W25Q64JV Adatlap

W25Q64JV
3V 64M-BIT
SERIAL FLASH MEMORY WITH
DUAL, QUAD SPI
For Industrial & Industrial Plus Grade
Publication Release Date: March 10, 2021

Revision K
W25Q64JV
Table of Contents
1. GENERAL DESCRIPTIONS .................................................................................................................. 4

2. FEATURES ............................................................................................................................................ 4
3. PACKAGE TYPES AND PIN CONFIGURATIONS ............................................................................... 5
3.1 Pin Configuration SOIC 208-mil ................................................................................................ 5
3.2 Pad Configuration WSON 6x5-mm/ 8x6-mm, XSON 4x4-mm .................................................. 5
3.3 Pin Description SOIC 208-mil, WSON 6x5-mm/ 8x6-mm, XSON 4x4-mm ............................... 5
3.4 Pin Configuration SOIC 300-mil ................................................................................................ 6
3.5 Pin Description SOIC 300-mil .................................................................................................... 6
3.6 Ball Configuration TFBGA 8x6-mm (5x5 or 6x4 Ball Array) ...................................................... 7
3.7 Ball Description TFBGA 5x5 or 8x6-mm ................................................................................... 7
3.8 Ball Configuration WLCSP ........................................................................................................ 8
3.9 Ball Description WLCSP12 ........................................................................................................ 8
4. PIN DESCRIPTIONS ............................................................................................................................. 9
4.1 Chip Select (/CS) ....................................................................................................................... 9
4.2 Serial Data Input, Output and IOs (DI, DO and IO0, IO1, IO2, IO3) ......................................... 9
4.3 Write Protect (/WP).................................................................................................................... 9
4.4 HOLD (/HOLD) .......................................................................................................................... 9
4.5 Serial Clock (CLK) ..................................................................................................................... 9
4.6 Reset (/RESET)(1) ...................................................................................................................... 9
5. BLOCK DIAGRAM ...............................................................................................................................10
6. FUNCTIONAL DESCRIPTIONS ..........................................................................................................11
6.1 Standard SPI Instructions ........................................................................................................11
6.2 Dual SPI Instructions ...............................................................................................................11
6.3 Quad SPI Instructions..............................................................................................................11
6.4 Software Reset & Hardware /RESET pin ................................................................................11
6.5 Write Protection .......................................................................................................................12
Write Protect Features ............................................................................................................... 12
7. STATUS AND CONFIGURATION REGISTERS .................................................................................13
7.1 Status Registers ......................................................................................................................13
Erase/Write In Progress (BUSY) – Status Only ...................................................................... 13
Write Enable Latch (WEL) – Status Only ................................................................................ 13
Block Protect Bits (BP2, BP1, BP0) – Volatile/Non-Volatile Writable ...................................... 13
Top/Bottom Block Protect (TB) – Volatile/Non-Volatile Writable ............................................. 14
Sector/Block Protect Bit (SEC) – Volatile/Non-Volatile Writable ............................................. 14
Complement Protect (CMP) – Volatile/Non-Volatile Writable ................................................. 14
Status Register Protect (SRP, SRL) – Volatile/Non-Volatile Writable ..................................... 15
Erase/Program Suspend Status (SUS) – Status Only ............................................................ 16
Security Register Lock Bits (LB3, LB2, LB1) – Non-Volatile OTP Writable............................. 16
Quad Enable (QE) – Volatile/Non-Volatile Writable ................................................................ 16
Write Protect Selection (WPS) – Volatile/Non-Volatile Writable ............................................. 17
Output Driver Strength (DRV1, DRV0) – Volatile/Non-Volatile Writable ................................. 17

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W25Q64JV
Reserved Bits – Non Functional ............................................................................................. 17

Status Register Memory Protection (WPS = 0, CMP = 0) .......................................................... 18
Status Register Memory Protection (WPS = 0, CMP = 1) .......................................................... 19
Individual Block Memory Protection (WPS=1) ......................................................................... 20
8. INSTRUCTIONS ..................................................................................................................................21
8.1 Device ID and Instruction Set Tables ......................................................................................21
Manufacturer and Device Identification ...................................................................................... 21
Instruction Set Table 1 (Standard SPI Instructions)(1) ................................................................ 22
Instruction Set Table 2 (Dual/Quad SPI Instructions)(1).............................................................. 23
8.2 Instruction Descriptions ...........................................................................................................24
Write Enable (06h) ..................................................................................................................... 24
Write Enable for Volatile Status Register (50h).......................................................................... 24
Write Disable (04h) .................................................................................................................... 25
Read Status Register-1 (05h), Status Register-2 (35h) & Status Register-3 (15h) .................... 25
Write Status Register-1 (01h), Status Register-2 (31h) & Status Register-3 (11h) .................... 26
Read Data (03h) ........................................................................................................................ 28
Fast Read (0Bh) ........................................................................................................................ 29
Fast Read Dual Output (3Bh) .................................................................................................... 30
Fast Read Quad Output (6Bh) ................................................................................................... 31
Fast Read Dual I/O (BBh) ........................................................................................................ 32
Fast Read Quad I/O (EBh)....................................................................................................... 33
Set Burst with Wrap (77h) ........................................................................................................ 34
Page Program (02h) ................................................................................................................ 35
Quad Input Page Program (32h).............................................................................................. 36
8.3 Sector Erase (20h) ..................................................................................................................37
32KB Block Erase (52h)............................................................................................................. 38
64KB Block Erase (D8h) ............................................................................................................ 39
Chip Erase (C7h / 60h) .............................................................................................................. 40
Erase / Program Suspend (75h) ................................................................................................ 41
Erase / Program Resume (7Ah) ................................................................................................. 42
Power-down (B9h) ..................................................................................................................... 43
Release Power-down / Device ID (ABh) .................................................................................... 44
Read Manufacturer / Device ID (90h) ........................................................................................ 45
Read Manufacturer / Device ID Dual I/O (92h) .......................................................................... 46
Read Manufacturer / Device ID Quad I/O (94h) ....................................................................... 47
Read Unique ID Number (4Bh) ................................................................................................ 48
Read JEDEC ID (9Fh) ............................................................................................................. 49
Read SFDP Register (5Ah)...................................................................................................... 50
Erase Security Registers (44h) ................................................................................................ 51
Program Security Registers (42h) ............................................................................................ 52
Read Security Registers (48h) ................................................................................................. 53
Individual Block/Sector Lock (36h) ........................................................................................... 54
Individual Block/Sector Unlock (39h) ....................................................................................... 55
Read Block/Sector Lock (3Dh)................................................................................................. 56
Global Block/Sector Lock (7Eh) ............................................................................................... 57

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W25Q64JV
Global Block/Sector Unlock (98h) ............................................................................................ 57

Enable Reset (66h) and Reset Device (99h) ........................................................................... 58
9. ELECTRICAL CHARACTERISTICS....................................................................................................59
9.1 Absolute Maximum Ratings (1) ...............................................................................................59
9.2 Operating Ranges ...................................................................................................................59
9.3 Power-Up Power-Down Timing and Requirements ................................................................60
9.4 DC Electrical Characteristics- ..................................................................................................61
9.5 AC Measurement Conditions ..................................................................................................62
9.6 AC Electrical Characteristics(6) ................................................................................................63
9.7 Serial Output Timing ................................................................................................................65
9.8 Serial Input Timing...................................................................................................................65
9.9 /WP Timing ..............................................................................................................................65
10. PACKAGE SPECIFICATIONS ............................................................................................................66
10.1 8-Pin SOIC 208-mil (Package Code SS) .................................................................................66
10.2 8-Pad WSON 6x5-mm (Package Code ZP) ............................................................................67
10.3 8-Pad WSON 8x6mm (Package Code ZE) .............................................................................68
10.4 8-Pad XSON 4x4x0.45-mm (Package Code XG) ...................................................................69
10.5 16-Pin SOIC 300-mil (Package Code SF) ...............................................................................70
10.7 24-Ball TFBGA 8x6-mm (Package Code TB, 5x5 Ball Array) .................................................71
10.8 24-Ball TFBGA 8x6-mm (Package Code TC, 6x4 ball array)..................................................72
10.9 12-Ball WLCSP (Package Code BY) .......................................................................................73
11. ORDERING INFORMATION ...............................................................................................................74
11.1 Valid Part Numbers and Top Side Marking .............................................................................75
12. REVISION HISTORY ...........................................................................................................................77

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W25Q64JV
1. GENERAL DESCRIPTIONS
The W25Q64JV (64M-bit) Serial Flash memory provides a storage solution for systems with limited space,
pins and power. The 25Q series offers flexibility and performance well beyond ordinary Serial Flash devices.
They are ideal for code shadowing to RAM, executing code directly from Dual/Quad SPI (XIP) and storing
voice, text and data. The device operates on 2.7V to 3.6V power supply with current consumption as low as
1µA for power-down. All devices are offered in space-saving packages.
The W25Q64JV array is organized into 32,768 programmable pages of 256-bytes each. Up to 256 bytes can
be programmed at a time. Pages can be erased in groups of 16 (4KB sector erase), groups of 128 (32KB
block erase), groups of 256 (64KB block erase) or the entire chip (chip erase). The W25Q64JV has 2,048
erasable sectors and 128 erasable blocks respectively. The small 4KB sectors allow for greater flexibility in
applications that require data and parameter storage. (See Figure 2.)
The W25Q64JV supports the standard Serial Peripheral Interface (SPI), Dual/Quad I/O SPI: Serial Clock, Chip
Select, Serial Data I/O0 (DI), I/O1 (DO), I/O2 and I/O3. SPI clock frequencies of W25Q64JV of up to 133MHz
are supported allowing equivalent clock rates of 266MHz (133MHz x 2) for Dual I/O and 532MHz (133MHz x
4) for Quad I/O when using the Fast Read Dual/Quad I/O. These transfer rates can outperform standard
Asynchronous 8 and 16-bit Parallel Flash memories.
Additionally, the device supports JEDEC standard manufacturer and device ID, and a 64-bit Unique Serial
Number and three 256-bytes Security Registers.
2. FEATURES
 New Family of SpiFlash Memories  Advanced Security Features
– W25Q64JV: 64M-bit / 8M-byte – Software and Hardware Write-Protect
– Standard SPI: CLK, /CS, DI, DO – Special OTP protection
– Dual SPI: CLK, /CS, IO0, IO1 – Top/Bottom, Complement array protection
– Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3 – Individual Block/Sector array protection
– Software & Hardware Reset(1) – 64-Bit Unique ID for each device
– Discoverable Parameters (SFDP) Register
 Highest Performance Serial Flash – 3X256-Bytes Security Registers
– 133MHz Single, Dual/Quad SPI clocks – Volatile & Non-volatile Status Register Bits
– 266/532MHz equivalent Dual/Quad SPI
 Space Efficient Packaging
– Min. 100K Program-Erase cycles per sector
– 8-pin SOIC 208-mil
– More than 20-year data retention
– 8-pad WSON 6x5-mm/8x6-mm
 Low Power, Wide Temperature Range – 16-pin SOIC 300-mil
– Single 2.7 to 3.6V supply – 8-pad XSON 4x4-mm
– <1µA Power-down (typ.) – 24-ball TFBGA 8x6-mm (6x4 ball array)
– -40°C to +85°C operating range – 24-ball TFBGA 8x6-mm (6x4/5x5 ball array)
– -40°C to +105°C operating range – 12-ball WLCSP
 Flexible Architecture with 4KB sectors – Contact Winbond for KGD and other options
– Uniform Sector/Block Erase (4K/32K/64K-Byte)
– Program 1 to 256 byte per programmable page
– Erase/Program Suspend & Resume
Note: 1. Hardware /RESET pin is only available on TFBGA or SOIC16 packages

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W25Q64JV
3. PACKAGE TYPES AND PIN CONFIGURATIONS

3.1 Pin Configuration SOIC 208-mil
Top View
/CS 1 8 VCC
/HOLD or /RESET
DO (IO1) 2 7
(IO3)
/WP (IO2) 3 6 CLK
GND 4 5 DI (IO0)
Figure 1a. W25Q64JV Pin Assignments, 8-pin SOIC 208-mil (Package Code SS)
3.2 Pad Configuration WSON 6x5-mm/ 8x6-mm, XSON 4x4-mm

Top View
/CS 1 8 VCC
/HOLD or /RESET
DO (IO1) 2 7
(IO3)
/WP (IO2) 3 6 CLK
GND 4 5 DI (IO0)
Figure 1b. W25Q64JV Pad Assignments, 8-pad WSON 6x5-mm/8x6 (Package Code ZP, ZE)
3.3 Pin Description SOIC 208-mil, WSON 6x5-mm/ 8x6-mm, XSON 4x4-mm
PAD NO. PAD NAME I/O FUNCTION
1 /CS I Chip Select Input
2 DO (IO1) I/O Data Output (Data Input Output 1)(1)
3 /WP (IO2) I/O Write Protect Input ( Data Input Output 2)(2)
4 GND Ground
5 DI (IO0) I/O Data Input (Data Input Output 0)(1)
6 CLK I Serial Clock Input
/HOLD or /RESET
7 I/O Hold or Reset Input (Data Input Output 3)(2)
(IO3)
8 VCC Power Supply
Notes:
1. IO0 and IO1 are used for Standard and Dual SPI instructions
2. IO0 – IO3 are used for Quad SPI instructions, /HOLD (or /RESET) function is only available for Standard/Dual SPI.

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W25Q64JV
3.4 Pin Configuration SOIC 300-mil

Top View
IO3 1 16 CLK
VCC 2 15 DI (IO0)
/RESET 3 14 NC
NC 4 13 NC
NC 5 12 NC
NC 6 11 NC
/CS 7 10 GND
DO (IO1) 8 9 IO2
Figure 1c. W25Q64JV Pin Assignments, 16-pin SOIC 300-mil (Package Code SF)
3.5 Pin Description SOIC 300-mil

PIN NO. PIN NAME I/O FUNCTION
/HOLD or
1 I/O Hold or Reset Input (Data Input Output 3)(2)
/RESET (IO3)
2 VCC Power Supply
3 /RESET I Reset Input(3)
4 N/C No Connect
5 N/C No Connect
6 N/C No Connect
7 /CS I Chip Select Input
8 DO (IO1) I/O Data Output (Data Input Output 1)(1)
9 /WP (IO2) I/O Write Protect Input (Data Input Output 2)(2)
10 GND Ground
11 N/C No Connect
12 N/C No Connect
13 N/C No Connect
14 N/C No Connect
15 DI (IO0) I/O Data Input (Data Input Output 0)(1)
16 CLK I Serial Clock Input
Notes:
1. IO0 and IO1 are used for Standard and Dual SPI instructions.
3. The /RESET pin is a dedicated hardware reset pin regardless of device settings or operation states. If the hardware reset function
is not used, this pin can be left floating or connected to VCC in the system.

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W25Q64JV
3.6 Ball Configuration TFBGA 8x6-mm (5x5 or 6x4 Ball Array)
Top View Top View
A1 A2 A3 A4
A2 A3 A4 A5 NC NC NC /RESET
NC NC /RESET NC
B1 B2 B3 B4
B1 B2 B3 B4 B5 NC CLK GND VCC
NC CLK GND VCC NC
C1 C2 C3 C4
C1 C2 C3 C4 C5 NC /CS NC /WP (IO2)
NC /CS NC /WP (IO2) NC
D1 D2 D3 D4
D1 D2 D3 D4 D5 NC DO(IO1) DI(IO0) /HOLD(IO3)
NC DO(IO1) DI(IO0) /HOLD(IO3) NC
E1 E2 E3 E4
E1 E2 E3 E4 E5 NC NC NC NC
NC NC NC NC NC
F1 F2 F3 F4
NC NC NC NC
Package Code B Package Code C

Figure 1d. W25Q64JV Ball Assignments, 24-ball TFBGA 8x6-mm (Package Code TB/TC)
3.7 Ball Description TFBGA 5x5 or 8x6-mm

BALL NO. PIN NAME I/O FUNCTION
A4 /RESET I Reset Input(3)
B2 CLK I Serial Clock Input
B3 GND Ground
B4 VCC Power Supply
C2 /CS I Chip Select Input
C4 /WP (IO2) I/O Write Protect Input (Data Input Output 2)(2)
D2 DO (IO1) I/O Data Output (Data Input Output 1)(1)
D3 DI (IO0) I/O Data Input (Data Input Output 0)(1)
D4 /HOLD (IO3) I/O Hold or Reset Input (Data Input Output 3)(2)
Multiple NC No Connect
Notes:
3. The /RESET pin is a dedicated hardware reset pin regardless of device settings or operation states.
If the hardware reset function is not used, this pin can be left floating or connected to VCC in the system

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W25Q64JV
3.8 Ball Configuration WLCSP
Figure 1e. W25Q64JV Ball Assignments, 12-ball WLCSP (Package Code BY)
3.9 Ball Description WLCSP12

BALL NO. PIN NAME I/O FUNCTION
B2 VCC Power Supply
B3 /CS I Chip Select Input
/HOLD or /RESET
C2 I/O Hold Input or /RESET (Data Input Output 3)(2)
(IO3)
C3 DO (IO1) I/O Data Output (Data Input Output 1)(1)
D2 CLK I Serial Clock Input
D3 /WP (IO2) I/O Write Protect Input (Data Input Output 2)(2)
E2 DI (IO0) I/O Data Input (Data Input Output 0)(1)
E3 GND Ground
Notes:

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W25Q64JV
4. PIN DESCRIPTIONS
4.1 Chip Select (/CS)

The SPI Chip Select (/CS) pin enables and disables device operation. When /CS is high the device is
deselected and the Serial Data Output (DO, or IO0, IO1, IO2, IO3) pins are at high impedance. When
deselected, the devices power consumption will be at standby levels unless an internal erase, program or
write status register cycle is in progress. When /CS is brought low the device will be selected, power
consumption will increase to active levels and instructions can be written to and data read from the device.
After power-up, /CS must transition from high to low before a new instruction will be accepted. The /CS input
must track the VCC supply level at power-up and power-down (see “Write Protection” and Figure 58). If
needed a pull-up resister on the /CS pin can be used to accomplish this.
4.2 Serial Data Input, Output and IOs (DI, DO and IO0, IO1, IO2, IO3)
The W25Q64JV supports standard SPI, Dual SPI and Quad SPI operation. Standard SPI instructions use
the unidirectional DI (input) pin to serially write instructions, addresses or data to the device on the rising
edge of the Serial Clock (CLK) input pin. Standard SPI also uses the unidirectional DO (output) to read data
or status from the device on the falling edge of CLK.
Dual and Quad SPI instructions use the bidirectional IO pins to serially write instructions, addresses or data
to the device on the rising edge of CLK and read data or status from the device on the falling edge of CLK.
Quad SPI instructions require the non-volatile Quad Enable bit (QE) in Status Register-2 to be set. When
QE=1, the /WP pin becomes IO2 and the /HOLD pin becomes IO3.
4.3 Write Protect (/WP)
The Write Protect (/WP) pin can be used to prevent the Status Register from being written. Used in
conjunction with the Status Register’s Block Protect (CMP, SEC, TB, BP2, BP1 and BP0) bits and Status
Register Protect (SRP) bits, a portion as small as a 4KB sector or the entire memory array can be hardware
protected. The /WP pin is active low.
4.4 HOLD (/HOLD)
The /HOLD pin allows the device to be paused while it is actively selected. When /HOLD is brought low,
while /CS is low, the DO pin will be at high impedance and signals on the DI and CLK pins will be ignored
(don’t care). When /HOLD is brought high, device operation can resume. The /HOLD function can be useful
when multiple devices are sharing the same SPI signals. The /HOLD pin is active low. When the QE bit of
Status Register-2 is set for Quad I/O, the /HOLD pin function is not available since this pin is used for IO3.
See Figure 1a-c for the pin configuration of Quad I/O operation.
4.5 Serial Clock (CLK)

The SPI Serial Clock Input (CLK) pin provides the timing for serial input and output operations. ("See SPI
Operations")
4.6 Reset (/RESET)(1)
A dedicated hardware /RESET pin is available on SOIC-16 and TFBGA packages. When it’s driven low for
a minimum period of ~1µS, this device will terminate any external or internal operations and return to its
power-on state.
Note:
1. Hardware /RESET pin is available on SOIC-16 or TFBGA; please contact Winbond for this package.

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W25Q64JV
5. BLOCK DIAGRAM
SFDP Register Security Register 1 - 3
000000h 0000FFh 003000h 0030FFh

002000h 0020FFh
001000h 0010FFh
Block Segmentation
7FFF00h 7FFFFFh
xxFF00h xxFFFFh
• Sector 15 (4KB) • • Block 127 (64KB) •
xxF000h xxF0FFh 7F0000h 7F00FFh
xxEF00h xxEFFFh
• Sector 14 (4KB) •
xxE000h xxE0FFh
xxDF00h xxDFFFh
xxD000h xxD0FFh
•
•
• •
•
Write Protect Logic and Row Decode

•
xx2F00h xx2FFFh
xx2000h xx20FFh
W25Q64JV
40FF00h 40FFFFh
xx1F00h xx1FFFh
W25Q64FV
• Sector 1 (4KB) • • Block 64 (64KB) •
xx1000h xx10FFh 400000h 4000FFh
xx0F00h xx0FFFh 3FFF00h 3FFFFFh
• Block 63 (64KB) •
xx0000h xx00FFh
3F0000h 3F00FFh
•
•
Write Control
/WP (IO2) •
Logic
20FF00h 20FFFFh
• Block 32 (64KB) •
200000h 2000FFh
Status 1FFF00h 1FFFFFh
Register • Block 31 (64KB) •
1F0000h 1F00FFh
•
•
High Voltage
•
Generators
00FF00h 00FFFFh
/HOLD (IO3) • Block 0 (64KB) •
000000h 0000FFh
Page Address
CLK
Latch / Counter Beginning Ending
SPI Page Address Page Address
/CS Command &
Control Logic
Column Decode
And 256-Byte Page Buffer
Data
DI (IO0)
DO (IO1) Byte Address

Latch / Counter
Figure 2. W25Q64JV Serial Flash Memory Block Diagram

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W25Q64JV
6. FUNCTIONAL DESCRIPTIONS
6.1 Standard SPI Instructions

The W25Q64JV is accessed through an SPI compatible bus consisting of four signals: Serial Clock (CLK),
Chip Select (/CS), Serial Data Input (DI) and Serial Data Output (DO). Standard SPI instructions use the DI
input pin to serially write instructions, addresses or data to the device on the rising edge of CLK. The DO
output pin is used to read data or status from the device on the falling edge of CLK.
SPI bus operation Mode 0 (0,0) and 3 (1,1) are supported. The primary difference between Mode 0 and
Mode 3 concerns the normal state of the CLK signal when the SPI bus master is in standby and data is not
being transferred to the Serial Flash. For Mode 0, the CLK signal is normally low on the falling and rising
edges of /CS. For Mode 3, the CLK signal is normally high on the falling and rising edges of /CS.
6.2 Dual SPI Instructions

The W25Q64JV supports Dual SPI operation when using instructions such as “Fast Read Dual Output
(3Bh)” and “Fast Read Dual I/O (BBh)”. These instructions allow data to be transferred to or from the device
at two to three times the rate of ordinary Serial Flash devices. The Dual SPI Read instructions are ideal for
quickly downloading code to RAM upon power-up (code-shadowing) or for executing non-speed-critical
code directly from the SPI bus (XIP). When using Dual SPI instructions, the DI and DO pins become
bidirectional I/O pins: IO0 and IO1.
6.3 Quad SPI Instructions

The W25Q64JV supports Quad SPI operation when using instructions such as “Fast Read Quad Output
(6Bh)”, and “Fast Read Quad I/O (EBh). These instructions allow data to be transferred to or from the device
four to six times the rate of ordinary Serial Flash. The Quad Read instructions offer a significant improvement
in continuous and random access transfer rates allowing fast code-shadowing to RAM or execution directly
from the SPI bus (XIP). When using Quad SPI instructions the DI and DO pins become bidirectional IO0
and IO1, with the additional I/O pins: IO2, IO3. Quad SPI instructions require the non-volatile Quad Enable
bit (QE) in Status Register-2 to be set.
6.4 Software Reset & Hardware /RESET pin

The W25Q64JV can be reset to the initial power-on state by a software Reset sequence. This sequence
must include two consecutive instructions: Enable Reset (66h) & Reset (99h). If the instruction sequence is
successfully accepted, the device will take approximately 30µS (tRST) to reset. No instruction will be
accepted during the reset period. For the SOIC-16 and TFBGA packages, W25Q64JV provides a dedicated
hardware /RESET pin. Drive the /RESET pin low for a minimum period of ~1µS (tRESET*) will interrupt any
on-going external/internal operations and reset the device to its initial power-on state. Hardware /RESET
pin has higher priority than other SPI input signals (/CS, CLK, IOs).
Note:
1. Hardware /RESET pin is available on SOIC-16 or TFBGA; please contact Winbond for his package.
2. While a faster /RESET pulse (as short as a few hundred nanoseconds) will often reset the device, a 1us minimum is recommended
to ensure reliable operation.
3. There is an internal pull-up resistor for the dedicated /RESET pin on the SOIC-16 and TFBGA-24 package. If the reset function is
not needed, this pin can be left floating in the system.

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W25Q64JV
6.5 Write Protection

Applications that use non-volatile memory must take into consideration the possibility of noise and other
adverse system conditions that may compromise data integrity. To address this concern, the W 25Q64JV
provides several means to protect the data from inadvertent writes.
Write Protect Features

 Device resets when VCC is below threshold
 Time delay write disable after Power-up
 Write enable/disable instructions and automatic write disable after erase or program
 Software and Hardware (/WP pin) write protection using Status Registers
 Additional Individual Block/Sector Locks for array protection
 Write Protection using Power-down instruction
 Lock Down write protection for Status Register until the next power-up
 One Time Program (OTP) write protection for array and Security Registers using Status Register *
* Note: This feature is available upon special flow. Please contact Winbond for details.
Upon power-up or at power-down, the W25Q64JV will maintain a reset condition while VCC is below the
threshold value of VWI, (See Power-up Timing and Voltage Levels and Figure 43). While reset, all operations
are disabled and no instructions are recognized. During power-up and after the VCC voltage exceeds VWI,
all program and erase related instructions are further disabled for a time delay of t PUW. This includes the
Write Enable, Page Program, Sector Erase, Block Erase, Chip Erase and the Write Status Register
instructions. Note that the chip select pin (/CS) must track the VCC supply level at power-up until the VCC-
min level and tVSL time delay is reached, and it must also track the VCC supply level at power-down to
prevent adverse command sequence. If needed a pull-up resister on /CS can be used to accomplish this.
After power-up the device is automatically placed in a write-disabled state with the Status Register Write
Enable Latch (WEL) set to a 0. A Write Enable instruction must be issued before a Page Program, Sector
Erase, Block Erase, Chip Erase or Write Status Register instruction will be accepted. After completing a
program, erase or write instruction the Write Enable Latch (WEL) is automatically cleared to a write-disabled
state of 0.
Software controlled write protection is facilitated using the Write Status Register instruction and setting the
Status Register Protect (SRP, SRL) and Block Protect (CMP, TB, BP[3:0]) bits. These settings allow a
portion or the entire memory array to be configured as read only. Used in conjunction with the Write Protect
(/WP) pin, changes to the Status Register can be enabled or disabled under hardware control. See Status
Register section for further information. Additionally, the Power-down instruction offers an extra level of write
protection as all instructions are ignored except for the Release Power-down instruction.
The W25Q64JV also provides another Write Protect method using the Individual Block Locks. Each 64KB
block (except the top and bottom blocks, total of 126 blocks) and each 4KB sector within the top/bottom
blocks (total of 32 sectors) are equipped with an Individual Block Lock bit. When the lock bit is 0, the
corresponding sector or block can be erased or programmed; when the lock bit is set to 1, Erase or Program
commands issued to the corresponding sector or block will be ignored. When the device is powered on, all
Individual Block Lock bits will be 1, so the entire memory array is protected from Erase/Program. An
“Individual Block Unlock (39h)” instruction must be issued to unlock any specific sector or block.
The WPS bit in Status Register-3 is used to decide which Write Protect scheme should be used. When
WPS=0 (factory default), the device will only utilize CMP, SEC, TB, BP[2:0] bits to protect specific areas of
the array; when WPS=1, the device will utilize the Individual Block Locks for write protection.

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W25Q64JV
7. STATUS AND CONFIGURATION REGISTERS

Three Status and Configuration Registers are provided for W25Q64JV. The Read Status Register-1/2/3
instructions can be used to provide status on the availability of the flash memory array, whether the device
is write enabled or disabled, the state of write protection, Quad SPI setting, Security Register lock status,
Erase/Program Suspend status, output driver strength, power-up. The Write Status Register instruction
can be used to configure the device write protection features, Quad SPI setting, Security Register OTP
locks, and output driver strength. Write access to the Status Register is controlled by the state of the non-
volatile Status Register Protect bits (SRL), the Write Enable instruction, and during Standard/Dual SPI
operations
7.1 Status Registers
S7 S6 S5 S4 S3 S2 S1 S0
SRP SEC TB BP2 BP1 BP0 WEL BUSY
STATUS REGISTER PROTECT

(volatile/non-volatile)
SECTOR PROTECT
TOP/BOTTOM PROTECT
BLOCK PROTECT BITS
WRITE ENABLE LATCH
WRITE IN PROGRESS
Figure 4a. Status Register-1
Erase/Write In Progress (BUSY) – Status Only

BUSY is a read only bit in the status register (S0) that is set to a 1 state when the device is executing a
Page Program, Quad Page Program, Sector Erase, Block Erase, Chip Erase, Write Status Register or
Erase/Program Security Register instruction. During this time the device will ignore further instructions
except for the Read Status Register and Erase/Program Suspend instruction (see tW, tPP, tSE, tBE, and tCE
in AC Characteristics). When the program, erase or write status/security register instruction has completed,
the BUSY bit will be cleared to a 0 state indicating the device is ready for further instructions.
Write Enable Latch (WEL) – Status Only
Write Enable Latch (WEL) is a read only bit in the status register (S1) that is set to 1 after executing a Write
Enable Instruction. The WEL status bit is cleared to 0 when the device is write disabled. A write disable
state occurs upon power-up or after any of the following instructions: Write Disable, Page Program, Quad
Page Program, Sector Erase, Block Erase, Chip Erase, Write Status Register, Erase Security Register and
Program Security Register.
Block Protect Bits (BP2, BP1, BP0) – Volatile/Non-Volatile Writable
The Block Protect Bits (BP2, BP1, BP0) are non-volatile read/write bits in the status register (S4, S3, and
S2) that provide Write Protection control and status. Block Protect bits can be set using the Write Status
Register Instruction (see tW in AC characteristics). All, none or a portion of the memory array can be
protected from Program and Erase instructions (see Status Register Memory Protection table). The factory
default setting for the Block Protection Bits is 0, none of the array protected.

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W25Q64JV
Top/Bottom Block Protect (TB) – Volatile/Non-Volatile Writable

The non-volatile Top/Bottom bit (TB) controls if the Block Protect Bits (BP2, BP1, BP0) protect from the Top
(TB=0) or the Bottom (TB=1) of the array as shown in the Status Register Memory Protection table. The
factory default setting is TB=0. The TB bit can be set with the Write Status Register Instruction depending
on the state of the SRP/SRL and WEL bits.
Sector/Block Protect Bit (SEC) – Volatile/Non-Volatile Writable
The non-volatile Sector/Block Protect bit (SEC) controls if the Block Protect Bits (BP2, BP1, BP0) protect
either 4KB Sectors (SEC=1) or 64KB Blocks (SEC=0) in the Top (TB=0) or the Bottom (TB=1) of the array
as shown in the Status Register Memory Protection table. The default setting is SEC=0.
Complement Protect (CMP) – Volatile/Non-Volatile Writable
The Complement Protect bit (CMP) is a non-volatile read/write bit in the status register (S14). It is used in
conjunction with SEC, TB, BP2, BP1 and BP0 bits to provide more flexibility for the array protection. Once
CMP is set to 1, previous array protection set by SEC, TB, BP2, BP1 and BP0 will be reversed. For instance,
when CMP=0, a top 64KB block can be protected while the rest of the array is not; when CMP=1, the top
64KB block will become unprotected while the rest of the array become read-only. Please refer to the Status
Register Memory Protection table for details. The default setting is CMP=0.

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W25Q64JV
Status Register Protect (SRP, SRL) – Volatile/Non-Volatile Writable

Three Status and Configuration Registers are provided for W25Q64JV. The Read Status Register-1/2/3
instructions can be used to provide status on the availability of the flash memory array, whether the device
is write enabled or disabled, the state of write protection, Quad SPI setting, Security Register lock status,
Erase/Program Suspend status, and output driver strength, The Write Status Register instruction can be
used to configure the device write protection features, Quad SPI setting, Security Register OTP locks,
output driver. Write access to the Status Register is controlled by the state of the non-volatile Status Register
Protect bits (SRP, SRL), the Write Enable instruction, and during Standard/Dual SPI operations, the /WP
pin.
Status
SRL SRP /WP Register Description
Software /WP pin has no control. The Status register can be written to
0 0 X
Protection after a Write Enable instruction, WEL=1. [Factory Default]
Hardware When /WP pin is low the Status Register locked and cannot be
0 1 0
Protected written to.
Hardware When /WP pin is high the Status register is unlocked and can be
0 1 1
Unprotected written to after a Write Enable instruction, WEL=1.
Power Supply Status Register is protected and cannot be written to again until
1 X X
Lock-Down the next power-down, power-up cycle.(1)
One Time Status Register is permanently protected and cannot be written

1 X X
Program(2) to. (enabled by adding prefix command AAh, 55h)
1. When SRL =1, a power-down, power-up cycle will change SRL =0 state.
2. Please contact Winbond for details regarding the special instruction sequence.

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W25Q64JV
S15 S14 S13 S12 S11 S10 S9 S8
SUS CMP LB3 LB2 LB1 (R) QE SRL
SUSPEND STATUS
(Status Only)
COMPLEMENT PROTECT
(Volatile/Non-Volatile Writable)
SECURITY REGISTER LOCK BITS
(Non-Volatile OTP Writable)
Reserved
QUAD ENABLE
(Volatile/Non-Volatile OTP Writable)
STATUS REGISTER LOCK
(Volatile/Non-Volatile Writable)
Figure 4b. Status Register-2
Erase/Program Suspend Status (SUS) – Status Only

The Suspend Status bit is a read only bit in the status register (S15) that is set to 1 after executing a
Erase/Program Suspend (75h) instruction. The SUS status bit is cleared to 0 by Erase/Program Resume
(7Ah) instruction as well as a power-down, power-up cycle.
Security Register Lock Bits (LB3, LB2, LB1) – Non-Volatile OTP Writable
The Security Register Lock Bits (LB3, LB2, LB1) are non-volatile One Time Program (OTP) bits in Status
Register (S13, S12, S11) that provide the write protect control and status to the Security Registers. The
default state of LB3-1 is 0, Security Registers are unlocked. LB3-1 can be set to 1 individually using the
Write Status Register instruction. LB3-1 are One Time Programmable (OTP), once it’s set to 1, the
corresponding 256-Byte Security Register will become read-only permanently.
Quad Enable (QE) – Volatile/Non-Volatile Writable
The Quad Enable (QE) bit is a non-volatile read/write bit in the status register (S9) that enables Quad SPI
operation. When the QE bit is set to a 0 state (factory default for part numbers with ordering options “IM”
&“JM”), the /HOLD are enabled, the device operates in Standard/Dual SPI modes. When the QE bit is set
to a 1 (factory fixed default for part numbers with ordering options “IQ/IN” & “JQ”), the Quad IO2 and IO3
pins are enabled, and /HOLD function is disabled, the device operates in Standard/Dual/Quad SPI modes.

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W25Q64JV
Figure 4c. Status Register-3
Write Protect Selection (WPS) – Volatile/Non-Volatile Writable

The WPS bit is used to select which Write Protect scheme should be used. When WPS=0, the device will
use the combination of CMP, SEC, TB, BP[2:0] bits to protect a specific area of the memory array. When
WPS=1, the device will utilize the Individual Block Locks to protect any individual sector or blocks. The
default value for all Individual Block Lock bits is 1 upon device power on or after reset.
Output Driver Strength (DRV1, DRV0) – Volatile/Non-Volatile Writable

The DRV1 & DRV0 bits are used to determine the output driver strength for the Read operations.
DRV1, DRV0 Driver Strength
0, 0 100%
0, 1 75%(1)
1, 0 50%
1, 1 25%(2)
Notes:
1. Factory default for part numbers with ordering options “IN”

2. Factory default for part numbers with ordering options “IQ”.
Reserved Bits – Non Functional

There are a few reserved Status Register bits that may be read out as a “0” or “1”. It is recommended to
ignore the values of those bits. During a “Write Status Register” instruction, the Reserved Bits can be written
as “0”, but there will not be any effects.

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W25Q64JV
Status Register Memory Protection (WPS = 0, CMP = 0)
STATUS REGISTER(1) W25Q64JV (64M-BIT) MEMORY PROTECTION(3)

PROTECTED PROTECTED PROTECTED PROTECTED
SEC TB BP2 BP1 BP0
BLOCK(S) ADDRESSES DENSITY PORTION(2)
X X 0 0 0 NONE NONE NONE NONE

0 0 0 0 1 126 and 127 7E0000h – 7FFFFFh 128KB Upper 1/64
0 0 0 1 0 124 thru 127 7C0000h – 7FFFFFh 256KB Upper 1/32
0 0 0 1 1 120 thru 127 780000h – 7FFFFFh 512KB Upper 1/16
0 0 1 0 0 112 thru 127 700000h – 7FFFFFh 1MB Upper 1/8
0 1 0 0 1 0 and 1 000000h – 01FFFFh 128KB Lower 1/64
0 1 0 1 0 0 thru 3 000000h – 03FFFFh 256KB Lower 1/32
0 1 0 1 1 0 thru 7 000000h – 07FFFFh 512KB Lower 1/16
0 1 1 0 0 0 thru 15 000000h – 0FFFFFh 1MB Lower 1/8
X X 1 1 1 0 thru 127 000000h – 7FFFFFh 8MB ALL
1 0 0 0 1 127 7FF000h – 7FFFFFh 4KB U – 1/2048

1 0 0 1 0 127 7FE000h – 7FFFFFh 8KB U – 1/1024
1 0 0 1 1 127 7FC000h – 7FFFFFh 16KB U – 1/512
1 0 1 0 X 127 7F8000h – 7FFFFFh 32KB U – 1/256
1 1 0 0 1 0 000000h – 000FFFh 4KB L – 1/2048

1 1 0 1 0 0 000000h – 001FFFh 8KB L – 1/1024
1 1 0 1 1 0 000000h – 003FFFh 16KB L – 1/512
1 1 1 0 X 0 000000h – 007FFFh 32KB L – 1/256
Notes:
3. X = don’t care
4. L = Lower; U = Upper
5. If any Erase or Program command specifies a memory region that contains protected data portion, this command
will be ignored.

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W25Q64JV
Status Register Memory Protection (WPS = 0, CMP = 1)
STATUS REGISTER(1) W25Q64JV (64M-BIT) MEMORY PROTECTION(3)

PROTECTED PROTECTED PROTECTED PROTECTED
SEC TB BP2 BP1 BP0
BLOCK(S) ADDRESSES DENSITY PORTION(2)
X X 0 0 0 0 thru 127 000000h – 7FFFFFh 8MB ALL

0 0 0 0 1 0 thru 125 000000h – 7DFFFFh 8,064KB Lower 63/64
0 0 0 1 0 0 thru 123 000000h – 7BFFFFh 7,936KB Lower 31/32
0 0 0 1 1 0 thru 119 000000h – 77FFFFh 7,680KB Lower 15/16
0 1 0 0 1 2 thru 127 020000h – 7FFFFFh 8,064KB Upper 63/64
X X 1 1 1 NONE NONE NONE NONE
1 0 0 0 1 0 thru 127 000000h – 7FEFFFh 8,188KB L – 2047/2048

1 0 0 1 0 0 thru 127 000000h – 7FDFFFh 8,184KB L – 1023/1024
1 0 0 1 1 0 thru 127 000000h – 7FBFFFh 8,176KB L – 511/512
1 0 1 0 X 0 thru 127 000000h – 7F7FFFh 8,160KB L – 255/256
1 1 0 0 1 0 thru 127 001000h – 7FFFFFh 8,188KB L – 2047/2048

1 1 0 1 0 0 thru 127 002000h – 7FFFFFh 8,184KB L – 1023/1024
1 1 0 1 1 0 thru 127 004000h – 7FFFFFh 8,176KB L – 511/512
1 1 1 0 X 0 thru 127 008000h – 7FFFFFh 8,160KB L – 255/256
Notes:
1. X = don’t care
2. L = Lower; U = Upper
3. If any Erase or Program command specifies a memory region that contains protected data portion, this command
will be ignored.

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W25Q64JV
Individual Block Memory Protection (WPS=1)
Sector 15 (4KB)
Block 127
Sector 14 (4KB)
(64KB)
Sector 1 (4KB) Individual Block Locks:

Sector 0 (4KB)
32 Sectors (Top/Bottom)
126 Blocks
Block 126 (64KB) Individual Block Lock:

36h + Address
Individual Block Unlock:

39h + Address
Read Block Lock:

3Dh + Address
Block 1 (64KB) Global Block Lock:

7Eh
Global Block Unlock:

Sector 15 (4KB)
Sector 14 (4KB) 98h
Block 0
(64KB)
Sector 1 (4KB)
Sector 0 (4KB)
Figure 4d. Individual Block/Sector Locks
Notes:
1. Individual Block/Sector protection is only valid when WPS=1.
2. All individual block/sector lock bits are set to 1 by default after power up, all memory array is protected.

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W25Q64JV
8. INSTRUCTIONS
The Standard/Dual/Quad SPI instruction set of the W25Q64JV consists of 48 basic instructions that are fully
controlled through the SPI bus (see Instruction Set Table1-2). Instructions are initiated with the falling edge
of Chip Select (/CS). The first byte of data clocked into the DI input provides the instruction code. Data on
the DI input is sampled on the rising edge of clock with most significant bit (MSB) first.
Instructions vary in length from a single byte to several bytes and may be followed by address bytes, data
bytes, dummy bytes (don’t care), and in some cases, a combination. Instructions are completed with the
rising edge of edge /CS. Clock relative timing diagrams for each instruction are included in Figures 5 through
57. All read instructions can be completed after any clocked bit. However, all instructions that Write, Program
or Erase must complete on a byte boundary (/CS driven high after a full 8-bits have been clocked) otherwise
the instruction will be ignored. This feature further protects the device from inadvertent writes. Additionally,
while the memory is being programmed or erased, or when the Status Register is being written, all
instructions except for Read Status Register will be ignored until the program or erase cycle has completed.
8.1 Device ID and Instruction Set Tables
Manufacturer and Device Identification
MANUFACTURER ID (MF7 - MF0)
Winbond Serial Flash EFh
Device ID (ID7 - ID0) (ID15 - ID0)
Instruction ABh, 90h, 92h, 94h 9Fh
W25Q64JV-IQ/JQ 16h 4017h

W25Q64JV-IM/JM* 16h 7017h
Note: For DTR, QPI supporting, please refer to W25Q64JV-M DTR datasheet.

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W25Q64JV
Instruction Set Table 1 (Standard SPI Instructions)(1)

Data Input Output Byte 1 Byte 2 Byte 3 Byte 4 Byte 5 Byte 6 Byte 7
Number of Clock(1-1-1) 8 8 8 8 8 8 8
Write Enable 06h
Volatile SR Write Enable 50h
Write Disable 04h
Release Power-down / ID ABh Dummy Dummy Dummy (ID7-ID0)(2)
Manufacturer/Device ID 90h Dummy Dummy 00h (MF7-MF0) (ID7-ID0)
JEDEC ID 9Fh (MF7-MF0) (ID15-ID8) (ID7-ID0)
Read Unique ID 4Bh Dummy Dummy Dummy Dummy (UID63-0)
Read Data 03h A23-A16 A15-A8 A7-A0 (D7-D0)
Fast Read 0Bh A23-A16 A15-A8 A7-A0 Dummy (D7-D0)
Page Program 02h A23-A16 A15-A8 A7-A0 D7-D0 D7-D0(3)
Sector Erase (4KB) 20h A23-A16 A15-A8 A7-A0
Block Erase (32KB) 52h A23-A16 A15-A8 A7-A0
Block Erase (64KB) D8h A23-A16 A15-A8 A7-A0
Chip Erase C7h/60h
Read Status Register-1 05h (S7-S0)(2)
(4)
Write Status Register-1 01h (S7-S0)(4)
Write Status Register-2 31h (S15-S8)
Write Status Register-3 11h (S23-S16)
Read SFDP Register 5Ah 00h 00h A7–A0 dummy (D7-0)
(5)
Erase Security Register 44h A23-A16 A15-A8 A7-A0
Program Security Register(5) 42h A23-A16 A15-A8 A7-A0 D7-D0 D7-D0(3)
(5)
Read Security Register 48h A23-A16 A15-A8 A7-A0 Dummy (D7-D0)
Global Block Lock 7Eh
Global Block Unlock 98h
Read Block Lock 3Dh A23-A16 A15-A8 A7-A0 (L7-L0)
Individual Block Lock 36h A23-A16 A15-A8 A7-A0
Individual Block Unlock 39h A23-A16 A15-A8 A7-A0
Erase / Program Suspend 75h
Erase / Program Resume 7Ah
Power-down B9h
Enable Reset 66h
Reset Device 99h

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W25Q64JV
Instruction Set Table 2 (Dual/Quad SPI Instructions)(1)

Data Input Output Byte 1 Byte 2 Byte 3 Byte 4 Byte 5 Byte 6 Byte 7 Byte 8 Byte 9
Number of Clock(1-1-2) 8 8 8 8 4 4 4 4 4
Fast Read Dual Output 3Bh A23-A16 A15-A8 A7-A0 Dummy Dummy (D7-D0)(7)
Number of Clock(1-2-2) 8 4 4 4 4 4 4 4 4
Fast Read Dual I/O BBh A23-A16(6) A15-A8(6) A7-A0(6) Dummy(11) (D7-D0)(7)
(6) (6) (6) (11)
Mftr./Device ID Dual I/O 92h A23-A16 A15-A8 00 Dummy (MF7-MF0) (ID7-ID0)(7)
Number of Clock(1-1-4) 8 8 8 8 2 2 2 2 2
Quad Input Page Program 32h A23-A16 A15-A8 A7-A0 (D7-D0) (9)
(D7-D0) (3)
…
Fast Read Quad Output 6Bh A23-A16 A15-A8 A7-A0 Dummy Dummy Dummy Dummy (D7-D0)(10)
(8) (8) (8)
Number of Clock(1-4-4) 8 2 2 2 2 2 2 2 2
Mftr./Device ID Quad I/O 94h A23-A16 A15-A8 00 Dummy(11) Dummy Dummy (MF7-MF0) (ID7-ID0)
Fast Read Quad I/O EBh A23-A16 A15-A8 A7-A0 Dummy(11) Dummy Dummy (D7-D0)
Set Burst with Wrap 77h Dummy Dummy Dummy W8-W0
1. Data bytes are shifted with Most Significant Bit first. Byte fields with data in parenthesis “( )” indicate data
output from the device on either 1, 2 or 4 IO pins.
2. The Status Register contents and Device ID will repeat continuously until /CS terminates the instruction.
3. At least one byte of data input is required for Page Program, Quad Page Program and Program Security
Registers, up to 256 bytes of data input. If more than 256 bytes of data are sent to the device, the addressing
will wrap to the beginning of the page and overwrite previously sent data.
4. Write Status Register-1 (01h) can also be used to program Status Register-1&2, see section 8.2.5.
5. Security Register Address:
Security Register 1: A23-16 = 00h; A15-8 = 10h; A7-0 = byte address
6. Dual SPI address input format:
IO0 = A22, A20, A18, A16, A14, A12, A10, A8 A6, A4, A2, A0, M6, M4, M2, M0
IO1 = A23, A21, A19, A17, A15, A13, A11, A9 A7, A5, A3, A1, M7, M5, M3, M1
7. Dual SPI data output format:
IO0 = (D6, D4, D2, D0)
IO1 = (D7, D5, D3, D1)
8. Quad SPI address input format: Set Burst with Wrap input format:
IO0 = A20, A16, A12, A8, A4, A0, M4, M0 IO0 = x, x, x, x, x, x, W4, x
IO3 = A23, A19, A15, A11, A7, A3, M7, M3 IO3 = x, x, x, x, x, x, x, x
9. Quad SPI data input/output format:
IO0 = (D4, D0, …..)
IO1 = (D5, D1, …..)
IO2 = (D6, D2, …..)
IO3 = (D7, D3, …..)
10. Fast Read Quad I/O data output format:
IO0 = (x, x, x, x, D4, D0, D4, D0)
IO1 = (x, x, x, x, D5, D1, D5, D1)
IO2 = (x, x, x, x, D6, D2, D6, D2)
IO3 = (x, x, x, x, D7, D3, D7, D3)
11. The first dummy is M7-M0 should be set to Fxh

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W25Q64JV
8.2 Instruction Descriptions

Write Enable (06h)
The Write Enable instruction (Figure 5) sets the Write Enable Latch (WEL) bit in the Status Register to a 1.
The WEL bit must be set prior to every Page Program, Quad Page Program, Sector Erase, Block Erase,
Chip Erase, Write Status Register and Erase/Program Security Registers instruction. The Write Enable
instruction is entered by driving /CS low, shifting the instruction code “06h” into the Data Input (DI) pin on
the rising edge of CLK, and then driving /CS high.
/CS
Mode 3 0 1 2 3 4 5 6 7 Mode 3
CLK Mode 0 Mode 0
Instruction (06h)
DI
(IO0)
DO High Impedance
(IO1)
Figure 5. Write Enable Instruction for SPI Mode

Write Enable for Volatile Status Register (50h)
The non-volatile Status Register bits described in section 7.1 can also be written to as volatile bits. This
gives more flexibility to change the system configuration and memory protection schemes quickly without
waiting for the typical non-volatile bit write cycles or affecting the endurance of the Status Register non-
volatile bits. To write the volatile values into the Status Register bits, the Write Enable for Volatile Status
Register (50h) instruction must be issued prior to a Write Status Register (01h) instruction. Write Enable for
Volatile Status Register instruction (Figure 6) will not set the Write Enable Latch (WEL) bit, it is only valid
for the Write Status Register instruction to change the volatile Status Register bit values.
/CS
Mode 3 0 1 2 3 4 5 6 7 Mode 3
CLK Mode 0 Mode 0
Instruction (50h)
DI
(IO0)
DO High Impedance
(IO1)
Figure 6. Write Enable for Volatile Status Register Instruction for SPI Mode)

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W25Q64JV
Write Disable (04h)

The Write Disable instruction (Figure 7) resets the Write Enable Latch (WEL) bit in the Status Register to a
0. The Write Disable instruction is entered by driving /CS low, shifting the instruction code “04h” into the DI
pin and then driving /CS high. Note that the WEL bit is automatically reset after Power-up and upon
completion of the Write Status Register, Erase/Program Security Registers, Page Program, Quad Page
Program, Sector Erase, Block Erase, Chip Erase and Reset instructions.
/CS
Mode 3 0 1 2 3 4 5 6 7 Mode 3
CLK Mode 0 Mode 0
Instruction (04h)
DI
(IO0)
DO High Impedance
(IO1)
Figure 7. Write Disable Instruction for SPI Mode

Read Status Register-1 (05h), Status Register-2 (35h) & Status Register-3 (15h)
The Read Status Register instructions allow the 8-bit Status Registers to be read. The instruction is entered
by driving /CS low and shifting the instruction code “05h” for Status Register-1, “35h” for Status Register-2
or “15h” for Status Register-3 into the DI pin on the rising edge of CLK. The status register bits are then
shifted out on the DO pin at the falling edge of CLK with most significant bit (MSB) first as shown in Figure
8. Refer to section 7.1 for Status Register descriptions.
The Read Status Register instruction may be used at any time, even while a Program, Erase or Write Status
Register cycle is in progress. This allows the BUSY status bit to be checked to determine when the cycle is
complete and if the device can accept another instruction. The Status Register can be read continuously,
as shown in Figure 8. The instruction is completed by driving /CS high.
/CS
Mode 3 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23
CLK Mode 0
Instruction (05h/35h/15h)
DI
(IO0)
Status Register-1/2/3 out Status Register-1/2/3 out
DO High Impedance
7 6 5 4 3 2 1 0 7 6 5 4 3 2 1 0 7
(IO1)
* = MSB * *
Figure 8. Read Status Register Instruction

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W25Q64JV
Write Status Register-1 (01h), Status Register-2 (31h) & Status Register-3 (11h)
The Write Status Register instruction allows the Status Registers to be written. The writable Status Register
bits include:SEC, TB, BP[2:0] in Status Register-1; CMP, LB[3:1], QE, SRL in Status Register-2; DRV1,
DRV0, WPS in Status Register-3. All other Status Register bit locations are read-only and will not be affected
by the Write Status Register instruction. LB[3:1] are non-volatile OTP bits, once it is set to 1, it cannot be
cleared to 0.
To write non-volatile Status Register bits, a standard Write Enable (06h) instruction must previously have
been executed for the device to accept the Write Status Register instruction (Status Register bit WEL must
equal 1). Once write enabled, the instruction is entered by driving /CS low, sending the instruction code
“01h/31h/11h”, and then writing the status register data byte as illustrated in Figure 9a.
To write volatile Status Register bits, a Write Enable for Volatile Status Register (50h) instruction must have
been executed prior to the Write Status Register instruction (Status Register bit WEL remains 0). However,
SRL and LB[3:1] cannot be changed from “1” to “0” because of the OTP protection for these bits. Upon
power off or the execution of a Software/Hardware Reset, the volatile Status Register bit values will be lost,
and the non-volatile Status Register bit values will be restored.
During non-volatile Status Register write operation (06h combined with 01h/31h/11h), after /CS is driven
high, the self-timed Write Status Register cycle will commence for a time duration of tW (See AC
Characteristics). While the Write Status Register cycle is in progress, the Read Status Register instruction
may still be accessed to check the status of the BUSY bit. The BUSY bit is a 1 during the Write Status
Register cycle and a 0 when the cycle is finished and ready to accept other instructions again. After the
Write Status Register cycle has finished, the Write Enable Latch (WEL) bit in the Status Register will be
cleared to 0.
During volatile Status Register write operation (50h combined with 01h/31h/11h), after /CS is driven high,
the Status Register bits will be refreshed to the new values within the time period of t SHSL2 (See AC
Characteristics). BUSY bit will remain 0 during the Status Register bit refresh period.
Refer to section 7.1 for Status Register descriptions.
/CS
Mode 3 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 Mode 3
CLK Mode 0 Mode 0
Instruction
Register-1/2/3 in
(01h/31h/11h)
DI
7 6 5 4 3 2 1 0
(IO0)
*
DO High Impedance
(IO1)
* = MSB
Figure 9a. Write Status Register-1/2/3 Instruction

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W25Q64JV
The W25Q64JV is also backward compatible to Winbond’s previous generations of serial flash memories,
in which the Status Register-1&2 can be written using a single “Write Status Register-1 (01h)” command.
To complete the Write Status Register-1&2 instruction, the /CS pin must be driven high after the sixteenth
bit of data that is clocked in as shown in Figure 9c. If /CS is driven high after the eighth clock, the Write
Status Register-1 (01h) instruction will only program the Status Register-1, the Status Register-2 will not be
affected (Previous generations will clear CMP and QE bits).
/CS
Mode 3 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 Mode 3
CLK Mode 0 Mode 0
Instruction (01h) Status Register 1 in Status Register 2 in

DI
7 6 5 4 3 2 1 0 15 14 13 12 11 10 9 8
(IO0)
* *
DO High Impedance
(IO1)
* = MSB
Figure 9c. Write Status Register-1/2 Instruction

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W25Q64JV
Read Data (03h)

The Read Data instruction allows one or more data bytes to be sequentially read from the memory. The
instruction is initiated by driving the /CS pin low and then shifting the instruction code “03h” followed by a
24-bit address (A23-A0) into the DI pin. The code and address bits are latched on the rising edge of the
CLK pin. After the address is received, the data byte of the addressed memory location will be shifted out
on the DO pin at the falling edge of CLK with most significant bit (MSB) first. The address is automatically
incremented to the next higher address after each byte of data is shifted out allowing for a continuous stream
of data. This means that the entire memory can be accessed with a single instruction as long as the clock
continues. The instruction is completed by driving /CS high.
The Read Data instruction sequence is shown in Figure 14. If a Read Data instruction is issued while an
Erase, Program or Write cycle is in process (BUSY=1) the instruction is ignored and will not have any effects
on the current cycle. The Read Data instruction allows clock rates from D.C. to a maximum of f R (see AC
Electrical Characteristics).
The Read Data (03h) instruction is only supported in Standard SPI mode.
/CS
Mode 3 0 1 2 3 4 5 6 7 8 9 10 28 29 30 31 32 33 34 35 36 37 38 39
CLK Mode 0
Instruction (03h) 24-Bit Address

DI
23 22 21 3 2 1 0
(IO0)
* Data Out 1
DO High Impedance
7 6 5 4 3 2 1 0 7
(IO1)
* = MSB *
Figure 14. Read Data Instruction

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W25Q64JV
Fast Read (0Bh)

The Fast Read instruction is similar to the Read Data instruction except that it can operate at the highest
possible frequency of FR (see AC Electrical Characteristics). This is accomplished by adding eight “dummy”
clocks after the 24-bit address as shown in Figure 16. The dummy clocks allow the devices internal circuits
additional time for setting up the initial address. During the dummy clocks the data value on the DO pin is a
“don’t care”.
/CS
Mode 3 0 1 2 3 4 5 6 7 8 9 10 28 29 30 31
CLK Mode 0
Instruction (0Bh) 24-Bit Address

DI
23 22 21 3 2 1 0
(IO0)
*
DO High Impedance
(IO1)
* = MSB
/CS
31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55
CLK
Dummy Clocks
DI
0
(IO0)
Data Out 1 Data Out 2
DO High Impedance
7 6 5 4 3 2 1 0 7 6 5 4 3 2 1 0 7
(IO1)
* *
Figure 16. Fast Read Instruction

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W25Q64JV
Fast Read Dual Output (3Bh)

The Fast Read Dual Output (3Bh) instruction is similar to the standard Fast Read (0Bh) instruction except
that data is output on two pins; IO0 and IO1. This allows data to be transferred at twice the rate of standard
SPI devices. The Fast Read Dual Output instruction is ideal for quickly downloading code from Flash to
RAM upon power-up or for applications that cache code-segments to RAM for execution.
Similar to the Fast Read instruction, the Fast Read Dual Output instruction can operate at the highest
possible frequency of FR (see AC Electrical Characteristics). This is accomplished by adding eight “dummy”
clocks after the 24-bit address as shown in Figure 18. The dummy clocks allow the device's internal circuits
additional time for setting up the initial address. The input data during the dummy clocks is “don’t care”.
However, the IO0 pin should be high-impedance prior to the falling edge of the first data out clock.
/CS
Mode 3 0 1 2 3 4 5 6 7 8 9 10 28 29 30 31
CLK Mode 0

DI
23 22 21 3 2 1 0
(IO0)
*
DO High Impedance
(IO1)
/CS
* = MSB
31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55
CLK
IO0 switches from
Dummy Clocks Input to Output
DI
0 6 4 2 0 6 4 2 0 6 4 2 0 6 4 2 0 6
(IO0)
DO High Impedance
7 5 3 1 7 5 3 1 7 5 3 1 7 5 3 1 7
(IO1)
* Data Out 1 * Data Out 2 * Data Out 3 * Data Out 4
Figure 18. Fast Read Dual Output Instruction

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W25Q64JV
Fast Read Quad Output (6Bh)

The Fast Read Quad Output (6Bh) instruction is similar to the Fast Read Dual Output (3Bh) instruction
except that data is output on four pins, IO0, IO1, IO2, and IO3. The Quad Enable (QE) bit in Status Register-
2 must be set to 1 before the device will accept the Fast Read Quad Output Instruction. The Fast Read
Quad Output Instruction allows data to be transferred at four times the rate of standard SPI devices.
The Fast Read Quad Output instruction can operate at the highest possible frequency of FR (see AC
Electrical Characteristics). This is accomplished by adding eight “dummy” clocks after the 24-bit address as
shown in Figure 20. The dummy clocks allow the device's internal circuits additional time for setting up the
initial address. The input data during the dummy clocks is “don’t care”. However, the IO pins should be high-
impedance prior to the falling edge of the first data out clock.
/CS
Mode 3 0 1 2 3 4 5 6 7 8 9 10 28 29 30 31
CLK Mode 0
IO0 23 22 21 3 2 1 0
High Impedance *
IO1
High Impedance
IO2
High Impedance
IO3
* = MSB
/CS
31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47
CLK
IO0 switches from
Dummy Clocks Input to Output
IO0 0 4 0 4 0 4 0 4 0 4
High Impedance
IO1 5 1 5 1 5 1 5 1 5
High Impedance
IO2 6 2 6 2 6 2 6 2 6
High Impedance
IO3 7 3 7 3 7 3 7 3 7
Byte 1 Byte 2 Byte 3 Byte 4
Figure 20. Fast Read Quad Output Instruction

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W25Q64JV
Fast Read Dual I/O (BBh)

The Fast Read Dual I/O (BBh) instruction allows for improved random access while maintaining two IO pins,
IO0 and IO1. It is similar to the Fast Read Dual Output (3Bh) instruction but with the capability to input the
Address bits (A23-0) two bits per clock. This reduced instruction overhead may allow for code execution
(XIP) directly from the Dual SPI in some applications.
/CS
Mode 3 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23
CLK Mode 0
Instruction (BBh) A23-16 A15-8 A7-0 M7-0

DI
22 20 18 16 14 12 10 8 6 4 2 0 6 4 2 0
(IO0)
DO
23 21 19 17 15 13 11 9 7 5 3 1 7 5 3 1
(IO1)
* *
* = MSB
/CS
23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39
CLK
IOs switch from
Input to Output
DI
0 6 4 2 0 6 4 2 0 6 4 2 0 6 4 2 0 6
(IO0)
DO
1 7 5 3 1 7 5 3 1 7 5 3 1 7 5 3 1 7
(IO1)
* Byte 1 * Byte 2 * Byte 3 * Byte 4
Figure 22. Fast Read Dual I/O Instruction (M5-4=Fxh)

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W25Q64JV
Fast Read Quad I/O (EBh)

The Fast Read Quad I/O (EBh) instruction is similar to the Fast Read Dual I/O (BBh) instruction except that
address and data bits are input and output through four pins IO 0, IO1, IO2 and IO3 and four Dummy clocks
are required in SPI mode prior to the data output. The Quad I/O dramatically reduces instruction overhead
allowing faster random access for code execution (XIP) directly from the Quad SPI. The Quad Enable bit
(QE) of Status Register-2 must be set to enable the Fast Read Quad I/O Instruction.
/CS
Mode 3 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23
CLK Mode 0
IOs switch from
Instruction (EBh) A23-16 A15-8 A7-0 M7-0 Dummy Dummy
Input to Output
IO0 20 16 12 8 4 0 4 0 4 0 4 0 4
IO1 21 17 13 9 5 1 5 1 5 1 5 1 5
IO2 22 18 14 10 6 2 6 2 6 2 6 2 6
IO3 23 19 15 11 7 3 7 3 7 3 7 3 7
Byte 1 Byte 2 Byte 3
Figure 24a. Fast Read Quad I/O Instruction (M7-M0 should be set to Fxh)
Fast Read Quad I/O with “8/16/32/64-Byte Wrap Around” in Standard SPI mode
The Fast Read Quad I/O instruction can also be used to access a specific portion within a page by issuing
a “Set Burst with Wrap” (77h) command prior to EBh. The “Set Burst with Wrap” (77h) command can either
enable or disable the “Wrap Around” feature for the following EBh commands. When “Wrap Around” is
enabled, the data being accessed can be limited to either an 8, 16, 32 or 64-byte section of a 256-byte page.
The output data starts at the initial address specified in the instruction, once it reaches the ending boundary
of the 8/16/32/64-byte section, the output will wrap around to the beginning boundary automatically until /CS
is pulled high to terminate the command.
The Burst with Wrap feature allows applications that use cache to quickly fetch a critical address and then
fill the cache afterwards within a fixed length (8/16/32/64-byte) of data without issuing multiple read
commands.
The “Set Burst with Wrap” instruction allows three “Wrap Bits”, W6-4 to be set. The W4 bit is used to enable
or disable the “Wrap Around” operation while W6-5 are used to specify the length of the wrap around section
within a page. Refer to section 8.2.37 for detail descriptions.

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W25Q64JV
Set Burst with Wrap (77h)

In Standard SPI mode, the Set Burst with Wrap (77h) instruction is used in conjunction with “Fast Read
Quad I/O” instructions to access a fixed length of 8/16/32/64-byte section within a 256-byte page. Certain
applications can benefit from this feature and improve the overall system code execution performance.
Similar to a Quad I/O instruction, the Set Burst with Wrap instruction is initiated by driving the /CS pin low
and then shifting the instruction code “77h” followed by 24 dummy bits and 8 “Wrap Bits”, W7-0. The
instruction sequence is shown in Figure 28. Wrap bit W7 and the lower nibble W3-0 are not used.
W4 = 0 W4 =1 (DEFAULT)
W6, W5
Wrap Around Wrap Length Wrap Around Wrap Length
0 0 Yes 8-byte No N/A
Once W6-4 is set by a Set Burst with Wrap instruction, the following “Fast Read Quad I/O” instructions will
use the W6-4 setting to access the 8/16/32/64-byte section within any page. To exit the “Wrap Around”
function and return to normal read operation, another Set Burst with Wrap instruction should be issued to
set W4 = 1. The default value of W4 upon power on or after a software/hardware reset is 1.
/CS
Mode 3 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 Mode 3
CLK Mode 0 Mode 0
don't don't don't
Instruction (77h) care care care
Wrap Bit
IO0 X X X X X X w4 X
IO3 X X X X X X X X
Figure 28. Set Burst with Wrap Instruction

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W25Q64JV
Page Program (02h)

The Page Program instruction allows from one byte to 256 bytes (a page) of data to be programmed at
previously erased (FFh) memory locations. A Write Enable instruction must be executed before the device
will accept the Page Program Instruction (Status Register bit WEL= 1). The instruction is initiated by driving
the /CS pin low then shifting the instruction code “02h” followed by a 24-bit address (A23-A0) and at least
one data byte, into the DI pin. The /CS pin must be held low for the entire length of the instruction while data
is being sent to the device. The Page Program instruction sequence is shown in Figure 29.
If an entire 256 byte page is to be programmed, the last address byte (the 8 least significant address bits)
should be set to 0. If the last address byte is not zero, and the number of clocks exceeds the remaining
page length, the addressing will wrap to the beginning of the page. In some cases, less than 256 bytes (a
partial page) can be programmed without having any effect on other bytes within the same page. One
condition to perform a partial page program is that the number of clocks cannot exceed the remaining page
length. If more than 256 bytes are sent to the device the addressing will wrap to the beginning of the page
and overwrite previously sent data.
As with the write and erase instructions, the /CS pin must be driven high after the eighth bit of the last byte
has been latched. If this is not done the Page Program instruction will not be executed. After /CS is driven
high, the self-timed Page Program instruction will commence for a time duration of tpp (See AC
Characteristics). While the Page Program cycle is in progress, the Read Status Register instruction may still
be accessed for checking the status of the BUSY bit. The BUSY bit is a 1 during the Page Program cycle
and becomes a 0 when the cycle is finished and the device is ready to accept other instructions again. After
the Page Program cycle has finished the Write Enable Latch (WEL) bit in the Status Register is cleared to
0. The Page Program instruction will not be executed if the addressed page is protected by the Block Protect
(CMP, SEC, TB, BP2, BP1, and BP0) bits or the Individual Block/Sector Locks.
/CS
Mode 3 0 1 2 3 4 5 6 7 8 9 10 28 29 30 31 32 33 34 35 36 37 38 39
CLK Mode 0
Instruction (02h) 24-Bit Address Data Byte 1

DI
23 22 21 3 2 1 0 7 6 5 4 3 2 1 0
(IO0)
* *
* = MSB
/CS
2072
2073
2074
2075
2076
2077
2078
2079
39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 Mode 3
CLK Mode 0
Data Byte 2 Data Byte 3 Data Byte 256

DI
0 7 6 5 4 3 2 1 0 7 6 5 4 3 2 1 0 7 6 5 4 3 2 1 0
(IO0)
* * *
Figure 29. Page Program Instruction

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W25Q64JV
Quad Input Page Program (32h)

The Quad Page Program instruction allows up to 256 bytes of data to be programmed at previously erased
(FFh) memory locations using four pins: IO 0, IO1, IO2, and IO3. The Quad Page Program can improve
performance for PROM Programmer and applications that have slow clock speeds <5MHz. Systems with
faster clock speed will not realize much benefit for the Quad Page Program instruction since the inherent
page program time is much greater than the time it take to clock-in the data.
To use Quad Page Program the Quad Enable (QE) bit in Status Register-2 must be set to 1. A Write Enable
instruction must be executed before the device will accept the Quad Page Program instruction (Status
Register-1, WEL=1). The instruction is initiated by driving the /CS pin low then shifting the instruction code
“32h” followed by a 24-bit address (A23-A0) and at least one data byte, into the IO pins. The /CS pin must
be held low for the entire length of the instruction while data is being sent to the device. All other functions
of Quad Page Program are identical to standard Page Program. The Quad Page Program instruction
sequence is shown in Figure 30.
/CS
Mode 3 0 1 2 3 4 5 6 7 8 9 10 28 29 30 31
CLK Mode 0
IO0 23 22 21 3 2 1 0
*
IO1
IO2
IO3
* = MSB
/CS
536
537
538
539
540
541
542
543
31 32 33 34 35 36 37 Mode 3
CLK Mode 0
Byte Byte Byte Byte
Byte 1 Byte 2 Byte 3
253 254 255 256
IO0 0 4 0 4 0 4 0 4 0 4 0 4 0 4 0
IO1 5 1 5 1 5 1 5 1 5 1 5 1 5 1
IO2 6 2 6 2 6 2 6 2 6 2 6 2 6 2
IO3 7 3 7 3 7 3 7 3 7 3 7 3 7 3
* * * * * * *
Figure 30. Quad Input Page Program Instruction

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W25Q64JV
8.3 Sector Erase (20h)

The Sector Erase instruction sets all memory within a specified sector (4K-bytes) to the erased state of all
1s (FFh). A Write Enable instruction must be executed before the device will accept the Sector Erase
Instruction (Status Register bit WEL must equal 1). The instruction is initiated by driving the /CS pin low and
shifting the instruction code “20h” followed a 24-bit sector address (A23-A0). The Sector Erase instruction
The /CS pin must be driven high after the eighth bit of the last byte has been latched. If this is not done the
Sector Erase instruction will not be executed. After /CS is driven high, the self-timed Sector Erase instruction
will commence for a time duration of tSE (See AC Characteristics). While the Sector Erase cycle is in
progress, the Read Status Register instruction may still be accessed for checking the status of the BUSY
bit. The BUSY bit is a 1 during the Sector Erase cycle and becomes a 0 when the cycle is finished and the
device is ready to accept other instructions again. After the Sector Erase cycle has finished the Write Enable
Latch (WEL) bit in the Status Register is cleared to 0. The Sector Erase instruction will not be executed if
the addressed page is protected by the Block Protect (CMP, SEC, TB, BP2, BP1, and BP0) bits or the
Individual Block/Sector Locks.
/CS
Mode 3 0 1 2 3 4 5 6 7 8 9 29 30 31 Mode 3
CLK Mode 0 Mode 0

DI
23 22 2 1 0
(IO0)
*
DO High Impedance
(IO1)
* = MSB
Figure 31. Sector Erase Instruction

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W25Q64JV
32KB Block Erase (52h)

The Block Erase instruction sets all memory within a specified block (32K-bytes) to the erased state of all
1s (FFh). A Write Enable instruction must be executed before the device will accept the Block Erase
shifting the instruction code “52h” followed a 24-bit block address (A23-A0). The Block Erase instruction
Block Erase instruction will not be executed. After /CS is driven high, the self-timed Block Erase instruction
will commence for a time duration of tBE1 (See AC Characteristics). While the Block Erase cycle is in
bit. The BUSY bit is a 1 during the Block Erase cycle and becomes a 0 when the cycle is finished and the
device is ready to accept other instructions again. After the Block Erase cycle has finished the Write Enable
Latch (WEL) bit in the Status Register is cleared to 0. The Block Erase instruction will not be executed if the
addressed page is protected by the Block Protect (CMP, SEC, TB, BP2, BP1, and BP0) bits or the Individual
Block/Sector Locks.
/CS
Mode 3 0 1 2 3 4 5 6 7 8 9 29 30 31 Mode 3
CLK Mode 0 Mode 0

DI
23 22 2 1 0
(IO0)
*
DO High Impedance
(IO1)
* = MSB
Figure 32. 32KB Block Erase Instruction

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W25Q64JV
64KB Block Erase (D8h)

The Block Erase instruction sets all memory within a specified block (64K-bytes) to the erased state of all
1s (FFh). A Write Enable instruction must be executed before the device will accept the Block Erase
shifting the instruction code “D8h” followed a 24-bit block address (A23-A0). The Block Erase instruction
Block Erase instruction will not be executed. After /CS is driven high, the self-timed Block Erase instruction
will commence for a time duration of tBE (See AC Characteristics). While the Block Erase cycle is in
bit. The BUSY bit is a 1 during the Block Erase cycle and becomes a 0 when the cycle is finished and the
device is ready to accept other instructions again. After the Block Erase cycle has finished the Write Enable
Latch (WEL) bit in the Status Register is cleared to 0. The Block Erase instruction will not be executed if the
addressed page is protected by the Block Protect (CMP, SEC, TB, BP2, BP1, and BP0) bits or the Individual
Block/Sector Locks.
/CS
Mode 3 0 1 2 3 4 5 6 7 8 9 29 30 31 Mode 3
CLK Mode 0 Mode 0
Instruction (D8h) 24-Bit Address

DI
23 22 2 1 0
(IO0)
*
DO High Impedance
(IO1)
* = MSB
Figure 33. 64KB Block Erase Instruction

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W25Q64JV
Chip Erase (C7h / 60h)

The Chip Erase instruction sets all memory within the device to the erased state of all 1s (FFh). A Write
Enable instruction must be executed before the device will accept the Chip Erase Instruction (Status
Register bit WEL must equal 1). The instruction is initiated by driving the /CS pin low and shifting the
instruction code “C7h” or “60h”. The Chip Erase instruction sequence is shown in Figure 34.
The /CS pin must be driven high after the eighth bit has been latched. If this is not done the Chip Erase
instruction will not be executed. After /CS is driven high, the self-timed Chip Erase instruction will commence
for a time duration of tCE (See AC Characteristics). While the Chip Erase cycle is in progress, the Read
Status Register instruction may still be accessed to check the status of the BUSY bit. The BUSY bit is a 1
during the Chip Erase cycle and becomes a 0 when finished and the device is ready to accept other
instructions again. After the Chip Erase cycle has finished the Write Enable Latch (WEL) bit in the Status
Register is cleared to 0. The Chip Erase instruction will not be executed if any memory region is protected
by the Block Protect (CMP, SEC, TB, BP2, BP1, and BP0) bits or the Individual Block/Sector Locks.
/CS
Mode 3 0 1 2 3 4 5 6 7 Mode 3
CLK Mode 0 Mode 0
Instruction (C7h/60h)
DI
(IO0)
DO High Impedance
(IO1)
Figure 34. Chip Erase Instruction

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W25Q64JV
Erase / Program Suspend (75h)

The Erase/Program Suspend instruction “75h”, allows the system to interrupt a Sector or Block Erase
operation or a Page Program operation and then read from or program/erase data to, any other sectors or
blocks. The Erase/Program Suspend instruction sequence is shown in Figure 35.
The Write Status Register instruction (01h) and Erase instructions (20h, 52h, D8h, C7h, 60h, 44h) are not
allowed during Erase Suspend. Erase Suspend is valid only during the Sector or Block erase operation. If
written during the Chip Erase operation, the Erase Suspend instruction is ignored. The Write Status Register
instruction (01h) and Program instructions (02h, 32h, 42h) are not allowed during Program Suspend.
Program Suspend is valid only during the Page Program or Quad Page Program operation.
The Erase/Program Suspend instruction “75h” will be accepted by the device only if the SUS bit in the Status
Register equals to 0 and the BUSY bit equals to 1 while a Sector or Block Erase or a Page Program
operation is on-going. If the SUS bit equals to 1 or the BUSY bit equals to 0, the Suspend instruction will be
ignored by the device. A maximum of time of “t SUS” (See AC Characteristics) is required to suspend the
erase or program operation. The BUSY bit in the Status Register will be cleared from 1 to 0 within “tSUS” and
the SUS bit in the Status Register will be set from 0 to 1 immediately after Erase/Program Suspend. For a
previously resumed Erase/Program operation, it is also required that the Suspend instruction “75h” is not
issued earlier than a minimum of time of “tSUS” following the preceding Resume instruction “7Ah”.
Unexpected power off during the Erase/Program suspend state will reset the device and release the
suspend state. SUS bit in the Status Register will also reset to 0. The data within the page, sector or block
that was being suspended may become corrupted. It is recommended for the user to implement system
design techniques against the accidental power interruption and preserve data integrity during
erase/program suspend state.
/CS
tSUS
Mode 3 0 1 2 3 4 5 6 7 Mode 3
CLK Mode 0 Mode 0
Instruction (75h)
DI
(IO0)
DO High Impedance
(IO1)
Accept instructions
Figure 35. Erase/Program Suspend Instruction

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W25Q64JV
Erase / Program Resume (7Ah)

The Erase/Program Resume instruction “7Ah” must be written to resume the Sector or Block Erase
operation or the Page Program operation after an Erase/Program Suspend. The Resume instruction “7Ah”
will be accepted by the device only if the SUS bit in the Status Register equals to 1 and the BUSY bit equals
to 0. After issued the SUS bit will be cleared from 1 to 0 immediately, the BUSY bit will be set from 0 to 1
within 200ns and the Sector or Block will complete the erase operation or the page will complete the program
operation. If the SUS bit equals to 0 or the BUSY bit equals to 1, the Resume instruction “7Ah” will be
ignored by the device. The Erase/Program Resume instruction sequence is shown in Figure 36.
Resume instruction is ignored if the previous Erase/Program Suspend operation was interrupted by
unexpected power off. It is also required that a subsequent Erase/Program Suspend instruction not to be
issued within a minimum of time of “tSUS” following a previous Resume instruction.
/CS
Mode 3 0 1 2 3 4 5 6 7 Mode 3
CLK Mode 0 Mode 0
Instruction (7Ah)
DI
(IO0)
Resume previously
suspended Program or
Erase
Figure 36. Erase/Program Resume Instruction

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W25Q64JV
Power-down (B9h)
Although the standby current during normal operation is relatively low, standby current can be further
reduced with the Power-down instruction. The lower power consumption makes the Power-down instruction
especially useful for battery powered applications (See ICC1 and ICC2 in AC Characteristics). The
instruction is initiated by driving the /CS pin low and shifting the instruction code “B9h” as shown in Figure
37.
The /CS pin must be driven high after the eighth bit has been latched. If this is not done the Power-down
instruction will not be executed. After /CS is driven high, the power-down state will entered within the time
duration of tDP (See AC Characteristics). While in the power-down state only the Release Power-down /
Device ID (ABh) instruction, which restores the device to normal operation, will be recognized. All other
instructions are ignored. This includes the Read Status Register instruction, which is always available during
normal operation. Ignoring all but one instruction makes the Power Down state a useful condition for
securing maximum write protection. The device always powers-up in the normal operation with the standby
current of ICC1.
/CS
tDP
Mode 3 0 1 2 3 4 5 6 7 Mode 3
CLK Mode 0 Mode 0
Instruction (B9h)
DI
(IO0)
Stand-by current Power-down current
Figure 37. Deep Power-down Instruction

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W25Q64JV
Release Power-down / Device ID (ABh)

The Release from Power-down / Device ID instruction is a multi-purpose instruction. It can be used to
release the device from the power-down state, or obtain the devices electronic identification (ID) number.
To release the device from the power-down state, the instruction is issued by driving the /CS pin low, shifting
the instruction code “ABh” and driving /CS high as shown in Figure 38a. Release from power-down will take
the time duration of tRES1 (See AC Characteristics) before the device will resume normal operation and
other instructions are accepted. The /CS pin must remain high during the tRES1 time duration.
When used only to obtain the Device ID while not in the power-down state, the instruction is initiated by
driving the /CS pin low and shifting the instruction code “ABh” followed by 3-dummy bytes. The Device ID
bits are then shifted out on the falling edge of CLK with most significant bit (MSB) first. The Device ID value
for the W25Q64JV is listed in Manufacturer and Device Identification table. The Device ID can be read
continuously. The instruction is completed by driving /CS high.
When used to release the device from the power-down state and obtain the Device ID, the instruction is the
same as previously described, and shown in Figure 38b, except that after /CS is driven high it must remain
high for a time duration of tRES2 (See AC Characteristics). After this time duration the device will resume
normal operation and other instructions will be accepted. If the Release from Power-down / Device ID
instruction is issued while an Erase, Program or Write cycle is in process (when BUSY equals 1) the
instruction is ignored and will not have any effects on the current cycle.
/CS
tRES1
Mode 3 0 1 2 3 4 5 6 7 Mode 3
CLK Mode 0 Mode 0
Instruction (ABh)
DI
(IO0)
Power-down current Stand-by current
Figure 38a. Release Power-down Instruction
/CS
Mode 3 0 1 2 3 4 5 6 7 8 9 29 30 31 32 33 34 35 36 37 38 Mode 3
CLK Mode 0 Mode 0
Instruction (ABh) 3 Dummy Bytes tRES2

DI
23 22 2 1 0
(IO0)
* Device ID
DO High Impedance
7 6 5 4 3 2 1 0
(IO1)
*
* = MSB Power-down current Stand-by current
Figure 38c. Release Power-down / Device ID Instruction

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W25Q64JV
Read Manufacturer / Device ID (90h)

The Read Manufacturer/Device ID instruction is an alternative to the Release from Power-down / Device ID
instruction that provides both the JEDEC assigned manufacturer ID and the specific device ID.
The Read Manufacturer/Device ID instruction is very similar to the Release from Power-down / Device ID
instruction. The instruction is initiated by driving the /CS pin low and shifting the instruction code “90h”
followed by a 24-bit address (A23-A0) of 000000h. After which, the Manufacturer ID for Winbond (EFh) and
the Device ID are shifted out on the falling edge of CLK with most significant bit (MSB) first as shown in
Figure 39. The Device ID values for the W25Q64JV are listed in Manufacturer and Device Identification
table. The instruction is completed by driving /CS high.
/CS
Mode 3 0 1 2 3 4 5 6 7 8 9 10 28 29 30 31
CLK Mode 0
Instruction (90h) Address (000000h)

DI
23 22 21 3 2 1 0
(IO0)
*
DO High Impedance
(IO1)
* = MSB
/CS
31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 Mode 3
CLK Mode 0
DI
0
(IO0)
DO
7 6 5 4 3 2 1 0
(IO1)
Manufacturer ID (EFh) * Device ID
Figure 39. Read Manufacturer / Device ID Instruction

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W25Q64JV
Read Manufacturer / Device ID Dual I/O (92h)

The Read Manufacturer / Device ID Dual I/O instruction is an alternative to the Read Manufacturer / Device
ID instruction that provides both the JEDEC assigned manufacturer ID and the specific device ID at 2x
speed.
The Read Manufacturer / Device ID Dual I/O instruction is similar to the Fast Read Dual I/O instruction. The
instruction is initiated by driving the /CS pin low and shifting the instruction code “92h” followed by a 24-bit
address (A23-A0) of 000000h, but with the capability to input the Address bits two bits per clock. After which,
the Manufacturer ID for Winbond (EFh) and the Device ID are shifted out 2 bits per clock on the falling edge
of CLK with most significant bits (MSB) first as shown in Figure 40. The Device ID values for the W25Q64JV
are listed in Manufacturer and Device Identification table. The Manufacturer and Device IDs can be read
continuously, alternating from one to the other. The instruction is completed by driving /CS high.
/CS
Mode 3 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23
CLK Mode 0
Instruction (92h) A23-16 A15-8 A7-0 (00h) M7-0

DI
6 4 2 0 6 4 2 0 6 4 2 0 6 4 2 0
(IO0)
DO High Impedance
7 5 3 1 7 5 3 1 7 5 3 1 7 5 3 1
(IO1) = MSB
* * * * *
/CS
23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 Mode 3
CLK Mode 0
IOs switch from
Input to Output
DI
0 6 4 2 0 6 4 2 0 6 4 2 0 6 4 2 0
(IO0)
DO
1 7 5 3 1 7 5 3 1 7 5 3 1 7 5 3 1
(IO1)
* MFR ID * Device ID * MFR ID
(repeat)
* Device ID
(repeat)
Figure 40. Read Manufacturer / Device ID Dual I/O Instruction
Note:
The “Continuous Read Mode” bits M(7-0) must be set to Fxh to be compatible with Fast Read Dual I/O instruction.

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W25Q64JV
Read Manufacturer / Device ID Quad I/O (94h)

The Read Manufacturer / Device ID Quad I/O instruction is an alternative to the Read Manufacturer / Device
ID instruction that provides both the JEDEC assigned manufacturer ID and the specific device ID at 4x
speed.
The Read Manufacturer / Device ID Quad I/O instruction is similar to the Fast Read Quad I/O instruction.
The instruction is initiated by driving the /CS pin low and shifting the instruction code “94h” followed by a
four clock dummy cycles and then a 24-bit address (A23-A0) of 000000h, but with the capability to input the
Address bits four bits per clock. After which, the Manufacturer ID for Winbond (EFh) and the Device ID are
shifted out four bits per clock on the falling edge of CLK with most significant bit (MSB) first as shown in
Figure 41. The Manufacturer and Device IDs can be read continuously, alternating from one to the other.
The instruction is completed by driving /CS high.
/CS
Mode 3 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23
CLK Mode 0
A7-0 IOs switch from
Instruction (94h) A23-16 A15-8
(00h)
M7-0 Dummy Dummy
Input to Output
IO0 4 0 4 0 4 0 4 0 4 0 4 0
High Impedance
IO1 5 1 5 1 5 1 5 1 5 1 5 1
High Impedance
IO2 6 2 6 2 6 2 6 2 6 2 6 2
High Impedance
IO3 7 3 7 3 7 3 7 3 7 3 7 3
MFR ID Device ID
/CS
23 24 25 26 27 28 29 30 Mode 3
CLK Mode 0
IO0 0 4 0 4 0 4 0 4 0
IO1 1 5 1 5 1 5 1 5 1
IO2 2 6 2 6 2 6 2 6 2
IO3 3 7 3 7 3 7 3 7 3
MFR ID Device ID MFR ID Device ID
(repeat) (repeat) (repeat) (repeat)
Figure 41. Read Manufacturer / Device ID Quad I/O Instruction
Note:
The “Continuous Read Mode” bits M(7-0) must be set to Fxh to be compatible with Fast Read Quad I/O instruction.

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W25Q64JV
Read Unique ID Number (4Bh)

The Read Unique ID Number instruction accesses a factory-set read-only 64-bit number that is unique to
each W25Q64JV device. The ID number can be used in conjunction with user software methods to help
prevent copying or cloning of a system. The Read Unique ID instruction is initiated by driving the /CS pin
low and shifting the instruction code “4Bh” followed by a four bytes of dummy clocks. After which, the 64-bit
ID is shifted out on the falling edge of CLK as shown in Figure 42.
/CS
Mode 3 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23
CLK Mode 0
Instruction (4Bh) Dummy Byte 1 Dummy Byte 2

DI
(IO0)
DO High Impedance
(IO1)
/CS
100
101
102
23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 Mode 3
CLK Mode 0
Dummy Byte 3 Dummy Byte 4

DI
(IO0)
DO High Impedance
63 62 61 2 1 0
(IO1)
* = MSB
* 64-bit Unique Serial Number
Figure 42. Read Unique ID Number Instruction

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W25Q64JV
Read JEDEC ID (9Fh)

For compatibility reasons, the W25Q64JV provides several instructions to electronically determine the
identity of the device. The Read JEDEC ID instruction is compatible with the JEDEC standard for SPI
compatible serial memories that was adopted in 2003. The instruction is initiated by driving the /CS pin low
and shifting the instruction code “9Fh”. The JEDEC assigned Manufacturer ID byte for Winbond (EFh) and
two Device ID bytes, Memory Type (ID15-ID8) and Capacity (ID7-ID0) are then shifted out on the falling
edge of CLK with most significant bit (MSB) first as shown in Figure 43. For memory type and capacity
values refer to Manufacturer and Device Identification table.
/CS
Mode 3 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15
CLK Mode 0
Instruction (9Fh)
DI
(IO0)
Manufacturer ID (EFh)
DO High Impedance
(IO1)
* = MSB
/CS
15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 Mode 3
CLK Mode 0
DI
(IO0)
Memory Type ID15-8 Capacity ID7-0
DO
7 6 5 4 3 2 1 0 7 6 5 4 3 2 1 0
(IO1)
* *
Figure 43. Read JEDEC ID Instruction

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W25Q64JV
Read SFDP Register (5Ah)

The W25Q64JV features a 256-Byte Serial Flash Discoverable Parameter (SFDP) register that contains
information about device configurations, available instructions and other features. The SFDP parameters
are stored in one or more Parameter Identification (PID) tables. Currently only one PID table is specified,
but more may be added in the future. The Read SFDP Register instruction is compatible with the SFDP
standard initially established in 2010 for PC and other applications, as well as the JEDEC standard
JESD216-serials that is published in 2011. Most Winbond SpiFlash Memories shipped after June 2011 (date
code 1124 and beyond) support the SFDP feature as specified in the applicable datasheet.
The Read SFDP instruction is initiated by driving the /CS pin low and shifting the instruction code “5Ah”
followed by a 24-bit address (A23-A0)(1) into the DI pin. Eight “dummy” clocks are also required before the
SFDP register contents are shifted out on the falling edge of the 40 th CLK with most significant bit (MSB)
first as shown in Figure 44. For SFDP register values and descriptions, please refer to the Winbond
Application Note for SFDP Definition Table.
Note 1: A23-A8 = 0; A7-A0 are used to define the starting byte address for the 256-Byte SFDP Register.
/CS
Mode 3 0 1 2 3 4 5 6 7 8 9 10 28 29 30 31
CLK Mode 0
Instruction (5Ah) 24-Bit Address

DI
23 22 21 3 2 1 0
(IO0)
*
DO High Impedance
(IO1)
/CS
31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55
CLK
Dummy Byte
DI
0 7 6 5 4 3 2 1 0
(IO0)
DO High Impedance
7 6 5 4 3 2 1 0 7 6 5 4 3 2 1 0 7
(IO1)
= MSB
* * *
Figure 44. Read SFDP Register Instruction Sequence Diagram

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W25Q64JV
Erase Security Registers (44h)

The W25Q64JV offers three 256-byte Security Registers which can be erased and programmed individually.
These registers may be used by the system manufacturers to store security and other important information
separately from the main memory array.
The Erase Security Register instruction is similar to the Sector Erase instruction. A Write Enable instruction
must be executed before the device will accept the Erase Security Register Instruction (Status Register bit
WEL must equal 1). The instruction is initiated by driving the /CS pin low and shifting the instruction code
“44h” followed by a 24-bit address (A23-A0) to erase one of the three security registers.
ADDRESS A23-16 A15-12 A11-8 A7-0

Security Register #1 00h 0001 0000 Don’t Care
The Erase Security Register instruction sequence is shown in Figure 45. The /CS pin must be driven high
after the eighth bit of the last byte has been latched. If this is not done the instruction will not be executed.
After /CS is driven high, the self-timed Erase Security Register operation will commence for a time duration
of tSE (See AC Characteristics). While the Erase Security Register cycle is in progress, the Read Status
Register instruction may still be accessed for checking the status of the BUSY bit. The BUSY bit is a 1 during
the erase cycle and becomes a 0 when the cycle is finished and the device is ready to accept other
instructions again. After the Erase Security Register cycle has finished the Write Enable Latch (WEL) bit in
the Status Register is cleared to 0. The Security Register Lock Bits (LB3-1) in the Status Register-2 can be
used to OTP protect the security registers. Once a lock bit is set to 1, the corresponding security register
will be permanently locked, Erase Security Register instruction to that register will be ignored (Refer to
section 7.1.8 for detail descriptions).
/CS
Mode 3 0 1 2 3 4 5 6 7 8 9 29 30 31 Mode 3
CLK Mode 0 Mode 0

DI
23 22 2 1 0
(IO0)
*
DO High Impedance
(IO1)
* = MSB
Figure 45. Erase Security Registers Instruction

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W25Q64JV
Program Security Registers (42h)

The Program Security Register instruction is similar to the Page Program instruction. It allows from one byte
to 256 bytes of security register data to be programmed at previously erased (FFh) memory locations. A
Write Enable instruction must be executed before the device will accept the Program Security Register
Instruction (Status Register bit WEL= 1). The instruction is initiated by driving the /CS pin low then shifting
the instruction code “42h” followed by a 24-bit address (A23-A0) and at least one data byte, into the DI pin.
The /CS pin must be held low for the entire length of the instruction while data is being sent to the device.
ADDRESS A23-16 A15-12 A11-8 A7-0

Security Register #1 00h 0001 0000 Byte Address
The Program Security Register instruction sequence is shown in Figure 46. The Security Register Lock Bits
(LB3-1) in the Status Register-2 can be used to OTP protect the security registers. Once a lock bit is set to
1, the corresponding security register will be permanently locked, Program Security Register instruction to
that register will be ignored (See 7.1.8, 8.2.25 for detail descriptions).
/CS
Mode 3 0 1 2 3 4 5 6 7 8 9 10 28 29 30 31 32 33 34 35 36 37 38 39
CLK Mode 0
Instruction (42h) 24-Bit Address Data Byte 1

DI
23 22 21 3 2 1 0 7 6 5 4 3 2 1 0
(IO0)
* *
* = MSB
/CS
2072
2073
2074
2075
2076
2077
2078
2079
39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 Mode 3
CLK Mode 0
Data Byte 2 Data Byte 3 Data Byte 256

DI
0 7 6 5 4 3 2 1 0 7 6 5 4 3 2 1 0 7 6 5 4 3 2 1 0
(IO0)
* * *
Figure 46. Program Security Registers Instruction

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W25Q64JV
Read Security Registers (48h)

The Read Security Register instruction is similar to the Fast Read instruction and allows one or more data
bytes to be sequentially read from one of the four security registers. The instruction is initiated by driving
the /CS pin low and then shifting the instruction code “48h” followed by a 24-bit address (A23-A0) and eight
“dummy” clocks into the DI pin. The code and address bits are latched on the rising edge of the CLK pin.
After the address is received, the data byte of the addressed memory location will be shifted out on the DO
pin at the falling edge of CLK with most significant bit (MSB) first. The byte address is automatically
incremented to the next byte address after each byte of data is shifted out. Once the byte address reaches
the last byte of the register (byte address FFh), it will reset to address 00h, the first byte of the register, and
continue to increment. The instruction is completed by driving /CS high. The Read Security Register
instruction sequence is shown in Figure 47. If a Read Security Register instruction is issued while an Erase,
Program or Write cycle is in process (BUSY=1) the instruction is ignored and will not have any effects on
the current cycle. The Read Security Register instruction allows clock rates from D.C. to a maximum of F R
(see AC Electrical Characteristics).
ADDRESS A23-16 A15-12 A11-8 A7-0

/CS
Mode 3 0 1 2 3 4 5 6 7 8 9 10 28 29 30 31
CLK Mode 0

DI
23 22 21 3 2 1 0
(IO0)
*
DO High Impedance
(IO1)
* = MSB
/CS
31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55
CLK
Dummy Byte
DI
0 7 6 5 4 3 2 1 0
(IO0)
DO High Impedance
7 6 5 4 3 2 1 0 7 6 5 4 3 2 1 0 7
(IO1)
* *
Figure 47. Read Security Registers Instruction

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W25Q64JV
Individual Block/Sector Lock (36h)

The Individual Block/Sector Lock provides an alternative way to protect the memory array from adverse
Erase/Program. In order to use the Individual Block/Sector Locks, the WPS bit in Status Register-3 must be
set to 1. If WPS=0, the write protection will be determined by the combination of CMP, SEC, TB, BP[2:0]
bits in the Status Registers. The Individual Block/Sector Lock bits are volatile bits. The default values after
device power up or after a Reset are 1, so the entire memory array is being protected.
To lock a specific block or sector as illustrated in Figure 4d, an Individual Block/Sector Lock command must
be issued by driving /CS low, shifting the instruction code “36h” into the Data Input (DI) pin on the rising
edge of CLK, followed by a 24-bit address and then driving /CS high. A Write Enable instruction must be
executed before the device will accept the Individual Block/Sector Lock Instruction (Status Register bit
WEL= 1).
/CS
Mode 3 0 1 2 3 4 5 6 7 8 9 29 30 31 Mode 3
CLK Mode 0 Mode 0

DI
23 22 2 1 0
(IO0)
*
DO High Impedance
(IO1)
* = MSB
Figure 53. Individual Block/Sector Lock Instruction

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W25Q64JV
Individual Block/Sector Unlock (39h)

To unlock a specific block or sector as illustrated in Figure 4d, an Individual Block/Sector Unlock command
must be issued by driving /CS low, shifting the instruction code “39h” into the Data Input (DI) pin on the
rising edge of CLK, followed by a 24-bit address and then driving /CS high. A Write Enable instruction must
be executed before the device will accept the Individual Block/Sector Unlock Instruction (Status Register bit
WEL= 1).
/CS
Mode 3 0 1 2 3 4 5 6 7 8 9 29 30 31 Mode 3
CLK Mode 0 Mode 0

DI
23 22 2 1 0
(IO0)
*
DO High Impedance
(IO1)
* = MSB
Figure 54. Individual Block Unlock Instruction

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W25Q64JV
Read Block/Sector Lock (3Dh)

To read out the lock bit value of a specific block or sector as illustrated in Figure 4d, a Read Block/Sector
Lock command must be issued by driving /CS low, shifting the instruction code “3Dh” into the Data Input
(DI) pin on the rising edge of CLK, followed by a 24-bit address. The Block/Sector Lock bit value will be
shifted out on the DO pin at the falling edge of CLK with most significant bit (MSB) first as shown in Figure
55. If the least significant bit (LSB) is 1, the corresponding block/sector is locked; if LSB=0, the
corresponding block/sector is unlocked, Erase/Program operation can be performed.
/CS
Mode 3 0 1 2 3 4 5 6 7 8 9 10 28 29 30 31 32 33 34 35 36 37 38 39 Mode 3
CLK Mode 0 Mode 0
Instruction (3Dh) 24-Bit Address

DI
23 22 21 3 2 1 0
(IO0)
* Lock Value Out
DO High Impedance
X X X X X X X 0
(IO1)
* = MSB *
Figure 55. Read Block Lock Instruction

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W25Q64JV
Global Block/Sector Lock (7Eh)

All Block/Sector Lock bits can be set to 1 by the Global Block/Sector Lock instruction. The command must
be issued by driving /CS low, shifting the instruction code “7Eh” into the Data Input (DI) pin on the rising
edge of CLK, and then driving /CS high. A Write Enable instruction must be executed before the device will
accept the Global Block/Sector Lock Instruction (Status Register bit WEL= 1).
/CS
Mode 3 0 1 2 3 4 5 6 7 Mode 3
CLK Mode 0 Mode 0
Instruction (7Eh)
DI
(IO0)
DO High Impedance
(IO1)
Figure 56. Global Block Lock Instruction for SPI Mode
Global Block/Sector Unlock (98h)

All Block/Sector Lock bits can be set to 0 by the Global Block/Sector Unlock instruction. The command must
be issued by driving /CS low, shifting the instruction code “98h” into the Data Input (DI) pin on the rising
edge of CLK, and then driving /CS high. A Write Enable instruction must be executed before the device will
accept the Global Block/Sector Unlock Instruction (Status Register bit WEL= 1).
/CS
Mode 3 0 1 2 3 4 5 6 7 Mode 3
CLK Mode 0 Mode 0
Instruction (98h)
DI
(IO0)
DO High Impedance
(IO1)
Figure 57. Global Block Unlock Instruction for SPI Mode

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W25Q64JV
Enable Reset (66h) and Reset Device (99h)

Because of the small package and the limitation on the number of pins, the W25Q64JV provide a software
Reset instruction instead of a dedicated RESET pin. Once the Reset instruction is accepted, any on-going
internal operations will be terminated and the device will return to its default power-on state and lose all the
current volatile settings, such as Volatile Status Register bits, Write Enable Latch (WEL) status,
Program/Erase Suspend status, Read parameter setting (P7-P0), and Wrap Bit setting (W6-W4).
“Enable Reset (66h)” and “Reset (99h)” instructions can be issued in SPI mode. To avoid accidental reset,
both instructions must be issued in sequence. Any other commands other than “Reset (99h)” after the
“Enable Reset (66h)” command will disable the “Reset Enable” state. A new sequence of “Enable Reset
(66h)” and “Reset (99h)” is needed to reset the device. Once the Reset command is accepted by the device,
the device will take approximately tRST=30us to reset. During this period, no command will be accepted.
Data corruption may happen if there is an on-going or suspended internal Erase or Program operation when
Reset command sequence is accepted by the device. It is recommended to check the BUSY bit and the
SUS bit in Status Register before issuing the Reset command sequence.
/CS
Mode 3 0 1 2 3 4 5 6 7 Mode 3 0 1 2 3 4 5 6 7 Mode 3

CLK Mode 0 Mode 0 Mode 0
Instruction (66h) Instruction (99h)

DI
(IO0)
DO High Impedance
(IO1)
Figure 58. Enable Reset and Reset Instruction Sequence

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W25Q64JV
9. ELECTRICAL CHARACTERISTICS
9.1 Absolute Maximum Ratings (1)

PARAMETERS SYMBOL CONDITIONS RANGE UNIT
Supply Voltage VCC –0.6 to 4.6 V
Voltage Applied to Any Pin VIO Relative to Ground –0.6 to VCC+0.4 V
<20nS Transient
Transient Voltage on any Pin VIOT –2.0V to VCC+2.0V V
Relative to Ground
Storage Temperature TSTG –65 to +150 °C
Lead Temperature TLEAD See Note (2) °C
Electrostatic Discharge Voltage VESD Human Body Model(3) –2000 to +2000 V
Notes:
1. This device has been designed and tested for the specified operation ranges. Proper operation outside
of these levels is not guaranteed. Exposure to absolute maximum ratings may affect device reliability.
Exposure beyond absolute maximum ratings may cause permanent damage.
2. Compliant with JEDEC Standard J-STD-20C for small body Sn-Pb or Pb-free (Green) assembly and the
European directive on restrictions on hazardous substances (RoHS) 2002/95/EU.
3. JEDEC Std JESD22-A114A (C1=100pF, R1=1500 ohms, R2=500 ohms).
9.2 Operating Ranges

SPEC
PARAMETER SYMBOL CONDITIONS UNIT
MIN MAX
FR = 133MHz, fR = 50MHz 3.0 3.6 V
Supply Voltage(1) VCC
FR = 104MHz, fR = 50MHz 2.7 3.0 V
Ambient Temperature, Industrial –40 +85 °C
TA
Operating Industrial Plus –40 +105 °C
Note:
1. VCC voltage during Read can operate across the min and max range but should not exceed ±10% of
the programming (erase/write) voltage.

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W25Q64JV
9.3 Power-Up Power-Down Timing and Requirements

SPEC
PARAMETER SYMBOL UNIT
MIN MAX
VCC (min) to /CS Low tVSL(1) 20 µs
Time Delay Before Write Instruction tPUW(1) 5 ms
Write Inhibit Threshold Voltage VWI (1)
1.0 2.0 V
Note:
1. These parameters are characterized only.
VCC
VCC (max)
Program, Erase and Write Instructions are ignored
/CS must track VCC
VCC (min)
tVSL Read Instructions Device is fully
Reset Allowed Accessible
State
VWI
tPUW
Time
Figure 58a. Power-up Timing and Voltage Levels
/C S m u s t tr a c k V C C
d u r in g V C C R a m p U p /D o w n
VCC
/C S
T im e
Figure 58b. Power-up, Power-Down Requirement

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W25Q64JV
9.4 DC Electrical Characteristics-

SPEC
PARAMETER SYMBOL CONDITIONS UNIT
MIN TYP MAX
Input Capacitance CIN(1) VIN = 0V(1) 6 pF
Output Capacitance Cout(1) VOUT = 0V(1) 8 pF
Input Leakage ILI ±2 µA
I/O Leakage ILO ±2 µA
/CS = VCC,
Standby Current ICC1 10 50 µA
VIN = GND or VCC
/CS = VCC,
Power-down Current ICC2 1 15 µA
VIN = GND or VCC
Current Read Data / C = 0.1 VCC / 0.9 VCC
ICC3 8 15 mA
Dual /Quad 50MHz(2) DO = Open
Current Read Data / C = 0.1 VCC / 0.9 VCC
ICC3 10 18 mA
Dual /Quad 80MHz(2) DO = Open
Current Read Data /
Dual Output Read/Quad C = 0.1 VCC / 0.9 VCC
ICC3 12 20 mA
DO = Open
Output Read 104MHz(2)
Current Write Status
ICC4 /CS = VCC 20 25 mA
Register
Current Page Program ICC5 /CS = VCC 20 25 mA
Current Sector/Block
ICC6 /CS = VCC 20 25 mA
Erase
Current Chip Erase ICC7 /CS = VCC 20 25 mA
Input Low Voltage VIL –0.5 VCC x 0.3 V
Input High Voltage VIH VCC x 0.7 VCC + 0.4 V
Output Low Voltage VOL IOL = 100 µA 0.2 V
Output High Voltage VOH IOH = –100 µA VCC – 0.2 V
Notes:
1. Tested on sample basis and specified through design and characterization data. TA = 25° C, VCC = 3.0V.
2. Checker Board Pattern.

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W25Q64JV
9.5 AC Measurement Conditions

SPEC
PARAMETER SYMBOL UNIT
MIN MAX
Load Capacitance CL 30 pF
Input Rise and Fall Times TR, TF 5 ns
Input Pulse Voltages VIN 0.1 VCC to 0.9 VCC V
Input Timing Reference Voltages IN 0.3 VCC to 0.7 VCC V
Output Timing Reference Voltages OUT 0.5 VCC to 0.5 VCC V
Note:
1. Output Hi-Z is defined as the point where data out is no longer driven.
Input and Output

Input Levels Timing Reference Levels
0.9 VCC
0.5 VCC
0.1 VCC
Figure 59. AC Measurement I/O Waveform

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W25Q64JV
9.6 AC Electrical Characteristics(6)

SPEC
DESCRIPTION SYMBOL ALT UNIT
MIN TYP MAX
Clock frequency except for Read Data (03h) FR fC1 D.C. 133 MHz
instructions (3.0V-3.6V)
Clock frequency except for Read Data (03h) FR fC2 D.C. 104 MHz
instructions( 2.7V-3.0V)
Clock frequency for Read Data instruction (03h) fR D.C. 50 MHz
Clock High, Low Time tCLH, 45%

tCLL(1) ns
for all instructions except for Read Data (03h) PC
Clock High, Low Time tCRLH, 45%

ns
for Read Data (03h) instruction tCRLL(1) PC
Clock Rise Time peak to peak tCLCH(2) 0.1 V/ns
Clock Fall Time peak to peak tCHCL(2) 0.1 V/ns
/CS Active Setup Time relative to CLK tSLCH tCSS 3 ns
/CS Not Active Hold Time relative to CLK tCHSL 3 ns
Data In Setup Time tDVCH tDSU 1 ns
Data In Hold Time tCHDX tDH 2 ns
/CS Active Hold Time relative to CLK tCHSH 3 ns
/CS Not Active Setup Time relative to CLK tSHCH 3 ns
/CS Deselect Time (for Read) tSHSL1 tCSH 10 ns
/CS Deselect Time (for Erase or Program or Write) tSHSL2 tCSH 50 ns
Output Disable Time tSHQZ(2) tDIS 7 ns
Clock Low to Output Valid

tCLQV tV 6 ns
2.7V-3.6V
Output Hold Time tCLQX tHO 1.5 ns

Continued – next page AC Electrical Characteristics (cont’d)

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W25Q64JV
SPEC
DESCRIPTION SYMBOL ALT UNIT
MIN TYP MAX
Write Protect Setup Time Before /CS Low tWHSL(3) 20 ns
Write Protect Hold Time After /CS High tSHWL(3) 100 ns
/CS High to Power-down Mode tDP(2) 3 µs
/CS High to Standby Mode without ID Read tRES1(2) 3 µs
/CS High to Standby Mode with ID Read tRES2(2) 1.8 µs
/CS High to next Instruction after Suspend tSUS(2) 20 µs
/CS High to next Instruction after Reset tRST(2) 30 µs
/RESET pin Low period to reset the device tRESET(2) 1(5) µs
Write Status Register Time tW 10 15 ms
Page Program Time tPP 0.4 3 ms
Sector Erase Time (4KB) tSE 45 400 ms
Block Erase Time (32KB) tBE1 120 1,600 ms
Block Erase Time (64KB) tBE2 150 2,000 ms
Chip Erase Time tCE 20 100 s

Notes:
1. Clock high or Clock low must be more than or equal to 45%Pc. Pc=1/fC(MAX)
2. Value guaranteed by design and/or characterization, not 100% tested in production.
3. Only applicable as a constraint for a Write Status Register instruction when SRP=1.
4. It’s possible to reset the device with shorter tRESET (as short as a few hundred ns), a 1us minimum is recommended to ensure reliable
operation.
5. Tested on sample basis and specified through design and characterization data. T A = 25° C, VCC = 3.0V, 25% driver strength.
6. 4-bytes address alignment for Quad Read, start address from [A1,A0]=(0,0).

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W25Q64JV
9.7 Serial Output Timing
/CS
tCLH
CLK
tCLQV tCLQV tCLL tSHQZ
tCLQX tCLQX
IO
MSB OUT LSB OUT
output
9.8 Serial Input Timing
/CS
tSHSL
tCHSL tSLCH tCHSH tSHCH
CLK
tDVCH tCHDX tCLCH tCHCL
IO
MSB IN LSB IN
input
9.9 /WP Timing

/CS
tWHSL tSHWL
/WP
CLK
IO
input
Write Status Register is allowed Write Status Register is not allowed

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W25Q64JV
10. PACKAGE SPECIFICATIONS
10.1 8-Pin SOIC 208-mil (Package Code SS)
Millimeters Inches
Symbol
Min Nom Max Min Nom Max
A 1.75 1.95 2.16 0.069 0.077 0.085
A1 0.05 0.15 0.25 0.002 0.006 0.010
A2 1.70 1.80 1.91 0.067 0.071 0.075
b 0.35 0.42 0.48 0.014 0.017 0.019
C 0.19 0.20 0.25 0.007 0.008 0.010
D 5.18 5.28 5.38 0.204 0.208 0.212
D1 5.13 5.23 5.33 0.202 0.206 0.210
E 5.18 5.28 5.38 0.204 0.208 0.212
E1 5.13 5.23 5.33 0.202 0.206 0.210
e 1.27 BSC 0.050 BSC
H 7.70 7.90 8.10 0.303 0.311 0.319
L 0.50 0.65 0.80 0.020 0.026 0.031
y
--- --- 0.10 --- --- 0.004
θ 0° --- 8° 0° --- 8°

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W25Q64JV
10.2 8-Pad WSON 6x5-mm (Package Code ZP)
Millimeters Inches
Symbol
A 0.70 0.75 0.80 0.028 0.030 0.031
A1 0.00 0.02 0.05 0.000 0.001 0.002
b 0.35 0.40 0.48 0.014 0.016 0.019
C --- 0.20 REF --- --- 0.008 REF ---
D 5.90 6.00 6.10 0.232 0.236 0.240
D2 3.35 3.40 3.45 0.132 0.134 0.136
E 4.90 5.00 5.10 0.193 0.197 0.201
E2 4.25 4.30 4.35 0.167 0.169 0.171
e 1.27 BSC 0.050 BSC
L 0.55 0.60 0.65 0.022 0.024 0.026
y 0.00 --- 0.075 0.000 --- 0.003
Note:
The metal pad area on the bottom center of the package is not connected to any internal electrical signals. It can be left
floating or connected to the device ground (GND pin). Avoid placement of exposed PCB vias under the pad.

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W25Q64JV
10.3 8-Pad WSON 8x6mm (Package Code ZE)
MILLIMETERS INCHES
SYMBOL
A 0.70 0.75 0.80 0.028 0.030 0.031
A1 0.00 0.02 0.05 0.000 0.001 0.002
b 0.35 0.40 0.48 0.014 0.016 0.019
C --- 0.20 Ref. --- --- 0.008 Ref. ---
D 7.90 8.00 8.10 0.311 0.315 0.319
D2 3.35 3.40 3.45 0.132 0.134 0.136
E 5.90 6.00 6.10 0.232 0.236 0.240
E2 4.25 4.30 4.35 0.167 0.169 0.171
e 1.27 BSC 0.050 BSC
L 0.45 0.50 0.55 0.018 0.020 0.022
y 0.00 --- 0.05 0.000 --- 0.002
Note:
The metal pad area on the bottom center of the package is not connected to any internal electrical signals. It can be left
floating or connected to the device ground (GND pin). Avoid placement of exposed PCB vias under the pad.

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W25Q64JV
10.4 8-Pad XSON 4x4x0.45-mm (Package Code XG)

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W25Q64JV
10.5 16-Pin SOIC 300-mil (Package Code SF)
Millimeters Inches
Symbol
A 2.36 2.49 2.64 0.093 0.098 0.104
A1 0.10 --- 0.30 0.004 --- 0.012
A2 --- 2.31 --- --- 0.091 ---
b 0.33 0.41 0.51 0.013 0.016 0.020
C 0.18 0.23 0.28 0.007 0.009 0.011
D 10.08 10.31 10.49 0.397 0.406 0.413
E 10.01 10.31 10.64 0.394 0.406 0.419
E1 7.39 7.49 7.59 0.291 0.295 0.299
e 1.27 BSC 0.050 BSC
L 0.38 0.81 1.27 0.015 0.032 0.050
y --- --- 0.076 --- --- 0.003
θ 0° --- 8° 0° --- 8°

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W25Q64JV
10.7 24-Ball TFBGA 8x6-mm (Package Code TB, 5x5 Ball Array)
Note:
Ball land: 0.45mm. Ball Opening: 0.35mm
PCB ball land suggested <= 0.35mm
Millimeters Inches
Symbol
A --- --- 1.20 --- --- 0.047
A1 0.26 0.31 0.36 0.010 0.012 0.014
A2 --- 0.85 --- --- 0.033 ---
b 0.35 0.40 0.45 0.014 0.016 0.018
D 7.90 8.00 8.10 0.311 0.315 0.319
D1 4.00 BSC 0.157 BSC
E 5.90 6.00 6.10 0.232 0.236 0.240
E1 4.00 BSC 0.157 BSC
SE 1.00 TYP 0.039 TYP
SD 1.00 TYP 0.039 TYP
e 1.00 BSC 0.039 BSC
ccc --- --- 0.10 --- --- 0.0039

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W25Q64JV
10.8 24-Ball TFBGA 8x6-mm (Package Code TC, 6x4 ball array)
Note:
Ball land: 0.45mm. Ball Opening: 0.35mm
PCB ball land suggested <= 0.35mm
Millimeters Inches
Symbol
A --- --- 1.20 --- --- 0.047
A1 0.25 0.30 0.35 0.010 0.012 0.014
b 0.35 0.40 0.45 0.014 0.016 0.018
D 7.95 8.00 8.05 0.313 0.315 0.317
D1 5.00 BSC 0.197 BSC
E 5.95 6.00 6.05 0.234 0.236 0.238
E1 3.00 BSC 0.118 BSC
e 1.00 BSC 0.039 BSC
ccc --- --- 0.10 --- --- 0.039

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W25Q64JV
10.9 12-Ball WLCSP (Package Code BY)
Millimeters Inches
Symbol
A 0.432 0.472 0.512 0.017 0.019 0.020
A1 0.152 0.167 0.182 0.006 0.007 0.007
c 0.280 0.305 0.330 0.012 0.013 0.014
b 0.240 0.300 0.360 0.009 0.012 0.014
D1 1.200 0.0472
D2 0.301 0.0119
D3 0.301 0.0119
E1 2.200 0.0866
E2 0.396 0.0156
E3 0.396 0.0156
eD 0.5 BSC 0.020 BSC
eE 0.5 BSC 0.020 BSC
aaa 0.10 0.004
bbb 0.10 0.004
ccc 0.03 0.001
ddd 0.15 0.006
Notes:
1. Dimension b is measured at the maximum solder bump diameter, parallel to primary datum C.
2. Dimension D and E; please contact Winbond for details.

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W25Q64JV
11. ORDERING INFORMATION
W(1) 25Q 64J V xx(2) I

W = Winbond
25Q = SpiFlash Serial Flash Memory with 4KB sectors, Dual/Quad I/O
64J = 64M-bit
V = 2.7V to 3.6V
SS = 8-pin SOIC 208-mil SF = 16-pin SOIC 300-mil

ZP = WSON8 6x5-mm ZE = WSON8 8x6-mm
XG = XSON 4x4x0.45-mm TB = TFBGA 8x6-mm (5x5 ball array)
TC = TFBGA 8x6-mm (6x4 ball array) BY = 12-ball WLCSP
I = Industrial (-40°C to +85°C) J = Industrial Plus (-40°C to +105°C)
(3,4)
Q(5) = Green Package (Lead-free, RoHS Compliant, Halogen-free (TBBA), Antimony-Oxide-free Sb2O3)
with QE = 1 (fixed) in Status register-2. Backward compatible to FV family.
N(5) = Green Package (Lead-free, RoHS Compliant, Halogen-free (TBBA), Antimony-Oxide-free Sb2O3)
with QE = 1 (fixed) in Status register-2 & DRV=75%. Backward compatible to FV family.
M(6) = Green Package (Lead-free, RoHS Compliant, Halogen-free (TBBA), Antimony-Oxide-free Sb2O3)
with QE = 0 (programmable) in Status register-2. New device ID is used to identify JV family
Notes:
1. The “W” prefix is not included on the part marking.
2. Only the 2nd letter is used for the part marking; WSON package type ZP is not used for the part marking.
3. Standard bulk shipments are in Tube (shape E). Please specify alternate packing method, such as Tape and Reel (shape T)
or Tray (shape S), when placing orders.
4. For shipments with OTP feature enabled, please specify when placing orders.
5. /HOLD function is disabled to support Standard, Dual and Quad I/O without user setting.
6. For DTR, QPI supporting, please refer to W25Q64JV-M DTR datasheet.

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W25Q64JV
11.1 Valid Part Numbers and Top Side Marking

The following table provides the valid part numbers for the W25Q64JV SpiFlash Memory. Please contact
Winbond for specific availability by density and package type. Winbond SpiFlash memories use a 12-digit
Product Number for ordering. However, due to limited space, the Top Side Marking on all packages uses
an abbreviated 10-digit number.
W25Q64JV-IQ/JQ valid part numbers:
PACKAGE TYPE DENSITY PRODUCT NUMBER TOP SIDE MARKING

SS W25Q64JVSSIQ 25Q64JVSIQ
SOIC-8 208-mil
64M-bit
W25Q64JVSSJQ 25Q64JVSJQ
SF W25Q64JVSFIQ 25Q64JVFIQ
SOIC-16 300-mil
64M-bit
W25Q64JVSFJQ 25Q64JVFJQ
ZP(1) W25Q64JVZPIQ 25Q64JVIQ
WSON-8 6x5-mm
64M-bit
W25Q64JVZPJQ 25Q64JVJQ
ZE(1) W25Q64JVZEIQ 25Q64JVIQ
WSON-8 8x6-mm
64M-bit
W25Q64JVZEJQ 25Q64JVJQ
XG W25Q64JVXGIQ Q64JVXGIQ
XSON-8 4x4-mm
64M-bit
W25Q64JVXGJQ Q64JVXGJQ
TB(2)
W25Q64JVTBIQ 25Q64JVBIQ
TFBGA-24 8x6-mm 64M-bit
(5x5 Ball Array) W25Q64JVTBJQ 25Q64JVBJQ
TC(2)
W25Q64JVTCIQ 25Q64JVCIQ
TFBGA-24 8x6-mm 64M-bit
(6x4 Ball Array) W25Q64JVTCJQ 25Q64JVCJQ
BY(2) 6CJI
64M-bit W25Q64JVBYIQ
12-ball WLCSP •Qyw(4)

SS
SOIC-8 208-mil
64M-bit W25Q64JVSSIN 25Q64JVSIN
ZP(1)
WSON-8 6x5-mm
64M-bit W25Q64JVZPIN 25Q64JVIN

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W25Q64JV
W25Q64JV-IM/JM(3) valid part numbers:

SS W25Q64JVSSIM 25Q64JVSIM
SOIC-8 208-mil
64M-bit
W25Q64JVSSJM 25Q64JVSJM
SF W25Q64JVSFIM 25Q64JVFIM
SOIC-16 300-mil
64M-bit
W25Q64JVSFJM 25Q64JVFJM
ZP W25Q64JVZPIM 25Q64JVIM
WSON-8 6x5-mm
64M-bit
W25Q64JVZPJM 25Q64JVJM
ZE(1) W25Q64JVZEIM 25Q64JVIM
WSON-8 8x6-mm
64M-bit
W25Q64JVZEJM 25Q64JVJM
XG W25Q64JVXGIM Q64JVXGIM
XSON-8 4x4-mm
64M-bit
W25Q64JVXGJM Q64JVXGJM
TB(2)
TFBGA-24 8x6-mm 64M-bit W25Q64JVTBIM 25Q64JVBIM
(5x5 Ball Array)
Note:
1. For WSON packages, the package type ZP and ZE is not used in the top side marking.
2. These package types are special order, please contact Winbond for more information
3. For DTR, QPI supporting, please refer to W25Q64JV-M DTR datasheet.
4. yw: year/ week.

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W25Q64JV
12. REVISION HISTORY
VERSION DATE PAGE DESCRIPTION

A 2015/01/07 New Create Datasheet
B 2016/04/12 Removed “Preliminary”
16 Updated QE description
C 2016/06/03
73-76 Added TFBGA information
4 Added data retention
D 2016/08/30
8 Added TFBGA 5X5
E 2016/10/24 Removed PDIP 8 information
F 2016/11/15 12 Updated Status Register-1 table
G 2016/12/14 4-5, 67, 71-72 Updated XSON package information
Updated /WP information
H 2017/05/11
20, 73-74 Updated W25Q64JV-IM order information
I 2017/11/22 8, 72-75 Added WLCSP package type
12, 13 Updated OTP Notice and SR1 Figure
J 2018/03/27 61,63,64 Updated ICC3, tPP, tSLCH, tCHSL, tDVCH, tCHDX
4, 74-76 Added industrial plus information
16 Updated LB typo
H 2021/03/21
16,17,75,75 Added DRV@75% information
Trademarks
Winbond and SpiFlash are trademarks of Winbond Electronics Corporation.
All other marks are the property of their respective owner.
Important Notice
Winbond products are not designed, intended, authorized or warranted for use as components in systems or
equipment intended for surgical implantation, atomic energy control instruments, airplane or spaceship
instruments, transportation instruments, traffic signal instruments, combustion control instruments, or for other
applications intended to support or sustain life. Furthermore, Winbond products are not intended for
applications wherein failure of Winbond products could result or lead to a situation wherein personal injury,
death or severe property or environmental damage could occur. Winbond customers using or selling these
products for use in such applications do so at their own risk and agree to fully indemnify Winbond for any
damages resulting from such improper use or sales.
Information in this document is provided solely in connection with Winbond products. Winbond
reserves the right to make changes, corrections, modifications or improvements to this document and
the products and services described herein at any time, without notice.

- 77 - Revision K

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W25Q64JV

Publication Release Date: March 10, 2021

1. GENERAL DESCRIPTIONS .................................................................................................................. 4

Publication Release Date: March 10, 2021

Reserved Bits – Non Functional ............................................................................................. 17

Publication Release Date: March 10, 2021

Global Block/Sector Unlock (98h) ............................................................................................ 57

Publication Release Date: March 10, 2021

Note: 1. Hardware /RESET pin is only available on TFBGA or SOIC16 packages

Publication Release Date: March 10, 2021

3. PACKAGE TYPES AND PIN CONFIGURATIONS

/WP (IO2) 3 6 CLK

3.2 Pad Configuration WSON 6x5-mm/ 8x6-mm, XSON 4x4-mm

Publication Release Date: March 10, 2021

3.4 Pin Configuration SOIC 300-mil

3.5 Pin Description SOIC 300-mil

Publication Release Date: March 10, 2021

3.6 Ball Configuration TFBGA 8x6-mm (5x5 or 6x4 Ball Array)

Top View Top View

Package Code B Package Code C

3.7 Ball Description TFBGA 5x5 or 8x6-mm

Publication Release Date: March 10, 2021

3.8 Ball Configuration WLCSP

3.9 Ball Description WLCSP12

Publication Release Date: March 10, 2021

4.1 Chip Select (/CS)

4.5 Serial Clock (CLK)

Publication Release Date: March 10, 2021

SFDP Register Security Register 1 - 3

000000h 0000FFh 003000h 0030FFh

Write Protect Logic and Row Decode

DO (IO1) Byte Address

Figure 2. W25Q64JV Serial Flash Memory Block Diagram

Publication Release Date: March 10, 2021

6.1 Standard SPI Instructions

6.2 Dual SPI Instructions

6.3 Quad SPI Instructions

6.4 Software Reset & Hardware /RESET pin

Publication Release Date: March 10, 2021

6.5 Write Protection

Write Protect Features

Publication Release Date: March 10, 2021

7. STATUS AND CONFIGURATION REGISTERS

7.1 Status Registers

SRP SEC TB BP2 BP1 BP0 WEL BUSY

STATUS REGISTER PROTECT

Figure 4a. Status Register-1

Erase/Write In Progress (BUSY) – Status Only

Publication Release Date: March 10, 2021

Top/Bottom Block Protect (TB) – Volatile/Non-Volatile Writable

Publication Release Date: March 10, 2021

Status Register Protect (SRP, SRL) – Volatile/Non-Volatile Writable

One Time Status Register is permanently protected and cannot be written

Publication Release Date: March 10, 2021

S15 S14 S13 S12 S11 S10 S9 S8

SUS CMP LB3 LB2 LB1 (R) QE SRL

Figure 4b. Status Register-2

Erase/Program Suspend Status (SUS) – Status Only

Publication Release Date: March 10, 2021