Full-Bridge DMOS PWM Motor Driver: Description Features and Benefits
Full-Bridge DMOS PWM Motor Driver: Description Features and Benefits
Full-Bridge DMOS PWM Motor Driver: Description Features and Benefits
Not to scale
Load Supply
Charge
OSC Pump VBB
IN1
Control
Logic
Disable OUT1
TSD
IN2 UVLO OUT2
7V
GND
LSS
VREF ÷ 10 (Optional)
A4950-DS, Rev. 2
A4950 Full-Bridge DMOS PWM Motor Driver
Selection Guide
Part Number Packing
A4950ELJTR-T 3000 pieces per 13-in. reel
Thermal Characteristics may require derating at maximum conditions, see application information
Characteristic Symbol Test Conditions* Value Unit
On 2-layer PCB with 0.8 in2. exposed 2-oz. copper each side 62 ºC/W
Package Thermal Resistance RθJA
On 4-layer PCB based on JEDEC standard 35 ºC/W
Characteristic Performance
VIN(1)
IN1
GND
VIN(1)
IN2
GND
+IREG
IOUT(x)
0A
-IREG
Functional Description
Protection circuitry includes internal thermal shutdown, and pro- Overcurrent Protection
tection against shorted loads, or against output shorts to ground A current monitor will protect the IC from damage due to output
or supply. Undervoltage lockout prevents damage by keeping the shorts. If a short is detected, the IC will latch the fault and disable
outputs off until the driver has enough voltage to operate nor- the outputs. The fault latch can only be cleared by coming out of
mally. Low Power Standby mode or by cycling the power to VBB. Dur-
ing OCP events, Absolute Maximum Ratings may be exceeded
Standby Mode
for a short period of time before the device latches.
Low Power Standby mode is activated when both input (INx)
pins are low for longer than 1 ms. Low Power Standby mode Shutdown
disables most of the internal circuitry, including the charge pump If the die temperature increases to approximately 160°C, the full
and the regulator. When the A4950 is coming out of standby bridge outputs will be disabled until the internal temperature falls
mode, the charge pump should be allowed to reach its regulated below a hysteresis, TTSDhys , of 15°C. Internal UVLO is present
voltage (a maximum delay of 200 μs) before any PWM com- on VBB to prevent the output drivers from turning-on below the
mands are issued to the device. UVLO threshold.
Internal PWM Current Control Braking
Initially, a diagonal pair of source and sink FET outputs are The braking function is implemented by driving the device in
enabled and current flows through the motor winding and the Slow Decay mode, which is done by applying a logic high to both
optional external current sense resistor, RS . When the voltage inputs, after a bridge-enable Chop command (see PWM Control
across RS equals the comparator trip value, then the current sense Truth Table). Because it is possible to drive current in both direc-
comparator resets the PWM latch. The latch then turns off the tions through the DMOS switches, this configuration effectively
sink and source FETs (Mixed Decay mode). shorts-out the motor-generated BEMF, as long as the Chop com-
VREF mand is asserted. The maximum current can be approximated by
The maximum value of current limiting is set by the selection of VBEMF / RL . Care should be taken to ensure that the maximum
RSx and the voltage at the VREF pin. The transconductance func- ratings of the device are not exceeded in worse case braking situ-
tion is approximated by the maximum value of current limiting, ations: high speed and high-inertia loads.
VPHASE
See Enlargement A
IOUT
0
Enlargement A
Fixed Off-Time, toff = 25 μs
ITrip
IOUT
Application Information
Sense Pin (LSS) of the device makes a good location for the star ground point. The
In order to use PWM current control, a low-value resistor is exposed pad can be connected to ground for this purpose.
placed between the LSS pin and ground for current sensing pur-
poses. To minimize ground-trace IR drops in sensing the output Layout
current level, the current sensing resistor should have an indepen- The PCB should have a thick ground plane. For optimum
dent ground return to the star ground point. This trace should be electrical and thermal performance, the A4950 must be soldered
as short as possible. For low-value sense resistors, the IR drops in directly onto the board. On the underside of the A4950 package is
the PCB can be significant, and should be taken into account. an exposed pad, which provides a path for enhanced thermal dis-
sipation. The thermal pad must be soldered directly to an exposed
When selecting a value for the sense resistor be sure not to
exceed the maximum voltage on the LSS pin of ±500 mV at surface on the PCB in order to achieve optimal thermal conduc-
maximum load. During overcurrent events, this rating may be tion. Thermal vias are used to transfer heat to other layers of the
exceeded for short durations. PCB.
Ground The load supply pin, VBB, should be decoupled with an electro-
A star ground should be located as close to the A4950 as possible. lytic capacitor (typically 100 μF) in parallel with a lower valued
The copper ground plane directly under the exposed thermal pad ceramic capacitor placed as close as practicable to the device.
Solder
GND GND A4950
Trace (2 oz.)
Signal (1 oz.)
Ground (1 oz.)
PCB
Thermal (2 oz.)
OUT2
RS Thermal Vias
OUT1
C1
A4950
1 GND
C2 VBB OUT2
BULK LSS
CAPACITANCE PAD RS
IN2
IN1 OUT1
VREF VBB
VBB
C1 C2
GND GND
Bill of Materials
Item Reference Value Units Description
0.25 2512, 1 W, 1% or better,
1 RS Ω
(for VREF = 5 V, IOUT = 2 A) carbon film chip resistor
2 C1 0.22 μF X5R minimum, 50 V or greater
3 C2 100 μF Electrolytic, 50 V or greater
4.90 ±0.10
8° 0.65
0° 8 1.27
8
0.25 1.75
0.17
B
2.41 NOM 3.90 ±0.10 6.00 ±0.20 2.41 5.60
A 1.04 REF
1 2
1.27 1 2
3.30 NOM 0.40
3.30
0.25 BSC
C PCB Layout Reference View
SEATING PLANE
Branded Face
GAUGE PLANE
8X C
SEATING
0.10 C PLANE For Reference Only; not for tooling use (reference MS-012BA)
Dimensions in millimeters
1.70 MAX Dimensions exclusive of mold flash, gate burrs, and dambar protrusions
0.51
0.31 0.15 Exact case and lead configuration at supplier discretion within limits shown
0.00
1.27 BSC A Terminal #1 mark area
B Exposed thermal pad (bottom surface); dimensions may vary with device
C Reference land pattern layout (reference IPC7351
SOIC127P600X175-9AM); all pads a minimum of 0.20 mm from all
adjacent pads; adjust as necessary to meet application process
requirements and PCB layout tolerances; when mounting on a multilayer
PCB, thermal vias at the exposed thermal pad land can improve thermal
dissipation (reference EIA/JEDEC Standard JESD51-5)
Revision History
Revision Revision Date Description of Revision
Rev. 2 November 9, 2011 Update PWM timing, AV