Location via proxy:   [ UP ]  
[Report a bug]   [Manage cookies]                
Scribd Logo
Upload

Welcome to Scribd!

  • 84 views

    Overview of Electronic Packaging Evolution

    Uploaded by

    Allen Su
    This document summarizes the evolution of electronic packaging technology from the 1960s to the 2000s. It describes key milestones such as the development of TO packages in the 1960s, the rise of DIPs and early PGAs in the 1970s, the dominance of QFPs in the 1980s, the introduction of BGA and CSP concepts in the 1990s, and more advanced packaging technologies emerging in the 2000s like SiP and 3D WLP. The document traces how packaging has pursued smaller sizes and higher densities to meet the needs of semiconductors and electronic products over the decades.

    Copyright:

    © All Rights Reserved
    Download as PDF, TXT or read online from Scribd

    Overview of Electronic Packaging Evolution

    Uploaded by

    Allen Su
    84 views2 pages
    This document summarizes the evolution of electronic packaging technology from the 1960s to the 2000s. It describes key milestones such as the development of TO packages in the 1960s, the rise of DIPs and early PGAs in the 1970s, the dominance of QFPs in the 1980s, the introduction of BGA and CSP concepts in the 1990s, and more advanced packaging technologies emerging in the 2000s like SiP and 3D WLP. The document traces how packaging has pursued smaller sizes and higher densities to meet the needs of semiconductors and electronic products over the decades.

    Copyright

    © © All Rights Reserved

    Available Formats

    PDF, TXT or read online from Scribd

    Did you find this document useful?

    Is this content inappropriate?

    This document summarizes the evolution of electronic packaging technology from the 1960s to the 2000s. It describes key milestones such as the development of TO packages in the 1960s, the rise of DIPs and early PGAs in the 1970s, the dominance of QFPs in the 1980s, the introduction of BGA and CSP concepts in the 1990s, and more advanced packaging technologies emerging in the 2000s like SiP and 3D WLP. The document traces how packaging has pursued smaller sizes and higher densities to meet the needs of semiconductors and electronic products over the decades.

    Copyright:

    © All Rights Reserved
    Download as PDF, TXT or read online from Scribd
    Download as pdf or txt
    84 views2 pages

    Overview of Electronic Packaging Evolution

    Uploaded by

    Allen Su
    This document summarizes the evolution of electronic packaging technology from the 1960s to the 2000s. It describes key milestones such as the development of TO packages in the 1960s, the rise of DIPs and early PGAs in the 1970s, the dominance of QFPs in the 1980s, the introduction of BGA and CSP concepts in the 1990s, and more advanced packaging technologies emerging in the 2000s like SiP and 3D WLP. The document traces how packaging has pursued smaller sizes and higher densities to meet the needs of semiconductors and electronic products over the decades.

    Copyright:

    © All Rights Reserved
    Download as PDF, TXT or read online from Scribd
    Download as pdf or txt
    You are on page 1of 2

    Overview of Electronic Packaging Evolution

    108033113 Youtin Su
    Power Mechanical Engineering Dept.
    National Tsing Hua University

    Abstract: In this report, we introduce the 2. 1970s


    evolution of electronic packaging technology 2.1. Era of DIPs
    over time, including packaging from early In 1960s, TO with leads was used for IC,
    time to CSP packaging. but with the I/O pins increased, the round
    body of TO was no longer suitable. The
    Keywords: Packaging, TO, PTH, DIP, SIP, rectangular appearance of DIP, which can
    SMT, QFP, SOP, BGA, CSP. increase I/O pins with simple layout, and the
    density of the components made DIP a
    Introduction: With the rapid development mainstay of the industry in 1970s.
    of the semiconductor industry, IC chips
    become smaller and smaller, but require 2.2. first PGA
    more and more I/Os. This situation forces the Musashi Semiconductor Works is
    electronic packaging technology to upgrade Hitachi Corporation's oldest and largest
    and meet the requirements. Since the TOP semiconductor factory. The first PGA (pin
    (transistor outline package) was first used in grid array) was developed at Musashi Works
    1960s, packaging technology has been in 1974, which has 52-pin and higher
    continuously innovated. Realizing the mounting efficiency.
    history of package is necessary and important.
    2.3. first QFP
    1. 1960s As mentioned before, Musashi Works
    1.1. Era of TO not only developed the first PGA but also
    On December 16, 1947, William give birth to the first QFP (quad flat package)
    Shockley, John Bardeen, and Walter Brattain in 1977, which was called FPP (flat plastic
    succeeded in making the first transistor at package) when it was first developed. The
    Bell Labs. With the application of transistors, first QFP was 14mm in width, 20mm in
    TO packaging technology has begun to length, and 2mm in thickness.
    develop and be used in 1960s.
    3. 1980s
    1.2. first DIP 3.1. Era of QFPs
    The first DIP (dual in-line package) was With the demand for memory products
    invented by Don Forbes, Rex Rice, and and portable devices grew, DIP with dual
    Bryant Buck Rogers of Fairchild sides and the PTH (pin through hole)
    Semiconductor in 1964, which had 14 leads. mechanism couldn’t meet the needs. QFP
    had two major advantages. Due to the 5. 2000s
    quadruple sides of QFP, the package outline 5.1 Era of Advanced Packaging
    of QFP became smaller than that of DIP. It In 2000s, with the increase in the
    allowed QFP to contain more I/Os in same requirement of electronic product
    area. Also, with the mechanism of SMT performance and the integration of functions,
    (surface mount technology), which QFP packaging become more and more advanced,
    featured, it enabled us to package on both including SiP (system in package), FCBGA
    sides of PCB boards. QFP has better (flip chip ball grid array), WLCSP(wafer
    dimension efficiency than DIP and SOP level chip size package), 3D WLP (3
    (small out-line package), which made it a dimensional wafer level package), FO-WLP
    mainstream technology in 1980s. (Fan-Out wafer level package), FO-PoP
    (Fan-Out package on package), Embedded
    4. 1990s SiP, etc.
    4.1. Era of BGA
    The research of BGA (ball grid array) 6. Conclusion
    started in 1960s. However, it didn’t enter the Packaging technology has been
    market until early 1990s. BGA is a kind of pursuing small size and high efficiency, such
    area array technology. When the demand as changing from dual sides to quadruple
    came to hundreds of I/Os, the pitch between sides, or from planer to 3D. From the past to
    pin needs to be smaller, which increase the the present, many packaging methods have
    difficulty of production. Furthermore, the been invented, some are still in use, and some
    previous fine lead was easy to bend. With have been eliminated by time, so when we try
    BGA design, it eliminates the production to design a new packaging method, finding
    difficulty and warping defects but also an approach can stand the test of time is our
    improve the performance by low inductance best choice.
    pins.
    7. References
    4.2. CSP concept 1. https://polymerinnovationblog.com/pol
    Junichi Kasai of Fujitsu Limited, ymers-electronic-packaging-
    Kawasaki, Japan, and Gen Murakami of introduction-flip-chip-packaging/
    Hitachi Cable proposed the concept of CSP 2. https://anysilicon.com/semiconductor-
    (chip size package) in 1992. CSP has 2 packaging-history-trends/
    meaning, one for chip size package and the 3. https://ieeexplore.ieee.org/author/3795
    other is chip scale package. For chip scale 8612800
    package, the area of packaging is usually not 4. https://www.shmj.or.jp/english/packagi
    greater than 1.2 times the area of the die. ng/pac70s.html
    In late 1990s, CSP started mass production 5. https://www.youtube.com/watch?v=F
    due to its less area than BGA. Y5V600ceuU

    You might also like