VN800PS-E

High-side driver

Features

Type RDS(on) IOUT VCC

VN800PS-E 135 mΩ 0.7 A 36 V

■ ECOPACK®: lead free and RoHS compliant

■ Automotive Grade: compliance with AEC SO-8
guidelines
■ Very low standby current
■ CMOS compatible input
■ Thermal shutdown protection and diagnosis Description
■ Undervoltage shutdown The VN800PS-E is monolithic device made by
■ Overvoltage clamp using STMicroelectronics™ VIPower™ M0-3
■ Load current limitation technology, intended for driving any kind of load
with one side connected to ground.
■ Reverse battery protection
Active VCC pin voltage clamp protects the device
■ Electrostatic discharge protection
against low energy spikes. Active current
limitation combined with thermal shutdown and
automatic restart protect the device against
overload. Device automatically turns off in case of
ground pin disconnection.
This device is especially suitable for industrial
applications in norms conformity with IEC1131
(Programmable Controllers International
Standard).

Table 1. Device summary

Order codes
Package
Tube Tape and reel

SO-8 VN800PS-E VN800PSTR-E

September 2013 Doc ID 15610 Rev 4 1/27

www.st.com 1
Contents VN800PS-E

Contents

1 Block diagram and pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

2 Electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2.1 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2.2 Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2.3 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

3 Application information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
3.1 GND protection network against reverse battery . . . . . . . . . . . . . . . . . . . 15
3.1.1 Solution 1: resistor in the ground line (RGND only) . . . . . . . . . . . . . . . . 15
3.1.2 Solution 2: diode (DGND) in the ground line . . . . . . . . . . . . . . . . . . . . . 16
3.2 Microcontroller I/Os protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
3.3 Electrical characteristics curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
3.4 SO-8 maximum demagnetization energy . . . . . . . . . . . . . . . . . . . . . . . . . 19

4 Package and PCB thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

4.1 SO-8 thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

5 Package and packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

5.1 ECOPACK® . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
5.2 SO-8 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
5.3 SO-8 packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

6 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

2/27 Doc ID 15610 Rev 4

VN800PS-E List of tables

List of tables

Table 1. Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

Table 2. Suggested connections for unused and not connected pins . . . . . . . . . . . . . . . . . . . . . . . . 5
Table 3. Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Table 4. Thermal data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Table 5. Power . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Table 6. Switching (VCC = 24 V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Table 7. Input pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Table 8. VCC - output diode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Table 9. Status pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Table 10. Protections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Table 11. Truth table. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Table 12. Electrical transient requirements on VCC pin (part 1/3). . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Table 13. Electrical transient requirements on VCC pin (part 2/3). . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Table 14. Electrical transient requirements on VCC pin (part 3/3). . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Table 15. Thermal parameter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Table 16. SO-8 mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Table 17. Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

Doc ID 15610 Rev 4 3/27

List of figures VN800PS-E

List of figures

Figure 1. Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

Figure 2. Configuration diagram (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Figure 3. Current and voltage conventions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Figure 4. Status timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Figure 5. Switching time waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Figure 6. Peak short circuit current test circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Figure 7. Avalanche energy test circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Figure 8. Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Figure 9. Application schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Figure 10. Off-state output current. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Figure 11. High level input current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Figure 12. Status leakage current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Figure 13. On-state resistance vs Tcase . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Figure 14. On-state resistance vs VCC. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Figure 15. Input high level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Figure 16. Input low level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Figure 17. Turn-on voltage slope . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Figure 18. Overvoltage shutdown . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Figure 19. Input hysteresis voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Figure 20. Turn-off voltage slope . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Figure 21. ILIM vs Tcase . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Figure 22. SO-8 maximum turn off current versus load inductance. . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Figure 23. Demagnetization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Figure 24. SO-8 PC board(1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Figure 25. SO-8 Rthj-amb vs PCB copper area in open box free air condition . . . . . . . . . . . . . . . . . . . 20
Figure 26. SO-8 thermal impedance junction ambient single pulse. . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Figure 27. Thermal fitting model of a single channel HSD in SO-8 . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Figure 28. SO-8 package dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Figure 29. SO-8 tube shipment (no suffix) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Figure 30. SO-8 tape and reel shipment (suffix “TR”) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

4/27 Doc ID 15610 Rev 4

VN800PS-E Block diagram and pin description

1 Block diagram and pin description

Figure 1. Block diagram

9&&

29(592/7$*(
9&& '(7(&7,21
&/$03

81'(592/7$*(
'(7(&7,21

*1'
3RZHU&/$03

'5,9(5
287387
,1387
/2*,&
&855(17/,0,7(5

67$786

29(57(03(5$785(
'(7(&7,21

*$3*&)7

Figure 2. Configuration diagram (top view)

9&&   1&

287387 67$786
287387 ,1387

9&&   *1'

62
*$3*&)7

Table 2. Suggested connections for unused and not connected pins

Connection/pin Status N.C. Output Input

Floating X X X X
To ground X Through 10 KΩ resistor

Doc ID 15610 Rev 4 5/27

Electrical specifications VN800PS-E

2 Electrical specifications

Figure 3. Current and voltage conventions

,6

9)
,,1
9&&
,1387

,67$7 ,287
67$786 287387 9&&
*1'
9,1
967$7 9287
,*1'

*$3*&)7

2.1 Absolute maximum ratings

Table 3. Absolute maximum ratings
Value
Symbol Parameter Unit
SO-8

VCC DC supply voltage 41 V

- VCC Reverse DC supply voltage -0.3 V
- IGND DC reverse ground pin current -200 mA
IOUT DC output current Internally limited A
- IOUT Reverse DC output current -6 A
IIN DC input current +/- 10 mA
VIN Input voltage range -3/+VCC V
VSTAT DC status voltage +VCC V
Electrostatic discharge (human body model: R = 1.5 KΩ;
C = 100 pF)
4000 V
- Input
VESD 4000 V
- Status
5000 V
- Output
5000 V
- VCC
Ptot Power dissipation TC = 25 °C 4.2 W
Maximum switching energy
EMAX 121 mJ
(L = 77.5 mH; RL = 0 Ω; Vbat = 13.5 V; Tjstart = 150 °C; IL = 1.5 A)

6/27 Doc ID 15610 Rev 4

VN800PS-E Electrical specifications

Table 3. Absolute maximum ratings (continued)

Value
Symbol Parameter Unit
SO-8

Tj Junction operating temperature Internally limited °C

Tc Case operating temperature -40 to 150 °C
Tstg Storage temperature -55 to 150 °C

2.2 Thermal data

Table 4. Thermal data
Value
Symbol Parameter Unit
SO-8

Rthj-lead Thermal resistance junction-lead max 30 °C/W

93 (1)
°C/W
Rthj-amb Thermal resistance junction-ambient max
82 (2)
°C/W
1. When mounted on FR4 printed circuit board with 0.5 cm2 of copper area (at least 35 µm thick) connected to all VCC pins.
2. When mounted on FR4 printed circuit board with 2 cm2 of copper area (at least 35 µm thick).

Doc ID 15610 Rev 4 7/27

Electrical specifications VN800PS-E

2.3 Electrical characteristics

Values specified in this section are for 8 V< VCC < 36 V; -40 °C < Tj < 150 °C, unless
otherwise stated.

Table 5. Power
Symbol Parameter Test conditions Min. Typ. Max. Unit

Operating supply
VCC 5.5 36 V
voltage
VUSD Undervoltage shutdown 3 4 5.5 V
VOV Overvoltage shutdown 36 42 V
IOUT = 0.5 A; Tj = 25 °C 135 mΩ
RON On-state resistance
IOUT = 0.5 A 270 mΩ
Off-state; VCC = 24 V; Tcase = 25 °C 10 20 µA
IS Supply current On-state; VCC = 24 V 1.5 3.5 mA
On-state; VCC = 24 V; Tcase = 100 °C 2.6 mA
VCC = VSTAT = VIN = VGND = 24 V;
ILGND Output current at turn-off 1 mA
VOUT = 0 V
IL(off1) Off-state output current VIN = VOUT = 0 V 0 50 µA
VIN = VOUT = 0 V; VCC = 13 V;
IL(off2) Off-state output current 5 µA
Tj = 125 °C
VIN = VOUT = 0 V; VCC = 13 V;
IL(off3) Off-state output current 3 µA
Tj = 25 °C

Table 6. Switching (VCC = 24 V)

Symbol Parameter Test conditions Min. Typ. Max. Unit

RL = 48 Ω from VIN rising edge to

td(on) Turn-on delay time - 10 - µs
VOUT = 2.4 V
RL = 48 Ω from VIN falling edge to
td(off) Turn-off delay time - 40 - µs
VOUT = 21.6 V
See
RL = 48 Ω from VOUT = 2.4 V to
dVOUT/dt(on) Turn-on voltage slope - relative - V/µs
VOUT = 19.2 V
diagram
See
RL = 48 Ω from VOUT = 21.6 V to
dVOUT/dt(off) Turn-off voltage slope - relative - V/µs
VOUT = 2.4 V
diagram

Table 7. Input pin

Symbol Parameter Test conditions Min. Typ. Max. Unit

VINL Input low level - 1.25 V

IINL Low level input current VIN = 1.25 V 1 - µA
VINH Input high level 3.25 - V

8/27 Doc ID 15610 Rev 4

VN800PS-E Electrical specifications

Table 7. Input pin (continued)

Symbol Parameter Test conditions Min. Typ. Max. Unit

IINH High level input current VIN=3.25 V - 10 µA

VI(hyst) Input hysteresis voltage 0.5 - V
IIN Input current VIN = VCC = 36 V - 200 µA

Table 8. VCC - output diode

Symbol Parameter Test conditions Min. Typ. Max. Unit

VF Forward on voltage -IOUT = 0.6 A; Tj = 150 °C - - 0.6 V

Table 9. Status pin

Symbol Parameter Test conditions Min. Typ. Max. Unit

VSTAT Status low output voltage ISTAT = 1.6 mA - - 0.5 V

ILSTAT Status leakage current Normal operation; VSTAT = VCC = 36 V - - 10 µA
Status pin input
CSTAT Normal operation; VSTAT = 5 V - - 30 pF
capacitance

Table 10. Protections(1)

Symbol Parameter Test conditions Min. Typ. Max. Unit

TTSD Shutdown temperature 150 175 200 °C

TR Reset temperature 135 °C
Thyst Thermal hysteresis 7 15 °C
Status delay in overload
TSDL Tj>Tjsh 20 µs
condition
Ilim DC short circuit current VCC = 24 V; RLOAD = 10 mΩ 0.7 2 A
Vdemag Turn-off output clamp voltage IOUT = 0.5 A; L = 6 mH VCC - 47 VCC - 52 VCC - 57 V
1. To ensure long term reliability under heavy overload or short circuit conditions, protection and related diagnostic signals
must be used together with a proper software strategy. If the device is subjected to abnormal conditions, this software must
limit the duration and number of activation cycles.

Doc ID 15610 Rev 4 9/27

Electrical specifications VN800PS-E

Figure 4. Status timing

29(57(0367$7867,0,1*

9,1 7M!7MVK

967$7

W6'/ W6'/

*$3*&)7

Table 11. Truth table

Conditions Input Output Status

L L H
Normal operation
H H H
L L H
Current limitation H X (Tj < TTSD) H
H X (Tj > TTSD) L
L L H
Over temperature
H L L
L L X
Undervoltage
H L X
L L H
Overvoltage
H L H

10/27 Doc ID 15610 Rev 4

VN800PS-E Electrical specifications

Figure 5. Switching time waveforms

9287




G9287GW RII
G9287GW RQ

WU  WI
W

9,1
7G RQ 7G RII

*$3*&)7

Doc ID 15610 Rev 4 11/27

Electrical specifications VN800PS-E

Table 12. Electrical transient requirements on VCC pin (part 1/3)

Test levels
ISO T/R 7637/1
test pulse Delays and
I II III IV
impedance

1 -25 V -50 V -75 V -100 V 2 ms, 10 Ω

2 +25 V +50 V +75 V +100 V 0.2 ms, 10 Ω
3a -25 V -50 V -100 V -150 V 0.1 µs, 50 Ω
3b +25 V +50 V +75 V +100 V 0.1 µs, 50 Ω
4 -4 V -5 V -6 V -7 V 100 ms, 0.01 Ω
5 +26.5 V +46.5 V +66.5 V +86.5 V 400 ms, 2 Ω

Table 13. Electrical transient requirements on VCC pin (part 2/3)

ISO T/R 7637/1 Test levels results

Test pulse I II III IV

1 C C C C
2 C C C C
3a C C C C
3b C C C C
4 C C C C
5 C E E E

Table 14. Electrical transient requirements on VCC pin (part 3/3)

Class Contents

All functions of the device are performed as designed after exposure to

C
disturbance.
One or more functions of the device is not performed as designed after
E exposure to disturbance and cannot be returned to proper operation without
replacing the device.

12/27 Doc ID 15610 Rev 4

VN800PS-E Electrical specifications

Figure 6. Peak short circuit current test circuit

9&&

Nё

67$786 9&&
&21752/
81,7 ,1387 287387
5,1

*1'

5/ Pё

*1'

*$3*&)7

Figure 7. Avalanche energy test circuit

9&&

Nё

67$786 9&&
&21752/
81,7 ,1387 287387
5,1

*1'

/2$'

*1'

*$3*&)7

Doc ID 15610 Rev 4 13/27

Electrical specifications VN800PS-E

Figure 8. Waveforms
1250$/23(5$7,21

,1387
/2$'92/7$*(
67$786

81'(592/7$*(
9&& 986'K\VW
986'
,1387
/2$'92/7$*(
67$786 XQGHILQHG

29(592/7$*(
9&&929 9&&!929
9&&

,1387
/2$'92/7$*(
67$786

29(57(03(5$785(
776'
75
7M
,1387
/2$'&855(17
67$786

*$3*&)7

14/27 Doc ID 15610 Rev 4

VN800PS-E Application information

3 Application information

Figure 9. Application schematic

9&&

9&&
9'& 9
5SURW
9ROW
5HJXODWRU
67$786Q
&RQWURO 
GLDJQRVWLF,2

%86
$6,&

5SURW ,1387Q 287387Q

/2$'

*1'
/

5*1' '*1'
9*1'

*$3*&)7

3.1 GND protection network against reverse battery

3.1.1 Solution 1: resistor in the ground line (RGND only)

This can be used with any type of load.
The following is an indication on how to dimension the RGND resistor.
1) RGND ≤ 600 mV / (IS(on)max)
2) RGND ≥ (-VCC) / (-IGND)
where -IGND is the DC reverse ground pin current and can be found in the absolute
maximum rating section of the device’s datasheet.
Power dissipation in RGND (when VCC < 0: during reverse battery situations) is:
PD= (-VCC)2/RGND
This resistor can be shared amongst several different HSD. Please note that the value of this
resistor should be calculated with formula (1) where IS(on)max becomes the sum of the
maximum on-state currents of the different devices.
Please note that if the microprocessor ground is not common with the device ground then
the RGND produces a shift (IS(on)max * RGND) in the input thresholds and the status output
values. This shift varies depending on many devices are on in the case of several high side
drivers sharing the same RGND.

Doc ID 15610 Rev 4 15/27

Application information VN800PS-E

If the calculated power dissipation leads to a large resistor or several devices have to share
the same resistor then the ST suggests to utilize Solution 2 (see Section 3.1.2).

3.1.2 Solution 2: diode (DGND) in the ground line

A resistor (RGND = 1 kΩ) should be inserted in parallel to DGND if the device is driving an
inductive load.
This small signal diode can be safely shared amongst several different HSD. Also in this
case, the presence of the ground network produces a shift (≈600 mV) in the input threshold
and the status output values if the microprocessor ground is not common with the device
ground. This shift not varies if more than one HSD shares the same diode/resistor network.
Series resistor in input and status lines are also required to prevent that, during battery
voltage transient, the current exceeds the absolute maximum rating.
Safest configuration for unused input and status pin is to leave them unconnected.

3.2 Microcontroller I/Os protection

If a ground protection network is used and negative transients are present on the VCC line,
the control pins are pulled negative. ST suggests to insert a resistor (Rprot) in line to prevent
the microcontroller I/Os pins to latch-up.
The value of these resistors is a compromise between the leakage current of microcontroller
and the current required by the HSD I/Os (Input levels compatibility) with the latch-up limit of
microcontroller I/Os.
-VCCpeak/Ilatchup ≤ Rprot ≤ (VOHµC-VIH-VGND) / IIHmax
Calculation example:
For VCCpeak = -100 V and Ilatchup ≥ 20 mA; VOHµC ≥ 4.5 V
5k Ω ≤ Rprot ≤ 65 kΩ.
Recommended Rprot value is 10 kΩ.

16/27 Doc ID 15610 Rev 4

VN800PS-E Application information

3.3 Electrical characteristics curves

Figure 10. Off-state output current Figure 11. High level input current
IL(off1) (µA) Iih (µA)
2.5 8

2.25
7
Off state
2 Vcc=36V Vin=3.25V
6
Vin=Vout=0V
1.75
5
1.5

1.25 4

1 3

0.75
2
0.5
1
0.25
0
0
-50 -25 0 25 50 75 100 125 150 175
-50 -25 0 25 50 75 100 125 150 175
Tc (ºC)
Tc (ºC)

Figure 12. Status leakage current Figure 13. On-state resistance vs Tcase
Ilstat (µA) Ron (mOhm)
0.1 400

0.09
350
Vstat=Vcc=36V Iout=0.5A
0.08
Vcc=8V; 13V; 36V
300
0.07

0.06 250

0.05 200

0.04
150
0.03
100
0.02

0.01 50

0 0
-50 -25 0 25 50 75 100 125 150 175 -50 -25 0 25 50 75 100 125 150 175
Tc (ºC) Tc (ºC)

Figure 14. On-state resistance vs VCC Figure 15. Input high level

Ron (mOhm) Vih (V)

400 3.6

350 3.4

Iout=0.5A
300 3.2

250 3
Tc= 150ºC
200 2.8

150 2.6
Tc= 25ºC
100 2.4

Tc= - 40ºC 2.2

50

0 2
5 10 15 20 25 30 35 40 -50 -25 0 25 50 75 100 125 150 175

Vcc (V) Tc (°C)

Doc ID 15610 Rev 4 17/27

Application information VN800PS-E

Figure 16. Input low level Figure 17. Turn-on voltage slope

Vil (V) dVout/dt(on) (V/ms)

2.6 1600

2.4 1400
Vcc=24V
Rl=48Ohm
2.2 1200

2 1000

1.8 800

1.6 600

1.4 400

1.2 200

1 0
-50 -25 0 25 50 75 100 125 150 175 -50 -25 0 25 50 75 100 125 150 175
Tc (°C) Tc (ºC)

Figure 18. Overvoltage shutdown Figure 19. Input hysteresis voltage

Vov (V) Vhyst (V)

50 1.5

48 1.4

46 1.3

44 1.2

42 1.1

40 1

38 0.9

36 0.8

34 0.7

32 0.6

30 0.5
-50 -25 0 25 50 75 100 125 150 175 -50 -25 0 25 50 75 100 125 150 175
Tc (°C) Tc (°C)

Figure 20. Turn-off voltage slope Figure 21. ILIM vs Tcase

dVout/dt(off) (V/ms) Ilim (A)

800 2.5

2.25
700
Vcc=24V Vcc=24V
2
Rl=48Ohm Rl=10mOhm
600
1.75
500
1.5

400 1.25

1
300
0.75
200
0.5
100
0.25

0 0
-50 -25 0 25 50 75 100 125 150 175 -50 -25 0 25 50 75 100 125 150 175
Tc (ºC) Tc (ºC)

18/27 Doc ID 15610 Rev 4

VN800PS-E Application information

3.4 SO-8 maximum demagnetization energy

Figure 22. SO-8 maximum turn off current versus load inductance
ILMAX (A)
10

A
B
1
C

0.1
1 10 100 1000
L(mH )
Note: Legend
A = Single pulse at TJstart = 150 ºC
B = Repetitive pulse at TJstart = 100 ºC
C = Repetitive Pulse at TJstart = 125 ºC
Conditions:
VCC = 13.5 V
Values are generated with RL = 0 Ω
In case of repetitive pulses, Tjstart (at beginning of each demagnetization) of every pulse
must not exceed the temperature specified above for curves B and C.

Figure 23. Demagnetization

9,1,/

'HPDJQHWL]DWLRQ 'HPDJQHWL]DWLRQ 'HPDJQHWL]DWLRQ

*$3*&)7

Doc ID 15610 Rev 4 19/27

Package and PCB thermal data VN800PS-E

4 Package and PCB thermal data

4.1 SO-8 thermal data

Figure 24. SO-8 PC board(1)

1. Layout condition of Rth and Zth measurements (PCB FR4 area = 58 mm x 58 mm, PCB thickness = 2 mm,
Cu thickness = 35 µm, Copper areas: 0.14 cm2, 2 cm2).

Figure 25. SO-8 Rthj-amb vs PCB copper area in open box free air condition

20/27 Doc ID 15610 Rev 4

VN800PS-E Package and PCB thermal data

Figure 26. SO-8 thermal impedance junction ambient single pulse

ZT H (°C/W)
1000

0.5 cm2
100
2 cm2

10

0.1
0.0001 0.001 0.01 0.1 1 10 100 1000
T ime (s)

Figure 27. Thermal fitting model of a single channel HSD in SO-8

Tj C1 C2 C3 C4 C5 C6

R1 R2 R3 R4 R5 R6

Pd

T_amb

Equation 1 Pulse calculation formula

Z THδ = R TH ⋅ δ + Z THtp ( 1 – δ )

where
δ = tp ⁄ T

Doc ID 15610 Rev 4 21/27

Package and PCB thermal data VN800PS-E

Table 15. Thermal parameter

Area/island (cm2) 0.14 2

R1 (°C/W) 0.24
R2 (°C/W) 1.2
R3 (°C/W) 4.5
R4 (°C/W) 21
R5 (°C/W) 16
R6 (°C/W) 58 28
C1 (W.s/°C) 0.00015
C2 (W.s/°C) 0.0005
C3 (W.s/°C) 7.50E-03
C4 (W.s/°C) 0.045
C5 (W.s/°C) 0.35
C6 (W.s/°C) 1.05 2

22/27 Doc ID 15610 Rev 4

VN800PS-E Package and packing information

5 Package and packing information

5.1 ECOPACK®
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.

5.2 SO-8 package information

Table 16. SO-8 mechanical data
mm
Dim.
Min. Typ. Max.

A 1.75
a1 0.1 0.25
a2 1.65
a3 0.65 0.85
b 0.35 0.48
b1 0.19 0.25
C 0.25 0.5
c1 45
D 4.8 5
E 5.8 6.2
e 1.27
e3 3.81
F 3.8 4
L 0.4 1.27
M 0.6
S 8
L1 0.8 1.2

Doc ID 15610 Rev 4 23/27

Package and packing information VN800PS-E

Figure 28. SO-8 package dimensions

0016023 D

24/27 Doc ID 15610 Rev 4

VN800PS-E Package and packing information

5.3 SO-8 packing information

The devices can be packed in tube or tape and reel shipments (see the Device summary on
page 1).

Figure 29. SO-8 tube shipment (no suffix)

Base Q.ty 100

B
C Bulk Q.ty 2000
Tube length (± 0.5) 532
A 3.2
A B 6
C (± 0.1) 0.6

All dimensions are in mm.

Figure 30. SO-8 tape and reel shipment (suffix “TR”)

REEL DIMENSIONS
Base Q.ty 2500
Bulk Q.ty 2500
A (max) 330
B (min) 1.5
C (± 0.2) 13
F 20.2
G (+ 2 / -0) 12.4
N (min) 60
T (max) 18.4

All dimensions are in mm.

TAPE DIMENSIONS
According to Electronic Industries Association
(EIA) Standard 481 rev. A, Feb 1986
Tape width W 12
Tape Hole Spacing P0 (± 0.1) 4
Component Spacing P 8
Hole Diameter D (± 0.1/-0) 1.5
Hole Diameter D1 (min) 1.5
Hole Position F (± 0.05) 5.5
Compartment Depth K (max) 4.5
Hole Spacing P1 (± 0.1) 2

All dimensions are in mm. End

Start

Top No components Components No components

cover
tape 500mm min
Empty components pockets 500mm min
saled with cover tape.

User direction of feed

Doc ID 15610 Rev 4 25/27

Revision history VN800PS-E

6 Revision history

Table 17. Document revision history

Date Revision Changes

21-Apr-2009 1 Initial release

Updated Features list.
31-May-2010 2 Updated Table 3: Absolute maximum ratings.
Reformatted entire document.
Updated Features list.
Updated following tables:
07-Feb-2011 3
– Table 4: Thermal data
– Table 16: SO-8 mechanical data
18-Sep-2013 4 Updated Disclaimer.

26/27 Doc ID 15610 Rev 4

VN800PS-E

Please Read Carefully:

Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the
right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any
time, without notice.
All ST products are sold pursuant to ST’s terms and conditions of sale.
Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no
liability whatsoever relating to the choice, selection or use of the ST products and services described herein.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this
document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products
or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such
third party products or services or any intellectual property contained therein.

UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED
WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED
WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS
OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.
ST PRODUCTS ARE NOT DESIGNED OR AUTHORIZED FOR USE IN: (A) SAFETY CRITICAL APPLICATIONS SUCH AS LIFE
SUPPORTING, ACTIVE IMPLANTED DEVICES OR SYSTEMS WITH PRODUCT FUNCTIONAL SAFETY REQUIREMENTS; (B)
AERONAUTIC APPLICATIONS; (C) AUTOMOTIVE APPLICATIONS OR ENVIRONMENTS, AND/OR (D) AEROSPACE APPLICATIONS
OR ENVIRONMENTS. WHERE ST PRODUCTS ARE NOT DESIGNED FOR SUCH USE, THE PURCHASER SHALL USE PRODUCTS AT
PURCHASER’S SOLE RISK, EVEN IF ST HAS BEEN INFORMED IN WRITING OF SUCH USAGE, UNLESS A PRODUCT IS
EXPRESSLY DESIGNATED BY ST AS BEING INTENDED FOR “AUTOMOTIVE, AUTOMOTIVE SAFETY OR MEDICAL” INDUSTRY
DOMAINS ACCORDING TO ST PRODUCT DESIGN SPECIFICATIONS. PRODUCTS FORMALLY ESCC, QML OR JAN QUALIFIED ARE
DEEMED SUITABLE FOR USE IN AEROSPACE BY THE CORRESPONDING GOVERNMENTAL AGENCY.

Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void
any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any
liability of ST.
ST and the ST logo are trademarks or registered trademarks of ST in various countries.
Information in this document supersedes and replaces all information previously supplied.
The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners.

© 2013 STMicroelectronics - All rights reserved

STMicroelectronics group of companies

Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan -
Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America
www.st.com

Doc ID 15610 Rev 4 27/27