Pressfit Guideline

CE23-0104
MHD2 Product Backplane Installation Process
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Specification Revision Status
Revision Description Initial Date

A AAO Initial release (Ref TB-2252, Rev E) GSP 1-04-2023
MHD2 Product Backplane Installation Process CE23-0104
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TABLE OF CONTENTS
2.0 REFERENCE 4
2.1 DOCUMENTS 4
2.2 TOOLING 6
3.0 PROCEDURE 10
Appendix A 18
XCede HD , XCede HD PLUS & XCede HD2 Backplane Press Recommendations and Pressing
Procedures 18
XCede HD , XCede HD PLUS & XCede HD2 Backplane Press Recommendations 18
XCede HD , XCede HD PLUS & XCede HD2 Backplane Recommended Press Procedures 19
XCede HD , XCede HD PLUS & XCede HD2 BP Recommended Press Settings for Tyco (ASG)
MEP-12T Presses 20
Copyright © Amphenol Corporation 2023 • All rights reserved Page 2 of 35

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LIST OF FIGURES
Figure 1: XCede HD PLUS Plus Solid Loading Head (for reference) 8
Figure 2: Leftmost row of compliant pins in the PTH. 11
Figure 3: With the leftmost row entirely placed, roll the module toward the right, placing the remaining
compliant pins. 12
Figure 4: Backplane module is fully in place. Note the first row of compliants. 13
Figure 5: Rightmost view of assembly, check for bent pins. 14
Figure 6: The 4 Pair seating head matches the 4 Pair Backplane module. 15
Figure 7: Ensure the cavities in the seating head match up to the blades on the backplane module. 16
Figure 8: MEP-12T Manual-Electric Press 20
Figure 9: Main Menu of MEP-12T Press 21
Figure 10: Tool Editor Screen of MEP-12T Press (Representative screen - tool length can vary based on
connector configuration) 23
Figure 11: Connector Editor Screen of MEP-12T press 25
Figure 12: Profile Editor of MEP-12T press displaying the Amphenol TCS ATCS_XCede
HD_FG_DWELL.prf profile, Revision A. 28
Figure 13: Press Data Editor of MEP-12T press. 30
Figure 14: Typical Force vs. Distance Curve of MEP-12T press for XCede HD , XCede HD PLUS &
XCede HD2 connectors. 31
Figure 15: XCede HD , XCede HD PLUS & XCede HD2 pressing Force vs. Distance Graph showing two
shapes of the knee area utilizing an MEP-12T press. 33
Figure 16: Force vs. Distance Graph showing the "Max Force Per Pin" zone. 34
Figure 17: Force vs. Distance Graph showing the 75 Degree Force Gradient Zone. 35
LIST OF TABLES
Table 1: Connector Setup dimensions for XCede HD , XCede HD PLUS & XCede HD2 Backplane
connectors for MEP-12T press. 26

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1.0 SCOPE
1.1 This document describes the methods and tooling for application of Amphenol TCS
XCede HD, XCede HD PLUS & XCede HD2 press fit backplane connector family onto
a printed circuit board (PCB).
2.0 REFERENCE
2.1 DOCUMENTS
2.1.1 XCede HD 2 Pair Backplane With Extra Ground Customer Use Drawings C-
923-201C-500 2 Pair, 6 Column Differential Backplane Module, Thick Wall
C-923-201E-500 2 Pair, 8 Column Differential Backplane Module, Thick Wall
C-923-201G-500 2 Pair, 10 Column Differential Backplane Module, Thick Wall
C-923-201J-500 2 Pair, 4 Column Differential Backplane Module, Thick Wall
2.1.2 XCede HD 3 Pair Backplane Without Extra Ground Customer Use Drawings
C-923-300C-500 3 Pair, 6 Column Differential Backplane Module
C-923-300E-500 3 Pair, 8 Column Differential Backplane Module
C-923-300J-500 3 Pair, 4 Column Differential Backplane Module
C-923-301C-500 3 Pair, 6 Column Differential Backplane Module, Thick Wall
C-923-301J-500 3 Pair 4 Column Differential Backplane Module, Thick Wall
2.1.3 XCede HD 4 Pair Backplane Without Extra Ground Customer Use Drawings C-
923-400C-500 4 Pair, 6 Column Differential Backplane Module
2.1.4 XCede HD 6 Pair Backplane Without Extra Ground Customer Use Drawings C-

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2.1.5 XCede HD PLUS 3 Pair Backplane With Extra Ground Customer Use
Drawings
Drawings
C-926-403C-500 4 Pair, 6 Column Differential Backplane Module, with cross
shield
C-926-403E-500 4 Pair, 8 Column Differential Backplane Module, with Cross
shield
C-926-403J-500 4 Pair, 4 Column Differential Backplane Module, with Cross
shield
Drawings
C-926-603C-500 6 Pair, 6 Column Differential Backplane Module, with Cross
shield
C-926-603E-500 6 Pair, 8 Column Differential Backplane Module, with Cross
shield
C-926-603J-500 6 Pair, 4 Column Differential Backplane Module, with Cross
shield
2.1.8 XCede HD2 3 Pair Backplane With Extra Ground Customer Use Drawings C-
2.1.9 XCede HD2 4 Pair Backplane With Extra Ground Customer Use Drawings C-
2.1.10 XCede HD2 6 Pair Backplane With Extra Ground Customer Use Drawings

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C-972-601G-500 6 Pair, 10 Column Differential Backplane Module
2.1.11 XCede HD2 3 Pair Backplane Without Extra Ground Customer Use
Drawings
Drawings
Drawings
2.1.14 XCede HD2 Plus 3 Pair Backplane With Extra Ground Customer Use
Drawings
C-973-305C-500 3 Pair, 6 Column Differential Backplane Module, Lite
C-973-305E-500 3 Pair, 8 Column Differential Backplane Module, Lite
C-973-305J-500 3 Pair, 4 Column Differential Backplane Module, Lite
Drawings
Drawings
C-973-605G-500 6 Pair, 10 Column Differential Backplane Module, Lite
2.2 TOOLING
2.2.1 Press System

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The application of Amphenol TCS XCede HD , XCede HD PLUS & XCede

HD2 press-fit style components can be performed across many different
press platforms, however there are minimum performance features and
capabilities that are strongly recommend be available:
2.2.1.1 Rate
Recommended press head installation rate is 0.05 +/- .01 in/sec with
the appropriate installation force.
2.2.1.2 Structure
The press, fixture, and tooling combination need to be adequately
rigid such that there is a minimum deflection during the pressing
process, and the forces are transmitted directly to the connector
without inducing any side load or moment onto the connector
assembly. The press also needs to be capable of applying a pre-load
force minimum of 100lbs, and dwelling at that Z-height for
approximately 1-2 seconds. This allows the press system to stabilize
prior to actual insertion.
2.2.1.3 Feedback
The application press should have the capability to monitor, display,
record, and feed back insertion force data to the Z axis speed
controller throughout an individual press cycle. This capability
allows for continuous insertion process monitoring, technical
analysis and data collection in the event of a failure, and will alert
the operator in the case of a mechanical machine problem. Speed or
height controls should also allow a temporary press cycle to stop at a
repeatable position with reference to the board surface, or with
reference to the insertion force. This ability is a requirement in
certain connector and board combinations.
2.2.2 Application Tools

XCede HD , XCede HD PLUS & XCede HD2 2, 3, 4, and 6 pair backplane
connectors have dedicated loading heads for each product. Different loading
head sizes with different lengths (based on how many positions the connector
has) are available for each backplane product; refer to section 2.2.2.1 and
2.2.2.2. Amphenol TCS recommends customers and contact manufactures

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purchase the loading head tooling through their ATCS Field Apps Engineer
to ensure proper clearances for the backplane installation.
2.2.2.1 XCede HD PLUS & XCede HD2 With Extra Ground Version
Application Tools – SOLID HEAD
DESCRIPTION PART NUMBER SHROUD WALL

3 PAIR x 4 POSITION 694-4922-000 Thick Wall
Figure 1: XCede HD PLUS Solid Loading Head (for reference)

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2.2.2.2 XCede HD & XCede HD2 Without Extra Ground Version(1)

Application Tools – Solid Head
PART
DESCRIPTION NUMBER SHROUD WALL
3 PAIR x 4 POSITION 694-4706- Standard
000
000
000
000
000
000
000
000
000
2 PAIR x 4 POSITION 694-4762- Thick Wall
000
000
000
000
000
000
000
000
000
000
000
000
000
Note1:
XCede HD2 without extra ground version belongs to Thick Wall configuration.
2.2.2.3 Support Tooling/Fixture

Customers and contract manufacturers should design or purchase the

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appropriate support fixture to support the PCB during the backplane

installation process (this support fixture need only be planar in order to
support and elevate the PCB and does not require any special modeling). The
support fixture is not supplied by Amphenol, if assistance with the fixture
design is needed please contact your local field application engineer.
DESCRIPTION PART NUMBER
6” Loading Head Mount Plate 699-2588-000

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3.0 PROCEDURE
Step 1. Locate the correct seating head and support pallet/fixture. The seating head should
match up to your individual connectors along their length (position) and width (pair).
Refer to sections 2.2.2.1, 2.2.2.2, and 2.2.2.3 for the correct tool to fit the connector.
Step 2. Place the support fixture (pallet) onto the press bed, and ensure:
- Pallet is square with reference to the press head
- Pallet is flat to the press bed, with no excessive bow or twist
- PCB board is pinned to the pallet
- Pallet is pinned to the press bed
- Loading head is pinned to the press ram
Step 3. Ensure the press has the required installation force, alignment, and speed controls
capable of pressing the specific configuration connector being installed. Refer to
section 2.2.1 for the recommended force and press head rate.
Step 4. Place the PCB onto the pallet and remove the connector from the packaging. If the
connector is supplied in a tray, simply remove the cover and lift the connector from the
tray. If the connector is supplied in a tube, first remove the shipping tape and hardware.
If the tube has a retaining pin, cut the pin with wire cutters, and remove the end
connector. Lay the tube on a flat table with the connector compliant pins facing up. To
properly remove the connectors from the tube, use a round or square rod to push the
connectors out one at a time.
Step 5. Verify the compliant pins of the connector were not damaged or bent during shipping
or removal from the packaging. Visually inspect for bent pins, looking down both the
width and length of the connector pin pattern for any grossly misaligned pins. If a
compliant true position gage has been ordered, place the connector onto the gage in the
same manner as the connector would be placed onto a PCB, and look for any difficulty
during placement, or any compliant pins that do not protrude out the back side of the
gage. If any compliant pins are out of position or broken, discard the connector and
begin Step 5 again with a new connector.

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NOTE: Amphenol TCS recommends the purchase or the design and manufacture
of a backplane compliant pin true position gage for the specific configuration of
the connector being installed. The compliant pin true position gage can ensure
that the compliant pins are in their proper position immediately before the
connector is placed onto the board, significantly reducing the possibility of
connector or PCB damage. Contact your local Amphenol TCS application
engineer for ordering information of this part.
Step 6. Hold the connector up off the PCB and place the row of compliant pins, opposite to the
tabbed side of the backplane, into the correct plated through hole (PTH), see Figure 2.
With the front of the connector still up off the board, roll the connector right to left,
into the remaining PTHs, see Figures 3-4.
Figure 2: Leftmost row of compliant pins in the PTH.

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Figure3: With the leftmost row entirely placed, roll the module toward the right, placing the
remaining compliant pins.

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Figure4: Backplane module is fully in place. Note the first row of complaints.
Step 7. Check for any bent pins protruding from under the connector assembly, see Figure 5.

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Figure5: Rightmost view of assembly, check for bent pins.
Step 8. Select the correct seating head based on the connector platform (3, 4, or 6 pair) and the
length of the connector, see Figure 6. Position the seating head directly over the
connector blades being sure to align the proper cavities in the seating head to the blades
on the backplane, see Figure 7.

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Figure6: The 4 Pair seating head matches the 4 Pair Backplane module.

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Figure7: Ensure the cavities in the seating head match up to the blades on the backplane module.
Step 9. Initiate the press cycle and seat the connector onto the board surface.
NOTE: Ensure the seating head does not come into contact with any other components on the PCB
adjacent or behind the connector throughout the placement and pressing process. See the XCede HD,
XCede HD PLUS & XCede HD2 Customer Use Drawings for a drawing of the application and rework
keep out zones.

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Step 10. If the PCB thickness allows, inspect the connector pattern from the secondary side, and
verify the presence of a compliant pin tip in each PTH.

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Appendix A
XCede HD , XCede HD PLUS & XCede HD2 Backplane Press Recommendations and Pressing
Procedures
XCede HD , XCede HD PLUS & XCede HD2 Backplane Press Recommendations
The press used for inserting XCede HD , XCede HD PLUS & XCede HD2 backplane modules into the
PCB should have the minimum capabilities defined as follows:
1) The press shall be suitably rigid and stiff to provide a stable platform to support the installation
of any size connectors. Installation forces will vary depending on connector size, plated through hole size,
and plated through hole finish (i.e. Gold). The press, tooling and fixtures need to be sufficiently rigid to
prevent any bowing or deflection during the installation process.
2) ATCS recommends a press that has the capability to apply a pre-load force of approximately
100lbs and dwelling at that force for approximately 1-2 sec. This allows the entire press setup to stabilize
just prior to inserting the connector into the plated through hole. This pre-load force eliminates any bow
that might exist in the PCB and firmly seats the connector into the PTH just prior to the installation
process.
3) The press shall be capable of controlling the insertion rate. ATCS recommends an insertion rate
of 0.050 in/sec to ensure the compliant pins are properly inserted into the PTH and reduces any damage to
the PTH.
4) The press shall be capable of a pressing process per a force gradient curve. To do this, the press
must have real time force feedback from the press head and the necessary software, this allows for
consistent backplane module installation and accounts for PCB thickness and connector height tolerances.
It is not recommended to insert backplane modules to a specific height, due to the PCB and connector
tolerances build up. Installing a backplane module to a specific height may result in over seating or under
seating the connector. Over seating a backplane module can cause damage to the connector and/or the
PCB. Under seating the connector will not fully insert the compliant pin into the PTH and can cause
mechanical and reliability issues.

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NOTE: Amphenol TCS recommends using the Tyco Electronics (ASG) MEP-12T for all
XCede HD , XCede HD PLUS & XCede HD2 connector pressing. The MEP-12T has all of the
capabilities outlined above.
XCede HD , XCede HD PLUS & XCede HD2 Backplane Recommended Press Procedures
The following are recommended process steps to follow when installing XCede HD , XCede HD PLUS &
XCede HD2 Backplane connectors.
1) Each PCB should be inspected for blocked holes. This can be accomplished by simply holding
the board up to a light and visually looking at the connector plated through hole pattern for any holes that
are not clear. This ensures that the connector will insert and seat properly into the PCB.
2) Each PCB should be inspected for the finished hole size (FHS). Compliance to the required
FHS is important in maintaining a consistent pressing process; refer to TB-2237 for FHS requirements.
Approximately 6-12 holes should be inspected across the connector hole pattern.
3) After pressing, the completed assembly should be inspected. Inspect the PCB opposite the
connector to verify that the compliant pins are in the holes. If a pin is missing (provide a picture to show
the defect) the assembly can be repaired by removing the defective backplane module and inserting a new
one per TB-2245. The most common cause of a missing pin is improper loading of the connector, which
causes a bent pin prior to pressing.
For customers who are using a MEP 12T press, please contact your local ATCS application engineer for
tooling and fixturing support.

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XCede HD , XCede HD PLUS & XCede HD2 BP Recommended Press Settings for Tyco (ASG) MEP-
12T Presses
The following settings are recommended for applying XCede HD , XCede HD PLUS & XCede HD2
connectors using MEP-12T presses. If the press is not a MEP-12T, please contact your ATCS application
engineer for assistance.
Figure8: MEP-12T Manual-Electric Press
Amphenol-TCS has developed a press profile that can be used on MEP presses to install XCede HD ,
XCede HD PLUS & XCede HD2 connectors onto PCBs. The profile utilizes force feedback features on
the MEP-12T press that ensure proper pressing of connectors. The XCede HD , XCede HD PLUS &
XCede HD2 press profile developed by Amphenol-TCS is named: ATCS_XCede HD_FG_DWELL.prf.
• If this profile is not installed on your press, please contact your ATCS fields application
engineer for assistance. Other profiles tailored to specific connector and application needs
may also be used, consult your ATCS fields application engineer for more information
and assistance.

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The following steps describe proper creation, setup, and application of XCede HD , XCede HD PLUS &
XCede HD2 backplane modules: The MEP press main menu has 4 major screens that are required to
setup a connector, tool and PCB for pressing, see Figure 9:
• 1 - Tool Editor
This screen is where the tool name, ID and dimensions are entered.
• 2 -Connector Editor
This screen is where connector name, dimensions, pin count, error limits, and
termination method are entered.
• 3 - Profile Editor
This screen is where the list of action steps for the press to execute is entered (the
ATCS_XCede HD_FG_DWELL.prf profile)
• 4 - Press Data Editor
This screen is where a printed wiring board (PWB) is assigned connectors to be
pressed, board thickness, and fixture thickness.
4 3 1 2
Figure9: Main Menu of MEP-12T Press

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1 - Tool Editor:
The Tool Editor screen allows for the creation of a new tool, see Figure 10. This screen is the setup for
top tooling only. Bottom tooling setup is in the press data editor screen and is categorized as “Fixture”
(See Press Data Editor Screen).
• Tool Type – Unique identifier (User specified).

• Tool ID – Tool part number (User specified).
• Tool Clearance – Typically 0.100 inches unless additional height is needed for taller
components on PWB.
• Tool Height – Overall height of tool from top of tool to tool contact point of connector.
• Tool Width – Width of tool.
• Tool Length – Length of Tool.

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Figure 20: Tool Editor Screen of MEP-12T Press (Representative screen - tool length can vary
based on connector configuration)

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2 - Connector Editor:
The connector editor screen allows for the creation of a new connector, see Figure 11.
• Connector – Part number for connector being created (User specified).

• Tool – “Tool Type” and “Tool ID” from Tool Editor screen
• Profile – Pressing profile used by the MEP-12T to install the XCede HD , XCede HD PLUS &
XCede HD2 connector (Amphenol-TCS recommendation is ATCS_XCede HD_FG_DWELL.prf).
• Number of Pins – Sum of all pins entering PTHs on the connector (signal, shield, and power).
• Graph Scale – 8.0 for Standard Pin (0.0217” Drill)
• Graph Scale – 6.0 for Nano Pin (0.0177” Drill)
• Graph Scale – 5.0 for Femto Pin (0.0157” Drill)
• Distance – 0.1500
• Min Force per Pin – 0.5
• Max Force per Pin – 8.0 for Standard Pin (0.0217” Drill)
• Max Force per Pin – 6.0 for Nano Pin (0.0177” Drill)
• Max Force per Pin – 5.0 for Femto Pin (0.0157” Drill)
• User Force per Pin – Not used for ATCS_XCede HD_FG_DWELL.prf profile
• Other Force – Not used for ATCS_XCede HD_FG_DWELL.prf profile.
• PARS – Not used for ATCS_XCede HD_FG_DWELL.prf profile.
• Force Gradient Degrees – 75.0.
• SPC – Values to be dictated by process owner. Not covered in this document.
• Dimension – Unique to connector being installed, see Figure 11.

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Figure 31: Connector Editor Screen of MEP-12T press

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The dimensions of connectors that are critical to proper installation onto a PWB are:
• Base Thickness – The connector thickness between the contact point of the installation tool and
the seating surface of the connector.
• Unseated Top – The unseated connector height from the contact point of the installation tool to
the PWB surface.
• Height – Same as Base Thickness for XCede HD , XCede HD PLUS & XCede HD2 Connectors.
• Seated Height – Gap between PWB and connector seating surface, ideally 0.00.
Table 1 below describes the dimension values for the Connector Setup screen of the MEP-12T press for
the various XCede HD , XCede HD PLUS & XCede HD2 Backplane connector sizes. If a particular
XCede HD , XCede HD PLUS & XCede HD2 connector is not listed, please consult your Amphenol-
TCS representative for assistance.
XCede HD , XCede HD PLUS & XCede HD2 Backplane Dimensional Values
Base Thickness Unseated Top Height Seated Height

(inches) (inches) (inches) (inches)
3-Pair (Nano Pin, Femto pin) .100 .120 .100 0
3-Pair (21.7 Pin) .100 .130 .100 0
4-Pair (21.7 Pin) .100 .130 .100 0
6-Pair (21.7 Pin) .100 .130 .100 0
Table 1: Connector Setup dimensions for XCede HD , XCede HD PLUS & XCede HD2 Backplane
connectors for MEP-12T press.

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3 - Profile Editor:
The Profile Editor screen provides the detail of the Amphenol-TCS ATCS_XCede HD_FG_DWELL.prf
profile created for installing XCede HD , XCede HD PLUS & XCede HD2 connectors onto PWBs, see
Figure 12. Rows 1 through 5 are the commands for a normal press sequence. Rows 6 through 9 are the
commands for a “Re-Press” sequence. At each step in the profile sequence, the press executes on the
event that occurs first. If the “Height Above Board” occurs first, then the press executes the “Height
Action”. If the “Force” occurs first, the press executes “Force Action”. The press speed during the press
sequence is set to 0.050 inches / second. This speed is intended to ensure that the XCede HD , XCede HD
PLUS & XCede HD2 compliant pins remain stable during the pressing process. Speeds exceeding this are
not recommended and may result in connector pressing failures. Row 3 has a 1.5 second delay built into
the press profile as a settling time for connectors to minimize the potential for pressing failures.
• Profile – Set of steps found in ATCS_XCede HD_FG_DWELL.prf profile to perform normal press
and re-press operations for XCede HD , XCede HD PLUS & XCede HD2 connectors.
• Sample Range for PARS Forces – Not used in ATCS_XCede HD_FG_DWELL.prf profile.
• Action Errors – Message that appear on MEP-12T monitor if error occurs.

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Figure 42: Profile Editor of MEP-12T press displaying the Amphenol TCS ATCS_XCede
HD_FG_DWELL.prf profile, Revision A.

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Press Data Editor:

The Press Data Editor screen allows for the creation of a unique PWB assembly, see Figure 13.
• Description – Unique identifier of assembly (User specified)

• Revision – To be determined by process owner (User specified)
• Board Thickness – Thickness of raw PWB in inches in the location of the XCede HD , XCede
HD PLUS & XCede HD2 connector. This value may be determined by a board thickness
measurement taken automatically prior to press cycle (not covered in this document).
• Fixture Thickness – over hang will not interfere with MEP-12T press surface, see Figure 13. This
thickness includes any tooling between “machine zero” and the bottom surface of the PWB.
“Machine zero” is a term describing the lowest plane on the press (default is the original press
tabletop but this may be reassigned in the instance of a permanent bottom fixture or rolling table).
• Fixture ID – To be determined by the process owner (User specified).
• Press Sequence – Connector pressing order to be determined by process owner.
o X, Y, and Angle – Locations of the connector being placed on PWB. To be determined
by process owner.
o Connector – Select XCede HD , XCede HD PLUS & XCede HD2 connector from pull
down menu in “Connector” cell.

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Figure 53: Press Data Editor of MEP-12T press.

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The MEP-12T press produces a Force vs. Distance curve during a pressing sequence similar to the one
shown in Figure 14. The main areas of the curve are: the initial compression of the XCede HD , XCede
HD PLUS & XCede HD2 compliant pin and compliance of the PWB hole (1), the full collapse of the
XCede HD , XCede HD PLUS & XCede HD2 compliant pin (2), the sliding of the compliant pin in the
PWB hole (3), and the termination force of the pressing sequence at the 75 Degree Force Gradient line
(4). The following descriptions of these areas as for reference and are intended as an aid in understanding
the pressing characteristics of the XCede HD , XCede HD PLUS & XCede HD2 connector utilizing the
ATCS_XCede HD_FG_DWELL.prf profile.
Figure 64: Typical Force vs. Distance Curve of MEP-12T press for XCede HD , XCede HD PLUS &
XCede HD2 connectors.

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1 - Initial Compression of XCede HD , XCede HD PLUS & XCede HD2 compliant Pins:
Part of the initial pressing sequence with the ATCS_XCede HD_FG_DWELL.prf profile (Refer to Figure
12) is to permit settling and alignment of all the compliant pins of the connector prior to a full pressing
sequence. In this zone, the XCede HD , XCede HD PLUS & XCede HD2 compliant pins and the PWB
plated through holes begin to conform to each other and the XCede HD , XCede HD PLUS & XCede
HD2 complaint pins begin to compress. At this zone the slope of the force gradient line begins to increase
as the XCede HD , XCede HD PLUS & XCede HD2 compliant pins continue to compress.

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Full collapse of the XCede HD , XCede HD PLUS & XCede HD2 compliant pin:
At approximately 0.050 to 0.070 inches of insertion into the PWB plated through hole (approximately at
the 0.035 inches mark on X axis of the Force Gradient Curve), the XCede HD , XCede HD PLUS &
XCede HD2 compliant pin is fully collapsed in the PWB plated through hole. This is represented by the
peak in the force gradient curve, referred to the knee of the curve. Depending on multiple variables
including PWB surface finish, PWB hole diameter, compliant pin feature size, number of power pins vs.
signal pins, etc., the knee will be more or less pronounced, but is typically highlighted by an inflection
point in the curve as Figure 15 shows.
Figure 75: XCede HD , XCede HD PLUS & XCede HD2 pressing Force vs. Distance Graph
showing two shapes of the knee area utilizing a MEP-12T press.

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2 - Sliding Force of the XCede HD , XCede HD PLUS & XCede HD2 compliant pin in the PCB hole:
After the compliant pin of the XCede HD , XCede HD PLUS & XCede HD2 connector is fully compressed, the pin tr
avels further into the PWB plated through hole. As this sliding occurs, the force required to continue the installation p
rocess of the XCede HD , XCede HD PLUS & XCede HD2 connector past this point may decrease between 1 and 10
percent for a short distance before beginning to increase again as the compliant pin travels further into the PWB plate
d through hole. The specific amount of decrease depends on multiple variables including PWB surface finish, PWB h
ole diameter, compliant pin feature size, number of power pins vs. signal pins, etc. Figure 15 shows a typical Force vs
. Distance curve where the graph on the left does not show a decrease in force during the pressing process, where the
graph on the right shows a slight decrease in the force. Both conditions produce a properly installed XCede HD , XCe
de HD PLUS & XCede HD2 connector.
Figure 16 shows that between 0.040 inches and 0.010 inches above the PWB surface (spanning zones 2
and 3, refer to Figure 14), the ATCS_XCede HD_FG_DWELL.prf profile searches for the “Max Force Per
Pin” value entered in the Connector Editor Tool (Refer to Figure 10). If this force is seen by the MEP-
12T press in this region, the press will stop and display an error that the Max Force Per Pin has been
reached. If the MEP-12T press does not see the “Max Force Per Pin”, the ATCS_XCede
HD_FG_DWELL.prf profile will move to the next phase of the pressing process; the “75 Degree Force
Gradient Line”.
Figure 86: Force vs. Distance Graph showing the "Max Force Per Pin" zone.

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Termination Force at the 75 Degree Force Gradient Line:

Once the XCede HD , XCede HD PLUS & XCede HD2 connector standoff features begin to come in
contact with the PWB surface, the force vs. distance curve will begin to further increase in slope. During
this stage of the pressing sequence, the
ATCS_XCede HD_FG_DWELL.prf profile is designed to begin to search for the force vs. gradient curve
to reach a 75-degree angle at a distance from 0.010 inches above to 0.025 inches below the PWB surface
(See Profile Editor and Press Data Editor Sections). Figure 17 shows the termination phase of the pressing
process area on the Force Gradient curve.
Figure 97: Force vs. Distance Graph showing the 75 Degree Force Gradient Zone.
The termination force generated by the pressing sequence is a combination of the frictional sliding forces
created by the XCede HD , XCede HD PLUS & XCede HD2 complaint pins and the PWB plated through
hole along with other reactionary forces such as complaint pin alignment during the pressing process,
connector standoff interference with the PWB surface, PWB and fixture warping, etc. It is important to
understand that the termination force of a connector is not equivalent to the force experienced strictly by
the connector complaint pin or PWB plated through holes. As a result of the components and process
variables associated with the installation of XCede HD , XCede HD PLUS & XCede HD2 onto PWB’s,
termination forces of XCede HD , XCede HD PLUS & XCede HD2 connectors can be expected to be as
high or higher than the knee of the curve described within zone 2, see Figure 17.

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CE23-0104

MHD2 Product Backplane Installation Process

Specification Revision Status

Revision Description Initial Date

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C-972-601E-500 6 Pair, 8 Column Differential Backplane Module

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The application of Amphenol TCS XCede HD , XCede HD PLUS & XCede

2.2.2 Application Tools

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DESCRIPTION PART NUMBER SHROUD WALL

Figure 1: XCede HD PLUS Solid Loading Head (for reference)

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2.2.2.2 XCede HD & XCede HD2 Without Extra Ground Version(1)

2.2.2.3 Support Tooling/Fixture

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appropriate support fixture to support the PCB during the backplane

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Figure 2: Leftmost row of compliant pins in the PTH.

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Figure5: Rightmost view of assembly, check for bent pins.

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XCede HD , XCede HD PLUS & XCede HD2 Backplane Press Recommendations

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Figure8: MEP-12T Manual-Electric Press

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Figure9: Main Menu of MEP-12T Press

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• Tool Type – Unique identifier (User specified).

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• Connector – Part number for connector being created (User specified).

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Figure 31: Connector Editor Screen of MEP-12T press

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XCede HD , XCede HD PLUS & XCede HD2 Backplane Dimensional Values

Base Thickness Unseated Top Height Seated Height

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Press Data Editor:

• Description – Unique identifier of assembly (User specified)

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Figure 53: Press Data Editor of MEP-12T press.

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Termination Force at the 75 Degree Force Gradient Line: