Surface Mount

Surface Mount Ceramic
Capacitor Products
100422
IMPORTANT INFORMATION/DISCLAIMER
All product specifications, statements, information and data (collectively, the “Information”) in this datasheet or
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Statements of suitability for certain applications are based on KYOCERA AVX’s knowledge of typical operating
conditions for such applications, but are not intended to constitute and KYOCERA AVX specifically disclaims
any warranty concerning suitability for a specific customer application or use.
ANY USE OF PRODUCT OUTSIDE OF SPECIFICATIONS OR ANY STORAGE OR INSTALLATION

INCONSISTENT WITH PRODUCT GUIDANCE VOIDS ANY WARRANTY.
The Information is intended for use only by customers who have the requisite experience and capability to
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regard, and KYOCERA AVX assumes no obligation or liability for the advice given or results obtained.
Although KYOCERA AVX designs and manufactures its products to the most stringent quality and safety
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The Important Information/Disclaimer is incorporated in the catalog where these specifications came from or available
online at www.kyocera-avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.
111919
– surface mount ceramic capacitor products –

Surface Mount Ceramic Capacitor Products
Table of Contents
How to Order Automotive MLCC
Part Number Explanation............................................................................... 1 General Specifications................................................................................. 54
Capacitance Range...................................................................................... 56
C0G (NP0) Dielectric
General Specifications................................................................................... 3 APS for COTS+ High Reliability Applications
Specifications and Test Methods.................................................................. 4 General Specifications................................................................................. 59
Capacitance Range........................................................................................ 5 Capacitance Range...................................................................................... 60
U Dielectric MLCC with FLEXITERM®

RF/Microwave C0G (NP0) Capacitors (RoHS) General Specifications................................................................................. 63
RF/Microwave C0G (NP0) Capacitors (Sn/Pb) Specifications and Test Methods................................................................ 64
RF/Microwave Automotive C0G (NP0) Capacitors (RoHS) Capacitance Range...................................................................................... 66
AEC Q200 Qualified Ultra Low ESR.......................................................... 13
Designer Kits............................................................................................... 15 FLEXISAFE MLC Chips
General Specifications and Capacitance Range.......................................... 68
X8R/X8L Dielectric
General Specifications................................................................................. 16 Capacitor Array
Specifications and Test Methods................................................................ 18 Capacitor Array (IPC)................................................................................... 69
Automotive Capacitor Array (IPC)................................................................ 73
X7R Dielectric Part & Pad Layout Dimensions.................................................................... 74
General Specifications................................................................................. 19
Specifications and Test Methods................................................................ 20 Low Inductance Capacitors
Capacitance Range...................................................................................... 21 Introduction................................................................................................. 75
LICC® (Low Inductance Chip Capacitors)Capacitors) ................................ 77
X7S Dielectric LICC® (Low Inductance Chip Capacitors)Capacitors) ................................ 78
General Specifications................................................................................. 23 IDC (InterDigitated Capacitors).................................................................... 81
Specifications and Test Methods................................................................ 24 LGA Low Inductance Capacitors.................................................................. 85
Capacitance Range...................................................................................... 25
High Temperature MLCCs
X5R Dielectric AT Series – 200ºC & 250°C Rated............................................................... 88
Specifications and Test Methods................................................................ 27 High Voltage MLC Chips
Capacitance Range...................................................................................... 28 For 600V to 5000V Applications.................................................................. 94
Tin/Lead Termination “B” - 600V to 5000V Applications............................. 99
Y5V Dielectric FLEXITERM® - 600V to 5000V Applications............................................... 101
General Specifications................................................................................. 30 For 600V to 3000V Automotive Applications - AEC-Q200.......................... 106
Specifications and Test Methods................................................................ 31
Capacitance Range...................................................................................... 32 MIL-PRF-55681/Chips
CDR01 thru CDR06..................................................................................... 108
MLCC Gold Termination — AU Series CDR31 thru CDR35..................................................................................... 110
Capacitance Range...................................................................................... 34 MLCC Medical Applications
MM Series ................................................................................................. 114
MLCC Tin/Lead Termination "B" (LD Series)
C0G (NP0) – General Specifications............................................................ 40 Packaging of Chip Components...................................................... 119
Specifications and Test Methods........................................... 41
Capacitance Range................................................................. 42 Embossed Carrier Configuration..................................................... 120
X8R General Specifications............................................................ 44
Capacitance Range................................................................. 46 Paper Carrier Configuration.............................................................. 121
X7R General Specifications............................................................ 47
Specifications and Test Methods........................................... 48 Basic Capacitor Formulas.................................................................. 122
Capacitance Range................................................................. 49
X5R General Specifications............................................................ 51 General Description............................................................................. 123
Capacitance Range................................................................. 53
online at www.kyocera-avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.

How to Order
Part Number Explanation
Commercial Surface Mount Chips
EXAMPLE: 08055A101JAT2A
0805 5 A 101 J* A T 2 A**
Size Voltage Dielectric Capacitance Tolerance Failure Terminations Packaging Special

(L" x W") 4 = 4V A = NP0(C0G) 2 Sig. Fig + B = ±.10 pF Rate T = Plated Ni and Sn Available Code
0101* 6 = 6.3V C = X7R No. of Zeros C = ±.25 pF A = N/A 7 = Gold Plated 2 = 7" Reel A = Std
0201 Z = 10V D = X5R Examples: D = ±.50 pF 4 = Automotive U = Conductive 4 = 13" Reel K = 30K (0603 2mm pitch)
0402 Y = 16V F = X8R 100 = 10 pF F = ±1% (≥ 10 pF) Expoxy for Hybrid U = 4mm TR 22K (0805/1206
0603 3 = 25V G = Y5V 101 = 100 pF G = ±2% (≥ 10 pF) Applications (01005) <0.030"/ 0.76mm)
0805 102 = 1000 pF J = ±5% Z = FLEXITERM® H = 18K (0603/0805/1206
D = 35V U = U Series
1206 223 = 22000 pF K = ±10% *X = FLEXITERM® <0.037” / 0.94mm)
1210
5 = 50V W = X6S
224 = 220000 pF M = ±20% with 5% min lead Contact J = 15K (0805/1206
1 = 100V Z = X7S
1812
2 = 200V
105 = 1μF Z = +80%, -20% (X7R & X8R only) Factory For <0.050” / 1.27mm)
1825 106 = 10μF P = +100%, -0% 1 = 12K (0805/1206
2220 7 = 500V 107 = 100μF
Multiples <0.055 / 1.4mm)
2225 For values below **Non std options upon
Contact Factory for 10 pF, use “R” approval from the factory
Special Voltages in place of
*EIA 01005 F = 63V 9 = 300V Decimal point, e.g., Contact
E = 150V 8 = 400V 9.1 pF = 9R1.
Factory For
V = 250V
1 = Pd/Ag Term
* B, C & D tolerance for ≤10 pF values.

Standard Tape and Reel material (Paper/Embossed) depends upon chip size and thickness.
See individual part tables for tape material type for each capacitance value.
NOTE: Contact factory for availability of Termination and Tolerance Options for Specific Part Numbers.
For Tin/Lead Terminations, please refer to LD Series
High Voltage MLC Chips

EXAMPLE: 1808AA271KAT2A
1808 A A 271 K A T 2 A
Style Voltage Temperature Capacitance Capacitance Failure Termination Packaging/ Special

0805 C = 600V/630V Coefficient Code Tolerance Rate 1 = Pd/Ag Marking Code
1206 A = 1000V A = C0G (2 significant digits C0G: J = ±5% A=Not T = Plated Ni 2 = 7" Reel A = Standard
+ no. of zeros)
1210 S = 1500V C = X7R K = ±10% Applicable and Sn 4 = 13" Reel
1808 Examples:
G = 2000V M = ±20% B = 5% Min Pb
1812 10 pF = 100
W = 2500V X7R: K = ±10% Z = FLEXITERM®
1825 100 pF = 101
H = 3000V M = ±20% *X = FLEXITERM®
2220 1,000 pF = 102
J = 4000V Z = +80%, with 5% min
2225 22,000 pF = 223
K = 5000V -20% lead (X7R
3640 220,000 pF = 224 only)
1 μF = 105
For Tin/Lead Terminations, please refer to LD Series *
For RoHS compliant products,

please select correct termination style.
online at www.kyocera-avx.com/disclaimer/ by reference and should be reviewed in full before placing any order. 1
082621

How to Order
Part Number Explanation
Capacitor Array
EXAMPLE: W2A43C103MAT2A
W 2 A 4 3 C 103 M A T 2A
Style Case Array Number Voltage Dielectric Capacitance Capacitance Failure Termination Packaging &
W = RoHS Size of Caps Z = 10V A = NP0 Code (In pF) Tolerance Rate Code Quantity
L = SnPb 1 = 0405 Y = 16V C = X7R 2 Sig Digits J = ±5% A = Commercial T = Plated Ni and Sn Code
2 = 0508 3 = 25V D = X5R + Number of K = ±10% 4 = Automotive Z = FLEXITERM ®
2A = 7" Reel
3 = 0612 5 = 50V Zeros M = ±20% *B = 5% min lead (4000)
1 = 100V *X = FLEXITERM® 4A = 13" Reel
with 5% min lead (10000)
2F = 7" Reel
(1000)
Low Inductance Capacitors (LICC®)

EXAMPLE: 0612ZD105MAT2A
0612 Z D 105 M A T 2 A
Size Voltage Dielectric Capacitance Capacitance Failure Rate Terminations Packaging Thickness
0306 6 = 6.3V C = X7R Code (In pF) Tolerance A = N/A T = Plated Ni Available See Page 97
0508 Z = 10V D = X5R 2 Sig. Digits + K = ±10% and Sn 2 = 7" Reel for Codes
0612 Y = 16V Number of Zeros M = ±20% *B =5% min 4 = 13" Reel
*LD16 3 = 25V lead
*LD17 5 = 50V
*LD18
Interdigitated Capacitors (IDC)

EXAMPLE: W3L16D225MAT3A
W 3 L 1 6 D 225 M A T 3 A
Style Case Low Number Voltage Dielectric Capacitance Capacitance Failure Termination Packaging Thickness
W = RoHS Size Inductance of 4 = 4V C = X7R Code (In pF) Tolerance Rate T = Plated Ni Available Max. Thickness
L = SnPb 2 = 0508 ESL = 50pH Terminals 6 = 6.3V D = X5R 2 Sig. Digits + M = ±20 A = N/A and Sn 1=7" Reel mm (in.)
3 = 0612 ESL = 60pH 1 = 8 Terminals Z = 10V Number of *B =5% min 3=13" Reel A=0.95 (0.037)
Y = 16V Zeros lead S=0.55 (0.022)
Low Inductance Decoupling Capacitor Arrays (LICA)

EXAMPLE: LICA3T183M3FC4AA
LICA 3 T 102 M 3 F C 4 A A
Style Voltage Dielectric Cap/Section Capacitance Height Termination Reel Packaging # of Inspection Code
& 5V = 9 D = X5R (EIA Code) Tolerance Code *F = C4 Solder M = 7" Reel Caps/Part Code Face
Size 10V = Z T = T55T 102 = 1000 pF M = ±20% 6 = 0.500mm Balls- 97Pb/3Sn R = 13" Reel 1 = one A = Standard A = Bar
25V = 3 S = High K 103 = 10 nF P = GMV 3 = 0.650mm H = C4 Solder 6 = 2"x2" Waffle Pack 2 = two B = Established B = No Bar
T55T 104 = 100 nF 1 = 0.875mm Balls–Low ESR 8 = 2"x2" Black Waffle 4 = four Reliability C = Dot, S55S
5 = 1.100mm P = Cr-Cu-Au Pack Testing Dielectrics
*
7 = 1.600mm N = Cr-Ni-Au 7 = 2"x2" Waffle Pack D = Triangle
X = None w/ termination
facing up
A = 2"x2" Black Waffle
Pack NOTE: Contact factory for
w/ termination availability of Termination and
facing up Tolerance Options for Specific
C = 4"x4" Waffle Pack Part Numbers.
w/ clear lid
2 online at www.kyocera-avx.com/disclaimer/ by reference and should be reviewed in full before placing any order.

General Specifications
C0G (NP0) is the most popular formulation of the “temperature-compensating,” EIA Class I ceramic materials.
Modern C0G (NP0) formulations contain neodymium, samarium and other rare earth oxides.
C0G (NP0) ceramics offer one of the most stable capacitor dielectrics available. Capacitance change with
temperature is 0 ±30ppm/°C which is less than ±0.3% C from -55°C to +125°C. Capacitance drift or hysteresis
for C0G (NP0) ceramics is negligible at less than ±0.05% versus up to ±2% for films. Typical capacitance
change with life is less than ±0.1% for C0G (NP0), one-fifth that shown by most other dielectrics. C0G (NP0)
formulations show no aging characteristics.
PART NUMBER (SEE PAGE 4 FOR COMPLETE PART NUMBER EXPLANATION)
0805 5 A 101 J A T 2 A
Size Voltage Dielectric Capacitance Capacitance Failure Terminations Packaging Special

(L” x W”) 6.3V = 6 C0G (NP0) = A Code (In pF) Tolerance Rate T = Plated Ni 2 = 7” Reel Code
10V = Z 2 Sig. Digits + B = ±.10 pF (<10pF) A = Not and Sn 4 = 13” Reel A = Std.
16V = Y Number of Zeros C = ±.25 pF (<10pF) Applicable U = 4mm TR Product
25V = 3 Contact
D = ±.50 pF (<10pF) Factory For (01005)
50V = 5
100V = 1 F = ±1% (≥ 10 pF) 1 = Pd/Ag Term
200V = 2 G = ±2% (≥ 10 pF) 7 = Gold Plated
250V = V J = ±5% Contact Factory
NOT RoHS
500V = 7 K = ±10% For Multiples
COMPLIANT
NOTE: Contact factory for availability of Termination and Tolerance Options for Specific Part
Numbers. Contact factory for non-specified capacitance values.
TDS-SMDMLCC-0010 | Rev 1

Specifications and Test Methods
Parameter/Test NP0 Specification Limits Measuring Conditions
Operating Temperature Range -55ºC to +125ºC Temperature Cycle Chamber
Capacitance Within specified tolerance Freq.: 1.0 MHz ± 10% for cap ≤ 1000 pF
<30 pF: Q≥ 400+20 x Cap Value 1.0 kHz ± 10% for cap > 1000 pF
Q
≥30 pF: Q≥ 1000 Voltage: 1.0Vrms ± .2V
10,000MΩ or 500MΩ - µF, Charge device with rated voltage for 60 ± 5 secs
Insulation Resistance
whichever is less @ room temp/humidity
Charge device with 250% of rated voltage for 1-5
seconds, w/charge and discharge current limited
Dielectric Strength No breakdown or visual defects to 50 mA (max)
Note: Charge device with 150% of rated voltage
for 500V devices.
Appearance No defects
Deflection: 2mm
Capacitance Test Time: 30 seconds
±5% or ±.5 pF, whichever is greater
Variation
Resistance to
Flexure Q Meets Initial Values (As Above)
Stresses
Insulation
≥ Initial Value x 0.3
Resistance
≥ 95% of each terminal should be covered Dip device in eutectic solder at 230 ± 5ºC for 5.0 ±
Solderability
with fresh solder 0.5 seconds
Appearance No defects, <25% leaching of either end terminal
Capacitance
≤ ±2.5% or ±.25 pF, whichever is greater
Variation
Dip device in eutectic solder at 260ºC for
Resistance to Q Meets Initial Values (As Above) 60sec- onds. Store at room temperature
Solder Heat for 24 ± 2hours before measuring electrical
Insulation properties.
Meets Initial Values (As Above)
Resistance
Dielectric
Strength
Appearance No visual defects Step 1: -55ºC ± 2º 30 ± 3 minutes
Capacitance
≤ ±2.5% or ±.25 pF, whichever is greater Step 2: Room Temp ≤ 3 minutes
Variation
Q Meets Initial Values (As Above) Step 3: +125ºC ± 2º 30 ± 3 minutes
Thermal Shock
Insulation
Meets Initial Values (As Above) Step 4: Room Temp ≤ 3 minutes
Resistance
Dielectric Repeat for 5 cycles and measure after
Strength 24 hours at room temperature
Appearance No visual defects
Capacitance
≤ ±3.0% or ± .3 pF, whichever is greater
Variation Charge device with twice rated voltage in test
chamber set at 125ºC ± 2ºC
≥ 30 pF: Q≥ 350
Q for 1000 hours (+48, -0).
≥10 pF, <30 pF: Q≥ 275 +5C/2
Load Life (C=Nominal Cap)
<10 pF: Q≥ 200 +10C
Remove from test chamber and stabilize at
Insulation room temperature for 24 hours
≥ Initial Value x 0.3 (See Above)
Resistance before measuring.
Dielectric
Strength
Capacitance
Variation Store in a test chamber set at 85ºC ± 2ºC/ 85% ±
≥ 30 pF: Q≥ 350 5% relative humidity for 1000 hours
Load Q ≥10 pF, <30 pF: Q≥ 275 +5C/2 (+48, -0) with rated voltage applied.
Humidity <10 pF: Q≥ 200 +10C
Insulation Remove from chamber and stabilize at room
Resistance ≥ Initial Value x 0.3 (See Above) temperature for 24 ± 2 hours before measuring.
Dielectric
Strength

Capacitance Range
PREFERRED SIZES ARE SHADED
SIZE 0101* 0201 0402 0603 0805 1206
Soldering Reflow Only Reflow Only Reflow/Wave Reflow/Wave Reflow/Wave Reflow/Wave
Packaging All Paper All Paper All Paper All Paper Paper/Embossed Paper/Embossed
mm 0.40 ± 0.02 0.60 ± 0.03 1.00 ± 0.10 1.60 ± 0.15 2.01 ± 0.20 3.20 ± 0.20
(L) Length
(in.) (0.016 ± 0.0008) (0.024 ± 0.001) (0.040 ± 0.004) (0.063 ± 0.006) (0.079 ± 0.008) (0.126 ± 0.008)
mm 0.20 ± 0.02 0.30 ± 0.03 0.50 ± 0.10 0.81 ± 0.15 1.25 ± 0.20 1.60 ± 0.20
W) Width
(in.) (0.008 ± 0.0008) (0.011 ± 0.001) (0.020 ± 0.004) (0.032 ± 0.006) (0.049 ± 0.008) (0.063 ± 0.008)
mm 0.10 ± 0.04 0.15 ± 0.05 0.25 ± 0.15 0.35 ± 0.15 0.50 ± 0.25 0.50 ± 0.25
(t) Terminal
(in.) (0.004 ± 0.0016) (0.006 ± 0.002) (0.010 ± 0.006) (0.014 ± 0.006) (0.020 ± 0.010) (0.020 ± 0.010)
WVDC 16 25 50 16 25 50 16 25 50 100 200 16 25 50 100 200 250 16 25 50 100 200 250 500
Cap 0.5 A A C C C G G G G J J J J J J J J J J J J J
(pF) 1.0 B A A C C C G G G G J J J J J J J J J J J J J
1.2 B A A C C C G G G G J J J J J J J J J J J J J
10 B A A C C C G G G G G J J J J J J J J J J J J J
120 C C C G G G G G J J J J J J J J J J J J J
150 C C C G G G G G J J J J J J J J J J J J J
180 C C C G G G G G J J J J J N J J J J J J J
220 C C C G G G G G J J J J N N J J J J J J J
270 C C C G G G G J J J J N N J J J J J J J
1200 G G G J J J J P P J J J J J J J
1500 G G G J J J J P P J J J M Q P P
1800 G G G J J J J P P J J M P Q P P
2200 G G G P P P P P P J J M P Q P P
2700 G G G P P P P P P J J M P Q P P
3300 G G G P P P P P P J J M P Q X P
3900 G G G P P P P P P J J M P X X X
4700 G G G P P P P P P J J M P X X X
5600 P P P J J M P X X X
6800 P P P M M M P X X X
8200 P P P P P P P X X
Cap 0.010 P P P P P P P X X
(μF) 0.012 P P P X X X X
0.015 X X X X
0.018 X X X X
0.022 X X X X
0.027 X X X
0.033 X X X X
0.039 X X X
0.047 X X X
0.068 X X X
0.082
0.1 X X X
WVDC 16 25 50 16 25 50 16 25 50 100 200 16 25 50 100 200 250 16 25 50 100 200 250 500
SIZE 0101* 0201 0402 0603 0805 1206
Letter A B C E G J K M N P Q X Y Z
Max. 0.33 0.22 0.56 0.71 0.90 0.94 1.02 1.27 1.40 1.52 1.78 2.29 2.54 2.79
Thickness (0.013) (0.009) (0.022) (0.028) (0.035) (0.037) (0.040) (0.050) (0.05 5) (0.060) (0.070) (0.090) (0.100) (0.110)
PAPER EMBOSSED

Capacitance Range
SIZE 1210 1812 1825 2220 2225

Soldering Reflow Only Reflow Only Reflow Only Reflow Only Reflow Only
Packaging Paper/Embossed All Embossed All Embossed All Embossed All Embossed
mm 3.20 ± 0.20 4.50 ± 0.30 4.50 ± 0.30 5.70 ± 0.40 5.72 ± 0.25
(L) Length
(in.) (0.126 ± 0.008) (0.177 ± 0.012) (0.177 ± 0.012) (0.225 ± 0.016) (0.225 ± 0.010)
mm 2.50 ± 0.20 3.20 ± 0.20 6.40 ± 0.40 5.00 ± 0.40 6.35 ± 0.25
W) Width
(in.) (0.098 ± 0.008) (0.126 ± 0.008) (0.252 ± 0.016) (0.197 ± 0.016) (0.250 ± 0.010)
mm 0.50 ± 0.25 0.61 ± 0.36 0.61 ± 0.36 0.64 ± 0.39 0.64 ± 0.39
(t) Terminal
(in.) (0.020 ± 0.010) (0.024 ± 0.014) (0.024 ± 0.014) (0.025 ± 0.015) (0.025 ± 0.015)
WVDC 25 50 100 200 500 25 50 100 200 500 50 100 200 50 100 200 50 100 200
Cap 3.9
(pF) 4.7
5.6
6.8
8.2
10 M M M M M P P P P P
47 P P P P P P P P P P
1000 P P P P P P P P P P M M M M M P
2200 P P P P P P P P P P X X M M M P
2700 P P P P P P P P P Q X X M M M P
3300 P P P P P P P P P Q X X X X M M P
3900 P P P P P P P P P Q X X X X M M P
4700 P P P P P P P P P Y X X X X X X M M P
5600 P P P P P P P P P Y X X X X X X M M P
6800 P P P X X P P Q Q Y X X X X X X M M P
8200 P P P X X P P Q Q Y X X X X X X M M P
Cap 0.010 P P X X X P P Q Q Y X X X X X X M M P
(μF) 0.012 X X X X X P P Q X Y X X X X X X M M P
0.015 X X X Z Z P P Q X Y X X X X X X M M Y
0.018 X X Z Z P P X X Y X X X X X X M M Y
0.022 X X Z Z P P X X X X X X X M Y Y
0.027 X Z Z Z Q X X Z X X Y X X P Y Y
0.033 X Z Z Z Q X X Z X X X X X Y Y
0.039 Z Z Z X X Z Z X Y X Y Y
0.047 Z Z Z X X Z Z X Y X Z
0.068 Z Z Z Z X Z
0.082 Z Z Z Z X Z
0.1 Z Z Z Z Z Z
WVDC 25 50 100 200 500 25 50 100 200 500 50 100 200 50 100 200 50 100 200
SIZE 1210 1812 1825 2220 2225
Max. 0.33 0.22 0.56 0.71 0.90 0.94 1.02 1.27 1.40 1.52 1.78 2.29 2.54 2.79
Thickness (0.013) (0.009) (0.022) (0.028) (0.035) (0.037) (0.040) (0.050) (0.055) (0.060) (0.070) (0.090) (0.100) (0.110)
PAPER EMBOSSED

U Dielectric
RF/Microwave C0G (NP0) Capacitors (RoHS)
Ultra Low ESR, “U” Series, C0G (NP0) Chip Capacitors
GENERAL INFORMATION
“U” Series capacitors are C0G (NP0) chip capacitors specially designed for “Ultra” low ESR for applications in the communications market. Max ESR and
effective capacitance are met on each value producing lot to lot uniformity. Sizes available are EIA chip sizes 0603, 0805, and 1210.
DIMENSIONS: inches (millimeters)
0402 0603 0805 1210
Size A B C D E
0402 0.039±0.004 (1.00±0.1) 0.020±0.004 (0.50±0.1) 0.024 (0.6) max 0.010 ± 0.006 (0.25 ± 0.15) 0.014 (0.36) min
0603 0.060±0.010 (1.52±0.25) 0.030±0.010 (0.76±0.25) 0.036 (0.91) max 0.010 ± 0.005 (0.25 ± 0.13) 0.030 (0.76) min
0805 0.079±0.008 (2.01±0.2) 0.049±0.008 (1.25±0.2) 0.045 (1.15mm) max 0.020 ± 0.010 (0.51 ± 0.254) 0.020 (0.51) min
1210 0.126±0.008 (3.2±0.2) 0.098±0.008 (2.49±0.2) 0.055 (1.40mm) max 0.025 ± 0.015 (0.635 ± 0.381) 0.040 (1.02) min
HOW TO ORDER
0805 1 U 100 J A T 2 A
Case Size Dielectric = Capacitance Termination Special Code

0402 Ultra Low Tolerance Code T= Plated Ni and Sn A = Standard
0603 ESR B = ±0.1pF
0805 C = ±0.25pF
1210 D = ±0.5pF
F = ±1%
G = ±2%
J = ±5%
K = ±10%
Voltage Code M = ±20% Failure Rate Packaging
3 = 25V Code Code
5 = 50V Capacitance A = Not 2 = 7” Reel
1 = 100V EIA Capacitance Code in pF. Applicable 4 = 13” Reel
2 = 200V 9 = Bulk
First two digits = significant
figures or “R” for decimal place.
Third digit = number of zeros or
after “R” significant figures.
ELECTRICAL CHARACTERISTICS LEAD-FREE COMPATIBLE

COMPONENT
Capacitance Values and Tolerances:

Dielectric Working Voltage (DWV):
Size 0402 - 0.2 pF to 22 pF @ 1 MHz
250% of rated WVDC
Size 0603 - 1.0 pF to 100 pF @ 1 MHz
Size 0805 - 1.6 pF to 160 pF @ 1 MHz Equivalent Series Resistance Typical (ESR):
Size 1210 - 2.4 pF to 1000 pF @ 1 MHz 0402 - See Performance Curve, page 300
0603 - See Performance Curve, page 300
Temperature Coefficient of Capacitance (TC):
0±30 ppm/°C (-55° to +125°C)
Insulation Resistance (IR):
1012 Ω min. @ 25°C and rated WVDC
Marking
Laser marking EIA J marking standard (except 0603) (capacitance code and
tolerance upon request).
Working Voltage (WVDC):
Size Working Voltage MILITARY SPECIFICATIONS
0402 - 50, 25 WVDC Meets or exceeds the requirements of MIL-C-55681
0603 - 200, 100, 50 WVDC
0805 - 200, 100 WVDC
1210 - 200, 100 WVDC
012521

U Dielectric
RF/Microwave C0G (NP0) Capacitors (RoHS)
CAPACITANCE RANGE
Cap Available Size Cap Available Size Cap Available Size Cap Available Size
(pF) Tolerance 0402 0603 0805 1210 (pF) Tolerance 0402 0603 0805 1210 (pF) Tolerance 0402 0603 0805 1210 (pF) Tolerance 0402 0603 0805 1210
0.2 B,C 50V N/A N/A N/A 1.0 B,C,D 50V 200V 200V 200V 7.5 B,C,J,K,M 50V 200V 200V 200V 100 F,G,J,K,M N/A 100V 200V 200V
0.3 1.1 8.2 110 50V
0.4 1.2 9.1 B,C,J,K,M 120 50V
B,C 1.3 10 F,G,J,K,M 130 N/A 200V
0.5
0.6 B,C,D 1.4 11 140 100V
0.7 1.5 12 150
0.8 1.6 13 160 100V
0.9 B,C,D 1.7 15 180 N/A
1.8 18 200V 200
1.9 20 100V 220
2.0 22 270
2.1 24 300
2.2 27 330
2.4 30 50V 360
2.7 33 N/A 390
3.0 36 430 200V
3.3 39 470 100V
3.6 43 510
3.9 47 560
4.3 51 620
4.7 56 680
5.1 68 750
5.6 75 820
6.2 B,C,D
82 910
6.8 B,C,J,K,M
91 1000 F,G,J,K,M
ULTRA LOW ESR, “U” SERIES
ESR Measured on the Boonton 34A
012419

U Dielectric
RF/Microwave C0G (NP0) Capacitors
120216

U Dielectric
RF/Microwave C0G (NP0) Capacitors (Sn/Pb)
GENERAL INFORMATION
“U” Series capacitors are C0G (NP0) chip capacitors specially designed for “Ultra” low ESR for applications in the communications market. Max ESR and
effective capacitance are met on each value producing lot to lot uniformity. Sizes available are EIA chip sizes 0603, 0805, and 1210.
DIMENSIONS: inches (millimeters)
0402 0603 0805 1210
Size A B C D E
0402 0.039±0.004 (1.00±0.1) 0.020±0.004 (0.50±0.1) 0.024 (0.6) max 0.010 ± 0.006 (0.25 ± 0.15) 0.014 (0.36) min
0603 0.060±0.010 (1.52±0.25) 0.030±0.010 (0.76±0.25) 0.036 (0.91) max 0.010±0.005 (0.25±0.13) 0.030 (0.76) min
0805 0.079±0.008 (2.01±0.2) 0.049±0.008 (1.25±0.2) 0.045 (1.15mm) max 0.020±0.010 (0.51±0.254) 0.020 (0.51) min
1210 0.126±0.008 (3.2±0.2) 0.098±0.008 (2.49±0.2) 0.055 (1.40mm) max 0.025±0.015 (0.635±0.381) 0.040 (1.02) min
HOW TO ORDER
LD05 1 U 100 J A B 2 A

LD02 = 0402 Ultra Low Tolerance Code B = 5% min lead A = Standard
LD03 = 0603 ESR B = ±0.1pF
LD05 = 0805 C = ±0.25pF
LD10 = 1210 D = ±0.5pF
F = ±1%
G = ±2%
J = ±5%
K = ±10%
3 = 25V Code Code
5 = 50V Capacitance A = Not 2 = 7” Reel
1 = 100V EIA Capacitance Code in pF. Applicable 4 = 13” Reel
2 = 200V 9 = Bulk
Third digit = number of zeros or Not RoHS Compliant
ELECTRICAL CHARACTERISTICS
Capacitance Values and Tolerances: Dielectric Working Voltage (DWV):
Size 0402 - 0.2 pF to 22 pF @ 1 MHz 250% of rated WVDC
Size 0805 - 1.6 pF to 160 pF @ 1 MHz
Size 1210 - 2.4 pF to 1000 pF @ 1 MHz
Temperature Coefficient of Capacitance (TC): 0805 - See Performance Curve, page 306
0±30 ppm/°C (-55° to +125°C) 1210 - See Performance Curve, page 306
Insulation Resistance (IR): Marking:
1012 Ω min. @ 25°C and rated WVDC Laser marking EIA J marking standard (except 0603) (capacitance
1011 Ω min. @ 125°C and rated WVDC code and tolerance upon request).
Working Voltage (WVDC): Military Specifications
Size Working Voltage Meets or exceeds the requirements of MIL-C-55681
0402 - 50, 25 WVDC
0603 - 200, 100, 50 WVDC
0805 - 200, 100 WVDC
1210 - 200, 100 WVDC
012521

U Dielectric
RF/Microwave C0G (NP0) Capacitors (Sn/Pb)
CAPACITANCE RANGE
(pF) Tolerance LD02 LD03 LD05 LD10 (pF) Tolerance LD02 LD03 LD05 LD10 (pF) Tolerance LD02 LD03 LD05 LD10 (pF) Tolerance LD02 LD03 LD05 LD10
0.2 B,C 50V N/A N/A N/A 1.0 B,C,D 50V 200V 200V 200V 7.5 B,C,J,K,M 50V 200V 200V 200V 100 F,G,J,K,M N/A 100V 200V 200V
0.3 1.1 8.2 110 50V
0.4 1.2 9.1 B,C,J,K,M 120 50V
B,C 1.3 10 F,G,J,K,M 130 N/A 200V
0.5
0.6 B,C,D 1.4 11 140 100V
0.7 1.5 12 150
0.8 1.6 13 160 100V
0.9 B,C,D 1.7 15 180 N/A
1.8 18 200V 200
1.9 20 100V 220
2.0 22 270
2.1 24 300
2.2 27 330
2.4 30 50V 360
2.7 33 N/A 390
3.0 36 430 200V
3.3 39 470 100V
3.6 43 510
3.9 47 560
4.3 51 620
4.7 56 680
5.1 68 750
5.6 75 820
6.2 B,C,D
82 910
6.8 B,C,J,K,M
91 1000 F,G,J,K,M
ESR Measured on the Boonton 34A
012419

RF/Microwave Capacitors
RF/Microwave C0G (NP0) Capacitors
Ultra Low ESR “U” Series, C0G (NP0) Capacitors (Sn/Pb)
TYPICAL
SERIES RESONANT FREQUENCY
“U” SERIES CHIP
10
0402
0603
Frequency (GHz)
0805
1210
1.0
0.1
1.0 10 100 1000
Capacitance (pF)

U Dielectric
RF/Microwave Automotive C0G (NP0) Capacitors (RoHS)
AEC Q200 Qualified Ultra Low ESR , “U” Series, C0G (NP0) Chip Capacitors
GENERAL INFORMATION DIMENSIONS: inches (millimeters)
Automotive “U” Series capacitors are C0G (NP0) chip capacitors specially 0402 0603
designed for “Ultra” low ESR for applications in the automotive market. Max
ESR and effective capacitance are met on each value producing lot to lot
uniformity. Sizes available are EIA chip sizes 0402 and 0603.
inches (mm)
Size A B C D E
0.039±0.004 0.020±0.004 0.024 max
0402 N/A N/A
(1.00±0.1) (0.50±0.1) (0.6)
0.060±0.010 0.030±0.010 0.036 max 0.010±0.005 0.030 min

0603
(1.52±0.25) (0.76±0.25) (0.91) (0.25±0.13) (0.76)
HOW TO ORDER
0402 1 U 100 J A T 2 A

0402 Ultra Low Tolerance Code T= Plated Ni and Sn A = Standard
0603 ESR B = ±0.1pF
C = ±0.25pF
D = ±0.5pF
F = ±1%
G = ±2%
J = ±5%
K = ±10%
5 = 50V Code Code
1 = 100V Capacitance 4 = Automotive 2 = 7” Reel
2 = 200V EIA Capacitance Code in pF. 4 = 13” Reel
9 = Bulk
Third digit = number of zeros or
ELECTRICAL CHARACTERISTICS LEAD-FREE COMPATIBLE

COMPONENT
Capacitance Values and Tolerances: 250% of rated WVDC
Size 0402 - 0.2 pF to 22 pF @ 1 MHz
Temperature Coefficient of Capacitance (TC):
0±30 ppm/°C (-55° to +125°C)
Insulation Resistance (IR): Automotive Specifications
1012 Ω min. @ 25°C and rated WVDC Meets or exceeds the requirements of AEC Q200
Working Voltage (WVDC):
Size Working Voltage
0402 - 100, 50, 25 WVDC
0603 - 200, 100, 50 WVDC
Dielectric Working Voltage (DWV):
120216

U Dielectric
RF/Microwave Automotive C0G (NP0) Capacitors (RoHS)
AEC Q200 Qualified, Ultra Low ESR, “U” Series, C0G (NP0) Chip Capacitors
CAPACITANCE RANGE
(pF) Tolerance 0402 0603 (pF) Tolerance 0402 0603 (pF) Tolerance 0402 0603 (pF) Tolerance 0402 0603
0.2 B,C 50V N/A 1.0 B,C,D 50V 200V 7.5 B,C,J,K,M 50V 200V 100 F,G,J,K,M N/A 100V
0.3 1.1 8.2 110 50V
0.4 1.2 9.1 B,C,J,K,M 120 50V
B,C 1.3 10 F,G,J,K,M 130 N/A
0.5
0.6 B,C,D 1.4 11 140
0.7 1.5 12 150
0.8 1.6 13 160
0.9 B,C,D 1.7 15 180
1.8 18 200V 200
1.9 20 100V 220
2.0 22 270
2.1 24 300
2.2 27 330
2.4 30 50V 360
2.7 33 N/A 390
3.0 36 430
3.3 39 470
3.6 43 510
3.9 47 560
4.3 51 620
4.7 56 680
5.1 68 750
5.6 75 820
6.2 B,C,D
82 910
6.8 B,C,J,K,M
91 1000 F,G,J,K,M
TYPICAL
SERIES RESONANT FREQUENCY
“U” SERIES CHIP
10
0402
0603
Frequency (GHz)
1.0
0.1
1.0 10 100 1000
Capacitance (pF)
120216

U Dielectric
Designer Kits
Communication Kits “U” Series
0402 0603
Kit 5000 UZ Kit 4000 UZ
Cap. Cap. Cap. Cap.
Value Tolerance Value Tolerance Value Tolerance Value Tolerance
PF pF PF pF
0.5 4.7 1.0 6.8
1.0 5.6 1.2 7.5 B (±0.1pF)

B (± 0.1pF)
1.5 6.8 1.5 8.2
1.8 8.2 1.8 10.0

B (±0.1pF)
2.2 10.0 2.0 12.0
2.4 12.0 2.4 15.0

J (±5%) B (±0.1pF)
3.0 15.0 2.7 18.0
3.6 3.0 22.0 J (±5%)
***25 each of 15 values 3.3 27.0
3.9 33.0
4.7 39.0
5.6 47.0
***25 each of 24 values
0805 1210
Kit 3000 UZ Kit 3500 UZ
Cap. Cap. Cap. Cap.
Value Tolerance Value Tolerance Value Tolerance Value Tolerance
PF pF PF pF
1.0 15.0 2.2 36.0
1.5 18.0 2.7 39.0
2.2 22.0 4.7 47.0
2.4 24.0 5.1 B (±0.1pF) 51.0
2.7 27.0 6.8 56.0
3.0 33.0 8.2 68.0

B (±0.1pF)
3.3 36.0 9.1 82.0
J (±5%)
3.9 39.0 10.0 100.0 J (±5%)
4.7 47.0 13.0 120.0
5.6 56.0 15.0 130.0
7.5 68.0 18.0 240.0

J (± 5 % )
8.2 82.0 20.0 300.0
10.0 100.0 24.0 390.0

J (±5 %)
12.0 130.0 27.0 470.0
***25 each of 30 values 30.0 680.0
***25 each of 30 values
012419

X8R/X8L Dielectric
KYOCERA AVX has developed a range of multilayer ceramic capacitors designed for use in applications up to 150°C. These
capacitors are manufactured with an X8R and an X8L dielectric material. X8R material has capacitance variation of ± 15%
between -55°C and +150°C. The X8L material has capacitance variation of ±15% between -55°C to 125°C to 125°C and
+15/40% from +125°C to +150°C.
The need for X8R and X8L performance has been driven by customer requirements for parts that operate at elevated
temperatures. They provide a highly reliable capacitor with low loss and stable capacitance over temperature.
They are ideal for automotive under the hood sensors, and various industrial applications. Typical industrial application would
be drilling monitoring system. They can also be used as bulk capacitors for high temperature camera modules.
Both X8R and X8L dielectric capacitors are automotive AEC-Q200 qualified. Optional termination systems, tin, FLEXITERM®
and conductive epoxy for hybrid applications are available. Providing this series with our FLEXITERM® termination system
provides further advantage to customers by way of enhanced resistance to both, temperature cycling and mechanical
damage.
0805 5 A 104 K 4 T 2 A
Size Voltage Dielectric Capacitance Capacitance Failure Terminations Packaging Special Code
0402 10V = Z X8R = F
Code (in pF) Tolerance Rate T = Plated Ni and Sn 2 = 7” Reel A = Std. Product
0603 16V = Y X8L = L 2 Sig. Digits + J = ±5% 4=Automotive Z = FLEXITERM®** 4 = 13” Reel
0805 25V = 3 Number of Zeros K = ±10% A = Not
1206 50V = 5 e.g. 10 F = 106 M = ±20% Applicable
100V = 1
X8R X8L
Style 0603 0805 1206 Size 0603 0805 1206 1210
Soldering Reflow/Wave Reflow/Wave Reflow/Wave Soldering Reflow/Wave Reflow/Wave Reflow/Wave Reflow/Wave
WVDC 25V 50V 100V 25V 50V 100V 25V 50V WVDC 25V 50V 100V 25V 50V 100V 16V 25V 50V 100V 10V 50V 100V
221 220 J J J 271 Cap 270 G G
271 270 G G J J J 331 (pF) 330 G G G J J J
331 pF 330 G G J J J 471 470 G G G J J J
471 470 G G G J J J 681 680 G G G J J J
681 680 G G G J J J 102 1000 G G G J J J J J
102 1000 G G G J J J J J 152 1500 G G G J J J J J J
103 uF 0.01 G G G J J J J J 472 4700 G G G J J J J J J
153 0.015 G G J J N J J 562 5600 G G G J J J J J J
223 0.022 G G J J N J J 682 6800 G G G J J J J J J
333 0.033 G G J J J J 822 8200 G G G J J J J J J
473 0.047 G G J J J J 103 Cap 0.01 G G G J J J J J J
683 0.068 G N N M M 123 (µF) 0.012 G G J J J J J J
104 0.1 N N M M 153 0.015 G G J J J J J J
154 0.15 N N M M 183 0.018 G G J J J J J J
224 0.22 N M M 223 0.022 G G J J J J J J
334 0.33 M M 273 0.027 G G J J J J J J
474 0.47 M Q 333 0.033 G G J J N J J J
684 0.68 Q Q 393 0.039 G G J J N J J J
105 uF 1 Q Q 473 0.047 G G J J N J J J
WVDC 25V 50V 100V 25V 50V 100V 25V 50V 563 0.056 G G J J N J J J
Style 0603 0805 1206 683 0.068 G G J J N J J J
823 0.082 G G J J N J J J
104 0.1 G G J J N J J M
Size 0603 0805 1206 1210 124 0.12 J N J J M
Soldering Reflow/Wave Reflow/Wave Reflow/Wave Reflow/Wave 154 0.15 J N J J J Q
184 0.18 N N J J J Q
Packaging All Paper Paper/Embossed Paper/Embossed Paper/Embossed
224 0.22 N N J J J Q
mm 1.60 ± 0.15 2.01 ± 0.20 3.20 ± 0.20 3.30 ± 0.4
(L) Length 274 0.27 N J M M Q
(in) (0.063 ± 0.006) (0.079 ± 0.008) (0.126 ± 0.008) (0.130 ± 0.016)
334 0.33 N J M M Q
mm 0.81 ± 0.15 1.25 ± 0.20 1.60 ± 0.20 2.50 ± 0.20
(W) Width 394 0.39 N M M P Q
(in) (0.032 ± 0.006) (0.049 ± 0.008) (0.063 ± 0.008) (0.098 ± 0.008)
474 0.47 N M M P Q
mm 0.35 ± 0.15 0.50 ± 0.25 0.50 ± 0.25 0.50 ± 0.25
(t) Terminal 684 0.68 N M M P Q
(in) (0.014 ± 0.006) (0.020 ± 0.010) (0.020 ± 0.010) (0.020 ± 0.010)
824 0.82 N M M P Q
105 1 N M M P Q
155 1.5 M M
225 2.2 M M Z Z
475 Z
106 Z
WVDC 25V 50V 100V 25V 50V 100V 16V 25V 50V 100V 10V 50V 100V
SIZE 0603 0805 1206 1210
Letter A C E G J K M N P Q X Y Z
Max. 0.33 0.56 0.71 0.9 0.94 1.02 1.27 1.4 1.52 1.78 2.29 2.54 2.79
Thickness (-0.013) (-0.022) (-0.028) (-0.035) (-0.037) (-0.04) (-0.05) (-0.055) (-0.06) (-0.07) (-0.09) (-0.1) (-0.11)
PAPER EMBOSSED
062821

X8R/X8L Dielectric
APPLICATIONS FOR X8R AND X8L CAPACITORS
• All market sectors with a 150°C requirement
• Automotive on engine applications
• Oil exploration applications
• Hybrid automotive applications
– Battery control
– Inverter / converter circuits
– Motor control applications
– Water pump
• Hybrid commercial applications
– Emergency circuits
– Sensors
– Temperature regulation
ADVANTAGES OF X8R AND X8L MLC CAPACI-

TORS
• Both ranges are qualified to the highest automotive
AEC-Q200 standards
• Excellent reliability compared to other capacitor
technologies
• RoHS compliant
• Low ESR / ESL compared to other technologies
• Tin solder finish
• FLEXITERM® available
• Epoxy termination for hybrid available
• 100V range available
ENGINEERING TOOLS FOR HIGH VOLTAGE MLC CAPACITORS

• Samples
• Technical Articles
• Application Engineering
• Application Support
X8R/X8L Dielectric
0805, 50V, X8R/X8L Typical Temperature Coefficient
10.00
X8R
0.00
-10.00
Cap change %
X8L
-20.00
-30.00
-40.00
-50.00
-55 -35 -15 0 20 25 35 45 65 85 105 125 130 135 140 150
Temperature (°C)
100917

X8R/X8L Dielectric
Parameter/Test X8R/X8L Specification Limits Measuring Conditions
Capacitance Within specified tolerance
Freq.: 1.0 kHz ± 10%
≤ 2.5% for ≥ 50V DC rating Voltage: 1.0Vrms ± .2V
Dissipation Factor
≤ 3.5% for 25V DC and 16V DC rating
100,000MΩ or 1000MΩ - µF, Charge device with rated voltage for 120 ± 5 secs
Charge device with 250% of rated voltage for
1-5 seconds, w/charge and discharge current
Dielectric Strength No breakdown or visual defects limited to 50 mA (max)
for 500V devices.
Deflection: 2mm
≤ ±12%
Resistance to Variation
Flexure Dissipation
Stresses Meets Initial Values (As Above)
Factor
Insulation
Resistance
≥ 95% of each terminal should be covered with Dip device in eutectic solder at 230 ± 5ºC for 5.0 ±
Solderability
fresh solder 0.5 seconds
Capacitance
≤ ±7.5%
Variation
Dip device in eutectic solder at 260ºC for
Resistance to Dissipation 60 seconds. Store at room temperature for
Solder Heat Factor 24 ± 2 hours before measuring electrical
Resistance
Dielectric
Strength
Capacitance
≤ ±7.5% Step 2: Room Temp ≤ 3 minutes
Variation
Dissipation
Thermal Shock Meets Initial Values (As Above) Step 3: +125ºC ± 2º 30 ± 3 minutes
Factor
Insulation
Resistance
Strength 24 ± 2 hours at room temperature
Capacitance
≤ ±12.5% Charge device with 1.5 rated voltage (≤ 10V) in
Variation
test chamber set at 150ºC ± 2ºC
Dissipation
≤ Initial Value x 2.0 (See Above) for 1000 hours (+48, -0)
Load Life Factor
Insulation Remove from test chamber and stabilize at room
Resistance temperature for 24 ± 2 hours before measuring.
Dielectric
Strength
Capacitance
≤ ±12.5% Store in a test chamber set at 85ºC ± 2ºC/ 85% ±
Variation
5% relative humidity for 1000 hours
Dissipation (+48, -0) with rated voltage applied.
Load ≤ Initial Value x 2.0 (See Above)
Factor
Humidity
≥ Initial Value x 0.3 (See Above) temperature and humidity for 24 ± 2 hours before
Resistance
measuring..
Dielectric
Strength
100917

X7R Dielectric
X7R formulations are called “temperature stable” ceramics and fall into EIA Class II materials. X7R is the most popular
of these intermediate dielectric constant materials. Its temperature variation of capacitance is within ±15% from -55°C to
+125°C. This capacitance change is non-linear.
Capacitance for X7R varies under the influence of electrical operating con-ditions such as voltage and frequency.
X7R dielectric chip usage covers the broad spectrum of industrial applications where known changes in capacitance due
to applied voltages are acceptable.
0805 5 С 103 M A T 2 A

(L” x W”) 4V = 4 X7R = C Code (In pF) Tolerance Rate T = Plated Ni and Sn 2 = 7” Reel Code
6.3V = 6 2 Sig. Digits + J = ± 5%* A = Not Z= FLEXITERM®** 4 = 13” Reel A = Std.
10V = Z Number of Zeros K = ±10% Applicable *Optional termination Product
16V = Y M = ± 20% Contact
25V = 3 **See FLEXITERM® Factory For
50V = 5 X7R section Multiples
*≤1μF only,
100V = 1 contact factory for
200V = 2 additional values
500V = 7
Contact factory for non-specified capacitance values.
100819

X7R Dielectric
Parameter/Test X7R Specification Limits Measuring Conditions

≤ 10% for ≥ 50V DC rating≤ 12.5% for 25V DC rating Freq.: 1.0 kHz ± 10%
≤ 12.5% for 25V and 16V DC rating Voltage: 1.0Vrms ± .2V
Dissipation Factor
≤ 12.5% for ≤ 10V DC rating For Cap > 10µF, 0.5Vrm @ 120Hz
Contact Factory for DF by PN
10,000MΩ or 500MΩ - µF, Charge device with rated voltage for
whichever is less 120 ± 5 secs @ room temp/humidity
Charge device with 250% of rated voltage for 1-5 seconds, w/

Dielectric Strength No breakdown or visual defects charge and discharge current limited to 50 mA (max)
Note: Charge device with 150% of rated voltage for 500V devices.
Capacitance
≤ ±12%
Resistance to Variation Deflection: 2mm
Flexure Dissipation Test Time: 30 seconds
Stresses Factor
Insulation
Resistance
≥ 95% of each terminal should be covered with Dip device in eutectic solder at 230 ± 5ºC
Solderability
fresh solder for 5.0 ± 0.5 seconds
Capacitance
≤ ±7.5%
Variation
Dissipation Dip device in eutectic solder at 260ºC for 60 seconds. Store at
Resistance to Meets Initial Values (As Above)
Factor room temperature for 24 ± 2hours before measuring electrical
Solder Heat
Resistance
Dielectric
Strength
Capacitance
Variation
Dissipation
Meets Initial Values (As Above) Step 3: +125ºC ± 2º 30 ± 3 minutes
Thermal Shock Factor
Insulation
Resistance
Dielectric Repeat for 5 cycles and measure after 24 ± 2 hours at room
Strength temperature
Appearance No visual defects Pre-treatment: After mounting, perform heat treatment 150+0/-
Capacitance 10C for 2 hour, then stabilise for 24+/-2 hour at room temp,
≤ ±12.5% then measure.
Variation
Dissipation
≤ Initial Value x 2.0 (See Above) Charge device with ≥ rated voltage in test chamber set at
Factor
Insulation 125ºC ± 2ºC for 1000 hours (+48, -0).
Load Life ≥ Initial Value x 0.3 (See Above)
Resistance
Pre-treatment: After remove from test chamber, perform heat
treatment 150+0/-10C for 2 hour, then stabilise for 24+/-2 hour
Dielectric at room temp, then measure.
Strength
Contact KYOCERA AVX for datasheet of specific parts.
Appearance No visual defects Pre-treatment: After mounting, perform heat treatment 150+0/-
Capacitance 10C for 2 hour, then stabilise for 24+/-2 hour at room temp,
≤ ±12.5% then measure.
Variation
Dissipation
Load ≤ Initial Value x 2.0 (See Above) Store in a test chamber set at 85ºC ± 2ºC/ 85% ± 5% relative
Factor
Humidity humidity for 1000 hours (+48, -0) with rated voltage applied.
Insulation
Resistance
Pre-treatment: After remove from test chamber, perform heat
Dielectric treatment 150+0/-10C for 2 hour, then stabilise for 24+/-2 hour
Strength at room temp, then measure.
051222

X7R Dielectric
Capacitance Range
SIZE 0101* 0201 0402 0603 0805 1206
Soldering Reflow Only Reflow Only Reflow/Wave Reflow/Wave Reflow/Wave Reflow/Wave
Paper/
Packaging All Paper All Paper All Paper Paper/Embossed Paper/Embossed
Embossed
mm 0.40 ± 0.02 0.60 ± 0.03 1.00 ± 0.10 1.60 ± 0.15 2.01 ± 0.20 3.20 ± 0.30
(L) Length
(in.) (0.016 ± 0.0008) (0.024 ± 0.001) (0.040 ± 0.004) (0.063 ± 0.006) (0.079 ± 0.008) (0.126 ± 0.012)
mm 0.20 ± 0.02 0.30 ± 0.03 0.50 ± 0.10 0.81 ± 0.15 1.25 ± 0.20 1.60 ± 0.30
W) Width
(in.) (0.008 ± 0.0008) (0.011 ± 0.001) (0.020 ± 0.004) (0.032 ± 0.006) (0.049 ± 0.008) (0.063 ± 0.012)
mm 0.10± 0.04 0.15 ± 0.05 0.25 ± 0.15 0.35 ± 0.15 0.50 ± 0.25 0.50 ± 0.25
(t) Terminal
(in.) (0.004 ± 0.0016) (0.006 ± 0.002) (0.010 ± 0.006) (0.014 ± 0.006) (0.020 ± 0.010) (0.020 ± 0.010)
WVDC 16 6.3 10 16 25 50 6.3 10 16 25 50 100 6.3 10 16 25 50 100 200 250 6.3 10 16 25 50 100 200 250 6.3 10 16 25 50 100 200 250 500
Cap 100 101 B A A A A A C C C C C C G G G G G G J J G G N N N
(pF) 150 151 B A A A A A C C C C C C G G G G G G J J G G G G G G N N N
220 221 B A A A A A C C C C C C G G G G G G J J E E E E E E E J J J J J J J N N P
330 331 B A A A A A C C C C C C G G G G G G J J J J J J J J J J J J J J J N N P
1500 152 A A A A C C C C C C G G G G G G J J J J J J J J J J J J J J J N N P
3900 392 A A A A
5600 562 A A A A
6800 682 A A A A C C C C C C G G G G G G J J J J J J J P P J J J J J J N N P
Cap 0.01 103 A A A A C C C C C C G G G G G G J J J J J J J P P J J J J J J N N P
(μF) 0.012 123
0.015 153 C C C C E G G G G G J J J J J J J J P P J J J J J J N N Q
0.018 183
0.022 223 A A A C C C C E G G G G G J J J J J J J J P P J J J J J J P P Q
0.027 273
0.033 333 C C C C E G G G G J J J J J J P P P J J J J J J Q Q Q
0.039 393
0.047 473 C C C C E G G G G J J J J J J P P P J J J J J J Q Q Q
0.068 683 C C C C E G G G G J J J J J J P P J J J J J P Q Q
0.082 823
0.1 104 A C C C C E G G G G J J J J J J P P J J J J J P Q Q
0.12 124
0.15 154 G G G J J N N N N P K K K K K Q Q Q
0.22 224 C C C C G G J J J N N N N P K K K K K Q Q Q
0.33 334 J J J J J P P P P P K K K K N Q
0.47 474 C C J J J J J P P P P P M M M M X X
0.68 684 J J J P P P M M M M X X
1.0 105 C J J J J K P P P P M M M M X X
2.2 225 J J K P P P P M M M X X X
4.7 475 K P P P X X X X Z
10 106 P P P X X X X
22 226 X X
47 476
100 107
WVDC 16 6.3 10 16 25 50 6.3 10 16 25 50 100 6.3 10 16 25 50 100 200 250 6.3 10 16 25 50 100 200 250 6.3 10 16 25 50 100 200 250 500
SIZE 0101* 0201 0402 0603 0805 1206
Max. 0.33 0.22 0.56 0.71 0.90 0.94 1.02 1.27 1.40 1.52 1.78 2.29 2.54 2.79
Thickness (0.013) (0.009) (0.022) (0.028) (0.035) (0.037) (0.040) (0.050) (0.055) (0.060) (0.070) (0.090) (0.100) (0.110)
PAPER EMBOSSED
NOTE: Contact factory for non-specified capacitance values

*EIA 01005
**Contact Factory for Specifications
022222

X7R Dielectric
Capacitance Range
SIZE 1210 1812 1825 2220 2225
mm 3.30 ± 0.4 4.50 ± 0.40 4.50 ± 0.40 5.70 ± 0.50 5.70 ± 0.40
(L) Length
(in.) (0.130± 0.016) (0.177 ± 0.016) (0.177 ± 0.016) (0.224 ± 0.020) (0.224 ± 0.016)
mm 2.50 ± 0.30 3.20 ± 0.40 6.40 ± 0.40 5.00 ± 0.40 6.30 ± 0.40
W) Width
(in.) (0.098 ± 0.012) (0.126 ± 0.016) (0.252 ± 0.016) (0.197 ± 0.016) (0.248 ± 0.016)
mm 0.50 ± 0.25 0.61 ± 0.36 0.61 ± 0.36 0.64 ± 0.39 0.64 ± 0.39
(t) Terminal
(in.) (0.020 ± 0.010) (0.024 ± 0.014) (0.024 ± 0.014) (0.025 ± 0.015) (0.025 ± 0.015)
WVDC 10 16 25 50 100 200 500 16 25 50 100 200 500 50 100 200 25 50 100 200 500 50 100 200
Cap 100 101
(pF) 150 151
220 221 K K K M
330 331 K K K M N N N N
470 471 K K K M N N N N
680 681 K K K M N N N N
1000 102 K K K K K K M N N N N N N X X X X X X X X X X
3300 332 K K K K K K P N N N N N N X X X X X X X X X X
4700 472 K K K K K K P N N N N N P X X X X X X X X X X
6800 682 K K K K K K P N N N N N P X X X X X X X X X X
Cap 0.01 103 K K K K K K P N N N N N P X X X X X X X X X X
(μF) 0.015 153 K K K K K K P N N N N N P X X X X X X X X X X
0.022 223 K K K K K P Q N N N N N P X X X X X X X X X X
0.033 333 K K K K K P X N N N N N X X X X X X X X X X X
0.047 473 K K K K K P X N N N N P X X X X X X X X X X X
0.068 683 K K K K K P X N N N N P X X X X X X X X X X X
0.1 104 K K K K K P X N N N P P X X X X X X X X X X X
0.15 154 K K K M P Z Z N N N P P Z X X X X X X X X X X
0.22 224 K K K M P Z N N N P Q Z X X X X X X X X X X
0.33 334 K K K M Q Z N N N P X Z X X X X X X X X X X
0.47 474 M M M P Q Z N N N Q X Z X X X X X X X X X X
0.68 684 M M P X X Z Q Q Q Q Z X X X X X X Z X X X
1.0 105 P P P X Z Q Q Q X Z X X X X X X 7 X X X
1.5 155 N N Z Z Z Z Z Z X X Z X X Z X X Z
2.2 225 X X Z Z Z Z Z Z X X Z X X Z X X Z
3.3 335 X X Z Z Z Z Z Z X X X Z X X
4.7 475 Z Z Z Z Z Z Z Z X X Z Z X X
10 106 Z Z Z Z Z Z Z Z Z Z Z Z Z
22 226 Z Z Z Z
47 476 Z
100 107
WVDC 10 16 25 50 100 200 500 16 25 50 100 200 500 50 100 200 25 50 100 200 500 50 100 200
SIZE 1210 1812 1825 2220 2225
Letter A B C E G J K M N P Q X Y Z 7
Max. 0.33 0.22 0.56 0.71 0.90 0.94 1.02 1.27 1.40 1.52 1.78 2.29 2.54 2.79 3.30
Thickness (0.013) (0.009) (0.022) (0.028) (0.035) (0.037) (0.040) (0.050) (0.055) (0.060) (0.070) (0.090) (0.100) (0.110) (0.130)
PAPER EMBOSSED
080221

X7S Dielectric
GENERAL DESCRIPTION
X7S formulations are called “temperature stable” ceramics and fall into EIA Class II materials. Its temperature
variation of capacitances within ±22% from –55°C to +125°C. This capacitance change is non-linear.
Capacitance for X7S varies under the influence of electrical operating conditions such as voltage and frequency.
X7S dielectric chip usage covers the broad spectrum of industrial applications where known changes in capacitance
due to applied voltages are acceptable.
1206 Z Z 105 M A T 2 A

(L” x W”) 4 = 4V Z = X7S Code (In pF) Tolerance Rate T = Plated Ni 2 = 7” Reel Code
6 = 6.3V 2 Sig. Digits + K = ±10% A = N/A and Sn 4 = 13” Reel A = Std.
Z = 10V Number of M = ± 20% Product
Y = 16V Zeros
3 = 25V
5 = 50V
1 = 100V
2 = 200V
NOTE: Contact factory for availability of Tolerance Options for Specific Part Numbers.
TYPICAL ELECTRICAL CHARACTERISTICS
X7S Dielectric
Typical Temperature Coefficient Capacitance vs. Frequency Insulation Resistance vs Temperature
Insulation Resistance (Ohm-Farads)
10,000
10 +30
5
+20
0
Capacitance
% Cap Change
+10 1,000
-5
0
-10
-15 -10 100

%
-20 -20
-25
-60 -40 -20 0 20 40 60 80 100 120 140 -30 0
1KHz 10 KHz 100 KHz 1 MHz 10 MHz 0 20 40 60 80 100 120
Temperature (°C)
Frequency Temperature °C
Variation of Impedance with Cap Value

Impedance vs. Frequency Variation of Impedance with Chip Size Variation of Impedance with Chip Size
1,000 pF vs. 10,000 pF - X7S Impedance vs. Frequency Impedance vs. Frequency
0805 10,000 pF - X7S 100,000 pF - X7S
10
10.00 10 1206
1,000 pF 1206
0805 0805
10,000 pF 1210 1210
1.0
Impedance,
1.00 1.0
Impedance,
Impedance,
0.1
0.10 0.1
0.01 .01 .01

10 100 1000 1 10 100 1,000 1 10 100 1,000
Frequency, MHz Frequency, MHz Frequency, MHz

X7S Dielectric
Parameter/Test X7S Specification Limits Measuring Conditions

≤ 5.0% for ≥ 100V DC rating
Freq.: 1.0 kHz ± 10%
≤ 5.0% for ≥ 25V DC rating
Voltage: 1.0Vrms ± .2V
Dissipation Factor ≤ 10.0% for ≥ 10V DC rating
For Cap > 10 μF, 0.5Vrms @ 120Hz
≤ 10.0% for ≤ 10V DC rating
100,000MΩ or 1000MΩ - μF, Charge device with rated voltage for
Dielectric Strength No breakdown or visual defects 1-5 seconds, w/charge and discharge current
limited to 50 mA (max)
Appearance No defects Deflection: 2mm
≤ ±12%
Flexure Dissipation
Factor
Insulation
Resistance
≥ 95% of each terminal should be covered Dip device in eutectic solder at 230 ± 5ºC
Solderability
with fresh solder for 5.0 ± 0.5 seconds
Capacitance
≤ ±7.5%
Variation
Dissipation Dip device in eutectic solder at 260ºC for 60
Factor seconds. Store at room temperature for 24 ± 2
Solder Heat
Insulation hours before measuring electrical properties.
Resistance
Dielectric
Strength
Capacitance
Variation
Dissipation
Thermal Shock Factor
Insulation
Resistance
Capacitance
Variation
Dissipation
Load Life Factor
Dielectric
Strength
Capacitance Store in a test chamber set at 85ºC ± 2ºC/ 85% ±
≤ ±12.5%
Variation 5% relative humidity for 1000 hours
Factor
Humidity
Resistance temperature and humidity for
24 ± 2 hours before measuring.
Dielectric
Strength

X7S Dielectric
Capacitance Range
SIZE 0402 0603 0805 1206 1210

Soldering Reflow/Wave Reflow/Wave Reflow/Wave Reflow/Wave Reflow Only
Packaging All Paper All Paper Paper/Embossed Paper/Embossed Paper/Embossed
mm 1.00 ± 0.10 1.60 ± 0.15 2.01 ± 0.20 3.20 ± 0.20 3.20 ± 0.20
(L) Length
(in.) (0.040 ± 0.004) (0.063 ± 0.006) (0.079 ± 0.008) (0.126 ± 0.008) (0.126 ± 0.008)
mm 0.50 ± 0.10 0.81 ± 0.15 1.25 ± 0.20 1.60 ± 0.20 2.50 ± 0.20
W) Width
(in.) (0.020 ± 0.004) (0.032 ± 0.006) (0.049 ± 0.008) (0.063 ± 0.008) (0.098 ± 0.008)
(t) mm 0.25 ± 0.15 0.35 ± 0.15 0.50 ± 0.25 0.50 ± 0.25 0.50 ± 0.25
Terminal (in.) (0.010 ± 0.006) (0.014 ± 0.006) (0.020 ± 0.010) (0.020 ± 0.010) (0.020 ± 0.010)
WVDC 4 6.3 6.3 4 10 50 100 6.3
Cap 100
(pF) 150
220
330
470
680
1000
1500
2200
3300
4700
6800
Cap 0.010
(μF) 0.015
0.022
0.033 C
0.047 C
0.068 C
0.10 C
0.15
0.22
0.33 G
0.47 G
0.68 G
1.0 E G
1.5 N
2.2 E N Q
3.3 N
4.7 N Q
10
22 Z
47
100
WVDC 4 6.3 6.3 4 10 50 100 6.3
SIZE 0402 0603 0805 1206 1210
Max. 0.33 0.56 0.71 0.90 0.94 1.02 1.27 1.40 1.52 1.78 2.29 2.54 2.79
Thickness (0.013) (0.022) (0.028) (0.035) (0.037) (0.040) (0.050) (0.055) (0.060) (0.070) (0.090) (0.100) (0.110)
PAPER EMBOSSED
*Contact Factory for Specifications

X5R Dielectric
GENERAL DESCRIPTION
• General Purpose Dielectric for Ceramic Capacitors
• EIA Class II Dielectric
• Temperature variation of capacitance is within ±15%
from -55°C to +85°C
• Well suited for decoupling and filtering applications
• Available in High Capacitance values (up to 100μF)
1210 4 D 107 M A T 2 A

(L” x W”) 4 = 4V D = X5R Code (In pF) Tolerance Rate T = Plated Ni 2 = 7” Reel Code
0101** 6 = 6.3V 2 Sig. Digits + K = ±10% A = N/A and Sn 4 = 13” Reel A = Std.
0201 Z = 10V Number of M = ± 20%
0402 Y = 16V Zeros
0603 3 = 25V
0805 D = 35V
1206 5 = 50V
1210 1 = 100V
1812
**EIA 01005
Insulation Resistance vs Temperature

20 10,000
15
10
% Capacitance
0 1,000
-5
-10
100
-15
-20
-60 -40 -20 0 +20 +40 +60 +80 0

20 40 60 80 100 120
Temperature °C Temperature °C

X5R Dielectric

≤ 2.5% for ≥ 50V DC rating Freq.: 1.0 kHz ± 10%
≤ 12.5% for 25V, 35V DC rating Voltage: 1.0Vrms ± .2V
Dissipation Factor
≤ 12.5% Max. for 16V DC rating and lower For Cap > 10 µF, 0.5Vrms @ 120Hz
10,000MΩ or 500MΩ - µF, Charge device with rated voltage for 120 ± 5
whichever is less secs @ room temp/humidity
Charge device with 250% of rated voltage for 1-5
Dielectric Strength No breakdown or visual defects seconds, w/charge and discharge current limited
to 50 mA (max)
Deflection: 2mm
≤ ±12%
Flexure Dissipation
Stresses Factor
Insulation
Resistance
≥ 95% of each terminal should be covered with Dip device in eutectic solder at 230 ± 5ºC for 5.0
Solderability
fresh solder ± 0.5 seconds
Capacitance
≤ ±7.5%
Variation
Dissipation Dip device in eutectic solder at 260ºC for
Factor 60seconds. Store at room temperature for 24 ±
Solder Heat
2hours before measuring electrical properties.
Insulation
Resistance
Dielectric
Strength
Capacitance
Variation
Dissipation
Factor
Insulation
Resistance
Dielectric Repeat for 5 cycles and measure after 24 ± 2
Strength hours at room temperature
Charge device with 1.5X rated voltage in test
Capacitance chamber set at 85ºC ± 2ºC for 1000 hours
≤ ±12.5%
Variation (+48, -0).
Dissipation
≤ Initial Value x 2.0 (See Above) Note: Contact factory for *optional specification
Load Life Factor
part numbers that are tested at < 1.5X rated
Insulation voltage.
Resistance
Dielectric Remove from test chamber and stabilize at room
Meets Initial Values (As Above) temperature for 24 ± 2 hours
Strength
Capacitance
Variation
5% relative humidity for 1000 hours (+48, -0) with
Dissipation rated voltage applied.
Factor
Humidity
≥ Initial Value x 0.3 (See Above) temperature and humidity for
Resistance
Dielectric
Strength

X5R Dielectric
Capacitance Range
Case Size 0101* 0201 0402 0603 0805
Soldering Reflow Only Reflow Only Reflow/Wave Reflow/Wfeve Reflow/Wfeve
Packaging Paper/Embossed All Paper All Paper All Paper Paper/Embossed
mm 0.40 ± 0.02 0.60 ± 0.09 1.00 ± 0.20 1.60 ± 0.20 2.01 ± 0.20
(L) Length
(in.) (0.016 ± 0.0008) (0.024 ± 0.004) (0.040 ± 0.008) (0.063 ± 0.008) (0.079 ± 0.008)
mm 0.20 ± 0.02 0.30 ± 0.09 0.50 ± 0.20 0.80 ± 0.20 1.25 ± 0.20
W) Width
(in.) (0.008 ± 0.0008) (0.011 ± 0.004) (0.020 ± 0.008) (0.031 ± 0.008) (0.049 ± 0.008)
mm 0.10 ± 0.04 0.15 ± 0.05 0.25 ± 0.10 0.35 ± 0.15 0.50 ± 0.25
(t) Terminal
(in.) (0.004 ± 0.0016) (0.006 ± 0.002) (0.010 ± 0.004) (0.014 ± 0.006) (0.020 ± 0.010)
Voltage: 6.3 10 4 6.3 10 16 25 4 6.3 10 16 25 50 4 6.3 10 16 25 35 50 4 6.3 10 16 25 35 50
Cap (pF) 100 101 B A
150 151 B A
220 221 B A C
330 331 B A C
470 471 B A C
680 681 B A C
1000 102 B A A C
1500 152 B B A A C
2200 222 B B A A A C
3300 332 B B A A A C
4700 472 B B A A A C G
6800 682 B B A A A C G
Cap (μF) 0.01 103 B B A A A C G G G
0.015 150 B C G G G
0.022 223 B A A A A C C G G G N
0.033 333 B C G G G N
0.047 473 B A A A A C C G G G N
0.068 689 B C G G N
0.1 104 B A A A A C C C C G G G N N N
0.15 154 G N N
0.22 224 B A A A C C C C C G G N N N
0.33 334 G G N
0.47 474 B A A C C C C C E G J N P P
0.68 684 G N
1.0 105 A A C C C C C C C G G G G J G G N N P P
1.5 155
2.2 225 C C C C C C C C G G J J J K K N N P P P
3.3 335 J J J J N N
4.7 475 C C E E E E J J J G K N P J N N P P
10 106 E E E K J K K K P P P P P
22 226 E G K K K P P P P P
47 476 K K P P P
100 107
Voltage: 6.3 10 4 6.3 10 16 25 4 6.3 10 16 25 50 4 6.3 10 16 25 35 50 4 6.3 10 16 25 35 50
Case Size 0101* 0201 0402 0603 0805
Max. 0.33 0.22 0.56 0.71 0.90 0.94 1.02 1.27 1.40 1.52 1.78 2.29 2.54 2.79
Thickness (0.013) (0.009) (0.022) (0.028) (0.035) (0.037) (0.040) (0.050) (0.055) (0.060) (0.070) (0.090) (0.100) (0.110)
PAPER EMBOSSED
PAPER and EMBOSSED available for 01005
*EIA 01005

X5R Dielectric
Capacitance Range
Case Size 1206 1210 1812

Soldering Reflow/Wave Reflow Only Reflow Only
Packaging Paper/Embossed Paper/Embossed All Embossed
mm 3.20 ± 0.40 3.20 ± 0.40 4.50 ± 0.30
(L) Length
(in.) (0.126 ± 0.016) (0.126 ± 0.016) (0.177 ± 0.012)
mm 1.60 ± 0.30 2.50 ± 0.30 3.20 ± 0.20
W) Width
(in.) (0.063 ± 0.012) (0.098 ± 0.012) (0.126 ± 0.008)
mm 0.50 ± 0.25 0.50 ± 0.25 0.61 ± 0.36
(t) Terminal
(in.) (0.020 ± 0.010) (0.020 ± 0.010) (0.024 ± 0.014)
Voltage: 4 6.3 10 16 25 35 50 4 6.3 10 16 25 35 50 4 6.3 10 16 25 35 50
Cap (pF) 100 101
150 151
220 221
330 331
470 471
680 681
1000 102
1500 152
2200 222
3300 332
4700 472
6800 682
Cap (μF) 0.01 103
0.015 150
0.022 223
0.033 333
0.047 473
0.068 689
0.1 104
0.15 154
0.22 224
0.33 334
0.47 474 Q Q X X
0.68 684
1.0 105 Q Q Q X X X
1.5 155
2.2 225 Q Q Q Q Q X Z Z
3.3 335 Q Q
4.7 475 X X X X X X X Z Z Z Z Z
10 106 X X X X X X X X X Z Z Z Z Z
22 226 X X X X X Z Z Z Z Z Z Z Z Z
47 476 X X X X Z Z Z Z Z
100 107 X X Z Z
Voltage: 4 6.3 10 16 25 35 50 4 6.3 10 16 25 35 50 4 6.3 10 16 25 35 50
Case Size 1206 1210 1812
Max. 0.33 0.22 0.56 0.71 0.90 0.94 1.02 1.27 1.40 1.52 1.78 2.29 2.54 2.79
Thickness (0.013) (0.009) (0.022) (0.028) (0.035) (0.037) (0.040) (0.050) (0.055) (0.060) (0.070) (0.090) (0.100) (0.110)
PAPER EMBOSSED
PAPER and EMBOSSED available for 01005

*EIA 01005

Y5V Dielectric
GENERAL DESCRIPTION
Y5V formulations are for general-purpose use in a limited temperature range. They have a wide temperature
characteristic of +22% –82% capacitance change over the operating temperature range of –30°C to +85°C.
These characteristics make Y5V ideal for decoupling applications within limited temperature range.
0805 3 G 104 Z A T 2 A

(L” x W”) 6.3V = 6 Y5V = G Code (In pF) Tolerance Rate T = Plated Ni 2 = 7” Reel Code
10V = Z 2 Sig. Digits + Z = +80 –20% A = Not and Sn 4 = 13” Reel A = Std.
16V = Y Number of Applicable Product
25V = 3 Zeros
50V = 5
Temperature Coefficient Capacitance Change Insulation Resistance vs. Temperature

vs. DC Bias Voltage

10,000
+20
+10 +40
0
Capacitance
+20
-10 1,000
-20 0
c/c (%)
-30
-20
-40
-50 -40 100
-60 -60
%
-70
-80 -80
-100 0
-55 -35 -15 +5 +25 +45 +65 +85 +105 +125 0 20 40 60 80 100 +20 +30 +40 +50 +60 +70 +80 +90
Temperature °C % DC Bias Voltage Temperature °C
0.1 F - 0603 0.22 F - 0805 1 F - 1206

Impedance vs. Frequency Impedance vs. Frequency Impedance vs. Frequency
10,000 1,000 1,000
1,000
100 100
100
|Z| (Ohms)
|Z| (Ohms)
|Z| (Ohms)
10 10
10
1 1
1
0.1 0.1 0.1
0.01 0.01 0.01

10,000 100,000 1,000,000 10,000,000 10,000 100,000 1,000,000 10,000,000 10,000 100,000 1,000,000 10,000,000
Frequency (Hz) Frequency (Hz) Frequency (Hz)
101316

Y5V Dielectric
Parameter/Test Y5V Specification Limits Measuring Conditions
≤ 7.0% for 25V DC rating Voltage: 1.0Vrms ± .2V
Dissipation Factor For Cap > 10 μF, 0.5Vrms @ 120Hz
≤ 9.0% for 16V DC rating
10,000MΩ or 500MΩ - μF, Charge device with rated voltage for 120 ± 5 secs
Deflection: 2mm
≤ ±30%
Flexure Dissipation
Factor
Insulation
Resistance
≥ 95% of each terminal should be covered with Dip device in eutectic solder at 230 ± 5ºC
Solderability
fresh solder for 5.0 ± 0.5 seconds
Capacitance
≤ ±20%
Variation
Solder Heat
hours before measuring electrical properties.
Insulation
Resistance
Dielectric
Strength
Capacitance
≤ ±20% Step 2: Room Temp ≤ 3 minutes
Variation
Dissipation
Factor
Insulation
Resistance
Strength 24 ±2 hours at room temperature
Capacitance
≤ ±30% Charge device with twice rated voltage in test
Variation
Dissipation
Load Life Factor
Dielectric
Strength
Capacitance
≤ ±30% Store in a test chamber set at 85ºC ± 2ºC/ 85% ±
Variation
Load ≤ Initial Value x 1.5 (See above)
Factor
Humidity
Resistance
Dielectric
Strength
101316

Y5V Dielectric
Capacitance Range
SIZE 0201 0402 0603 0805 1206 1210

Soldering Reflow Only Reflow/Wave Reflow/Wave Reflow/Wave ReflowMfeve Reflow/Wave
Packaging All Paper All Paper All Paper Paper/Embossed Paper/Embossed Paper/Embossed
mm 0.60 ± 0.09 1.00 ± 0.10 1.60 ± 0.15 2.01 ± 0.20 3.20 ± 0.20 3.20 ± 0.20
(L) Length
(in.) (0.024 ± 0.004) (0.040 ± 0.004) (0.063 ± 0.006) (0.079 ± 0.008) (0.126 ± 0.008) (0.126 ± 0.008)
mm 0.30 ± 0.09 0.50 ± 0.10 .81 ± 0.15 1.25 ± 0.20 1.60 ± 0.20 2.50 ± 0.20
W) Width
(in.) (0.011 ± 0.004) (0.020 ± 0.004) (0.032 ± 0.006) (0.049 ± 0.008) (0.063 ± 0.008) (0.098 ± 0.008)
mm 0.15 ± 0.05 0.25 ± 0.15 0.35 ± 0.15 0.50 ± 0.25 0.50 ± 0.25 .50 ± 0.25
(t) Terminal
(in.) (0.006 ± 0.002) (0.010 ± 0.006) (0.014 ± 0.006) (0.020 ± 0.010) (0.020 ± 0.010) (0.020 ± 0.010)
WVDC 6.3 10 6 10 16 25 50 10 16 25 50 10 16 25 50 10 16 25 50 10 16 25 50
Cap 820
(pF) 1000 A
2200 A
4700 A
Cap 0.010 A A
(μF) 0.022 A
0.047 A C
0.10 C C G G K
0.22 G
0.33 G
0.47 C G G
1.0 C C G G J N N N M M M N
2.2 C J N N K Q
4.7 N N N P Q N N
10.0 N P Q Q X X Q Q Z
22.0 Q X Z
47.0
WVDC 6.3 10 6 10 16 25 50 10 16 25 50 10 16 25 50 10 16 25 50 10 16 25 50
SIZE 0201 0402 0603 0805 1206 1210
Max. 0.33 0.56 0.71 0.90 0.94 1.02 1.27 1.40 1.52 1.78 2.29 2.54 2.79
Thickness (0.013) (0.022) (0.028) (0.035) (0.037) (0.040) (0.050) (0.055) (0.060) (0.070) (0.090) (0.100) (0.110)
PAPER EMBOSSED
060120

MLCC Gold Termination — AU Series
KYOCERA AVX will support those customers for commercial and military Multilayer Ceramic Capacitors with
a termination consisting of Gold. This termination is indicated by the use of a “7” or “G” in the 12th position
of the KYOCERA AVX Catalog Part Number. This fulfills KYOCERA AVX’s commitment to providing a full range
of products to our customers. Please contact the factory if you require additional information on our MLCC
Gold Termination.
PART NUMBER
AU03 Y G 104 K A 7 2 A

AU02 - 0402 6.3V = 6 C0G (NP0) = A Code (In pF) Tolerance Rate G* =1.9 μ" to 2 = 7" Reel Code
AU03 - 0603 10V = Z X7R = C 2 Sig. Digits + B = ±.10 pF (<10pF) A = Not 7.87 μ" 4 = 13" Reel A = Std.
AU05 - 0805 16V = Y X5R = D Number of C = ±.25 pF (<10pF) Applicable U = 4mm TR Product
AU06 - 1206 25V = 3 Zeros D = ±.50 pF (<10pF) 7 = 100 μ" (01005)
AU10 - 1210 35V = D F = ±1% (≥ 10 pF) minimum
AU12 - 1812 50V = 5 G = ±2% (≥ 10 pF) Contact
AU13 - 1825 100V = 1 J = ±5% Factory For
AU14 - 2225 200V = 2 K = ±10% Multiples*
AU16 - 0306 500V = 7 M = ±20%
AU17 - 0508
AU18 - 0612
* Contact factory for availability.
110419

MLCC Gold Termination – AU Series
Capacitance Range (NP0 Dielectric)
SIZE AU02 AU03 AU05 AU06
Reflow/Epoxy/ Reflow/Epoxy/ Reflow/Epoxy/ Reflow/Epoxy/
Soldering Wire Bond* Wire Bond* Wire Bond* Wire Bond*
Packaging All Paper All Paper Paper/Embossed Paper/Embossed
mm 1.00 ± 0.10 1.60 ± 0.15 2.01 ± 0.20 3.20 ± 0.20
(L) Length
(in.) (0.040 ± 0.004) (0.063 ± 0.006) (0.079 ± 0.008) (0.126 ± 0.008)
mm 0.50 ± 0.10 0.81 ± 0.15 1.25 ± 0.20 1.60 ± 0.20
W) Width
(in.) (0.020 ± 0.004) (0.032 ± 0.006) (0.049 ± 0.008) (0.063 ± 0.008)
mm 0.25 ± 0.15 0.35 ± 0.15 0.50 ± 0.25 0.50 ± 0.25
(t) Terminal
(in.) (0.010 ± 0.006) (0.014 ± 0.006) (0.020 ± 0.010) (0.020 ± 0.010)
WVDC 16 25 50 16 25 50 100 16 25 50 100 200 16 25 50 100 200 500
Cap 0.5 C C C G G G G J J J J J J J J J J J
(pF) 1.0 C C C G G G G J J J J J J J J J J J
1.2 C C C G G G G J J J J J J J J J J J
10 C C C G G G G J J J J J J J J J J J
220 C C C G G G G J J J J J J J J J J M
270 C C C G G G G J J J J M J J J J J M
390 C C C G G G J J J J M J J J J J M
560 G G G J J J J M J J J J J M
680 G G G J J J J M J J J J J P
820 G G G J J J J M J J J J M
1000 G G G J J J J M J J J J Q
1200 J J J J J J J Q
1500 J J J J J J M Q
1800 J J J J J M M
2200 J J N J J M P
2700 J J N J J M P
3300 J J J J M P
3900 J J J J M P
4700 J J J J M P
5600 J J M
6800 M M
8200 M M
0.010 M M
0.012
0.015
0.018
0.022
0.027
0.033
0.039
0.047
0.068
0.082
0.1
WVDC 16 25 50 16 25 50 100 16 25 50 100 200 16 25 50 100 200 500
* Contact Factory
Max. 0.33 0.56 0.71 0.90 0.94 1.02 1.27 1.40 1.52 1.78 2.29 2.54 2.79
Thickness (0.013) (0.022) (0.028) (0.035) (0.037) (0.040) (0.050) (0.055) (0.060) (0.070) (0.090) (0.100) (0.110)
PAPER EMBOSSED
110419

Capacitance Range (NP0 Dielectric)
Soldering Wire Bond* Wire Bond* Wire Bond* Wire Bond*
Packaging Paper/Embossed All Embossed All Embossed All Embossed
mm 3.20 ± 0.20 4.50 ± 0.30 4.50 ± 0.30 5.72 ± 0.25
(L) Length
(in.) (0.126 ± 0.008) (0.177 ± 0.012) (0.177 ± 0.012) (0.225 ± 0.010)
mm 2.50 ± 0.20 3.20 ± 0.20 6.40 ± 0.40 6.35 ± 0.25
W) Width
(in.) (0.098 ± 0.008) (0.126 ± 0.008) (0.252 ± 0.016) (0.250 ± 0.010)
mm 0.50 ± 0.25 0.61 ± 0.36 0.61 ± 0.36 0.64 ± 0.39
(t) Terminal
(in.) (0.020 ± 0.010) (0.024 ± 0.014) (0.024 ± 0.014) (0.025 ± 0.015)
WVDC 25 50 100 200 500 25 50 100 200 500 50 100 200 50 100 200
Cap 0.5
(pF) 1.0
1.2
1.5
1.8
2.2
2.7
3.3
3.9
4.7
5.6
6.8
8.2
10 J
12 J
15 J
18 J
22 J
27 J
33 J
39 J
47 J
56 J
68 J
82 J
100 J
120 J
150 J
180 J
220 J
270 J
330 J
390 M
470 M
560 J J J J M
680 J J J J M
820 J J J J M
1000 J J J J M K K K K M M M M M M P
1200 J J J M M K K K K M M M M M M P
1800 J J J M K K K K M M M M M M P
2200 J J J Q K K K K P M M M M M P
2700 J J J Q K K K P Q M M M M M P
3300 J J J K K K P Q M M M M M P
3900 J J M K K K P Q M M M M M P
4700 J J M K K K P Q M M M M M P
5600 J J K K M P X M M M M M P
6800 J J K K M X M M M M M P
8200 J J K M M M M M M P
0.010 J J K M M M M M M P
0.012 J J K M M M M M P
0.015 M M M M M M Y
0.018 M M P M M M Y
0.022 M M P M Y Y
0.027 M M P P Y Y
0.033 M M P P
0.039 M M P P
0.047 M M P P
0.068 M M P
0.082 M M Q
0.1 Q
WVDC 25 50 100 200 500 25 50 100 200 500 50 100 200 50 100 200
* Contact Factory
Max. 0.33 0.56 0.71 0.90 0.94 1.02 1.27 1.40 1.52 1.78 2.29 2.54 2.79
Thickness (0.013) (0.022) (0.028) (0.035) (0.037) (0.040) (0.050) (0.055) (0.060) (0.070) (0.090) (0.100) (0.110)
PAPER EMBOSSED
041019

Capacitance Range (X7R Dielectric)
Soldering
Wire Bond* Wire Bond* Wire Bond* Wire Bond*
mm 1.00 ± 0.10 1.60 ± 0.15 2.01 ± 0.20 3.20 ± 0.20
(L) Length
(in.) (0.040 ± 0.004) (0.063 ± 0.006) (0.079 ± 0.008) (0.126 ± 0.008)
mm 0.50 ± 0.10 0.81 ± 0.15 1.25 ± 0.20 1.60 ± 0.20
W) Width
(in.) (0.020 ± 0.004) (0.032 ± 0.006) (0.049 ± 0.008) (0.063 ± 0.008)
mm 0.25 ± 0.15 0.35 ± 0.15 0.50 ± 0.25 0.50 ± 0.25
(t) Terminal
(in.) (0.010 ± 0.006) (0.014 ± 0.006) (0.020 ± 0.010) (0.020 ± 0.010)
WVDC 10 16 25 50 6.3 10 16 25 50 100 200 6.3 10 16 25 50 100 200 6.3 10 16 25 50 100 200 500
100
Cap
150
(pF)
220 C G
330 C G G G J J J J J J K
1500 C G G J J J J J J J J J J J J M
3300 C C G G J J J J J J J J J J J J M
6800 C C G G J J J J J J J J J J J J P
0.010 C G G G J J J J J J J J J J J J P
Cap
0.015 C G G J J J J J J J J J J J M
(μF)
0.022 C C G G J J J J J N J J J J J M
0.033 C G G J J J J N J J J J J M
0.047 G G G J J J J N J J J J J M
0.068 G G G J J J J N J J J J J P
0.10 G G G G J J J J J J J J M P
0.15 G G J J J N N J J J J Q
0.22 G G J J N N N J J J J Q
0.33 N N N N N J J M P Q
0.47 N N N N N M M M P Q
0.68 N N N M M Q Q Q
1.0 N N N M M Q Q
1.5 P Q Q
2.2 P* Q Q Q
3.3
4.7 P* Q Q
10 Q*
22 Q*
47
100
WVDC 10 16 25 50 6.3 10 16 25 50 100 200 6.3 10 16 25 50 100 200 6.3 10 16 25 50 100 200 500
* Contact Factory
Max. 0.33 0.56 0.71 0.90 0.94 1.02 1.27 1.40 1.52 1.78 2.29 2.54 2.79
Thickness (0.013) (0.022) (0.028) (0.035) (0.037) (0.040) (0.050) (0.055) (0.060) (0.070) (0.090) (0.100) (0.110)
PAPER EMBOSSED
021220


Soldering
Wire Bond* Wire Bond* Wire Bond* Wire Bond*
Packaging Paper/EmbosseU All Embossed All Embossed All Embossed
mm 3.20 ± 0.20 4.50 ± 0.30 4.50 ± 0.30 5.72 ± 0.25
(L) Length
(in.) (0.126 ± 0.008) (0.177 ± 0.012) (0.177 ± 0.012) (0.225 ± 0.010)
mm 2.50 ± 0.20 3.20 ± 0.20 6.40 ± 0.40 6.35 ± 0.25
W) Width
(in.) (0.098 ± 0.008) (0.126 ± 0.008) (0.252 ± 0.016) (0.250 ± 0.010)
mm 0.50 ± 0.25 0.61 ± 0.36 0.61 ± 0.36 0.64 ± 0.39
(t) Terminal
(in.) (0.020 ± 0.010) (0.024 ± 0.014) (0.024 ± 0.014) (0.025 ± 0.015)
WVDC 10 16 25 50 100 200 500 50 100 200 500 50 100 50 100
100
Cap
150
(pF)
220
330
470
680
1000
1500 J J J J J J M
2200 J J J J J J M
3300 J J J J J J M
4700 J J J J J J M
6800 J J J J J J M
0.010 J J J J J J M K K K K M M M P
Cap
0.015 J J J J J J P K K K P M M M P
(μF)
0.022 J J J J J J Q K K K P M M M P
0.033 J J J J J J Q K K K X M M M P
0.047 J J J J J J K K K Z M M M P
0.068 J J J J J M K K K Z M M M P
0.10 J J J J J M K K K Z M M M P
0.15 J J J J M Z K K P M M M P
0.22 J J J J P Z K K P M M M P
0.33 J J J J Q K M X M M M P
0.47 M M M M Q K P M M M P
0.68 M M P X X M Q M P M P
1.0 N N X Z M X M P M P
1.5 N N Z Z Z Z Z M M X
2.2 X X Z Z Z Z Z M
3.3 X X Z Z Z
4.7 X X Z Z Z
10 Z Z Z
22
47
100
WVDC 10 16 25 50 100 200 500 50 100 200 500 50 100 50 100
* Contact Factory
Max. 0.33 0.56 0.71 0.90 0.94 1.02 1.27 1.40 1.52 1.78 2.29 2.54 2.79
Thickness (0.013) (0.022) (0.028) (0.035) (0.037) (0.040) (0.050) (0.055) (0.060) (0.070) (0.090) (0.100) (0.110)
PAPER EMBOSSED
050219

SIZE AU02 AU03 AU05 AU06 AU10 AU12

Reflow/Epoxy Reflow/Epoxy Reflow/Epoxy Reflow/Epoxy Reflow/Epoxy Reflow/Epoxy/
Soldering
Wire Bond* Wire Bond* Wire Bond* Wire Bond* Wire Bond* Wire Bond*
Packaging All Paper All Paper Paper/Embossed Paper/Embossed Paper/Embossed All Embossed
mm 1.00 ± 0.10 1.60 ± 0.15 2.01 ± 0.20 3.20 ± 0.20 3.20 ± 0.20 4.50 ± 0.30
(L) Length
(in.) (0.040 ± 0.004) (0.063 ± 0.006) (0.079 ± 0.008) (0.126 ± 0.008) (0.126 ± 0.008) (0.177 ± 0.012)
mm 0.50 ± 0.10 0.81 ± 0.15 1.25 ± 0.20 1.60 ± 0.20 2.50 ± 0.20 3.20 ± 0.20
(W) Width
(in.) (0.020 ± 0.004) (0.032 ± 0.006) (0.049 ± 0.008) (0.063 ± 0.008) (0.098 ± 0.008) (0.126 ± 0.008)
mm 0.25 ± 0.15 0.35 ± 0.15 0.50 ± 0.25 0.50 ± 0.25 0.50 ± 0.25 0.61 ± 0.36
(t) Terminal
(in.) (0.010 ± 0.006) (0.014 ± 0.006) (0.020 ± 0.010) (0.020 ± 0.010) (0.020 ± 0.010) (0.024 ± 0.014)
WVDC 4 6.3 10 16 25 50 4 6.3 10 16 25 35 50 6.3 10 16 25 35 50 6.3 10 16 25 35 50 4 6.3 10 16 25 35 50 6.3 10 25 50
Cap 100
(pF) 150
220
330 C
470 C
680 C
1000 C
1500 C
2200 C
3300 C
4700 C G
6800 C G
Cap 0.010 C G
(μF) 0.015 C G G G
0.022 C C G G G N
0.033 C G G G N
0.047 C C G G G N
0.068 C G G N
0.10 C C C G G N N
0.15 G N N
0.22 C* G G N N
0.33 G G N Q
0.47 C* G N Q Q
0.68 G N X
1.0 G G G J* N N N P* Q Q X X X
1.5 N
2.2 C* G* G* J* J* N N N N Q Q Z X
3.3 J* J* J* J* N N Q Q
4.7 J* J* J* N N* N* Q Q Q Q Q Z
10 K* P* P* P* Q Q Q Q* X Z Z Z
22 P* Q* Q* Q* Z Z Z Z
47 Q* Z*
100 Z* Z*
WVDC 4 6.3 10 16 25 50 4 6.3 10 16 25 35 50 6.3 10 16 25 35 50 6.3 10 16 25 35 50 4 6.3 10 16 25 35 50 6.3 10 25 50
SIZE AU02 AU03 AU05 AU06 AU10 AU12
* Contact Factory
Max. 0.33 0.56 0.71 0.90 0.94 1.02 1.27 1.40 1.52 1.78 2.29 2.54 2.79
Thickness (0.013) (0.022) (0.028) (0.035) (0.037) (0.040) (0.050) (0.055) (0.060) (0.070) (0.090) (0.100) (0.110)
PAPER EMBOSSED
= *Optional Specifications – Contact Factory
110419

AU16/AU17/AU18
AU16 AU17 AU18 PHYSICAL DIMENSIONS AND

SIZE
(0306) (0508) (0612) PAD LAYOUT
Packaging Embossed Embossed Embossed
mm 0.81 ± 0.15 1.27 ± 0.25 1.60 ± 0.25
Length
(in.) (0.032 ± 0.006) (0.050 ± 0.010) (0.063 ± 0.010)
mm 1.60 ± 0.15 2.00 ± 0.25 3.20 ± 0.25
Width (in.) (0.063 ± 0.006) (0.080 ± 0.010) (0.126 ± 0.010) W t
Cap
WVDC 4 6.3 10 1 6 25 6.3 10 16 25 50 6.3 10 16 25 50
Code
102 Cap 0.001 A A A A S S S S V S S S S V
222 (μF) .0022 A A A A S S S S V S S S S V T
332 0.0033 A A A A S S S S V S S S S V
472 0.0047 A A A A S S S S V S S S S V
682 0.0068 A A A A S S S S V S S S S V L
103 0.01 A A A A S S S S V S S S S V
153 0.015 A A A A S S S S V S S S S W
223 0.022 A A A A S S S S V S S S S W
333 0.033 A A A S S S V V S S S S W PHYSICAL DIMENSIONS MM (IN.)
473 0.047 A A A S S S V A S S S S W
L W t
683 0.068 A A A S S S A A S S S V W
AU16 0.81 ± 0.15 1.60 ± 0.15 0.13 min.
104 0.1 A A A S S V A A S S S V W
(0306) (0.032 ± 0.006) (0.063 ± 0.006) (0.005 min.)
154 0.15 A A S S V S S S W W
AU17 1.27 ± 0.25 2.00 ± 0.25 0.13 min.
224 0.22 A A S S A S S V W (0508) (0.050 ± 0.010) (0.080 ± 0.010) (0.005 min.)
334 0.33 V V A S S V AU18 1.60 ± 0.25 3.20 ± 0.25 0.13 min.
474 0.47 V V A S S V (0612) (0.063 ± 0.010) (0.126 ± 0.010) (0.005 min.)
684 0.68 A A V V W
T - See Range Chart for Thickness and Codes
105 1 A A A V V A
155 1.5 A W W
225 2.2 A A
PAD LAYOUT DIMENSIONS MM (IN.)
335 3.3 A
475 4.7 A B C
685 6.8 AU16
0.31 (0.012) 1.52 (0.060) 0.51 (0.020)
106 10 (0306)
AU17
Solid = X7R = X5R = X7S (0508)
0.51 (0.020) 2.03 (0.080) 0.51 (0.020)
AU18
mm (in.) mm (in.) mm (in.) 0.76 (0.030) 3.05 (0.120) 0.635 (0.025)
(0612)
AU16 AU16 AU16
(0306) (0508) (0612)
Code Thickness Code Thickness Code Thickness
A 0.56 (0.022) S 0.56 (0.022) S 0.56 (0.022)
V 0.76 (0.030) V 0.76 (0.030)
A 1.02 (0.040) W 1.02 (0.040)
A 1.27 (0.050)
“B”
C “A” C
041019

MLCC Tin/Lead Termination "B" (LD Series)
C0G (NP0) – General Specifications
KYOCERA AVX will support those customers for commercial and military Multilayer Ceramic Capacitors with a
termination consisting of 5% minimum lead. This termination is indicated by the use of a “B” in the 12th position
of the KYOCERA AVX Catalog Part Number. This fulfills KYOCERA AVX’s commitment to providing a full range of
products to our customers. KYOCERA AVX has provided in the following pages a full range of values that we are
currently offering in this special “B” termination. Please contact the factory if you require additional information
on our MLCC Tin/Lead Termination “B” products.
LD05 5 A 101 J A B 2 A

LD02 - 0402 6.3V = 6 C0G (NP0) = A Code (In pF) Tolerance Rate B = 5% min lead 2 = 7" Reel Code
LD03 - 0603 10V = Z X7R = C 2 Sig. Digits + B = ±.10 pF (<10pF) A = Not X = FLEXITERM® 4 = 13" Reel A = Std.
LD04 - 0504* 16V = Y X5R = D Number of C = ±.25 pF (<10pF) Applicable with 5% min Product
LD05 - 0805 25V = 3 X8R = F Zeros 4 = Automotive lead** Contact Factory
D = ±.50 pF (<10pF)
LD06 - 1206
35V = D For
LD10 - 1210 F = ±1% (≥ 10 pF) Multiples*
LD12 - 1812 50V = 5 G = ±2% (≥ 10 pF) **X7R only
LD13 - 1825 100V = 1 J = ±5%
LD14 - 2225 200V = 2 K = ±10%
LD20 - 2220 500V = 7 M = ±20%
*LD04 has the same CV ranges as LD03. See FLEXITERM® section for CV options
Insulation Resistance vs Temperature

10,000
1,000
100
0
0 20 40 60 80 100
Temperature °C
042320

MLCC Tin/Lead Termination “B”
C0G (NP0) – Specifications and Test Methods

Q
≥30 pF: Q≥ 1000 Voltage: 1.0Vrms ± .2V
for 500V devices.
Resistance to ±5% or ±.5 pF, whichever is greater
Variation
Flexure
Stresses Q Meets Initial Values (As Above)
Insulation
Resistance
Solderability
Capacitance
Variation
Dip device in eutectic solder at 260ºC for 60
Resistance to Q Meets Initial Values (As Above) seconds. Store at room temperature for 24 ± 2
Solder Heat
Resistance
Dielectric
Strength
Capacitance
Variation
Q Meets Initial Values (As Above) Step 3: +125ºC ± 2º 30 ± 3 minutes

Thermal Shock
Insulation
Resistance
Capacitance
Variation Charge device with twice rated voltage in test
≥ 30 pF: Q≥ 350
for 1000 hours (+48, -0).
Q ≥10 pF, <30 pF: Q≥ 275 +5C/2
Load Life <10 pF: Q≥ 200 +10C
Remove from test chamber and stabilize at room
Insulation temperature for 24 hours
Resistance before measuring.
Dielectric
Strength
Capacitance
Variation
Store in a test chamber set at 85ºC ± 2ºC/ 85% ±
≥ 30 pF: Q≥ 350 5% relative humidity for 1000 hours
≥ Initial Value x 0.3 (See Above) temperature for 24 ± 2 hours before measuring.
Resistance
Dielectric
Strength
112916

C0G (NP0) – Capacitance Range
SIZE LD02 LD03 LD05 LD06

Soldering Reflow/Wave Reflow/Wave Reflow/Wave Reflow/Wave
mm 1.00 ± 0.10 1.60 ± 0.15 2.01 ± 0.20 3.20 ± 0.20
(L) Length
(in.) (0.040 ± 0.004) (0.063 ± 0.006) (0.079 ± 0.008) (0.126 ± 0.008)
mm 0.50 ± 0.10 0.81 ± 0.15 1.25 ± 0.20 1.60 ± 0.20
W) Width
(in.) (0.020 ± 0.004) (0.032 ± 0.006) (0.049 ± 0.008) (0.063 ± 0.008)
mm 0.25 ± 0.15 0.35 ± 0.15 0.50 ± 0.25 0.50 ± 0.25
(t) Terminal
(in.) (0.010 ± 0.006) (0.014 ± 0.006) (0.020 ± 0.010) (0.020 ± 0.010)
WVDC 16 25 50 16 25 50 100 16 25 50 100 200 16 25 50 100 200 500
Cap 0.5 C C C G G G G J J J J J J J J J J J
(pF) 1.0 C C C G G G G J J J J J J J J J J J
220 C C C G G G G J J J J J J J J J J M
560 G G G J J J J M J J J J J M
680 G G G J J J J J J J J J P
820 G G G J J J J J J J J M
1000 G G G J J J J J J J J Q
1200 G J J J J J J J Q
1500 J J J J J J M Q
1800 J J J J J M M
2200 J J N J J M P
2700 J J N J J M P
3300 J J J J M P
3900 J J J J M P
4700 J J J J M P
5600 J J M
6800 M M
8200 M M
Cap 0.010 M M
(pF) 0.012
0.015
0.018
0.022
0.027
0.033
0.039
0.047
0.068
0.082
0.1
WVDC 16 25 50 16 25 50 100 16 25 50 100 200 16 25 50 100 200 500
Max. 0.33 0.56 0.71 0.90 0.94 1.02 1.27 1.40 1.52 1.78 2.29 2.54 2.79
Thickness (0.013) (0.022) (0.028) (0.035) (0.037) (0.040) (0.050) (0.055) (0.060) (0.070) (0.090) (0.100) (0.110)
PAPER EMBOSSED
112916

C0G (NP0) – Capacitance Range

Soldering Reflow Only Reflow Only Reflow Only Reflow Only
Packaging Paper/Embossed All Embossed All Embossed All Embossed
mm 3.20 + 0.20 4.50 ± 0.30 4.50 ± 0.30 5.72 ± 0.25
(L) Length
(in.) (0.126 ± 0.008) (0.177 ± 0.012) (0.177 ± 0.012) (0.225 ± 0.010)
mm 2.50 ± 0.20 3.20 ± 0.20 6.40 ± 0.40 6.35 ± 0.25
W) Width
(in.) (0.098 ± 0.008) (0.126 ± 0.008) (0.252 ± 0.016) (0.250 ± 0.010)
mm 0.50 ± 0.25 0.61 ± 0.36 0.61 ± 0.36 0.64 ± 0.39
(t) Terminal
(in.) (0.020 ± 0.010) (0.024 ± 0.014) (0.024 ± 0.014) (0.025 ± 0.015)
WVDC 25 50 100 200 500 25 50 100 200 500 50 100 200 50 100 200
Cap 0.5
(pF) 1.0
1.2
1.5
1.8
2.2
2.7
3.3
3.9
4.7
5.6
6.8
8.2
10 J
12 J
15 J
18 J
22 J
27 J
33 J
39 J
47 J
56 J
68 J
82 J
100 J
120 J
150 J
180 J
220 J
270 J
330 J
390 M
470 M
560 J J J J M
680 J J J J M
820 J J J J M
1000 J J J J M K K K K M M M M M M P
1800 J J J M K K K K M M M M M M P
2200 J J J Q K K K K P M M M M M P
2700 J J J Q K K K P Q M M M M M P
3300 J J J P P P P Q M M M M M P
3900 J J M P P P P Q M M M M M P
4700 J J M P P P P Y M M M M M P
5600 J J P P P P Y M M M M M P
6800 J J P P Q Q Y M M M M M P
8200 J J P P Q Q Y M M M M P
Cap 0.010 J J P P Q Q Y M M M M P
(pF) 0.012 J J P P Q X Y M M M M P
0.015 P P Q X Y M M M M Y
0.018 P P X X Y P M M M Y
0.022 P P X X P M Y Y
0.027 Q X X Z P P Y Y
0.033 Q X X Z P P
0.039 X X Z Z P P
0.047 X X Z Z P P
0.068 Z Z Z P
0.082 Z Z Z Q
0.1 Z Z Z Q
WVDC 25 50 100 200 500 25 50 100 200 500 50 100 200 50 100 200
Max. 0.33 0.56 0.71 0.90 0.94 1.02 1.27 1.40 1.52 1.78 2.29 2.54 2.79
Thickness (0.013) (0.022) (0.028) (0.035) (0.037) (0.040) (0.050) (0.055) (0.060) (0.070) (0.090) (0.100) (0.110)
PAPER EMBOSSED
010721

X8R – General Specifications
KYOCERA AVX will support those customers for commercial and military Multilayer Ceramic Capacitors
with a termination consisting of 5% minimum lead. This termination is indicated by the use of a “B” in the
12th position of the KYOCERA AVX Catalog Part Number. This fulfills KYOCERA AVX’s commitment to
providing a full range of products to our customers. KYOCERA AVX has provided in the following pages a
full range of values that we are currently offering in this special “B” termination. Please contact the factory
if you require additional information on our MLCC Tin/Lead Termination “B” products.
LD05 5 F 101 J A B 2 A

LD02 - 0402 6.3V = 6 X8R = F Code (In pF) Tolerance Rate B = 5% min lead 2 = 7" Reel Code
LD03 - 0603 10V = Z 2 Sig. Digits + B = ±.10 pF (<10pF) A = Not X = FLEXITERM® 4 = 13" Reel A = Std.
LD04 - 0504* 16V = Y Number of C = ±.25 pF (<10pF) Applicable with 5% min Product
LD05 - 0805 25V = 3 Zeros lead** Contact Factory
D = ±.50 pF (<10pF)
LD06 - 1206
35V = D For
LD10 - 1210 F = ±1% (≥ 10 pF) Multiples*
LD12 - 1812 50V = 5 G = ±2% (≥ 10 pF) **X7R only
LD13 - 1825 100V = 1 J = ±5%
LD14 - 2225 200V = 2 K = ±10%
LD20 - 2220 500V = 7 M = ±20%
LD04 has the same CV ranges as LD03. See FLEXITERM® section for CV options
112916

X8R – Specifications and Test Methods

Freq.: 1.0 kHz ± 10%
≤ 2.5% for ≥ 50V DC rating Voltage: 1.0Vrms ± .2V
Dissipation Factor
≤ 3.5% for 25V DC and 16V DC rating
for 500V devices.
Deflection: 2mm
≤ ±12%
Flexure Dissipation
Factor
Insulation
Resistance
Solderability
Capacitance
≤ ±7.5%
Variation
Solder Heat
Insulation
Resistance
Dielectric
Strength
Capacitance
Variation
Dissipation
Factor
Insulation
Resistance
Capacitance
Variation
Dissipation
Load Life Factor
Dielectric
Strength
Capacitance
Variation
Factor
Humidity
Resistance
Dielectric
Strength
112916

X8R – Capacitance Range
SIZE LD03 LD05 LD06
WVDC 25V 50V 25V 50V 25V 50V
271 Cap 270 G G
331 (pF) 330 G G J J
471 470 G G J J
681 680 G G J J
102 1000 G G J J J J
152 1500 G G J J J J
182 1800 G G J J J J
222 2200 G G J J J J
272 2700 G G J J J J
332 3300 G G J J J J
392 3900 G G J J J J
472 4700 G G J J J J
562 5600 G G J J J J
682 6800 G G J J J J
822 Cap 8200 G G J J J J
103 (μF) 0.01 G G J J J J
123 0.012 G G J J J J
153 0.015 G G J J J J
183 0.018 G G J J J J
223 0.022 G G J J J J
273 0.027 G G J J J J
333 0.033 G G J J J J
393 0.039 G G J J J J
473 0.047 G G J J J J
563 0.056 G N N M M
683 0.068 G N N M M
823 0.082 N N M M
104 0.1 N N M M
124 0.12 N N M M
154 0.15 N N M M
184 0.18 N M M
224 0.22 N M M
274 0.27 M M
334 0.33 M M
394 0.39 M
474 0.47 M
684 0.68
824 0.82
105 1
WVDC 25V 50V 25V 50V 25V 50V
SIZE LD03 LD05 LD06
Max. 0.33 0.56 0.71 0.90 0.94 1.02 1.27 1.40 1.52 1.78 2.29 2.54 2.79
Thickness (0.013) (0.022) (0.028) (0.035) (0.037) (0.040) (0.050) (0.055) (0.060) (0.070) (0.090) (0.100) (0.110)
PAPER EMBOSSED
112916

LD05 5 C 101 J A B 2 A

LD03 - 0603 6.3V = 6 X7R = C Code (In pF) Tolerance Rate B = 5% min lead 2 = 7" Reel Code
LD04 - 0504* 10V = Z 2 Sig. Digits + B = ±.10 pF (<10pF) A = Not X = FLEXITERM® 4 = 13" Reel A = Std.
LD05 - 0805 16V = Y Number of C = ±.25 pF (<10pF) Applicable with 5% min Product
D = ±.50 pF (<10pF)
LD10 - 1210 35V = D For
F = ±1% (≥ 10 pF) Multiples*
LD12 - 1812 50V = 5 G = ±2% (≥ 10 pF) **X7R only
LD13 - 1825 100V = 1 J = ±5%
LD14 - 2225 200V = 2 K = ±10%
LD20 - 2220 500V = 7 M = ±20%
112916


≤ 10% for ≥ 50V DC rating Freq.: 1.0 kHz ± 10%
Dissipation Factor
≤ 12.5% for 25V and 16V DC rating
for 500V devices.
Deflection: 2mm
≤ ±12%
Flexure Dissipation
Factor
Insulation
Resistance
Solderability
Capacitance
≤ ±7.5%
Variation
Solder Heat
Insulation
Resistance
Dielectric
Strength
Capacitance
Variation
Dissipation
Factor
Insulation
Resistance
Capacitance
Variation
Dissipation
Load Life Factor
Dielectric
Strength
Capacitance
Variation
Factor
Humidity
Resistance
Dielectric
Strength
112916


Soldering Reflow/Wave Reflow/Wave Reflow/Wave Reflow/Wave
mm 1.00 ± 0.10 1.60 ± 0.15 2.01 ± 0.20 3.20 ± 0.20
(L) Length
(in.) (0.040 ± 0.004) (0.063 ± 0.006) (0.079 ± 0.008) (0.126 ± 0.008)
mm 0.50 ± 0.10 0.81 ± 0.15 1.25 ± 0.20 1.60 ± 0.20
W) Width
(in.) (0.020 ± 0.004) (0.032 ± 0.006) (0.049 ± 0.008) (0.063 ± 0.008)
mm 0.25 ± 0.15 0.35 ± 0.15 0.50 ± 0.25 0.50 ± 0.25
(t) Terminal
(in.) (0.010 ± 0.006) (0.014 ± 0.006) (0.020 ± 0.010) (0.020 ± 0.010)
WVDC 16 25 50 6.3 10 16 25 50 100 200 6.3 10 16 25 50 100 200 6.3 10 16 25 50 100 200 500
Cap 100
(pF) 150
220 C
6800 C C G G J J J J J J J J J J J J P
Cap 0.010 C C G G J J J J J J J J J J J J P
(μF) 0.015 C G G J J J J J J J J J J J M
0.022 C G G J J J J J N J J J J J M
0.033 C G G J J J J N J J J J J M
0.047 G G G J J J J N J J J J J M
0.068 G G G J J J J N J J J J J P
0.10 C* G G G G J J J J N J J J J P P
0.15 G G J J J N N J J J J Q
0.22 G G J J N N N J J J J Q
0.33 N N N N N J J M P Q
0.47 J* N N N N N M M M P Q
0.68 N N N M M Q Q Q
1.0 J* J* N N N* M M Q Q Q
1.5 P Q Q
2.2 J* P* Q Q Q
3.3
4.7 P* P* Q* Q* Q*
10 P* P Q* Q* Q
22 Q*
47
100
WVDC 16 25 50 6.3 10 16 25 50 100 200 6.3 10 16 25 50 100 200 6.3 10 16 25 50 100 200 500
Max. 0.33 0.56 0.71 0.90 0.94 1.02 1.27 1.40 1.52 1.78 2.29 2.54 2.79
Thickness (0.013) (0.022) (0.028) (0.035) (0.037) (0.040) (0.050) (0.055) (0.060) (0.070) (0.090) (0.100) (0.110)
PAPER EMBOSSED
= Under Development
112916

SIZE LD10 LD12 LD13 LD20 LD14

mm 3.20 + 0.20 4.50 ± 0.30 4.50 ± 0.30 5.70 ± 0.50 5.72 ± 0.25
(L) Length
(in.) (0.126 ± 0.008) (0.177 ± 0.012) (0.177 ± 0.012) (0.224 ± 0.020) (0.225 ± 0.010)
mm 2.50 ± 0.20 3.20 ± 0.20 6.40 ± 0.40 5.00 ± 0.40 6.35 ± 0.25
W) Width
(in.) (0.098 ± 0.008) (0.126 ± 0.008) (0.252 ± 0.016) (0.197 ± 0.016) (0.250 ± 0.010)
mm 0.50 ± 0.25 0.61 ± 0.36 0.61 ± 0.36 0.64 ± 0.39 0.64 ± 0.39
(t) Terminal
(in.) (0.020 ± 0.010) (0.024 ± 0.014) (0.024 ± 0.014) (0.025 ± 0.015) (0.025 ± 0.015)
WVDC 10 16 25 50 100 200 500 50 100 200 500 50 100 25 50 100 200 50 100
Cap 100
(pF) 150
220
330
470
680
1000
1500 J J J J J J M
2200 J J J J J J M
3300 J J J J J J M
4700 J J J J J J M
6800 J J J J J J M
Cap 0.010 J J J J J J M K K K K M M X X X M P
(μF) 0.015 J J J J J J P K K K P M M X X X M P
0.022 J J J J J J Q K K K P M M X X X M P
0.033 J J J J J J Q K K K X M M X X X M P
0.047 J J J J J J K K K Z M M X X X M P
0.068 J J J J J M K K K Z M M X X X M P
0.10 J J J J J M K K K Z M M X X X M P
0.15 J J J J M Z K K P M M X X X M P
0.22 J J J J P Z K K P M M X X X M P
0.33 J J J J Q K M X M M X X X M P
0.47 M M M M Q K P M M X X X M P
0.68 M M P X X M Q M P X X M P
1.0 N N P X Z M X M P X X M P
1.5 N N Z Z Z Z Z M X X M X
2.2 X X Z Z Z Z Z X X M
3.3 X X Z Z Z X Z
4.7 X X Z Z Z Z X Z
10 Z Z Z Z Z Z
22 Z Z Z
47 Z
100
WVDC 10 16 25 50 100 200 500 50 100 200 500 50 100 25 50 100 200 50 100
SIZE LD10 LD12 LD13 LD20 LD14
Max. 0.33 0.56 0.71 0.90 0.94 1.02 1.27 1.40 1.52 1.78 2.29 2.54 2.79
Thickness (0.013) (0.022) (0.028) (0.035) (0.037) (0.040) (0.050) (0.055) (0.060) (0.070) (0.090) (0.100) (0.110)
PAPER EMBOSSED
081021

LD05 5 D 101 J A B 2 A

LD02 - 0402 6.3V = 6 X5R = D Code (In pF) Tolerance Rate B = 5% min lead 2 = 7" Reel Code
LD03 - 0603 10V = Z 2 Sig. Digits + B = ±.10 pF (<10pF) A = Not X = FLEXITERM® 4 = 13" Reel A = Std.
LD04 - 0504* 16V = Y Number of C = ±.25 pF (<10pF) Applicable with 5% min Product
D = ±.50 pF (<10pF)
LD06 - 1206
35V = D For
LD10 - 1210 F = ±1% (≥ 10 pF) Multiples*
LD12 - 1812 50V = 5 G = ±2% (≥ 10 pF) **X7R only
LD13 - 1825 100V = 1 J = ±5%
LD14 - 2225 200V = 2 K = ±10%
LD20 - 2220 500V = 7 M = ±20%
Temperature Coefficient Insulation Resistance vs Temperature

20 10,000
15
10
Capacitance
1,000
5
-5
100
-10
%
-15
-20
-60 -40 -20 0 +20 +40 +60 +80 0
0 20 40 60 80 100 120
Temperature °C Temperature °C
112916


≤ 3.0% for 25V, 35V DC rating Voltage: 1.0Vrms ± .2V
Dissipation Factor For Cap > 10 μF, 0.5Vrms @ 120Hz
≤ 12.5% Max. for 16V DC rating and lower Contact
Factory for DF by PN
Deflection: 2mm
≤ ±12%
Flexure Dissipation
Factor
Insulation
Resistance
Solderability
Capacitance
≤ ±7.5%
Variation
Solder Heat
Insulation
Resistance
Dielectric
Strength
Capacitance
Variation
Dissipation
Factor
Insulation
Resistance
Capacitance Charge device with 1.5X rated voltage in test
≤ ±12.5% chamber set at 85ºC ± 2ºC for 1000 hours
Variation
(+48, -0). Note: Contact factory for *optional
Dissipation
≤ Initial Value x 2.0 (See Above) specification part numbers that are tested at
Load Life Factor < 1.5X rated voltage.
Insulation
Resistance Remove from test chamber and stabilize at room
Dielectric temperature for 24 ± 2 hours before measuring.
Strength
Capacitance
Variation
Factor
Humidity
Resistance
Dielectric
Strength
112916

SIZE LD02 LD03 LD05 LD06 LD10 LD12

Soldering Reflow/Wave Reflow/Wave Reflow/Wave Reflow/Wave Reflow/Wave
Packaging All Paper All Paper Paper/Embossed Paper/Embossed Paper/Embossed
mm 1.00 ± 0.10 1.60 ± 0.15 2.01 ± 0.20 3.20 ± 0.20 3.20 ± 0.20
(L) Length
(in.) (0.040 ± 0.004) (0.063 ± 0.006) (0.079 ± 0.008) (0.126 ± 0.008) (0.126 ± 0.008)
mm 0.50 ± 0.10 0.81 ± 0.15 1.25 ± 0.20 1.60 ± 0.20 2.50 ± 0.20
W) Width
(in.) (0.020 ± 0.004) (0.032 ± 0.006) (0.049 ± 0.008) (0.063 ± 0.008) (0.098 ± 0.008)
mm 0.25 ± 0.15 0.35 ± 0.15 0.50 ± 0.25 0.50 ± 0.25 0.50 ± 0.25
(t) Terminal
(in.) (0.010 ± 0.006) (0.014 ± 0.006) (0.020 ± 0.010) (0.020 ± 0.010) (0.020 ± 0.010)
WVDC 4 6.3 10 16 25 50 4 6.3 10 16 25 35 50 6.3 10 16 25 35 50 6.3 10 16 25 35 50 4 6.3 10 16 25 35 50 6.3 10 25 50
Cap 100
(pF) 150
220 C
330 C
470 C
680 C
1000 C
1500 C
2200 C
3300 C
4700 C G
6800 C G
Cap 0.010 C G
(μF) 0.015 C G G G
0.022 C C G G G N
0.033 C G G G N
0.047 C C G G G N
0.068 C G G N
0.10 C C C G G N N
0.15 G N N
0.22 C* G G N N Q
0.33 G G N
0.47 C* C* G N Q Q X
0.68 G N
1.0 C* C* C* G G G J* N N P* Q Q X X X
1.5
2.2 C* G* G* J* J* N N N Q Q Z X
3.3 J* J* J* J* N N X X
4.7 J* J* J* N N N* N* X X X X Q Z
10 K* P P P X X X X X Z Z Z
22 P* X Z X X X Z Z Z
47 X Z*
100 Z* Z
WVDC 4 6.3 10 16 25 50 4 6.3 10 16 25 35 50 6.3 10 16 25 35 50 6.3 10 16 25 35 50 4 6.3 10 16 25 35 50 6.3 10 25 50
SIZE LD02 LD03 LD05 LD06 LD10 LD12
Max. 0.33 0.56 0.71 0.90 0.94 1.02 1.27 1.40 1.52 1.78 2.29 2.54 2.79
Thickness (0.013) (0.022) (0.028) (0.035) (0.037) (0.040) (0.050) (0.055) (0.060) (0.070) (0.090) (0.100) (0.110)
PAPER EMBOSSED
*Optional Specifications – Contact factory
112916

Automotive MLCC
GENERAL DESCRIPTION
KYOCERA AVX has supported the Automotive Industry requirements for Multilayer Ceramic Capacitors consistently
for more than 25 years. Products have been developed and tested specifically for automotive applications and all
manufacturing facilities are QS9000 and VDA 6.4 approved.
KYOCERA AVX is using AECQ200 as the qualification vehicle for this transition. A detailed qualification package is
available on request and contains results on a range of part numbers.
HOW TO ORDER
0805 5 A 104 K 4 T 2 A
0402 6.3V = 6 NP0 = A Code (In pF) Tolerance Rate T = Plated Ni and Sn 2 = 7" Reel A = Std.Product
0603 10V = Z X7R = C 2 Sig. Digits + B = ± 0.1pF (<10pF)* Z = FLEXITERM®** 4 = 13" Reel
0805 4=Automotive
16V = Y X8R = F Number of Zeros C = ± 0.25pF (<10pF)* U = Conductive Epo
1206 25V = 3 e.g. 10 F = 106
1210 D = ± 0.5pF (<10pF)*
35V = D F = ± 1%* **X7R X8R only
1812
50V = 5 G = ± 2%*
100V = 1 J = ± 5% (<=1µF) Contact factory for availability of Tolerance Options for Specific Part Numbers.
200V = 2 K = ± 10%
500V = 7 M = ± 20% NOTE: Contact factory for non-specified capacitance values
0402 case size available in T termination only.
*NPO only
COMMERCIAL VS AUTOMOTIVE MLCC PROCESS COMPARISON

Commercial Automotive
Standard Part Numbers. Specific Automotive Part Number. sed to control supply of
Administrative
No restriction on who purchases these parts. product to Automotive customers.
Lot Qualification (Destructive

As per EIA RS469 Increased sample plan stricter criteria.
Physical Analysis - DPA)
Visual/Cosmetic Quality Standard process and inspection 100% inspection

Standard sampling for accelerated wave solder on Increased sampling for accelerated wave solder on X7R and
Application Robustness
X7R dielectrics NP0 followed by lot by lot reliability testing.
All Tests have Accept/Reject Criteria 0/1

Automotive MLCC
NP0/X7R Dielectric
FLEXITERM FEATURES
a) Bend Test
The capacitor is soldered to the PC Board as shown:
Typical bend test results are shown below:
Style Conventional Soft Term

0603 >2mm >5
0805 >2mm >5
1206 >2mm >5
a) Temperature Cycle testing

FLEXITERM® has the ability to withstand at least 1000 cycles
between -55°C and +125°C

Automotive MLCC-NP0
Capacitance Range
Case Size 0402 0603 0805 1206 1210
mm 1.00 ± 0.10 1.60 ± 0.15 2.01 ± 0.20 3.20 ± 0.20 3.20 ± 0.20
Length (L)
(in.) (0.040 ± 0.004) (0.063 ± 0.006) 0.079 ± 0.008 (0.126 ± 0.008) (0.126 ± 0.008)
mm 0.50 ± 0.10 0.81 ± 0.15 1.25 ± 0.20 1.60 ± 0.20 2.50 ± 0.20
Width (W)
(in.) (0.020 ± 0.004) (0.032 ± 0.006) (0.049 ± 0.008) (0.063 ± 0.008) (0.098 ± 0.008)
Terminal mm 0.25 ± 0.15 0.35 ± 0.15 0.50 ± 0.25 0.50 ± 0.25 0.50 ± 0.25
(t) (in.) (0.010 ± 0.006) (0.014 ± 0.006) (0.020 ± 0.010) (0.020 ± 0.010) (0.020 ± 0.010)
CAP
CAP 25 50 100 25 50 100 200 250 25 50 100 200 250 500 630 25 50 100 200 250 500 630 1000 50 100 200 250 500 630 1000
Code
0.5 0R5 C C C G G G G G J J J J J J J J J J J J J Q Q J J J J J J J
1 1R0 C C C G G G G G J J J J J J J J J J J J J Q Q J J J J J J J
5 5R0 C C C G G G G G J J J J J J J J J J J J J Q Q J J J J J J J
10 100 C C C G G G G G J J J J J J J J J J J J J Q Q J J J J J J J
12 120 C C C G G G G G J J J J J J J J J J J Q Q J J J J J J J
47 470 C C G G G G G J J J J J J J J J J J Q Q J J J J J J J
56 560 C C G G G G J J J J N J J J J J J Q Q J J J J J J J
68 680 C C G G G G J J J J N J J J J J J Q Q J J J J J J J
82 820 C C G G G G J J J J N J J J J J J Q Q N N N N N N N
100 101 C C G G G G J J J J N J J J J J J Q Q N N N N N N N
120 121 G G G J J J J N J J J J J J Q Q N N N P P P X
270 271 G G G J J J J N J J J J J J Q N N N P P P X
330 331 G G G J J J J N J J J J J J Q N N N P P P X
390 391 G G G J J J J J J J J J J Q N N N P P P X
430 431 G G J J J J J J J J J J Q N N N P P P X
470 471 G G J J J J J J J J J J Q N N N P P P X
560 561 G G J J J J J J J M Q Q N N N P P P
680 681 G G J J J J J J J M Q Q N N N P P P
1,000 102 G G J J J J J J J M Q Q N N N P P X
1,200 122 G G J J N N N N N N N P P
1,500 152 G G J J N N N N N N N P P
2,200 222 G J J M M M M M M M N N N P K K
2,700 272 G M M M M M M M K K
3,300 332 G M M M M M M M K K
3,900 392 G M M M M M M M M M
4,700 472 G P P P P P P P M M
5,600 562 G M M
6,800 682 G N N
8,200 822 G P P
10,000 103 G X X X
12,000 123 X
15,000 153 X
18,000 183 X
22,000 223 X
27,000 273 X
33,000 333 X
39,000 393
47,000 473
56,000 563
68,000 683
82,000 823
100,000 104
CAP
CAP 25 50 100 25 50 100 200 250 25 50 100 200 250 500 630 25 50 100 200 250 500 630 1000 50 100 200 250 500 630 1000
Code
Case Size 0402 0603 0805 1206 1210
Max. 0.33 0.56 0.71 0.90 0.94 1.02 1.27 1.40 1.52 1.78 2.29 2.54 2.79
Thickness (0.013) (0.022) (0.028) (0.035) (0.037) (0.040) (0.050) (0.055) (0.060) (0.070) (0.090) (0.100) (0.110)
PAPER EMBOSSED

Automotive MLCC - X7R
Capacitance Range
Size 0402 0603 0805 1206 1210 1812 2220
Soldering Reflow/Wave Reflow/Wave Reflow/Wave Reflow/Wave Reflow Only Reflow Only Reflow Only
4.5 ± 0.3
(L) mm 1 ± 0.1 1.6 ± 0.15 2.01 ± 0.2 3.2 ± 0.2 3.2 ± 0.2 5.7 ± 0.5
(0.177 ±
Length (in.) (0.04 ± 0.004) (0.063 ± 0.006) (0.079 ± 0.008) (0.126 ± 0.008) (0.126 ± 0.008) (0.224 ± 0.02)
0.012)
3.2 ± 0.2
(W) mm 0.5 ± 0.1 0.81 ± 0.15 1.25 ± 0.2 1.6 ± 0.2 2.5 ± 0.2 5 ± 0.4
(0.126 ±
Width (in.) (0.02 ± 0.004) (0.032 ± 0.006) (0.049 ± 0.008) (0.063 ± 0.008) (0.098 ± 0.008) (0.197 ± 0.016)
0.008)
0.61 ± 0.36
(t) mm 0.25 ± 0.15 0.35 ± 0.15 0.5 ± 0.25 0.5 ± 0.25 0.5 ± 0.25 0.64 ± 0.39
(0.024 ±
Terminal (in.) (0.01 ± 0.006) (0.014 ± 0.006) (0.02 ± 0.01) (0.02 ± 0.01) (0.02 ± 0.01) (0.025 ± 0.015)
0.014)
WVDC 6.3V 16V 25V 50V 10V 16V 25V 50V 100V 200V 250V 6.3V 10V 16V 25V 50V 100V 200V 250V 16V 25V 50V 100V 200V 250V 500V 16V 25V 50V 100V 200V 250V 50V 100V 25V 50V 100V 200V 250V 500V
101 100 M Q
221 220 C C C G G G G G G M Q
271 270 C C C G G G G G G M Q
331 330 C C C G G G G G G M Q
391 390 C C C G G G G G G M Q
471 470 C C C G G G G G G M Q
561 560 C C C G G G G G G M Q
681 680 C C C G G G G G G M Q
821 820 C C C G G G G G G M Q
102 1000 C C C G G G G G G G J J J J J J J J J J J J J K K K K M Q K K
103 Cap 0.01 C C C G G G G G G G J J J J J J J J J J J J J K K K K M Q K K
123 (uF) 0.012 C G G G G G J J J N N N J J J J J J K K K K M Q K K
153 0.015 C G G G G G J J J N N N J J J J J J K K K K M Q K K
183 0.018 C G G G G G J J J N N N J J J J J J K K K K M Q K K
223 0.022 C G G G G G J J J N N N J J J J Q Q K K K K M Q K K
273 0.027 C G G G G J J J J N N N J J J J Q Q K K K K M Q K K
333 0.033 C G G G G J J J J N N N J J J J Q Q K K K K M Q K K
393 0.039 G G G G J J J J N N N J J J J Q Q K K K K M Q K K
473 0.047 G G G G J J J J N N N J J J M Q Q K K K K M Q K K
563 0.056 G G G G J J J J N J J J M Q Q K K K M M Q K K
683 0.068 G G G G J J J J N J J J M Q Q K K K M M Q K K
823 0.082 G G G G J J J J N J J J M Q Q K K K M Q Q K K
104 0.1 G G G G J J J J N J J J M Q Q K K K M Q Q K K X
124 0.12 G J J J J N N J J M M Q Q K K K P Q Q K K
154 0.15 G J J M N N N J J M M Q Q K K K P Q Q K K
224 0.22 G J J M N N N J M M Q Q Q M M M P Q Q M M
334 0.33 N N N N J M P Q P P P Q Z Z X X
474 0.47 N N N N M M P Q P P P Q X X
684 0.68 N N N N M Q Q Q P P Q X X X
105 1 C N N N N M Q Q Q P Q Q Z X X Z Z X X
155 1.5 N N N Q Q Q Q P Q Z Z X X Z Z Z Z
225 2.2 N N N Q Q Q Q Z Z Z Z Z Z Z Z
335 3.3 Q Q Q X Z Z Z Z Z Z
475 4.7 Q Q Q X Z Z Z Z Z Z
106 10 P P Z Z Z Z Z Z Z
226 22 Z
Max. 0.33 0.56 0.71 0.90 0.94 1.02 1.27 1.40 1.52 1.78 2.29 2.54 2.79
Thickness (0.013) (0.022) (0.028) (0.035) (0.037) (0.04) (0.05) (0.055) (0.060) (0.07) (0.09) (0.1) (0.11)
PAPER EMBOSSED

Automotive MLCC - X8R
Capacitance Range
SIZE 0603 0805 1206

Soldering Reflow/Wave Reflow/Wave Reflow/Wave
WVDC WVDC 25V 50V 100V 25V 50V 100V 25V 50V
472 pF 4700 G G G J J J J J
562 5600 G G G J J J J J
682 6800 G G G J J J J J
822 8200 G G G J J J J J
103 uF 0.01 G G G J J J J J
123 0.012 G G J J N J J
153 0.015 G G J J N J J
183 0.018 G G J J N J J
223 0.022 G G J J N J J
273 0.027 G G J J J J
333 0.033 G G J J J J
393 0.039 G G J J J J
473 0.047 G G J J J J
563 0.056 G N N M M
683 0.068 G N N M M
823 0.082 N N M M
104 0.1 N N M M
124 0.12 N N M M
154 0.15 N N M M
184 0.18 N M M
224 0.22 N M M
274 0.27 M M
334 0.33 M M
394 0.39 M M
474 0.47 M Q
684 0.68 Q Q
824 0.82 Q Q
105 1 Q Q
WVDC WVDC 25V 50V 100V 25V 50V 100V 25V 50V
SIZE 0603 0805 1206
Max. 0.33 0.56 0.71 0.90 0.94 1.02 1.27 1.40 1.52 1.78 2.29 2.54 2.79
Thickness (0.013) (0.022) (0.028) (0.035) (0.037) (0.040) (0.050) (0.055) (0.060) (0.070) (0.090) (0.100) (0.110)
PAPER EMBOSSED

APS for COTS+ High Reliability Applications
General Specifications Surface Mount NP0, X7R and X8R/L MLCCs
KYOCERA AVX's APS COTS+ series of multilayer ceramic capacitors offers the customer a high reliability solution with an
ultralow failure rate, <1ppb, in a variety of case sizes and voltages. The APS range encompasses a wide range of dielectric
types to meet the customer's requirements from low temperature/voltage capacitance change dielectric, NP0, to high
preforming capacitance voltage X7R to high temperature reliability dielectrics, X8R/L.
APS capacitors have a wider capacitance range than MIL spec parts that satisfies the need for higher CV demands and board
space saving requirements. Each production lot is extensively tested and removes the requirement for customer specific
drawings. The testing regime uses many of the MIL-STD test methods as per MIL-PRF-55681 and has a field failure rate
of less than 1 ppb. The APS testing series uses KYOCERA AVX’s unique in-house maverick testing detection system that
eliminates infant mortality failures.
Applications suitable for APS include Industrial, Telecommunications, Aviation, and Military. The APS is available with a
range of different termination finishes, Flexiterm®, Nickel / Tin and Tin with Pb1. Flexiterm® technology delivers improved
thermo-mechanical stress resistance.
APS RELIABILITY TEST FEATURES

SUMMARY • The APS range has been extensively Dielectric Temperature/Percentage Cap Change
• 100% Visual Inspection reliability tested as standard resulting in
NP0 -30ppm +30ppm from -55°C + 125°C
• DPA an ultralow failure rate, ≤1ppb
• IR, DF, Cap, DWV • The APS range is available with Flexiterm® X7R -15% +15% from -55°C to + 125°C
• Maverick Lot Review that deliver’s high thermo-mechanical X8R -15% +15% from -55°C to + 150°C
• Thermal Shocl stress resistance.
• High CV range enabling board space X8L -15% +40% from -55°C to + 150°C
• 85/85 Testing
• Additional Life Testing saving requirements.
• C of C with every Order
• Quarterly Data Package
HOW TO ORDER
AP03 5 A 104 K Q T 2 A
Code (In pF) Tolerance Rate T = Plated Ni and Sn 2 = 7" Reel A = Std.Product
AP03=0603 10V = Z NP0 = A
AP05=0805 Q = APS Z = FLEXITERM®** 4 = 13" Reel
16V = Y X7R = C 2 Sig. Digits + J = ±5%
AP06=1206 B = 10% min lead
25V = 3 X8R = F Number of Zeros K = ±10%
AP10=1210 X = FLEXITERM® with
50V = 5 X8L = L e.g. 10 F = 106 M = ±20%
AP12=1812 100V = 1
10% min lead
AP20=2220
200V = 2
250V = V Z,X for X7R only
500V = 7 **RoHS compliant
NOTE: Contact factory for availability of Termination and Tolerance Options for Specific Part Number.
010920

APS COTS+ NP0 Series
Capacitance Range
Size AP03 = 0603 AP05 = 0805 AP06 = 1206 AP10 = 1210

WVDC 25V 50V 100V 25V 50V 100V 25V 50V 100V 200V 500V 25V 50V 100V 200V
100 10pF G G G J J J J J J J J
120 12 G G G J J J J J J J J
150 15 G G G J J J J J J J J
180 18 G G G J J J J J J J
220 22 G G G J J J J J J J
270 27 G G G J J J J J J J
330 33 G G G J J J J J J J
390 39 G G G J J J J J J J
470 47 G G G J J J J J J J
510 51 G G G J J J J J J J
560 56 G G G J J J J J J J
680 68 G G G J J J J J J J
820 82 G G G J J J J J J J
101 100 G G G J J J J J J J
121 120 G G G J J J J J J J
151 150 G G G J J J J J J J
181 180 G G G J J J J J J J
221 220 G G G J J J J J J J
271 270 G G G J J J J J J J
331 330 G G G J J J J J J J
391 390 G G J J J J J J J
471 470 G G J J J J J J J
561 560 J J J J J J J
681 680 J J J J J J J
821 820 J J J J J J J
102 1000 J J J J J J J J J J J
122 1200 J J M M
152 1500 J J M M
182 1800 J J M M
222 2200 J J M M
272 2700
332 3300
392 3900
472 4700
103 10nF
WVDC 25V 50V 100V 25V 50V 100V 25V 50V 100V 200V 500V 25V 50V 100V 200V
Size AP03 = 0603 AP05 = 0805 AP06 = 1206 AP10 = 1210
Max. 0.33 0.56 0.71 0.90 0.94 1.02 1.27 1.40 1.52 1.78 2.29 2.54 2.79
Thickness (0.013) (0.022) (0.028) (0.035) (0.037) (0.040) (0.050) (0.055) (0.060) (0.070) (0.090) (0.100) (0.110)
PAPER EMBOSSED
TS 16949, ISO 9001Certified
082917

APS COTS+ X7R Series
Capacitance Range
Size AP03 = 0603 AP05 = 0805 AP06 = 1206 AP10 = 1210 AP12 = 1812 AP20 = 2220
WVDC 16V 25V 50V 100V 200V 16V 25V 50V 100V 200V 16V 25V 50V 100V 200V 500V 16V 25V 50V 100V 50V 100V 25V 50V 100V
102 Cap 1000 G G G G G J J J J J J J J J J J K K K K K K
182 (pF) 1800 G G G G J J J J J J J J J J J K K K K K K
222 2200 G G G G J J J J J J J J J J J K K K K K K
103 0.01 G G G G J J J J J J J J J J J K K K K K K
123 0.012 G G G J J J M J J J J J K K K K K K
473 0.047 G G G J J J M J J J M J K K K K K K
563 0.056 G G G J J J M J J J M J K K K M K K
104 0.1 G G G J J M M J J J M J K K K M K K
124 0.12 J J M N J J M M K K K P K K
154 0.15 M N M N J J M M K K K P K K
224 0.22 M N M N J M M Q M M M P M M
334 0.33 N N M N J M P Q P P P Q X X
474 0.47 N N M N M M P Q P P P Q X X
684 0.68 N N N M Q Q Q P P Q X X X
105 Cap 1.0 N N N* M Q Q Q* P Q Q Z* X X
155 (μF) 1.5 Q Q Q P Q Z Z X X
225 2.2 Q Q Q Z Z Z Z* Z Z
335 3.3 Q X Z Z Z Z
475 4.7 Q X Z Z Z*
106 10 Z Z* Z Z*
226 22 Z
WVDC 16V 25V 50V 100V 200V 16V 25V 50V 100V 200V 16V 25V 50V 100V 200V 500V 16V 25V 50V 100V 50V 100V 25V 50V 100V
Size AP03 = 0603 AP05 = 0805 AP06 = 1206 AP10 = 1210 AP12 = 1812 AP20 = 2220
*Not currently available with lead plating finish, contact plant for further information.
Max. 0.33 0.56 0.71 0.90 0.94 1.02 1.27 1.40 1.52 1.78 2.29 2.54 2.79
Thickness (0.013) (0.022) (0.028) (0.035) (0.037) (0.040) (0.050) (0.055) (0.060) (0.070) (0.090) (0.100) (0.110)
PAPER EMBOSSED
102620

APS COTS+ X8R/L Series
Capacitance Range
X8R
SIZE AP03 = 0603 AP05 = 0805 AP06 = 1206
WVDC 25V 50V 25V 50V 25V 50V
331 Cap 330 G G J J
471 (pF) 470 G G J J
681 680 G G J J
102 1000 G G J J J J
152 1500 G G J J J J
222 2200 G G J J J J
332 3300 G G J J J J
472 4700 G G J J J J
682 6800 G G J J J J
103 Cap 0.01 G G J J J J
153 (μF) 0.015 G G J J J J
223 0.022 G G J J J J
333 0.033 G G J J J J
473 0.047 G G J J J J
683 0.068 G N N M M
104 0.1 N N M M
154 0.15 N N M M
224 0.22 N M M
334 0.33 M M
474 0.47 M
684 0.68
105 1
WVDC 25V 50V 25V 50V 25V 50V
SIZE 0603 0805 1206
X8L
SIZE AP03 = 0603 AP05 = 0805 AP06 = 1206
WVDC 25V 50V 100V 25V 50V 100V 16V 25V 50V 100V
331 Cap 330 G G J J
471 (pF) 470 G G J J
681 680 G G J J
102 1000 G G J J
152 1500 G G J J J J
222 2200 G G J J J J
332 3300 G G J J J J
472 4700 G G J J J J
682 6800 G G J J J J
103 Cap 0.01 G G J J J J
153 (μF) 0.015 G G J J J J J
223 0.022 G G J J J J J
333 0.033 G G J J N J J
473 0.047 G G J J N J J
683 0.068 G G J J J J
104 0.1 G G J J J M
154 0.15 J N J J J Q
224 0.22 N N J J J Q
334 0.33 N J M P Q
474 0.47 N M M P
684 0.68 M
105 1 M
WVDC 25V 50V 100V 25V 50V 100V 16V 25V 50V 100V
SIZE 0603 0805 1206
Max. 0.33 0.56 0.71 0.90 0.94 1.02 1.27 1.40 1.52 1.78 2.29 2.54 2.79
Thickness (0.013) (0.022) (0.028) (0.035) (0.037) (0.040) (0.050) (0.055) (0.060) (0.070) (0.090) (0.100) (0.110)
PAPER EMBOSSED
082917

MLCC with FLEXITERM®
GENERAL DESCRIPTION
With increased requirements from the automotive industry for additional component robustness, KYOCERA AVX
recognized the need to produce a MLCC with enhanced mechanical strength. It was noted that many components
may be subject to severe flexing and vibration when used in various under the hood automotive and other harsh
environment applications.
To satisfy the requirement for enhanced mechanical strength, KYOCERA AVX had to find a way of ensuring
electrical integrity is maintained whilst external forces are being applied to the component. It was found that
the structure of the termination needed to be flexible and after much research and development, KYOCERA AVX
launched FLEXITERM®. FLEXITERM® is designed to enhance the mechanical flexure and temperature cycling
performance of a standard ceramic capacitor with an X7R dielectric. The industry standard for flexure is 2mm
minimum. Using FLEXITERM®, KYOCERA AVX provides up to 5mm of flexure without internal cracks. Beyond 5mm,
the capacitor will generally fail “open”.
As well as for automotive applications FLEXITERM® will provide Design Engineers with a satisfactory solution
when designing PCB’s which may be subject to high levels of board flexure.
PRODUCT ADVANTAGES APPLICATIONS

• High mechanical performance able to withstand, High Flexure Stress Circuit Boards
5mm bend test guaranteed
• Increased temperature cycling performance, 3000 • e.g. Depanelization: Components near edges of board.
cycles and beyond Variable Temperature Applications
• Flexible termination system • Soft termination offers improved reliability performance in
• Reduction in circuit board flex failures applications where there is temperature variation.
• Base metal electrode system • e.g. All kind of engine sensors: Direct connection to battery rail.
• Automotive or commercial grade products available
• AECQ200 Qualified Automotive Applications
• Approved to VW 80808 Specification • Improved reliability.
• Excellent mechanical performance and thermo mechanical
performance.
HOW TO ORDER
0805 5 C 104 K A Z 2 A
Style Voltage Dielectric Capacitance Capacitance Failure Terminations Packaging Special Code
0603 6 = 6.3V C = X7R Code (In pF) Tolerance Rate Z = FLEXITERM® 2 = 7" Reel A = Std.Product
0805 Z = 10V F = X8R 2 Sig Digits + J = ±5%* A=Commercial For FLEXITERM® 4 = 13" Reel
1206 Y = 16V Number of Zeros K = ±10% 4 = Automotive with Tin/Lead
1210 3 = 25V e.g., 104 = 100nF
1812 M = ±20% termination see
2220 5 = 50V LD Series
1 = 100V *≤1μF only
2 = 200V
091120

PERFORMANCE TESTING BOARD BEND TEST PROCEDURE
According to AEC-Q200
AEC-Q200 Qualification: Test Procedure as per AEC-Q200:
• Created by the Automotive Electronics Sample size: 20 components
Council Span: 90mm Minimum deflection spec: 2 mm
• Specification defining stress
LOADING
KNIFE
test qualification for passive • Components soldered onto FR4 PCB (Figure 1)
components • Board connected electrically to the test equipment MOUNTING
ASSEMBLY
(Figure 2)
Testing:
DIGITAL
Key tests used to compare CALIPER
soft termination to AEC-Q200 BEND TESTPLATE
qualification:
CONNECTOR
• Bend Test CONTROL
• Temperature Cycle Test PANEL
CONTROL PANEL
Fig 2 - Board Bend test
Fig 1 - PCB layout with electrical connections equipment
BOARD BEND TEST RESULTS
AEC-Q200 Vrs FLEXITERM® Bend Test
0603 0805
12 ENHANCED SOFT TERMINATION BEND
Substrate Bend (mm)
12
Substrate Bend (mm)
10 10
8 8
TEST PROCEDURE
6 6
4 4 Bend Test
2 2
The capacitor is soldered to the printed circuit board as
0 0
NPO X7R X7R soft term NPO X7R X7R soft term shown and is bent up to 10mm at 1mm per second:
1210
1206
Substrate Bend (mm)
12 12
Substrate Bend (mm)
10 10
8 8
6 6
4 4
2 2
0 0
NPO X7R X7R soft term NPO X7R X7R soft term Max. = 10mm
TABLE SUMMARY
Typical bend test results are shown below: 90mm
Style Conventional Termination FLEXITERM ®
0603 >2mm >5mm

• The board is placed on 2 supports 90mm apart
0805 >2mm >5mm (capacitor side down)
1206 >2mm >5mm • The row of capacitors is aligned with the load
TEMPERATURE CYCLE TEST PROCEDURE stressing knife
Test Procedure as per AEC-Q200:
The test is conducted to determine the resistance of the component when it
is exposed to extremes of alternating high and low temperatures. Max. = 10mm
• Sample lot size quantity 77 pieces

• TC chamber cycle from -55ºC to +125ºC for 1000 cycles
• Interim electrical measurements at 250, 500, 1000 cycles
• Measure parameter capacitance dissipation factor, insulation
resistance
• The load is applied and the deflection where the
part starts to crack is recorded (Note: Equipment
detects the start of the crack using a highly
sensitive current detection circuit)
Test Temperature Profile (1 cycle) • The maximum deflection capability is 10mm
020117

BEYOND 1000 CYCLES: TEMPERATURE CYCLE TEST RESULTS
0603 0805
10 10
8 8
% Failure
% Failure
6 6
4 4
2 2
0 0
0 500 1000 1500 2000 2500 3000 0 500 1000 1500 2000 2500 3000
1206 1210
10 10
8 8
% Failure
% Failure
6 6
4 4
2 2
0 0
0 500 1000 1500 2000 2500 3000 0 500 1000 1500 2000 2500 3000
Green = Soft Term MLCC (Flexiterm)
Red = Standard MLCC
AEC-Q200 specification states

Soft Term - No Defects up to 3000 cycles 1000 cycles compared to 3000
temperature cycles.
FLEXITERM® TEST SUMMARY
• Qualified to AEC-Q200 test/specification with the exception • Board bend test improvement by a factor of 2 to 4 times.
of using 3000 temperature cycles (up to +150°C bend test • Temperature Cycling:
guaranteed greater than 5mm). – 0% Failure up to 3000 cycles
• FLEXITERM® provides improved performance compared to – No ESR change up to 3000 cycle
standard termination systems.
WITHOUT SOFT TERMINATION WITH SOFT TERMINATION
Major fear is of latent board flex failures.

Far superior mechanical performance.
Generally open failure mode beyond
5mm flexure
061120

Capacitance Range X8R Dielectric
SIZE 0603 0805 1206

Soldering Reflow/Wave Reflow/Wave Reflow/Wave
WVDC 25V 50V 25V 50V 25V 50V
271 Cap 270 G G
331 (pF) 330 G G J J
471 470 G G J J
681 680 G G J J
102 1000 G G J J J J
152 1500 G G J J J J
182 1800 G G J J J J
222 2200 G G J J J J
272 2700 G G J J J J
332 3300 G G J J J J
392 3900 G G J J J J
472 4700 G G J J J J
562 5600 G G J J J J
682 6800 G G J J J J
822 8200 G G J J J J
103 Cap 0.01 G G J J J J
123 (μF) 0.012 G G J J J J
153 0.015 G G J J J J
183 0.018 G G J J J J
223 0.022 G G J J J J
273 0.027 G G J J J J
333 0.033 G G J J J J
393 0.039 G G J J J J
473 0.047 G G J J J J
563 0.056 G N N M M
683 0.068 G N N M M
823 0.082 N N M M
104 0.1 N N M M
124 0.12 N N M M
154 0.15 N N M M
184 0.18 N M M
224 0.22 N M M
274 0.27 M M
334 0.33 M M
394 0.39 M
474 0.47 M
684 0.68
824 0.82
105 1
WVDC 25V 50V 25V 50V 25V 50V
SIZE 0603 0805 1206
Max. 0.33 0.56 0.71 0.90 0.94 1.02 1.27 1.40 1.52 1.78 2.29 2.54 2.79
Thickness (0.013) (0.022) (0.028) (0.035) (0.037) (0.040) (0.050) (0.055) (0.060) (0.070) (0.090) (0.100) (0.110)
PAPER EMBOSSED
020117

Capacitance Range X7R Dielectric
Size 0402 0603 0805 1206 1210 1812 2220
Soldering Reflow/ Wave Reflow/Wave Reflow/Wave Reflow/Wave Reflow Only Reflow Only Reflow Only
WVDC 16V 25V 50V 10V 16V 25V 50V 100 V 200V 250V 16V 25V 50V 100 V 200V 250V 16V 25V 50V 100 V 200V 250V 500V 16V 25V 50V 100V 50V 100 V 25V 50V 100 V
221 Cap 220 C C C C
271 (pF) 270 C C C
331 330 C C C
391 390 C C C
471 470 C C C
561 560 C C C
681 680 C C C
821 820 C C C
102 1000 C C C G G G G G G J J J J J J J J J J J J J K K K K N N
103 Cap 0.01 C G G G G G G J J J J J J J J J J J J J K K K K N N
123 (μF) 0.012 C G G G J J J N N N J J J J J J K K K K N N
153 0.015 C G G G J J J N N N J J J J J J K K K K N N
473 0.047 G G G J J J N N N J J J M J J K K K K N N
563 0.056 G G G J J J N J J J M J J K K K M N N
104 0.1 C G G G J J J N J J J M J J K K K M N N
124 0.12 J J N N J J M M K K K P N N
154 0.15 M N N N J J M M K K K P N N
224 0.22 G J J J M N N N J M M Q M M M P N N
334 0.33 N N N N J M P Q P P P Q X X
474 0.47 J J J N N N N M M P Q P P P Q X X
684 0.68 N N N N M Q Q Q P P Q X X X
105 1 N N N N M Q Q Q P Q Q Z X X
155 1.5 N N Q Q Q P Q Z Z X X
225 2.2 N N Q Q Q X Z Z Z Z Z
335 3.3 Q Q X Z Z Z Z
475 4.7 Q Q X Z Z Z Z Z
106 10 Z Z Z Z Z
226 22 Z
WVDC 16V 25V 50V 10V 16V 25V 50V 100 V 200V 250V 16V 25V 50V 100 V 200V 250V 16V 25V 50V 100 V 200V 250V 500V 16V 25V 50V 100 V 50V 100 V 25V 50V 100 V
Size 0402 0603 0805 1206 1210 1812 2220
Max. 0.33 0.56 0.71 0.90 0.94 1.02 1.27 1.40 1.52 1.78 2.29 2.54 2.79
Thickness (0.013) (0.022) (0.028) (0.035) (0.037) (0.040) (0.050) (0.055) (0.060) (0.070) (0.090) (0.100) (0.110)
PAPER EMBOSSED
111020

FLEXISAFE MLC Chips
General Specifications and Capacitance Range
For Ultra Safety Critical Applications
KYOCERA AVX have developed a range of components specifically for safety critical applications.
Utilizing the award-winning FLEXITERM™ layer in conjunction with the cascade design previously used for high
voltage MLCCs, a range of ceramic capacitors is now available for customers who require components designed
with an industry leading set of safety features.
The FLEXITERM™ layer protects the component from any damage to the ceramic resulting from mechanical stress
during PCB assembly or use with end customers. Board flexure type mechanical damage accounts for the majority
of MLCC failures. The addition of the cascade structure protects the component from low insulation resistance
failure resulting from other common causes for failure; thermal stress damage, repetitive strike ESD damage and
placement damage. With the inclusion of the cascade design structure to complement the FLEXITERM™ layer, the
FLEXISAFE range of capacitors has unbeatable safety features. Flexisafe capacitors are qualified in accordance
with AEC-Q200 standard. AEC-Q200 detailed qualification data is available on request
HOW TO ORDER
FS05 5 C 104 K Q Z 2 A

FS03 = 0603 16V = Y X7R = C Code (In pF) Tolerance Rate Z = FLEXITERM™ 2 = 7" Reel Code
FS05 = 0805 25V = 3 2 Sig. Digits + J = ±5% A = Commercial *X = FLEXITERM™ 4 = 13" Reel A = Std.Product
FS06 = 1206 50V = 5 Number of K = ±10% 4 = Automotive with 5% min lead
FS10 = 1210 100V = 1 Zeros M = ±20% Q = APS *Not RoHS Compliant
e.g. 10μF =106
CAPACITANCE RANGE FLEXISAFE X7R
SIZE FS03 = 0603 FS05 = 0805 FS06 = 1206 FS10 = 1210

WVDC 16 25 50 100 16 25 50 100 16 25 50 16 25 50
102 1000 G G G G J J J J J J J
182 1800 G G G G J J J J J J J
222 2200 G G G G J J J J J J J
332 3300 G G G G J J J J J J J
472 4700 G G G G J J J J J J J
682 6800 G G G G J J J J J J J
103 0.01 G G G G J J J J J J J
123 0.012 G G G J J J J J J J
153 0.015 G G G J J J J J J J
183 0.018 G G G J J J J J J J
223 0.022 G G G N N N N J J J
273 0.027 N N N N J J J
333 0.033 N N N N J J J
473 0.047 N N N N M M M
563 0.056 N N N N M M M
683 0.068 N N N N M M M
823 0.082 N N N N M M M
104 0.1 N N N N M M M
124 0.12 M M M
154 0.15 M M M Q Q Q
224 0.22 Q Q Q
334 0.33 Q Q Q
474 0.47 Q Q Q
Letter G J M N Q
Max. Thickness 0.90 (0.035) 0.94 (0.037) 1.27 (0.050) 1.40 (0.055) 1.78 (0.070)
PAPER EMBOSSED
012721

Capacitor Array
Capacitor Array (IPC)
BENEFITS OF USING CAPACITOR ARRAYS
KYOCERA AVX capacitor arrays offer designers the opportunity to lower For high volume users of cap arrays using the very latest placement
placement costs, increase assembly line output through lower component equipment capable of placing 10 components per second, the increase in
count per board and to reduce real estate requirements. throughput can be very significant and can have the overall effect of reducing
the number of placement machines required to mount components:
Reduced Costs
If 120 million 2-element arrays or 40 million 4-element arrays were placed in
Placement costs are greatly reduced by effectively placing one device a year, the requirement for placement equipment would be reduced by one
instead of four or two. This results in increased throughput and translates machine.
into savings on machine time. Inventory levels are lowered and further
During a 20Hr operational day a machine places 720K components. Over a
savings are made on solder materials, etc.
working year of 167 days the machine can place approximately 120 million.
Space Saving If 2-element arrays are mounted instead of discrete components, then the
number of placements is reduced by a factor of two and in the scenario
Space savings can be quite dramatic when compared to the use of discrete
where 120 million 2-element arrays are placed there is a saving of one pick
chip capacitors. As an example, the 0508 4-element array offers a space
and place machine.
reduction of >40% vs. 4 x 0402 discrete capacitors and of >70% vs. 4 x 0603
discrete capacitors. (This calculation is dependent on the spacing of the Smaller volume users can also benefit from replacing discrete components
discrete components.) with arrays. The total number of placements is reduced thus creating spare
capacity on placement machines. This in turn generates the opportunity
Increased Throughput to increase overall production output without further investment in new
Assuming that there are 220 passive components placed in a mobile equipment.
phone:
A reduction in the passive count to 200 (by replacing discrete
components with arrays) results in an increase in throughput of
approximately 9%.
A reduction of 40 placements increases throughput by 18%.
W2A (0508) Capacitor Arrays
4 pcs 0402 Capacitors = 1 pc 0508 Array
1.4 1.0 1.88

(0.055) (0.039) (0.074)
5.0 (0.197) 2.1 (0.083)

AREA = 7.0mm2 (0.276 in2) AREA = 3.95mm2 (0.156 in2)
The 0508 4-element capacitor array gives a PCB space saving of over 40%
vs four 0402 discretes and over 70% vs four 0603 discrete capacitors.
W3A (0612) Capacitor Arrays

4 pcs 0603 Capacitors = 1 pc 0612 Array
2.3 1.5 1.60

(0.091) (0.059) (0.063)
6.0 (0.236) 3.2 (0.126)

AREA = 13.8mm2 (0.543 in2) AREA = 6.4mm2 (0.252 in2)
The 0612 4-element capacitor array gives a PCB space saving of over 50%
vs four 0603 discretes and over 70% vs four 0805 discrete capacitors.
032417

Capacitor Array
Capacitor Array (IPC)
GENERAL DESCRIPTION
KYOCERA AVX is the market leader in the development and manufacture of capacitor
arrays. The array family of products also includes the 0612 4-element device as well as
0508 2-element and 4-element series, all of which have received widespread acceptance in
the marketplace.
KYOCERA AVX capacitor arrays are available in X5R, X7R and NP0 (C0G) ceramic dielectrics
to cover a broad range of capacitance values. Voltage ratings from 6.3 Volts up to 100 Volts
0508 - 2 Element
are offered. KYOCERA AVX also now offers a range of automotive capacitor arrays qualified
to AEC-Q200 (see separate table).
Key markets for capacitor arrays are Mobile and Cordless Phones, Digital Set Top Boxes,
Computer Motherboards and Peripherals as well as Automotive applications, RF Modems,
Networking Products, etc.
0508 - 4 Element 0612 - 4 Element
AVX Capacitor Array - W2A41A***K

S21 Magnitude
0
-5
-10
-15
S21 mag. (dB)
-20
-25 5pF 10pF

15pF 22pF
-30 33pF 39pF
68pF
-35
-40
0.01 0.1 1 10
Frequency (GHz)
HOW TO ORDER
W 2 A 4 3 C 103 M A T 2A
Style Case Array Number Voltage Dielectric Capacitance Capacitance Failure Termination Packaging &
W = RoHS Size of Caps 6 = 6V A = NP0 Code Tolerance Rate Code Quantity
L = SnPb 2 = 0508 2 = 2 Element Z = 10V C = X7R 2 Sig. Digits + J = ±5% A = Commercial *T = Plated Ni Code
Number of K = ±10% 4 = Automotive and Sn 2A = 7" Reel
3 = 0612 4 = 4 Element Y = 16V D = X5R Zeros
3 = 25V M = ±20% *Z = FLEXITERM 4A = 13" Reel
®
*B = 5% min lead 2F = 7" Reel

5 = 50V *X = FLEXITERM® (1000)
1 = 100V with 5% min
lead
020922

Capacitor Array
Capacitance Range – NP0/C0G
SIZE W2 = 0508 W3 = 0612

# Elements 4 4
Solderinq Reflow/Wave Reflow/Wave
Packaqinq Paper/Embossed Paper/Embossed
mm 1.30 ± 0.15 1.60 ± 0.150
Length
(in.) (0.051 ± 0.006) (0.063 ± 0.006)
mm 2.10 ± 0.15 3.20 ± 0.20
Width
(in.) (0.083 ± 0.006) (0.126 ± 0.008)
Max. mm 0.94 1.35
Thickness (in.) (0.037) (0.053)
WVDC 16 25 50 16 25 50
1R0 Cap 1.0
1R2 (pF) 1.2
1R5 1.5
1R8 1.8
2R2 2.2
2R7 2.7
3R3 3.3
3R9 3.9
4R7 4.7
5R6 5.6
6R8 6.8
8R2 8.2
100 10
120 12
150 15
180 18
220 22
270 27
330 33
390 39
470 47
560 56
680 68
820 82
101 100
121 120
151 150
181 180
221 220
271 270
331 330
391 390
471 470
561 560
681 680
821 820
102 1000
122 1200
152 1500
182 1800
222 2200
272 2700
332 3300
392 3900
472 4700
562 5600
682 6800
822 8200
= Supported Values
031722

Capacitor Array
Capacitance Range – X7R
SIZE W2 = 0508 W2 = 0508 W3 = 0612
# Elements 2 4 4
Solderinq Reflow/Wave Reflow/Wave Reflow/Wave
Packaqinq All Paper Paper/Embossed Paper/Embossed
mm 1.30 ± 0.15 1.30 ± 0.15 1.60 ± 0.150
Length
(in.) (0.051 ± 0.006) (0.051 ± 0.006) (0.063 ± 0.006)
mm 2.10 ± 0.15 2.10 ± 0.15 3.20 ± 0.20
Width
(in.) (0.083 ± 0.006) (0.083 ± 0.006) (0.126 ± 0.008)
Max. mm 0.94 0.94 1.35
Thickness (in.) (0.037) (0.037) (0.053)
WVDC 6 10 16 25 50 100 6 10 16 25 50 100 6 10 16 25 50 100
101 Cap 100
121 (PF) 120
151 150
181 180
221 220
271 270
331 330
391 390
471 470
561 560
681 680
821 820
102 1000
122 1200
152 1500
182 1800
222 2200
272 2700
332 3300
392 3900
472 4700
562 5600
682 6800
822 8200
103 Cap 0.010
123 (μF) 0.012
153 0.015
183 0.018
223 0.022
273 0.027
333 0.033
393 0.039
473 0.047
563 0.056
683 0.068
823 0.082
104 0.10
124 0.12
154 0.15
184 0.18
224 0.22
274 0.27
334 0.33
474 0.47
564 0.56
684 0.68
824 0.82
105 1.0
125 1.2
155 1.5
185 1.8
225 2.2
335 3.3
475 4.7
106 10
226 22
476 47
107 100

Capacitor Array
Automotive Capacitor Array (IPC)
As the market leader in the development and manufacture of capacitor arrays KYOCERA AVX is pleased to offer a range
of AEC-Q200 qualified arrays to compliment our product offering to the Automotive industry. Both the KYOCERA AVX
0612 and 0508 4-element capacitor array styles are qualified to the AEC-Q200 automotive specifications.
AEC-Q200 is the Automotive Industry qualification standard and a detailed qualification package is available on request.
All KYOCERA AVX automotive capacitor array production facilities are certified to ISO/TS 16949:2002.
HOW TO ORDER
W 3 A 4 Y C 104 K 4 T 2A
Style Case Array Number Voltage Dielectric Capacitance Capacitance Failure Rate Terminations Packaging
W = RoHS Size of Caps Z = 10V A = NP0 Code (In pF) Tolerance 4 = Automotive *T = Plated Ni and Sn & Quantity
L = SnPb 2 = 0508 Y = 16V C = X7R Significant *J = ±5% *Z = FLEXITERM® Code
3 = 0612 3 = 25V F = X8R Digits + *K = ±10% B = 5% min lead 2A = 7" Reel
*M = ±20% X = FLEXITERM® 4A = 13" Reel
5 = 50V Number of
2F = 7" Reel
1 = 100V Zeros with 5% min lead
e.g. 10μF=106 (1000)
*Contact factory for availability by part number for K = ±10% and J = ±5% tolerance.
NP0/C0G X7R
SIZE W3 = 0612 SIZE W2 = 0508 W2 = 0508 W3 = 0612
No. of Elements Reflow/Wave No. of Elements 2 4 4
WVDC 16 25 50 WVDC 16 25 50 100 16 25 50 100 10 16 25 50 100
1R0 Cap 1.0 101 Cap 100
1R2 (pF) 1.2 121 (pF) 120
1R5 1.5 151 150
1R8 1.8 181 180
2R2 2.2 221 220
2R7 2.7 271 270
3R3 3.3 331 330
3R9 3.9 391 390
4R7 4.7 471 470
5R6 5.6 561 560
6R8 6.8 681 680
8R2 8.2 821 820
100 10 102 1000
120 12 122 1200
150 15 152 1500
180 18 182 1800
220 22 222 2200
270 27 272 2700
330 33 332 3300
390 39 392 3900
470 47 472 4700
560 56 562 5600
680 68 682 6800
820 82 822 8200
101 100 103 Cap 0 010
121 120 123 (μF) 0.012
151 150 153 0.015
181 180 153 0.018
221 220 223 0.022
271 270 273 0.027
331 330 333 0.033
391 390 393 0.039
471 470 473 0.047
561 560 563 0.056
681 680 683 0.068
821 820 823 0.082
102 1000 104 0.10
122 1200 124 0.12
152 1500 154 0.15
182 1800 224 0.22
222 2200
272 2700 = X7R
332 3300
392 3900
472 4700
562 5600
682 6800
822 8200
= NPO/COG
LEAD-FREE COMPATIBLE
COMPONENT
For RoHS compliant products,

please select correct termination style.
020822

Capacitor Array
Part & Pad Layout Dimensions
PART & PAD LAYOUT DIMENSIONS millimeters (inches)
0508 - 2 Element 0508 - 4 Element 0612 - 4 Element

W
X X
W S S
P
X X
S S
P
T
T
BW C/L OF CHIP BW C/L OF CHIP

C
L C
L
BL
L
BL
L
PAD LAYOUT PAD LAYOUT PAD LAYOUT
PART DIMENSIONS PAD LAYOUT DIMENSIONS

L W T BW BL P S A B C D E
1.30 ± 0.15 2.10 ± 0.15 0.94 MAX 0.43 ± 0.10 0.33 ± 0.08 1.00 REF 0.50 ± 0.10 0.68 1.32 2.00 0.46 1.00
(0.051 ± 0.006) (0.083 ± 0.006) (0.037 MAX) (0.017 ± 0.004) (0.013 ± 0.003) (0.039 REF) (0.020 ± 0.004) (0.027) (0.052) (0.079) (0.018) (0.039)

L W T BW BL P X S A B C D E
1.30 ± 0.15 2.10 ± 0.15 0.94 MAX 0.25 ± 0.06 0.20 ± 0.08 0.50 REF 0.75 ± 0.10 0.25 ± 0.10 0.56 1.32 1.88 0.30 0.50
(0.051 ± 0.006) (0.083 ± 0.006) (0.037 MAX) (0.010 ± 0.003) (0.008 ± 0.003) (0.020 REF) (0.030 ± 0.004) (0.010 ± 0.004) (0.022) (0.052) (0.074) (0.012) (0.020)
L W T BW BL P X S A B C D E
+0.25 0.89 1.65 2.54 0.46 0.76
1.60 ± 0.20 3.20 ± 0.20 1.35 MAX 0.41 ± 0.10 0.18 -0.08 0.76 REF 1.14 ± 0.10 0.38 ± 0.10 (0.035) (0.065) (0.100) (0.018) (0.030)
(0.007+0.010 )
(0.063 ± 0.008) (0.126 ± 0.008) (0.053 MAX) (0.016 ± 0.004) -0.003 (0.030 REF) (0.045 ± 0.004) (0.015 ± 0.004)

Low Inductance Capacitors
Introduction
The signal integrity characteristics of a Power Delivery Network (PDN) The ESL of a capacitor determines the speed of energy transfer to a load.
are becoming critical aspects of board level and semiconductor package The lower the ESL of a capacitor, the faster that energy can be transferred
designs due to higher operating frequencies, larger power demands, and the to a load. Historically, there has been a tradeoff between energy storage
ever shrinking lower and upper voltage limits around low operating voltages. (capacitance) and inductance (speed of energy delivery). Low ESL devices
These power system challenges are coming from mainstream designs typically have low capacitance. Likewise, higher capacitance devices
with operating frequencies of 300MHz or greater, modest ICs with power typically have higher ESLs. This tradeoff between ESL (speed of energy
demand of 15 watts or more, and operating voltages below 3 volts. delivery) and capacitance (energy storage) drives the PDN design topology
The classic PDN topology is comprised of a series of capacitor stages. that places the fastest low ESL capacitors as close to the load as possible.
Figure 1 is an example of this architecture with multiple capacitor stages. Low Inductance MLCCs are found on semiconductor packages and on
boards as close as possible to the load.
An ideal capacitor can transfer all its stored energy to a load instantly. A real
capacitor has parasitics that prevent instantaneous transfer of a capacitor’s
stored energy. The true nature of a capacitor can be modeled as an RLC
equivalent circuit. For most simulation purposes, it is possible to model
the characteristics of a real capacitor with one capacitor, one resistor, and
one inductor. The RLC values in this model are commonly referred to as
equivalent series capacitance (ESC), equivalent series resistance (ESR), and
equivalent series inductance (ESL).
Slowest Capacitors Fastest Capacitors
Semiconductor Product
VR
Bulk Board-Level Package-Level Die-Level
Low Inductance Decoupling Capacitors

Figure 1 Classic Power Delivery Network (PDN) Architecture
LOW INDUCTANCE CHIP CAPACITORS INTERDIGITATED CAPACITORS

The key physical characteristic determining equivalent series inductance The size of a current loop has the greatest impact on the ESL characteristics
(ESL) of a capacitor is the size of the current loop it creates. The smaller of a surface mount capacitor. There is a secondary method for decreasing
the current loop, the lower the ESL. A standard surface mount MLCC is the ESL of a capacitor. This secondary method uses adjacent opposing
rectangular in shape with electrical terminations on its shorter sides. A current loops to reduce ESL. The InterDigitated Capacitor (IDC) utilizes
Low Inductance Chip Capacitor (LICC®) sometimes referred to as Reverse both primary and secondary methods of reducing inductance. The IDC
Geometry Capacitor (RGC) has its terminations on the longer side of its architecture shrinks the distance between terminations to minimize the
rectangular shape. current loop size, then further reduces inductance by creating adjacent
When the distance between terminations is reduced, the size of the current opposing current loops.
loop is reduced. Since the size of the current loop is the primary driver of An IDC is one single capacitor with an internal structure that has been
inductance, an 0306 with a smaller current loop has significantly lower optimized for low ESL. Similar to standard MLCC versus LICC®s, the
ESL then an 0603. The reduction in ESL varies by EIA size, however, ESL is reduction in ESL varies by EIA case size. Typically, for the same EIA size, an
typically reduced 60% or more with an LICC® versus a standard MLCC. IDC delivers an ESL that is at least 80% lower than an MLCC.

Low Inductance Capacitors
Introduction
LAND GRID ARRAY (LGA) CAPACITORS LOW INDUCTANCE CHIP ARRAYS (LICA®)
Land Grid Array (LGA) capacitors are based on the first Low ESL MLCC The LICA® product family is the result of a joint development effort between
technology created to specifically address the design needs of current day KYOCERA AVX and IBM to develop a high performance MLCC family of
Power Delivery Networks (PDNs). This is the 3rd low inductance capacitor decoupling capacitors. LICA was introduced in the 1980s and remains the
technology developed by KYOCERA AVX. LGA technology provides engineers leading choice of designers in high performance semiconductor packages
with new options. The LGA internal structure and manufacturing technology and high reliability board level decoupling applications.
eliminates the historic need for a device to be physically small to create LICA® products are used in 99.999% uptime semiconductor package
small current loops to minimize inductance. applications on both ceramic and organic substrates. The C4 solder
The first family of LGA products are 2 terminal devices. A 2 terminal 0306 ball termination option is the perfect compliment to flip-chip packaging
LGA delivers ESL performance that is equal to or better than an 0306 8 technology. Mainframe class CPUs, ultimate performance multi-chip
terminal IDC. The 2 terminal 0805 LGA delivers ESL performance that modules, and communications systems that must have the reliability of 5
approaches the 0508 8 terminal IDC. New designs that would have used 8 9’s use LICA®.
terminal IDCs are moving to 2 terminal LGAs because the layout is easier for LICA® products with either Sn/Pb or Pb-free solder balls are used for
a 2 terminal device and manufacturing yield is better for a 2 terminal LGA decoupling in high reliability military and aerospace applications. These
versus an 8 terminal IDC. LICA® devices are used for decoupling of large pin count FPGAs, ASICs,
LGA technology is also used in a 4 terminal family of products that KYOCERA CPUs, and other high power ICs with low operating voltages.
AVX is sampling and will formerly introduce in 2008. Beyond 2008, there When high reliability decoupling applications require the very lowest ESL
are new multi-terminal LGA product families that will provide even more capacitors, LICA® products are the best option.
attractive options for PDN designers.
470 nF 0306 Impedance Comparison

1
0306 2T-LGA
0306 LICC
0306 8T-IDC
0603 MLCC
Impedance (ohms)
0.1
0.01
0.001
1 10 100 1000
Frequency (MHz)
Figure 2 MLCC, LICC®, IDC, and LGA technologies deliver different levels of equivalent series inductance (ESL).

Low Inductance Ceramic Capacitors
LICC® (Low Inductance Chip Capacitors) 0204/0306/0508/0612 RoHS Compliant
GENERAL DESCRIPTION
The key physical characteristic determining equivalent series inductance (ESL) of a
capacitor is the size of the current loop it creates. The smaller the current loop, the
lower the ESL.
A standard surface mount MLCC is rectangular in shape with electrical
terminations on its shorter sides. A Low Inductance Chip Capacitor (LICC®)
sometimes referred to as Reverse Geometry Capacitor (RGC) has its terminations
on the longer sides of its rectangular shape. The image on the right shows the
termination differences between an MLCC and an LICC®.
When the distance between terminations is reduced, the size of the current loop
is reduced. Since the size of the current loop is the primary driver of inductance,
an 0306 with a smaller current loop has significantly lower ESL then an 0603.
The reduction in ESL varies by EIA size, however, ESL is typically reduced 60% or
more with an LICC® versus a standard MLCC.
KYOCERA AVX LICC® products are available with a lead-free finish of plated MLCC LICC
Nickel/Tin.
PERFORMANCE CHARACTERISTICS
Capacitance Tolerances K = ±10%; M = ±20%
X7R = -55°C to +125°C
Operation
X5R = -55°C to +85°C
Temperature Range
X7S = -55°C to +125°C
Temperature Coefficient X7R, X5R = ±15%; X7S = ±22%
Voltage Ratings 4, 6.3, 10, 16, 25 VDC
4V, 6.3V = 6.5% max; 10V = 5.0% max;
Dissipation Factor 16V = 3.5% max; 25V = 3.0% max
Insulation Resistance 100,000MΩ min, or 1,000MΩ per μF
(@+25°C, RVDC) min.,whichever is less
HOW TO ORDER
0612 Z D 105 M A T 2 A*
0204 4 = 4V C = X7R Code (In pF) Tolerance A = N/A T = Plated Ni Available Thickness
0306 K = ±10% 4 = Automotive** and Sn 2 = 7" Reel
6 = 6.3V D = X5R 2 Sig. Digits + mm (in)
0508 Z = 10V W = X6S Number of Zeros M = ±20% 4 = 13" Reel 0.56 (0.022)
0612
Y = 16V Z = X7S 0.76 (0.030)
3 = 25V 1.02 (0.040)
5 = 50V 1.27 (0.050)
*See the thickness tables on the next page.
**Select voltages for Automotive version, contact factory
TYPICAL IMPEDANCE CHARACTERISTICS

Low Inductance Ceramic Capacitors
LICC® (Low Inductance Chip Capacitors) 0204/0306/0508/0612 RoHS Compliant
SIZE 0204 0306 0508 0612 PHYSICAL DIMENSIONS AND
Packaging Paper Paper Paper/Embossed Paper/Embossed
Length
mm 0.50 ± 0.05 0.81 + 0.15 1.27 + 0.25 1.60 + 0.25 PAD LAYOUT
(in.) (0.020 ± 0.002) (0.032 ± 0.006) (0.050 ± 0.010) (0.063 ± 0.010)
mm 1.00 ± 0.05 1.60 + 0.15 2.00 + 0.25 3.20 + 0.25
Width (in.) (0.040 ± 0.002) (0.063 ± 0.006) (0.080 ± 0.010) (0.126 ± 0.010)
Cap WVDC
4 6.3 10 16 4 6.3 10 16 25 6.3 10 16 25 50 6.3 10 16 25 50 t
Code W
102 Cap 0.001 A A A A V V V V V S S S S V
222 (μF) .0022 A A A A S S S S V S S S S V
332 0.0033 A A A A S S S S V S S S S V T
472 0.0047 A A A A S S S S V S S S S V
682 0.0068 A A A A S S S S V S S S S V
L
103 0.01 A A A A S S S S V S S S S V
153 0.015 A A A A S S S S V S S S S W
223 0.022 A A A A S S S S V S S S S W
333 0.033 A A A S S S V V S S S S W PHYSICAL DIMENSIONS
473 0.047 A A A S S S V A S S S S W
683 0.068 A A A S S S A A S S S V W
104 0.1 C A A A S S V A A S S S V W
MM (IN.)
154 0.15 A A S S V S S S W W Size L W t
224 0.22 A A S S A S S V W 0.50 ± 0.05 1.00 ± 0.05 0.18 ± 0.08
0204
334 0.33 V V A S S V
(0.020 ± 0.002) (0.040 ± 0.002) (0.007 ± 0.003)
0.81 ± 0.15 1.60 ± 0.15 0.13 min.
474 0.47 V V A S S V 0306
684 0.68 A A V V W
(0.032 ± 0.006) (0.063 ± 0.006) (0.005 min.)
1.27 ± 0.25 2.00 ± 0.25 0.13 min.
105 1 A A A V V A 0508
(0.050 ± 0.010) (0.080 ± 0.010) (0.005 min.)
155 1.5 A W W
1.60 ± 0.25 3.20 ± 0.25 0.13 min.
225 2.2 A A 0612
(0.063 ± 0.010) (0.126 ± 0.010) (0.005 min.)
335 3.3 A
475 4.7 T - See Range Chart for Thickness and Codes
685 6.8
106 10 PAD LAYOUT DIMENSIONS MM (IN.)
Size A B C
0306 0.31 (0.012) 1.52 (0.060) 0.51 (0.020)
Solid = X7R = X5R = X7S = X6S
0508 0.51 (0.020) 2.03 (0.080) 0.76 (0.030)
0612 0.76 (0.030) 3.05 (0.120) 0.635 (0.025)
mm (in.) mm (in.) mm (in.) mm (in.)
0204
0204 0306 0508 0612
Code Thickness Code Thickness Code Thickness Code Thickness
C 0.35 (0.014) A 0.56 (0.022) S 0.56 (0.022) S 0.56 (0.022)
V 0.76 (0.030) V 0.76 (0.030)
A 1.02 (0.040) W 1.02 (0.040)
A 1.27 (0.050)
“B”
C “A” C

Low Inductance Capacitors with SnPb Terminations
LD15/LD16/LD17/LD18 Tin-Lead Termination “B”
GENERAL DESCRIPTION
The key physical characteristic determining equivalent series inductance (ESL)
of a capacitor is the size of the current loop it creates. The smaller the current
loop, the lower the ESL.
A standard surface mount MLCC is rectangular in shape with electrical
terminations on its shorter sides. A Low Inductance Chip Capacitor (LICC®)
sometimes referred to as Reverse Geometry Capacitor (RGC) has its
terminations on the longer sides of its rectangular shape. The image on the
right shows the termination differences between an MLCC and an LICC®.
When the distance between terminations is reduced, the size of the current
loop is reduced. Since the size of the current loop is the primary driver of
inductance, an 0306 with a smaller current loop has significantly lower ESL
then an 0603. The reduction in ESL varies by EIA size, however, ESL is typically
reduced 60% or more with an LICC® versus a standard MLCC.
AVX LICC® products are available with a lead termination for high reliability MLCC LICC
military and aerospace applications that must avoid tin whisker reliability
issues.
Capacitance Tolerances K = ±10%; M = ±20%
X7R = -55°C to +125°C
Operation
X5R = -55°C to +85°C
Temperature Range
X7S = -55°C to +125°C
Temperature Coefficient X7R, X5R = ±15%; X7S = ±22%
Voltage Ratings 4, 6.3, 10, 16, 25 VDC
4V, 6.3V = 6.5% max; 10V = 5.0% max;
Dissipation Factor 16V = 3.5% max; 25V = 3.0% max
HOW TO ORDER
LD18 Z D 105 M A B 2 A*
LD15 = 0204 4 = 4V C = X7R Code (In pF) Tolerance A = N/A B = 5% min lead Available Thickness
LD16 = 0306 6 = 6.3V D = X5R 2 Sig. Digits + K = ±10% 2 = 7" Reel mm (in)
LD17 = 0508 Z = 10V W = X6S Number of Zeros M = ±20% 4 = 13" Reel 0.56 (0.022)
LD18 = 0612
Y = 16V Z = X7S 0.76 (0.030)
3 = 25V 1.02 (0.040)
5 = 50V 1.27 (0.050)
*See the thickness tables on the next page.

TYPICAL IMPEDANCE CHARACTERISTICS

Low Inductance Capacitors with SnPb Terminations
LD15/LD16/LD17/LD18 Tin-Lead Termination “B”
LD15 LD16 LD17 LD18 PHYSICAL DIMENSIONS AND

SIZE
(0204) (0306) (0508) (0612)
Packaging Paper Paper Paper/Embossed Paper/Embossed
PAD LAYOUT
mm 0.50 ± 0.05 0.81 ± 0.15 1.27 ± 0.25 1.60 ± 0.25
(in.) (0.020 ± 0.002) (0.032 ± 0.006) (0.050 ± 0.010) (0.063 ± 0.010)
mm 1.00 ± 0.05 1.60 ± 0.15 2.00 ± 0.25 3.20 ± 0.25
Width
(in.) (0.040 ± 0.002) (0.063 ± 0.006) (0.080 ± 0.010) (0.126 ± 0.010)
Cap t
WVDC 4 6.3 10 16 4 6.3 10 16 25 6.3 10 16 25 50 6.3 10 16 25 50 W
Code
102 Cap 0.001 A A A A S S S S V S S S S V
222 (μF) .0022 A A A A S S S S V S S S S V
332 0.0033 A A A A S S S S V S S S S V
T
472 0.0047 A A A A S S S S V S S S S V
682 0.0068 A A A A S S S S V S S S S V L
103 0.01 A A A A S S S S V S S S S V
153 0.015 A A A A S S S S V S S S S W
223 0.022 A A A A S S S S V S S S S W
333 0.033 A A A S S S V V S S S S W
473 0.047 A A A S S S V A S S S S W
PHYSICAL DIMENSIONS MM (IN.)
683 0.068 A A A S S S A A S S S V W
104 0.1 C A A A S S V A A S S S V W
Size L W t
154 0.15 A A S S V S S S W W LD15 0.50 ± 0.05 1.00 ± 0.05 0.18 ± 0.08
(0204) (0.020 ± 0.002) (0.040 ± 0.002) (0.007 ± 0.003)
224 0.22 A A S S A S S V W
LD16 0.81 ± 0.15 1.60 ± 0.15 0.13 min.
334 0.33 V V A S S V
(0306) (0.032 ± 0.006) (0.063 ± 0.006) (0.005 min.)
474 0.47 V V A S S V
LD17 1.27 ± 0.25 2.00 ± 0.25 0.13 min.
684 0.68 A A V V W
(0508) (0.050 ± 0.010) (0.080 ± 0.010) (0.005 min.)
105 1 A A A V V A
LD18 1.60 ± 0.25 3.20 ± 0.25 0.13 min.
155 1.5 A W W
(0612) (0.063 ± 0.010) (0.126 ± 0.010) (0.005 min.)
225 2.2 A A
T - See Range Chart for Thickness and Codes
335 3.3 A
475 4.7
685 6.8
PAD LAYOUT DIMENSIONS MM (IN.)
106 10 Size A B C
LD15
(0204)
Solid = X7R = X5R = X7S = X6S LD16
0.31 (0.012) 1.52 (0.060) 0.51 (0.020)
(0306)
LD17
mm (in.) mm (in.) mm (in.) mm (in.) 0.51 (0.020) 2.03 (0.080) 0.76 (0.030)
(0508)
LD15 LD16 LD17 LD18 LD18
0.76 (0.030) 3.05 (0.120) 0.635 (0.025)
(0306) (0508) (0612) (0612)
(0204)
Code Thickness Code Thickness Code Thickness Code Thickness
C 0.35 (0.014) A 0.56 (0.022) S 0.56 (0.022) S 0.56 (0.022)
V 0.76 (0.030) V 0.76 (0.030)
A 1.02 (0.040) W 1.02 (0.040)
A 1.27 (0.050)
“B”
C “A” C

IDC Low Inductance Capacitors (RoHS)
IDC (InterDigitated Capacitors) 0306/0612/0508
GENERAL DESCRIPTION
Inter-Digitated Capacitors (IDCs) are used for both semiconductor package and
board level decoupling. The equivalent series inductance (ESL) of a single capacitor
or an array of capacitors in parallel determines the response time of a Power
Delivery Network (PDN). The lower the ESL of a PDN, the faster the response time. A 0612
designer can use many standard MLCCs in parallel to reduce ESL or a low ESL Inter-
Digitated Capacitor (IDC) device. These IDC devices are available in versions with a + – + –
maximum height of 0.95mm or 0.55mm.
IDCs are typically used on packages of semiconductor products with power levels
of 15 watts or greater. Inter-Digitated Capacitors are used on CPU, GPU, ASIC, and
ASSP devices produced on 0.13μ, 90nm, 65nm, and 45nm processes. IDC devices
0508
are used on both ceramic and organic package substrates. These low ESL surface
mount capacitors can be placed on the bottom side or the top side of a package – + – +
substrate. The low profile 0.55mm maximum height IDCs can easily be used on the
bottom side of BGA packages or on the die side of packages under a heat spreader.
IDCs are used for board level decoupling of systems with speeds of 300MHz or
greater. Low ESL IDCs free up valuable board space by reducing the number of 0306
capacitors required versus standard MLCCs. There are additional benefits to

reducing the number of capacitors beyond saving board space including higher
reliability from a reduction in the number of components and lower placement costs TYPICAL IMPEDANCE
based on the need for fewer capacitors.
The Inter-Digitated Capacitor (IDC) technology was developed by KYOCERA AVX. 10
This is the second family of Low Inductance MLCC products created by KYOCERA
Impedance (Ohms)
MLCC_1206
AVX. IDCs are a cost effective alternative to KYOCERA AVX’s first generation low ESL 1
family for high-reliability applications known as LICA (Low Inductance Chip Array). LICC_0612
KYOCERA AVX IDC products are available with a lead-free finish of plated Nickel/ 0.1
Tin. IDC_0612
0.01
0.001
1 10 100 1000
Frequency (MHz)
HOW TO ORDER
W 3 L 1 6 D 225 M A T 3 A
Style IDC Case Low Number of Voltage Dielectric Capacitance Capacitance Failure Termination Packaging Thickness
Size Inductance Terminals 4 = 4V C = X7R Code (In pF) Tolerance Rate T =Plated Ni Available Max. Thickness
2 = 0508 1 = 8 Termi- 6 = 6.3V D = X5R 2 Sig. Digits + M = ±20% A = N/A and Sn 1=7" Reel mm (in)
3 = 0612 nals Z = 10V Z = X7S Number of 3=13" Reel A=Standard
4 = 0306 Y = 16V Zeros S=0.55 (0.022)
3 = 25V
PERFORMANCE CHARACTERISTICS 072522
Capacitance Tolerance ±20% Preferred No problems observed after 2.5 x RVDC for 5
Dissipation Factor
X7R = -55°C to +125°C seconds at 50mA max current
Operation
X5R = -55°C to +85°C
Temperature Range CTE (ppm/C) 12.0
X7S = -55°C to +125°C
Temperature Thermal Conductivity 4-5W/M K
±15% (0VDC), ±22% (X7S)
Coefficient Terminations
Voltage Ratings 4, 6.3, 10, 16, 25 VDC Plated Nickel and Solder
Available
≤ 6.3V = 6.5% max;
Dissipation Factor 10V = 5.0% max;
≥ 16V = 3.5% max
072522

IDC Low Inductance Capacitors (RoHS)
SIZE W4 = 0306 W2 = Thin 0508 W2 = 0508 W3= Thin 0612 W3 = 0612 W3 = THICK 0612
Max. mm 0.55 0.55. 0.95 0.55 0.95 1.22
Thickness (in.) (0.022) (0.022) (0.037) (0.022) (0.037) (0.048)
WVDC 4 6.3 4 6.3 10 16 25 4 6.3 10 16 25 4 6.3 10 16 4 6.3 10 16 25 4 6.3 10 16
Cap (μF) 0.010
0.022
0.033
0.047
0.068
0.10
0.22
0.33
0.47
0.68
1.0
1.5
2.2
3.3
Consult factory for

PHYSICAL DIMENSIONS AND PAD LAYOUT additional requirements
= X7R
= X5R
= X7S
PAD LAYOUT DI-

PHYSICAL CHIP DIMENSIONS MILLIMETERS (INCHES) MENSIONS
SIZE W L BW BL P SIZE A B C D E
1.60 ± 0.20 0.82 ± 0.10 0.25 ± 0.10 0.20 ± 0.10 0.40 ± 0.05 0.38 0.89 1.27 0.20 0.40
0306 0306
(0.063 ± 0.008) (0.032 ± 0.006 (0.010 ± 0.004) (0.008± 0.004) (0.015 ± 0.002) (0.015) (0.035) (0.050) (0.008) (0.015)
2.03 ± 0.20 1.27 ± 0.20 0.30 ± 0.10 0.25 ± 0.15 0.50 ± 0.05 0.64 1.27 1.91 0.28 0.50
0508 0508
(0.080 ± 0.008) (0.050 ± 0.008) (0.012 ± 0.004) (0.010± 0.006) (0.020 ± 0.002) (0.025) (0.050) (0.075) (0.011) (0.020)
3.20 ± 0.20 1.60 ± 0.20 0.50 ± 0.10 0.25 ± 0.15 0.80 ± 0.10
0612 0.89 1.65 2.54 0.45 0.80
(0.126 ± 0.008) (0.063 ± 0.008) (0.020 ± 0.004) (0.010 ± 0.006) (0.031 ± 0.004) 0612
(0.035) (0.065) (0.010) (0.018) (0.031)

IDC Low Inductance Capacitors (SnPb)
GENERAL DESCRIPTION
Inter-Digitated Capacitors (IDCs) are used for both semiconductor package and
board level decoupling. The equivalent series inductance (ESL) of a single capacitor
or an array of capacitors in parallel determines the response time of a Power
0612
Delivery Network (PDN). The lower the ESL of a PDN, the faster the response time. A
designer can use many standard MLCCs in parallel to reduce ESL or a low ESL Inter-
Digitated Capacitor (IDC) device. These IDC devices are available in versions with a + – + –
maximum height of 0.95mm or 0.55mm.
IDCs are typically used on packages of semiconductor products with power levels
of 15 watts or greater. Inter-Digitated Capacitors are used on CPU, GPU, ASIC, and
ASSP devices produced on 0.13μ, 90nm, 65nm, and 45nm processes. IDC devices 0508
are used on both ceramic and organic package substrates. These low ESL surface – + – +
mount capacitors can be placed on the bottom side or the top side of a package
substrate. The low profile 0.55mm maximum height IDCs can easily be used on the
bottom side of BGA packages or on the die side of packages under a heat spreader.
IDCs are used for board level decoupling of systems with speeds of 300MHz or 0306
greater. Low ESL IDCs free up valuable board space by reducing the number of
capacitors required versus standard MLCCs. There are additional benefits to
reducing the number of capacitors beyond saving board space including higher TYPICAL IMPEDANCE
reliability from a reduction in the number of components and lower placement costs
based on the need for fewer capacitors. 10
The Inter-Digitated Capacitor (IDC) technology was developed by KYOCERA AVX.
Impedance (Ohms)
MLCC_1206
This is the second family of Low Inductance MLCC products created by KYOCERA 1
AVX. IDCs are a cost effective alternative to KYOCERA AVX’s first generation low ESL LICC_0612
family for high-reliability applications known as LICA (Low Inductance Chip Array). 0.1
IDC_0612
KYOCERA AVX IDC products are available with a lead termination for high reliability
military and aerospace applications that must avoid tin whisker reliability issues. 0.01
0.001
1 10 100 1000
Frequency (MHz)
HOW TO ORDER
L 3 L 1 6 D 225 M A B 3 A
Style IDC Case Low Number of Voltage Dielectric Capacitance Capacitance Failure Termination Packaging Thickness
Size Inductance Terminals 4 = 4V C = X7R Code (In pF) Tolerance Rate B =5% min. Available Max. Thickness
2 = 0508 1 = 8 Termi- 6 = 6.3V D = X5R 2 Sig. Digits + M = ±20% A = N/A Lead 1=7" Reel mm (in)
3 = 0612 nals Z = 10V Z = X7S Number of 3=13" Reel A=Standard
4 = 0306 Y = 16V Zeros S=0.55 (0.022)
3 = 25V
Capacitance Tolerance ±20% Preferred No problems observed after 2.5 x RVDC for
Dissipation Factor
X7R = -55°C to +125°C 5 seconds at 50mA max current
Operation
X5R = -55°C to +85°C
Temperature Range CTE (ppm/C) 12.0
X7S = -55°C to +125°C
Temperature Thermal Conductivity 4-5W/M K
±15% (0VDC), ±22% (X7S)
Coefficient Terminations
Voltage Ratings 4, 6.3, 10, 16, 25 VDC Plated Nickel and Solder
Available
≤ 6.3V = 6.5% max;
Dissipation Factor 10V = 5.0% max;
≥ 16V = 3.5% max
012820

IDC Low Inductance Capacitors (SnPb)
IDC (InterDigitated Capacitors) with Sn/Pb Termination 0306/0612/0508
SIZE W4 = 0306 W2 = Thin 0508 W2 = 0508 W3= Thin 0612 W3 = 0612 W3 = THICK 0612
Max. mm 0.55 0.55. 0.95 0.55 0.95 1.22
Thickness (in.) (0.022) (0.022) (0.037) (0.022) (0.037) (0.048)
WVDC 4 6.3 4 6.3 10 16 25 4 6.3 10 16 25 4 6.3 10 16 4 6.3 10 16 25 4 6.3 10 16
Cap
0.010
(μF)
0.022
0.033
0.047
0.068
0.10
0.22
0.33
0.47
0.68
1.0
1.5
2.2
3.3
Consult factory for

PHYSICAL DIMENSIONS AND PAD LAYOUT additional requirements
= X7R
= X5R
= X7S
PAD LAYOUT DI-

PHYSICAL CHIP DIMENSIONS MILLIMETERS (INCHES) MENSIONS
SIZE W L BW BL P SIZE A B C D E
1.60 ± 0.20 0.82 ± 0.10 0.25 ± 0.10 0.20 ± 0.10 0.40 ± 0.05 0.38 0.89 1.27 0.20 0.40
0306 0306
(0.063 ± 0.008) (0.032 ± 0.006 (0.010 ± 0.004) (0.008± 0.004) (0.015 ± 0.002) (0.015) (0.035) (0.050) (0.008) (0.015)
2.03 ± 0.20 1.27 ± 0.20 0.30 ± 0.10 0.25 ± 0.15 0.50 ± 0.05
0508 0.64 1.27 1.91 0.28 0.50
(0.080 ± 0.008) (0.050 ± 0.008) (0.012 ± 0.004) (0.010± 0.006) (0.020 ± 0.002) 0508
(0.025) (0.050) (0.075) (0.011) (0.020)
3.20 ± 0.20 1.60 ± 0.20 0.50 ± 0.10 0.25 ± 0.15 0.80 ± 0.10
0612 0.89 1.65 2.54 0.45 0.80
(0.126 ± 0.008) (0.063 ± 0.008) (0.020 ± 0.004) (0.010 ± 0.006) (0.031 ± 0.004) 0612
(0.035) (0.065) (0.010) (0.018) (0.031)
072522

LGA Low Inductance Capacitors
0204/0306 Land Grid Array
Land Grid Array (LGA) capacitors are the latest family of low inductance MLCCs from KYOCERA AVX. These new
LGA products are the third low inductance family developed by KYOCERA AVX. The innovative LGA technology
sets a new standard for low inductance MLCC performance.
Our initial 2 terminal versions of LGA technology deliver the performance of an 8 terminal IDC low inductance
MLCC with a number of advantages including:
• Simplified layout of 2 large solder pads compared to 8 small pads for IDCs
• Opportunity to reduce PCB or substrate contribution to system ESL by using multiple parallel vias in
solder pads
• Advanced FCT manufacturing process used to create uniformly flat terminations on the capacitor
that resist “tombstoning”
• Better solder joint reliability
APPLICATIONS
Semiconductor Packages Board Level Device Decoupling

• Microprocessors/CPUs • Frequencies of 300 MHz or more
• Graphics Processors/GPUs • ICs drawing 15W or more
• Chipsets • Low voltages
• FPGAs • High speed buses
• ASICs
0306 2 TERMINAL LGA COMPARISON WITH 0306 8 TERMINAL IDC
0.1
Impedance (Ω)
0.01
0.001
1 10 100 1000
Frequency (MHz)
051316

0204/0306 Land Grid Array
SIZE LG12 (0204) LG22 (0306)

Length mm (in.) 0.50 (0.020) 0.76 (0.030)
Width mm (in.) 1.00 (0.039) 1.60 (0.063)
Temp. Char. X5R (D) X7S (Z) X6S (W) X7R (C) X5R (D) X7S (Z) X6S (W)
Working Voltage 6.3 4 6.3 4 6.3 4 10 6.3 4 6.3 4 6.3 4 6.3 4
(6) (4) (6) (4) (6) (4) (Z) (6) (4) (6) (4) (6) (4) (6) (4)
Cap (μF) 0.010 (103)
0.022 (223)
0.047 (473)
0.100 (104)
0.220 (224)
0.330 (334)
0.470 (474)
1.000 (105)
2.200 (225)
= X7R = X5R = X7S = X6S
HOW TO ORDER
LG 1 2 6 Z 104 M A T 2 S 1
Style Case Number of Working Temperature Coded Cap Termination Termination Packaging Thickness Number of
Size Terminals Voltage Characteristic Cap Tolerance Style 100% Sn* Tape & Reel S = 0.55mm Capacitors
1 = 0204 2 4 = 4V C = X7R M = ±20% A = “U” Land *Contact factory for 2 = 7" Reel max
2 = 0306 6 = 6.3V D = X5R other termination 4 = 13" Reel
Z = 10V Z = X7S finishes
W = X6S
Reverse
Geometry LGA
LG12, LG22
BL
iew
L
To pV
e1 e2
T
Sid Sid
BL
BW
W L
PART DIMENSIONS MM (INCHES)

Series L W T BW BL
0.5 ± 0.05 1.00 ± 0.10 0.50 ± 0.05 0.8 ± 0.10 0.13 ± 0.08
LG12 (0204)
(0.020±0.002) (0.039 ± 0.004) (0.020 ± 0.002) (0.031 ± 0.004) (0.005 ± 0.003)
0.76 ± 0.10 1.60 ± 0.10 0.50 ± 0.05 1.50 ±0.10 0.28 ± 0.08
LG22 (0306)
(0.030 ± 0.004) (0.063 ± 0.004) (0.020 ± 0.002) (0.059 ± 0.004) (0.011 ± 0.003)
RECOMMENDED SOLDER PAD DIMENSIONS MM (INCHES)
Series PL PW1 G
PL
G LG12 (0204) 0.50 (0.020) 1.00 (0.039) 0.20 (0.008)

LG22 (0306) 0.65 (0.026) 1.50 (0.059) 0.20 (0.008)
PW1
051316

0204/0306 Land Grid Array – Tin/Lead Termination “B”
SIZE PG12 (0204) PG22 (0306)
Length mm (in.) 0.50 (0.020) 0.76 (0.030)
Width mm (in.) 1.00 (0.039) 1.60 (0.063)
Temp. Char. X5R (D) X7S (Z) X6S (W) X7R (C) X5R (D) X7S (Z) X6S (W)
Working Voltage 6.3 4 6.3 4 6.3 4 10 6.3 4 6.3 4 6.3 4 6.3 4
(6) (4) (6) (4) (6) (4) (Z) (6) (4) (6) (4) (6) (4) (6) (4)
Cap (μF) 0.010 (103)
0.022 (223)
0.047 (473)
0.100 (104)
0.220 (224)
0.330 (334)
0.470 (474)
1.000 (105)
2.200 (225)
= X7R = X5R = X7S = X6S
HOW TO ORDER
PG 1 2 6 Z 104 M A B 2 S 1
Style Case Number of Working Temperature Coded Cap Termination Termination Packaging Thickness Number of
Size Terminals Voltage Characteristic Cap Tolerance Style 5% Min Lead Tape & Reel S = 0.55mm Capacitors
1 = 0204 2 4 = 4V C = X7R M = ±20% A = “U” Land 2 = 7" Reel max
2 = 0306 6 = 6.3V D = X5R 4 = 13" Reel
Z = 10V Z = X7S
W = X6S
Reverse
Reverse
GeometryLGA
Geometry LGA
PG12, PG22
LG12, LG22
BL
w
Vie
Top
L
e1 e2
T
Sid Sid
BL
BW
W L
PART DIMENSIONS MM (INCHES)

Series L W T BW BL
0.5 ± 0.05 1.00 ± 0.10 0.50 ± 0.05 0.8 ± 0.10 0.13 ± 0.08
PG12 (0204)
(0.020±0.002) (0.039 ± 0.004) (0.020 ± 0.002) (0.031 ± 0.004) (0.005 ± 0.003)
0.76 ± 0.10 1.60 ± 0.10 0.50 ± 0.05 1.50 ±0.10 0.28 ± 0.08
PG22 (0306)
(0.030 ± 0.004) (0.063 ± 0.004) (0.020 ± 0.002) (0.059 ± 0.004) (0.011 ± 0.003)
RECOMMENDED SOLDER PAD DIMENSIONS MM (INCHES)
Series PL PW1 G
PL
G PG12 (0204) 0.50 (0.020) 1.00 (0.039) 0.20 (0.008)

PG22 (0306) 0.65 (0.026) 1.50 (0.059) 0.20 (0.008)
PW1
051316

High Temperature MLCCs
AT Series – 200ºC & 250°C Rated
Present military specifications, as well as a majority of commercial applications, require a maximum operating
temperature of 125°C. However, the emerging market for high temperature electronics demands capacitors
operating reliably at temperatures beyond 125°C. KYOCERA AVX’s high temperature chip capacitor product
line, has been extended with the BME C0G chip. All AT chips have verified capabilities of long term operation
up to 250°C for applications in both military and commercial businesses. These capacitors demonstrate high
volumetric efficiency, high insulation resistance and low ESR/ESL for the most demanding applications, such
as “down-hole” oil exploration and aerospace programs.
HOW TO ORDER
AT10 3 T 104 K A T 2 A
Style Voltage Temperature Capacitance Code Capacitance Test Level Termination Packaging Special
AT03 = 0603 Code Coefficient (2 significant digits Tolerance A = Standard 1 = Pd/Ag 2 = 7" Reel Code
AT05 = 0805 16V = Y PME + no. of zeros) J = ±5% T = 100% Sn Plated 4 = 13" Reel A = Standard
AT06 = 1206 25V = 3 C0G 250°C = A 101 = 100pF K = ±10% (RoHS Compliant) 9 = Bulk
AT10 = 1210 50V = 5 C0G 200°C = 2 102 = 1nF M = ±20% 7 = Ni/Au Plated
AT12 = 1812 VHT 250°C = T 103 = 10nF (For 250°C BME
AT14 = 2225 VHT 200°C = 4 104 = 100nF C0G Only)
BME 105 = 1μF
C0G 250°C = 5
C0G 200°C = 3
ELECTRICAL SPECIFICATIONS
Temperature Coefficient Insulation Resistance 25°C (MIL-STD-202, Method 302)
PME C0G 0±30ppm/°C, -55C to 250°C 100GΩ or 1000MΩ-μF (whichever is less)
BME C0G 0±30ppm/°C, -55C to 200°C Insulation Resistance 125°C (MIL-STD-202, Method 302)
See TCC Plot for +250°C 10GΩ or 100MΩ-μF (whichever is less)
VHT: T ±15%, -55°C to +150°C Insulation Resistance 200°C (MIL-STD-202, Method 302)
See TCC Plot for +250°C 1GΩ or 10MΩ-μF (whichever is less)
Capacitance Test (MIL-STD-202, Method 305) Insulation Resistance 250°C (MIL-STD-202, Method 302)
25°C, 1.0 ± 0.2 Vrms (open circuit voltage) @ 1kHz 100MΩ or 1MΩ-μF (whichever is less)
Dissipation factor 25°C Direct Withstanding Voltage 25°C (Flash Test)
C0G: 0.15% Max at 1.0 ± 0.2 Vrms (open circuit voltage) @ 1kHz 250% rated voltage for 5 seconds with 50mA max charging current
VHT: 2.5% Max at 1.0 ± 0.2 Vrms (open circuit voltage) @ 1kHz
DIMENSIONS: MILLIMETERS (INCHES)

Size AT03 = 0603 AT05= 0805 AT06=1206 AT10=1210 AT12=1812 AT14=2225
1.60 ± 0.15 2.01 ± 0.20 3.20 ± 0.20 3.20 ± 0.20 4.50 ± 0.30 5.72 ± 0.25
(L) Length
(0.063 ± 0.006) (0.079 ± 0.008) (0.126 ± 0.008) (0.126 ± 0.008) (0.177 ± 0.012) (0.225 ± 0.010)
0.81 ± 0.15 1.25 ± 0.20 1.60 ± 0.20 2.50 ± 0.20 3.20 ± 0.20 6.35 ± 0.25
(W) Width
(0.032 ± 0.006) (0.049 ± 0.008) (0.063 ± 0.008) (0.098 ± 0.008) (0.126 ± 0.008) (0.250 ± 0.010)
1.02 1.30 1.52 1.70 2.54 2.54
(T) Thickness Max.
(0.040) (0.051) (0.060) (0.067) (0.100) (0.100)
(t) min. 0.25 (0.010) 0.25 (0.010) 0.25 (0.010) 0.25 (0.010) 0.25 (0.010) 0.25 (0.010)
terminal max. 0.75 (0.030) 0.75 (0.030) 0.75 (0.030) 0.75 (0.030) 1.02 (0.040) 1.02 (0.040)
080416

High Temperature MLCC
Typical Temperature Coefficient of Capacitance (VHT Dielectric) Typical Temperature Coefficient of Capacitance (C0G Dielectric)
15 1.5
1 BME
-13.75
0.5
C (%)
C (%)
+30ppm/°C
-42.5
0
PME
-71.25 -30 ppm/°C
-0.5
-100 -1
-50 -25 0 25 50 75 100 125 150 175 200 225 250 -50 -25 0 25 50 75 100 125 150 175 200 225 250
Temperature (°C)
Temperature (°C)
Typical Voltage Coefficient of Capacitance (VHT Dielectric) Typical Voltage Coefficient of Capacitance (C0G Dielectric)
5 1
0.8
0 Legend: 0.6
Capacitor’s Rated
Voltage 0.4
-5 0.2
C (%)
C (%)
16VDC
25VDC
50VDC 0
-10 100VDC -0.2
200VDC
-0.4
-15 -0.6
-0.8
-20 -1
0 10 20 30 40 50 60 70 80 90 100 0 10 20 30 40 50 60 70 80 90 100
Percentage of Rated Voltage Percentage of Rated Voltage
Typical RC vs Temperature (VHT Dielectric) Typical RC vs Temperature (C0G Dielectric)
10000 1000000
100000
1000
10000
RC (Ω*F)
RC (Ω*F)
100 1000
100
10
10
1 1
25 50 75 100 125 150 175 200 225 250 25 50 75 100 125 150 175 200 225 250
Temperature (°C) Temperature (°C)
080416

RELIABILITY
250°C Life Test @ 2x Rated Voltage (VHT Dielectric) 250°C Life Test @ 2x Rated Voltage (C0G Dielectric)
1.1 48000
AT05YT104
AT103T104
Capacitance ( F)
Capacitance (pF)
0.825 AT123T334
36000
AT143A473
AT143T105
AT123A123
0.55 24000
0.275 12000
0 0
0 250 500 750 1000 0 250 500 750 1000
Time (hrs) Time (hrs)
VHT - Failure Rate @ 90% Confidence Level (%/1000 hours) C0G - Failure Rate @ 90% Confidence Level (%/1000 hours)
Temperature (°C) 50% Rated Voltage 100% Rated Voltage Temperature (°C) 50% Rated Voltage 100% Rated Voltage
200 0.002 0.017 200 0.006 0.047
250 0.026 0.210 250 0.074 0.590
*Typical 1210, 1812, 2225 Failure Rate Analysis based on 250°C testing and *Typical 1812 and 2225 Failure Rate Analysis based on 250°C testing and
voltage ratings specified on the following page. voltage ratings specified on the following page.
FREQUENCY RESPONSE
Impedance Frequency Response (VHT Dielectric) Impedance Frequency Response (C0G Dielectric)
1E+05 1E+06
AT05YT104 AT143A473
1E+04 AT123T334 1E+05 AT123A123
AT143T105
1E+04
)
)
1E+03
Impedance (
Impedance (
1E+03
1E+02
1E+02
1E+01
1E+01
1E+00
1E+00
1E-01 1E-01
1E-02 1E-02
1E+01 1E+02 1E+03 1E+04 1E+05 1E+06 1E+07 1E+08 1E+01 1E+02 1E+03 1E+04 1E+05 1E+06 1E+07 1E+08
Frequency (Hz) Frequency (Hz)
ESR Frequency Response (VHT Dielectric) ESR Frequency Response (C0G Dielectric)
1E+03 1E+03
AT05YT104 AT143A473
AT123T334 AT123A123
AT143T105 1E+02
1E+02
1E+01
)
1E+01
)
ESR (
ESR (
1E+00
1E+00
1E-01
1E-01 1E-02
1E-02 1E-03
1E+01 1E+02 1E+03 1E+04 1E+05 1E+06 1E+07 1E+08 1E+01 1E+02 1E+03 1E+04 1E+05 1E+06 1E+07 1E+08
Frequency (Hz) Frequency (Hz)

080416

CAPACITANCE RANGE
VHT Temp. Coefficient: 4 200ºC Rated VHT Temp. Coefficient: T 250ºC Rated
AT03 = AT05 = AT06 = AT10 = AT12 = AT14 = AT03 = AT05 = AT06 = AT10 = AT12 = AT14 =
Case Size Case Size
0603 0805 1206 1210 1812 2225 0603 0805 1206 1210 1812 2225
Soldering Reflow/Wave Reflow/Wave Reflow/Wave Reflow Only Reflow Only Reflow Only Soldering Reflow/Wave Reflow/Wave Reflow/Wave Reflow Only Reflow Only Reflow Only
mm 1.60 ± 0.15 2.01 ± 0.20 3.20 ± 0.20 3.20 ± 0.20 4.50 ± 0.30 5.72 ± 0.25 mm 1.60 ± 0.15 2.01 ± 0.20 3.20 ± 0.20 3.20 ± 0.20 4.50 ± 0.30 5.72 ± 0.25
(L) Length (L) Length
(in.) (0.063 ± 0.006) (0.079 ± 0.008) (0.126 ± 0.008) (0.126 ± 0.008) (0.177 ± 0.012) (0.225 ± 0.010) (in.) (0.063 ± 0.006) (0.079 ± 0.008) (0.126 ± 0.008) (0.126 ± 0.008) (0.177 ± 0.012) (0.225 ± 0.010)
mm 0.81 ± 0.15 1.25 ± 0.20 1.60 ± 0.20 2.50 ± 0.20 3.20 ± 0.20 6.35 ± 0.25 mm 0.81 ± 0.15 1.25 ± 0.20 1.60 ± 0.20 2.50 ± 0.20 3.20 ± 0.20 6.35 ± 0.25
(W) Width (W) Width
(in.) (0.032 ± 0.006) (0.049 ± 0.008) (0.063 ± 0.008) (0.098 ± 0.008) (0.126 ± 0.008) (0.250 ± 0.010) (in.) (0.032 ± 0.006) (0.049 ± 0.008) (0.063 ± 0.008) (0.098 ± 0.008) (0.126 ± 0.008) (0.250 ± 0.010)
mm 1.02 1.30 1.52 1.70 2.54 2.54 mm 1.02 1.30 1.52 1.70 2.54 2.54
(T) Thickness (T) Thickness
(in.) (0.040) (0.051) (0.060) (0.067) (0.100) (0.100) (in.) (0.040) (0.051) (0.060) (0.067) (0.100) (0.100)
min 0.25 (0.010) 0.25 (0.010) 0.25 (0.010) 0.25 (0.010) 0.25 (0.010) 0.25 (0.010) min 0.25 (0.010) 0.25 (0.010) 0.25 (0.010) 0.25 (0.010) 0.25 (0.010) 0.25 (0.010)
(t) Terminal (t) Terminal
max 0.75 (0.030) 0.75 (0.030) 0.75 (0.030) 0.75 (0.030) 1.02 (0.040) 1.02 (0.040) max 0.75 (0.030) 0.75 (0.030) 0.75 (0.030) 0.75 (0.030) 1.02 (0.040) 1.02 (0.040)
Rated Temp. (ºC) 200 200 200 200 200 200 Rated Temp. (ºC) 250 250 250 250 250 250
Temp. Coefficeint 4 4 4 4 4 4 Temp. Coefficeint T T T T T T
Voltage (V) 25 25 50 25 50 25 50 50 50 Voltage (V) 16 16 25 16 25 16 25 25 25
1000 102 1000 102
1200 122 1200 122
1500 152 1500 152
1800 182 1800 182
2200 222 2200 222
Cap 2700 272 Cap 2700 272
(pF) 3300 332 (pF) 3300 332
3900 392 3900 392
4700 472 4700 472
5600 562 5600 562
6800 682 6800 682
8200 822 8200 822
0.010 103 0.010 103
0.012 123 0.012 123
0.015 153 0.015 153
0.018 183 0.018 183
0.022 223 0.022 223
0.027 273 0.027 273
0.033 333 0.033 333
0.039 393 0.039 393
0.047 473 0.047 473
0.056 563 0.056 563
0.068 683 0.068 683
0.082 823 0.082 823

Cap Cap
0.100 104 0.100 104
(μF) (μF)
0.120 124 0.120 124
0.150 154 0.150 154
0.180 184 0.180 184
0.220 224 0.220 224
0.270 274 0.270 274
0.330 334 0.330 334
0.390 394 0.390 394
0.470 474 0.470 474
0.560 564 0.560 564
0.680 684 0.680 684
0.820 824 0.820 824
1.000 105 1.000 105
Voltage (V) 25 25 50 25 50 25 50 50 50 Voltage (V) 16 16 25 16 25 16 25 25 25
Rated Temp. (ºC) 200 200 200 200 200 200 Rated Temp. (ºC) 250 250 250 250 250 250
AT03 = AT05 = AT06 = AT10 = AT12 = AT14 = AT03 = AT05 = AT06 = AT10 = AT12 = AT14 =
Case Size Case Size
0603 0805 1206 1210 1812 2225 0603 0805 1206 1210 1812 2225
Voltage rating per table. Capacitance values specified at 25ºC, derate capacitance value based on TCC and VCC Plots on page 107.
NOTE: Contact factory for non-specified capacitance values.
080416

CAPACITANCE RANGE
BME C0G Temp. Coefficient: 4 200ºC Rated BME C0G (Ni/Au) Temp. Coefficient: 5 250ºC Rated
Case Size AT03=0603 AT05=0805 AT06=1206 Case Size AT03=0603 AT05=0805 AT06 = 1206
Soldering Reflow/Wave Reflow/Wave Reflow/Wave Soldering Reflow/Wave Reflow/Wave Reflow/Wave
(L) Length mm 1.60 ± 0.15 2.01 ± 0.20 3.20 ± 0.20 (L) Length mm 1.60 ± 0.15 2.01 ± 0.20 3.20 ± 0.20
(in.) (0.063 ± 0.006) (0.079 ± 0.008) (0.126 ± 0.008) (in.) (0.063 ± 0.006) (0.079 ± 0.008) (0.126 ± 0.008)
(W) Width mm 0.81 ± 0.15 1.25 ± 0.20 1.60 ± 0.20 (W) Width mm 0.81 ± 0.15 1.25 ± 0.20 1.60 ± 0.20
(in.) (0.032 ± 0.006) (0.049 ± 0.008) (0.063 ± 0.008) (in.) (0.032 ± 0.006) (0.049 ± 0.008) (0.063 ± 0.008)
(T) Thickness mm 1.02 1.30 1.52 (T) mm 1.02 1.30 1.52
(in.) (0.040) (0.051) (0.060) Thickness (in.) (0.040) (0.051) (0.060)
(t) Terminal min 0.25 (0.010) 0.25(0.010) 0.25 (0.010) (t) min 0.25 (0.010) 0.25(0.010) 0.25 (0.010)
max 0.75(0.030) 0.75(0.030) 0.75 (0.030) Terminal max 0.75 (0.030) 0.75(0.030) 0.75 (0.030)
Rated Temp. (ºC) 200 200 200 Rated Temp. (ºC) 250 250 250
Temp. Temp.
3 3 3 5 5 5
Coefficeint Coefficeint
Voltage (V) 25 50 25 50 25 50 Voltage (V) 25 25 25
Cap 39 390 Cap 39 390
(pF) (pF)
47 470 47 470
56 560 56 560
68 680 68 680
82 820 82 820
100 101 100 101
120 121 120 121
150 151 150 151
180 181 180 181
220 221 220 221
270 271 270 271
330 331 330 331
390 391 390 391
470 471 470 471
560 561 560 561
680 681 680 681
820 821 820 821
1000 102 1000 102
1200 122 1200 122
1500 152 1500 152
1800 182 1800 182
2200 222 2200 222
2700 272 2700 272
3300 332 3300 332
3900 392 3900 392
4700 472 4700 472
5600 562 5600 562
6800 682 6800 682
8200 822 8200 822
Cap 0.010 103 Cap 0.010 103
(μF) (μF)
0.012 123 0.012 123
0.015 153 0.015 153
0.018 183 0.018 183
0.022 223 0.022 223
0.027 273 0.027 273
0.033 333 0.033 333
0.039 393 0.039 393
0.047 473 0.047 473
0.056 563 0.056 563
0.068 683 0.068 683
0.082 823 0.082 823
0.100 104 0.100 104
Voltage (V) 25 50 25 50 25 50 Voltage (V) 25 25 25
Rated Temp. (ºC) 200 200 200 200 200 200 Rated Temp. (ºC) 250 250 250
Case Size AT03=0603 AT05=0805 AT06=1206 Case Size AT03=0603 AT05=0805 AT06=1206
080416

CAPACITANCE RANGE
PME C0G Temp. Coefficient: 2 200ºC Rated PME C0G Temp. Coefficient: A 250ºC Rated
Case Size AT05 = 0805 AT06 = 1206 AT10 = 1210 AT12 = 1812 AT14 = 2225 Case Size AT05 = 0805 AT06 = 1206 AT10 = 1210 AT12 = 1812 AT14 = 2225
Soldering Reflow/Wave Reflow/Wave Reflow Only Reflow Only Reflow Only Soldering Reflow/Wave Reflow/Wave Reflow Only Reflow Only Reflow Only
mm 2.01 ± 0.20 3.20 ± 0.20 3.20 ± 0.20 4.50 ± 0.30 2.75 ± 0.25 mm 2.01 ± 0.20 3.20 ± 0.20 3.20 ± 0.20 4.50 ± 0.30 2.75 ± 0.25
(L) Length (L) Length
(in.) (0.079 ± 0.008) (0.126 ± 0.008) (0.126 ± 0.008) (0.177 ± 0.012) (0.225 ± 0.010) (in.) (0.079 ± 0.008) (0.126 ± 0.008) (0.126 ± 0.008) (0.177 ± 0.012) (0.225 ± 0.010)
mm 1.25 ± 0.20 1.60 ± 0.20 2.50 ± 0.20 3.20 ± 0.20 6.35 ± 0.25 mm 1.25 ± 0.20 1.60 ± 0.20 2.50 ± 0.20 3.20 ± 0.20 6.35 ± 0.25
(W) Width (W) Width
(in.) (0.049 ± 0.008) (0.063 ± 0.008) (0.098 ± 0.008) (0.126 ± 0.008) (0.250 ± 0.010) (in.) (0.049 ± 0.008) (0.063 ± 0.008) (0.098 ± 0.008) (0.126 ± 0.008) (0.250 ± 0.010)
mm 1.30 1.52 1.70 2.54 2.54 mm 1.30 1.52 1.70 2.54 2.54
(T) Thickness (T) Thickness
(in.) (0.051) (0.060) (0.067) (0.100) (0.100) (in.) (0.051) (0.060) (0.067) (0.100) (0.100)
min 0.25 (0.010) 0.25 (0.010) 0.25 (0.010) 0.25 (0.010) 0.25 (0.010) min 0.25 (0.010) 0.25 (0.010) 0.25 (0.010) 0.25 (0.010) 0.25 (0.010)
(t) Terminal (t) Terminal
max 0.75 (0.030) 0.75 (0.030) 0.75 (0.030) 1.02 (0.040) 1.02 (0.040) max 0.75 (0.030) 0.75 (0.030) 0.75 (0.030) 1.02 (0.040) 1.02 (0.040)
Rated Temp. (ºC) 200 200 200 200 200 Rated Temp. (ºC) 250 250 250 250 250
Temp. Coefficeint 2 2 2 2 2 Temp. Coefficeint A A A A A
Voltage (V) 50 50 50 50 50 Voltage (V) 25 25 25 25 25
100 101 100 101
120 121 120 121
150 151 150 151
180 181 180 181
220 221 220 221
270 271 270 271
330 331 330 331
390 391 390 391
470 471 470 471
560 561 560 561
680 681 680 681
Cap 820 821 Cap 820 821
(pF) 1000 102 (pF) 1000 102
1200 122 1200 122
1500 152 1500 152
1800 182 1800 182
2200 222 2200 222
2700 272 2700 272
3300 332 3300 332
3900 392 3900 392
4700 472 4700 472
5600 562 5600 562
6800 682 6800 682
8200 822 8200 822
0.010 103 0.010 103
0.012 123 0.012 123
0.015 153 0.015 153
0.018 183 0.018 183
0.022 223 0.022 223
0.027 273 0.027 273
Cap Cap
0.033 333 0.033 333
(μF) (μF)
0.039 393 0.039 393
0.047 473 0.047 473
0.056 563 0.056 563
0.068 683 0.068 683
0.082 823 0.082 823
0.100 104 0.100 104
Voltage (V) 50 50 50 50 50 Voltage (V) 25 25 25 25 25
Rated Temp. (ºC) 200 200 200 200 200 Rated Temp. (ºC) 250 250 250 250 250
Case Size AT05 = 0805 AT06 = 1206 AT10 = 1210 AT12 = 1812 AT14 = 2225 Case Size AT05 = 0805 AT06 = 1206 AT10 = 1210 AT12 = 1812 AT14 = 2225
080416

For 600V to 5000V Applications
High value, low leakage and small size are difficult parameters to obtain in capacitors for high voltage systems.
KYOCERA AVX special high voltage MLC chip capacitors meet these performance characteristics and are
designed for applications such as snubbers in high frequency power converters, resonators in SMPS, and high
voltage coupling/dc blocking. These high voltage chip designs exhibit low ESRs at high frequencies.
Larger physical sizes than normally encountered chips are used to make high voltage MLC chip products. Special
precautions must be taken in applying these chips in surface mount assemblies. The temperature gradient during
heating or cooling cycles should not exceed 4ºC per second. The preheat temperature must be within 50ºC of
the peak temperature reached by the ceramic bodies through the soldering process. Chip sizes 1210 and larger
should be reflow soldered only. Capacitors may require protective surface coating to prevent external arcing.
For 1825, 2225 and 3640 sizes, KYOCERA AVX offers leaded version in either thru-hole or SMT configurations (for
details see section on high voltage leaded MLC chips)
NEW 630V RANGE
HOW TO ORDER
1808 A A 271 M A T 2 A
Style Voltage Temperature Capacitance Capacitance Test Level Termination* Packaging Special
0805 C = 600V/630V Coefficient Code Tolerance A = Standard T = Plated Ni and Sn 2 = 7” Reel** Code
1206 A = 1000V A = NPO (C0G) (2 significant digits C0G: J = ±5% (RoHS Compliant) 4 = 13” Reel** A = Standard
1210 S = 1500V C = X7R + no. of zeros) K = ±10% 6 = Tray (3640 Style)
1808 G = 2000V Examples: M = ±20%
1812 W = 2500V 10 pF = 100 X7R: K = ±10%
1825 H = 3000V 100 pF = 101 M = ±20%
2220 J = 4000V 1,000 pF = 102 Z = +80%,
2225 K = 5000V 22,000 pF = 223 -20%
3640 220,000 pF = 224
*** 1 μF = 105
Notes:
1. Capacitors with X7R dielectrics are not intended for applications across AC supply mains or AC line filtering with polarity reversal. Contact plant for recommendations. Contact
factory for availability of Termination and Tolerance options for Specific Part Numbers.
2. *Terminations with 5% minimum lead (Pb) is available, see pages 100 and 101 for LD style.
Leaded terminations are available, see pages 102-106.
**The 3640 Style is not available on Reels.
*** KYOCERA AVX offers nonstandard chip sizes. Contact factory for details.
DIMENSIONS: millimeters (inches)

SIZE 0805 1206 1210* 1808* 1812* 1825* 2220* 2225* 3640*
2.10 ± 0.20 3.30 ± 0.30 3.30 ± 0.40 4.60 ± 0.50 4.60 ± 0.50 4.60 ± 0.50 5.70 ± 0.50 5.70 ± 0.50 9.14 ± 0.25
(L) Length
(0.083 ± 0.008) (0.130 ± 0.012) (0.130 ± 0.016) (0.181 ± 0.020) (0.181 ± 0.020) (0.181 ± 0.020) (0.224 ± 0.020) (0.224 ± 0.020) (0.360 ± 0.010)
1.25 ± 0.20 1.60 ± 0.20 2.50 ± 0.30 2.00 ± 0.20 3.20 ± 0.30 6.30 ± 0.40 5.00 ± 0.40 6.30 ± 0.40 10.2 ± 0.25
(W) Width
(0.049 ±0.008) (0.063 ± 0.008) (0.098 ± 0.012) (0.079 ± 0.008) (0.126 ± 0.012) (0.248 ± 0.016) (0.197 ± 0.016) (0.248 ± 0.016) (0.400 ± 0.010)
min. 0.50 ± 0.20 0.60 ± 0.20 0.75 ± 0.35 0.75 ± 0.35 0.75 ± 0.35 0.75 ± 0.35 0.85 ± 0.35 0.85 ± 0.35 0.76 (0.030)
(t) terminal
max. (0.020 ± 0.008) (0.024 ± 0.008) (0.030 ± 0.014) (0.030 ± 0.014) (0.030 ± 0.014) (0.030 ± 0.014) (0.033 ± 0.014) (0.033 ± 0.014) 1.52 (0.060)
*Reflow Soldering Only
072922

NP0 (C0G) DIELECTRIC – PERFORMANCE CHARACTERISTICS
Capacitance Range 10 pF to 0.100 μF (25°C, 1.0 ±0.2 Vrms at 1kHz, for ≤ 1000 pF use 1 MHz)
Capacitance Tolerances ±5%, ±10%, ±20%
Dissipation Factor 0.1% max. (+25°C, 1.0 ±0.2 Vrms, 1kHz, for ≤ 1000 pF use 1 MHz)
Operating Temperature Range -55°C to +125°C
Temperature Characteristic 0 ±30 ppm/°C (0 VDC)
Voltage Ratings 600, 630, 1000, 1500, 2000, 2500, 3000, 4000 & 5000 VDC (+125°C)
Insulation Resistance (+25°C, at 500 VDC) 100K MΩ min. or 1000 MΩ - μF min., whichever is less
Dielectric Strength Minimum 120% rated voltage for 5 seconds at 50 mA max. current
NPO (C0G) CAPACITANCE RANGE – PREFERRED SIZES ARE SHADED

Case Size 0805 1206 1210 1808 1812
Soldering Reflow/Wave Reflow/Wave Reflow Only Reflow Only Reflow Only
(L) Length mm 2.10 ± 0.20 3.30 + 0.30 3.30 + 0.40 4.60 + 0.50 4.60 + 0.50
(in.) (0.085 ± 0.008) (0.130 + 0.012) (0.130 + 0.016) (0.181 + 0.020) (0.181 + 0.020)
W) Width mm 1.25 ± 0.2 0 1.60 +0.30/-0.10 2.50 + 0.30 2.00 + 0.20 3.20 + 0.30
(in.) (0.049 ± 0.008) (0.063 +0.012/-0.004) (0.098 + 0.012) (0.079 + 0.008) (0.126 + 0.012)
(t) Terminal mm 0.50 + 0.20 0.60 + 0.20 0.75 + 0.35 0.75 + 0.35 0.75 + 0.35
(in.) (0.020 + 0.008) (0.0 4 + 0.008) (.030 + 0.014) (.030 + 0.014) (.030 + 0.014)
Voltage (V) 600 630 1000 600 630 1000 1500 2000 600 630 1000 1500 2000 3000 600 630 1000 1500 2000 2500 3000 4000 600 630 1000 1500 2000 2500 3000 4000
Cap (pF) .5 0R5 A C
1.0 1R0 A C
1.2 1R2 A C
1.5 1R5 A A C X X X X X
1.8 1R8 A A C X X X X X
2.2 2R2 A A C X X X X X C C C C C
2.7 2R7 A A C X X X X X C C C C C C C
10 100 A A C C C C C C C C C C C F C C C C C C C C C C C C C C C E
22 220 A A C C C C C C C C C C C F C C C C C C C E C C C C C C C E
27 270 A A C C C C C C C C C C C F C C C C C C C E C C C C F C C E
33 330 A A C C C C C C C C C C C F C C C C C C C F C C C C F C C E
56 560 A A C C C C C C C C C C C F C C C C C C C C C C C F C C F
68 680 A A C C C C C C C C C C C F C C C C C C C C C C C F C C F
82 820 X X X C C C C C C C C C C F C C C C C C C C C C C F C C F
100 101 X X X C C C C C C C C C C F C C C C C F F C C C C F C C F
120 121 C C C C C C E E C C C C C F C C C C C F F C C C C F C C G
150 151 C C C C C C E E C C C E E F C C C F F F F C C C C F C C G
180 181 C C C C C E E E C C E E E F C C C F F F F C C C C F F F
220 221 C C C C C E E E C C E E E F C C C F F F F C C C C F F F
270 271 C C C C C E E E C C E E E G C F C F F F F C C C C F F F
330 331 C C C C C E E E C C E E E C F F F F F F C C C F F F F
390 391 C C C C C E E E C C E E E C F F F F F F C C C F F F F
470 471 C C C C E E E C C E E E C F F F F F F C C F F F F F
560 561 C C C C E C C E E E C F F F F F C C F F F F F
680 681 C C C C E C C E E E C F F F F C C F F F G G
750 751 C C E E E C C E E E C F F F F C C F F F G G
820 821 C C E E E C C E E E C F F E F C C F F F G G
1000 102 C E E E C C E F F C F F E F C C F F F G G
1200 122 C E E E C C E F F C F F E F C C F E E
1500 152 C E E C C F G G E F F F C C F F F
1800 182 C E E C C G G G E F F F C C F G F
2200 222 C E E C C G E F F C C E G G
2700 272 E E C C G E F F C C E G G
3300 332 E E C C G E F F C C F G
3900 392 E E C C G E F C C F
4700 472 E E C C E F C C G
5600 562 E E E F C C G
6800 682 E E F F C C
8200 822 F F F E C
Cap (µF) 0.010 103 F F F F F
0.012 123 F F F F
0.015 153 G G G G
0.018 183 G G
0.022 223 F
0.027 273 G
0.033 333 G
0.047 473
0.056 563
0.068 683
0.100 104
Voltage (V) 600 630 1000 600 630 1000 1500 2000 600 630 1000 1500 2000 3000 600 630 1000 1500 2000 2500 3000 4000 600 630 1000 1500 2000 2500 3000 4000
Case Size 0805 1206 1210 1808 1812
Letter A C E F G X 7 NOTE: Contact factory for non-specified capacitance values

Max. 0.81 1.45 1.80 2.20 2.80 0.94 3.30
Thickness (0.032) (0.057) (0.071) (0.087) (0.110) (0.037) (0.130)
072222

NP0 (C0G) CAPACITANCE RANGE – PREFERRED SIZES ARE SHADED
Case Size 1825 2220 2225 3640
mm 4.60 ± 0.50 5.70 ± 0.50 5.70 ± 0.50 9.14 ± 0.25
(L) Length
(in.) (0.181 ± 0.020) (0.224 ± 0.020) (0.224 ± 0.020) (0.360 ± 0.010)
mm 6.30 ± 0.40 5.00 ± 0.40 6.30 ± 0.40 10.2 ± 0.25
W) Width
(in.) (0.248 ± 0.016) (0.197 ± 0.016) (0.248 ± 0.016) (0.400 ± 0.010)
mm 0.75 ± 0.35 0.85 ± 0.35 0.85 ± 0.35 0.76 (0.030)
(t) Terminal
max (0.030 ± 0.014) (0.033 ± 0.014) (0.033 ± 0.014) 1.52 (0.060)
Voltage (V) 600 630 1000 1500 2000 2500 3000 4000 600 630 1000 1500 2000 2500 3000 4000 5000 600 630 1000 1500 2000 2500 3000 4000 5000 600 630 1000 1500 2000 2500 3000 4000 5000
Cap (pF) 1.5 1R5
1.8 1R8
2.2 2R2
2.7 2R7
3.3 3R3
3.9 3R9
4.7 4R7
5.6 5R6
6.8 6R8
8.2 8R2
10 100 E E G E F E F F E E E E E E E E E E E E E E E E F F
47 470 E E G E F E F F E E E E E E E E E E E E E E E E F G G
100 101 E E G E F E F F E E E E E E E E E E E E E E E E G G G G G G G G
180 181 E E G E F E F F E E E E E E E F F E E E E E E E G G G G G G G G
220 221 E E G E F E F F E E E E E E E F F E E E E E E E G G G G G G G G
270 271 E E G E F E F F E E E E E E E E E E E E E E G G G G G G G G
330 331 E E G E F E F F E E E E E E E E E E E E E E G G G G G G G
390 391 E E G E F E F E E E E E E E E E E E E E E G G G G G G G
680 681 E E G E F F G E E E E E F F E E E E E E E G G G G G G
750 751 E E G E F F G E E E E E F F E E E E E E E G G G G G G
820 821 E E G E F F G E E E E E F F E E E E E F E G G G G G G
1000 102 E E G E F F G E E E E E F F E E E E E E E G G G G G G G G
1200 122 E E G E F G G E E E E E G G E E E E E F F G G G G G G G G
1500 152 E E G F G G G E E E F F G G E E E E E F F G G G G G G G
1800 182 E E G F G G G E E E F F G G E E E E E G G G G G G G G G
2200 222 E E G G G G E E E G G E E E E E G G G G G G G
2700 272 E E G G G G E E E G G E E E F F G G G G G G G
3300 332 E E G G G E E E G G E E E F F G G G G G G
3900 392 E E G G G E E E G G E E E G G G G G G G G
4700 472 E E G G G E E E G G F F F G G G G G G G
5600 562 F F G G G F F F G G F F F G G G G G G G
6800 682 F F G G F F F F F F G G G G G G G
8200 822 F F G G G G G G G G G G G G
Cap (μF) 0.010 103 F F G 7 7 7 G G G G G G G
0.012 123 F F G G G G G G
0.015 153 F F G G G G G
0.018 183 F F G G G G G
0.022 223 F F G G G G G
0.027 273 F F
0.033 333 F F G G G G
0.039 393 G G
0.047 473 G G G G G G
0.056 563 G G G G
0.068 683 G G G G
0.100 104
Voltage (V) 600 630 1000 1500 2000 2500 3000 4000 600 630 1000 1500 2000 2500 3000 4000 5000 600 630 1000 1500 2000 2500 3000 4000 5000 600 630 1000 1500 2000 2500 3000 4000 5000
Case Size 1825 2220 2225 3640

Max. 0.81 1.45 1.80 2.20 2.80 0.94 3.30
Thickness (0.032) (0.057) (0.071) (0.087) (0.110) (0.037) (0.130)
072022

X7R Dielectric
Performance Characteristics
Capacitance Range 10 pF to 0.82 µF (25°C, 1.0 ±0.2 Vrms at 1kHz)
Capacitance Tolerances ±10%; ±20%; +80%, -20%
Dissipation Factor 2.5% max. (+25°C, 1.0 ±0.2 Vrms, 1kHz)
Temperature Characteristic ±15% (0 VDC)
Insulation Resistance (+25°C, at 500 VDC) 100K MΩ min. or 1000 MΩ - µF min., whichever is less
Insulation Resistance (+125°C, at 500 VDC) 10K MΩ min. or 100 MΩ - µF min., whichever is less
X7R CAPACITANCE RANGE – PREFERRED SIZES ARE SHADED

Case Size 0805 1206 1210 1808 1812
mm 2.10 ± 0.20 3.30 ± 0.30 3.30 ± 0.40 4.60 ± 0.50 4.60 ± 0.50
(L) Length
(in.) (0.085 ± 0.008) (0.130 ± 0.012) (0.130 ± 0.016) (0.181 ± 0.020) (0.181 ± 0.020)
mm 1.25 ± 0.20 1.60 +0.30/-0.10 2.50 ± 0.30 2.00 ± 0.20 3.20 ± 0.30
W) Width
(in.) (0.049 ± 0.008) (0.063 +0.012/-0.004) (0.098 ± 0.012) (0.079 ± 0.008) (0.126 ± 0.012)
mm 0.50 ± 0.20 0.60 ± 0.20 0.75 ± 0.35 0.75 ± 0.35 0.75 ± 0.35
(t) Terminal
max (0.020 ± 0.008) (0.024 ± 0.008) (0.030 ± 0.014) (0.030 ± 0.014) (0.030 ± 0.014)
Voltage (V) 600 630 1000 600 630 1000 1500 2000 600 630 1000 1500 2000 600 630 1000 1500 2000 2500 3000 4000 600 630 1000 1500 2000 2500 3000 4000
Cap (pF) 100 101 X X C C C E E E E E E E E
120 121 X X C C C E E E E E E E E
150 151 X X C C C E E E E E E E E
180 181 X X C C C E E E E E E E E
220 221 X X C C C E E E E E E E E
270 271 X X C C C E E E E E E E E E E E E E
330 331 X X C C C E E E E E E E E E E E E E E F E E E E E
470 471 X X C C C E E E E E E E E E E E E E E F E E E E E E E
560 561 X X C C C E E E E E E E E E E E E E F F E E E E E E E
680 681 X X C C C E E E E E E E E E E E E E F F E E E E E F F
1000 102 X X X C C E E E E E E E E E E E E E F F E E E E E F F
1200 122 X X X C C E E E E E E E E E E E E E F F F F F F F F F
1500 152 X X X C C E E E E E E E E E E E E E F F F F F F F G G
1800 182 X X C C C E E E E E E E E E E E E E F F F F F F F G G
2200 222 X X X C C E E E E E E F E E E E F F F F F F F F G G
2700 272 C C C C E E E E E F E E E E F F F F F F F G G
3300 332 C C C C E E E E F E E E E F F F F F F F G G
3900 392 C C C C E E E E F E E E F F F F F F G G
4700 472 C C C C E E E E F E E E F F F F F F G G
5600 562 C C C C E E E E F E E E F F F F G G G
6800 682 C C C C E E E E E E E F F F F G G
8200 822 C C C C E E E E E E E F F F G G
Cap (μF) 0.010 103 C C C C E E E E E E E F F F G G
0.015 153 C C E E E E E E F F F F F F G
0.018 183 C C E E E E E F F F F F G
0.022 223 C C E E E E F F F F F F G
0.027 273 E E E E F F F F G
0.033 333 E E E E F F F F G
0.039 393 E E F F F F G
0.047 473 E E F F F F G
0.056 563 F F F F F F
0.068 683 F F F F F F
0.082 823 F F F F
0.100 104 F F F F
0.150 154 G G
0.220 224 G G
0.270 274
0.330 334
0.390 394
0.470 474
0.560 564
0.680 684
0.820 824
1.000 105
Voltage (V) 600 630 1000 600 630 1000 1500 2000 600 630 1000 1500 2000 600 630 1000 1500 2000 2500 3000 4000 600 630 1000 1500 2000 2500 3000 4000
Case Size 0805 1206 1210 1808 1812

Max. 0.81 1.45 1.80 2.20 2.80 0.94 3.30
Thickness (0.032) (0.057) (0.071) (0.087) (0.110) (0.037) (0.130)
072122

X7R CAPACITANCE RANGE
Case Size 1825 2220 2225 3640
mm 4.60 ± 0.50 5.70 ± 0.50 5.70 ± 0.50 9.14 ± 0.25
(L) Length
(in.) (0.181 ± 0.020) (0.224 ± 0.020) (0.224 ± 0.020) (0.360 ± 0.010)
mm 6.30 ± 0.40 5.00 ± 0.40 6.30 ± 0.40 10.2 ± 0.25
W) Width
(in.) (0.248 ± 0.016) (0.197 ± 0.016) (0.248 ± 0.016) (0.400 ± 0.010)
mm 0.75 ± 0.35 0.85 ± 0.35 0.85 ± 0.35 0.76 (0.030)
(t) Terminal
max (0.030 ± 0.014) (0.033 ± 0.014) (0.033 ± 0.014) 1.52 (0.060)
Voltage (V) 600 630 1000 1500 2000 2500 3000 4000 600 630 1000 1500 2000 2500 3000 4000 5000 600 630 1000 1500 2000 2500 3000 4000 5000 600 630 1000 1500 2000 2500 3000 4000 5000
Cap (pF) 100 101
120 121
150 151
180 181
220 221
270 271
330 331
390 391
470 471
560 561
680 681
750 751
820 821
1000 102 F F F F F F F F F F F F F G F F F F F F F G G G G G G G G G
3900 392 F F F F F F F F F F F F F G F F F F F F F G G G G G G G G
6800 682 F F F G G G G F F F F F G G F F F F F G G G G G G G G G G
8200 822 F F F G G G G F F F G G G G F F F F F G G G G G G G G G
Cap (μF) 0.010 103 F F F G G G G F F F G G G G F F F F F G G G G G G G G G
0.015 153 F F F G G G F F F G G G F F F G G G G G G G G G G G
0.018 183 F F F G G F F F G G G F F F G G G G G G G G G G
0.022 223 F F F G G F F F G G F F F G G G G G G G G G
0.027 273 F F F G F F F G G F F F G G G G G G G
0.033 333 F F F G F F F G F F F G G G G G G
0.039 393 F F F G F F F G F F F G G G G G
0.047 473 F F F P F F F G F F F G G G G G
0.068 683 F F G F F G F F F G G G G G
0.082 823 F F G F F G F F G G G
0.100 104 F F G F F G F F G G G
0.150 154 F F F F G F F G G G
0.220 224 F F F F G F F G G
0.270 274 F F F F F F G G
0.330 334 F F F F F F G G
0.390 394 F F F F F F G G
0.470 474 F F F F F F G G
0.560 564 G G G G F F G G
0.680 684 G G G G
0.820 824 G G
1.000 105
Voltage (V) 600 630 1000 1500 2000 2500 3000 4000 600 630 1000 1500 2000 2500 3000 4000 5000 600 630 1000 1500 2000 2500 3000 4000 5000 600 630 1000 1500 2000 2500 3000 4000 5000
Case Size 1825 2220 2225 3640

Max. 0.81 1.45 1.80 2.20 2.80 0.94 3.30
Thickness (0.032) (0.057) (0.071) (0.087) (0.110) (0.037) (0.130)
072122

Tin/Lead Termination “B” - 600V to 5000V Applications
products to our customers. KYOCERA AVX has provided in the following pages, a full range of values that we are
offering in this “B” termination.
Larger physical sizes than normally encountered chips are used to make high voltage MLC chip product. Special
precautions must be taken in applying these chips in surface mount assemblies. The temperature gradient during
heating or cooling cycles should not exceed 4ºC per second.
The preheat temperature must be within 50ºC of the peak temperature reached by the ceramic bodies through the
soldering process. Chip sizes 1210 and larger should be reflow soldered only. Capacitors may require protective
surface coating to prevent external arcing.
For 1825, 2225 and 3640 sizes, KYOCERA AVX offers leaded version in either thru-hole or SMT configurations (for
details see section on high voltage leaded MLC chips).
NEW 630V RANGE
HOW TO ORDER
LD08 A A 271 K A B 2 A
Style Voltage Temperature Capacitance Capacitance Test Level Termination* Packaging Special
LD05 - 0805 600V/630V = C Coefficient Code Tolerance A = Standard B = 5% Min Pb 2 = 7” Reel** Code
LD06 - 1206 1000V = A C0G = A (2 significant digits C0G: J = ±5% 4 = Automotive* X = FLEXITERM® 4 = 13” Reel** A = Standard
LD10 - 1210 1500V = S X7R = C + no. of zeros) K = ±10% 5% min. Pb* 6 = Tray (3640 Style)
LD08 - 1808 2000V = G Examples: M = ±20%
LD12 - 1812 2500V = W 10 pF = 100 X7R: K = ±10%
LD13 - 1825 3000V = H 100 pF = 101 M = ±20%
LD20 - 2220 4000V = J 1,000 pF = 102 Z = +80%, -20%
LD14 - 2225 5000V = K 22,000 pF = 223
LD40 - 3640 220,000 pF = 224
*** 1 μF =105
Notes: Capacitors with X7R dielectrics are not intended for applications across AC supply mains or AC line filtering with polarity reversal. Contact plant for recommendations.
Contact factory for availability of Termination and Tolerance options for Specific Part Numbers.
* FLEXITERM is not available in the LD40 Style NOT RoHS Compliant
** The LD40 Style is not available on Reels.
*** KYOCERA AVX offers nonstandard chip sizes. Contact factory for details..
* Not all values are supported in Automotive grade. Please contact factory for availability.
DIMENSIONS MILLIMETERS (INCHES)

SIZE LD05 (0805) LD06 (1206) LD10* (1210) LD08* (1808) LD12* (1812) LD13* (1825) LD20* (2220) LD14* (2225) LD40* (3640)
2.10 ± 0.20 3.30 ± 0.30 3.30 ± 0.40 4.60 ± 0.50 4.60 ± 0.50 4.60 ± 0.50 5.70 ± 0.50 5.70 ± 0.50 9.14 ± 0.25
(L) Length (0.083 ± 0.008) (0.130 ± 0.012) (0.130 ± 0.016) (0.181 ± 0.020) (0.181 ± 0.020) (0.181 ± 0.020) (0.224 ± 0.020) (0.224 ± 0.020) (0.360 ± 0.010)
1.25 ± 0.20 1.60 ± 0.20 2.50 ± 0.30 2.00 ± 0.20 3.20 ± 0.30 6.30 ± 0.40 5.00 ± 0.40 6.30 ± 0.40 10.2 ± 0.25
(W) Width (0.049 ± 0.008) (0.063 ± 0.008) ( 0.098 ± 0.012) (0.079 ± 0.008) (0.126 ± 0.012) (0.248 ± 0.016) (0.197 ± 0.016) (0.248 ± 0.016) (0.400 ± 0.010)
(t) min. 0.50 ± 0.20 0.60 ± 0.20 0.75 ± 0.35 0.75 ± 0.35 0.75 ± 0.35 0.75 ± 0.35 0.85 ± 0.35 0.85 ± 0.35 0.76 (0.030)
terminal max. (0.020 ± 0.008) (0.024 ± 0.008) (0.030 ± 0.014) (0.030 ± 0.014) (0.030 ± 0.014) (0.030 ± 0.014) (0.033 ± 0.014) (0.033 ± 0.014) 1.52 (0.060)
Performance of ceramic capacitors can be simulated by using the online SpiMLCC software program - http://spicat.avx.com/mlcc
Custom values, ratings and configurations are also available.

Tin/Lead Termination “B” - 600V to 5000V Applications
NP0 (C0G) Dielectric
10 pF to 0.047 μF
Capacitance Range (25°C, 1.0 ±0.2 Vrms at 1kHz, for ≤ 1000 pF use 1 MHz)
Dissipation Factor 0.1% max. (+25°C, 1.0 ±0.2 Vrms, 1kHz, for ≤ 1000 pF use 1 MHz)
HIGH VOLTAGE C0G CAPACITANCE VALUES

VOLTAGE LD05 (0805) LD06 (1206) LD10 (1210) LD08 (1808) LD12 (1812) LD13 (1825) LD20 (2220) LD14 (2225) LD40 (3640)
min. 10 pF 10 pF 100 pF 100 pF 100 pF 1000 pF 1000 pF 1000 pF 1000 pF
600/630
max. 330 pF 1200 pF 2700 pF 3300 pF 5600 pF 0.012 μF 0.012 pF 0.018 μF 0.047 μF
min. 10 pF 10 pF 10 pF 100 pF 100 pF 100 pF 1000 pF 1000 pF 1000 pF
1000
max. 180 pF 560 pF 1500 pF 2200 pF 3300 pF 8200 pF 0.010 pF 0.010 μF 0.022 μF
min. – 10 pF 10 pF 10 pF 10 pF 100 pF 100 pF 100 pF 100 pF
1500
max. – 270 pF 680 pF 820 pF 1800 pF 4700 pF 4700 pF 5600 pF 0.010 μF
2000
max. – 120 pF 270 pF 330 pF 1000 pF 1800 pF 2200 pF 2700 pF 6800 pF
min. – – – 10 pF 10 pF 10 pF 100 pF 100 pF 100 pF
2500
max. – – – 180 pF 470 pF 1200 pF 1500 pF 1800 pF 3900 pF
3000
4000
min. – – – – – – 10 pF 10 pF 10 pF
5000
max. – – – – – – 220 pF 270 pF 820 pF
X7R Dielectric
Capacitance Range 10 pF to 0.56 μF (25°C, 1.0 ±0.2 Vrms at 1kHz)
HIGH VOLTAGE X7R MAXIMUM CAPACITANCE VALUES

VOLTAGE 0805 1206 1210 1808 1812 1825 2220 2225 3640
min. 100 pF 1000 pF 1000 pF 1000 pF 1000 pF 0.010 μF 0.010 μF 0.010 μF 0.010 μF
600/630
max. 6800 pF 0.022 μF 0.056 μF 0.068 μF 0.120 μF 0.390 μF 0.270 μF 0.330 μF 0.560 μF
min. 100 pF 100 pF 1000 pF 1000 pF 1000 pF 1000 pF 1000 pF 1000 pF 0.010 μF
1000
max. 1500 pF 6800 pF 0.015 μF 0.018 μF 0.039 μF 0.100 μF 0.120 μF 0.150 μF 0.220 μF
1500
max. – 2700 pF 5600 pF 6800 pF 0.015 μF 0.056 μF 0.056 μF 0.068 μF 0.100 μF
2000
max. – 1500 pF 3300 pF 3300 pF 8200 pF 0.022 μF 0.027 μF 0.033 μF 0.027 μF
2500
max. – – – 2200 pF 5600 pF 0.015 μF 0.018 μF 0.022 μF 0.022 μF
3000
max. – – – 1800 pF 3900 pF 0.010 μF 0.012 μF 0.015 μF 0.018 μF
min. – – – – – – – – 100 pF
4000
max. – – – – – – – – 6800 pF
min. – – – – – – – – 100 pF
5000
max. – – – – – – – – 3300 pF

FLEXITERM® - 600V to 5000V Applications
High value, low leakage and small size are difficult parameters to obtain in capacitors for high voltage systems. KYOCERA
AVX special high voltage MLC chips capacitors meet these performance characteristics and are designed for applications
such as snubbers in high frequency power converters, resonators in SMPS, and high voltage coupling/DC blocking. These
high voltage chip designs exhibit low ESRs at high frequencies.
To make high voltage chips, larger physical sizes than are normally encountered are necessary. These larger sizes require
that special precautions be taken in applying these chips in surface mount assemblies. In response to this, and to follow
from the success of the FLEXITERM® range of low voltage parts, KYOCERA AVX is delighted to offer a FLEXITERM® high
voltage range of capacitors, FLEXITERM®.
The FLEXITERM® layer is designed to enhance the mechanical flexure and temperature cycling performance of a standard
ceramic capacitor, giving customers a solution where board flexure or temperature cycle damage are concerns.
HOW TO ORDER
1808 A C 272 K A Z 2 A
Style Voltage Temperature Capacitance Code Capacitance Test Level Termination* Packaging Special
0805 600V/630V = C Coefficient (2 significant digits Tolerance Z = FLEXITERM® 2 = 7" Reel Code
1206 1000V = A C0G = A + no. of zeros) C0G: J = ±5% 100% Tin 4 = 13" Reel A = Standard
1210 1500V = S X7R = C Examples: K = ±10% (RoHS Compliant)
1808 2000V = G 10 pF = 100 M = ±20%
1812 2500V = W 100 pF = 101 X7R: K = ±10%
1825 3000V = H 1,000 pF = 102 M = ±20%
2220 4000V = J 22,000 pF = 223 Z = +80%,
2225 5000V = K 220,000 pF = 224 -20%
*** 1 μF =105
Notes: Capacitors with X7R dielectrics are not intended for applications across AC supply mains or AC line filtering with polarity reversal. Contact plant for
recommendations. Contact factory for availability of Termination and Tolerance options for Specific Part Numbers.
*** KYOCERA AVX offers nonstandard chip sizes. Contact factory for details.
DIMENSIONS millimeters (inches)

SIZE 0805 1206 1210* 1808* 1812* 1825* 2220* 2225*
2.10 ± 0.20 3.30 ± 0.30 3.30 ± 0.40 4.60 ± 0.50 4.60 ± 0.50 4.60 ± 0.50 5.70 ± 0.50 5.70 ± 0.50
(L) Length (0.083 ± 0.008) (0.130 ± 0.012) (0.130 ± 0.016) (0.181 ± 0.020) (0.181 ± 0.020) (0.181 ± 0.020) (0.224 ± 0.020) (0.224 ± 0.020)
1.25 ± 0.20 1.60 +0.30 2.50 ± 0.30 2.00 ± 0.20 3.20 ± 0.30 6.30 ± 0.40 5.00 ± 0.40 6.30 ± 0.40
(W) Width (0.049 ±0.008)
-0.10
(0.098 ± 0.012) (0.079 ± 0.008) (0.126 ± 0.012) (0.248 ± 0.016) (0.197 ± 0.016) (0.248 ± 0.016)
(0.063 +0.012
-0.004 )
min. 0.50 ± 0.20 0.60 ± 0.20 0.75 ± 0.35 0.75 ± 0.35 0.75 ± 0.35 0.75 ± 0.35 0.85 ± 0.35 0.85 ± 0.35
(t) terminal
max. (0.020 ± 0.008) (0.024 ± 0.008) (0.030 ± 0.014) (0.030 ± 0.014) (0.030 ± 0.014) (0.030 ± 0.014) (0.033 ± 0.014) (0.033 ± 0.014)
Performance of SMPS capacitors can be simulated by downloading SpiCalci software program - http://www.avx.com/SpiApps/default.asp#spicalci
Custom values, ratings and configurations are also available.
072022

NP0 (C0G) Dielectric

Capacitance Range 10 pF to 0.100 μF (+25°C, 1.0 ±0.2 Vrms, 1kHz)
NP0 (C0G) CAPACITANCE RANGE

Case Size 0805 1206 1210 1808 1812
mm 2.10 ± 0.20 3.30 ± 0.30 3.30 ± 0.40 4.60 ± 0.50 4.60 ± 0.50
(L) Length
(in.) (0.083 ± 0.008) (0.130 ± 0.012) (0.130 ± 0.016) (0.181 ± 0.020) (0.181 ± 0.020)
mm 1.25 ± 0.20 1.60 ± 0.30/-0.10 2.50 ± 0.30 2.00 ± 0.20 3.20 ± 0.30
W) Width
(in.) (0.049 ± 0.008) (0.063 ± 0.012/-0.004) (0.098 ± 0.012) (0.079 ± 0.008) (0.126 ± 0.012)
mm 0.50 ± 0.20 0.60 ± 0.20 0.75 ± 0.35 0.75 ± 0.35 0.75 ± 0.35
(t) Terminal
max (0.020 ± 0.008) (0.024 ± 0.008) (0.030 ± 0.014) (0.030 ± 0.014) (0.030 ± 0.014)
Voltage (V) 600 630 1000 600 630 1000 1500 2000 600 630 1000 1500 2000 600 630 1000 1500 2000 2500 3000 4000 600 630 1000 1500 2000 2500 3000 4000
Cap (pF) 1.5 1R5 A A X X X X X
1.8 1R8 A A X X X X X
2.2 2R2 A A X X X X X
2.7 2R7 A A X X X X X C C C C C
10 100 A A A X X X X X C C C C C C C C C C C C C C C C C C C C E
33 330 A A A X X X D D C C C C C C C C C C C C C C C C C C C C E
39 390 A A A X X X D D C C C C C C C C C C C C C C C C C C C C E
47 470 A A A X X M D D C C C C C C C C C C C C C C C C C C C C E
56 560 A A A X X M C C C C C C C C C C C C C C C C C C C C C F
68 680 A A A X X M C C C C C C C C C C C C C C C C C C C C C F
82 820 X X X X X C C C C C C C C C C C C C C C C C C C C C C F
100 101 X X X X X C C C C C C C C C C C C C F F C C C C C C C F
120 121 C C C X X C E E C C C C C C C C C C F F C C C C C C C G
150 151 C C C X X C E E C C C E E C C C F F F F C C C C C C C G
180 181 C C C X X E E E C C E E E C C C F F F F C C C C C F F
220 221 C C X X E E E C C E E E C C C F F F F C C C C C F F
270 271 C C C C E E E C C E E E C C C F F F F C C C C C F F
330 331 C C C C E E E C C E E E C C F F F F F C C C F F F F
390 391 C C C C E E E C C E E E C C F F F F F C C C F F F F
470 471 C C C C E E E C C E E E C C F F F F F C C F F F F F
560 561 C C C C E C C E E E C C F F F C C F F F F F
680 681 C C C C E C C E E E C C F F F C C F F F G G
750 751 C C E E E C C E E E C C F F F C C F F F G G
820 821 C C E E E C C E E E C C F E E C C F F F G G
1000 102 E E E C C E F F C C F E E C C F F F G G
1200 122 E E C C E F F E E F E E C C F E E
1500 152 E E C C F G G E E F C C F F F
1800 182 E E C C G G G E E F C C F F F
2200 222 E E C C G E E C C E G G
2700 272 E E C C G E E C C E G G
3300 332 E E C C G E E C C F
3900 392 C C G E E C C F
4700 472 C C E E C C G
5600 562 E E E E C C
6800 682 E E F F C C
8200 822 F F E E
Cap (μF) 0.010 103 F F E E
0.012 123 F F F F
0.015 153 G G G G
0.018 183 G G
0.022 223
0.033 333
0.047 473
0.056 563
0.068 683
0.100 104
Voltage (V) 600 630 1000 600 630 1000 1500 2000 600 630 1000 1500 2000 600 630 1000 1500 2000 2500 3000 4000 600 630 1000 1500 2000 2500 3000 4000
Case Size 0805 1206 1210 1808 1812
072122

NP0 (C0G) CAPACITANCE RANGE
Case Size 1825 2220 2225
Soldering Reflow Only Reflow Only Reflow Only
mm 4.60 ± 0.50 5.70 ± 0.50 5.70 ± 0.50
(L) Length
(in.) (0.181 ± 0.020) (0.224 ± 0.020) (0.224 ± 0.020)
mm 6.30 ± 0.40 5.00 ± 0.40 6.30 ± 0.40
W) Width
(in.) (0.248 ± 0.016) (0.197 ± 0.016) (0.248 ± 0.016)
mm 0.75 ± 0.35 0.85 ± 0.35
(t) Terminal 0.85 ± 0.35
max (0.030 ± 0.014) (0.033 ± 0.014)
Voltage (V) 600 630 1000 1500 2000 2500 3000 4000 600 630 1000 1500 2000 2500 3000 4000 5000 600 630 1000 1500 2000 2500 3000 4000 5000
Cap (pF) 1.5 1R5
1.8 1R8
2.2 2R2
2.7 2R7
3.3 3R3
3.9 3R9
4.7 4R7
5.6 5R6
6.8 6R8
8.2 8R2
10 100 E E E E E E E E E E E E E E E E E
E E E E EE E F F
E E E E EE E F F
E E E E EE E F F
E E E E EE E F F
E E E E EE E F F
E E E E EE E F F
E E E E EE E F F
E E E E EE E F F
47 470 E E E E E E E F E E E E E E E E E
E E E E EE E F G
E E E E EE E F G
E E E E EE E F G
E E E E EE E F G
E E E E EE E G G
E E E E EE E G G
E E E E EE E G G
180 181 E E E E E E E F E E E E E E E E EE EF E F E E G G
220 221 E E E E E E E F E E E E E E E E EE EF E F E E G G
270 271 E E E E E E E F E E E E E E E E EE E E E E G G
330 331 E E E E E E E F E E E E E E E E EE E E E E G
390 391 E E E E E E E E E E E E E E E EE E E E E G
680 681 E E E E E F F E E E E E E F E FE E E E E
820 821 E E E E E F F E E E E E E F E FE E E F E
1200 122 E E E E E G G E E E E E E G E GE E E F F
1500 152 E E E F F G G E E E F F E G E G
E E E F F
1800 182 E E E F F G G E E E F F E G E G
E E E G G
2200 222 E E E G G E E E G G E E E E E
2700 272 E E E G G E E E G G E E E F F
3300 332 E E E G G E E E G G E E E F F
3900 392 E E E G G E E E G G E E E G G
4700 472 E E E G G E E E G G F F F G G
5600 562 F F F G G F F F F F F G G
6800 682 F F F F F F F F F G G
8200 822 G G G G G G G G G
Cap (μF) 0.010 103 G G G
0.012 123 G G G
0.015 153 G G G
0.018 183 G G G
0.022 223 G G G
0.033 333 G G G
0.047 473 G G G
0.056 563 G G G
0.068 683 G G G
0.100 104 G G
Voltage (V) 600 630 1000 1500 2000 2500 3000 4000 600 630 1000 1500 2000 2500 3000 4000 5000 600 630 1000 1500 2000 2500 3000 4000 5000
Case Size 1825 2220 2225
Letter A C E F G X NOTE: Contact factory for non-specified capacitance

Max. 0.81 1.45 1.80 2.20 2.80 0.94
Thickness (0.032) (0.057) (0.071) (0.087) (0.110) (0.037)
072122

X7R Dielectric
Capacitance Range 10 pF to 0.82 μF (25°C, 1.0 ±0.2 Vrms at 1kHz)

Case Size 0805 1206 1210 1808 1812
mm 2.10 ± 0.20 3.30 ± 0.30 3.30 ± 0.40 4.60 ± 0.50 4.60 ± 0.50
(L) Length
(in.) (0.083 ± 0.008) (0.130 ± 0.012) (0.130 ± 0.016) (0.181 ± 0.020) (0.181 ± 0.020)
mm 1.25 ± 0.20 1.60 +0.30/-0.10 2.50 ± 0.30 2.00 ± 0.20 3.20 ± 0.30
W) Width
(in.) (0.049 ± 0.008) (0.063 +0.012/-0.004) (0.098 ± 0.012) (0.079 ± 0.008) (0.126 ± 0.012)
mm 0.50 ± 0.20 0.60 ± 0.20 0.75 ± 0.35 0.75 ± 0.35 0.75 ± 0.35
(t) Terminal
max (0.020 ± 0.008) (0.024 ± 0.008) (0.030 ± 0.014) (0.030 ± 0.014) (0.030 ± 0.014)
Voltage (V) 600 630 1000 600 630 1000 1500 2000 600 630 1000 1500 2000 600 630 1000 1500 2000 2500 3000 4000 600 630 1000 1500 2000 2500 3000 4000
Cap (pF) 100 101 X X C C C E E E E E E E E
120 121 X X C C C E E E E E E E E
150 151 X X C C C E E E E E E E E
180 181 X X C C C E E E E E E E E
220 221 X X C C C E E E E E E E E
270 271 X X C C C E E E E E E E E E E E E E
470 471 X X C C C E E E E E E E E E E E E E E F E E E E E E E
560 561 X X C C C E E E E E E E E E E E E E F F E E E E E E E
1200 122 X X C C C E E E E E E E E E E E E E F F F F F F F F F
1500 152 X X C C C E E E E E E E E E E E E E F F F F F F F G G
1800 182 X X C C E E E E E E E E E E E E E F F F F F F F G G
2200 222 X X C C E E E E E E F E E E E F F F F F F F F G G
2700 272 X X C C E E E E E F E E E E F F F F F F F G G
3300 332 X X C C E E E E F E E E E F F F F F F F G G
3900 392 X X C C E E E E G E E E F F F F F F G G
4700 472 X X C C E E E E G E E E F F F F F F G G
5600 562 X X C C E E E E G E E E F F F F G G
6800 682 X X C C E E E E E E E F F F F G G
8200 822 X X C C E E E E E E E F F E G G
Cap (μF) 0.010 103 C C C C E E E E E E E F F F G G
0.015 153 C C E E E E E E F F F F F F G
0.018 183 C C E E E E E F F F F F G
0.022 223 C C E E E E E F F F F F G
0.027 273 E E E E F F F F G
0.033 333 E E E E F F F F G
0.039 393 E E F F F F G
0.047 473 E E F F F F G
0.056 563 F F F F F F
0.068 683 F F F F F F
0.082 823 F F F F
0.100 104 F F F F
0.150 154 G G
0.220 224 G G
0.270 274
0.330 334
0.390 394
0.470 474
0.560 564
0.680 684
0.820 824
1.000 105
Voltage (V) 600 630 1000 600 630 1000 1500 2000 600 630 1000 1500 2000 600 630 1000 1500 2000 2500 3000 4000 600 630 1000 1500 2000 2500 3000 4000
Case Size 0805 1206 1210 1808 1812
072022

Case Size 1825 2220 2225 3640
mm 4.60 ± 0.50 5.70 0.50 5.70 ± 0.50 9.14 ± 0.25
(L) Length
(in.) (0.181 0.020) (0.224 0.020) (0.224 ± 0.020) (0.360 ± 0.010)
mm 6.30 ± 0.40 5.00 0.40 6.30 ± 0.40 5.72 ± 0.25
W) Width
(in.) (0.248 ± 0.016) (0.197 0.016) (0.248 ± 0.016) (0.225 ± 0.010)
mm 0.75 ± 0.35 0.85 0.35 0.85 ± 0.35 0.76 (0.030)
(t) Terminal
max (0.030 ± 0.014) (0.033 ± 0.014) (0.033 ± 0.014) 1.52 (0.062)
Voltage (V) 600 630 1000 1500 2000 2500 3000 4000 600 630 1000 1500 2000 2500 3000 4000 5000 600 630 1000 1500 2000 2500 3000 4000 5000 600 630 1000 1500 2000 2500 3000 4000 5000
Cap (pF) 100 101
120 121
150 151
180 181
220 221
270 271
330 331
390 391
470 471
560 561
680 681
750 751
820 821
6800 682 F F F G G G G F F F F F G G F F F F F G G G G G G G G G G
8200 822 F F F G G G G F F F G G G G F F F F F G G G G G G G G G
Cap (μF) 0.010 103 F F F G G G G F F F G G G G F F F F F G G G G G G G G G
0.015 153 F F F G G G F F F G G G F F F G G G G G G G G G G G
0.018 183 F F F G G F F F G G G F F F G G G G G G G G G G
0.022 223 F F F G G F F F G G F F F G G G G G G G G G
0.027 273 F F F G F F F G G F F F G G G G G G G
0.033 333 F F F G F F F G F F F G G G G G G
0.047 473 F F F P F F F G F F F G G G G G
0.068 683 F F G F F G F F F G G G G G
0.082 823 F F G F F G F F G G G
0.100 104 F F G F F G F F G G G
0.150 154 F F F F G F F G G G
0.220 224 F F F F G F F G G
0.270 274 F F F F F F G G
0.330 334 F F F F F F G G
0.390 394 F F F F F F G G
0.470 474 F F F F F F G G
0.560 564 G G G G F F G G
0.680 684 G G G G
0.820 824 G G G G
1.000 105 G G G G
Voltage (V) 600 630 1000 1500 2000 2500 3000 4000 600 630 1000 1500 2000 2500 3000 4000 5000 600 630 1000 1500 2000 2500 3000 4000 5000 600 630 1000 1500 2000 2500 3000 4000 5000
Case Size 1825 2220 2225 3640
NOTE: Contact factory for non-specified

Letter A C E F G P X capacitance values
Max. 0.81 1.45 1.80 2.20 2.80 3.10 0.94
Thickness (0.032) (0.057) (0.071) (0.087) (0.110) (0.120) (0.037)
072122

High Voltage MLC Chip Capacitors
For 600V to 3000V Automotive Applications - AEC-Q200
Modern automotive electronics could require components capable to work with high voltage (e.g. xenon lamp circuits or power
converters in hybrid cards). KYOCERA AVX offers high voltage ceramic capacitors qualified according to AEC-Q200 standard.
High value, low leakage and small size are diffocult parameters to obtain in cpacitors for high voltage systems. KYOCERA AVX
special hgih voltage MLC chip capacitors meet these performance characteristics and are designed for applications such as
snubbers in high frequency power converters, resonators in SMPS, and high voltage coupling/dc blocking. These high voltage chip
designs exhibit low ESRs at high frequencies.
Due to high voltage nature, larger physical dimensions are necessary. These larger sizes require special precautions to be taken in
applying of MLC chips. The temperature gradient during heating or cooling cycles should not exceed 4°C per second. The preheat
temperature must be within 50°C of the peak temperature reached by the ceramic bodies through the soldering process. Chip sizes
1210 and larger should be reflow soldered only. Capacitors may require protective surface coating to prevent external arcing.
To improve mechanical and thermal resistance, KYOCERA AVX recommend to use flexible terminations system - FLEXITERM®.
HOW TO ORDER
1210 C C 223 K 4 T 2 A
Size Voltage Dielectric Capacitance Capacitance Failure Rate Terminations Packaging Special Code
1206 C = 630V X7R = C Code Tolerance 4 = Automotive T = Plated Ni and Sn 2 = 7” Reel A = Std. Product
1210 A = 1000V 2 Sig. Digits + K = ±10% Z = FLEXITERM® 4 = 13” Reel
1808 S = 1500V Number of Zeros M = ±20%
1812 G = 2000V e.g. 103 = 10nF
2220 W = 2500V (223 = 22nF)
H = 3000V
*KYOCERA AVX offers nonstandard case size. Contact factory for details.
Notes: Capacitors with X7R dielectrics are not indeded for applications across AC supply mains or AC line filtering with polarity reversal.
Please contact KYOCERA AVX for recommendations
CHIP DIMENSIONS DESCRIPTION (SEE CAPACITANCE RANGE CHART ON PAGE 128)
L = Length
W = Width
T = Thickness
t = Terminal
X7R DIELECTRIC PERFORMANCE CHARACTERISTICS
Parameter/Test Specification Limits Measuring Conditions

Operating Temperature Range -55°C to +125°C Temperature Cycle Chamber
Capacitance within specified tolerance Freq.: 1kHz ±10%
Dissipation Factor 2.5% max. Voltage: 1.0Vrm s ±0.2Vrms
Capacitance Tolerance ±5% (J), ±10% (K), ±20% (M) T = +25°C, V = 0Vdc
Temperature Characteristics X7R = ±15% Vdc = 0V, T = (-55°C to +125°C)
T = +25°C, V = 500Vdc
100GΩ min. or 1000MΩ • μF min. (whichever is less)
Insulation Resistance 10GΩ min. or 100MΩ • μF min. (whichever is less)
T = +125°C, V = 500Vdc
(t ≥ 120 sec, I ≤ 50mA)
120% of rated voltage
Dielectric Strength No breakdown or visual defect
t ≤ 5 sec, I ≤ 50mA

High Voltage MLC Chips FLEXITERM®
For 600V to 3000V Automotive Applications - AEC-Q200
Case Size 1206 1210 1808 1812 2220
mm 3.2 ± 0.2 3.2 ± 0.2 4.57 ± 0.25 4.5 ± 0.3 5.7 ± 0.5
(L) Length
(in.) (0.126 ± 0.008) (0.126 ± 0.008) (0.18 ± 0.01) (0.177 ± 0.012) (0.224 ± 0.02)
mm 1.6 ± 0.2 2.5 ± 0.2 2.03 ± 0.25 3.2 ± 0.2 5 ± 0.4
W) Width
(in.) (0.063 ± 0.008) (0.098 ± 0.008) (0.08 ± 0.01) (0.126 ± 0.008) (0.197 ± 0.016)
mm 0.5 ± 0.25 0.5 ± 0.25 0.61 ± 0.36 0.61 ± 0.36 0.64 ± 0.39
(t) Terminal
max (0.02 ± 0.01) (0.02 ± 0.01) (0.024 ± 0.014) (0.024 ± 0.014) (0.025 ± 0.015)
Voltage (V) 630 1000 1500 2000 2500 630 1000 1500 2000 630 1000 1500 2000 2500 3000 630 1000 1500 2000 2500 3000 630 1000 1500 2000 3000
Cap (pF) 101 100 C E E E E
121 120 C E E E E
151 150 C E E E E
181 180 C E E E E
221 220 C E E E E E E E E E E
271 270 C E E E E E E E E E E E E E E
331 330 C E E E E E E E E E E E E E F E
391 390 C E E E E E E E E E E E E E F E
471 470 C E E E E E E E E E E E E F F E E E E E E
561 560 C E E E E E E E E E E E E F F E E E E E E
681 680 C E E E E E E E E E E F F F F E E E E F F
821 820 C E E E E E E E E E E F F F F E E E E F F
102 1000 C E E E E E E E E E E F F F F E E E E F F F F F F G
122 1220 C E E E E E E E F F F F G F F F F G
152 1500 C E E E E E E E F F F F G F F F F G
182 1800 C E E E E E E F F F F G F F F F G
222 2200 C E E E E E E F F F F G F F F F G
272 2700 C E E E E E E F F F F F F F F
332 3300 C E E E E E F F F F F F F F
392 3900 C E E E E F F F F F F F F
472 4700 C E E E E F F G G F F F F
562 5600 C E E E E F F G G F F F F
682 6800 E E E E F F G G F F F F
822 8200 E E E F F G G F F G G
103 0.01 E E E F F G G G G G
123 0.012 E E F F G G G G G
153 0.015 E E F F G G G G G
183 0.018 E E F F G G G G
223 0.022 E F F G G G G
273 0.027 Q F G G
333 0.033 F G G
393 0.039 F G G
473 0.047 F G G
563 0.056 G G
683 0.068 G G
823 0.082 G G
104 0.1 G G
124 0.12 G
154 0.15 G
224 0.22
334 0.33
474 0.47
684 0.68
105 1
155 1.5
225 2.2
335 3.3
475 4.7
106 10
226 22
WVDC 630 1000 1500 2000 2500 630 1000 1500 2000 630 1000 1500 2000 2500 3000 630 1000 1500 2000 2500 3000 630 1000 1500 2000 3000
Size 1206 1210 1808 1812 2220
Letter A C E F G Q
Max 0.81 1.45 1.80 2.20 2.80 1.78
Thickness (0.032) (0.057) (0.071) (0.087) (0.110) (0.070)

MIL-PRF-55681/Chips
Part Number Example
CDR01 thru CDR06
MILITARY DESIGNATION PER MIL-PRF-55681
Part Number Example

CDR01 BP 101 B K S M
L
W
D t MIL Style
Voltage-temperature
Limits
Capacitance
T
Rated Voltage
Capacitance Tolerance
Termination Finish
Failure Rate
NOTE: Contact factory for availability of Termination and Tolerance Options for
Specific Part Numbers.
MIL Style: CDR01, CDR02, CDR03, CDR04, CDR05, Termination Finish:

CDR06 M = Palladium silver
N = Silver-nickel-gold
Voltage Temperature Limits: S = Solder coated final with a minimum of 4 percent lead
BP = 0 ± 30 ppm/°C without voltage; 0 ± 30 ppm/°C with rated voltage T = Silver
from -55°C to +125°C U = Base metallization-barrier metal-solder coated
BX = ±15% without voltage; +15 –25% with rated voltage from -55°C to (tin/lead alloy, with a minimum of 4 percent lead)
+125°C W = Base metallization-barrier metal-tinned
(tin or tin/lead alloy)
Capacitance: Two digit figures followed by multiplier Y = Base metallization-barrier metal-tin (100 percent)
(number of zeros to be added) e.g., 101 = 100 pF Z = Base metallization-barrier metal-tinned
(tin/lead alloy, with a minimum of 4 percent lead)
Rated Voltage: A = 50V, B = 100V
Capacitance Tolerance: J ± 5%, K ± 10%, M ± 20% *See MIL-PRF-55681 Specification for more details
Failure Rate Level: M = 1.0%, P = .1%, R = .01%,
S = .001%
Packaging: Bulk is standard packaging. Tape and reel
per RS481 is available upon request.
CROSS REFERENCE: MIL-PRF-55681/CDR01 THRU CDR06*

Per Thickness (T) D Termination Band (t)
Style Length (L) Width (W)
MIL-PRF-55681 Min. Max. Min. Max. Min. Max.
CDR01 0805 .080 ± .015 .050 ± .015 .022 .055 .030 — .010 —
CDR02 1805 .180 ± .015 .050 ± .015 .022 .055 — — .010 .030
CDR03 1808 .180 ± .015 .080 ± .018 .022 .080 — — .010 .030
CDR04 1812 .180 ± .015 .125 ± .015 .022 .080 — — .010 .030
+ .020 + .020
CDR05 1825 .180 .250 - .015 .020 .080 — — .010 .030
- .015
CDR06 2225 .225 ± .020 .250 ± .020 .020 .080 — — .010 .030
*For CDR11, 12, 13, and 14 see KYOCERA AVX Microwave Chip Capacitor Catalog

MIL-PRF-55681/Chips
Military Part Number Identification
CDR01 thru CDR06
CDR01 thru CDR06 to MIL-PRF-55681

Rated temperature Rated temperature
Military Type Capacitance Capacitance Military Type Capacitance Capacitance
and voltage- WVDC and voltage- WVDC
Designation in pF tolerance Designation/ in pF tolerance
temperature limits temperature limits
Style 0805/CDR01 Style 1808/CDR03
CDR01BP100B--- 10 J,K BP 100 CDR03BP331B--- 330 J,K BP 100
CDR01BP120B--- 12 J BP 100 CDR03BP391B--- 390 J BP 100
CDR01BP180B--- 18 J BP 100 CDR03BP561B--- 560 J BP 100
CDR01BP270B--- 27 J BP 100 CDR03BP821B-- 820 J BP 100
CDR01BP390B--- 39 J BP 100 CDR03BX123B-- 12,000 K BX 100
CDR01BP470B--- 47 J,K BP 100 CDR03BX153B--- 15.000 K,M BX 100
CDR01BP560B--- 56 J BP 100 CDR03BX183B--- 18.000 K BX 100
CDR01BP680B--- 68 J,K BP 100 CDR03BX223B--- 22,000 K,M BX 100
CDR01BP820B--- 82 J BP 100 CDR03BX273B--- 27.000 K BX 100
CDR01BP101B--- 100 J,K BP 100 CDR03BX333B--- 33.000 K,M BX 100
CDR01B--121B--- 120 J,K BP,BX 100 CDR03BX393A--- 39.000 K BX 50
CDR01B--151B--- 150 J,K BP,BX 100 CDR03BX473A--- 47.000 K,M BX 50
CDR01B--181B--- 180 J,K BP,BX 100 CDR03BX563A--- 56.000 K BX 50
CDR01BX221B--- 220 K,M BX 100 CDR03BX683A--- 68.000 K,M BX 50
CDR01BX271B--- 270 K BX 100 Style 1812/CDR04
CDR01BX331B--- 330 K,M BX 100 CDR04BP122B--- 1200 J BP 100
CDR01BX391B--- 390 K BX 100 CDR04BP152B--- 1500 J,K BP 100
CDR01BX102B--- 1000 K,M BX 100 CDR04BX393B--- 39.000 K BX 100
CDR01BX122B--- 1200 K BX 100 CDR04BX473B--- 47.000 K,M BX 100
CDR01BX152B--- 1500 K,M BX 100 CDR04BX563B--- 56.000 K BX 100
CDR01BX182B--- 1800 K BX 100 CDR04BX823A--- 82.000 K BX 50
CDR01BX222B--- 2200 K,M BX 100 CDR04BX104A--- 100,000 K,M BX 50
CDR01BX272B--- 2700 K BX 100 CDR04BX124A--- 120,000 K BX 50
CDR01BX332B--- 3300 K,M BX 100 CDR04BX154A--- 150.000 K,M BX 50
CDR01BX392A--- 3900 K BX 50 CDR04BX184A--- 180.000 K BX 50
CDR01BX472A--- 4700 K,M BX 50 Style 1825/CDR05
Style 1805/CDR02 CDR05BP392B--- 3900 J,K BP 100
CDR02BP271B--- 270 J BP 100 CDR05BP562B--- 5600 J,K BP 100
CDR02BX392B--- 3900 K BX 100 CDR05BX683B--- 68,000 K,M BX 100
CDR02BX472B--- 4700 K,M BX 100 CDR05BX823B--- 82,000 K BX 100
CDR02BX562B--- 5600 K BX 100 CDR05BX104B--- 100,000 K,M BX 100
CDR02BX682B--- 6800 K,M BX 100 CDR05BX124B--- 120,000 K BX 100
CDR02BX822B--- 8200 K BX 100 CDR05BX154B--- 150.000 K,M BX 100
CDR02BX103B--- 10,000 K,M BX 100 CDR05BX224A--- 220.000 K,M BX 50
CDR02BX123A--- 12,000 K BX 50 CDR05BX274A--- 270,000 K BX 50
CDR02BX153A--- 15,000 K,M BX 50 CDR05BX334A--- 330,000 K,M BX 50
CDR02BX183A--- 18,000 K BX 50 Style 2225/CDR06
CDR02BX223A--- 22,000 K,M BX 50 CDR06BP682B--- 6800 J,K BP 100
CDR06BP822B--- 8200 J,K BP 100
Add appropriate failure rate CDR06BP103B--- 10,000 J,K BP 100
CDR06BX394A--- 390.000 K BX 50
Add appropriate termination finish CDR06BX474A--- 470.000 K,M BX 50
Add appropriate failure rate
Add appropriate termination finish

MIL-PRF-55681/Chips
Part Number Example
CDR31 thru CDR35
MILITARY DESIGNATION PER MIL-PRF-55681
Part Number Example

(example) CDR31 BP 101 B K S M
L
W
D t
MIL Style
Voltage-Temperature Limits
Capacitance
Rated Voltage
T
Termination Finish
Failure Rate
NOTE: Contact factory for availability of Termination and Tolerance Options for
Specific Part Numbers.
MIL Style: CDR31, CDR32, CDR33, CDR34, CDR35 Termination Finish:

Voltage-Temperature Limits: M = Palladium silver
BP = 0 ± 30 ppm/°C without voltage; 0 ± 30 ppm/°C with N = Silver-nickel-gold
rated voltage from -55°C to +125°C S = Solder coated final with a minimum of 4 percent lead
T = Silver
BX = ±15% without voltage; +15 –25% with rated voltage from U = Base metallization-barrier metal-solder coated
-55°C to +125°C (tin/lead alloy, with a minimum of 4 percent lead)
W = Base metallization-barrier metal-tinned
Capacitance: Two digit figures followed by multiplier (tin or tin/lead alloy)
(number of zeros to be added) e.g., 101 = 100 pF Y = Base metallization-barrier metal-tin (100 percent)
Rated Voltage: A = 50V, B = 100V Z = Base metallization-barrier metal-tinned
(tin/lead alloy, with a minimum of 4 percent lead)
Capacitance Tolerance: B ± .10 pF, C ± .25 pF, D ± .5
pF, F ± 1%, J ± 5%, K ± 10%,
M ± 20% *See MIL-PRF-55681 Specification for more details
Failure Rate Level: M = 1.0%, P = .1%, R = .01%,
S = .001%
Packaging: Bulk is standard packaging. Tape and reel per RS481 is
available upon request.
CROSS REFERENCE: MIL-PRF-55681/CDR31 THRU CDR35

Length (L) Width (W) Thickness (T) D Termination Band (t)
Per MIL-PRF-55681 Style
(mm) (mm) Max. (mm) Max. (mm) Min. (mm) Max. (mm)
CDR31 0805 2.00 1.25 1.3 .50 .70 .30
CDR32 1206 3.20 1.60 1.3 — .70 .30
CDR33 1210 3.20 2.50 1.5 — .70 .30
CDR34 1812 4.50 3.20 1.5 — .70 .30
CDR35 1825 4.50 6.40 1.5 — .70 .30
080620

MIL-PRF-55681/Chips
Military Part Number Identification CDR31
CDR31 to MIL-PRF-55681/7
Designation 1 / in pF tolerance Designation 1 / in pF tolerance
Style 0805/CDR31 (BP) Style 0805/CDR31 (BP) cont’d

CDR31BP1R0B--- 1.0 B,C BP 100 CDR31BP101B--- 100 F,J,K BP 100
CDR31BP2R7B--- 2.7 B,C,D BP 100 CDR31BP271B--- 270 F,J,K BP 100
CDR31BP5R1B--- 5.1 B,C,D BP 100 CDR31BP511A--- 510 F,J,K BP 50
CDR31BP7R5B--- 7.5 B,C,D BP 100
CDR31BP8R2B--- 8.2 B,C,D BP 100 Style 0805/CDR31 (BX)
CDR31BP9R1B--- 9.1 B,C,D BP 100 CDR31BX471B--- 470 K,M BX 100
CDR31BP100B--- 10 FJ,K BP 100 CDR31BX561B--- 560 K,M BX 100
CDR31BP130B--- 13 FJ,K BP 100 CDR31BX102B--- 1,000 K,M BX 100
CDR31BP200B--- 20 F,J,K BP 100 CDR31BX222B--- 2,200 K,M BX 100
CDR31BP330B--- 33 F,J,K BP 100 CDR31BX562A--- 5,600 K,M BX 50
CDR31BP360B--- 36 FJ,K BP 100 CDR31BX682A--- 6,800 K,M BX 50
CDR31BP390B--- 39 F,J,K BP 100 CDR31BX822A--- 8,200 K,M BX 50
CDR31BP510B--- 51 F,J,K BP 100 CDR31BX153A--- 15.000 K,M BX 50
CDR31BP560B--- 56 FJ,K BP 100 CDR31BX183A--- 18.000 K,M BX 50
CDR31BP620B--- 62 F,J,K BP 100
CDR31BP680B--- 68 FJ,K BP 100
CDR31BP750B--- 75 FJ,K BP 100
CDR31BP820B--- 82 F,J,K BP 100 Add appropriate termination finish
CDR31BP910B--- 91 FJ,K BP 100
1/ The complete part number will include additional symbols to indicate
Add appropriate termination finish capacitance tolerance, termination and failure rate level.
100821

MIL-PRF-55681/Chips
Military Part Number Identification CDR32
CDR32 to MIL-PRF-55681/8
Rated temperature Rated Temperature
and Voltage- WVDC and Voltage- WVDC
Designation 1 / in pF Tolerance Designation 1 / in pF Tolerance
Temperature Limits Temperature Limits
Style 1206/CDR32 (BP) Style 1206/CDR32 (BP) cont’d

CDR32BP1R0B--- 1.0 B,C BP 100 CDR32BP101B--- 100 FJ,K BP 100
CDR32BP2R7B--- 2.7 B,C,D BP 100 CDR32BP271B--- 270 FJ,K BP 100
CDR32BP100B--- 10 FJ,K BP 100 CDR32BP102B--- 1,000 FJ,K BP 100
CDR32BP110B--- 11 F,J,K BP 100 CDR32BP112A--- 1,100 FJ,K BP 50
CDR32BP120B--- 12 FJ,K BP 100 CDR32BP122A--- 1,200 F,J,K BP 50
CDR32BP130B--- 13 FJ,K BP 100 CDR32BP132A--- 1,300 FJ,K BP 50
CDR32BP150B--- 15 FJ,K BP 100 CDR32BP152A--- 1,500 F,J,K BP 50
CDR32BP200B--- 20 F,J,K BP 100 CDR32BP202A--- 2,000 F,J,K BP 50
CDR32BP240B--- 24 F,J,K BP 100
CDR32BP270B--- 27 FJ,K BP 100 Style 1206/CDR32 (BX)
CDR32BP300B--- 30 FJ,K BP 100
CDR32BX103B--- 10,000 K,M BX 100
CDR32BP470B--- 47 FJ,K BP 100
CDR32BP560B--- 56 FJ,K BP 100 CDR32BX153B--- 15.000 K,M BX 100
CDR32BX273A--- 27,000 K,M BX 50
CDR32BP750B--- 75 FJ,K BP 100
CDR32BP910B--- 91 FJ,K BP 100 CDR32BX393A--- 39.000 K,M BX 50
Add appropriate failure rate Add appropriate failure rate
Add appropriate termination finish Add appropriate termination finish
Capacitance Tolerance Capacitance Tolerance

capacitance tolerance, termination and failure rate level.
040121

MIL-PRF-55681/Chips
Military Part Number Identification CDR33/34/35
CDR33/34/35 to MIL-PRF-55681/9/10/11
Designation 1 / in pF tolerance Designation 1 / in pF tolerance
Style 1210/CDR33 (BP) Style 1812/CDR34 (BX)

CDR33BP102B--- 1,000 FJ,K BP 100 CDR34BX273B--- 27.000 K,M BX 100
CDR33BP162B--- 1,600 FJ,K BP 100 CDR34BX104A--- 100,000 K,M BX 50
CDR33BP182B--- 1,800 F,J,K BP 100 CDR34BX124A--- 120,000 K,M BX 50
CDR33BP202B--- 2,000 FJ,K BP 100 CDR34BX154A--- 150.000 K,M BX 50
CDR33BP222B--- 2,200 F,J,K BP 100 CDR34BX184A--- 180.000 K,M BX 50
CDR33BP242A--- 2,400 FJ,K BP 50
CDR33BP272A--- 2,700 FJ,K BP 50 Style 1825/CDR35 (BP)
CDR33BP302A--- 3,000 F,J,K BP 50
CDR33BP332A--- 3,300 FJ,K BP 50 CDR35BP472B--- 4,700 FJ,K BP 100
CDR35BP512B--- 5,100 F,J,K BP 100
Style 1210/CDR33 (BX) CDR35BP562B--- 5,600 FJ,K BP 100
CDR35BP622B--- 6,200 F,J,K BP 100
CDR33BX153B--- 15.000 K,M BX 100 CDR35BP682B--- 6,800 FJ,K BP 100
CDR33BX183B--- 18.000 K,M BX 100
CDR35BP752B--- 7,500 FJ,K BP 100
CDR33BX223B--- 22,000 K,M BX 100
CDR35BP822B--- 8,200 F,J,K BP 100
CDR33BX273B--- 27.000 K,M BX 100
CDR35BP912B--- 9,100 FJ,K BP 100
CDR33BX393A--- 39.000 K,M BX 50
CDR35BP103B--- 10,000 FJ,K BP 100
CDR33BX473A--- 47.000 K,M BX 50 CDR35BP113A--- 11,000 F,J,K BP 50
CDR33BX563A--- 56.000 K,M BX 50
CDR35BP123A--- 12,000 FJ,K BP 50
CDR33BX683A--- 68.000 K,M BX 50
CDR35BP133A--- 13.000 F,J,K BP 50
CDR33BX823A--- 82,000 K,M BX 50
CDR35BP153A--- 15.000 FJ,K BP 50
CDR33BX104A--- 100,000 K,M BX 50
CDR35BP163A--- 16.000 F,J,K BP 50
CDR35BP183A--- 18,000 FJ,K BP 50
Style 1812/CDR34 (BP)
CDR35BP203A--- 20,000 FJ,K BP 50
CDR34BP222B--- 2,200 FJ,K BP 100 CDR35BP223A--- 22,000 F,J,K BP 50
CDR34BP242B--- 2,400 F,J,K BP 100
CDR34BP272B--- 2,700 FJ,K BP 100 Style 1825/CDR35 (BX)
CDR34BP302B--- 3,000 F,J,K BP 100
CDR34BP392B--- 3,900 F,J,K BP 100 CDR35BX823B--- 82,000 K,M BX 100
CDR34BP432B--- 4,300 FJ,K BP 100 CDR35BX104B--- 100,000 K,M BX 100
CDR34BP472B--- 4,700 F,J,K BP 100 CDR35BX124B--- 120,000 K,M BX 100
CDR34BP512A--- 5,100 FJ,K BP 50 CDR35BX154B--- 150.000 K,M BX 100
CDR34BP562A--- 5,600 FJ,K BP 50 CDR35BX184A--- 180.000 K,M BX 50
CDR34BP622A--- 6,200 F,J,K BP 50 CDR35BX224A--- 220,000 K,M BX 50
CDR34BP752A--- 7,500 F,J,K BP 50 CDR35BX334A--- 330.000 K,M BX 50
CDR34BP103A--- 10,000 F,J,K BP 50
capacitance tolerance, termination and failure rate level.

MLCC Medical Applications – MM Series
The MM series is a multi-layer ceramic capacitor designed for use in medical applications other than
implantable/life support. These components have the design & change control expected for medical devices
and also offer enhanced LAT including reliability testing and 100% inspection.
APPLICATIONS
Implantable, Non-Life Supporting Medical Devices
• e.g. implanted temporary cardiac monitor, insulin pumps
External, Life Supporting Medical Devices
• e.g. heart pump external controller
External Devices
• e.g. patient monitoring, diagnostic equipment
HOW TO ORDER
MM02 Z A 100 J G T 3 A
Size Rated Dielectric Capacitance Capacitance Failure Rate Termination Packaging Special
MM02 = 0402 Voltage Code Code (In pF) Tolerance C = Standard Finish 2 = 7" Reel Code
MM03 = 0603 Z = 10V A = NP0 (C0G) (2 significant B = ±0.1pF Range T = Plated Ni & Sn 4 = 13" Reel A = Standard
MM05 = 0805 Y = 16V C = X7R digits + number C = ±0.25pF (NP0 only) Contact KYOC-
Contact KYOC-
MM06 = 1206 3 = 25V of zeros) D = ±0.5pF ERA AVX Z = Flexiterm ERA AVX
for others
MM10 = 1210 5 = 50V for values <10pF: F = ±1% (≥10pF) for others (X7R only)
MM08 = 1808 1 = 100V letter R denotes G = ±2% (≥10pF)
MM12 = 1812 2 = 200V decimal point. J = ±5%
MM20 = 2220 V = 250V Example: K = ±10%
7 = 500V 68pF = 680 M = ±20%
8.2pF = 8R2
COMMERCIAL VS MM SERIES PROCESS COMPARISON

Commercial MM Series
Standard part numbers; no restriction on
Administrative Specific series part number, used to control supply of product
who purchases these parts
Lot Qualification Destructive
As per EIA RS469 Increased sample plan – stricter criteria
Physical Analysis (DPA)
Visual/Cosmetic Quality Standard process and inspection 100% inspection
Standard sampling for accelerated wave Increased sampling for accelerated wave solder on X7R and NP0
Application Robustness
solder on X7R dielectrics followed by lot by lot reliability testing
KYOCERA AVX will qualify and notify customers before making any
change to the following materials or processes:
Required to inform customer of changes in: Dielectric formulation, type, or supplier Metal formulation, type, or
Design/Change Control
form fit function supplier Termination material formulation, type, or supplier Manufacturing
equipment type Quality testing regime including sample size and
accept/ reject criteria
062121

MM Series – MLCC for Medical Applications
NP0 (C0G) – Specifications & Test Methods
Q Voltage: 1.0Vrms ± .2V
≥30 pF: Q≥ 1000
for 500V devices.
±5% or ±.5 pF, whichever is greater
Flexure
Stresses Q Meets Initial Values (As Above)
Insulation
Resistance
Solderability
Capacitance
Variation
Q Meets Initial Values (As Above) Dip device in eutectic solder at 260ºC for 60
Resistance to
seconds. Store at room temperature for 24 ± 2
Solder Heat
Resistance
Dielectric
Strength
Capacitance
Variation
Thermal Q Meets Initial Values (As Above) Step 3: +125ºC ± 2º 30 ± 3 minutes
Shock
Insulation
Resistance
Capacitance
≤ ±3.0% or ± .3 pF, whichever is greater Charge device with twice rated voltage in test
Variation
≥ 30 pF: Q≥ 350 chamber set at 125ºC ± 2ºC
Q ≥10 pF, <30 pF: Q≥ 275 +5C/2 for 1000 hours (+48, -0).
Load Life <10 pF: Q≥ 200 +10C
Insulation Remove from test chamber and stabilize at
≥ Initial Value x 0.3 (See Above) room temperature for 24 hours
Resistance
before measuring.
Dielectric
Strength
Capacitance
Variation
Store in a test chamber set at 85ºC ± 2ºC/ 85%
≥ 30 pF: Q≥ 350 ± 5% relative humidity for 1000 hours
≥ Initial Value x 0.3 (See Above) temperature for 24 ± 2 hours before measuring.
Resistance
Dielectric
Strength
113016

NP0/C0G Capacitance Range
SIZE 0603 0805 1206
WVDC 16 25 50 100 16 25 50 100 16 25 50 100
Cap 0.5 0R5
(pF) 1.0 1R0
1.2 1R2
1.5 1R5
1.8 1R8
2.2 2R2
2.7 2R7
3.3 3R3
3.9 3R9
4.7 4R7
5.6 5R6
6.8 6R8
8.2 8R2
10 100
12 120
15 150
18 180
22 220
27 270
33 330
39 390
47 470
56 560
68 680
82 820
100 101
120 121
150 151
180 181
220 221
270 271
330 331
390 391
470 471
560 561
680 681
820 821
1000 102
1200 122
1500 152
WVDC 16 25 50 100 16 25 50 100 16 25 50 100
SIZE 0603 0805 1206
113016

X7R Specifications and Test Methods

≤ 10% for ≥ 50V DC rating Freq.: 1.0 kHz ± 10%
Dissipation Factor
≤ 12.5% for 25V and 16V DC rating
100,000MΩ or 1000MΩ - μF, Charge device with rated voltage for 120 ± 5
whichever is less secs @ room temp/humidity
for 500V devices.
≤ ±12%
Flexure Dissipation
Factor
Insulation
Resistance
Solderability
Capacitance
≤ ±7.5%
Variation
Solder Heat
Resistance
Dielectric
Strength
Capacitance
Variation
Thermal Dissipation
Shock Factor
Insulation
Resistance
Capacitance Charge device with 1.5 rated voltage (≤ 10V) in
≤ ±12.5%
Variation test chamber set at 125ºC ± 2ºC
Dissipation for 1000 hours (+48, -0)
≤ Initial Value x 2.0 (See Above)
Load Life Factor
Insulation Remove from test chamber and stabilize at
≥ Initial Value x 0.3 (See Above) room temperature for 24 ± 2 hours before
Resistance
Dielectric measuring.
Strength
Capacitance Store in a test chamber set at 85ºC ± 2ºC/ 85%
≤ ±12.5%
Variation ± 5% relative humidity for 1000 hours
Factor
Humidity
Resistance
Dielectric 24 ± 2 hours before measuring.
Strength
110121

X7R Capacitance Range
SIZE 0402 0603 0805 1206 1210 1808 1812 2220
WVDC 16 25 50 10 16 25 50 100 200 10 16 25 50 100 200 250 10 16 25 50 100 200 250 500 10 16 25 50 100 200 250 500 50 100 200 50 100 200 250 25 50 100
Cap 220 221
(pF) 270 271
330 331
390 391
470 471
560 561
680 681
820 821
1000 102
1200 122
1500 152
1800 182
2200 222
2700 272
3300 332
3900 392
4700 472
5600 562
6800 682
8200 822
cap 0.010 103
uF 0.012 123
0.015 153
0.018 183
0.022 223
0.027 273
0.033 333
0.039 393
0.047 473
0.056 563
0.068 683
0.082 823
0.10 104
0.12 124
0.15 154
0.22 224
0.33 334
0.47 474
0.56 564
0.68 684
0.82 824
1.0 105
1.2 125
1.5 155
WVDC 16 25 50 10 16 25 50 100 200 10 16 25 50 100 200 250 10 16 25 50 100 200 250 500 10 16 25 50 100 200 250 500 50 100 200 50 100 200 250 25 50 100
SIZE 0402 0603 0805 1206 1210 1808 1812 2220
110116

Packaging of Chip Components
Automatic Insertion Packaging
TAPE & REEL QUANTITIES
All tape and reel specifications are in compliance with RS481.
4mm 8mm 12mm

0612, 0508, 0805, 1206,
Paper or Embossed Carrier
1210
1812, 1825
Embossed Only 0101 1808
2220, 2225
Paper Only 0101, 0201, 0306, 0402, 0603
1,000, 2,000, 3,000 or 4,000, 10,000, 15,000, 20,000 500, 1,000
Qty. per Reel/7" Reel 4,000 3,000
Contact factory for exact quantity Contact factory for exact quantity
5,000, 10,000, 50,000
Qty. per Reel/13" Reel 10,000 4,000
Contact factory for exact quantity
REEL DIMENSIONS
Tape A B* D* N W2
C W1 W3
Size(1) Max. Min. Min. Min. Max.
1.80 1.5 13.0±0.5 20.2 60.0 4.35±0.3 7.95
4mm
(7.087) (0.059) (0.522±0.020) (0.795) (2.362) (0.171±0.011) (0.312)
7.90 Min.
+1.5
8.40 -0.0 14.4 (0.311)
8mm +0.059
(0.331 -0.0 ) (0.567) 10.9 Max.
+0.50
330 1.5 13.0 -0.20 20.2 50.0 (0.429)
(12.992) (0.059) +0.020
(0.512 -0.008 ) (0.795) (1.969) 11.9 Min.
+2.0
12.4 -0.0 18.4 (0.469)
12mm +0.079
(0.488 -0.0 ) (0.724) 15.4 Max.
(0.607)
Metric dimensions will govern.

English measurements rounded and for reference only.
(1) For tape sizes 16mm and 24mm (used with chip size 3640) consult EIA RS-481 latest revision.

Embossed Carrier Configuration
4, 8 & 12mm Tape Only
4, 8 & 12mm Embossed Tape

Metric Dimensions Will Govern
CONSTANT DIMENSIONS
Tape Size D0 E1 P0 P2 S1 Min. T Max. T1 Max.
0.80±0.04 0.90±0.05 2.0±0.04 1.00±0.02 1.075 0.26 0.06
4mm
(0.031±0.001) (0.035±0.001) (0.078±0.001) (0.039±0.0007) (0.042) (0.010) (0.002)
+0.10
8mm 1.50 -0.0 1.75 ± 0.10 4.0 ± 0.10 2.0 ± 0.05 0.60 0.60 0.10
& 12mm (0.059
+0.004
-0.0 ) (0.069 ± 0.004) (0.157 ± 0.004) (0.079 ± 0.002) (0.024) (0.024) (0.004)
VARIABLE DIMENSIONS
P1 R
B1 D1 E2 W
Tape Size F Min. T2 A0 B0 K0
Max. Min. Min. See Note 5 Max.
See Note 2
4.35 1.00 6.25 3.50 ± 0.05 4.00 ± 0.10 25.0 2.50 Max. 8.30
8mm See Note 1
(0.171) (0.039) (0.246) (0.138 ± 0.002) (0.157 ± 0.004) (0.984) (0.098) (0.327)
8.20 1.50 10.25 5.50 ± 0.05 4.00 ± 0.10 30.0 6.50 Max. 12.3
12mm See Note 1
(0.323) (0.059) (0.404) (0.217 ± 0.002) (0.157 ± 0.004) (1.181) (0.256) (0.484)
4.35 1.00 6.25 3.50 ± 0.05 2.00 ± 0.10 25.0 2.50 Max. 8.30
8mm 1/2 Pitch See Note 1
(0.171) (0.039) (0.246) (0.138 ± 0.002) (0.079 ± 0.004) (0.984) (0.098) (0.327)
12mm Double 8.20 1.50 10.25 5.50 ± 0.05 8.00 ± 0.10 30.0 6.50 Max. 12.3
See Note 1
Pitch (0.323) (0.059) (0.404) (0.217 ± 0.002) (0.315 ± 0.004) (1.181) (0.256) (0.484)
NOTES: 3. Bar code labeling (if required) shall be on the side of the reel opposite the round
1. The cavity defined by A0, B0, and K0 shall be configured to provide the following: sprocket holes. Refer to EIA-556.
Surround the component with sufficient clearance such that: 4. B1 dimension is a reference dimension for tape feeder clearance only.
b) the component does not protrude beyond the sealing plane of the cover tape. 5. If P1 = 2.0mm, the tape may not properly index in all tape feeders.
c) the component can be removed from the cavity in a vertical direction without
mechanical restriction, after the cover tape has been removed.
d) rotation of the component is limited to 20º maximum (see Sketches D & E).
e) lateral movement of the component is restricted to 0.5mm maximum (see Sketch F).
2. Tape with or without components shall pass around radius “R” without damage.

Paper Carrier Configuration
8 & 12mm Tape Only
4, 8 & 12mm Embossed Tape

Metric Dimensions Will Govern
CONSTANT DIMENSIONS
Tape Size D0 E P0 P2 T1 G. Min. R Min.
+0.10 0.10 0.75 25.0 (0.984)
8mm and 1.50 -0.0 1.75 ± 0.10 4.00 ± 0.10 2.00 ± 0.05
(0.004) (0.030) See Note 2
12mm (0.059
+0.004
) (0.069 ± 0.004) (0.157 ± 0.004) (0.079 ± 0.002)
-0.0
Max. Min. Min.
VARIABLE DIMENSIONS
P1
Tape Size E2 Min. F W A0 B0 T
See Note 4
+0.30
4.00 ± 0.10 6.25 3.50 ± 0.05 8.00 -0.10 See Note 1
8mm +0.012 1.10mm
(0.157 ± 0.004) (0.246) (0.138 ± 0.002) (0.315 -0.004 )
(0.043) Max.
4.00 ± 0.10 10.25 5.50 ± 0.05 12.0 ± 0.30 for Paper Base Tape
12mm
(0.157 ± 0.004) (0.404) (0.217 ± 0.002) (0.472 ± 0.012) and
+0.30
8mm 2.00 ± 0.05 6.25 3.50 ± 0.05 8.00 -0.10
1/2 Pitch (0.079 ± 0.002) (0.246) (0.138 ± 0.002) +0.012
(0.315 -0.004 ) 1.60mm
(0.063) Max.
12mm for Non-Paper Base
8.00 ± 0.10 10.25 5.50 ± 0.05 12.0 ± 0.30
Double Compositions
(0.315 ± 0.004) (0.404) (0.217 ± 0.002) (0.472 ± 0.012)
Pitch
NOTES: 3. Bar code labeling (if required) shall be on the side of the reel opposite the sprocket
1. The cavity defined by A0, B0, and T shall be configured to provide sufficient clearance holes. Refer to EIA-556.
surrounding the component so that: 4. If P1 = 2.0mm, the tape may not properly index in all tape feeders.
a) the component does not protrude beyond either surface of the carrier tape;
b) ) the component can be removed from the cavity in a vertical direction without
mechanical restriction after the top cover tape has been removed;
c) rotation of the component is limited to 20º maximum (see Sketches A & B);
d) lateral movement of the component is restricted to 0.5mm maximum (see Sketch C).
2. Tape with or without components shall pass around radius “R” without damage.
Bar Code Labeling Standard

KYOCERA AVX bar code labeling is available and follows latest version of EIA-556

Basic Capacitor Formulas
I. Capacitance (farads) XI. Equivalent Series Resistance (ohms)
E.S.R. = (D.F.) (Xc) = (D.F.) / (2 π fC)
XII. Power Loss (watts)
Power Loss = (2 π fCV2) (D.F.)
XIII. KVA (Kilowatts)
KVA = 2 π fCV2 x 10-3
II. Energy stored in capacitors (Joules, watt - sec)
XIV. Temperature Characteristic (ppm/°C)
E = ½ CV2
III. Linear charge of a capacitor (Amperes)
XV. Cap Drift (%)

IV. Total Impedance of a capacitor (ohms)
V. Capacitive Reactance (ohms)

XVI. Reliability of Ceramic Capacitors
VI. Inductive Reactance (ohms)

xL = 2 π fL XVII. Capacitors in Series (current the same)
VII. Phase Angles:
Ideal Capacitors: Current leads voltage 90°
Ideal Inductors: Current lags voltage 90°
Ideal Resistors: Current in phase with voltage
VIII. Dissipation Factor (%)
XVIII. Capacitors in Parallel (voltage the same)

CT = C1 + C2 --- + CN
XIX. Aging Rate
IX. Power Factor (%) A.R. = %∆ C/decade of time
P.F. = Sine (loss angle) = Cos φ (phase angle) XX. Decibels
P.F. = (when less than 10%) = DF
X. Quality Factor (dimensionless)
METRIC PREFIXES SYMBOLS
Pico X 10-12 K = Dielectric Constant f = frequency Lt = Test life

Nano X 10-9 A = Area L = Inductance Vt = Test voltage
Micro X 10-6 TD = Dielectric thickness δ = Loss angle Vo = Operating voltage
Milli X 10-3 V = Voltage φ = Phase angle Tt = Test temperature

t = time X & Y = exponent effect of voltage and temp. To = Operating temperature
Deci X 10-1
RS = Series Resistance Lo = Operating life
Deca X 10+1
Kilo X 10+3
Mega X 10+6
Giga X 10+9
Tera X 10+12

General Description
Basic Construction – A multilayer ceramic (MLC) capacitor is a monolithic today’s electronic equipment.
block of ceramic containing two sets of offset, interleaved planar electrodes
that extend to two opposite surfaces of the ceramic dielectric. This simple
structure requires a considerable amount of sophistication, both in material
and manufacture, to produce it in the quality and quantities needed in
Electrode
Ceramic Layer
End Terminations
Terminated
Edge
Terminated
Edge
Margin Electrodes
Multilayer Ceramic Capacitor

Figure 1
Formulations – Multilayer ceramic capacitors are available in both Class Class 2 – EIA Class 2 capacitors typically are based on the chemistry
1 and Class 2 formulations. Temperature compensating formulation are of barium titanate and provide a wide range of capacitance values and
Class 1 and temperature stable and general application formulations are temperature stability. The most commonly used Class 2 dielectrics are X7R
classified as Class 2. and Y5V. The X7R provides intermediate capacitance values which vary only
±15% over the temperature range of -55°C to 125°C. It finds applications
where stability over a wide temperature range is required.
Class 1 – Class 1 capacitors or temperature compensating capacitors are The Y5V provides the highest capacitance values and is used in applications
usually made from mixtures of titanates where barium titanate is normally where limited temperature changes are expected. The capacitance value for
not a major part of the mix. They have predictable temperature coefficients Y5V can vary from 22% to -82% over the -30°C to 85°C temperature range.
and in general, do not have an aging characteristic. Thus they are the most
All Class 2 capacitors vary in capacitance value under the influence of
stable capacitor available. The most popular Class 1 multilayer ceramic
temperature, operating voltage (both AC and DC), and frequency. For
capacitors are C0G (NP0) temperature compensating capacitors (negative-
additional information on performance changes with operating conditions,
positive 0 ppm/°C).
consult KYOCERA AVX’s software, SpiCap.

General Description
Table 1: EIA and MIL Temperature Stable and General Effects of Voltage – Variations in voltage have little effect on Class
Application Codes 1 dielectric but does affect the capacitance and dissipation factor of
Class 2 dielectrics. The application of DC voltage reduces both the
capacitance and dissipation factor while the application of an AC
EIA CODE
voltage within a reasonable range tends to increase both capacitance
Percent Capacity Change Over Temperature Range
and dissipation factor readings. If a high enough AC voltage is applied,
RS198 Temperature Range
eventually it will reduce capacitance just as a DC voltage will. Figure 2
X7 -55°C to +125°C
shows the effects of AC voltage.
X6 -55°C to +105°C
X5 -55°C to +85°C
Y5 -30°C to +85°C
Z5 +10°C to +85°C
Code Percent Capacity Change Cap. Change vs. A.C. Volts
D ±3.3% X7R
E ±4.7%
F ±7.5%
P ±10%
R ±15%
S ±22%
T +22%, -33%
U +22%, - 56%
V +22%, -82%
EXAMPLE – A capacitor is desired with the capacitance value at 25°C to
increase no more than 7.5% or decrease no more than 7.5% from -30°C to
+85°C. EIA Code will be Y5F.
MIL CODE
Symbol Temperature Range
A -55°C to +85°C
B -55°C to +125°C Figure 2
C -55°C to +150°C
Cap. Change Cap. Change Capacitor specifications specify the AC voltage at which to measure
Symbol
Zero Volts Rated Volts (normally 0.5 or 1 VAC) and application of the wrong voltage can cause
R +15%, -15% +15%, -40%
S +22%, -22% +22%, -56%
spurious readings. Figure 3 gives the voltage coefficient of dissipation
W +22%, -56% +22%, -66% factor for various AC voltages at 1 kilohertz. Applications of different
X +15%, -15% +15%, -25% frequencies will affect the percentage changes versus voltages.
Y +30%, -70% +30%, -80%
Z +20%, -20% +20%, -30%
Temperature characteristic is specified by combining range and change
symbols, for example BR or AW. Specification slash sheets indicate the
characteristic applicable to a given style of capacitor. D.F. vs. A.C. Measurement Volts
X7R
In specifying capacitance change with temperature for Class 2
materials, EIA expresses the capacitance change over an operating
temperature range by a 3 symbol code. The first symbol represents the
cold temperature end of the temperature range, the second represents
the upper limit of the operating temperature range and the third
symbol represents the capacitance change allowed over the operating
temperature range. Table 1 provides a detailed explanation of the EIA
system.
Figure 3
Typical effect of the application of DC voltage is shown in Figure 4. The
voltage coefficient is more pronounced for higher K dielectrics. These
figures are shown for room temperature conditions. The combination
characteristic known as voltage temperature limits which shows the
effects of rated voltage over the operating temperature range is shown
in Figure 5 for the military BX characteristic.

General Description
Typical Cap. Change vs. D.C. Volts
Example Change vs. D.C. Volts
X7R
X7R
5
Capacitance Change Percent
Example
Typical Curve
Curve of of Aging
Aging Rate
Rate
0 X7R
X7R
+1.5
-5
-10 0
Capacitance Change Percent

-15
-1.5
-20
25% 50% 75% 100%
Percent Rated Volts -3.0
Figure 4
-4.5
Typical Cap.
Example Cap.Change
Changevs.
vs.Temperature
Temperature
X7R
-6.0
-7.5
1 10 100 1000 10,000 100,000
Hours
Characteristic Max. Aging Rate %/Decade
C0G (NP0) None
X7R, X5R 2
Y5V 7
Figure 6
Effects of Frequency – Frequency affects capacitance and impedance
characteristics of capacitors. This effect is much more pronounced in
high dielectric constant ceramic formulation than in low K formulations.
KYOCERA AVX’s SpiCap software generates impedance, ESR, series
Figure 5 inductance, series resonant frequency and capacitance all as functions of
frequency, temperature and DC bias for standard chip sizes and styles. It
Effects of Time – Class 2 ceramic capacitors change capacitance is available free from KYOCERA AVX and can be downloaded for free from
and dissipation factor with time as well as temperature, voltage and KYOCERA AVX website: www.kyocera-avx.com.
frequency. This change with time is known as aging. Aging is caused
by a gradual re-alignment of the crystalline structure of the ceramic
and produces an exponential loss in capacitance and decrease
in dissipation factor versus time. A typical curve of aging rate for
semistable ceramics is shown in Figure 6.
If a Class 2 ceramic capacitor that has been sitting on the shelf for
a period of time, is heated above its curie point, (125°C for 4 hours
or 150°C for 1⁄2 hour will suffice) the part will de-age and return to
its initial capacitance and dissi-pation factor readings. Because the
capacitance changes rapidly, immediately after de-aging, the basic
capacitance measurements are normally referred to a time period
sometime after the de-aging process. Various manufacturers use
different time bases but the most popular one is one day or twenty-
four hours after “last heat.” Change in the aging curve can be caused
by the application of voltage and other stresses. The possible
changes in capacitance due to de-aging by heating the unit explain
why capacitance changes are allowed after test, such as temperature
cycling, moisture resistance, etc., in MIL specs. The application of high
voltages such as dielectric withstanding voltages also tends to de-age
capacitors and is why re-reading of capacitance after 12 or 24 hours
is allowed in military specifications after dielectric strength tests have
been performed.
052020

General Description
Effects of Mechanical Stress – High “K” dielectric ceramic capacitors Energy Stored – The energy which can be stored in a capacitor is given
exhibit some low level piezoelectric reactions under mechanical stress. by the formula:
As a general statement, the piezoelectric output is higher, the higher
the dielectric constant of the ceramic. It is desirable to investigate
this effect before using high “K” dielectrics as coupling capacitors in E = ½CV2
extremely low level applications.
Reliability – Historically ceramic capacitors have been one of the most E = energy in joules (watts-sec)
reliable types of capacitors in use today. The approximate formula for V = applied voltage
the reliability of a ceramic capacitor is: C = capacitance in farads
Potential Change – A capacitor is a reactive component which reacts
against a change in potential across it. This is shown by the equation
for the linear charge of a capacitor:
where
Lo = operating life Tt = test temperature and
where
Lt = test life To = operating temperature
I = Current
Vt = test voltage in °C
C = Capacitance
Vo = operating voltage X,Y = see text
dV/dt = Slope of voltage transition across capacitor
Thus an infinite current would be required to instantly change the
Historically for ceramic capacitors exponent X has been considered
potential across a capacitor. The amount of current a capacitor can
as 3. The exponent Y for temperature effects typically tends to run
“sink” is determined by the above equation.
about 8.
Equivalent Circuit – A capacitor, as a practical device, exhibits not
only capacitance but also resistance and inductance. A simplified
A capacitor is a component which is capable of storing electrical energy. schematic for the equivalent circuit is:
It consists of two conductive plates (electrodes) separated by insulating C = Capacitance L = Inductance
material which is called the dielectric. A typical formula for determining
Rs = Series Resistance Rp = Parallel Resistance
capacitance is:
C = capacitance (picofarads)
K = dielectric constant (Vacuum = 1)
A = area in square inches
t = separation between the plates in inches
(thickness of dielectric)
.224 = conversion constant Reactance – Since the insulation resistance (Rp) is normally very high,
(.0884 for metric system in cm) the total impedance of a capacitor is:
Capacitance – The standard unit of capacitance is the farad. A
capacitor has a capacitance of 1 farad when 1 coulomb charges it to
1 volt. One farad is a very large unit and most capacitors have values
in the micro (10-6), nano (10-9) or pico (10-12) farad level.
where
Dielectric Constant – In the formula for capacitance given above the
dielectric constant of a vacuum is arbitrarily chosen as the number Z = Total Impedance
1. Dielectric constants of other materials are then compared to the Rs = Series Resistance
dielectric constant of a vacuum. XC = Capacitive Reactance =
Dielectric Thickness – Capacitance is indirectly proportional to the XL = Inductive Reactance = 2 π fL
separation between electrodes. Lower voltage requirements mean
thinner dielectrics and greater capacitance per volume. The variation of a capacitor’s impedance with frequency determines
its effectiveness in many applications.
Area – Capacitance is directly proportional to the area of the
electrodes. Since the other variables in the equation are usually set by Phase Angle – Power Factor and Dissipation Factor are often
the performance desired, area is the easiest parameter to modify to confused since they are both measures of the loss in a capacitor under
obtain a specific capacitance within a material group. AC application and are often almost identical in value. In a “perfect”
capacitor the current in the capacitor will lead the voltage by 90°.

General Description
The seen in current microprocessors can be as high as 0.3 A/ns,

and up to 10A/ns. At 0.3 A/ns, 100pH of parasitic inductance can
cause a voltage spike of 30mV. While this does not sound very drastic,
with the Vcc for microprocessors decreasing at the current rate, this
can be a fairly large percentage.
Another important, often overlooked, reason for knowing the parasitic
inductance is the calculation of the resonant frequency. This can be
important for high frequency, bypass capacitors, as the resonant
point will give the most signal attenuation. The resonant frequency is
calculated from the simple equation:
In practice the current leads the voltage by some other phase angle
due to the series resistance RS. The complement of this angle is called
the loss angle and:
Insulation Resistance – Insulation Resistance is the resistance
Power Factor (P.F.) = Cos φ or Sine δ measured across the terminals of a capacitor and consists principally
Dissipation Factor (D.F.) = tan δ of the parallel resistance RP shown in the equivalent circuit. As
capacitance values and hence the area of dielectric increases, the
I.R. decreases and hence the product (C x IR or RC) is often specified
for small values of the tan and sine are essentially equal which has in ohm farads or more commonly megohm-microfarads. Leakage
led to the common interchangeability of the two terms in the industry. current is determined by dividing the rated voltage by IR (Ohm’s Law).
Dielectric Strength – Dielectric Strength is an expression of the ability
Equivalent Series Resistance – The term E.S.R. or Equivalent of a material to withstand an electrical stress. Although dielectric
Series Resistance combines all losses both series and parallel in strength is ordinarily expressed in volts, it is actually dependent on the
a capacitor at a given frequency so that the equivalent circuit is thickness of the dielectric and thus is also more generically a function
reduced to a simple R-C series connection. of volts/mil.
Dielectric Absorption – A capacitor does not discharge instantaneously
upon application of a short circuit, but drains gradually after the
capacitance proper has been discharged. It is common practice to
measure the dielectric absorption by determining the “reappearing
voltage” which appears across a capacitor at some point in time after
it has been fully discharged under short circuit conditions.
Corona – Corona is the ionization of air or other vapors which causes
Dissipation Factor – The DF/PF of a capacitor tells what percent of the
them to conduct current. It is especially prevalent in high voltage units
apparent power input will turn to heat in the capacitor.
but can occur with low voltages as well where high voltage gradients
occur. The energy discharged degrades the performance of the
capacitor and can in time cause catastrophic failures.
The watts loss are:

Watts loss = (2 π fCV2 ) (D.F.)
Very low values of dissipation factor are expressed as their reciprocal

for convenience. These are called the “Q” or Quality factor of capacitors.
Parasitic Inductance – The parasitic inductance of capacitors
is becoming more and more important in the decoupling of
today’s high speed digital systems. The relationship between the
inductance and the ripple voltage induced on the DC voltage line
can be seen from the simple inductance equation:

Surface Mounting Guide
MLC Chip Capacitors
REFLOW SOLDERING
Case Size D1 D2 D3 D4 D5
0201 0.85 (0.033) 0.30 (0.012) 0.25 (0.010) 0.30 (0.012) 0.35 (0.014)
0402 1.70 (0.067) 0.60 (0.024) 0.50 (0.020) 0.60 (0.024) 0.50 (0.020)
0603 2.30 (0.091) 0.80 (0.031) 0.70 (0.028) 0.80 (0.031) 0.75 (0.030)
0805 3.00 (0.118) 1.00 (0.039) 1.00 (0.039) 1.00 (0.039) 1.25 (0.049)
1206 4.00 (0.157) 1.00 (0.039) 2.00 (0.079) 1.00 (0.039) 1.60 (0.063)
1210 4.00 (0.157) 1.00 (0.039) 2.00 (0.079) 1.00 (0.039) 2.50 (0.098)
1808 5.60 (0.220) 1.00 (0.039) 3.60 (0.142) 1.00 (0.039) 2.00 (0.079)
1812 5.60 (0.220) 1.00 (0.039) 3.60 (0.142) 1.00 (0.039) 3.00 (0.118)
1825 5.60 (0.220) 1.00 (0.039) 3.60 (0.142) 1.00 (0.039) 6.35 (0.250)
2220 6.60 (0.260) 1.00 (0.039) 4.60 (0.181) 1.00 (0.039) 5.00 (0.197)
2225 6.60 (0.260) 1.00 (0.039) 4.60 (0.181) 1.00 (0.039) 6.35 (0.250)
Dimensions in millimeters (inches)
Component Pad Design

Component pads should be designed to achieve good solder filets and decrease this to as low as 85% of component width but it is
minimize component movement during reflow soldering. Pad designs not advisable to go below this.
are given below for the most common sizes of multilayer ceramic • Pad overlap 0.5mm beneath component.
capacitors for both wave and reflow soldering. The basis of these • Pad extension 0.5mm beyond components for reflow and
designs is: 1.0mm for wave soldering.
• Pad width equal to component width. It is permissible to
WAVE SOLDERING
Case Size D1 D2 D3 D4 D5
0603 3.10 (0.12) 1.20 (0.05) 0.70 (0.03) 1.20 (0.05) 0.75 (0.03)
0805 4.00 (0.15) 1.50 (0.06) 1.00 (0.04) 1.50 (0.06) 1.25 (0.05)
1206 5.00 (0.19) 1.50 (0.06) 2.00 (0.09) 1.50 (0.06) 1.60 (0.06)
Dimensions in millimeters (inches)
Component Spacing Preheat & Soldering

For wave soldering components, must be spaced sufficiently far apart The rate of preheat should not exceed 4°C/second to prevent
to avoid bridging or shadowing (inability of solder to penetrate properly thermal shock. A better maximum figure is about 2°C/second.
into small spaces). This is less important for reflow soldering but For capacitors size 1206 and below, with a maximum thickness of
sufficient space must be allowed to enable rework should it be required. 1.25mm, it is generally permissible to allow a temperature differential
from preheat to soldering of 150°C. In all other cases this differential
should not exceed 100°C.
For further specific application or process advice, please consult
KYOCERA AVX.
Cleaning
Care should be taken to ensure that the capacitors are thoroughly
cleaned of flux residues especially the space beneath the capacitor.
Such residues may otherwise become conductive and effectively offer
a low resistance bypass to the capacitor.
Ultrasonic cleaning is permissible, the recommended conditions being
8 Watts/litre at 20-45 kHz, with a process cycle of 2 minutes vapor
rinse, 2 minutes immersion in the ultrasonic solvent bath and finally 2
minutes vapor rinse.

Recommended Soldering Profiles
REFLOW SOLDER PROFILES Recommended Reflow Profiles
275
KYOCERA AVX RoHS compliant products utilize termination Pb Free Recommended
Component Temperature / ºC
finishes (e.g.Sn or SnAg) that are compatible with all Pb- 250 Pb Free Max with care
Sn Pb Recommended
Free soldering systems and are fully reverse compatible 225
with SnPb soldering systems. A recommended SnPb 200

profile is shown for comparison; for Pb-Free soldering, IPC/
175
JEDECJ- STD-020C may be referenced. The upper line in
the chart shows the maximum envelope to which products 150
are qualified (typically 3x reflow cycles at 260ºC max). The 125

center line gives the recommended profile for optimum 100
wettability and soldering in Pb-Free Systems.
75
Preheat: 50
25
0 20 40 60 80 100 120 140 160 180 200 220 240 260 280 300 320 340 360 380 400 420
Time / secs
The pre-heat stabilizes the part and reduces the temperature
differential prior to reflow. The initial ramp to 125ºC may be rapid, but
from that point (2-3)ºC/sec is recommended to allow ceramic parts to
heat uniformly and plastic encapsulated parts to stabilize through the
glass transition temperature of the body (~ 180ºC).
Reflow:
In the reflow phase, the maximum recommended time > 230ºC is
40secs. Time at peak reflow is 10secs max.; optimum reflow is
achieved at 250ºC, (see wetting balance chart opposite) but products
are qualified to 260ºC max. Please reference individual product
datasheets for maximum limits
Cool Down:
Cool down should not be forced and 6ºC/sec is recommended. A slow
cool down will result in a finer grain structure of the reflow solder in the IMPORTANT NOTE: Typical Pb-Free reflow solders have a more dull
solder fillet. and grainy appearance compared to traditional SnPb. Elevating the
reflow temperature will not change this, but extending the cool down
WAVE SOLDER PROFILES can help improve the visual appearance of the joint.
For wave solder, there is no change in the recommended wave profile;
all standard Pb-Free (SnCu/SnCuAg) systems operate at the same
260ºC max recommended for SnPb systems.
Preheat:
This is more important for wave solder; a higher temperature preheat
will reduce the thermal shock to SMD parts that are immersed (please
consult individual product data sheets for SMD parts that are suited to
wave solder). SMD parts should ideally be heated from the bottom-Side
prior to wave. PTH (Pin through hole) parts on the topside should not Recommended Soldering Profiles
be separately heated. 275
Wave:
Component Temperature / ºC
225
250ºC – 260ºC recommended for optimum solderability.
Cool Down:
175
As with reflow solder, cool down should not be forced and 6ºC/sec is
recommended. Any air knives at the end of the 2nd wave should be
heated. 125
Wave
75
Preheat Cool Down
25
0 50 100 150 200 250 300 350 400
Time / seconds

MLC Chip Capacitors
APPLICATION NOTES It is important to avoid the possibility of thermal shock during soldering and
carefully controlled preheat is therefore required. The rate of preheat should
Storage not exceed 4°C/second and a target figure 2°C/second is recommended.
The components should be stored in their “as received packaging” where Although an 80°C to 120°C temperature differential is preferred, recent
possible. If the components are removed from their original packaging developments allow a temperature differential between the component
then they should be stored in an airtight container (e.g. a heat sealed surface and the soldering temperature of 150°C (Maximum) for capacitors
plastic bag) with desiccant (e.g. silica gel). Storage area temperature of 1210 size and below with a maximum thickness of 1.25mm. The user is
should be kept between +5 degrees C and +30 degrees C with humidity < cautioned that the risk of thermal shock increases as chip size or temperature
70% RH. Storage atmosphere must be free of gas containing sulfur and differential increases.
chlorine. Avoid exposing the product to saline moisture or to temperature
changes that might result in the formation of condensation. To assure
Soldering
good solderability performance we recommend that the product be used Mildly activated rosin fluxes are preferred. The minimum amount of solder to
within 6 months from our shipping date, but can be used for up to 12 give a good joint should be used. Excessive solder can lead to damage from
months. Chip capacitors may crack if exposed to hydrogen (H2) gas while the stresses caused by the difference in coefficients of expansion between
sealed or if coated with silicon, which generates hydrogen gas. solder, chip and substrate. KYOCERA AVX terminations are suitable for all
wave and reflow soldering systems. If hand soldering cannot be avoided, the
Solderability preferred technique is the utilization of hot air soldering tools.
Terminations to be well soldered after immersion in a 60/40 tin/lead
solder bath at 245°C +/- 5°C for 5 +0/-0.5 seconds.
Cooling
Natural cooling in air is preferred, as this minimizes stresses within the
Leaching soldered joint. When forced air cooling is used, cooling rate should not
Terminations will resist leaching for at least the immersion times and exceed 4°C/second. Quenching is not recommended but if used, maximum
conditions shown below. temperature differentials should be observed according to the preheat
conditions above.
Cleaning
Solder Tin/ Solder Immersion Flux residues may be hygroscopic or acidic and must be removed. KYOCERA
Termination Type AVX MLC capacitors are acceptable for use with all of the solvents described
Lead/Silver Temp °C Time Seconds
in the specifications MIL-STD-202 and EIA-RS-198. Alcohol based solvents
Nickel Barrier 60/40/0 260 ± 5 30 ± 1
are acceptable and properly controlled water cleaning systems are also
acceptable. Many other solvents have been proven successful, and most
Lead-Free Wave Soldering solvents that are acceptable to other components on circuit assemblies are
equally acceptable for use with ceramic capacitors.
The recommended peak temperature for lead-free wave soldering is
250°C-260°C for 3-5 seconds. The other parameters of the profile remains Prevention of Metallic Migration
the same as above.
Note that when components with Sn plating on the end terminations are
The following should be noted by customers changing from lead based to be used in applications that are likely to experience conditions of high
systems to the new lead free pastes. humidity under bias voltage, we strongly recommend that the circuit boards
A. The visual standards used for evaluation of solder joints will be conformally coated to protect the Sn from moisture that might lead to
need to be modified as lead free joints are not as bright as with migration and eventual current leakage.
tin-lead pastes and the fillet may not be as large. When using Capacitor Arrays we recommend that there is no differential in
B. Lead-free solder pastes do not allow the same self alignment applied voltage between adjacent elements.
as lead containing systems. Standard mounting pads are
acceptable, but machine set up may need to be modified.
General
Surface mounting chip multilayer ceramic capacitors are designed for
soldering to printed circuit boards or other substrates. The construction
of the components is such that they will withstand the time/temperature
profiles used in both wave and reflow soldering methods.
Handling
Chip multilayer ceramic capacitors should be handled with care to avoid
damage or contamination from perspiration and skin oils. The use of
tweezers or vacuum pick ups is strongly recommended for individual
components. Bulk handling should ensure that abrasion and mechanical
shock are minimized. Taped and reeled components provides the
ideal medium for direct presentation to the placement machine. Any
mechanical shock should be minimized during handling chip multilayer
ceramic capacitors.
Preheat
021519

MLC Chip Capacitors
POST SOLDER HANDLING
Once SMP components are soldered to the board, any bending or flexure
of the PCB applies stresses to the soldered joints of the components. For
leaded devices, the stresses are absorbed by the compliancy of the metal
leads and generally don’t result in problems unless the stress is large
enough to fracture the soldered connection.
Ceramic capacitors are more susceptible to such stress because they don’t
have compliant leads and are brittle in nature. The most frequent failure Type A:
mode is low DC resistance or short circuit. The second failure mode is Angled crack between bottom of device to top of solder joint.
significant loss of capacitance due to severing of contact between sets of
the internal electrodes.
Cracks caused by mechanical flexure are very easily identified and generally
take one of the following two general forms:
Mechanical cracks are often hidden underneath the termination and are
difficult to see externally. However, if one end termination falls off during the
removal process from PCB, this is one indication that the cause of failure
was excessive mechanical stress due to board warping. Type B:
Fracture from top of device to bottom of device.
COMMON CAUSES OF
MECHANICAL CRACKING
REWORKING OF MLCS
The most common source for mechanical stress is board depanelization
equipment, such as manual breakapart, v-cutters and shear presses. Thermal shock is common in MLCs that are manually attached or
Improperly aligned or dull cutters may cause torqueing of the PCB reworked with a soldering iron. KYOCERA AVX strongly recommends that
resulting in flex stresses being transmitted to components near the any reworking of MLCs be done with hot air reflow rather than soldering
board edge. Another common source of flexural stress is contact during irons. It is practically impossible to cause any thermal shock in ceramic
parametric testing when test points are probed. If the PCB is allowed capacitors when using hot air reflow.
to flex during the test cycle, nearby ceramic capacitors may be broken. However direct contact by the soldering iron tip often causes thermal
A third common source is board to board connections at vertical cracks that may fail at a later date. If rework by soldering iron is absolutely
connectors where cables or other PCBs are connected to the PCB. If necessary, it is recommended that the wattage of the iron be less than 30
the board is not supported during the plug/unplug cycle, it may flex and watts and the tip temperature be <300ºC. Rework should be performed by
cause damage to nearby components. applying the solder iron tip to the pad and not directly contacting any part
of the ceramic capacitor.
Special care should also be taken when handling large (>6" on a side) PCBs
since they more easily flex or warp than smaller boards.
Preferred Method - No Direct Part Contact Poor Method - Direct Contact with Part
PCB BOARD DESIGN

To avoid many of the handling problems, KYOCERA AVX recommends that MLCs be located at least .2" away from nearest edge of board. However when
this is not possible, KYOCERA AVX recommends that the panel be routed along the cut line, adjacent to where the MLC is located.
No Stress Relief for MLCs Routed Cut Line Relieves Stress on MLC

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Tel: +1 864-967-2150 Tel: +44 1276-697000 Tel: +65 6286-7555
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ANY USE OF PRODUCT OUTSIDE OF SPECIFICATIONS OR ANY STORAGE OR INSTALLATION

– surface mount ceramic capacitor products –

U Dielectric MLCC with FLEXITERM®

– surface mount ceramic capacitor products –

0805 5 A 101 J* A T 2 A**

Size Voltage Dielectric Capacitance Tolerance Failure Terminations Packaging Special

* B, C & D tolerance for ≤10 pF values.

High Voltage MLC Chips

Style Voltage Temperature Capacitance Capacitance Failure Termination Packaging/ Special

For RoHS compliant products,

– surface mount ceramic capacitor products –

Low Inductance Capacitors (LICC®)

Interdigitated Capacitors (IDC)

Low Inductance Decoupling Capacitor Arrays (LICA)

– surface mount ceramic capacitor products –

PART NUMBER (SEE PAGE 4 FOR COMPLETE PART NUMBER EXPLANATION)

Size Voltage Dielectric Capacitance Capacitance Failure Terminations Packaging Special

– surface mount ceramic capacitor products –

– surface mount ceramic capacitor products –

– surface mount ceramic capacitor products –

PREFERRED SIZES ARE SHADED

SIZE 1210 1812 1825 2220 2225

– surface mount ceramic capacitor products –

Case Size Dielectric = Capacitance Termination Special Code

ELECTRICAL CHARACTERISTICS LEAD-FREE COMPATIBLE

Capacitance Values and Tolerances:

– surface mount ceramic capacitor products –

ULTRA LOW ESR, “U” SERIES

ESR Measured on the Boonton 34A

– surface mount ceramic capacitor products –

– surface mount ceramic capacitor products –

0402 0603 0805 1210

Case Size Dielectric = Capacitance Termination Special Code

– surface mount ceramic capacitor products –

ULTRA LOW ESR, “U” SERIES

ESR Measured on the Boonton 34A

– surface mount ceramic capacitor products –

– surface mount ceramic capacitor products –

0.060±0.010 0.030±0.010 0.036 max 0.010±0.005 0.030 min

Case Size Dielectric = Capacitance Termination Special Code

ELECTRICAL CHARACTERISTICS LEAD-FREE COMPATIBLE

– surface mount ceramic capacitor products –

ULTRA LOW ESR, “U” SERIES

– surface mount ceramic capacitor products –

1.0 5.6 1.2 7.5 B (±0.1pF)

1.8 8.2 1.8 10.0

2.4 12.0 2.4 15.0

3.6 3.0 22.0 J (±5%)

***25 each of 15 values 3.3 27.0

***25 each of 24 values

1.5 18.0 2.7 39.0

2.2 22.0 4.7 47.0

2.4 24.0 5.1 B (±0.1pF) 51.0

2.7 27.0 6.8 56.0

3.0 33.0 8.2 68.0

4.7 47.0 13.0 120.0

5.6 56.0 15.0 130.0

7.5 68.0 18.0 240.0

10.0 100.0 24.0 390.0