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HOT MOUNTING | COLD MOUNTING | ACCESSORIES
MOUNTING GUIDE
2
CONTENT
CONTENT
MOUNTING
Basics of materialographic mounting 3-5
Cold mounting (classic) 6-9

Cold mounting (light curing) 9-11
Hot mounting 12-20
Ordering information 21-27
ATM Qness GmbH · Germany · Phone: +49 2681 95390 · E-Mail: info@qatm.com · www.qatm.com
ATM Qness GmbH · A u s t r i a · Phone: +43 6244 34393 · E-Mail: info@qatm.com · www.qatm.com
3
GENERAL INFORMATION ABOUT MOUNTING

GENERAL INFORMATION THE PROCESS
When is mounting necessary? Samples for materialographic analysis can be cold or hot mounted.
»S
amples are too small for grinding/polishing and Both methods are complementary and should not be evaluated as
hardness testing (low load/micro hardness): sample competing methods. The cold mounting materials on the market can
surface is enlarged by mounting, and thereby simplifies be divided in chemical and light initiated polymeric systems.
handling
»S
imultaneous automatic preparation of larger sample
quantities CHOICE OF MOUNTING PROCESS
»P
reparation of coatings & layer thickness measurements
»P
rotection of edge zones Pressure and heat may alter the microstructure of a sampled
»F
or fragile and / or porous samples material, which leads to a wrong result of the analytical process.
Pores and gaps in the sampled part must be filled completely with
mounting material. The mounting technique, mounting material and
mounting method must be adjusted to the analytical goals and
present laboratory equipment.
COMPARISON OF MOUNTING PROCESSES

Cold Mounting (chemical curing) Cold Mounting (light curing) Hot Mounting
all materials,
simple part geometries,
porous samples, simple geometries,
Materials standard samples,
parts with shaded areas, cavities, cracks, heat and pressure resistant materials
heat-sensitive materials
heat-sensitive materials
fume cupboard, pressure unit,
Machines UV-mounting device hot mounting press
device for vacuum impregnation
acrylics (MMA based or modified acrylates), phenolic resins,
Mounting materials modified polyester resins, modified acrylics PMMA,
epoxy resins epoxy resins
Fillers ceramics, copper, graphite, minerals none ceramics, graphite, wood-flour
Temperature 35 °C - 120 °C 70 °C - 90 °C 150 °C - 200 °C
Time/process 5 min to approx. 24 h 1 - 5 min 5 - 15 min
2 to 3 component systems, 1 component systems, 1 component systems,
Handling
precise working essential very easy handling easy handling
strong, low,
VOC emission none
use of suitable fume-cupboard suggested use of external suction unit suggested
Repeatability mediocre good good
restricted, depending on hot mounting
Mould diameters free choice of mould size and shape free choice of mould size and shape
press
Mounting mould silicone rubber, PTFE, PP, PE PP, PE -
Cost low initial cost, high subsequent costs medium initial cost, high subsequent costs high initial cost, low subsequent costs
Parameters to be considered during mounting
Sample material Mounting resin
heat-, pressure-, UV-resistance curing time

sample throughput shrinkage, edge retention
size and geometry transparency
hardness hardness and chipping behavior
porosity mounting technique
analytical goals
4
PRACTICAL TIPS
PRACTICAL TIPS
!
GENERAL INFORMATION GOOD TO
KNOW
Sample Geometry
–
The following parameters have to be considered in order to

avoid the formation of edge gaps between sample material

and mounting material:
» Sample geometry Sample geometry and arrangement of the samples
» Arrangement of samples in the mounting mould and/or the distances of the samples to the mounting
» Arrangement of samples in the mounting mould mould can lead to different results.
» Polymerization behaviour and hardness of the resin Insufficient separation between the individual samples
» Thermal conductivity of sample material: or to the edge of the mould can cause gap formation
the risk of gap formation increases the faster the mounting and result in cracks (try to keep a distance of
material cools down (take special care with methyl approx. 2-3 mm).
acrylates!)
Geometry
simple difficult
Distance
sample - mounting
mould / > 2 mm
sample - sample
wrong optimal
5
PRACTICAL TIPS
APPLICATION-RELATED INFORMATION
–
Hardness

Correct preparation with edge retention and protected edge zones needs
the use of a mounting resin with a suitable hardness.
Transition zone of mounting material and sample
Same hardness of sample and mounting material Different hardness between sample and mounting material
Transition zone of Transition zone of

mounting material - sample: ideal mounting material - sample: bad
Gap formation
Mounting should show minimized gap formation. Gaps at edges and rounded
edges increase the risk of contamination with dirt and abrasives or polishing
particles; this can cause deterioration of preparation results.
Subsequently flowing etching agent or cleaning alcohol might cause
falsifying re-etchings or discoloration in the edge areas.
Shrinking gap
Transition zone of mounting material - sample: bad
6
COLD MOUNTING
SELECTION OF MOUNTING MOULD
The term cold mounting summarizes all mounting methods, which do not depend on the
application of a hot mounting press. Furthermore, it must be differentiated between classic and
UV-initiated cold mounting processes.
UV BASED COLD MOUNTING

UV based cold mounting recently appeared on the materialographic market. Modified acrylic resins
are applied for this process. The convince though very easy handling (1 component material),
transparency and extremely short mounting times of 60s to 5 min. Light curing cold mounting is the
most throughput oriented mounting technique. However, the used mounting materials do not
contain any fillers, which restricts the application of these products to samples of low to medium
–
hardness. The mounting of routine samples, or the analysis of core microstructures is also feasible
COLD MOUNTING
for hard materials.
COLD MOUNTING
The classic cold mounting process employs mounting materials that consist out of two or more
components. Usually two to three components (liquid-powder or liquid-liquid systems) must be mixed in
specific amounts. A proper dosing and good homogenization of the components are essential for the
process. Depending on the polymer system polymerization-temperatures, pot-life and curing times
deviate strongly. The addition of fillers enables the adjusting of hardness, shrinkage and contrasting
behavior of the mounting material. Cold mounting resins are mainly suggested for pressure- or heat-
sensitive samples. The high degree of freedom of the used mounting moulds enables the processing of
very different sample sizes and geometries. The classic cold mounting remains the most versatile
mounting technique on the market. With epoxy-resins, acrylic resins and modified polyester resins are
large spectrum of cold mounting materials is present. Therefore, it is important to choose the fitting
consumables based on the properties of the sampled material. It should be kept in mind, that the process
is not very cost effective, and a suitable fume cupboard is needed if a high sample throughput is desired.
SELECTION OF COLD MOUNTING MOULDS

Cold mounting moulds are available in PTFE, silicone, polypropylene and polyethylene. All cold mounting
moulds are reusable. Moulds with removable bottom make it easier to detach the sample from the mould.
PTFE High mechanical stability is ideal for automatic grinding and polishing.
Silicone Silicone moulds lose their round shape and turn oval after beeing used several times.
This can result in disadvantages for automatic individual pressure preparations. When
polyester resins are used, sticky places can occur at the edge of the sample as a
reaction of mounting material in combination with the silicone mould.
Polypropylene In older moulds the removable bottom is often no longer flat. When several small
and parts are mounted in one sample, different grinding planes can be ground
polyethylene unintentionally at the same time, depending on the position of the individual sample.
Suitability of the mounting mould
PTFE Polypropylene PP Polyethylene PE Silicone rubber

Methods Mounting material
opaque transparent transparent/opaque opaque
Methacrylates,
Cold mounting xxx xx x xx
polyester
Vacuum Epoxy resins - xx xx -
Pressure Methacrylate xxx xx x xx
Modified
Light curing - xxx xx -
methacrylates
xxx - very well suited, xx - well suited, x - less suitable, - not suitable
7
COLD MOUNTING
OVERVIEW COLD MOUNTING MATERIALL

OVERVIEW COLD MOUNTING MATERIAL
Modified
Acrylic resins Epoxy resins Acrylic resins
polyester
Product KEM 15 plus KEM 20 KEM 30 KEM 35 KEM 60 KEM 90 KEM 92 KEM 50 UV
Methylmeth Methylmeth Methylmeth Methylmeth Tetrahydrofurfuryl- modified
Based material Epoxy resin Epoxy resin
acrylate, styrene acrylate acrylate acrylate 2-methacrylate acrylate
Filler Mineral, PMMA PMMA PMMA Ceramic, PMMA Mineral, PMMA - - -
Hardness (Shore D) 85 84 85 87 85 79 81 83
Chipping sufficient sufficient (high
good good good very good good good
behavior (smearing) removal rate)
Removal rate very low medium medium very low low high medium high
good- sufficient good - sufficient good - sufficient
–
Chemical
good good good (heated good (heated (heated good
resistance
COLD MOUNTING
etchants) etchants) etchants)
good (curing in very good -
Transparency opaque opaque opaque opaque very good very good
pressure unit) good
Curing time approx. 25 min approx. 15 min approx. 5 min 10-15 min approx. 10 min 16-24 h 12-13 h 1-5 min
Curing approx. approx. approx. approx. approx. approx. approx. approx.
temperature 85-100 °C 100-120 °C 95-110 °C 85-100 °C 95-110 °C 60 °C 35 °C 70-90 °C
vacuum
no no no no no yes yes no
impregnation
Curing under
yes yes yes yes yes no no no
overpressure
Mixing ratio vol.% vol.% vol.% vol.% wt.% wt.% wt.% or vol.% -
porous porous Routine
Materials of materials of
Routine materials, materials, samples, soft to
medium to high Routine high and very
Soft to medium samples, materials of low materials of low medium hard
hardness, samples, high hardness,
hard materials, soft to medium hardness, hardness, materials,
Application analysis of materials of analysis of
targeted hard materials, targeted targeted simple
marginalized low to medium marginalized
preparations wide application preparation, preparation, geometries,
layers and hardness layers and
range complex complex targeted
coatings coatings
geometries geometries preparation
!
GOOD TO
KNOW
Tips for Cold Mounting
Epoxy resins » Epoxy resins can be cured at elevated temperatures (up to 60°C). This drastically
reduces the curing time on the cost of yellowing and enhanced shrinkage.
Of course, higher polymerization temperatures must be tolerated.
» Carefully mix resin and hardener in the cup - avoid air inclusions.
Acrylic resins » Pour acrylic resins into the mould immediately after mixing, as they harden very
quickly.
» Acrylic resins are not suitable for vacuum systems or disposable mounting moulds.
» Coating the sample with liquid hardener before pouring in mounting material
can improve the edge retention.
» The use of a pressure vessel can further reduce gap formation..
8
COLD MOUNTING
MOUNTING PROCESS
MOUNTING PROCESS
PROCESS SUPPORT
The mounting process can be supported by different methods. Characteristics of the respective
sample material have to be considered.
–
COLD MOUNTING
VACUUM PROCESS
Mounting under vacuum is only possible
with epoxy resins. Therefore, a vacuum
appliance is required.
Infiltration unit
This method is used for infiltration of porous sample

material and for optimization, if samples with thin
bores, fine pores or micro-cracks are mounted.
Scheme: infiltration of porous material or thin bores
To achieve an optimal mounting or infiltration, a vacuum can be applied (venting of the sample
before casting the epoxy resin). Warning: vacuum which is set too high and applied too long,
influences the polymerization and might cause uneven curing, leading to different results.
The dosage of epoxy resins should be strictly complied with and therefore always be carried out
according to weight-% (laboratory balance).
Errors and causes
Mounting material too brittle or too soft Mind exact dosage of resin and hardener.
Vacuum too long and/or too high;
Strong bubble formation in the mounting material
recommendation: 0.6-0.8 bar, about 2-3 min.
Infiltration not complete Leave vacuum on longer.
!
GOOD TO
KNOW
Colouring of Samples
Epoxy resins can be coloured by additives.
This is an advantage compared to other mounting
materials.
9
MOUNTING PROCESS
PRESSURE PROCESSES
Mounting with pressure is only possible with
methyl-methacrylates.
A simple pressure appliance / technomat for
–
compressed air connection (approx. 5-6 bar) is
COLD MOUNTING
required.
Methacrylates without a filler additive cure
transparently under pressure. The formation of
microbubbles is avoided by the application of a
pressure of 2-2.5 bar.
The dosage of MMAs can be handled generously, i.e.
the dosage by volume-% (dosing spoon) is sufficient.
Errors and causes
Mixing time too long.

Insertion into pressure appliance too late.
Bad transparency
Pressure too low.
Mixing ratio wrong.
COLD MOUNTING WITH LIGHT CURING POLYMERS

Currently only modified acrylics are used as the base material for light curing mounting materials.
The application of light curing epoxy-resins is extremely uncommon due to the high layer-
thicknesses in materialographic application. The initiation of the curing reaction is triggered by UV
radiation with a wavelength of 350 to 400 nm. The process is restricted to pore and cavity-free
sample geometries, since the mounting materials only cures in irradiated areas. A good example for
this product class is the very fast curing, 1 component system KEM 50 UV. It is transparent, like most
light curing acrylics. Due to the scattering effects, the addition of inorganic fillers (e.g., glass beads)
is only feasible in very small amounts. This restricts the methods application to materials of low to
medium hardness. The edge retention is, in comparison to filled acrylics like KEM 35, mediocre.
Therefore, the preparation of marginalized layers or coatings is not suggested with this mounting
material. The used UV initiators (usually, aromatic, organic compounds) need UV radiation of a
certain wavelength to start the curing reaction. This leads the used of UV – LEDs that have ben
optimized for the use with a certain initiator system. This is necessary to fully utilize the mounting
materials potential. Only a few UV-curing devices are currently present on the market. QATM's
Qmount is a UV-mounting device that has been optimized for the curing of resins with a
wavelength of 365 nm.
Errors and Causes
Check LED´s performance, use UV transparent PP/PE

Insufficient or no curing
moulds, too short curing time, wrong LED type used
No sufficient irradiation, cure layerwise, longer irradiation

Parts of the sample´s interior are improperly cured
times, choose other mounting methods, use proper moulds
Too high UV-intensity, sample may be too high for the

Backside of the sample is deformed
irradiation chamber, lighting is inhomogeneous
10
COLD MOUNTING
UV MOUNTING DEVICE
UV MOUNTING DEVICE
QMOUNT
The Qmount is a UV mounting device optimized for the application with KEM 50 UV. Long lasting UV-LEDs with slim
emission spectrum centered around 365 nm are employed. With a curing cross-section of 260x200 mm it is the largest
laboratory device present on the market (16th June 2021). An attachable suction unit and a robust aluminum housing make
it well suited for the application in an industrial environment. It was optimized for KEM 50 UV and enables very short curing
–
times of 60 s.
COLD MOUNTING
Features
Qmount
UV mounting device
» UV mounting in the shortest possible time (60 seconds)
» Highly efficient, long-life LED technology
» Robust machine design
» Easy handling
» Connectable suction unit (optional)
Mounting moulds
Polypropylene round, Ø 25 mm / H 27 mm
Qmount
!
GOOD TO
KNOW
Tips for UV mounting
Always use UV transparent moulds machined form PP or PE to guarantee the optimal curing of the
mounting material.
Clean the cured samples by immersing them in ethanol, to obtain a good surface finish. The residues
of the O2-stablizers are removed by the solvent.
Mount large samples, or samples used for longitudinal sectioning in multiple process steps. The
layerwise curing of the mounting material is possible.
11
UV MOUNTING DEVICE
–
COLD MOUNTING
12
COLD MOUNTING
COLD MOUNTING MATERIAL

Mounting material Recommended application
methyl-methacrylate,
blue, opaque, high edge retention
2-component system: powder + liquid (1.5:1 [Vol.-%])
KEM 15 plus
» for mountings with high edge retention, edge examination,
medium-hard to hard materials
» CT: approx. 20 min.
–
COLD MOUNTING
transparent (pressure appliance)
KEM 20 2-component system: powder + liquid (recommendation 2:1 [Vol.-%])
» for transparent mounting (pressure vessel), targeted preparation
green, transparent
2-component system: powder + liquid (2:1 [Vol.-%])
KEM 30
» for semi-transparent mountings (pressure vessel), routine work,
soft to medium-hard materials
light green, opaque, good edge retention
KEM 35
» for mountings with good edge retention, edge examination,
medium-hard to very hard materials
base tetrahydrofurfuryl-2-methacrylate with mineral filler,

red, opaque
KEM 60
2-component system: powder + liquid (2:0.9 [weight-%])
(MMA-free)
» universal usage
» CT: 15-18 min.
epoxy resin,
clear, transparent
KEM 90 2-component system: resin + hardener (2:1 [weight-%])
» suitable for vacuum impregnation, sensitive and brittle materials
» CT: approx. 16 - 24 h
epoxy resin,
clear, transparent
KEM 92 2-component system: resin + hardener (4:1 [weight-%])
» for vacuum impregnation, brittle, and sensitive material
» CT: approx. 13 h
!
GOOD TO
KNOW
Methyl-Methacrylate
Methyl-methacrylates may outgas over a longer
period of time -
this can delay the curing time!
13

Light curing acrylic resin, clear, transparent

1-component system
KEM 50 UV
» for standard samples, soft to medium hard materials
» CT: 1-5 min
–
COLD MOUNTING
white, opaque
3-component system: powder + liquid 1 + liquid 2 (3:2:1 [Vol.-%])
Technovit 4000 SET
» for mountings with good edge retention, edge examination,
medium-hard to hard materials
copper-brown (bubble-free in pressure appliance)
Technovit 5000 2-component system: powder + fluid (20 g:13 ml [Weight-%])
» conductive, for SEM examinations
CT = Curing time
Characteristics of cold mounting material
Edge Gap
Material Characteristics Application Transparency Curing time
retention formation
blue, opaque, edge examinations,

methyl-
KEM 15+ high edge retention, medium-hard to hard - xxx very low <20 min
methacrylate
high hardness materials
transparent
methyl- transparent mountings,
KEM 20 (curing under xxx x medium <15 min
methacrylate targeted preparation
overpressure)
semi-transparent routine mountings,

methyl-
KEM 30 (curing under soft to medium-hard x x medium <5 min
methacrylate
overpressure) materials
light green, opaque, edge examinations,

methyl-
KEM 35 good edge medium-hard to - xx very low <15 min
methacrylate
retention very hard materials
red, opaque,
KEM 60 methacrylate universal applications - x medium <20 min
MMA-free
sensitive and brittle

transparent,
KEM 90 epoxy resin materials, xxx xxx very low <24 h
low viscosity
vacuum impregnation
Vacuum impregnation,
transparent, low brittle and heat sensitive
KEM 92 epoxy resin xxx xxx very low < 13 h
viscosity, colorless materials, porous
materials, soft materials
Routine samples, soft to

transparent, light
KEM 50 UV modified acrylic medium hard materials, xxx x medium < 1 min
curing, colorless
targeted preparation
xxx - very well suited, xx - well suited, x - less suitable, - not suitable
14
HOT MOUNTING
GENERAL INFORMATION ABOUT HOT MOUNTING

HOT MOUNTING PROCESS
The hot mounting process means that materialographic samples are melted and compacted in
finished ground resin granulate inside a closed cylinder. This process is controlled in a hot mounting
press and the samples are encapsulated in a plane-parallel manner. The parameters selected -
temperature, pressure and time - depend on the machine specifications themselves and mounting
material/resin.
The hot mounting technique ensures high edge retention, protects the sample edges and is suitable
for a high sample volume. However, it is not suitable for heat- or pressure-sensitive samples. In case
of electronic components (solders/composites) or pressure-sensitive material, e.g. wires or sheets
with small cross-sections, the time of pressure application can be controlled in order to minimize
the risk of false mounting.
In the hot mounting process, the samples are placed in the press cylinder of the mounting press on
the lower ram, which is then filled with special resin granulates (diverse bakelites, duroplasts or
thermoplastics). The granulates are melted under pressure and heat, so that all cavities of the
mounting mould are filled. Hot mounting means the sample is mounted with minimum gap
formation, depending on mounting material. After cooling it is ready for further preparation.
Combined with respective mounting material, our hot mounting presses are extremely popular by
–
their very high edge retention and high sample throughput.

HOT MOUNTING
The benefits
» No direct contact with chemicals
» Good edge retention
» High degree of hardness of the mounting material
» High plane parallelism
» Easy sample marking by engraving, labelling
SOME USEFUL TIPS

Mould separating agent suitable solvents. A mechanic cleaning, e.g., using
microfiber cloths, should be carried out properly.
Especially of epoxy resins, or other mounting Sometimes the use of an ultrasonic bath is advised.
materials with low shrinkage and gap formation are
used a strong adhesion of the mounting materials to Preheating
the mould can be observed. Therefore, separating
agents can be applied on the mould to reduce the In the case of porous and/or pressure-sensitive
cleaning effort of the hot mounting press. Commonly samples, such as minerals, etc., the mounting
silicon pastes, spray or suitable metal-stearates are material can be heated and softened before applying
used to prevent the adhesion of the sample on the pressure. Preheating with the special programs in the
mould. The mould separating agent must be applied OPAL mounting presses is also recommended when
with caution, since it may lead to enhanced gap using thermoplastic mounting materials, as e.g.
formation if too much is applied on the lower ram. Thermoplast.
Mould diameter Heat and pressure sensitive samples
The spacing between sample and mould should be at Brittle materials and heat sensitive alloys prove a
least 3 mm to prevent cracks and breakouts of the challenge during the hot mounting process. To prevent
mounting material. Especially sharp-edged samples a thermal shock induced cracking, or irreversible
are prone to these errors, due to internal stresses in microstructural changes the use of a cold mounting
the shrinking polymer. method is suggested. If this is not possible the
following options remain:
Small samples The pressure is applied after the hot mounting press
has reached the target temperature, which leads to an
Small and thin samples must be fixed with mounting already softened hot mounting material which shows a
aids. Sometimes adhesives must be applied for fixation. better flowability. This reduces the load on the sample
Even though the pressure is applied homogeneously during the pressure application, which is good for
small samples tilt and shift during the hot mounting brittle materials. Furthermore, reduced heating and
process if the are not fixated properly. cooling rates should be used, even though a longer
mounting time is necessary. If possible, temperature
Clean samples and pressure should be reduced. 100 bar and 150 °C
The least gap formation is achieved with cleaned, can be assumed to be the lower threshold values of
dried, and fatless samples. Therefore, samples should commercial hot mounting presses.
be cleaned with ethanol, petroleum ether or other
15

HOT MOUNTING MATERIAL
Adding of fillers influences hardness, shrinking behaviour and mechanical workability. The Duroplast
group cures at a higher temperature in the range of 130–180 °C.
Thermoplastics melt at temperatures of 130–180 °C and cure during the cooling phase. In comparison
to Duroplasts this significantly increases the cooling time depending on the diameter of the mounted
sample..
Characteristics of Hot Mounting Material
Hardness Removal rate

Mounting material Recommended application Basis / filler
(shore D) (grindability)
routine mountings,
Bakelite phenolic resin/
soft to medium-hard materials, 92 medium
(black, red, green) wood flour
good for filling up
high edge retention, epoxy resin/
–
EPO black edge examination, mineral and glass 93 very low
medium-hard to hard materials fibre
HOT MOUNTING
high edge retention,
edge examination,
EPO-Max medium-hard to hard materials epoxy resin/mineral 93 very low
easy cleaning of mould and ram due to low
adhesion
conductive, SEM examinations, phenolic resin/
Duroplast black 89 medium
electrolytic polishing graphite
transparent mounting,
Thermoplast target preparation, sensitive materials, acrylic resin 86 medium
well-suited for filling up, marking
!
GOOD TO
KNOW
Parameters Bakelite EPO Duroplast Thermoplast
Polymerization range 120 – 200 °C 130 – 180 °C 130 – 190 °C 130 – 195 °C
Heating time 5 – 8 min* 5 – 8 min* 5 – 8 min* 5 – 8 min*
Cooling time 5 – 8 min* 5 – 8 min* 3 – 6 min* 7 – 10 min*
Pressure 150 – 250 bar* 150 – 250 bar* 150 – 180 bar* 160 – 195 bar*
* depending on the diameter of the mould assembly: the larger the diameter of the mould, the more pressure and time must be applied
Errors and causes
Sample too high.

Mounting material is coarse-grained and rough. Not enough granulate.
Discoloration when cleaning with ethanol. Mounting material not cured.
Check temperature.
Check pressure/temperature settings.

Sample has not been cleaned before mounting.
Gap formation despite of mounting material In case of a two-layer mounting:
with high edge retention. check sample arrangement
(cause: f ine-grained filling granulate can seep through
granulate with high edge retention).
Milky stains and/or cracks when using acrylic resin. Check cooling temperature (often too low).
16
HOT MOUNTING
HOT MOUNTING PRESSES
HOT MOUNTING PRESSES

THE OPAL HOT MOUNTING PRESSES
The hot mounting presses OPAL mount samples in a very short time - fully automatic, fully hydraulic and water-cooled. The
OPAL 410 is fitted with the proven QATM bayonet closure, whereas the fully automatic sliding closure of Opal 480 allows
quick and easy opening/closing of the mould assembly. The wide range of round (from 25.2 to 70 mm) and rectangular
(30x60 and 40x60 mm) mould assemblies enables optimum moulding. The mould assemblies are easy to change. Spacers
in different sizes allow for time-saving double mounts.
–
The appliances are environmentally friendly, operating noise is minimized and, thanks to the powder-coated aluminium
HOT MOUNTING
construction, very robust and durable. The infinitely variable cooling curve allows you to get very low water consumption
with a longer cooling time.
The clear LCD operation panel of OPAL 480 is user-friendly. Up to 18 free configurable mounting processes can be stored
and retrieved at any time. In addition to standard operation, three additional pressure methods can be selected:
1. Pressure increases in parallel with the pre-heating phase (ideal for mounting hollow samples)
2. Pressure increases after the pre-set temperature is reached (e.g. to produce almost gap-free mounts of complex geometries)
3. Pressure increases during cooling (e.g. to prepare transparent samples).
Comparison of characteristics
Opal 410 Opal 480

Automatic hot mounting press Automatic hot mounting press
» Fully hydraulic pressing process » Fully hydraulic pressing process
» Automatic water cooling (with water saving function) » Automatic water cooling (with water saving function)
» Bajonet closure » Sliding closure
» Fully automatic, electronic control
» Large, clearly arranged LCD display and optimized user interface
» 18 programs to save with free configuration
» 3 different modes for pressure to select
Mould assembly Mould assembly
Ø 25.2 mm (approx. 1") Ø 50 mm
Ø 30 mm Ø 60 mm
Ø 32 mm Ø 70 mm
Ø 31.75 mm (1¼") 30x60 mm
Ø 38 mm 40x60 mm
Ø 40 mm
Opal 410 Opal 480
17
HOT MOUNTING
MODULAR HOT MOUNTING PRESSES

MODULAR HOT MOUNTING PRESSES
Qpress 50
The modular design of the innovative hot mounting press Qpress 50 allows fast and simultaneous mounting of different
materialographic samples. In order to suit specific customer requirements with regard to material and size of different
samples, the appliance can be optimally configured after selection of the Qpress 50-2 or 50-4 variant.
The basic appliance includes a control panel and an integrated pressing unit and can be upgraded with 1 or 3 additional
pressing units Qp 50. These are separated from the base device and can be added later. Thus, it is possible to process
samples of up to 4 different diameters in one device at the same time. The Qpress 50 allows fast mountings with low
power consumption and a very high ease of use.
!
GOOD TO
KNOW
–
Mould assemblies with chamfer
HOT MOUNTING
When mounting samples for subsequent manual preparation, it is recommended to use mould assemblies with chamfer.
Chamfered samples are easier to handle as they do not tilt during manual grinding and polishing and will not damage
the polishing cloth.
Characteristics
Qpress 50
Modular hot mounting press Mould assemblies
(2-4 pressing units according to the equipment)
» Fully hydraulic pressing process Ø 25.2 mm (approx. 1")
» Automatic water cooling (with water saving function) Ø 30 mm
» Sliding closure with one-hand closure system Ø 1¼" (~32 mm)
» Dust Guard: during filling of mould removal of fine dust with connected Ø 1½" (~38 mm)
vacuum cleaner
» Dirt trap catches excess mounting material Ø 40 mm
» 7" touch display with innovative control software Ø 50 mm
» High flexibility due to customized preheating function, cooling modes,
maintenance tasks
» User accounts with definable access rights
» Housing made of solid, powder-coated steel construction
Qpress 50
18
HOT MOUNTING
PRACTICAL TIPS
PRACTICAL TIPS
DUROPLASTS THERMOPLAST
Phenolic resin Phenolic resin Epoxy resin Acrylic resin

–
Bakelite black, Duroplast EPO

HOT MOUNTING
Product EPO-Max Thermoplast

red, green black black
Routine examinations of
soft to medium-hard materials
Samples without edge
xxx –* –* – –
zones
Mounting of sample
material
Examination of material
with high hardness
x – xxx xxx –
Hard edge layers
Difficult geometries
All examinations
Planar grinding with – – – – –
corundum or
SiC grinding stones
Soft materials
Targeted preparation x – – – xxx
Thin sections
SEM examinations
– xx x x –
Electrolytic polishing
xxx - very well suited, xx - well suited, x - less suitable, - not suitable, –* over performing for this application
!
GOOD TO
KNOW
Tips for Hot Mounting
For better edge retention and minimized shrink gaps, the mounted samples should be cooled down
to room temperature under pressure before they are removed from the mounting press.
The cause for insufficiently cured mounted samples can be too much moisture in the mounting
material. Therefore, always make sure that the container is properly closed after use.
Warning: Although double mountings are possible with each mounting press, the finished samples
are too flat if the press cylinder height is too low. Samples that are too flat are difficult to handle or
cannot be used for automatic preparation (normal height 15 mm).
Thermoplast and Duroplast black

In electrolytic applications, electrically non-conductive Thermoplast is used in combination with
Duroplast black. To begin with, a small amount of Thermoplast is applied on the sample and then
the missing amount of mounting material is filled up with black Duroplast. This results in an
electrically conductive body with a non-conductive preparation surface.
Epo black, Epo-Max and Duroplast black

In order to achieve a cost reduction, Epo black, Epo-Max and Duroplast black can be used together
with bakelites. The sample is covered with a small amount of the desired mounting material and
then filled up with the cheaper bakelites.
Indicators for too low mounting temperature or pressure during the mounting process are
inhomogeneous or milky looking mounting material. The mounting parameters set on the mounting
press should superimpose with the optimum of the used mounting material. In principle mounting
processes with two differing mounting materials are possible.
19
PRACTICAL TIPS
–
HOT MOUNTING
epoxy resin with high edge retention
EPO black » very high hardness
» contains a high proportion of glass and mineral filler
epoxy resin with high edge retention
EPO-Max » very high hardness

» easy cleaning of mould and ram due to low adhesion
» with a proportion of mineral filler
phenolic resin for SEM examinations and electrolytic polishing

Duroplast black » medium hardness
» conductive, contains graphite particles
acrylic resin for transparent mounts

Thermoplast » ideal for target preparations, sensitive samples
» low to medium hardness
phenolic resin for general purpose, routine mountings

Bakelite black » medium hardness
» contains wood flour

Bakelite red » medium hardness

Bakelite green » medium hardness
20
HOT MOUNTING
TROUBLESHOOTING
TROUBLESHOOTING
Solution-oriented procedure
Problem Cause Solution

–
Sample with sharp

HOT MOUNTING
edges or sample If possible, round off edges and mount sample with
Edge cracks
mounted too close to distance of at least 3 mm to the edge.
sample edge.
Cooling time Increase cooling time,

Bulging too short. check cooling water intake.
Heating time
Dull surface finish Extend heating time.
too short.
Gap between Wrong mounting

Use mounting material with low shrinkage,
sample and material or sample
if possible, cut up sample.
mounting material too large.
Temperature too high

(hot mounting Lower heating temperature.
material).
Porosity
Proportion of
hardener too high Check dosage.
(KEM 90).
Cooling time too

Increase cooling time,
short or
Blastering check cooling water supply,
heating temperature
lower heating temperature.
too high.
Individual grains
visible on mounting Curing of mounting Increase pressure during heating,
* Only in case of material without
pressure. check pressure cylinder.
warm curing
mounting materials
Inner cracks Heating time Extend heating time,

(Thermoplast) too short. extend cooling time.
”Cottonball effect”
Heating time Extend heating time,
in centre of mount
too short. extend cooling time.
(Thermoplast)
!
GOOD TO
KNOW
Remarks
A longer mounting time can avoid bulging or mountings that are too soft.
Incorrectly melted or milky mounting material means that temperatures and pressure are too low
during mounting. The temperature and pressure values set on the mounting press should always
correspond to the recommended values for the mounting material used. In general, two-layer
mountings are possible.
21
ORDERING INFORMATION
APPLIANCES FOR COLD MOUNTING AND FOR HOT MOUNTING

APPLIANCES FOR COLD MOUNTING
Ordering Information
Item No. Unit Description
Infiltration set
» for cold mounting and hardening using vacuum

» recommended for Epoxy resin
Z6510000 1 Pc. Desiccator incl. non-return valve, vacuum pump, hose and pressure gauge
Infiltration unit
» for cold mounting, pouring and hardening using vacuum

M6500001 1 Pc. Infiltration unit, 230 V/50 Hz, vacuum pressure 0.8 bar, W330 x H270 x D300 mm
110 V/60 Hz on request
Pressure unit
» for bubble free hardening of methylmethacrylates
–
(e. g. for Technovit 4004, KEM 20), compressed air required
95016569 1 Pc. Pressure equipment, dimensions: D340 x W340 x H255 mm
Qmount UV mounting device
» The Qmount is a modern device for the light curing-based mounting of

materialographic samples
M0761000 1 Pc. Qmount UV mounting device, dimensions: W377 x D436 x H172 mm
APPLIANCES FOR HOT MOUNTING

Qpress 50 modular hot mounting press
» The Qpress 50 is a modular hot mounting press for fast and simultaneously
independent mounting of different materialographic specimens.
M0800004 1 Pc. Qpress 50-2, basic unit extendable with 1 additional pressing unit
(total up to 2 pressing units), 200-240 V, 50/60 Hz
M0800002 1 Pc. Qpress 50-4, basic unit extendable with up to 3 additional pressing units
(total up to 4 pressing units), 200-240 V, 50/60 Hz
Opal 410 and Opal 480 hot mounting presses
» The OPAL 410 and OPAL 480 are fully hydraulic, water cooled hot
mounting presses for mounting samples before polishing.
M0770000 1 Pc. Opal 410, automatic hot mounting press, bayonet closure,
230 V/50 Hz (1Ph/N/PE)
M0790000 1 Pc. Opal 480, automatic hot mounting press, fully automatic sliding closure,
230 V/50 Hz (1Ph/N/PE)
22

Cold mounting material methylmethacrylate

CT = curing time
KEM 15 plus, blue, opaque, high edge retention
–

» for mounting with high edge retention, edge examination
» medium-hard to hard materials

95012019 1 Pc. KEM 15 plus, SET including 1 kg powder, 500 ml liquid, 40 mixing cups,
40 mixing sticks, 2 dosing spoons
95011628 1 kg KEM 15 plus, powder, blue, opaque, CT: approx. 20 min
95011630 10 kg KEM 15 plus, powder, blue, opaque, CT: approx. 20 min
95011629 500 ml KEM 15 plus, liquid
95011631 5l KEM 15 plus, liquid
KEM 20, transparent (pressure appliance)

» for transparent mounting (pressure vessel), target preparation
95013990 1 Pc. KEM 20, SET including 1 kg powder, 500 ml liquid, 40 mixing cups,
95013939 1 kg KEM 20, powder, transparent, CT: approx. 12 min
95013942 500 ml KEM 20, liquid
95013943 1l KEM 20, liquid
KEM 30, green, transparent

» for semi-transparent mounting (pressure vessel), routine work
» soft to medium-hard materials
92004080 1 kg KEM 30, powder, green, transparent, CT: approx. 5 min
92004082 5 kg KEM 30, powder, green, transparent, CT: approx. 5 min
92004081 500 ml KEM 30, liquid
92004083 1l KEM 30, liquid
92002540 2.5 l KEM 30, liquid
KEM 35, light green, opaque, good edge retention

» for mounting with good edge retention, edge examination
» medium-hard to very hard materials
92002473 1 kg KEM 35, powder, light green, opaque, CT: approx. 12 min
92002475 500 ml KEM 35, liquid
92002476 1l KEM 35, liquid
92002477 2.5 l KEM 35, liquid
23

Cold mounting material MMA-free

CT = curing time
KEM 60, red
–
2-component system (MMA-free): powder + liquid (2:0.9 [weight-%])
» universal usage
95013184 1 kg KEM 60, powder, red, CT approx. 8–10 min.
95013187 500 ml KEM 60, liquid
Cold mounting material epoxy resin

CT = curing time
KEM 90, clear, transparent
2-components-system: resin + hardener (2:1 [weight-%])
» suitable for vacuum infiltration e.g. porous materials
92002484 500 ml KEM 90, resin, clear, transparent, CT: approx. 16–24 h
92002485 250 ml KEM 90, hardener
KEM 92, clear, transparent

2-components-system: resin + hardener (4:1 [weight-%])
» for vacuum impregnation, brittle, and sensitive material
95016854 1l KEM 92, resin, clear, transparent, CT: approx. 13 h
95016855 250 ml KEM 92, hardener
Cold mounting material methacrylate

CT = curing time
KEM 50 UV, clear, transparent
1-component system
» light curing at 365 nm
» for soft to medium hard materials, standard samples
95016840 1l KEM 50 UV, CT: approx. 1 min.
Cold mounting material methylmethacrylate

CT = curing time
Technovit 4000 SET, white, opaque
3-component system: powder + liquid 1 + liquid 2 (3:2:1 [Vol.-%])
» with high edge retention, edge examination, medium hard to hard materials
92001683 1 Pc. Technovit 4000 SET (750 g / 500 ml / 250 ml), white, opaque, CT: approx. 8 min
92001684 1 Pc. Technovit 4000 SET (1.5 kg / 1 Ltr. / 500 ml), white, opaque, CT: approx. 8 min
Technovit 5000, copper-brown

» conductive, for SEM examinations
95004058 1 kg Technovit 5000, powder, copper-brown (bubble-free with pressure vessel),
CT: approx. 7 min
95004059 500 ml Technovit 5000, liquid
» Download of Safey Data Sheets at www.qatm.com
24
COLD MOUNTING MOULDS
COLD MOUNTING MOULDS

Cold mounting moulds
Silicon rubber round, beveled edge

–
» reuseable
» not suitable for light curing

92002511 1 Pc. Silicon rubber round, Ø 25 mm / H 23 mm
Silicon rubber square, beveled edge

» reuseable
92002509 1 Pc. Silicon rubber square, 55 x 30 mm / H 22 mm
92002510 1 Pc. Silicon rubber square, 70 x 40 mm / H 22 mm
Polypropylen round
» reuseable
» for light curing
» with exchangeable bottom
92001719 1 Pc. Polypropylene round, Ø 25 mm / H 27 mm
Polyethylene round,
» reuseable
95016167 1 Pc. Polyethylene round, Ø 25 mm / H 25 mm
PTFE round, beveled edge

» reuseable
92002513 1 Pc. PTFE round, Ø 25 mm / H 23 mm
25
ACCESSORIES FOR COLD MOUNTING

ACCESSORIES FOR COLD MOUNTING
Accessories for cold mounting
92001715 100 Pcs. Mixing cups, disposable, 180 ml

92004360 1 Pc. Silicon mixing cup, reusable
92001717 100 Pcs. Mixing sticks (wood)
–
92002623 100 Pcs. Plastic mounting aid Ø 30 mm, gap 1 mm
95016787 10 Pcs. Transparent mounting aid, sample thickness <1 mm
95016790 10 Pcs. Transparent mounting aid, sample thickness 1-2 mm
92002715 1 Pc. Square bottle with screw-top for approx. 1 ltr. mounting material
92002657 100 Pcs. Angle adapter for angled polishing, 10°
92001716 10 Pcs. Dosing spoon for hot and cold mounting material, 13 ml
92001779 10 Pcs. Dosing spoon for cold mounting material, 20 ml
92001781 10 Pcs. Dosing spoon for cold mounting material, 13 ml
92002662 100 Pcs. Steel clip for for aligning thin samples in mould
92002663 100 Pcs. Plastic clip for aligning thin samples in mould, transparent
92002707 100 Pcs. Plastic clip for aligning thin samples in mould, black
92002708 100 Pcs. Plastic clip for aligning thin samples in mould, red
92002709 100 Pcs. Plastic clip for aligning thin samples in mould, grey
26

Hot mounting material
EPO-Max, black, epoxy resin, high edge retention

–
» very high hardness

» easy cleaning of mould and ram due to low adhesion

» with mineral filler
95013811 1 kg EPO-Max black
EPO black, epoxy resin, high edge retention

» very high hardness
» contains a high proportion of glass and mineral filler
95011990 1 kg EPO black
Duroplast black, phenolic resin for SEM examinations and electrolytic polishing
» medium hardness
» conductive, contains graphite particles
95011993 1 kg Duroplast black
Thermoplast, acrylic resin for transparent mounts

» ideal for targeted preparations
» low to medium hardness
95011996 1 kg Thermoplast
EXPIRY DATE OF CONSUMABLE
Product designation Expiry date Product designation Expiry date

Hot mounting Years Cold mounting Years
Bakelite 2 Methacrylates as e.g. KEM 15 plus, 20, 30, 35, 60 2
EPO black, EPO-Max 2 Epoxy resin KEM 90 1
Duroplast 2 Mounting moulds 2
Thermoplast 2 Releasing agent 2
Miscellaneous Years
Ethanol and acetone 2
27

ACCESSORIES FOR HOT MOUNTING
Hot mounting material
Bakelite black, phenolic resin for general purpose
–
» medium hardness
» contains wood powder
» very convenient material for filling
95011981 1 kg Bakelite black
Bakelite red, phenolic resin for general purpose

» medium hardness
95011984 1 kg Bakelite red
Bakelite green, phenolic resin for general purpose

» medium hardness
95011987 1 kg Bakelite green
Accessories for hot mounting
92002660 90 ml Silicon paste, anti-stick agent

92002661 200 ml Silicon spray, anti-stick agent
92004441 1 Pc. Brass brush for cleaning of hot mounting press
92002658 1 Pc. Funnel for hot mounting material
92002715 1 Pc. Square bottle with screw-top for approx. 1 ltr. mounting material
92002657 100 Pcs. Angle adapter for angled polishing, 10°
92001716 10 Pcs. Dosing spoon for hot and cold mounting material, 13 ml
92002662 100 Pcs. Steel clip for for aligning thin samples in mould
92002663 100 Pcs. Plastic clip for aligning thin samples in mould, transparent
92002707 100 Pcs. Plastic clip for aligning thin samples in mould, black
92002708 100 Pcs. Plastic clip for aligning thin samples in mould, red
92002709 100 Pcs. Plastic clip for aligning thin samples in mould, grey
Remarks
"The indicated expiry dates represent the minimum shelf life of the QATM consumables. Complete functionality of the
products is guaranteed inside this period in time. Reaching the expiry date does not cause a loss in the functionality
of the products. This means they can be used after the date. Correct storage is essential to ensure full functionality
of the products. It has to be ensured that the consumables are not exposed to strong temperature changes and high
humidity.
When outside temperatures are very high, delivery of the liquids of KEM 15, 20, 30, 35 and 60 is restricted. For further
information please read the data sheet. The consumables and their packaging should not be opened unless for direct
use e.g. cut-off wheels are hygroscopic and cold mounting materials can react with oxygen. This might influence the
functionality in the long term. Please, in your interest, ensure you have fresh supplies, do not order too much.
The expiry date starts from shipping date.
Complaints are checked by our quality management and application team.
Our general terms and conditions remain unaffected by this.”
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Copyright © 2022 by ATM Qness GmbH | 95014331/EN - 221018

Subject to technical modification and errors
ATM Qness GmbH ATM Qness GmbH
Emil-Reinert-Str. 2 Reitbauernweg 26
57636 Mammelzen 5440 Golling
Germany Austria
Phone: +49 2681 9539-0 Phone: +43 6244 34393

Fax: +49 2681 9539-20 Fax: +43 6244 3439330
info@qatm.com www.qatm.com

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NEW

HOT MOUNTING | COLD MOUNTING | ACCESSORIES

Basics of materialographic mounting 3-5

Cold mounting (classic) 6-9

Hot mounting 12-20

Ordering information 21-27

GENERAL INFORMATION ABOUT MOUNTING

COMPARISON OF MOUNTING PROCESSES

Parameters to be considered during mounting

Sample material Mounting resin

heat-, pressure-, UV-resistance curing time

GENERAL INFORMATION ABOUT MOUNTING

The following parameters have to be considered in order to

avoid the formation of edge gaps between sample material

GENERAL INFORMATION ABOUT MOUNTING

Transition zone of mounting material and sample

Transition zone of Transition zone of

Transition zone of mounting material - sample: bad

UV BASED COLD MOUNTING

for hard materials.

SELECTION OF COLD MOUNTING MOULDS

Suitability of the mounting mould

PTFE Polypropylene PP Polyethylene PE Silicone rubber

OVERVIEW COLD MOUNTING MATERIALL

Tips for Cold Mounting

This method is used for infiltration of porous sample

Scheme: infiltration of porous material or thin bores

Errors and causes

Errors and causes

Mixing time too long.

COLD MOUNTING WITH LIGHT CURING POLYMERS

Errors and Causes

Check LED´s performance, use UV transparent PP/PE

No sufficient irradiation, cure layerwise, longer irradiation

Too high UV-intensity, sample may be too high for the

Tips for UV mounting

COLD MOUNTING MATERIAL

base tetrahydrofurfuryl-2-methacrylate with mineral filler,

COLD MOUNTING MATERIAL

Light curing acrylic resin, clear, transparent

Characteristics of cold mounting material

blue, opaque, edge examinations,

semi-transparent routine mountings,

light green, opaque, edge examinations,

sensitive and brittle

Routine samples, soft to

GENERAL INFORMATION ABOUT HOT MOUNTING

their very high edge retention and high sample throughput.

SOME USEFUL TIPS

Mould diameter Heat and pressure sensitive samples

GENERAL INFORMATION ABOUT HOT MOUNTING

Characteristics of Hot Mounting Material

Hardness Removal rate

high edge retention, epoxy resin/

Heating time 5 – 8 min* 5 – 8 min* 5 – 8 min* 5 – 8 min*

Cooling time 5 – 8 min* 5 – 8 min* 3 – 6 min* 7 – 10 min*

Errors and causes

Sample too high.

Check pressure/temperature settings.

» for bubble free hardening of methylmethacrylates

» The Qmount is a modern device for the light curing-based mounting of

» very high hardness

» easy cleaning of mould and ram due to low adhesion