAP™ II CH-SERIES monitor
Measurement method
3-lead ECG
5-lead ECG (not with Respiratory rate measurement)
Lead selection
I, II, III with standard 3-lead cable

V connection with optional 5-lead cable (not with Respiratory rate
measurement)
Measuring range
QRS detection 0.5 - 5 mV, 40 - 200 ms

Allowable offset ±300 mV
Waveform display
Frequency response 0.5 - 30 Hz

Sweep speeds 12.5 and 25 mm/s
Gain range 0.2 - 4.0 mV/cm
Numerical display (heart rate)
Range 30 - 230 beats/min

Accuracy ±1 %
Resolution 1 beat/min
Averaging 10 s
Update interval 5s
Alarms
Asystole no QRS detected in 7 s
Heart rate
high limit adjustable 30 - 250 beats/min
low limit adjustable 30 - 250 beats/min
alarm delay 10 s after limit violation

RESPIRATION
Measurement method
Transthoracic impedance
Measuring range
0.3 - 3 ohm (dynamic), max. transthoracic impedance 3 kohm
Waveform display
Frequency response 0.1 - 3 Hz (-3 dB)

Sweep speed 6.25 mm/s
Length of trace approx. 16 s
Numerical display (respiratory rate)
Range 0, 2 - 180 breaths/min

Accuracy ±3 breaths/min
Resolution 1 breath/min
Averaging 30 s
Update interval 2s
Alarms
Apnea no breath detected during time speci-

fied by apnea alarm limit (3 - 30 s)
Respiratory rate
high limit adjustable 2 - 180 breaths/min, OFF
low limit adjustable 2 - 180 breaths/min, OFF

INVASIVE BLOOD PRESSURE
Measurement method Transducer 50 uV/cmHg/V,

20 mA max. current
Measuring range -40 - 260* mmHg
Zero adjustment range ±100 mmHg
Calibration range ±50 %
Waveform display
Frequency response 0 - 20 Hz
Sweep speeds 12.5 or 25 mm/s
Scales -5 - 32 mmHg
-10 - 65 mmHg
-20 - 130 mmHg
-40 - 260* mmHg
Numerical display
Range -40 - 260* mmHg

Resolution 1 mmHg
Averaging 10 s
Update interval 5s
Alarms
Systolic pressure
high limit adjustable -40 - 260* mmHg
low limit adjustable -40 - 260* mmHg
* 230 mmHg in Germanv

TEMPERATURE
The temperature channel is YSI 400 series sensors compatible
Numerical display in °C or °F
Update interval 24 s
Amplifier accuracy ±0.1°C (25.0 - 45.0°C) /

±0.2°F (77.0 - 113.0°F)
±0.2°C (15.0 - 24.9°C) /
±0.4°F (59.0 - 76.8°F)
Sensor accuracy ±0.1°C (15 - 45°C)/

(YSI 400 series) ±0.2°F (59.0 - 113.0°F)
NON-INVASIVE BLOOD PRESSURE
Measurement method Oscillometric
Measuring range Adult 25 to 260* mmHg

Pediatric 25 to 195 mmHg
Infant 15 to 145 mmHg
Accuracy Compared to auscultatory method in adults (slow deflation

speed):
systolic ±5 mmHg, STD < 8 mmHg, diastolic ±5 mmHg,
STD < 8 mmHg
Compared to auscultatory method in neonates (normal

deflation speed):
systolic ±5 mmHg, STD < 8 mmHg, diastolic ±5 mmHg,
STD < 8 mmHg
Accepted heart rate 30 to 250 beats/min
Measurement intervals manual, continuous for 5 min,

1, 2, 3, 5, 10, 15, 30, 60 min
Measurement time
March 22nd, 1996/4

Safety Limits Adult Pediatric Infant
Max. measurement time 2 min 2 min 1 min

Max. inflation pressure 280 mmHg 200 mmHg 150 mmHg
Overpressure limit, stops
measurement 320 mmHg 220 mmHg 165 mmHg
Initial inflation pressure 185 mmHg 185 mmHg 120 mmHg
Successive infl. pressures syst + 40 syst + 40 syst + 40
Next infl. pressure after
‘low infl press’ message +50 mmHg +50 mmHg +40 mmHg
Stasis time 2 min 2 min 1 min
Stasis pressure 80 mmHg 60 mmHg 40 mmHg
Mechanical safety valve limits max. cuff pressure to 330 mmHg.

Independent timing circuit limits pressurization to max. 5 min.
Alarms
Systolic pressure
high limit OFF, adjustable 30 - 260* mmHg
low limit OFF, adjustable 30 - 260* mmHg
* 230 mmHg in adaptation 70 monitors
OXYGEN SATURATION
Measurement method Red and infrared light absorption
Numerical display
Range 40 - 100 %
Accuracy 100 - 80 %, ±2 % SpO 2 (±l STD)
Resolution 1%
Averaging 6 s (rev 00), 5 s/10 s (01)
Update interval 2s
Alarms
SpO 2
high limit adjustable 40 - 99 %, OFF
low limit adjustable 40 - 99 %
Pulse beep pitch corresponds to SpO2 level
March 22nd, 1996/4

PLETH
Automatic scale setting when sensor is attached.

User-adjustable scale during operation.
Heart rate
Range 30 - 250 bpm

Accuracy ±1 %, ±1 bpm
Resolution 1 bpm
Averaging 5 s or 10 s (selectable)
Update interval 5s
Alarms
Heart rate
high limit adjustable 30 - 250 beats/min
low limit adjustable 30 - 250 beats/min
alarm delay < 3 s after limit violation
TRENDS
Revision 00
2 hours graphic trends of Heart Rate, Respiration Rate, Systolic

and Diastolic Pressures, SpO2, and Pleth Amplitude. Sampled every
10 s except NIBP.
Revision 01 and up
0.5, 2, 4, 8 hours of graphic and numerical trends of Heart Rate

(0.5 hour trend Revision 02 and up), Respiration Rate, Systolic and
Diastolic Pressures, SpO2, and Pleth Amplitude. Sampled as follows
except NIBP.
Trend Time Sampling Rate Display Rate
0.5 h HR (10 s), RR (20 s) every 10 s

2 h SpO2 (30 s) Pleth (30 s) every 10 s value
4 h P1 (40 s, 20 s if no P2) every 20 s average
8 h P2 (40 s) every 40 s average
March 22nd, 1996/4

4.2 Technical specifications of CARDIOCAP™ II CH-SERIES

monitor
Subject to change without notice
The ECG channel features an integral electrosurgery filter, defibrillator

protection and pacemaker pulse detection and rejection.
Patient Safety Type CF isolation
RESPIRATION
Input impedance 6.4 Mohm at 10 Hz

1.3 Mohm at 50 Hz
Sensitivity 1 V/ohm
Excitation signal frequency 48.3 kHz (nominal)
Auxiliary patient current
The EGG/ Respiration channel features an integral electrosurgery filter,

defibrillator protection and pacemaker pulse detection and rejection.
Novemher 15th, 1990

INVASIVE BLOOD PRESSURE
Amplifier
TEMPERATURE
The temperature channel is YSI 400 series sensors compatible
NON-INVASIVE BLOOD PRESSURE
Pressure transducer accuracy better than ±3 mmHg

or ±2 % (whichever greater)
Patient Safety Type BF isolation
March 22nd, 1996/4

OXYGEN SATURATION
The pulse oximeter accuracy measurements are statistically derived and

correlated to simultaneous SpO2 measured on an Instrumentation Laboratory
IL/282 CO-oximeter.
Accuracy 100 - 80 %, ±2 % SpO2 (±1 STD)

80 - 50 %, ±3 % SpO2 (±1 STD)
50 - 40 %, unspecified
PLETH
Automatic scale setting when sensor is attached.

User-adjustable scale during operation.
Amplifier Bandwidth 0.8 to 15 Hz (-3 dB)
ALARMS
Adjustable audio alarm sound, rear panel loudspeaker

(approximately 900 Hz)
Adjustable high/low alarm limits for heart rate, systolic pressures,
SpO2, respiratory rate
Adjustable alarm for apnea
Alarm for asystole
DISPLAY
9” green monochrome picture tube

Resolution 1024 x 256 pixels
Clock
March 22nd, 1996/4

GENERAL DATA
Safety standard fulfilled

IEC 601-1, Safety class I
CSA C22.2 No.125-M1584
Operating temperature 10 to 35°C / 50 to 95°F

Storage temperature -5 to 50°C / 23 to 122°F
Power requirements 100/115/220-240 V
50/60 Hz
120 W, 600 mA
DxWxH 340 x 330 x 210 mm
13.4 x 13.0 x 8.3 inches
Weight 12 kg / 26 lbs
EXTERNAL CONNECTIONS
Serial data output for computer interface (SERIAL & ANALOG

I/O connector) and graphics printer (AUX I/O connector)
Composite video output
ECG, PLETHYSMOGRAPH or PRESS1, PRESS2 analog waveform
output (SERIAL & ANALOG I/O connector)
ECG test signal
AC, DC power supply connection
Alarm signal (Nurse call)
March 22nd, 1996/4

4.3 Principle of operation
4.3.1 Principle of ECG measurement

Electrocardiography is the process of analysing the electrical
activity of the heart by measuring the electrical potential produced
with electrodes placed on the surface of the body.
ECG reflects:
Electrical activity of the heart
Normal/abnormal function of the heart
Effects of anesthesia on heart function
Effects of surgery on heart function
See the Operator’s Manual for electrodes positions and other

information.
4.3.2 Principle of Respiratory rate measurement

Impedance Respiration is a technique of monitoring respiratory
rates of a patient based on fractional changes in thoracic
impedance between two electrodes. These electrodes are the same
electrodes used for ECG measurement.
When monitoring ECG and respiratory rates simultaneously the

position of the electrodes is crucial. See the Operator’s Manual for
more information.
November 15th, 1990

4.3.3 Principle of NIBP measurement

NIBP (Non-Invasive-Blood-Pressure) is an indirect method for
measuring blood pressure.
The NIBP measurement uses the oscillometric measuring principle.

The cuff is inflated with a pressure slightly higher than the
presumed systolic pressure, then slowly deflated at a speed based
on the patient’s heart rate, collecting data from the oscillations
caused by the pulsating artery. Based on these oscillations, the
monitor calculates values for systolic, mean, and diastolic pressures.
The NIBP measuring unit is a fully automatic, self-contained non-

invasive blood pressure measuring system which communicates
with the main CPU via an asynchronous serial channel. All NIBP
functions are controlled by the NIBP’s CPU in the NIBP board.
The NIBP system contains the following main parts:
- NIBP board
- Pneumatic
- NIBP air pump
- Safety valve
- NIBP tubing
- Twin hose
- Blood pressure cuff
The NIBP board contains the pressure transducer, bleed and

exhaust valves, and electronic parts of the system.
The pneumatic contains two damping chambers, two magnetic

valves, and tubes (see Figure 9.3).
March 20th, 1992/2

4.3.4 Principle of SpO2 measurement

SpO2
Oxygen is the most acutely necessary substrate for survival.

A major concern during anesthesia is the prevention of tissue
hypoxia. Thus immediate and direct information about tissue
oxygenation is needed. When oxygen diffuses from the alveolus
into the blood it dissolves into the plasma and binds to hemoglobin.
Most of the oxygen needed by the body is transported bound to
hemoglobin. The total hemoglobin in the blood is composed of
oxygenated oxyhemoglobin (HbO2), reduced or deoxygenated
hemoglobin (Hb) and other forms of hemoglobin such as
Dyshemoglobins: carboxyhemoglobin (HbCO) and methemoglobin
(MetHb).
Pulse Oxymetry determines noninvasively the oxygen saturation of

hemoglobin (SpO2) on the basis of light absorption at only two
wavelengths. The limitation is that correspondingly only two
hemoglobin species can be discriminated by the measurement. In
principle, Pulse Oxymetry can be calibrated either against
fractional saturation SaO 2frac ,
S a O 2 f r a c = HbO2 / (HbO2 + Hb + Dyshemoglobin)

or against functional saturation SaO2func,
SaO2func = HbO2 / (HbO2 + Hb),
which is less sensitive to changes of Dyshemoglobin concentrations

in blood.
The oxygen saturation percentage measured by the DATEX-

ENGSTROM CARDIOCAP II monitor is calibrated against the
functional saturation SaO 2func . The advantage of this method is
that the accuracy of SpO2 measurement can be maintained even at
rather high concentrations of carboxyhemoglobin in blood.
Independent of the calibration method pulse oxymetry is not able
to correctly measure oxygen content of the arterial blood at
elevated Dyshemoglobin levels, which clinically may be harmful
for patient.
The absorption of light of normal human blood at different

wavelengths is mainly determined by oxygenated oxyhemoglobin
and by deoxygenated deoxyhemoglobin (see Figure 4.2). The
monitor measures the relative absorption of light at two
wavelengths, one in the near infrared (about 900 nm) and the other
in the red region (about 660 nm) of light spectrum. These
wavelengths are emitted by LEDs and detected by a PIN-diode in
the sensor. The total absorption can be divided into components of
March 22nd, 1996/4

arterial blood. Only the last component gives variations

synchronous with heart beat into the transmitted light intensity.
This fact is most essential for Pulse Oxymetry and eventually
makes feasible the measurement of oxygen saturation
noninvasively.
Plethysmographic pulse wave
The plethysmographic waveform is derived from the IR signal and

reflects the blood pulsation at the measuring site. Thus the
amplitude of the waveform represents the perfusion.
Pulse rate
The pulse rate calculation is done by peak detection of the

plethysmographic pulse wave. The signals are filtered to reduce
noise and checked to separate artifacts.
Figure 4.1 Absorption coefficients of oxy- and deoxy-

hemoglobin in the red and near-infrared regions
March 20th, 1992/2

Figure 4.2 Absorption of infrared light in the finger
November 15th, 1990

Sensor
The standard sensor is a finger clamp sensor which measures

through the finger (see Figure 4.3) and contains the light source
LEDs in one half and the photodiode detector in the other half.
Different kinds of sensors are also available from DATEX-
ENGSTROM.
Figure 4.3 Finger sensor parts layout and schematic diagram
March 22nd, 1996/4

4.4 General block diagram

The monitor consists of the following modular parts (see page 3-2
for the parts included in the monitor you are using):
ECG and respiration measuring electronics
NIBP measuring electronics, pump, and tubing
Invasive BP and temperature measuring electronics
Sensor and SpO2/pulse oximeter measuring board
Main processor board including analog signal multiplexer,

A/D converter, and real time clock
Video ASIC board to convert the CPU commands into

video signal
Video display module
Transformer and power supply board to generate necessary

voltages and I/O functions
Mother board including signal buses and analog input signal

buffers
Tactile membrane keyboard
Loudspeaker unit
See Figure 4.4 for the monitor block diagram.
For monitor parts locations see the exploded view (Figure 9.1) in
Chapter 9.
March 22nd, 1996/4

4.5 Wiring diagram

4.6 External connector configurations
4.6.1 Input/Output specifications

Serial data output for computer interface (SERIAL & ANALOG
I/O connector)
Serial Output for Graphics Printer (AUX I/O connector)
Composite video output
ECG, PLETHYSMOGRAPH or PRESS1, PRESS2 analog waveform

output (SERIAL & ANALOG I/O connector)
ECG test signal
AC, DC power supply connection
Alarm signal (Nurse call)
4.6.2 Connectors
Table 4.1 Pin order of the ECG connector
5-lead cable ECG measurement not with Respiratory rate

measurement.
November 15th, 1990

Table 4.2 Pin order of the invasive pressure connector

(PRESSURE 1)
Table 4.3 Pin order of the invasive pressure connector

(PRESSURE 2)
Table 4.4 Pin order of the pulse oximeter sensor connector

(SpO2)
March 22nd, 1996/4

Table 4.5 Pin order of the SERIAL & ANALOG connector
December 10th 1993/3

Table 4.6 Pin order of the AUX I/O connector

5 DETAILED DESCRIPTION OF MODULES
5.1 ECG Board

The ECG board is an isolated amplifier that accepts the low level
(approx. 1 mV) signal from the patient cable via the protection
circuitry and the lead selector. The signal is filtered and amplified
to A/D-conversion levels.
ECG input
The input circuit has a four position switch for selecting the
desired patient lead configuration and directing the signal into the
preamplifier input. In models which include RESP measurement,
the switch is limited to three positions.
Defibrillation and ESU protection
Input protection against defibrillation pulses (typically 5 kV/400 J)

is established by 4.7 kOhm/1 W resistors and 6800 uH coils in each
patient cable lead and by the spark gap F2.
NOTE: In CARDIOCAP™ II models which include the RESP

board, the defibrillation pulse protection circuits are located on
the ECG board.
At the input there is also the electrosurgery interference (ESU)

filter (R22, R23, R28, R29 and C6-C8) and a diode circuit that
serves as input limiter and provides input amplifier saturation bias
if the patient connection is broken, (LEADS OFF).
The patient isolation section is shielded by a metal enclosure to

prevent high frequency ESU interference. A second spark gap is
connected across the isolation barrier to allow a controlled passage
for static voltages which otherwise would destroy the isolation
components.
November 15th, 1990

Amplification
Each input is amplified by standard non-inverting amplifiers

which drive a differential amplifier, whose output is sent to a
pulse width modulator operating at approximately 5 kHz. The pulse
width modulated signal drives an optocoupler that transmits the
ECG signal across the isolation barrier.
ECG output
The output stage consists of a pulse width demodulator, low pass

filter and an adjustable 50/60 Hz notch filter. The signal is
demodulated, filtered and sent to an analog multiplexer on the
CPU board.
Leads off/Pacemaker pulses
Input amplifier saturation caused by a lead off or by a high slew

rate pulse is detected by the IN-OP comparators. In case of
LEADS OFF, the INOP output is a steady low voltage state. When
a pacemaker pulse is detected, a fast (0.5 - 2 ms) low pulse is
produced.
These signals are transmitted across the isolation barrier using an

optocoupler. The signals are sent to port C of the 8255 PPI on the
CPU board. The constant low signal will produce the LEADS OFF
message on the display and output data string and pacemaker pulse
will be clipped from the ECG waveform.
ECG power supply
Isolated power is generated by a small 75 kHz switching converter

(D1, V24, V25 and T1) the output of which is a regulated
+/- 12 V, using zener diodes.
November 15th, 1990

Figure 5.1 ECG board block diagram
November 15th, 1990
Figure 5.2 ECG board parts layout

(CH, CH-2, CH-S, CH-2S)
Figure 5.2a (on the next page)

ECG board schematic diagram
(CH, CH-2, CH-S, CH-2S)
March 22nd, 1996/4


Figure 5.3 ECG board parts layout

(CH-R, CH-1R, CH-RS, CH-1RS)
(board modification level 5 and higher)

ECG board schematic diagram
March 22nd, 1996/4

DATEX CARDIOCAP™ II CH-SERIES SERVICE MANUAL

5.2 RESP Board

The RESP board measures the respiratory rate of a patient based
on fractional changes in thoracic impedance between two
electrodes.
An oscillator produces a 48 kHz signal at a constant voltage that is

applied to the input of a preamplifier whose input impedance
varies with respiration. The output of the amplifier is rectified and
filtered producing a signal where a 1 Vpp change represents a 1.0
ohm change in the thoracic impedance of the patient.
The dynamic measuring range of the amplifier is 0.1 to 3.0 ohm,

with a frequency response of 0.2 to 3.0 Hz corresponding to
respiratory rate of 12 to 180 per minute.
The AC amplifier produces a signal from which respiratory rate

data is displayed. it operates within an impedance window
established by the static impedance level (approx. 3 kohms) and the
voltage peak to peak limit of the AC amplifier. If a limit is
exceeded, an IN-OP switch is activated which effectively turns off
the AC amplifier. An error message will be displayed.
The RESP board (connector Xl) is connected to the ECG board

(connector X8) with flexible cable.
The RESP board is included in models 1R, 1RS, R, and RS.
November 15th, 1990

Figure 5.4 RESP board block diagram
November 15th, 1990

Patient hook up
The electrodes are placed on the patient in such a manner to

provide a static impedance of up to 3 kohms. As the patient
breathes, this impedance will change fractionally.
This variable patient or base impedance becomes part of the

preamplifier input circuit.
Resonant circuit
The resonant circuit consisting of the base impedance, transformer

T2, high voltage capacitors C35 and C36, choke L1 and a spark
gap F3. Transformer T2, provides the necessary patient isolation as
well as stepping up the impedance of the resonant circuit. The
effect is that small changes in the base impedance caused by
respiration, produce larger changes to the preamplifier input
impedance.
Choke L1, matches the resonant circuit so that its resonant

frequency is not dependant on the base impedance. The input
impedance of the preamplifier is approximately 1.3 Mohm at 50 Hz
and 6.4 Mohm at 10 Hz.
This circuit is located on the ECG board.
Oscillator
A1B is an oscillator whose frequency is adjusted by trimmer R54

to 48.3 kHz. Output waveform is sinusoidal with some limit applied
to the peaks.
Preamplifier
The output of the oscillator is applied to the input of the

preamplifier Al A. The amplifier has a gain of 4, but the actual
signal strength produced will vary as the input impedance varies.
November 15th, 1990

Detector
The output of the preamplifier is split so that some of the signal is

processed by the amplifier A1C and diodes V3 and V4 (which
form a full wave rectifier). This rectified signal is summed with
the non-rectified signal through R5, then low-pass filtered by
A1D. The result of which is to produce a low-frequency AC signal
with a DC component.
* The DC-component is produced from the static base
impedance.
* An AC-component is the result of the impedance variation
of the base impedance caused by respiration.
RESP amplifier
The AC-component of the detected signal is amplified by an AC

amplifier A2A and A2B (RESP-amplifier), then transmitted to the
amplitude limiter.
Amplitude limiter
Operational amplifiers A2C and A2D monitor the output signal of

the RESP-amplifier. If the output signal exceeds a pre-established
point, the INOP-switch is activated when the signal is rectified by
the limiter circuit and applied A3B.
The voltage applied through D1 is established by a pull-up resistor

at +15 V. When the inverted voltage from A3B is applied to D1,
the output of the RESP-amplifier becomes 0 volts.
The output of the amplitude limiter is also transmitted to the

analog multiplexer on the CPU board via the ECG board.
Respiratory rate is then calculated and displayed.
November 15th, 1990

Comparator
The DC signal is applied to a comparator circuit (A3A). The

voltage is directly proportional to the impedance in the patient
circuit. The comparator has a threshold level of about 4.2 V
(corresponding to impedance of 3 kohm). When the voltage at the
input exceeds this level (that is, the base impedance has exceeded 3
kohms), the comparator output changes state (+15 V). This voltage
is applied through diode V13, amplified and inverted by A3B.
In addition, the comparator output is transmitted to port B of the

8255 PPI on the CPU via the ECG board. The change in state
causes an interrupt to be produced resulting in an error message to
be displayed.
Defibrillation protection
The defibrillation protection is realized by five resistors (R58

through R62) in the ECG board.
Over voltage protection
Transient suppressor diodes VI, V2, V19, and V20 protect the
measuring amplifier against an Over voltage pulse which might
pass through the transformer.
Voltage regulator
The operating voltage of oscillator, preamplifier, and detector is

regulated and stabilized with A3C and A3D. This reduces noise in
the first stages of the amplifier and keeps the amplitude of the
oscillator constant.
November 15th, 1990

Figure 5.5 RESP board parts layout and schematic diagram


5.3 IPT (Invasive-Pleth-Temperature) Board

The IPT board is designed to support two pressure channels and
one temperature channel. However, in models CH-1R and CH-
1RS, only one pressure channel is available. In models CH, CH-R,
CH-S, and CH-RS, no invasive pressure channels are provided.
The boards have two common features with the ECG board; the
isolating power switcher and the pulse width modulator/
optoisolator/ demodulator chain.
The two-pressure channel IPT board generates two real time

waveforms:
1. Invasive pressure P1 waveform.
2. Invasive pressure P2 waveform.
Temperature
The temperature signal is produced by a voltage divider, part of

which is the patient sensor (YSI 400-series thermistor). The output
is amplified by the calibrated amplifiers. Offset adjustment and
linearization is done by software.
Invasive pressure
The monitor provides +5 V excitation voltage and a ground

reference. The transducer output is sent to a single differential
amplifier IC. The excitation voltage is sourced from the isolated
power supply on the IPT board and all variations in this voltage
are compensated for by software.
The Cardiocap senses when a pressure sensor has been inserted into
a connector by providing a line on each connector that is held high
(pressure flag) by a pull-up resistor. The line is shorted to ground
when a pressure transducer is plugged into the monitor. The
pressure flag lines are polled by the multiplexer and when the CPU
senses the line is grounded, the pressure display is activated.
March 22nd, 1996/4

Signal output
The following signals are multiplexed to a pulse width modulator:
- the temperature channel

- two pressure flags
- zero and +5 V reference
- pressure differential signal
The multiplexer control is provided by the CPU.
If a second pressure is provided, its differential output is directed

to its own pulse width modulator.
After all signals are transmitted across the isolation barrier, they
are demodulated, low-pass filtered and transmitted to the analog
multiplexer resident on the CPU board.
March 22nd, 1996/4

Figure 5.7 IPT board (board modification level 4 and higher)

and IPT connector board parts layouts and IPT
connector board schematic diagram
Figure 5.8 (on the next page)

IPT board schematic diagram
(board modification level 4 and higher)m
(Connector X4 or both X3 and X4 not included in some models)
March 22nd, 1996/4

March 22nd, 1996/4

5.4 NIBP Measurement
5.4.1 NIBP board
PNEUMATIC SYSTEM
The NIBP board consists of the following pneumatic parts:
- Pressure transducer
- Bleed system
- Exhaust valve
See Figures 5.10 and 5.11 for NIBP board parts layout and
schematic diagram.
Pressure transducer
The piezoresistive pressure transducer (B1) is connected to the

cuff. It measures the absolute pressure of the blood pressure cuff
and the pressure fluctuations caused by arterial wall movement.
Bleed system
Bleed valve (Y2) releases the cuff pressure. The opening of the
valve is pulse-width controlled between 100% and 0%. When the
pulse-width ratio is 100% the signal is constantly high and the
valve is open all the time. When the ratio is 0% the signal is
constantly low and the valve is closed all the time. The driving
signal frequency is 40 Hz.
Exhaust valve
Valve Y1 is used as an exhaust valve to quickly deflate the cuff.
November 15th, 1990

ANALOG CIRCUITS
Pressure transducer excitation
The pressure transducer B1 is excited by a 4 mA constant current

source. This is produced by floating constant voltage of 1.200 V
that is produced by the voltage reference diode V7. Operational
amplifiers A5A and A5B are used as voltage followers. The voltage
difference through resistor R5 (TP X8/7, X8/8) is 1.200 V,
producing a current of 4 mA through the resistor for the pressure
transducer. The excitation voltage of B1 is about 12 V (TP X8/8,
X6/5).
Differential amplifier
The output of the pressure transducer B1 is a differential signal

between the midpoints of the pressure sensing resistor bridge legs
(TP X8/2, X8/3). This signal is fed to a differential amplifier
(operational amplifiers A4A and A4B, and resistors R12, 13, 14,
and 15) that produces a gain of 31.1 (TP X8/4).
Pressure zero and gain control
At zero pressure, the output voltage difference of the pressure

transducer B1 may be up to 100 mV. This zero pressure voltage is
compensated for by R6 (TP X8/5) in the amplifier stage A4C. This
stage is an inverting amplifier with unity gain and low-pass
filtering.
The next stage, A4D, is an inverting amplifier whose gain can be

adjusted with trimmer R11. The gain is adjusted to compensate for
pressure transducer gain differences, so that a linear signal is
produced throughout the transducers range (TP X8/6).
Pressure DC channel range and bias circuits
The DC channel is used to measure the static or non-oscillating

pressure of the blood pressure cuff. The static signal from A4D has
a 5 V range (0 to -5 V). This voltage is sent to A2A which limits
the voltage range to 1 V (+0.755 V to -0.755 volts) for the A/D
converter.
November 15th, 1990

Two input ports of the analog multiplexer (A3) are dedicated to

the DC channel. The microprocessor selects the desired port
depending on the cuff pressure required for best resolution. If the
cuff pressure is between 0 and 255 mmHg the signal produced by
A2A is sent directly to the multiplexer port 6, because the pressure
corresponds directly to the 8 bit range of the A/D converter.
If the cuff pressure exceeds 255 mmHg, the signal is directed

through a voltage divider network (R30/1-2 and R30/3-4) to port
5 of the multiplexer. This doubles the pressure range represented
by the 1 volt signal and since the voltage measured at the divider
is referenced to ground the pressures represented are between -128
and +382 mmHg.
To allow for a certain amount of zero pressure drift, the pressure

zero points are actually set at 0 to 235 mmHg and -108 to 362
mmHg respectively.
Pressure AC channel filters
The AC component of the cuff pressure data is amplified to allow

the processor to analyze the small cuff pressure fluctuations which
are used as a basis for blood pressure determination. This
additional amplifier is AC coupled. The first stage, A2B, is a
second order high-pass filter to effectively block out the DC
component of the pressure data (TP X9/2). The second stage, A2C,
is the amplifier stage (G = 73) and low-pass filter (TP X9/3). The
third stage A2D blocks the offset voltages of the previous two
stages (TP X9/4).
AC reset
During cuff inflation or if an abnormal situation arises, the AC

signal is sent to ground through D6A and D6B with AC reset signal
P16 from the processor.
November 15th, 1990

AC channel range selection
The output from A2D is connected to a voltage divider chain (R24

through 28). The 5 outputs of this resistor chain make up a binary
division chain. The division ratio is selected by the analog
multiplexer (A3). If voltage at the beginning of the chain is 1 volt
the following outputs have voltages 1/2, 1/4, 1/8 and 1/16 volts.
The processor selects the proper division ratio according to the
incoming signal level. This effectively extends the dynamic range
of the A/D converter from 8 bits to 12 bits.
Multiplexer and A/D converter
The analog multiplexer circuit A3 is used to select either the DC or

AC channel to the A/D converter. The same multiplexer is also
used to select suitable ranges for both channels. As described
previously, the DC channel has two different ranges and the AC
channel has 5 different ranges. The multiplexer inputs are allocated
according to the following table.
INPUT DESCRIPTION DIVISION RATIO
The operational amplifier A1C is a non-inverting gain stage

(G = 6.62), which amplifies the incoming signals to -5 V to +5 V
level (TP X9/5). Resistor network R30/5-6 and 7-8 shifts the -5 to
+5 V range to 0 - 5 V for the A/D converter U1. U1 is an 8 bit
successive approximation A/D converter. The converter is timed by
its own internal clock (TP X6/2), the conversion rate is determined
by the external RC circuit (R29, C34), conversion time is about
200 us. The converted signal is led to buffer D13 output when
ADCRD-signal is activated. Decoder D5 activates the ADCRD-
signal when Al 5 and RD-signal are active.
November 15th, 1990

Reference voltage source
The reference voltages are generated with the reference diode V6

and operational amplifiers A5C and A5D. The reference voltages
are typically +5.30 V (TP X6/4) and -10.6 V (TP X6/5).
JUMPERS
The NIBP board contains two jumpers.
Jumper X13 selects the watchdog time. Normally the time is

adjusted to 5 minutes (no jumper). In test purpose the time can be
changed to 5 seconds (X13 short-circuited).
Jumper X10 selects the RAM memory capacity used.
PIN RAM CAPACITY SELECTED
1-2 32 kbytes
2-3 8 kbytes
PUMP AND VALVE DRIVERS
The magnetic valves and the air pump are controlled by the open
collector darlington driver circuit D11. A separate power source
(+15 V) is used to drive these circuits. An additional power switch
(V1, V3), controlled by the processor, connects power to valve
circuits. The watchdog timer prevents a prolonged inflation.
SAFETY CIRCUITS
Pressure control switch
A comparator circuit A1A compares cuff pressure to a fixed

reference level. If cuff is inflated the circuit prevents CPU from
zeroing the watchdog circuit (TP X9/6).
November 15th, 1990

Watchdog timer
The watchdog timer circuit (D8, D9) controls the power of the
magnetic valves and the air pump. Normally, power to the valves is
not connected. The CPU is able to reset the watchdog circuit and
connect power to the pump only when the cuff is not inflated. If
the cuff is inflated, the CPU cannot control the watchdog circuit,
which will deflate the cuff after 5 minutes.
PROCESSOR CIRCUITS
The NIBP board contains its own 8051FA CPU and memory
circuits to allow independent operation. The 64 kbyte code memory
resides in D2 (EPROM) and the 8 kbyte data memory in D3
(RAM). Ports P3 and P1 are used to control directly various
operations of the NIBP.
Port P3 also provides RS-232 output which is used to transmit

NIBP data to the main CPU.
Memory organization
The code memory and the external data memory both start from
zero. The decoded address space is 64 kbytes.
CPU Control ports
CPU ports P3 and P1 are used to directly control several NIBP

functions.
PORT P3 FUNCTION
P 3.0 RXD/
P 3.1 TXD/
P 3.2 Mux address 0
P 3.3 Mux address 1
P 3.4 Mux address 2
P 3.5 15 V power sense
P 3.6 WR
P 3.7 RD/
November 15th, 1990

PORT P1 FUNCTION
Reset circuit
The reset line is connected to the common reset line RESET to

guarantee simultaneous resetting with the main processor at power
down conditions.
TEST POINT SIGNALS
PIN SIGNAL
November 15th, 1990

Figure 5.9 Block Diagram of NIBP System
Two different kinds of twin hose are used: one for standard adult
cuff and another which contains a built-in choke for infant cuff.
Figure 5.10 NIBP board parts layout and schematic diagram

(part 1) (board modification level 4 and lower)

NIBP board schematic diagram (part 2)
(board modification level 4 and lower)


Figure 5.11 NIBP board parts layout and schematic diagram

(part 1) (board modification level 5 and higher)

NIBP board schematic diagram (part 2)


5.4.2 Pneumatic unit

The pneumatic unit includes three damping chambers and two
magnetic valves.
Damping chamber I
The damping chamber I prevents a rapid increase of pressure

caused by the pump.
Choke
A choke is used to slow down the pressure change in infant

measurement.
Damping chamber II
The damping chamber II is used with small cuff sizes to increase

volume so that the pressure can be precisely adjusted.
Damping chamber III
The damping chamber III smooths down rapid pressure pulses

caused by the bleed valve.
Shunt valves
If the cuff volume is too small, the two shunt valves open and
connect damping chamber II to the blood pressure circuit.
5.4.3 NIBP air pump

The NIBP air pump module contains a membrane type pump and a
DC motor. The module is enclosed in a separate foam rubber-filled
case to attenuate noise.

5.4.4 Safety valve

The NIBP is equipped with a separate mechanical safety valve to
prevent accidental cuff over-pressurization. The valve operates
nominally at 330 mmHg.
The safety valve is checked by connecting a hand pump with a

manometer to it and pumping slowly until the valve opens. It
should open at 300-330 mmHg.
5.4.5 NIBP tubing

The pneumatic components are assembled together as shown in
Figure 9.3.
WARNING: PATIENT SAFETY: It is important to attach the

tube from pressure transducer to the inner connector of the
NIBP-connector and the tube from the pneumatic unit is
attached to the outer connector of the NIBP-connector.
Reversing the tubes will inhibit deflation of the infant cuff.
5.4.6 Twin hose

The twin hose is used to connect cuffs to the monitor. The choke
which is designed for infant measurement is located in the infant
adapter (USA) or inside the input port of the infant twin hose (all
others). The monitor automatically detects the hose type in use.

5.4.7 Blood pressure cuff

The NIBP measuring unit is designed to operate with seven
different standard blood pressure cuffs. The cuff sizes are as
follows:
CUFF SIZE CUFF
March 20th, 1992/2

5.5 SpO2 Measurement

SpO2 measurement is included in models 2S, RS, 1RS, and S.
5.5.1 SpO2 Measuring Board

The board is intended to perform the following tasks:
Control the LED light sources of the sensor.
Amplify the signal coming from the detector and separate

the red and infrared signal components to respective
channels.
Multiplex in both channels the alternating component of the

signal (plethysmographic pulse) with the signal proportional
to the total intensity measured with the respective
wavelength.
Provide isolated output from the multiplexer channels (red

channel and IR channel) to the SpO2 Processor board.
Power supply
The isolated power supply consists of the following functional

blocks:
- 32,768 Hz oscillator.
- Half-bridge converter with isolation transformer.
- Stabilization and filtering of the output voltages with linear
regulators.
- Protection of the overloading with PTC-type thermistor.
Timing/LED control
The timing pulses are produced by a PAL (Programmable Array

Logic) D3. The input signal for D3 (SYNC.) is taken from the
switching power supply as a 32,768 Hz square wave. All timing
signals are synchronized at this switching frequency. The timing
circuit controls the LED driver circuitry (signals LEDR and
LEDIR), the RC time constants in amplifier chain (MEASURE)
and sampling (SAMPLER, SAMPLEIR) (Figure 5.14).
March 22nd, 1996/4

Referring to Figures 5.13 and 5.14, the LEDs in the sensor are
driven with constant current pulses, (90 or 300 mA). The pulse
duration and duty cycle can be seen in timing diagram in Figure
5.13. A positive voltage pulse at 1/X1 corresponds to the red LED
current and a negative one to the IR-LED, respectively.
Detector signal processing
The signal produced by the detector is a current. The first

amplifier stage is a current-to-voltage converter. A signal current
passes through the resistors between pins 13 and 14 of A3 and
produces a negative voltage pulse at 14/A3. Notice that the part of
the feedback resistance is located in the sensor connector.
The bias voltage of the detector (4.2V) is the voltage difference

between the connector pins 3/X1 (5V) and 5/X1 (0.8V).
At 8/A3 the detected voltage pulses are inverted to positive value.
The digitally controlled amplifier is a Digital to Analog Converter

(DAC), D5. The signal is fed to the reference input of D5. The 8-
bit digital control word is transferred over the patient isolation
barrier in serial mode (PA2) and is converted into parallel mode by
a shift register D4. The signal level at the output, 7/A3, is adjusted
to 3 to 8 V by the CPU.
The amplified signal pulses are separated to red and infrared

channels by sample-and-hold circuitry (S/H). Voltages VR and VIR
are proportional to the total intensity of the light detected at the
respective wavelength. VRac and VIRac are the amplified alternating
components (plethysmographic pulses).
The signals are multiplexed into two channels by a 2 x 4 MUX,

A5. Also +5 V and GND are connected to MUX input. The value
of the resistor RC in the sensor connector can be read through the
red channel, if needed.
The two output channels of MUX A5 are transferred across the

patient isolation by two identical pulse width
modulator/optoisolator/demodulator-chains. The frequency of the
pulse width modulator is about 20 kHz. The demodulated signal is
inverted.
March 22nd, 1996/4

Figure 5.12 SpO2 measuring board block diagram, parts layout
and timing diagram
Figure 5.13 (on the next pages)
SpO2 measuring board schematic diagram
March 22nd, 1996/4

March 22nd, 1996/4

Figure 5.14 SpO2 measuring board signal waveforms

5.5.2 SpO2 Processor Board

The SpO2 processor board accepts the multiplexed signal from the
SpO2 measuring board, converts the signal to digital data, processes
the information and transmits the data to the main CPU.
The SpO2 processor board (see Figure 5.15) contains, the 8031
CPU, EPROM, RAM, the parallel interface circuit, analog
multiplexer/demultiplexer, and the analog/digital converter.
The CPU uses the internal bus to access most of the peripheral
circuits. CPU port 1 is used to control the analog multiplexer (A3).
The serial channel 0 (ASCII computer output) is not used on this
board.
The two memory chips are jumper selected for 27256 program
EPROM, 8 x 8 kbit low current CMOS RAM 5564 powered by the
data retention voltage.
SpO2 input
The analog signals from the SpO2 measuring board are sent to an
analog MUX, A3 that is used as a demultiplexer. The output goes
to a sample/hold circuit and then transmitted to the A/D
converter, the output of which is put on to the data bus.
SpO2 processor board output
The SpO2 data is transmitted to the main CPU through the 8255
PPI. In addition, the measuring board MUX and DAC control
signals are also sent through the PPI.
November l5th, 1990

Figure 5.15 SpO2 processor board block diagram and parts layout

SpO2 processor board schematic diagram


5.6 CPU Board

The high speed CPU board contains 16 MHz oscillator to replace
that of 11,059 MHz. Serial I/O signals that used the CPU’s own
channel in the previous CPU board are changed and they occupy
one channel in QUART.
The board contains, in addition to the 80C32 CPU, the standard

EPROM, SRAM, and several analog and digital I/O functions. See
the CPU board block diagram.
The CPU (D5, refer to Figure 5.18) uses the CPU board internal
bus to access most of the peripheral circuits. Processor port 1 is
used to control the analog multiplexers (MUX).
Communication with the NIBP board is established in serial mode

through QUART (D15) pins 4 (in) and 3 (out).
There are three memory chips on the CPU board. The EPROM D1,
1M bit or 4M bit, is jumper selected, see table 5.19, 32 x 8 kbit
low current CMOS SRAM (D6) powered by the data retention
voltage, and battery back-up 8 kbit SRAM (D4) for permanent
calibration value memory. This IC has also a built-in Real Time
Clock. The lifetime of the battery inside the IC is minimum 10
years. If the SRAM is defective or the battery is dead the monitor
gives warnings every 30 seconds. Please refer to section 6,
Troubleshooting in general. See the jumper configuration.
The 16 MHz oscillator clock is first passed through control logic

circuit (D2, D16, and D19), which is for wait state control, and fed
to the CPU.
When a key is pressed (short-circuit) keyboard scanner (D9)

interrupts the microprocessor and this reads from the scanner
which key was pressed.
Input signal processing
The analog input signals from the IPT, ECG, and RESP (if used)
boards are read through the multiplexer (A3) to a sample and hold
circuit and to the A/D-converter A2.
Output signal processing
Up to eight analog signals are sent to the output connectors. Digital

patient data is sent to a D/A converter A1 and after conversion,
sent to the demultiplexer A7. The eight analog signals produced are
sent to sample and hold circuits and then transmitted to the power
supply board and the connectors in the back of the monitor.

Control signals of MUX are in port 1 on the microprocessor as follows:
pins 3-5 MUX A0-A2 (both)

pin 6 MUX enable (both)
pin 7 MUX 0 Write (ADC)
pin 8 MUX 1 Write (DAC)
ADC 0 IMP. RESP
ADC 2 ECG
ADC 4 IPT signal
ADC 6 PB2 signal
ADC 7 EXT INPUT
DAC 2 IPT signal
DAC 4 ECG TEST
DAC 5 Loudspeaker volume
DAC 6 PB2 signal
DAC 7 Loudspeaker pitch
Ports on the PPI is used for as follows:
When a key is pressed (short-circuit) keyboard scanner (D9) interrupts the

microprocessor and this reads from the scanner which key was pressed.
The 16 MHz oscillator clock is first passed through control logic circuit (D2,
D16, and D19), which is for wait state control, and fed to the CPU.
Because of slowness of the some internal peripheral circuits, their bus

(IODATA) is separated from the high speed bus (DATA) by D18. Function of
real time clock is included in battery back-up SRAM (D4).
Software features are described in the Operator’s Manual and main differences
between software revisions in Section 3.4.
CAUTION: The SRAM IC (D4) contains a lithium battery. Danger of

explosion if IC is incorrectly replaced. Replace only with same or equivalent
type recommended by DATEX-ENGSTROM. Do not dispose of faulty IC:s in
fire. IC should be disposed of according to local regulations.
March 22nd, 1996/4


Figure 5.19 CPU board jumper configuration and schematic

diagram (part 2)
CONNECTOR JUMPER MEMORY TYPE
The value of resistor network R5 is 4 x 47k.

5.7 Video ASIC Board

The video ASIC board replaces video control board from revision
04 on. ASIC board includes ASIC IC and some other components.
Due to the number of components we recommend changing the
complete board in case of failure.
March 22nd, 1996/4

Figure 5.20 Video ASIC board parts layout

Video ASIC board schematic diagram
March 22nd, 1996/4

March 22nd, 1996/4

5.8 Power Supply Board

The primary of the power supply is designed to double insulation
requirements for added safety. There are two fuses. The primary
operating voltage is factory selected by insulating and folding the
unused primary leads inside the additional insulation tube.
The mains transformer is magnetically shielded to minimize screen

disturbance.
The power supply board contains basically four DC sources:
+5 V switched, for the digital circuitry.
+15 V switched, for valves, pump and other components.
+/-15 V regulated for the analog amplifiers.
Data retention voltage generation circuit supplies +5 V DRV

voltage for memory from switched +5 V supply.
Also, +12 V/1 A for the CRT unit and serial drivers/receivers is
derived from the +15 V switched voltage. The -12 V for the serial
I/O is derived from -15 V.
In addition to the power supply functions the board contains

drivers for two serial channels (including the modem control
signals CTS and RTS), a RESET control, which generates a 200 ms
reset pulse to the CPU if the +5 V line goes below 4.75 V, and
miscellaneous I/O functions like a loudspeaker driver. Some signals
from the mother board are passed directly to the rear panel
connectors.
March 22nd, 1996/4

Figure 5.22 Power supply board block diagram
March 22nd, 1996/4
Figure 5.23 Transformer diagram and power supply board signal

waveforms
March 22nd, 1996/4

DATEX CARDIOCAP TM II CH-SERIES SERVICE MANUAL 5-49
Figure 5.24 Power supply board parts layout and schematic

diagram (part 1)

Power supply board schematic diagram (part 2)


5.9 Mother Board

The mother board contains mainly the system bus interconnections
and connectors. Also on the board are power bypass capacitors and
driver transistors for the sampling system magnetic valves (gas zero
and pressure valves; not used in Cardiocap II CH-series monitors).
For signals in each bus, see Table 4.7.
5.10 Keyboard
The keypad pcb is a simple 4x4 matrix which is scanned by the
keyboard controller on the CPU board.
5.11 Loudspeaker Unit

Audible alarms and beeps are generated by a separate loudspeaker
unit. It contains an 8 ohm/0.4 W speaker and the associated driving
circuitry.
November 15th, 1990

Figure 5.26 Mother board parts layout and schematic diagram


Figure 5.27 Keyboard parts layout and schematic diagram
November 15th, 1990

Figure 5.28 Loudspeaker unit parts layout and schematic diagram
November 15th, 1990

5.12 Internal connector configurations
Table 5.1 Video ASIC board (X1) - Mother board (X1)
NC = not connected
AIN is an AD-converter in and AOUT is a DA-converter out
ADC is an AD-converter and DAC is a DA-converter
March 22nd, 1996/4

Table 5.2 Main CPU board (X1) - Mother board (X2)
NC = not connected

Table 5.3 SpO2 processor board (X1) - Mother board (X3)
NC = not connected
November 15th, 1990

Table 5.4 NIBP board (Xl) - Mother board (X4)
NC = not connected
November 15th, 1990

Table 5.5 Power supply board (X10) - Mother board (X5)
NC = not connected
November 15th, 1990

Table 5.6 SpO2 measuring board (X2) - SpO2 processor board
Table 5.7 Keyboard (X1) - Mother board (X8)
November 15th, 1990

Table 5.8 ECG board - Mother board (X12)
Table 5.9 IPT board - Mother board (X10)
Table 5.10 Power supply board - Mother board (X6)
November 15th, 1990

Table 5.11 ECG board - RESP board (X7)
Table 5.12 Mother board test connector (X13)
Table 5.13 Video ASIC board (X2) - Video unit main

pc board (X13)
March 22nd, 1996/4

Table 5.14 Front panel SpO2 connector - SpO2

measuring board (X1)
Table 5.15 Power supply board (X1) - Line transformer
Table 5.16 Power supply board (X3) - Fan
March 22nd, 1996/4

Table 5.17 Power supply board (X6) - Video unit main pc board
Table 5.18 Power supply board (X8) - Loudspeaker
Table 5.19 NIBP board (X2) - NIBP Pump
November 15th, 1990

6 SERVICE AND TROUBLESHOOTING
6.1 General service information

Usually field service is limited to replacing the faulty circuit
boards or mechanical parts. The boards are then returned to
DATEX-ENGSTROM for repair.
DATEX-ENGSTROM is always available for service advice. Please

provide the unit serial number, full type designation, program
revision (displayed at monitor startup) and a detailed fault
description.
NOTE: After any component replacements see Section 7.1

(Adjustments) and after any service perform the functional field
check procedure in Chapter 8.
CAUTION: The tests and repairs outlined in this section should

only be attempted by trained personnel with the appropriate
equipment. Unauthorized service may void warranty of the unit.
March 22nd, 1996/4

6.2 Disassembly and reassembly

The monitor is disassembled in the following way (see page 3-2 for
the parts included in the monitor you are using). See Figure 9.1 for
the exploded view of the monitor:
Disconnect the power cord.
Remove the upper two galvanized screws on the side panels

and lift off the top cover.
Remove the lower two screws and detach the side panels.
Now the interior of the monitor is exposed. The pneumatic unit for
the NIBP measurement is located on the left side and printed
circuit boards are located on the right side of the monitor.
Video screen frame can be removed. Keyboard pc board

with plastic key panel is attached to the front plate. It can
be removed by detaching the ECG lead selector knob and
disconnecting X8 connector on the mother board.
Behind the Keyboard pc board an assembly of pc boards is

located. They are (front to rear) the ECG board, IPT board,
a supporting board, and the Respiration board. The
connector board (no.2) with pressure and temperature
connectors is attached to the IPT board, beneath the ECG
board. This whole assembly can be detached by removing 6
supporting screws on the front plate (two on top and one on
each side of two connector openings) and disconnecting
X10 and X12 connectors after the Keyboard pc board is
removed. Each board can now be detached from the
assembly by removing the screws and spacers.
Four boards are attached to the mother board on the right

half of the chassis: (moving front to rear) the NIBP
processor board, the SpO2 processor board, the CPU board,
and the Video ASIC board. These boards are removed by
pulling upwards.
Beneath the mother board the intermediary bottom plate

houses SpO2 measuring board.
Power supply board is attached to the rear plate with four

screws.
Transformer, power cord receptacle block, loudspeaker, fan

and dust filter, fuse housing(s), NIBP cuff connector, and
ECG test signal connector are all attached to the rear panel.
March 22nd, 1996/4

The rear panel can be tilted back by first detaching the power cord
receptacle block and removing the two screws beside the fan which
are keeping the rear panel in the upright position and sliding the
panel in sideways.
The main PC board for the picture tube, NIBP pump and
vertically positioned supporting plate, and NIBP safety
valve are attached to the bottom plate with screws.
Two magnetic valves, damping chambers II and III, and a choke

are screwed to the horizontally positioned plate, which in turn, is
attached to the vertically positioned supporting plate.
CAUTION: When the pneumatic unit is disassembled, make sure

that the tubes are reconnected properly.
The picture tube unit is screwed to the front plate.
Most parts can be removed by loosening the appropriate screws.
Reassembling is essentially reversing what was described

above.
CAUTION: When attaching the top cover, make sure that the
tubes and cables are not pinched between the boards and the
cover.
November 15th, 1990

6.3 Troubleshooting
6.3.1 Monitor start-up sequence

After the monitor is switched on
Fan on the rear panel starts to run.
The self test text appears on the screen. All the memory in
the monitor is checked. Program code and the date of its
completion are also displayed.
Within a half minute fields for waveforms and numeric

values will appear as horizontally running straight lines and
dashes on the screen. The real time clock also appears. If
SpO2 sensor is not connected to the monitor, the message
“no probe” appears. If the sensor is connected to the
monitor but not to the patient, the message “probe off
appears. When the sensor is connected to the patient, the
message “pulse search” appears and shortly pulse waveform
appears on the screen.
The NIBP software is performing its own selfcheck. If the

selfcheck is completed with no error detected, the program
code for NIBP appears in the lower left corner of the
screen.
The monitor is ready for use.
March 22nd, 1996/4

6.3.2 Troubleshooting in general
NOTE: Please read “Troubleshooting and Displayed Messages” in

the Operator’s Manual first. The part of this chart is duplicated
from it.
Table 6.1 General troubleshooting chart
March 22nd, 1996/4


6.3.3 ECG board troubleshooting

In troubleshooting the ECG board it is important to note that the
isolated ground has no connection to the system electronics ground.
Also, if the problem is excessive high frequency noise, it may be
that altering the normal ground by connecting an oscilloscope
ground to the isolated ground may cancel the noise.
When checking ECG board problems, confirm that the isolated

power (±12 V) is available and stable. The waveform at the
secondary of T1 should be 100 kHz square wave, 50 % duty cycle
and 25 - 30 Vpp.
Table 6.2 ECG board troubleshooting chart
November 15th, 1990

6.3.4 RESP board troubleshooting
Table 6.3 RESP board troubleshooting chart
November 15th, 1990

6.3.5 IPT board troubleshooting
Table 6.4 IPT board troubleshooting chart
November 15th, 1990

6.3.6 NIBP board troubleshooting

The NIBP board has its own diagnostics software that tests the
NIBP hardware every time the monitor is switched on. Should
there be any trouble with the NIBP, the monitor should be
switched off and on again and check for a display of a NIBP error
message. If the NIBP unit is ok it will display the NIBP VER X.X.
message.
Table 6.5 NIBP board troubleshooting chart
November 15th, 1990


6.3.7 SpO2 measuring electronics troubleshooting

In troubleshooting the measuring board it is important to note that
the isolated ground has no connection to the system electronics
ground. Also, if the problem is excessive high frequency noise, it
may be that altering the normal ground by connecting an
oscilloscope ground to the isolated ground may cancel the noise.
When checking measuring board problems first confirm that the

isolated DC power (+12 V, -12 V, and +5 V) are present and are
stable.
The troubleshooting chart of the measuring electronics is shown in

Table 6.6.
For the parts layout and schematic diagram of the SpO2 measuring
board see Section 5.

Table 6.6 SpO2 measuring electronics troubleshooting chart
Finger in probe and connected to CARDIOCAP™
*) see Figure 5.14 for signal waveforms.
NOTE: When doing any work on the measuring board care has
to be taken that the patient isolation is not violated.
NOTE: When reassembling the measuring board see Figure 9.1

for the proper placement of the shields.
November 15th, 1990

6.3.8 SpO2 processor board troubleshooting

Due to the complexity of the LSI circuitry there are few faults in
the CPU digital electronics that can be located without special
equipment. The following checks may, however, be performed:
All integrated circuits are properly inserted into the sockets.
The 11.059 MHz clock signal at the CPU pins 18 and 19

(use a high impedance sensor to check).
PSEN (CPU pin 29) shows that instructions are being

fetched. If this line is static, the processor is not running.
RESET (CPU pin 9) is normally low but pulled up to +5 V

for a moment after power up. If RESET is constantly high,
check the +5 V supply line for spikes or too low level.
The analog part is easier to debug. The input analog voltages are
easily tracked to the MUX input. After the MUX, the voltages are
multiplexed so that the resulting waveform frequency is at 200 -
600 HS.
March 22nd, 1996/4

6.3.9 CPU board troubleshooting

Due to the complexity of the LSI circuitry there are few faults in
the CPU digital electronics that can be located without special
equipment. The following checks may be performed:
The RAM, EPROM, CPU, and other socketed I.C.‘s are

properly installed and the memory configuration jumpers
are correct (see Figure 5.19).
The 16 MHz (revision 02 and up) or 11.059 MHz clock

signal at the CPU pins 18 and 19 (use a high impedance
sensor to check).
PSEN (CPU pin 29) shows that instructions are being

fetched. If this line is static, the processor is not running.
RESET (CPU pin 9) is normally low, but pulled to +5 V

for a moment after power up. If RESET is constantly high,
check the +5 V supply line for spikes or low voltage.
The analog sections are easier to troubleshoot. The input analog

voltages are easily tracked to the MUX input. After the MUX, the
voltages are multiplexed so that the resulting waveform frequency
is at 200 - 600 HS.
All analog output channels are updated every 40 ms. Thus the D/A
conversion interval is 5 ms.
6.3.9.1 Instructions after replacing the software or CPU board

After replacing the software, the CPU board or the memory IC D4
on the CPU board the monitor displays “MEMORY CIRCUIT
FAILURE / CALL SERVICE”. The content of D4 is incorrect.
Performing factory reset will set the content correct.
Perform factory reset in the engineering menu (see the

Operator’s Manual Section 2).
Re-establish previously used settings or inform the monitor

user that all other settings are default values.
March 22nd, 1996/4

6.3.10 Video ASIC board troubleshooting

Due to the number of components in video ASIC board, we
recommend changing the complete board in case of failure.
March 22nd, 1996/4

6.3.11 Power supply board troubleshooting

The following troubleshooting chart will help in pinpointing
a malfunctioning component. The only part that requires good
understanding of operating principles are the switching supplies.
Consult the IC data sheet for more information on the LM 3524
switcher controller.
Table 6.7 Power supply board troubleshooting chart
November 15th, 1990

6.3.12 Mother board/Keyboard troubleshooting

Fault finding on the mother board/Keyboard is reduced to:
visual inspection of board surface and connectors
continuity and short circuit testing with an ohmmeter
measuring of power supply voltages.
6.3.13 Loudspeaker /troubleshooting

Loudspeaker can be evaluated by checking its supply voltage (red
wire), volume (black), and pitch (green) signals. The measurement
can be performed easily by detaching the loudspeaker from the
rear panel.
November 15th, 1990

6.4 Service mode

The service mode is designed originally for factory use. However
some simple checks can be done in the service mode to ensure the
proper operation of the monitor without having to disassembly it.
Enter the service mode as follows:
Turn on the monitor and allow it to go into normal

monitoring mode.
Press the softkeys 1, 2, 3, and 4 in order and then

immediately press and hold down the NORMAL SCREEN
key
The character ‘S’ blinks and the text ‘SERVICE MODE ON’
appears to indicate that you have entered the service mode.
Press soft key 4. The service mode menu will appear.
The menu is:

STAND BY
INFO
SERVICE OFF
Press the soft key 1 to move the box from selection to

another. Press the NORMAL SCREEN key to enter the
menu.
In STAND BY, normal monitoring can be continued even

though you are in service mode.
In info, the revision and the date of the program, the date
of the last factory reset performed and a list of observed
faults can be seen.

ADJUSTMENTS
7.1 ECG board adjustment

The only adjustment on the ECG board is the 50/60 Hz notch.
This is also the only difference between 50/60 Hz monitors.
To adjust the notch, feed a 1 - 10 mV 50/60 Hz signal into the

ECG input, between LA and RA in LEAD 1 configuration, either
through a resistive divider from system bus pin 31c (22 Vac) or
from a signal generator. Adjust R48 (accessible from top of the
ECG board) to minimize the displayed amplitude (fast speed).
WARNING: When doing any work on the ECG and IPT boards,
care has to be taken that the patient isolation is not violated.
November 15th, 1990

7.2 RESP board adjustment
Test equipment
Oscilloscope 10 mV/div.
Frequency counter
Oscillator adjustment
Connect oscilloscope and frequency counter to test point TP1 (pin

1 in connector X2). A nearly sinusoidal signal of amplitude almost
+10 V should be seen on the oscilloscope.
Adjust the frequency to 48.3 kHz ±100 Hz with trimmer R54.
LEADS OFF threshold adjustment
Connect 3 kohm resistor between yellow and black patient cables.
Turn trimmer R53 counter-clockwise until the message LEADS

OFF appears on the screen of the host monitor. Turn the trimmer
carefully and slowly clockwise until the message disappears.
Remove the 3 kohm resistor and make sure that the message
returns to the screen.
Connect the cables together and see that the message disappears.
Confirm that the message does not appear when a resistor whose
value is less than 3 kohm is connected between the cables.
November 15th, 1990

7.3 IPT board adjustment

The only adjustments on the IPT board are the temperature gain
set trimmers, which are adjusted as follows:
Set the 38°C TEMP CAL via the engineering menu. To

enter the engineering menu keep MARK RESET softkey
depressed during power up until the menu appears. With
temperature measuring jack disconnected choose
CALIBRATE and TEMP CAL, depress the TEMP TEST
button and adjust the reading to 38.0°C.
Insert a plug with a precision resistor listed below into the

jack receptacle and adjust R11 to show the correct
temperature. The trimmers are accessible from above
without removing the IPT-ECG board assembly.
YSI 400 series temperature-resistance table:
°C Ohms
15 3539
20 2814
25 2253
30 1815
35 1471
38 1301
40 1200
44 1024
NOTE: For temperature gain calibration use a precision resistor

between 3539 and 2000 ohms.
WARNING: When doing any work on the ECG and IPT boards,
care has to be taken that the patient isolation is not violated.
March 20th, 1992/2

7.4 NIBP board adjustment

The NIBP board automatically performs all adjustments except
pressure calibration, which must be done manually. Pressure zero is
automatically maintained by the processor. If the zero point drifts
too much NIBP transmits an error message. Normally zero point
trimmer R6 should not be touched.
CALIBRATION
NIBP calibration can be performed as follows:
Enter engineering menu by pressing MARK RESET key

during power up. Keep the key down until the
“STARTING” sequence has been completed.
Press soft key 2 to enter calibration mode.
Press soft key 2 again to enter NIBP calibration.
In the calibration mode, the automatic zero adjustment is

not operating to allow the adjustment of the pressure
channel zero trimmer R6 (upper trimmer on the NIBP
board). Adjust R6 until the mean pressure value M is zero.
Make sure that the upper pneumatic connector is not
connected to a pressure source to allow proper zeroing.
Remove the female connector from an adult cuff and

connect it to the male connector in the twin hose. Connect
an external pump and mercury manometer to it and pump
the pressure up to 200 mmHg and adjust the calibration
trimmer R11 (lower trimmer on the NIBP board) until the
mean value M shows 200.
Repeat steps d) and e) until zero and 200 mmHg readings

are both correct.
Check the linearity of the pressure transducer at the

pressure of 100 mmHg.
Press “RETURN TO MONITOR” to enter normal operating

mode.
NOTE: In the normal operating mode the zero pressure drift is

compensated by software and this drift does not affect the
accuracy of the device. If zero drift is more than ±20 mmHg
NIBP issues an error message, see troubleshooting chart.
March 20th, 1992/2

7.5 SpO2 processor board adjustment

There are only two adjustments on the SpO2 processor board:
A/D-converter zero (R9).
A/D-converter 10 V reference (R8).
The A/D-converter adjustments are performed only at the factory.
7.6 CPU board adjustment

There is one adjustable capacitor on the CPU board for real time
clock oscillator frequency. It is factory adjusted, but may need to
be readjusted if some components are replaced.
Real time clock oscillator frequency
The real time clock oscillator frequency is set by connecting a

counter to pin 15 of D16 and adjusting C49 to read 256.00 Hz
corresponding to a cycle time of 3906.25 us.
NOTE: The high speed CPU board does not require any
adjustments.
March 20th, 1992/2

7.7 Video Display Unit (Philips) Adjustments

The following adjustments can be done in the Philips CRT display
board:
Basic brightness adjustment Trimmer potentiometer P4

Horizontal width Trimming indutance L1
Vertical height Trimmer potentiometer P2
Horizontal positioning Trimmer potentiometer P1
Horizontal linearity Trimmer magnet L2
Focus Trimmer potentiometer P3
Figure 7.1 Video Display Unit Adjustment
March 22nd, 1996/4

8 FUNCTIONAL FIELD CHECK PROCEDURE
8.1 Preoperative check list

Perform the following tests daily to assure proper operation of the
monitor.
WARNING: If the monitor fails to respond as described, stop

using the monitor, troubleshoot, and correct the situation.
Power up
Turn the power on. The monitor performs a start-up and self test
procedure.
Confirm that no error messages appear.
ECG Check
Plug an ECG cable into the ECG connector receptacle on

the front panel.
Connect the ECG lead wires to the clip-on connectors on

the monitor’s rear panel according to the letter codes.
Turn the lead selector to position I.
The ECG waveform should display a train of 1 mV pulses

with a frequency of 60 ±1 bpm.
Confirm that the QRS indicator ‘*’ is flashing to the left

and above the ECG channel.
Remove the ECG leads from the test pins. Ensure that the
message ‘LEADS OFF’ appears in the upper right corner of
the screen.
November 15th, 1990

NIBP Check
Assemble the blood pressure cuff with the cuff hose and
connect it to the NIBP connector on the rear panel.
Attach the cuff to your arm.
Take a blood pressure measurement by pressing the START

key. Confirm that the pump inflates the cuff. Confirm that
the cuff pressure is displayed during measurement and that
final systolic, diastolic, and mean values are displayed.
SpO2 Check
Connect the pulse oximeter sensor to the monitor. The

message ‘NO PROBE’ is replaced by ‘PROBE OFF’.
Confirm that the red light is seen from the sensor, and that
the sensor surface is undamaged.
Attach the pulse oximeter sensor to your finger.
Wait for the pulse search to be completed and readings to

stabilize. Verify that the SpO2 readings are in the expected
range and that the plethysmographic pulse waveform is
regular.
March 20th, 1992/2

8.2 Checks after component replacements

The following test should be performed after any service to ensure
proper operation of the monitor.
Check visually that tubes, valves, and pump are properly

connected. Tubes are not pinched, clogged, or jammed.
There should be no sharp bends either.
Connect power cord and switch the monitor on.
Check that no error messages are shown.
Check the operation of the real time clock:

- Verify the date (use engineering menu).
- Verify time.
- Check that the clock is running.
Connect the ECG cable to the rear panel test connectors.

Verify that the test signal is shown on the display. Heart
rate display should read 60 ±1.
Connect the invasive blood pressure transducer(s) to the

front panel connector(s) PRESSURE 1 (and 2). Zero the
sensor(s) by pressing PRESSURE key and soft key 1 (and
2). Verify proper operation by connecting a manometer and
hand pump in series with the transducer(s). Check
calibration at 200 mmHg pressure.
Connect the NIBP cuff. Perform one measurement with

yourself. Verify operation. Perform venous stasis (see the
Operator’s Manual Section 7) and check for leaks. Check
NIBP calibration (see Section 7.4).
Check temperature channel by pressing the TEMP TEST

switch. Reading should be 38.0 ±0.1°C (100.4 ±0.2°F).
November 15th, 1990

Connect the SpO2 sensor and observe the message PULSE

SEARCH followed by PROBE OFF. Put the sensor on your
finger and keep the hand still.
The message PULSE SEARCH should appear first.
A numeric value should appear next in the SpO2 field

(normally between 94 and 98 in non-anesthetized
people).
The plethysmographic pulse waveform from SpO2

sensor should be shown on the screen,
Keep the SpO2 sensor on your finger for several minutes.

Press the TRENDS key and check that the measurement
results are enough to draw trend waveform.
Check the operation of the loudspeaker by creating an

alarm state.
Connect serial printer to serial & analog I/O connector on

the rear panel of the monitor. Turn the power on and check
that the printer prints data correctly.
Reset the monitor by pressing the MARK RESET key for

about five seconds.
Check the leakage current of the unit. Check the condition

of all cables and connectors.
Disconnect power cord for 30 minutes. Then connect it

back and turn the monitor on. When the initialization is
over, make trend displayed on the screen. The trend which
had been measured before the power cut-off should be
displayed.
Check that there are no dirt stains in the monitor. Top

cover, side panels, and bottom plate are properly attached
with screws.
March 20th, 1992/2

8.3 Preventive maintenance check list

We recommend that you perform these checks at least once every
six months to keep the monitor in good working condition.
1. VISUAL INSPECTIONS
Remove the top cover and check internal tubing

system for sharp bends and dirt.
Rear panel dust filter (clean at least once a month).
Screen for distortion (adjust if necessary).
Software version numbers (update if necessary).
2. MAIN FUNCTIONAL CHECKS
Check ECG functions (see Section 8.2 step e)).
Check invasive blood pressure measurement

(see Section 8.2 step f)).
Check NIBP operation (see Section 8.2 step g)).
Check temperature (see Section 8.2 step h)).
Check Pulse oximeter functions

(see Section 8.2 step i)).
Check date in the engineering menu.
Check real time in SETUP menu.
Check the function of the loudspeaker in SETUP menu.
November 15th, 1990

9 SPARE PARTS
9.1 Spare parts

For the locations of the main parts see Figure 9.1.
March 22nd, 1996/4

March 22nd, 1996/4

March 22nd, 1996/4

In your rear panel or front panel order, please specify the serial number and the
full monitor code as found in the type shield on the rear panel.
The part is recommended for stock.
The part is sold as an accessory.
March 22nd, 1996/4

9.2 Service accessories
March 20th, 1992/2


Figure 9.2 ECG, IPT, and RESP board assembly
November 15th, 1990

Figure 9.3 Pneumatic unit parts layout
March 20th, 1992/2


DATEX CARDIOCAP™ II CH-SERIES SERVICE MANUAL 5-4a/2

Figure 5.3 ECG board parts layout and schematic diagram

November 15th, 1990

DATEX CARDIOCAP™ II CH-SERIES SERVICE MANUAL 5-5/2
Figure 5.3 ECG board schematic diagram (part 2)
November 15th, 1990


Figure 5.3 ECG board schematic diagram (part 2)

Figure 5.5 RESP board parts layout and schematic diagram

November 15th, 1990

Figure 5.7 IPT board (board modification level 4 and higher)

and IPT connector board parts layouts and IPT
connector board schematic diagram

IPT board schematic diagram
(Connector X4 or both X3 and X4 not included in some models)

Figure 5.12 SpO2 measuring board block diagram, parts layout
and timing diagram
Figure 5.13 (on the next pages)
SpO2 measuring board schematic diagram

November 15th, 1990

November 15th, 1990


DATEX CARDIOCAPTM II CH-SERIES SERVICE MANUAL 5-33a/3
September 2nd, 1991/l

DATEX CARDIOCAP™ II CH-SERIES SERVICE MANUAL 5-33b/2
March 20th, 1992/2

DATEX CARDIOCAP™ II CH-SERIES SERVICE MANUAL 5-33b/3
March 20th, 1992/2


Figure 5.16 SpO2 processor board parts layout and schematic

diagram (modification level 4 and lower)
March 20th, 1992/2

Figure 5.16 SpO2 Processor board schematic diagram (part 2)
March 20th, 1992/2

Figure 5.16a SpO2 processor board parts layout and schematic

diagram (modification level 5 and higher)
March 20th, 1992/2

Figure 5.16 SpO2 Processor board schematic diagram (part 2)
March 20th, 1992/2

Figure 5.20 Video control board block diagram, parts layout and
timing diagram

Video control board schematic diagram


March 20th, 1992/2

November 15th, 1990

Figure C.5 Keyboard parts layout and schematic diagram
March 20th, 1991

Figure C.6 Control board parts layout and troubleshooting chart
Figure C.7 (on the next page)

Control board schematic diagram


Figure C.9 Exploded view of CCK-104 Keyboard
March 20th, 1992/2

12 APPENDICES
COMPUTER OUTPUT (Serial & Analog I/O Connector)

Transmission rate 1200 Baud. One series of output strings in 10 seconds except
NIBP string which comes out immediately after NIBP measurement. 8 data bits,
no parity. 1 start bit and 1 stop bit. Each parameter has 3 digits. Parameters are
separated by commas.

If DATEX-ENGSTROM gas monitor CAPNOMAC™ II is connected to

CARDIOCAP™ II monitor (see the preceding page for NIBP string):

If DATEX-ENGSTROM gas monitor CAPNOMAC ULTIMA™ is connected to

CARDIOCAP™ II monitor (depending on the Ultima in use, some strings may
not be available:
(See the preceding pages for NIBP, SpO2, and basic strings).
U01 string U03 string U04 string
String type String type String type
Marker no. MV exp (0.1 1/min) ETCO 2
ETO2 (% x 10) MV insp (0.1 1/min) FiCO 2
FiO2 (% x 10) TV exp high (1) CO 2 unit
ET balance gas TV exp low (ml)
Fi balance gas TV insp high (1)
ASX status TV insp low (ml)
Automatically V1.0 (%) for adults or

identified gas V0.5 (%) for paediatrics
Reserved Compliance
ET (primary gas, 10=1%) Ppeak
ET (secondary gas) Pplat
Fi (primary gas) PEEP
Fi (secondary gas) I:E
MAC (x 10) Reserved
Pulse rate Reserved
SpO2 Reserved
Ired ampl. Reserved
Red ampl. Recorder output
Gain Units status
Status Status
U03-string comes out when CAPNOMAC ULTIMA™ monitor includes V-option.

See operator’s manual for strings’ interpretation.
The status data are followed by: CR (Carriage return, hex D) LF (Line feed, hex A)

The Status Characters of the Standard String
*) Mean alarm when p2 scale = 12.5 mmHg
December lOth, 1993/3

DATEX CARDIOCAP™ II CH-SERIES SERVICE MANUAL 12-3b
Status Code Interpretation
For example:
740
7 (first character) indicates that the status code is about Pleth/SpO2

status and alarm (see the table on the preceding page).
4 (second character) indicates bit b2 is active (see the table above).

It is “probe off” according to the table on the preceding page.
0 (third character) indicates that there is no error among the items

listed in the third character box in the same table.
So the status code 740 indicates “probe off”.

Alarm Activation/Deactivation String
Alarm activation string appears immediately when an alarm is

given.
CARDIOCAP™ monitor alarm

activation string identification
Alarm parameter
Alarm activation value
< or > depending on whether low

or high limit
Limit
CARDIOCAP™ alarm deactivation

string identification
Alarm parameter
*) When Capnomac Ultima™ is connected
Command/Info String
CARDIOCAP™ command/
info string identification
RES for reset, POW for power-up
Program code

B CCP-104 GRAPHICS PRINTER

The CCP-104 is an HP ThinkJet graphics printer. Earlier printers
(CCP-104-xx-00, see the type plate on the bottom of the unit)
require an isolated connecting cable (P/N 873152) to satisfy
medical electronics safety requirements. Printers currently in
production (CCP-104-xx-01) are IEC 601-1 class II devices and do
not require an isolated cable. The non-isolated connecting cable’s
part number is 875370. Due to mechanical changes the isolated
connecting cable can not be connected to the current printers.
For troubleshooting the printer please refer to the HP ThinkJet

service manual.
See figure below for the correct DIP switch settings in the printer.
March 20th, 1992/2

C TRILINGUAL LIST OF ERROR MESSAGES

Listing of error messages in English, German and French.
English version German version French version
ARTIFACT ARTEFAKT ARTEFACT
CHECK PROBE CHECK SENSOR VERIF CAPTEUR
CUFF LOOSE MANSCH. LOCKER BRASSARD LACHE
CUFF OCCLUSION MAN. OCCLUSION OCCL BRASSARD
EXTERNAL RAM EXTERN. RAM ERREUR DE RAM

ERROR FEHLER
INVASIVE BP INVASIVER DRUCK PRESS. INV.

NOT CALIBRATED, NICHT KALIBRIERT, NON ETALONNEE,
RECALIBRATE NEU-KAL RE-ETALONNER
LEADS OFF EKG AUS ECG INOP
LOW PLETH SIGNAL GERINGES PULS- SIGNAL PLETH PEU

SIGNAL FIABLE
MEMORY CIRCUIT SPEICHER-FEHLER/ ERREUR CIRCUIT

FAILURE/CALL SERVICE MEMOIRE/APPELER
SERVICE ERFORDERLICH SERVICE
NIBP AIR LEAKAGE NIBD UNDICHT FUITE AIR BRAS
NIBP ARTIFACT NIBD ARTEFACT ARTEFACT PNI
NIBP HW ERR X NIBD HW FEHL X PNI HW ERR X
NTBP ZERO ERROR NIBD NULL FEHLER ERREUR 0 PNI
NO NIBP KEIN NIBD PAS DE PNI
NO PROBE KEIN SENSOR PAS DE CAPTEUR
PROBE OFF SENSOR LOSE CAPTEUR DECONN.
ROM CHECKSUM ROM CHECK ERREUR DE ROM

ERROR FEHLER
TEMPERATURE NOT TEMPERATUR NICHT TEMPERATURE NON

CALIBRATED, KALIBRIERT, ETALONNEE,
RECALIBRATE NEU-KALIBR. RE-ETALONNER

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All specifications subject to change without notice

Document No. 878910- 1

March 22nd, 1996

Datex-Engstrom Division, Instrumentarium Corp.

1 CONTENTS .......................................................................................................... PAGE

2 WARNINGS AND CAUTIONS.. .............................................................................. 2- 1

3 INTRODUCTION AND APPLICABILITY OF THIS MANUAL ......................... 3-1

4 GENERAL DESCRIPTION.. .................................................................................... 4- 1

5 DETAILED DESCRIPTION O F MODULES............................................................. 5-1

December 10th, 1993/3

5.4 NIBP Measurement ....................................................................................... 5-17

6 SERVICE AND TROUBLESHOOTING .................................................................. 6-1

ADJUSTMENTS.. ..................................................................................................... 7-1

March 22nd, 1996/4

7.4 NIBP board adjustment.. ................................................................................. 7-4

8 FUNCTIONAL FIELD CHECK PROCEDURE ..................................................... 8-1

9 SPARE PARTS ......................................................................................................... 9-1

12 APPENDICES ......................................................................................................... 12-1

A COMPUTER OUTPUT ........................................................................................... 12-1

B CCP-104 GRAPHICS PRINTER ............................................................................ 12-5

C TRILINGUAL LIST OF ERROR MESSAGES.. ................................................... 12-6

March 22nd, 1996/4

List o f Figures................................................................................................................ PAGE

Absorption coefficients of oxy- and deoxy-hemoglobin in the red and

Absorption of infrared light in the finger ........................................................... 4-15

Finger sensor parts layout and schematic diagram .............................................. 4-16

General block diagram .......................................................................................... 4-18

Wiring diagram ...................................................................................................... 4-19

ECG board block diagram ...................................................................................... 5-3

ECG board parts layout (CH-R, CH-1R, CH-RS, CH-1RS)

ECG board schematic diagram (CH-R, CH-1R, CH-RS, CH-1RS)

RESP board block diagram ..................................................................................... 5-7

RESP board parts layout and schematic diagram

IPT board block diagram ...................................................................................... 5-14

IPT board (board modification level 4 and higher) and

IPT board schematic diagrams ............................................................................ 5-16a

Block Diagram of NIBP System (USA Version) ................................................... 5-24

NIBP board parts layout and schematic diagram

5.10a NIBP board schematic diagram

March 22nd, 1996/4

5.11 NIBP board parts layout schematic diagram

5.11a NIBP board schematic diagram

5.12 SpO2 measuring board block diagram, parts layout

5.13 SpO2 measuring board schematic diagram ......................................................... 5-33

5.14 SpO 2 measuring board signal waveforms...............................................................5-34a

5.15 SpO2 processor board block diagram and parts layout

5.16 SpO2 processor board schematic diagram

5.17 CPU board block diagram and parts layout...........................................................5-40

5.18 CPU board schematic diagram (part 1) .............................................................. 5-41

5.19 CPU board jumper configuration and schematic diagram

5.20 Video ASIC board parts layout............................................................................ 5-44

5.21 Video ASIC board schematic diagram ................................................................ 5-45

5.22 Power supply board block diagram....................................................................... 5-47

5.23 Transformer diagram and power supply board signal waveforms..............................5-48

5.24 Power supply board parts layout and schematic diagram

5.25 Power supply board schematic diagram (part 2) ................................................. 5-50

5.26 Mother board parts layout and schematic diagram

5.27 Keyboard parts layout and schematic diagram.......................................................5-53

5.28 Loudspeaker unit parts layout and schematic diagram........................................5-54