WFM5000 Service Manual

xx
WFM4000 and WFM5000

Waveform Monitors
ZZZ
Service Manual
*P077244201*
077-2442-01
xx WFM4000 and WFM5000
Waveform Monitors
ZZZ
Service Manual
Revision B
Warning
The servicing instructions are for use by qualified personnel
only. To avoid personal injury, do not perform any servicing
unless you are qualified to do so. Refer to all safety summaries
prior to performing service.
www.tektronix.com
077-2442-01
Copyright © Tektronix. All rights reserved. Licensed software products are owned by Tektronix or its subsidiaries
or suppliers, and are protected by national copyright laws and international treaty provisions.
Tektronix products are covered by U.S. and foreign patents, issued and pending. Information in this publication
supersedes that in all previously published material. Specifications and price change privileges reserved.
TEKTRONIX and TEK are registered trademarks of Tektronix, Inc.
Contacting Tektronix
Tektronix, Inc.
14150 SW Karl Braun Drive
P.O. Box 500
Beaverton, OR 97077
USA
For product information, sales, service, and technical support:

In North America, call 1-800-833-9200.
Worldwide, visit www.tektronix.com to find contacts in your area.
Warranty
Tektronix warrants that this product will be free from defects in materials and workmanship for a period of one (1)
year from the date of shipment. If any such product proves defective during this warranty period, Tektronix, at its
option, either will repair the defective product without charge for parts and labor, or will provide a replacement
in exchange for the defective product. Parts, modules and replacement products used by Tektronix for warranty
work may be new or reconditioned to like new performance. All replaced parts, modules and products become
the property of Tektronix.
In order to obtain service under this warranty, Customer must notify Tektronix of the defect before the expiration of
the warranty period and make suitable arrangements for the performance of service. Customer shall be responsible
for packaging and shipping the defective product to the service center designated by Tektronix, with shipping
charges prepaid. Tektronix shall pay for the return of the product to Customer if the shipment is to a location within
the country in which the Tektronix service center is located. Customer shall be responsible for paying all shipping
charges, duties, taxes, and any other charges for products returned to any other locations.
This warranty shall not apply to any defect, failure or damage caused by improper use or improper or inadequate
maintenance and care. Tektronix shall not be obligated to furnish service under this warranty a) to repair damage
resulting from attempts by personnel other than Tektronix representatives to install, repair or service the product;
b) to repair damage resulting from improper use or connection to incompatible equipment; c) to repair any damage
or malfunction caused by the use of non-Tektronix supplies; or d) to service a product that has been modified or
integrated with other products when the effect of such modification or integration increases the time or difficulty
of servicing the product.
THIS WARRANTY IS GIVEN BY TEKTRONIX WITH RESPECT TO THE PRODUCT IN LIEU OF ANY
OTHER WARRANTIES, EXPRESS OR IMPLIED. TEKTRONIX AND ITS VENDORS DISCLAIM ANY
IMPLIED WARRANTIES OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE.
TEKTRONIX’ RESPONSIBILITY TO REPAIR OR REPLACE DEFECTIVE PRODUCTS IS THE SOLE
AND EXCLUSIVE REMEDY PROVIDED TO THE CUSTOMER FOR BREACH OF THIS WARRANTY.
TEKTRONIX AND ITS VENDORS WILL NOT BE LIABLE FOR ANY INDIRECT, SPECIAL, INCIDENTAL,
OR CONSEQUENTIAL DAMAGES IRRESPECTIVE OF WHETHER TEKTRONIX OR THE VENDOR HAS
ADVANCE NOTICE OF THE POSSIBILITY OF SUCH DAMAGES.
[W2 – 15AUG04]
Table of Contents
General Safety Summary ......................................................................................... iv
Service Safety Summary.......................................................................................... vi
Preface ............................................................................................................. vii
Manual Conventions......................................................................................... vii
Related Manuals ............................................................................................. viii
Introduction ......................................................................................................... 1
Service Strategy................................................................................................ 1
Specifications................................................................................................... 1
Performance Verification...................................................................................... 1
Options and Accessories ...................................................................................... 1
Configurations.................................................................................................. 1
Hardware Installation.......................................................................................... 2
Product Upgrade ............................................................................................... 2
Operating Information......................................................................................... 2
Theory of Operation................................................................................................ 3
SDI I/O Board.................................................................................................. 5
Reference I/O Board........................................................................................... 5
Main Board ..................................................................................................... 5
Front Panel ..................................................................................................... 6
Audio............................................................................................................ 7
Fan Control ..................................................................................................... 7
Power Supply and Distribution............................................................................... 7
General Maintenance............................................................................................... 9
Preventing ESD ................................................................................................ 9
Inspection and Cleaning...................................................................................... 10
Troubleshooting............................................................................................... 12
Detailed Troubleshooting Procedures ...................................................................... 15
Repackaging Instructions ......................................................................................... 21
Packaging ...................................................................................................... 21
Shipping to the Service Center .............................................................................. 21
Removal and Replacement Procedures ......................................................................... 22
Preparation..................................................................................................... 22
Module Removal.............................................................................................. 24
Replaceable Parts .................................................................................................. 41
Parts Ordering Information .................................................................................. 41
Using the Replaceable Parts Lists........................................................................... 42
WFM4000 and WFM5000 Service Manual i

Table of Contents
List of Figures
Figure 1: Block diagram ........................................................................................... 4
Figure 2: Backplane board power supply test points .......................................................... 18
Figure 3: WFM overview view 1 ................................................................................ 25
Figure 4: WFM overview view 2 ................................................................................ 26
Figure 5: Rear panel cover removal ............................................................................. 27
Figure 6: I/O bracket removal.................................................................................... 29
Figure 7: Main board removal ................................................................................... 30
Figure 8: SDI and REF connectors .............................................................................. 31
Figure 9: SDI and Ref board removal........................................................................... 32
Figure 10: Backplane board view 1 ............................................................................. 33
Figure 11: Backplane board view 2 ............................................................................. 34
Figure 12: Backlight driver board removal ..................................................................... 35
Figure 13: Front panel assembly removal ...................................................................... 36
Figure 14: Front panel board and backlight removal .......................................................... 37
Figure 15: Removing the LCD assembly bracket.............................................................. 39
Figure 16: Backlight removal .................................................................................... 40
ii WFM4000 and WFM5000 Service Manual

Table of Contents
List of Tables
Table i: Related documentation ................................................................................. viii
Table 1: External inspection check list.......................................................................... 11
Table 2: Internal inspection check list........................................................................... 11
Table 3: Required test equipment................................................................................ 13
Table 4: Symptoms and causes .................................................................................. 14
Table 5: Backplane board secondary supplies.................................................................. 17
Table 6: Lead-free solder and paste ............................................................................. 23
Table 7: Tools required for module removal ................................................................... 24
Table 8: Module removal ......................................................................................... 24
Table 9: Parts list column descriptions.......................................................................... 42
Table 10: Figure 3 replaceable parts list ........................................................................ 42
Table 17: Figure 10 replaceable parts list....................................................................... 45
Table 18: Figure 11 replaceable parts list ....................................................................... 45
Table 21: Figure 14, Figure 15, and Figure 16 replaceable parts list ........................................ 46
Table 22: Accessories ............................................................................................. 48
WFM4000 and WFM5000 Service Manual iii

General Safety Summary

Review the following safety precautions to avoid injury and prevent damage to
this product or any products connected to it.
To avoid potential hazards, use this product only as specified.
Only qualified personnel should perform service procedures.
While using this product, you may need to access other parts of a larger system.
Read the safety sections of the other component manuals for warnings and
cautions related to operating the system.
To Avoid Fire or Personal Use proper power cord. Use only the power cord specified for this product and
Injury certified for the country of use.
Ground the product. This product is grounded through the grounding conductor
of the power cord. To avoid electric shock, the grounding conductor must be
connected to earth ground. Before making connections to the input or output
terminals of the product, ensure that the product is properly grounded.
Observe all terminal ratings. To avoid fire or shock hazard, observe all ratings
and markings on the product. Consult the product manual for further ratings
information before making connections to the product.
Do not apply a potential to any terminal, including the common terminal, that
exceeds the maximum rating of that terminal.
Power disconnect. The power cord disconnects the product from the power source.
Do not block the power cord; it must remain accessible to the user at all times.
Do not operate without covers. Do not operate this product with covers or panels
removed.
Do not operate with suspected failures. If you suspect that there is damage to this
product, have it inspected by qualified service personnel.
Avoid exposed circuitry. Do not touch exposed connections and components when
power is present.
Replace batteries properly. Replace batteries only with the specified type and
rating.
Recharge batteries properly. Recharge batteries for the recommended charge cycle
only.
Use proper AC adapter. Use only the AC adapter specified for this product.
iv WFM4000 and WFM5000 Service Manual

Do not operate in wet/damp conditions.

Do not operate in an explosive atmosphere.
Keep product surfaces clean and dry.
Provide proper ventilation. Refer to the manual’s installation instructions for
details on installing the product so it has proper ventilation.
Terms in This Manual These terms may appear in this manual:
WARNING. Warning statements identify conditions or practices that could result

in injury or loss of life.
CAUTION. Caution statements identify conditions or practices that could result in

damage to this product or other property.
Symbols and Terms on the These terms may appear on the product:
Product DANGER indicates an injury hazard immediately accessible as you read
the marking.
WARNING indicates an injury hazard not immediately accessible as you
read the marking.
CAUTION indicates a hazard to property including the product.
The following symbol(s) may appear on the product:
WFM4000 and WFM5000 Service Manual v

Service Safety Summary
Service Safety Summary

Only qualified personnel should perform service procedures. Read this Service
Safety Summary and the General Safety Summary before performing any service
procedures.
Do Not Service Alone. Do not perform internal service or adjustments of this

product unless another person capable of rendering first aid and resuscitation is
present.
Disconnect Power. To avoid electric shock, switch off the instrument power, then
disconnect the power cord from the mains power.
Use Care When Servicing With Power On. Dangerous voltages or currents may
exist in this product. Disconnect power, remove battery (if applicable), and
disconnect test leads before removing protective panels, soldering, or replacing
components.
To avoid electric shock, do not touch exposed connections.
vi WFM4000 and WFM5000 Service Manual

Preface
This manual supports servicing to the module level of the WFM4000 and
WFM5000 Waveform Monitors, which process video signals for display on
an internal XGA LCD. These instruments are used in video and television
broadcasting, production, and post-production environments.
This manual explains how to troubleshoot and service the monitor to the module
level. The manual is divided into the following sections:
Introduction provides a general product description and tells where to find
product installation information.
Theory of Operation provides descriptions of the WFM4000 and WFM5000
Series Waveform Monitors modules.
Maintenance tells you how to troubleshoot the product to the module
level, remove the modules, and provides lists of replaceable modules and
mechanical parts, and replacement part numbers.
Manual Conventions
The following terms and conventions are used throughout this manual:
The term “monitor” is used interchangeably with the more formal term
“WFM4000 and WFM5000 Series Waveform Monitors.”
The term “instrument” is used interchangeably with the term “monitor.”
The term “module” refers to a collection of parts.
WFM4000 and WFM5000 Service Manual vii

Preface
Related Manuals
This manual assumes you have access to the following manuals and documentation
when servicing this product. The manuals ship with the product on the Product
Documentation CD and are also downloadable from the Tektronix Web site. The
Online Help comes pre-installed on the instrument.
Table i: Related documentation

Item Purpose Location
WFM4000 and WFM5000 Waveform Installation and high-level operational
Monitors User Manual overview
WFM4000 and WFM5000 Online Help In-depth operation and UI help
WFM4000 and WFM5000 Waveform Procedure for checking performance and

Monitors Specifications and Performance list of specifications
Verification
viii WFM4000 and WFM5000 Service Manual

Introduction
The WFM4000 and WFM5000 Waveform Monitors provide a powerful and
portable monitoring solution for broadcast, production, and post-production
environments.
Service Strategy
The WFM4000 and WFM5000 Series Waveform Monitors will be repaired to the
module level at selected Tektronix service centers. Repair includes functional
verification of the product. Component level repair by the customer is not
supported.
Specifications
The specifications for this product are found on the WFM4000 and WFM5000
Product Documentation CD that ships with the product. (See page viii, Related
Manuals.)
Performance Verification
The Performance Verification procedures for this product are found in the
WFM4000 and WFM5000 Product Documentation CD that ships with the
product. (See page viii, Related Manuals.)
Options and Accessories

The lists of options and accessories for this product are found in the WFM4000
and WFM5000 Waveform Monitors User Manual provided in the WFM4000
and WFM5000 Product Documentation CD that ships with the product. (See
page viii, Related Manuals.)
Configurations
The WFM4000 Waveform Monitor has SD SDI inputs. The WFM5000 Waveform
Monitor has dual mode SD/HD SDI inputs. No other configurations are available
with these instruments.
WFM4000 and WFM5000 Service Manual 1

Introduction
Hardware Installation
The waveform monitor is shipped in a one-piece, unpainted, bathtub shaped,
EMI shell. It can be used as-is or installed into a hard carry case, soft carry case
(requires hard carry case), or rack mount cabinet. For installation instructions
into a rack mount or cabinet, refer to the WFM4000 and WFM5000 Waveform
Monitors and WVR4000 and WVR5000 Waveform Rasterizers System Integration
Technical Reference.
Product Upgrade
No field upgrades are available for the WFM4000 or WFM5000 Waveform
Monitors. When software updates become available, you can access them from
the Tektronix Web site: www.tek.com. The WFM4000 and WFM5000 Waveform
Monitors User Manual includes instructions for updating product software.
Operating Information
For basic operating instructions, refer to the WFM4000 and WFM5000 Waveform
Monitors User Manual that can be found on the WFM4000 and WFM5000
Product Documentation CD that shipped with this product. For more detailed
reference information, refer to the Waveform Monitor Online Help. (Press the
Help button on the instrument and then use the General knob, up/down arrow
keys, and SEL button to navigate through the topics.)
In addition, there is context sensitive help to identify the buttons, knobs, and soft
keys. Press the Help button to enable the context sensitive help. Touch it again
to turn the context sensitive help off.
Power-On Procedure 1. Connect the power cord to the AC adapter. If the instrument has a
rechargeable battery as a power source, connect the connector on the battery
to the rear panel of the instrument and then proceed to step 3.
2. Connect the AC adapter to the rear panel of the instrument and the power cord
to an AC line frequency of 50 or 60 Hz within the range of 100 to 240 volts.
3. Press the Power button.
4. Wait for the system to complete its power-on self-tests.
Power-Down Procedure There are two methods to power down the instrument:
Power Button – Press the Power button to turn the instrument off.
Power Supply – Unplug the instrument from the power source to turn the
instrument off.
2 WFM4000 and WFM5000 Service Manual

Theory of Operation
The WFM4000 and WFM5000 are modular waveform monitors. They are
configured to accept serial SD digital or HD digital inputs, and digital audio inputs.
All models use an internal XGA monitor for the display.
This theory of operation is mainly based on the High-level Block diagram. (See
Figure 1.)

Theory of Operation
Figure 1: Block diagram

Theory of Operation
SDI I/O Board

Serial Digital Input The serial digital inputs are AC coupled and buffered passive loopthroughs.
Processing The signal passes through an amplifier while traveling to the channel selection
switch. Only the amplifier corresponding to the selected channel is “on” (meaning
that only the selected amp gets DC power). The selected signal passes through
an equalizer whose digital differential pair output is sent over the ribbon cable
to the Main board.
AES Audio Input The AES digital audio input is AC coupled and bit sliced by a comparator, the
Processing single ended digital output of which is sent over the ribbon cable to the Main
board.
Reference I/O Board

Reference Input The Reference input is an AC coupled and buffered passive loopthrough. The
reference signal is applied to a sync separator, the single ended digital output of
which is sent over the ribbon cable to the Main board.
LTC Input The LTC input is a differential pair that is bit sliced by a comparator, the single
ended digital output of which is sent over the ribbon cable to the Main board.
Ground Closure Interface The ground closure interface (GCI) signals are heavily filtered and protected
Signals against adverse customer connections. Inputs (except Future 3 and 4) are buffered
and the digital outputs are sent over the ribbon cable to the Main board. Future
3 and 4, since they have no directional circuitry, could be used as outputs in the
future.
Main Board
Reference Input The Reference input is a passive loopthrough, which is AC coupled and buffered.
The reference signal is applied to a sync separator whose output is supplied to the
DSP FPGA, where the timing information is derived.
Digital Waveform The data stream from the SDI video input is applied to the waveform processing
Processing Engine FPGA. This block deformats, up-samples, interpolates, demodulates, and
otherwise processes the data to generate the signals needed to create the displays.

Theory of Operation
Rasterizing Engine The Rasterizer engine resides in the same DSP FPGA as the waveform processing
FPGA. This block builds up the variable intensity images in the fast static RAM.
For each pixel of the display, the Rasterizer Engine increments the intensity of that
pixel every time the waveform hits its coordinates. As a result the waveform areas
hit more frequently are brighter. For any given frame the intensity map is built up
in one memory chip and read out of the other. The functions swap on the next field.
Recursion and Picture The output of the rasterizer feeds the picture and recursive processing engine
Processing Engine in the second large FPGA. This engine adds the previous frame to the present
frame to reduce flicker and improve brightness. It also converts the picture and
waveform signals from the input rate to 59.94 Hz frame rate to work with the
XGA monitor. The picture and waveform data combine with the graphics and
audio bar information from the control processor, and then output to the XGA
LCD display drive. Note that the parallel data from the serial digital input connect
directly to this FPGA to provide the picture display functionality, bypassing the
waveform processing engine, which is the DSP FPGA.
Control Processor The control processor is in charge of all the operational modes in the instrument.
It draws the audio bars, communicates with the front panel through SPI signaling,
and controls most other internal devices though either the SPI or the I2C serial
buses.
The control processor interfaces to the Ethernet through a dual rate connection.
This allows the network connection to run at 10 or 100 MB/s. The control
processor has an internal USB 1.1 port that it uses to interface to the USB.
LTC LTC inputs come from the remote connector on the REF I/O board where it is
converted from differential to single-ended. The LTC signal is applied to the
waveform processing FPGA, which decodes the time code information.
NOTE. The FPGAs decode VITC signals digitally.
Front Panel
The front panel contains a small processor which communicates with the control
processor through SPI signaling. Reprogramming can be done through SPI as
well, if the front panel processor flash code needs to be updated.

Theory of Operation
Audio
The audio capabilities reside on the main board and the backplane board. Audio
supports digital embedded and AES/EBU monitoring.
Audio Processing The audio processing engine uses the DSY FPGA, whose main function is to
calculate the peak values for the selected meter ballistics (response characteristics).
The audio data has two paths to the display. On one path, peak values are sent to
the control processor which then plots the bar display. On the second path, raw
data samples are sent to the waveform processing engine which interpolates and
plots it to generate the lissajous, or “phase,” display.
Audio Inputs There are two basic audio input paths: AES and embedded. AES inputs are
accepted at rates up to 192 kHz.
The embedded audio path starts at the waveform processing engine. First the
audio samples are extracted from the serial digital video data and then multiplexed
into the AES decoder. They then follow the same path as the AES data.
Fan Control
There is a temperature sensor on the Backplane board. The control circuits use the
temperature data to adjust the target speed for the fan. The fan circuit holds the
fan speed at the target by measuring the fan tachometer output, allowing reliable
operation at low speed. If the fan is not turning, the circuit senses the stall and
turns on a red LED (DS170 on the Backplane board).
Power Supply and Distribution

The Backplane board provides adverse input protection, on/off switching, and
transient/EMC conditioning for the DC power input. The Backplane board also
hosts all of the DC/DC converters for the various voltages used within the unit. In
some cases, additional local linear regulators are used on other boards.
A 4 amp Polyswitch (self resetting thermal fuse) provides input overcurrent
fault protection. Failure of this fuse usually indicates a serious fault within the
instrument.
The secondary supplies, their tolerances and locations are specified in the General
Maintenance section.

Theory of Operation

General Maintenance
This section contains the information needed to perform periodic and corrective
maintenance on the instrument. The following subsections are included:
Preventing ESD – General information on preventing damage by electrostatic
discharge.
Inspection and Cleaning – Information and procedures for inspecting and
cleaning the instrument.
Troubleshooting – Information for isolating and troubleshooting failed
modules. Included are instructions for operating instrument diagnostic
routines and troubleshooting trees. Most of the trees make use of the internal
diagnostic routines to speed fault isolation to a module.
Preventing ESD
Before servicing this product, read the Safety Summary and Introduction at the
front of the manual, and the ESD information below.
CAUTION. Static discharge can damage any semiconductor component in the

instrument.
When performing any service that requires internal access to the instrument,
adhere to the following precautions to avoid damaging internal modules and their
components due to electrostatic discharge (ESD).
1. Minimize handling of static-sensitive circuit boards and components.
2. Transport and store static-sensitive modules in their static protected containers
or on a metal rail. Label any package that contains static-sensitive boards.
3. Discharge the static voltage from your body by wearing a grounded antistatic
wrist strap while handling these modules. Do service of static-sensitive
modules only at a static-free work station.
4. Nothing capable of generating or holding a static charge should be allowed
on the work station surface.
5. Handle circuit boards by the edges when possible.
6. Do not slide the circuit boards over any surface.
7. Avoid handling circuit boards in areas that have a floor or work-surface
covering capable of generating a static charge.

General Maintenance
Inspection and Cleaning

Inspection and Cleaning describes how to inspect for dirt and damage. It also
describes how to clean the exterior and interior of the waveform monitor.
Inspection and cleaning are done as preventive maintenance. Preventive
maintenance, when done regularly, may prevent instrument malfunction and
enhance its reliability.
Preventive maintenance consists of visually inspecting and cleaning the
instrument and using general care when operating it.
How often maintenance should be performed depends on the severity of the
environment in which the instrument is used. A proper time to perform preventive
maintenance is just before any instrument adjustment.
General Care The cabinet helps keep dust out of the instrument and should normally be in place
during instrument operation.
WARNING. To prevent injury or death, power down the instrument and disconnect
it from line voltage before performing any procedure that follows.
Interior Cleaning Use a dry, low-velocity stream of air to clean the interior of the chassis. Use a
soft-bristle, non-static-producing brush for cleaning around components. If you
must use a liquid for minor interior cleaning, use a 75% isopropyl alcohol solution
and rinse with deionized water.
Exterior Cleaning Clean the exterior surfaces of the chassis with a dry lint-free cloth or a soft-bristle
brush. If any dirt remains, use a cloth or swab dipped in a 75% isopropyl alcohol
solution. Use a swab to clean narrow spaces around controls and connectors. Do
not use abrasive compounds on any part of the instrument that may damaged by it.
CAUTION. Avoid the use of chemical cleaning agents that might damage the
plastics used in the instrument. Use only deionized water when cleaning the
front-panel buttons. Use a glass cleaner to clean the LCD. For the rest of the
instrument, use a 75% isopropyl alcohol solution as a cleaner and rinse with
deionized water. Before using any other type of cleaner, consult your Tektronix
Service Center or representative.
Inspection – Exterior. Inspect the outside of the instrument for damage, wear, and
missing parts, using the following table as a guide. Immediately repair defects
that could cause personal injury or lead to further damage to the instrument.

General Maintenance
Table 1: External inspection check list

Item Inspect for Repair action
Front panel and hard case Cracks, scratches, Repair or replace defective
deformations, damaged module
hardware
Front-panel knobs Missing, damaged, or loose Repair or replace missing or
knobs defective knobs
Connectors Broken shells, cracked Repair or replace defective
insulation, and deformed modules. Clear or wash out
contacts. Dirt in connectors dirt
Hard case handle and feet Correct operation Repair or replace defective
part
Accessories Missing items or parts of Repair or replace damaged
items, bent pins, broken or or missing items, frayed
frayed cables, and damaged cables, and defective
connectors modules
LCD Cracks Replace the LCD assembly
Dirty Clean with glass cleaner
Inspection – Interior. To access the inside of the instrument for inspection and
cleaning, you will need to remove the top cover.
Inspect the internal portions of the instrument for damage and wear. Defects
found should be repaired immediately.
If any circuit board is repaired or replaced, see if it is necessary to adjust the
instrument. (See Table 2 on page 11.)
CAUTION. To prevent damage from electrical arcing, ensure that circuit boards
and components are dry before applying power to the instrument.
Table 2: Internal inspection check list

Circuit boards Loose, broken, or corroded Remove and replace
solder connections. damaged circuit board.
Burned circuit boards.
Burned, broken, or cracked
circuit-run plating.
Resistors Burned, cracked, broken, Remove and replace
blistered condition. damaged circuit board.
Solder connections Cold solder or rosin joints. Resolder joint and clean
with isopropyl alcohol.
Capacitors Damaged or leaking cases. Remove and replace
Corroded solder on leads or damaged circuit board.
terminals.

General Maintenance
Table 2: Internal inspection check list (cont.)

Wiring and cables Loose plugs or connectors. Firmly seat connectors.
Burned, broken, or frayed Repair or replace modules
wiring. with defective wires or
cables.
Chassis Dents, deformations, and Straighten, repair, or replace
damaged hardware. defective hardware.
Cleaning Procedure – Interior. To clean the instrument interior, perform the

following steps:
1. Blow off dust with dry, low-pressure, deionized air (approximately 9 psi).
2. Remove any remaining dust with a lint-free cloth dampened in isopropyl
alcohol (75% solution) and rinse with warm deionized water. (A cotton-tipped
applicator is useful for cleaning in narrow spaces and on circuit boards.)
STOP. If, after doing steps 1 and 2, a module is clean upon inspection, skip the
remaining steps.
3. If steps 1 and 2 do not remove all the dust or dirt, the instrument may be spray
washed using a solution of 75% isopropyl alcohol by doing steps 4 through 6.
4. Gain access to the parts to be cleaned by removing easily accessible shields
and panels.
5. Spray wash dirty parts with the isopropyl alcohol and wait 60 seconds for the
majority of the alcohol to evaporate.
6. Dry all parts with low-pressure, deionized air.
Lubrication. There is no periodic lubrication required for the instrument.
Troubleshooting
The procedures in this section will help you trace the root cause of a problem back
to one of the replaceable modules. In general, this is a board-level replacement,
but there are a few components on some boards that are replaceable.
WARNING. Before performing this or any other procedure in this manual, read the
General Safety Summary and Service Safety Summary found at the beginning of
this manual.
To prevent possible injury to service personnel or damage to electrical
components, refer to Preventing ESD. (See page 9.)

General Maintenance
Getting Started To properly test an instrument you must have appropriate signal sources.
Depending on what portion of the instrument you are testing, this might include
Serial Digital Video or Digital Audio. In some cases, you may also need receivers
or an oscilloscope to check outputs.
These instruments consist of several boards and major components. The objective
of this troubleshooting guide is to isolate a problem to a module or board so it
can be replaced. This guide does not provide information to troubleshoot to the
component level.
Standard boards and modules:
Display Assembly (LCD, Backlight assembly, Backlight driver board, Front
Panel board)
Main board
REF I/O board
SDI I/O board
Backplane board
Front panel board
Backlight driver board
Table 3: Required test equipment

Test equipment Requirements Example
SDI serial digital video test generator with 1080i 59.94 HD signals required for Tektronix TG2000 with HDVG1 module
embedded audio and composite signal WFM5000: for TG2000 (Embedded audio needed)
source. Varies with instrument model: SD
(WFM4000), HD (WFM5000) 100% color bars
10 bit shallow ramp
SDI Matrix Split Field Pathological
Signal
100% sweep
525/270 SD signals required for DVG1 with option S1 module for TG2000
WFM4000: (Embedded audio needed)
100% color bars
10 bit shallow ramp
SDI Matrix Pathological Signal
H 100% sweep
AES Audio Signal Generator 48 kHz, 24 bit word length signals Rohde & Schwarz UPL06, Tektronix
AM700 and AM70.
Voltmeter Fluke 87 or equivalent

General Maintenance
Table 3: Required test equipment (cont.)

Test equipment Requirements Example
DC Ammeter with Clamp on pickup 20 Amp DC capable Fluke 336 or equivalent
Oscilloscope Video trigger capability Tektronix TDS3000B Series
Table 4: Symptoms and causes

Symptom Possible Sources or Recommended Detailed Troubleshooting Procedure to follow
No LEDs lit and/or LCD not Perform general checks
working Perform power supply checks
Perform Front Panel button Troubleshooting
Perform LCD troubleshooting test
Replace main circuit board, Backplane board, or Front Panel assembly as indicated by above
tests
Inconsistent or partial hardware Perform power supply checks
failures Examine Power On Self Tests (POST) results in the Diagnostic Log
Replace Main circuit board
Fails any of these Power On Self Review messages in diagnostic log
Tests (POST): Perform power supply checks
Timecode Decoder Comm Replace the main board
SDI Deserializer Comm

DSP FPGA A Comm
DSP FPGA A Program
Display FPGA Comm
Display FPGA Program
No text or traces on LCD Perform LCD troubleshooting test
Dim region on LCD (roughly 1/6 or Perform the Backlight Driver board replacement procedure. If that does not resolve the
a multiple thereof) problem, perform the Backlight replacement procedure.

General Maintenance
Table 4: Symptoms and causes (cont.)

Symptom Possible Sources or Recommended Detailed Troubleshooting Procedure to follow
Functional Test Failures In case of failure on either Functional or the Performance tests, the board at fault is generally
PVD Test Failures obvious. Before replacing a board:
1. Perform the power supply check.
2. Check the diagnostic log for help in isolating the fault.
If those do not isolate the problem, then replace the main board if the test is in one of the
following areas:
SDI
REF
LTC
If the problem is only the SDI input, first replace the SDI I/O board. If that does not fix the
problem, replace the main board.
If the problem is only the reference input, replace the Ref I/O board. If the problem persists,
then replace the main board.
If the problem is in audio, perform the steps in the Audio Troubleshooting section.
Unknown Problems 1. Check the diagnostic log. This log records a variety of problems and will enable you to see
Often an instrument will come into messages for an error that may not be currently happening.
service with vague or intermittent 2. Check the power supply by performing the Power Supply check. A marginal supply can lead
symptoms. In cases like these, to intermittent operation if it is near the acceptable threshold.
the following set of tests may help 3. Run the functional test. This will exercise a majority of the functions in the instrument and
find the problem or the marginal includes the diagnostics. Some parts of the test may not be necessary for all problem areas.
condition.
Detailed Troubleshooting Procedures

The following tests should be run as indicated in the Symptom and Causes. (See
Table 4 on page 14.) The procedures check for specific problems or will help you
isolate a problem to a board. You can run them at any time for informational
purposes but if you do not run the procedures in the correct context, then the final
recommendation identifying a root cause might be suspect.
List of detailed troubleshooting procedures:
General Checks
Fan Failures
Power Up/Power Down Troubleshooting
Secondary Power Supply Check
Front Panel Button Troubleshooting
LCD Problems
Isolating Audio Problems

General Maintenance
Examining Power On Self Test Results

Running Diagnostics
General Checks 1. Verify that the power cord is connected.
NOTE. If the instrument is running from a battery, check that the capacity gauge
of the battery indicates that it has charge. Also, check that the battery mounting
plate cable is plugged into the DC input of the instrument.
2. Remove the cover and check that all (visible) internal cables are correctly
connected and seated.
3. Check for any (visible) discolored or burned components.
Fan Failures There is a temperature sensor on the Backplane board. The control circuits use the
temperature data to adjust the target speed for the fan. The fan circuit holds the
fan speed at the target by measuring the fan tachometer output, allowing reliable
operation at low speed.
Since the fan speed is sensed through tachometer feedback, a fault will be asserted
if the fan is not connected, is stalled, or if the tachometer feedback line is not
working correctly. If the fan tachometer feedback stops (for whatever reason),
then the red LED DS170 on the Backplane board will be lit, the front panel fault
light will be lit, and the control circuit voltage at TP10 will drop to near zero
volts (normally close to 5 volts).
To continue diagnosis requires differentiating between the power supply to the fan
and the fan itself. The most direct measurement point is the fan connector, J11 pin
1 (typically red wire), but to measure this while the connector is seated requires
a probe with a very fine tip that can slip into the connector housing alongside
of the wire itself. If the voltage on the fan connector J11 pin 1 is near 13 V
(normal operating is close to 6 V), then replace the fan. If the voltage is not above
10 V, then replace the Backplane board. If equipment precludes measuring the
connector pin directly, an alternate measurement node is F70, on the side closest
to the outside wall of the instrument.
If the fan is spinning, but LED DS170 is lit, the problem is probably the
tachometer feedback line on pin 3 of the fan. Inspect the fan wiring and check
the J11 connector seating. If a sufficiently fine probe tip is available, use the
oscilloscope to look for a square wave (about 4.75 V, 50 – 200 Hz) on the
tachometer feedback line at J11 pin 3.
If J11 pin 3 is static 5 V, replace the fan.
If J11 pin 3 is static 0 V, unplug the fan connector and measure J11 pin 3 on the
board (without any fan connection). If the voltage is now 5 V, replace the fan.

General Maintenance
If probe tips available preclude direct measurement of J11 pin 3, start by replacing
the fan. If that does not fix the problem, replace the Backplane board.
If you measured a square wave on J11 pin 3 (while the fan was running), replace
the Backplane board.
Power Up/Power Down If you push the power button and nothing happens, perform the following steps:
Troubleshooting 1. Verify that the cabling from the Front Panel board to the Backplane board
(10 wire cable J1) is seated and that none of the pins of the connector have
pulled out.
2. If the cabling is solid and the unit will not turn on, replace the Backplane
board (where all the hardware that controls power up resides).
3. If the cabling is solid and the unit will not turn off, then the Main board
software is “lost”. Reload the system software. If the problem persists,
replace the Main board.
Power Supply Test The DC input is processed through a series of protection circuits before being
supplied as VBULK to several DC to DC converters. If any of the following
checks fail, replace the Backplane board. Use the provided picture to locate
Backplane board test points. (See Figure 2.)
The test points are available, with the Backplane board installed, at the location
specified, except for TP11, which is hidden beneath the Main board when the
instrument is assembled. (See Table 5.)
NOTE. All test points have a silk-screened box around them for easy identification.
1. Check the VBULK test point and verify that it is approximately the same as
the input voltage. Input voltage is about 12 V with the supplied AC converter,
or something between 10 V and 18 V running from a battery.
2. Check the following test points for the individual supplies. (See Table 5.)
Table 5: Backplane board secondary supplies

Nominal (V) Allowed range (V) Measure at
VBULK Input V (anywhere in 10 V to TP20
18 V range) with up to 0.2 V
drop
Fan 5 to 13.5 TP11 1
+5 4.75 to 5.25 TP3 2
3.3 3.2 to 3.4 TP4 3
2.5 2.4 to 2.6 TP5 3

General Maintenance
Table 5: Backplane board secondary supplies (cont.)

Nominal (V) Allowed range (V) Measure at
1.5 1.4 to 1.6 TP6 3
-5 -4.75 to -5.25 TP7 3
1 Cannot be seen until the instrument is disassembled.
2 Near the fan circuits.
3 Near the central mounting hole in the middle of the Backplane board. You may have to gently press the J3
ribbon cable out of the way to access it.
Check the Audio supplies on the Audio board (if an Audio board is installed).
The test points are available, with the board installed, at the location specified.
(See Figure 2.)
Figure 2: Backplane board power supply test points

General Maintenance
Front Panel Button Perform this test if the power supplies are good, but none of the buttons are lit or
Troubleshooting responding to presses.
1. Cycle the power to the unit. Immediately after power up, three buttons
(GAIN, SWEEP, and MAG) should be lit continuously for about a second.
Another button or two will begin to light briefly and one at a time before all
buttons go out for a number of seconds while the display prints out a couple
lines of text. Normal boot time is approximately 30 seconds. The initial
sequence of lights, just before they all go out, indicates that the front panel
processor is booting normally.
2. If the buttons are not lit, check the 10 pin cable from the keypad to the main
board J1. If the cable is connected and good, then replace the front panel
assembly.
3. If the buttons do not go out after a second or so, and continue to blink in
a walking sequence, this indicates that the front panel processor has not
received any communications from the Main board host processor. Check the
10 pin cable from the keypad to the main board J1 for proper seating and that
none of the pins in the connector are pulled out. If the connector/cable looks
okay, using a known good Front Panel is the next best troubleshooting tactic
to isolate which board (Front Panel or Main) is at fault.
4. If the buttons light as expected and the unit appears to complete booting, but
the keys are nonresponsive, check to see if the fault light is on (red LED
behind the power button). If so, the front panel processor is likely “lost”.
Replace the Front Panel board.
5. If the buttons do not light in the expected sequence and the screen comes up a
solid white, wait at least 5 minutes before disconnecting power and rebooting.
If the unit boots normally after this, the original problem was that the Main
board processor and the PLD (on the Main board) needed to be programmed.
This is possible of a new Main board that has never been powered up.
Otherwise, it is likely the result of a fault condition on the Main board.
LCD Troubleshooting Perform this test if there is no display on the LCD, but the power supplies test as
nominal.
1. Check that the gray ribbon cable that runs from the internal display to J17 on
the main board is okay. Look at an angle into the gap at the left edge of the
LCD, turn the power off and on and you should be able to see the backlight
come on. It may help to be in a low light area to see the backlight.
2. If the backlight is fully lit, replace the front panel assembly.
3. If the backlight is partially lit, meaning a region of the display is dim, replace
the Backlight Driver board.

General Maintenance
4. If the backlight is completely unlit, replace the backlight.

5. If the backlight remains unlit after replacing the backlight, check the backlight
power cable from the Backlight Driver board (on the rear of the display
assembly) to the Main board J9. Also, check the J9 connector itself for any
solder issues.
6. If the backlight is still completely unlit, replace the Front Panel assembly.
Audio Troubleshooting Perform this test if there are problems with the audio display.
1. If embedded audio is not working, make sure that it still fails when the factory
default preset is loaded. If it still fails, replace the Main board.
2. If AES audio is not working, there is some chance that it is not getting through
the SDI I/O board. First make sure that the ribbon cable between the SDI I/O
board and the Main board is seated and in good condition. If this does not
resolve the problem, follow step 1 for embedded audio.
Examine Power On Self To examine the POST results, press the CONFIG button, then select Utilities >
Tests (POST) Results in View Diagnostic Log, and then press the SEL button.
the Diagnostic Log Each power up is indicated by a boot time stamp, followed by a list of power on
tests. If any failures are indicted, reload the unit software. If that does not resolve
the problem, replace the Main board.
Run Power On Diagnostics To run the Power On Diagnostics, press the CONFIG button, and then select
Utilities > Run Power Up Diags and press the SEL button. Press SEL again to
run the diagnostic tests.
A series of Pass/Fail tests will be run. There are four types of tests performed:
SDI diagnostics, FPGA diagnostics, Timecode diagnostics, and Power Up
diagnostics, although only the first three are listed in the Run Diagnostics screen.
The results are shown on screen and also saved to the Diagnostics Log, where
they can viewed at a later time.
If any failures are indicted, reload the unit software. If that does not resolve the
problem, replace the Main board.

Repackaging Instructions
Repackaging Instructions
This section contains the information needed to repackage the waveform monitor
for shipment or storage.
Packaging
When repacking the instrument for shipment, use the original packaging. If
the packaging is unavailable or unfit for use, contact your local Tektronix
representative to obtain new packaging. Refer to Contacting Tektronix for the
mailing address, the email address, and phone number.
Seal the shipping carton with an industrial stapler or strapping tape.
Shipping to the Service Center

Contact the Service Center to get an RMA (Return Material Authorization)
number, and any return or shipping information you may need.
If the instrument is being shipped to a Tektronix Service Center, enclose the
following information:
The RMA number.
The owner’s address.
Name and phone number of a contact person.
Type and serial number of the instrument.
Reason for returning.
A complete description of the service required.
Mark the address of the Tektronix Service Center and the return address on the
shipping carton in two prominent locations.

Removal and Replacement Procedures

This section contains procedures for the removal and replacement of all
replaceable modules in the instrument.
Preparation
WARNING. Before doing this or any other procedure in this manual, read the
safety summaries found at the beginning of this manual. Also, to prevent possible
injury to service personnel or damage to the instrument components, read
Preventing ESD. (See page 9.)
This subsection contains the following items:

Preparatory information that you need to properly do the procedures that
follow.
List of tools required to remove and disassemble all modules.
Procedures for removal of the modules.
WARNING. Before doing any procedure in this subsection, disconnect the power
cord from the line voltage source. Failure to do so could cause serious injury
or death.
NOTE. Read Equipment Required for a list of the tools needed to remove and
install modules in this instrument. (See Table 7 on page 24.) Read the cleaning
procedure before disassembling the instrument for cleaning.
Lead Free Soldering Lead-free manufacturing processes and components were used to make this
product. The Tektronix Worldwide Service Organization uses lead-free solder
in all repairs. Lead-free solder joints have a satin finish and are not shiny like
lead-based solder joints.
This manual does not support component-level repairs. However, if you do make
any component-level repairs, the following equipment is recommended:

Industry-acceptable lead-free solder or solder paste. (See Table 6.)
Table 6: Lead-free solder and paste

Material Alloy Vendor Detail
Wire Core Solder SAC305 Kester 275 w/Pb-free alloy
Syringe Paste SAC305 Kester R 276SR w/Pb-free
alloy
Soldering iron (and tip) that provides a higher temperature (700 °F) for proper
melting of the lead-free solder.
If you are using syringe paste, a hot air gun capable of providing temperatures
slightly higher than 700 ºF.
Component Level Repairs Lead free soldering. Tektronix, Inc. has used Lead Free Manufacturing processes
(Lead Free Environment) and components in the making of this product and our Worldwide Service
Organization has transitioned to using Lead Free solder in all component level
repairs.
Temperature. For Leaded solder 600 ºF tips are used whereas for Lead-Free
solder 700 ºF tips are used due to the higher melting temperature required for the
alloy. For Syringe Paste a hot air gun can be used where the temperatures tend to
run slightly higher then 700 ºF.
Special Tools. With the exception of a soldering iron capable of providing the
higher temperature for proper soldering, or a hot air gun for syringe paste no new
hand tools are required for soldering components.
Appearance. When using leaded solder we have always been trained to look for a
nice shiny solder joint to indicate that the joint is not a cold solder joint. However
with lead free solder a normal solder joint is dull and will never be shiny.
Lead free solder. Industry acceptable Lead Free solder should be used for all
component level repairs. (See Table 9 on page 42.)
Preparation for Module Equipment Required. Most modules in the instrument can be removed with a
Removal screwdriver handle mounted with a size T-10 or T-15 Torx® screwdriver tip. All
equipment required to remove and reinstall the modules is listed. (See Table 7
on page 24.)

Table 7: Tools required for module removal

Item
no. Name Description
1 Screwdriver Accepts Torx-driver bits
handle
2 T-8 Torx tip Used for removing the screws that hold the power connector
to the I/O bracket. Torx-driver bit for T-8 size screw heads
3 T-10 Torx tip Used for removing instrument screws. Torx-driver bit for
T-10 size screw heads
4 T-15 Torx tip Used for removing instrument screws on boards. Torx-driver
bit for T-15 size screw heads
5 1/8 inch Screwdriver for unlocking cable connectors
flat-bladed
screwdriver
6 Phillips head Used for removing instrument Phillips head screws
screwdriver
7 Angle-Tip Used to remove front panel knobs
Tweezers
8 3/16 inch nut Used to remove jack screws and front panel standoffs
driver
9 MA-800G Used to remove the front panel trim
Soldering Aid
(spudger)
10 Bomar DB36400 Special BNC socket wrench with Controlled Torque. Used
to remove BNCs
11 Soldering iron Used for replacing Main board fuses
(15 W)
12 Long nose pliers Used to compress EMI tabs
Module Removal
Remove a module by following the procedures provided. Use the pictures to see
how to remove any module. The WFM Overview pictures provide a quick way to
determine where modules are located. (See Figure 3.) (See Figure 4.)
The Module Removal table describes how the modules are layered and in which
order they need to be removed. (See Table 8.)
Table 8: Module removal

To remove
Front Front Backlight
panel Main panel SDI Ref Backplane driver Main
You must first remove assembly board board board board board board chassis
Rear panel cover X X X X X X X X

Table 8: Module removal (cont.)

To remove
Front Front Backlight
panel Main panel SDI Ref Backplane driver Main
You must first remove assembly board board board board board board chassis
I/O bracket X X X X X X X X
Fan assembly
Main board X X X X
Front panel board
Backplane board X X X
Backlight driver board X
Main chassis X X
Figure 3: WFM overview view 1

Figure 4: WFM overview view 2

Rear Panel Cover To remove the rear panel cover, perform the following procedure. (See Figure 5.)
1. Remove the nine T-10 screws and the five T-15 screws from the sides, top,
and rear of the rear panel cover.
2. Lift the cover straight up and remove.
Figure 5: Rear panel cover removal

I/O Bracket The I/O bracket is connected to the main chassis and holds the fan, the SDI I/O
board, the REF I/O board, and the Power connector. To remove the bracket,
perform the following procedure. (See Figure 6.)
1. Remove the rear panel cover.
2. Remove the four T-10 screws from the sides of the bracket.
3. Pull the sides of the tray out slightly to clear the grinches.
4. With your hand on the top of the bracket, pull it gently up and back, bringing
it partly away from the rest of the instrument.
5. Detach J5 and J11 from the backplane board.
6. Detach J6 and J7 from the main board.
7. Remove the bracket.

Figure 6: I/O bracket removal

Main Board The main board is perpendicular to the backplane board. To remove the main
board, perform the following procedure. (See Figure 7.)
1. Remove the rear panel cover and the I/O bracket.
2. Detach the J6, J7, and J17 connectors from the main board.
3. Remove the five Torx-15 screws that secure the main board to the main
chassis.
4. Lift the main board up until you are able to reach the J3 and J6 connectors
that attach the main board to the backplane board.
5. Detach the J3 and J6 connectors and remove the main board.
Figure 7: Main board removal

SDI I/O and REF I/O Boards The SDI I/O board and the REF I/O board are both attached to the I/O bracket. To
remove them, perform the following procedure. (See Figure 8.) (See Figure 9.)
2. Remove the seven nuts and washers that are attached to the seven BNC
input/output connectors.
3. Remove the two screws from the 15-pin DSUB connector.
4. Pull the BNCs and the 15-pin DSUB connector through the holes in the
bracket and remove the SDI board.
NOTE. If you need to, remove the power connector by removing the two nuts
and Torx-8 screws.
Figure 8: SDI and REF connectors

Figure 9: SDI and Ref board removal

Backplane Board The backplane board is attache to the main chassis. To remove the backplane
board, perform the following procedure. (See Figure 10.) (See Figure 11.)
2. Remove the six T-15 screws that attach the board to the main chassis.
3. Detach J1 (attached to the front panel board) and J9 (attached to the backlight
driver board).
4. Remove the backplane board.
Figure 10: Backplane board view 1

Figure 11: Backplane board view 2

Backlight Driver Board The backlight driver board is located on the main chassis near the front panel
assembly. To remove the backlight driver board, perform the following procedure.
(See Figure 12.)
1. Remove the two T-10 screws securing the backlight driver board to the main
chassis.
2. Remove J1 and J2, which connect the backlight driver board to the backplane
board.
3. Remove the backlight driver board.
Figure 12: Backlight driver board removal

Front Panel Board/LCD Remove the front panel board and LCD assembly as a unit. To do so, perform the
Assembly following procedure. (See Figure 13.)
1. Disassemble the instrument down to and including the main board and
backplane board.
2. Remove the two Phillips screws that connect the main chassis to the front
bezel. They are located on the bottom corners of the front panel bezel.
3. Remove the two T-10 screws that connect the cable retainer bracket (the
rectangular metal plate) to the front panel assembly.
4. Place the instrument so that the bottom end of the bezel is facing up and the
open part of the main chassis is facing you.
5. Pull the main chassis toward you and down, clearing the metal stays located at
the top of the bezel (which should now be facing down). (See Figure 13.)
NOTE. As you separate the main chassis from the front panel, make sure that you
pull the J1 cable that is attached to the front panel board through the hole in
the main chassis.
Figure 13: Front panel assembly removal

Remove the front panel board.

6. Remove the two spacer posts and the one T-10 screw that hold the front panel
board to the front bezel.
7. Remove the front panel board.
Figure 14: Front panel board and backlight removal

Remove the backlights. There are two backlights. One is located at the top of the
LCD assembly and one is located at the bottom of the LCD assembly. Each can be
accessed from its respective corner of the assembly. (See Figure 14.) Perform the
following procedures to remove the backlights. (See Figure 15.) (See Figure 16.)
8. Remove the two screws attached to the right-hand bracket of the LCD display
assembly. The right-hand bracket is on the right when the assembly is facing
you. (See Figure 15.)
9. Remove the poron gasket from the bracket and remove the bracket.
10. While depressing the small white plastic backlight lock (located on the corner
of the assembly), remove the rubber tensioning spacer using a thin object.
(See Figure 16.)
CAUTION. Do not bend the flex circuitry. Carefully remove the flex circuit from
the metal guides and connector latch.
11. Lift up on the flex circuit connector latch and remove the flex circuit from the
connector. (See Figure 16.)
12. Carefully remove the flex circuit from the metal guides.
13. Pull the backlight straight out (to the right) from the assembly.
14. To remove the other backlight, repeat the previous four steps.

Figure 15: Removing the LCD assembly bracket

Figure 16: Backlight removal

Replaceable Parts
Replaceable Parts
This section contains a list of the replaceable modules for the WFM4000 and
WFM5000 Waveform Monitors. Use the following lists to identify and order
replacement parts. Note that not all parts listed in this section are present on every
model. The parts present will depend on the model.
Parts Ordering Information

Replacement parts are available through your local Tektronix field office or
representative.
Changes to Tektronix products are sometimes made to accommodate improved
components as they become available and to give you the benefit of the latest
improvements. Therefore, when ordering parts, it is important to include the
following information in your order:
Part number
Instrument type or model number
Instrument serial number
Instrument modification number, if applicable
If you order a part that has been replaced with a different or improved part, your
local Tektronix field office or representative will contact you concerning any
change in part number.
Module Servicing Modules can be serviced by selecting one of the following three options. Contact
your local Tektronix service center or representative for repair assistance.
Module Exchange. In some cases you may exchange your module for a
remanufactured module. These modules cost significantly less than new modules
and meet the same factory specifications. For more information about the module
exchange program, call 1-800-833-9200. Outside North America, contact a
Tektronix sales office or distributor; see the Tektronix Web site for a list of offices:
www.tektronix.com.
Module Repair and Return. You may ship your module to us for repair, after
which we will return it to you.
New Modules. You may purchase replacement modules in the same way as other
replacement parts.

Replaceable Parts
Using the Replaceable Parts Lists

This section contains lists of the mechanical and/or electrical components that are
replaceable for the WFM4000 and WFM5000 Waveform Monitors. Use this
list to identify and order replacement parts. The following table describes each
column in the parts list.
Table 9: Parts list column descriptions

Column Column name Description
1 Figure & index Items in this section are referenced by figure and index numbers to the WFM Overview photos.
number (See Figure 3 on page 25.)
2 Tektronix part Use this part number when ordering replacement parts from Tektronix.
number
3 and 4 Serial number Column three indicates the serial number at which the part was first effective. Column four
indicates the serial number at which the part was discontinued. No entry indicates the part is
good for all serial numbers.
5 Qty This indicates the quantity of parts used.
6 Name & description An item name is separated from the description by a colon (:). Because of space limitations,
an item name may sometimes appear as incomplete. Use the U.S. Federal Catalog handbook
H6-1 for further item name identification.
Abbreviations Abbreviations conform to American National Standard ANSI Y1.1-1972.
Table 10: Figure 3 replaceable parts list

Fig. &
index Tektronix part Serial no. Serial no.
number number effective discont’d Qty Name & description
Figure 3
-1 870-0091-00 1 CIRCUIT BD SUBASSY;MAIN; 389400800, ROHS COMPLIAN
-2 870-0092-00 1 CIRCUIT BD SUBASSY;BACKPLANE; 389400900, ROHS COMPLIAN;
SAFETY CONTROLLED
-3 863-0093-00 1 CIRCUIT BD SUBASSY; SDI I/O; 389401000, ROHS COMPLIAN
-4 863-0094-00 1 CIRCUIT BD SUBASSY; REF I/O; 389401100, ROHS COMPLIAN
-5 870-0209-00 1 CIRCUIT BD SUBASSY; 389410200; FP; WFM5000, WFM4000, ROHS
COMPLIA
-6 878-0186-00 1 CIRCUIT BOARD SUBASSY; LED BACKLIGHT DRIVER, UNTESTED,
389-4085-00
-7 407-5292-00 1 BRACKET, SUPPORT; REAR I/O
-8 119-7036-00 1 FAN ASSEMBLY; DC,12V;0.105A,8.6 CFM,30DBA,3 LEAD, TACH
OUTPUT, WITH CONN & HOUSING,SAFETY CONTROLLED
-9 174-5445-00 1 CABLE ASSEMBLY;POWER 2 PIN, CABLE, PWR XLR RPAN TO BP PCB
2PIN WFM 2.5, J5; SAFETY CONTROLLED
-10 441-2504-00 1 CHASSIS,MAIN; 0.050 AL,SAFETY CONTROLLED
-11 850-0060-00 1 FINAL ASSEMBLY; BEZEL ASSEMBLY;
-12 850-0061-00 1 FINAL ASSEMBLY; BEZEL AND FRONT PANEL CONTROLLER; TESTED

Replaceable Parts
Table 10: Figure 3 replaceable parts list (cont.)

Fig. &
-13 850-0059-00 1 FINAL ASSEMBLY; LCD DISPLAY MODULE; TESTED
-14 129-1636-00 2 SPACER POST: 4-40M/F,0.687L,SST,0.188HEX

Fig. &
Figure 4
-66 311-2607-00 1 ENCODER; DIGITAL CONTACTING ENCODER, 24 CPR, 24 DETENTS,
6 MM DIA SHAFT, 17.5 MM LENGTH SHAFT, 12 MM BODY SIZE, TOP
MOUNT; RE0123
-67 311-2580-00 2 ENCODER; DIGITAL CONTACTING ENCODER, 24 CPR,
NON-DETENTED, 6 MM DIA SHAFT, 17.5 MM LENGTH SHAFT, 12 MM
BODY SIZE, TOP MOUNT; RE0123
-68 366-0859-01 3 ASSEMBLY, KNOB; .470 DIAMETER, SOFT TOUCH

Fig. &
Figure 5
-15 200-5056-00 1 COVER;INTERNAL,EMI,0.050 THICK ALUMINUM, WFM; SAFETY
CONTROLLED
-16 211-0734-00 13 SCREW, MACHINE; 6-32 X 0.250, FLH100, 410 SS PASSIVATED, T-10
TORX DR
-17 211-0722-00 16 SCREW, MACHINE; 6-32 X 0.250, PNH, 410 SS PASSIVATED, T-15
TORX DR

Fig. &
Figure 6
-16 211-0734-00 13 SCREW, MACHINE; 6-32 X 0.250, FLH100, 410 SS PASSIVATED, T-10
TORX DR
-23 174-5441-00 1 CABLE ASSEMBLY;20 PIN, MAIN PCB TO SDI PCB WFM J6
-40 174-4586-00 3 CA ASSY; RIBBON,2.0 L,DOUBLE ENDED,IDC,FEMALE,2 X 20,0.050
CTR,PLZ

Replaceable Parts

Fig. &
Figure 7
TORX DR
-25 214-4747-00 2 HEAT SINK,SEMIC; IC,PGA 11X11/MQUAD/27MM BGA;1.1 IN X 1.1 IN X
0.45 IN H,PIN FIN,ALUMINUM,BLACK ANODIZE;658-45AB
-30 146-0109-00 1 BATTERY,DRY; 3.0V,LITHIUM MANGANESE DIOXIDE,210MAH,20 X
3.22MM COIN CELL WITH SOLDER TABS,CR2032-1HF1

Fig. &
Figure 8
-31 210-0586-00 2 NUT, PL, ASSY WA; 4-40 X 0.25, 18/8 NUT 410 SS WASHER PASSIVATED
-33 211-1266-00 2 SCREW, METRIC 4-1.4 X 12MM, FAN, FLATHEAD, STL, NICKEL PLATE,
PHILLIPS
-34 211-0380-00 2 SCREW, MACHINE; 4-40 X 0.375, FLH, 410 SS PASSIVATED, T8
-35 131-5450-00 1 CONN, DSUB; PCB,HIGH DENSITY; FEMALE, RTANG, 15 POS,0.078
CTR,0.350 MLG X 0.125 TAIL,4-40 THD INSERT, BD RETENTION,30
GOLD, SAFETY CONTROLLED
-36 214-3903-00 2 *VENDOR: LYNTRON...SCREW, JACK; 4-40 X 0.312 LONG, 0.188 H
HEX HEAD STAND OFF, 4-40 INT THD, X 0.312 THD EXT 4-40, STEEL,
SN PLATED
-37 131-7270-00 7 CONN,RF,PLUG; BNC,PCB,PNL MNT,FEMALE,RTANG,75 OHM, 0.510 H
X 0.169 TAIL,LOW PROFILE ZINC DIE CAST HOUSING
-38 210-1039-00 7 WASHER,LOCK; 0.521 ID,INT,0.025 THK,410 SS, PASSIVATED
-39 220-0497-00 7 NUT, PLAIN, HEX; .5-28 X .562 HEX, BRS, NI (NICKEL) PLATED

Fig. &
Figure 9
-3 863-0093-00 1 CIRCUIT BD SUBASSY; SDI I/O; 389401000;TESTED
-4 863-0094-00 1 CIRCUIT BD SUBASSY; REF I/O; 389401100;TESTED
-8 119-7036-00 1 FAN ASSEMBLY; DC,12V;0.105A,8.6 CFM,30DBA,3 LEAD, TACH
OUTPUT, WITH CONN & HOUSING,SAFETY CONTROLLED

Replaceable Parts
Table 16: Figure 9 replaceable parts list (cont.)

Fig. &
-23 174-5441-00 1 CABLE ASSEMBLY;20 PIN, MAIN PCB TO SDI PCB WFM J6
-40 174-4586-00 3 CA ASSY; RIBBON, 2.0 L,DOUBLE ENDED,IDC,FEMALE,2 X 20,0.050
CTR,PLZ

Fig. &
Figure 10
TORX DR
-40 174-4586-00 3 CA ASSY; RIBBON,2.0 L,DOUBLE ENDED,IDC,FEMALE,2 X 20,0.050
CTR,PLZ
-41 174-5485-00 1 CABLE ASSEMBLY DISPLAY INVERTER;15 PIN;LED BACKLIGHT TO
DISPLAY,WFM5000,WFM4000
-42 174-5493-00 1 CABLE ASSY,SP; DISCRETE,BACKLIGHT,IDC; WFM5000,WFM4000
-47 174-5492-00 1 CABLE ASSEMBLY, 10 PIN; FP TO MAIN
-62 174-5428-00 1 CA ASSY; SHIELDED RIBBON ADAPTER TO XGA LVDS LCD DISPLAY,
20 PIN, 4IN

Fig. &
Figure 11
-43 120-2048-00 1 TRANSFORMER,SIG;MODULE,LAN/ETHERNET;10/100 BASE-T SINGLE
PORT,W/RJ45 CONNECTOR, W/LEDS,SHIELDED,EMI FINGERS,TX
1CT:1CT,RX 1CT:1,1500V ISOL;J1011F21P,THRU-HOLE
-44 131-7881-00 1 CONN,IO; PCB,USB,SERIES A;FEMALE,RTANG ON EDGE,1 X 4, 2.5MM
CTR,13.90 H X 2.0 TAIL,30 GOLD,W/BOARD RETENTION
-45 131-7717-00 1 CONN,JACK PHONE; PCB/PNL;FEMALE,RTANG,3 POS,4 TERM
-46 120-5069-00 1 INDUCTOR,FXD; COUPLED INDUCTOR; PARALLEL RATING:300UH
25%,0.75A,0.675 OHM, SERIES RATING:1200UH 25%,0.37A,2.70
OHM,2 WINDINGS,TOROID CORE;SMT45A-303,SMD
-51 159-0450-00 1 FUSE, THERMAL; 4.0A HOLD, 8.0A TRIP, 30V MAX, SELF RESETTING,
UL REC; RUE400, RADIAL LEAD, SAFETY CONTROLLED
-53 159-0412-00 1 FUSE,THRM,CHIP; SELF RESETTING FUSE,0.5A HOLD,1.0A TRIP,60V
MAX,SMD050,T,SAFETY CONTROLLED

Replaceable Parts

Fig. & Serial
index Tektronix part no. Serial no.
Figure 12
-6 878-0186-00 1 CIRCUIT BOARD SUBASSY; LED BACKLIGHT DRIVER, UNTESTED,
389-4085-00
-42 174-5493-00 1 CABLE ASSY,SP; DISCRETE,BACKLIGHT,IDC; WFM5000,WFM4000
-56 150-0294-00 1 DIODE, OPTO; LED, RED, 635 NM, 220 MCD TYP @ 20 MA, 90 DEGREE
VIEWING ANGLE, CLEAR LENS; 0603, APHK1608SURCK
-57 211-1117-00 11 SCREW, MACHINE; 4-40 X 0.187, PAN HEAD, 410 SS PASSIVATED,
T-10, TORX DR

Fig. &
Figure 13
-47 174-5492-00 1 CABLE ASSEMBLY, 10 PIN; FP TO MAIN
T-10, TORX DR
20 PIN, 4IN
-66 407-5332-00 1 BRACKET, RETAINER,CABLE
-69 211-0119-00 2 SCREW,MACHINE; 4-40 X 0.25,FLH,100 DEG,STL BK OXD POZ
Table 21: Figure 14, Figure 15, and Figure 16 replaceable parts list
Fig. &
Figure
14,
Figure
15, and
Figure 16
-5 870-0209-00 1 CIRCUIT BD SUBASSY; 389410200; FP; WFM5000, WFM4000, ROHS
COMPLIA
-12 850-0061-00 1 FINAL ASSEMBLY; BEZEL AND FRONT PANEL CONTROLLER; TESTED
-13 850-0059-00 1 FINAL ASSEMBLY; LCD DISPLAY MODULE; TESTED
T-10, TORX DR

Replaceable Parts
Table 21: Figure 14, Figure 15, and Figure 16 replaceable parts list (cont.)
Fig. &
-61 150-0335-00 1 LAMP; BACKLIGHT ASSEMBLY, LED, REPLACEMENT FOR 119743900
6.5 LCD DISPLAY (SET OF TWO BACKLIGHTS)
20 PIN, 4IN
-64 131-6521-00 4 CONTACT,ELEC; EMI,CLIP-ON,0.38 L X 0.460 W (2 CONTACTS) X 0.45
HIGH,ELECTROLESS NICKEL PLATE
-65 260-2872-00 1 SWITCH,KEYPAD;ELASTOMERIC,SILICONE RUBBER;FRONT PANEL,
WFM5000
-67 407-5303-00 2 BRACKET, CRADLE, WFM
-68 211-0950-00 4 SCREW,MACHINE; M2X.4X3L,PHL, PNH, 410 SS, PASSIVATE
-70 337-4419-00 1 PORON FOAM SHIELD

Replaceable Parts
Accessories
Table 22: Accessories
Tektronix part Serial no. Serial no.
number effective discont’d Qty Name & description
Standard Accessories
071-2476-xx 1 MANUAL,TECH;QUICK START FLYER, WFM4000 & WFM5000
NOTE. This document is packaged with the Product

Documentation CD as part number 020-2918-xx.
077-2444-xx 1 MANUAL,TECH;RELEASE NOTES WFM4000 WFM5000
063-4116-xx 1 DOCUMENTATION;PRODUCT CD, WFM4000 & WFM5000
NOTE. This document is packaged with the Quick Start Reference

as part number 020-2918-xx.
The following documents are included as PDFs on the WFM4000 and WFM5000 Product Documentation CD:
077-2438-xx MANUAL,TECH; USER,ENGLISH, NOT PRINTED, PDF ONLY;WFM4000,WFM5000
077-2440-xx MANUAL, TECH; USER, JAPANESE, NOT PRINTED, PDF ONLY, WFM4000,
WFM5000
077-2441-xx MANUAL,TECH; USER,SIMPLIFIED CHINESE,NOT PRINTED, PDF
ONLY,WFM4000,WFM5000
077-2439-xx MANUAL,TECH;SPECIFICATION AND PERFORMANCE VERIFICATION, NOT
PRINTED, PDF ONLY, WFM4000/WFM5000
077-2443-xx MANUAL,TECH;SECURITY AND DECLASSIFICATION INSTRUCTIONS,NOT
PRINTED, PDF ONLY, WFM4000, WFM5000
077-2506-xx SYSTEM INTEGRATOR, NOT PRINTED, PDF ONLY,
WFM5000,WFM4000,WVR5000,WVR4000
See Description 1 CABLE ASSY, POWER:
Option Country P/N
A0 North America 161-0066-00
A1 Universal EURO 161-0066-09
A2 United Kingdom 161-0066-10
A3 Australia 161-0066-13
A5 Switzerland 161-0154-00
A6 Japan 161-0298-00
A10 China 161-0304-00
A11 India 161-0400-00
Optional Accessories
071-2185-xx MANUAL,TECH; DYHG-NC; TEKTRONIX SUPPLEMENTAL INFORMATION SHEET
FOR THE PEOPLES REPUBLIC OF CHINA; CHINA ROHS
077-2442-xx MANUAL,TECH;SERVICE MANUAL, WFM4000/WFM5000, PDF ONLY
071-2516-xx WFM4000/5000 & WVR4000/5000 POWER CORD FERRITE INSTRUCTIONS
WFM50F01 PORTABLE HARD CARRYING CASE FOR WFM5000 OR WFM4000
WFM50F02, RACK ADAPTER; DUAL SIDE BY SIDE FOR WFM4000 and WFM5000
WFM50F03
011-0163-00 TERM,COAXIAL; BNC,TERMINATION SINGLR ENDED;75 OHM,26DB TO 2GHZ,50
OHM INTERMATABLE

Replaceable Parts
Table 22: Accessories (cont.)

Tektronix part Serial no. Serial no.
number effective discont’d Qty Name & description
119-7393-00 AC/DC POWER SUPPLY; SAFETY CONTROLLED
146-0156-00 BATTERY; 14.4V,6.3AH;LI-ION PACK,5 1/4 X 3 1/2 X 1.8 INCHES,SAFETY
CONTROLLED
016-2005-00 BATTERY CHARGER; 2-SLOT EXTERNAL CHARGER;GOLD MOUNT; UNIVERSAL
AC INPUT; SAFETY CONTROLLED
WFM50FVM Sony / IDX Battery Adapter (V - Mount) Battery & Charger NOT included
WFM50FGM Anton Bauer Battery Adapter (Gold - Mount) Battery & Charger NOT included
WFM50FSC Soft carrying case for WFM5000 or WFM4000 (WFM50F01 is required)

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WFM4000 and WFM5000

For product information, sales, service, and technical support:

WFM4000 and WFM5000 Service Manual i

ii WFM4000 and WFM5000 Service Manual

WFM4000 and WFM5000 Service Manual iii

General Safety Summary

iv WFM4000 and WFM5000 Service Manual

Do not operate in wet/damp conditions.

Terms in This Manual These terms may appear in this manual:

WARNING. Warning statements identify conditions or practices that could result

CAUTION. Caution statements identify conditions or practices that could result in

WFM4000 and WFM5000 Service Manual v

Service Safety Summary

Do Not Service Alone. Do not perform internal service or adjustments of this

vi WFM4000 and WFM5000 Service Manual

WFM4000 and WFM5000 Service Manual vii

Table i: Related documentation

WFM4000 and WFM5000 Online Help In-depth operation and UI help

WFM4000 and WFM5000 Waveform Procedure for checking performance and

viii WFM4000 and WFM5000 Service Manual

Options and Accessories

WFM4000 and WFM5000 Service Manual 1

2 WFM4000 and WFM5000 Service Manual

WFM4000 and WFM5000 Service Manual 3

Figure 1: Block diagram

4 WFM4000 and WFM5000 Service Manual

SDI I/O Board

Reference I/O Board

WFM4000 and WFM5000 Service Manual 5

NOTE. The FPGAs decode VITC signals digitally.

6 WFM4000 and WFM5000 Service Manual

Power Supply and Distribution

WFM4000 and WFM5000 Service Manual 7

8 WFM4000 and WFM5000 Service Manual

CAUTION. Static discharge can damage any semiconductor component in the

WFM4000 and WFM5000 Service Manual 9

Inspection and Cleaning

10 WFM4000 and WFM5000 Service Manual

Table 1: External inspection check list

Table 2: Internal inspection check list

WFM4000 and WFM5000 Service Manual 11

Table 2: Internal inspection check list (cont.)

Cleaning Procedure – Interior. To clean the instrument interior, perform the

Lubrication. There is no periodic lubrication required for the instrument.

12 WFM4000 and WFM5000 Service Manual

Table 3: Required test equipment

WFM4000 and WFM5000 Service Manual 13

Table 3: Required test equipment (cont.)

Table 4: Symptoms and causes

SDI Deserializer Comm

14 WFM4000 and WFM5000 Service Manual

Table 4: Symptoms and causes (cont.)

Detailed Troubleshooting Procedures

WFM4000 and WFM5000 Service Manual 15

Examining Power On Self Test Results

General Checks 1. Verify that the power cord is connected.

16 WFM4000 and WFM5000 Service Manual

Table 5: Backplane board secondary supplies

WFM4000 and WFM5000 Service Manual 17