03 2019 Joint KPS AKPA Symposium Woong Huh
03 2019 Joint KPS AKPA Symposium Woong Huh
03 2019 Joint KPS AKPA Symposium Woong Huh
Summary
The needs for a new way computing
An explosive increase in data
Neuro inspired computing : How to reduce computing step Front. Neurosci. 5, 108 (2011)
Series operation Parallel operation
(Von neumann) (Neuro computing)
Synaptic functions
Long-Term Potentiation (LTP)
Long-Term Depression (LTD)
Dynamic synapse: Short-Term
Plasticity (STP)
Learning rule: Spike Timing
Dependent Plasticity (STDP)
….
ACS Nano 11, 3110 (2017)
Artificial synapse
Applications
Pattern & Image recognition
Data mining
Non-linear data processing
...
Pre
Synapse Post Memristive switching induced by atomic drifting
neuron
neuron
Metal
Insulator
Metal
In order to induce a change in resistance, device must have MIM 2 terminal structures.
In this structure, it is difficult to control on / off of the device or to adjust the current level with the
dynamic range.
2D materials for electrostatically tunable electronics
Barristor has the variable schottky barrier through the junction of graphene and Silicon or TMDCs.
The dirac cone of the graphene moves by the gate voltage, the schottky barrier is changed at the
Gr/semiconductor junction and it becomes the tunable diode.
Our strategy : Gate tunable memristor
Device structure Adv. Mater. 30, 1801447 (2018)
Memory part
D D
Resistive
WOx memory
S
WSe2
Gr G
Barristor
G S
Selector part( to prevent sneak current)
Resistive memory : Nonvolatile bipolar switching Barristor : Gate tunable operation
10-7 1.5
on
10-8
ID(nA)
10-10
ID(A)
Interface oxide
10-14
-0.2 0.0 0.2 -80 -60 -40 -20 0 20 40
V (V) V (V)
Advantages of our device structures
Resistive memory Resistive
D
memory
S
Barristor
VS
Using 2D materials, it is possible to increase the tunability of the devices with the structural diversity.
Monolithic phase engineering
2D materials
Monolithic growth of WOx
(Direct oxidation of WSe2)
?
Semi-metal Semiconductor Materials for
(Graphene) (TMDC) Memristor ML-WSe2 ML-WSe2
Layer-by-layer oxidation
OM image with variable oxidation time PL enhancement
Monolayer Pristine
Bilayer After 20 min
After 30 min
After 40 min
Intensity (a.u)
10㎛ 10㎛ 10㎛ 10㎛
5um
5um
WOx/WSe2
(control 2)
Reactive metal
Reactive metal
Noble metal
The ultrathin oxide layers were formed by partial oxidation of Ag (Ti), inducing oxygen vacancies in the
vicinity of the interface, which attribute to interface-dominant memristive switching.
The variation of an interface barrier at Ag/AgOx (or TiOx)/WO3-x induced by oxygen vacancies under the
programming pulses could lead to the memristive switching.
Gate tunable switching behavior
Drain
Potentiation & depression curve
WOx
Source
WSe2
Gr
VG = 0 V
The analog-like change in PSC is observed as consecutive input spikes are stimulated.
The device can also implement LTP or LTD as sequentially applying excitatory or inhibitory spikes.
Number & Frequency dependent function
Number-dependent function
Synaptic device can be further programmed
to mimic either STP or LTP depending on the
Long Term Plasticity VPulse N = 30 number and frequency of input spike (N).
Frequency-dependent function
VPulse Short
Δt = 30 ms (short), the PSC gradually
increases and tends to saturate with an
increasing number of spikes, mimicking LTP.
VPulse
Long
In contrast, the PSC does not noticeably
change at Δt = 300 ms (long), mimicking STP.
Heterosynaptic plasticity
Two-neuronal synapses Three terminal synapses
Pre Post
Pre Post
Modulatory
terminal
Biological synapse does not consist solely of a two-neural system, the neuromodulator such as an
astrocyte was recently proposed to play a critical role in cellular programming to achieve a high level of
neural information processing.
With this modulatory terminal, human brain can process information energy-efficiently.
Energy consumption related to the number of spikes
Number-dependent function
If It is possible to induce
transition with fewer spikes,
we can use energy efficiently.
Enhanced modulation with gate terminal
Two-neuronal synaptic system Modulated synaptic system
Modulator
vs
The potentiation and depession processes, are accelerated by applying a larger negative VG.
This result implies the conversion from STP to LTP can be occured with fewer spikes.
The ability to accelerate the modulation of the synaptic weight can offer potential advantages
to improve the recognizing accuracy and reduce the learning time of the pattern recognition.
Summary
Device characteristics
Devices are operated as artificial synapse with enhanced tunability.
Memristive switching behavior is tuned by varying the gate voltage due to modulation of the
Schottky barrier.
SET/RESET voltages(~1V) are lower than those of conventional s due to atomically thin structures.
Pre & post neuron are connected to synapse, and the signals can be enhanced by the gate terminal.
D D
Resistive
WOx Memory
S
WSe2
Gr G
Barristor
G S
Thank you for your attention.
Fabrication process
Fabrication process
2 Marker patterning 4 e-
beam lithography
& metal deposition(Ag)
1 Exfoliated Gr 5 e-
beam lithography
3 StackingWSe2/WOx flake
on the exfoliated Gr & metal deposition(Cr/Pd/Au)
Fabrication process
Thickness control
5.0nm
2.0nm
1.3nm 10nm
8
Before oxidation
7 After 10min
6 After 90min
Height(nm)
4
3
2
1
0
-1
-2
0 2 4 6 8
Nano Lett. 15(3), 2067(‘15)
Distance(um)
Fabrication process
Monolithic oxidation process
Monolayer
30000 Pristine
20min 100℃
30min 100℃
Intensity (a.u)
WOx 20000
10000
0
ML-WSe2 ML-WSe2 1.4 1.6 1.8 2.0
Energy (eV)
Monolayer Bilayer
Bilayer
Pristine
9000 20min 100℃
30min 100℃
40min 100℃
Intensity (a.u)
10㎛ 10㎛ 10㎛ 10㎛
6000
Pristine 20 min 35 min 40 min
3000
Energy (eV)
- Disappeared PL & Raman intensity
* Collaboration with Jae Yoon Lee @ Korea University
Mechanism of switching
Cross-sectional TEM images & EDS line profiling
Reactive metal - Based on the existence of interfacial oxide layer
between Ag (or Ti) and WO3–x and the bipolar
switching with the negative SET voltage, the
switching behavior may be attributed to the
migration of oxygen vacancies and electrochemical
redox reactions at the interface.
Reactive metal
Ti
Noble metal
Basic performance with a low power feature
Low power consumption
Current-Voltage Power-Voltage
101 101
100 100
10-1 10-1
10-2 10-2
10-3 Pt/WOx/Al 10-3 Pt/WOx/Al
Power(W)
Al/WOx/FTO
10-4 10-4
Al/WOx/FTO
Cu/WOx/TiN Cu/WOx/TiN
Iset(A)
Ti/WOx:N/Pt Ti/WOx:N/Pt
10-5 IrOx/Al2O3/WOx/W
Al/Gr/WOx/Al
10-5 IrOx/Al2O3/WOx/W
Al/Gr/WOx/Al
10-6 TiN/WOx/W
10-6 TiN/WOx/W
Synaptic barristor WOx/Au coreshell WOx/Au coreshell
10-7 (Vg=60/0/-85V)
Cu/WOx*H2O/ITO-PET
ITO/WO3/ITO 10-7 Synaptic barristor
Cu/WOx*H2O/ITO-PET
ITO/WO3/ITO
Pt/WOx/W
10-8 10-8
Pt/WOx/W
Al/WOx/Pt
Cu/WOx/Pt
(Vg=60/0/-85V) Al/WOx/Pt
Cu/WOx/Pt
10-9 W/WOx/TiN
Vg=60V
10-9 W/WOx/TiN
Vg=60V
10-10 Vg=0V
Vg=-85V 10-10 Vg=0V
Vg=-85V
10-11 10-11
0 1 2 3 4 5 0 1 2 3 4 5
Vset(V) Vset(V)
- The selection criterion was limited to WOx , and the set voltage and the current in LRS state were recorded.
- The data in black shade is the result of examining the set V and current of the previously announced WO x based memory.
- Since we can control the amount of current flowing as we change the gate voltages,
we use the power consumption according to various gate V for comparison.
Number & Frequency dependent function
Number-dependent function
Synaptic device can be further programmed
to mimic either STP or LTP depending on the
Long Term Plasticity N = 30 number and frequency of input spike (N).
Frequency-dependent function
Short
Δt = 30 ms (short), the PSC gradually
increases and tends to saturate with an
increasing number of spikes, mimicking LTP.
Long
In contrast, the PSC does not noticeably
change at Δt = 300 ms (long), mimicking STP.
Time dependent potentiation
1.5x10-6
Paired pulse facilitation (PPF)
1.0x10-6
Id(A)
5.0x10-7
0.0
-Since we tested at various voltages from -0.2V to -0.3V, we labeled Y axis as Siemens for comparison.
- These works have a similar structure to the basic three-terminal MOSFET (synaptic transistor),
and still have problems such as circuit complexity.
LRS
D
TE (Ag)
Interfacial oxide
WOx WOx
S
RESET
WSe2 BE (WSe2, Gr) HRS
Gr
SET
G
LRS
The device exhibits a transition from HRS to LRS in
RESET negative VD polarity corresponding to the ‘SET’ process,
SET and vice versa in positive VD polarity corresponding to
the ‘RESET’ process, indicating bipolar resistive switching.
HRS The migration of oxygen vacancies and electrochemical
redox reactions at the Ag/WOx interface may be
responsible for this switching behavior
The needs for a new way computing
An explosive increase in data
Brain inspired computing for
E-efficient processing
Neuro computing : how to reduce computing step Front. Neurosci. 5, 108 (2011)
Series operation Parallel operation
(Von neumann) (Neuro computing)
- Artificial synapses mimic step-wise change of states, which is similar to function of the biological synapses.
The needs for a new way computing
An explosive increase in data
Solution 1
Decreasing energy consumption
per computation step
Solution 2
Decreasing volatility of the data storage
Solution 3
Reducing computation step
Neuro computing : how to reduce computing step Front. Neurosci. 5, 108 (2011)
Series operation Parallel operation
(Von neumann) (Neuro computing)
D D
Resistive WSe2/WOx
10μm
2 WOx memory
S
WSe2
3 Gr 1 G
Barristor
Structures : Complexity G S
2D materials : Tunbale & Low power
Selector part( to prevent sneak current)
ReRAM : Nonvolatile-7bipolar switching Barristor : Improved circuit complexity
10 1.5
on
10-8
ID(nA)
10-10
ID(A)
Interface oxide
10-14
-0.2 0.0 0.2 -80 -60 -40 -20 0 20 40
V (V) V (V)
Heterosynaptic plasticity
Two-neural synapses (previously reported works)
Chemical synapse
Electrical synapse
Modulatory
terminal
Astrocyte
Nature Review. 27, 7720 (2015)
Adv. Mater. 27, 7720 (2015)
Memory
Bus
WOx WOx
WSe2 WSe2
Graphene Graphene
+
Ag Ag
10-4 10-4 Au
WOx
10-4
WOx WOx
WSe2 Au WSe2
10-6 10-6
Au -6 Au
10
Id(A)
10-8
Id(A)
Id(A)
10-8
10-8
-10
10-10 10
10-10
10-12 10-12
Ag metal
+
Ag Ag
10-4 10-4 Au
WOx
10-4
WOx WOx
WSe2 Au WSe2
10-6 10-6
Au -6 Au
10
Id(A)
10-8
Id(A)
Id(A)
10-8
10-8
-10
10-10 10
10-10
10-12 10-12
Device structure
Memory part Gr
D D
WSe2/WOx
10μm
Memristor
WOx
S
WSe2 G
Gr Barristor
S
G
Selector part( to prevent sneak current)
Fabrication process
Fabrication process
4 e-
beam lithography
Marker patterning
& metal deposition(Ag)
1 Gr 5 e-
beam lithography
exfoliation 3 StackingWSe2/WOx flake
on the exfoliated Gr & metal deposition(Cr/Pd/Au)
Fabrication process
* Collaboration with Hu Young Jeong @ UNIST
HRTEM image
Ag - It present the possibility that the oxide
Interface oxide inside WOx can be moved by Ag electrode
Amorphous-WOx ~10nm
Ag Ag
WOx O
W
WSe2 Se
- STEM image - Ag -O -W - Se
mapping mapping mapping mapping