DH61AG TechProdSpec04

Intel Desktop Board DH61AG
Technical Product Specification
October 2011 Order Number: G28731-004
The Intel Desktop Board DH61AG may contain design defects or errors known as errata that may cause the product to deviate from published specifications. Current characterized errata are documented in the Intel Desktop Board DH61AG Specification Update.
Revision History
Revision 001 002 003 004 Revision History First release of the Intel Desktop Board DH61AG Technical Product Specification Updated to include specification clarifications Updated the Board Identification Information Section Updated to include specification clarifications
Date May 2011 July 2011 July 2011 October 2011
Disclaimer
This product specification applies to only the standard Intel Desktop Board with BIOS identifier AGH6110H.86A.
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTELS TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS OTHERWISE AGREED IN WRITING BY INTEL, THE INTEL PRODUCTS ARE NOT DESIGNED NOR INTENDED FOR ANY APPLICATION IN WHICH THE FAILURE OF THE INTEL PRODUCT COULD CREATE A SITUATION WHERE PERSONAL INJURY OR DEATH MAY OCCUR. All Intel desktop boards are evaluated as Information Technology Equipment (I.T.E.) for use in personal computers (PC) for installation in homes, offices, schools, computer rooms, and similar locations. The suitability of this product for other PC or embedded non-PC applications or other environments, such as medical, industrial, alarm systems, test equipment, etc. may not be supported without further evaluation by Intel. Intel Corporation may have patents or pending patent applications, trademarks, copyrights, or other intellectual property rights that relate to the presented subject matter. The furnishing of documents and other materials and information does not provide any license, express or implied, by estoppel or otherwise, to any such patents, trademarks, copyrights, or other intellectual property rights. Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions marked reserved or undefined. Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. Intel desktop boards may contain design defects or errors known as errata, which may cause the product to deviate from published specifications. Current characterized errata are available on request. Contact your local Intel sales office or your distributor to obtain the latest specifications before placing your product order.
Intel, Intel Core, Intel Celeron, Intel Xeon, and Pentium are trademarks of Intel Corporation in the U.S. and/or other countries. * Other names and brands may be claimed as the property of others. Copyright 2011, Intel Corporation. All rights reserved.
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Board Identification Information

Basic Desktop Board DH61AG Identification Information
AA Revision
G23736-400 G23736-500 Notes: 1. 2. The AA number is found on a small label on the component side of the board. The H61 processor used on this AA revision consists of the following component:
BIOS Revision
AGH6110H.86A.0023 AGH6110H.86A.0023
Notes
1,2 1,2
Device
BD82H61
Stepping
B3
S-Spec Numbers
SLJ4B
Specification Changes or Clarifications

Table 1 indicates the Specification Changes or Specification Clarifications that apply to the Intel Desktop Board DH61AG. Table 1. Specification Changes or Clarifications
Date
July 2011
Type of Change
Spec Clarification
Description of Changes or Clarifications

The BIOS was updated to AGH6110H.86A.0023 just prior to product launch. Section 2.2.3.3 Power Supply Connectors additional information has been added to the External Power Supply section. Sections 1.10 Audio Subsystem and Section 2.2.3.1 Signal Tables for the Connectors and Headers have been updated to show that AA revision G23736-400 supports 5.1 analog surround audio and AA revision G23736-500 supports both 5.1 and 7.1 analog surround audio.
July 2011
Spec Clarification
AGH6110H.86A.0027 will not be implemented with AA Revision G23736-500 as planned. The BIOS will remain at AGH6110H.86A.0023. Updates were made to Tables 3, 4, and 14. References to 2.6A USB current specifics were removed from the TPS
October 2011
Spec Clarification
Errata
Current characterized errata, if any, are documented in a separate Specification Update. See http://developer.intel.com/products/desktop/motherboard/index.htm for the latest documentation.
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Preface
This Technical Product Specification (TPS) specifies the board layout, components, connectors, power and environmental requirements, and the BIOS for Intel Desktop Board DH61AG.
Intended Audience
The TPS is intended to provide detailed, technical information about Intel Desktop Board DH61AG and its components to the vendors, system integrators, and other engineers and technicians who need this level of information. It is specifically not intended for general audiences.
What This Document Contains

Chapter 1 2 3 4 5 Description A description of the hardware used on Intel Desktop Board DH61AG A map of the resources of the Intel Desktop Board The features supported by the BIOS Setup program A description of the BIOS error messages, beep codes, and POST codes Regulatory compliance and battery disposal information
Typographical Conventions
This section contains information about the conventions used in this specification. Not all of these symbols and abbreviations appear in all specifications of this type.
Notes, Cautions, and Warnings

NOTE
Notes call attention to important information.
CAUTION
Cautions are included to help you avoid damaging hardware or losing data.
Intel Desktop Board DH61AG Technical Product Specification
Other Common Notation

# GB GB/s Gb/s KB Kbit kbits/s MB MB/s Mbit Mbits/s TDP xxh x.x V * Used after a signal name to identify an active-low signal (such as USBP0#) Gigabyte (1,073,741,824 bytes) Gigabytes per second Gigabits per second Kilobyte (1024 bytes) Kilobit (1024 bits) 1000 bits per second Megabyte (1,048,576 bytes) Megabytes per second Megabit (1,048,576 bits) Megabits per second Thermal Design Power An address or data value ending with a lowercase h indicates a hexadecimal value. Volts. Voltages are DC unless otherwise specified. This symbol is used to indicate third-party brands and names that are the property of their respective owners.
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Contents
Revision History
Disclaimer ............................................................................................... ii Board Identification Information .................................................................iii Errata.....................................................................................................iii
Prefacev
Intended Audience ................................................................................... v What This Document Contains.................................................................... v Typographical Conventions ........................................................................ v
1 Product Description
1.1 Overview........................................................................................ 13 1.1.1 Feature Summary ................................................................ 13 1.1.2 Board Layout (Top)............................................................... 15 1.1.3 Board Layout (Bottom).......................................................... 17 1.1.4 Block Diagram ..................................................................... 18 1.2 Online Support................................................................................ 19 1.3 Processor ....................................................................................... 19 1.4 System Memory .............................................................................. 20 1.4.1 Memory Configurations ......................................................... 21 1.5 Intel H61 Express Chipset ............................................................... 23 1.6 Graphics Subsystem ........................................................................ 23 1.6.1 Integrated Graphics .............................................................. 23 1.6.2 Flat Panel Display Interfaces .................................................. 26 1.6.3 USB ................................................................................... 29 1.7 SATA Interfaces .............................................................................. 30 1.7.1 AHCI Mode .......................................................................... 30 1.8 Real-Time Clock Subsystem .............................................................. 31 1.9 Legacy I/O Controller ....................................................................... 31 1.9.1 Consumer Infrared (CIR) ....................................................... 31 1.10 Audio Subsystem............................................................................. 32 1.10.1 Audio Subsystem Software .................................................... 33 1.10.2 Audio Subsystem Components ............................................... 33 1.11 LAN Subsystem ............................................................................... 35 1.11.1 Intel 82579V Gigabit Ethernet Controller ................................ 35 1.11.2 LAN Subsystem Software....................................................... 36 1.11.3 RJ-45 LAN Connector with Integrated LEDs .............................. 36 1.12 Hardware Management Subsystem .................................................... 37 1.12.1 Hardware Monitoring............................................................. 37 1.12.2 Fan Monitoring ..................................................................... 37 1.12.3 Thermal Monitoring .............................................................. 38
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1.13 Power Management ......................................................................... 39 1.13.1 ACPI................................................................................... 39 1.13.2 Hardware Support ................................................................ 41
2 Technical Reference
2.1 Memory Resources .......................................................................... 45 2.1.1 Addressable Memory............................................................. 45 2.1.2 Memory Map........................................................................ 47 2.2 Connectors and Headers................................................................... 47 2.2.1 Back Panel Connectors .......................................................... 48 2.2.2 Connectors and Headers (Top) ............................................... 49 2.2.3 Connectors and Headers (Bottom) .......................................... 51 2.3 I/O Shields ..................................................................................... 64 2.4 Jumper Block .................................................................................. 67 2.5 Mechanical Considerations ................................................................ 68 2.5.1 Form Factor......................................................................... 68 2.5.2 Board 3D View ..................................................................... 70 2.6 Electrical Considerations ................................................................... 71 2.6.1 Power Supply Considerations ................................................. 71 2.6.2 Fan Header Current Capability................................................ 73 2.6.3 PCI Express* Add-in Card Considerations................................. 73 2.7 Thermal Considerations .................................................................... 73 2.8 Reliability ....................................................................................... 76 2.9 Environmental ................................................................................ 76
3 Overview of BIOS Features

3.1 3.2 3.3 3.4 3.5 3.6 3.7 Introduction ................................................................................... BIOS Flash Memory Organization ....................................................... System Management BIOS (SMBIOS)................................................. Legacy USB Support ........................................................................ BIOS Updates ................................................................................. 3.5.1 Language Support ................................................................ 3.5.2 Custom Splash Screen .......................................................... BIOS Recovery................................................................................ Boot Options................................................................................... 3.7.1 Optical Drive Boot ................................................................ 3.7.2 Network Boot....................................................................... 3.7.3 Booting Without Attached Devices........................................... 3.7.4 Changing the Default Boot Device During POST ........................ Adjusting Boot Speed....................................................................... 3.8.1 Peripheral Selection and Configuration..................................... 3.8.2 BIOS Boot Optimizations ....................................................... BIOS Security Features .................................................................... 77 78 79 79 80 80 81 81 82 82 82 82 82 83 83 83 84
3.8 3.9
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Contents
4 Error Messages and Beep Codes

4.1 4.2 4.3 4.4 4.5 Speaker ......................................................................................... 85 BIOS Beep Codes ............................................................................ 85 Front-panel Power LED Blink Codes .................................................... 86 BIOS Error Messages ....................................................................... 86 Port 80h POST Codes ....................................................................... 87
5 Regulatory Compliance and Battery Disposal Information

5.1 Regulatory Compliance..................................................................... 93 5.1.1 Safety Standards.................................................................. 93 5.1.2 European Union Declaration of Conformity Statement ................ 94 5.1.3 Product Ecology Statements................................................... 95 5.1.4 EMC Regulations .................................................................. 97 5.1.5 ENERGY STAR* 5.0, e-Standby, and ErP Compliance ................100 5.1.6 Regulatory Compliance Marks (Board Level) ............................101 5.2 Battery Disposal Information............................................................102
Figures
1. 2. 3. 4. 5. 6. 7. 8. 9. 10. 11. 12. 13. 14. 15. 16. 17. 18. 19. 20. 21. 22. 23. Major Board Components (Top) ......................................................... 15 Major Board Components (Bottom) .................................................... 17 Block Diagram ................................................................................ 18 Memory Channel and SO-DIMM Configuration...................................... 22 Flat Panel Connectors....................................................................... 26 Back Panel Audio Connectors ............................................................ 33 Internal Audio Headers..................................................................... 34 LAN Connector LED Locations ............................................................ 36 Thermal Sensors and Fan Headers ..................................................... 38 Location of the Standby Power LED .................................................... 44 Detailed System Memory Address Map ............................................... 46 Back Panel Connectors ..................................................................... 48 Connectors and Headers (Top) .......................................................... 49 Connectors and Headers (Bottom) ..................................................... 51 Connection Diagram for Front Panel Header ........................................ 61 Connection Diagram for Front Panel USB 2.0 Dual-Port Headers ............. 63 Connection Diagram for the Front Panel USB 2.0 Single-Port Header....... 63 Half-Height Back Panel I/O Shield ...................................................... 65 Standard-Height Back Panel I/O Shield ............................................... 66 Location of the Jumper Block............................................................. 67 Board Dimensions ........................................................................... 69 3D View of Intel Desktop Board DH61AG ............................................ 70 Localized High Temperature Zones..................................................... 74
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Tables
1. 2. 3. 4. 5. 6. 7. 8. 9. 10. 11. 12. 13. 14. 15. 16. 17. 18. 19. 20. 21. 22. 23. 24. 25. 26. 27. 28. 29. 30. 31. 32. 33. 34. 35. 36. 37. 38. 39. 40. 41. 42. 43. 44. 45. 46. Specification Changes or Clarifications ..................................................iii Feature Summary............................................................................ 13 Components Shown in Figure 1 ......................................................... 16 Components Shown in Figure 2 ......................................................... 17 Supported Memory Configurations ..................................................... 20 HDMI Port Status Conditions ............................................................. 24 DVI Port Status Conditions................................................................ 25 Audio Jack Support .......................................................................... 32 LAN Connector LED States ................................................................ 36 Effects of Pressing the Power Switch .................................................. 39 Power States and Targeted System Power........................................... 40 Wake-up Devices and Events ............................................................ 41 System Memory Map ....................................................................... 47 Connectors and Headers Shown in Figure 13 ....................................... 50 Connectors and Headers Shown in Figure 14 ....................................... 51 Front Panel Audio Header for Intel HD Audio........................................ 52 Front Panel Audio Header for AC97 Audio ........................................... 52 Analog Surround Audio Header for AA Revision G23736-400 .................. 53 Analog Surround Audio Header for AA Revision G23736-500 .................. 53 Internal Stereo Speakers Header ....................................................... 53 Internal S/PDIF or DMIC Header ........................................................ 54 Dual-Port Front Panel USB 2.0 Headers............................................... 54 Single-Port USB 2.0 Header .............................................................. 54 SATA Connectors............................................................................. 54 SATA Power Connector ..................................................................... 55 Fan Headers ................................................................................... 55 Front Panel CIR Receiver (Input) Header............................................. 55 HTPC Header .................................................................................. 56 Panel Voltage Selection Header ......................................................... 56 Backlight Inverter Voltage Selection Header ........................................ 56 40-Pin LVDS Connector .................................................................... 57 40-Pin eDP Connector ...................................................................... 58 8-Pin FPD Brightness Connector......................................................... 58 PCI Express Full-/Half-Mini Card Connector ......................................... 59 19 V Internal Power Supply Connector................................................ 60 Front Panel Header .......................................................................... 61 States for a One-Color Power LED ...................................................... 62 Debug Header................................................................................. 64 BIOS Setup Configuration Jumper Settings.......................................... 68 Typical System-Level Power Consumption Figures ................................ 72 Fan Header Current Capability........................................................... 73 Thermal Considerations for Components ............................................. 75 Tcontrol Values for Components ........................................................ 75 Environmental Specifications............................................................. 76 BIOS Setup Program Menu Bar.......................................................... 78 BIOS Setup Program Function Keys.................................................... 78
Contents
47. 48. 49. 50. 51. 52. 53. 54. 55. 56. 57. 58.
AccepDrives/Media Types for BIOS Recovery ....................................... 81 Boot Device Menu Options ................................................................ 82 Supervisor and User Password Functions............................................. 84 BIOS Beep Codes ............................................................................ 85 Front-panel Power LED Blink Codes .................................................... 86 BIOS Error Messages ....................................................................... 86 Port 80h POST Code Ranges.............................................................. 87 Port 80h POST Codes ....................................................................... 88 Typical Port 80h POST Sequence........................................................ 92 Safety Standards............................................................................. 93 EMC Regulations ............................................................................. 97 Regulatory Compliance Marks...........................................................101
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1
1.1
1.1.1
Product Description
Overview
Feature Summary
Table 2 summarizes the major features of the board. Table 2. Feature Summary
Form Factor Processor Mini-ITX (6.7 inches by 6.7 inches [170.18 millimeters by 170.18 millimeters]) Intel Core i7, Intel Core i5, Intel Core i3, Intel Pentium, Intel Celeron, and Intel Xeon processors in an LGA1155 socket with up to 65 W TDP: Integrated graphics processing (processors with Intel Graphics Technology) Integrated PCI Express* v2.0 interface controller Integrated memory controller Memory Two 204-pin DDR3 SDRAM Small Outline Dual Inline Memory Module (SO-DIMM) sockets Support for DDR3 1333 MHz and DDR3 1066 MHz SO-DIMMs Support for 1 Gb, 2 Gb, and 4 Gb memory technology Support for up to 16 GB of system memory with two SO-DIMMs using 4 Gb memory technology Support for non-ECC memory Support for 1.35 V low voltage JEDEC memory Chipset Graphics Intel H61 Express Chipset consisting of the Intel H61 Express Platform Controller Hub (PCH) Integrated graphics support for processors with Intel Graphics Technology: High Definition Multimedia Interface* (HDMI*) DVI-I Internal flat panel displays: LVDS eDP (Embedded DisplayPort*) Audio 10-channel (8+2) Intel High Definition (Intel HD) audio via the Realtek* ALC892 audio codec Digital/analog stereo line-out (2-in-1 digital/analog back panel jack) In-chassis stereo speakers support (3 W/4 via internal header) AV-compliant 7.1 (see note on page 32) surround support (analog line-level via internal header) Secondary S/PDIF digital audio output (internal header) DMIC digital microphone input (internal header) Analog line-in (back panel jack) Front panel HD Audio/AC97 headphones/mic support (internal header) 8-channel (7.1) Intel High Definition Audio via the HDMI interface
continued
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Table 2. Feature Summary (continued)

Peripheral Interfaces Two USB 3.0 ports, via an NEC D720200 controller, implemented through two back panel connectors (blue) Ten USB 2.0 ports: Four ports implemented through two dual-port internal headers (black) One single-port internal header (black) Two high-current/fast-charging ports implemented through stacked back panel connectors (yellow) One port implemented in the PCI Express HalfMini Card slot Two ports implemented in the PCI Express Full-Mini Card slot Four SATA ports: Two internal SATA connectors (black) One back panel eSATA connector (red) One internal mSATA port (PCI Express Full-Mini Card slot) Expansion Capabilities BIOS One PCI Express 2.0 x4 add-in card connector One PCI Express Half-Mini Card slot One PCI Express Full-/Half-Mini Card slot Intel BIOS resident in the Serial Peripheral Interface (SPI) Flash device Support for Advanced Configuration and Power Interface (ACPI), Plug and Play, and System Management BIOS (SMBIOS) LAN Support Legacy I/O Control Hardware Monitor Subsystem Gigabit (10/100/1000 Mbits/s) LAN subsystem using the Intel 82579V Gigabit Ethernet Controller Nuvoton W83677HG-i I/O controller for CIR and hardware management support Hardware monitoring through the Nuvoton I/O controller Voltage sense to detect out of range power supply voltages Thermal sense to detect out of range thermal values Two fan headers Two fan sense inputs used to monitor fan activity Fan speed control
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Product Description
1.1.2
Board Layout (Top)
Figure 1 shows the location of the major components on the top-side of the Intel Desktop Board DH61AG.
Figure 1. Major Board Components (Top)
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Table 3 lists the components identified in Figure 1. Table 3. Components Shown in Figure 1
Item from Figure 1 Description A B C D E F G H I J K L M N O P Q R S T U V W X Y Z AA BB CC DD EE Internal stereo speakers connector Intel H61 Express Chipset BIOS Setup configuration jumper block Home Theater PC (HTPC) header Back panel connectors Internal power connector PCI Express Full-/Half-Mini Card slot System fan header Single-port USB 2.0 header SATA data connectors Standby power LED SATA power connector Processor fan header Consumer IR receiver header Front panel header Flat panel voltage selection header LVDS connector DDR3 SO-DIMM 2 socket DDR3 SO-DIMM 1 socket FPD brightness connector Backlight inverter voltage selection header Front panel dual-port USB 2.0 header Debug connector Front panel dual-port USB 2.0 header LGA1155 processor socket PCI Express Half-Mini Card slot PCI Express 2.0 x4 connector Internal S/PDIF / DMIC header Front panel audio header Analog surround audio header Battery
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Product Description
1.1.3
Board Layout (Bottom)
Figure 2 shows the location of the major components on the bottom-side of the Intel Desktop Board DH61AG.
Figure 2. Major Board Components (Bottom)
Table 4. Components Shown in Figure 2

Item/callout from Figure 2
A
Description
Embedded DisplayPort (eDP) connector
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1.1.4
Block Diagram
Figure 3 is a block diagram of the major functional areas of the board.
Figure 3. Block Diagram
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Product Description
1.2
Online Support
To find information about
Intel Desktop Board DH61AG Desktop Board Support Available configurations for Intel Desktop Board DH61AG Supported processors Chipset information BIOS and driver updates Tested memory Integration information
Visit this World Wide Web site:

http://www.intel.com/products/motherboard/index.htm http://www.intel.com/p/en_US/support?iid=hdr+support http://ark.intel.com http://processormatch.intel.com http://www.intel.com/products/desktop/chipsets/index.htm http://downloadcenter.intel.com http://www.intel.com/support/motherboards/desktop/sb/CS025414.htm http://www.intel.com/support/go/buildit
1.3
Processor
The board is designed to support the Intel Core i7, Intel Core i5, Intel Core i3, Intel Pentium, Intel Celeron, and Intel Xeon processors in an LGA1155 socket. Other processors may be supported in the future. This board is designed to support processors with a maximum Thermal Design Power (TDP) of 65 W. The processors listed above are only supported when falling within the power requirements of Intel Desktop Board DH61AG. See the Intel web site listed below for the most up-to-date list of supported processors.
For information about
Supported processors
Refer to:
http://processormatch.intel.com
CAUTION
Use only the processors listed on the web site above. Use of unsupported processors can damage the board, the processor, and the power supply.
NOTE
This board has specific requirements for providing power to the processor. Refer to Section 2.6.1 on page 71 for information on power supply requirements for this board.
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1.4

System Memory
1.5 V DDR3 SDRAM SO-DIMMs with gold plated contacts. Support for 1.35 V Low Voltage DDR3 (new JEDEC specification) Two independent memory channels with interleaved mode support Unbuffered, single-sided or double-sided SO-DIMMs 16 GB maximum total system memory (with 4 Gb memory technology). Refer to Section 2.1.1 on page 45 for information on the total amount of addressable memory. Minimum recommended total system memory: 1024 MB Non-ECC SO-DIMMs Serial Presence Detect XMP profile support for voltage detection DDR3 1333 MHz and DDR3 1066 MHz SDRAM SO-DIMMs
The board has two 204-pin SO-DIMM sockets and supports the following memory features:
NOTE
To be fully compliant with all applicable DDR SDRAM memory specifications, the board should be populated with SO-DIMMs that support the Serial Presence Detect (SPD) data structure. This allows the BIOS to read the SPD data and program the chipset to accurately configure memory settings for optimum performance. If non-SPD memory is installed, the BIOS will attempt to correctly configure the memory settings, but performance and reliability may be impacted or the SO-DIMMs may not function under the determined frequency. Table 5 lists the supported SO-DIMM configurations. Table 5. Supported Memory Configurations
Raw Card Version A SO-DIMM Capacity 1 GB 2 GB 1 GB 2 GB 512 MB 1 GB 2 GB F 4 GB 8 GB Note: DRAM Device Technology 1 Gb 2 Gb 1 Gb 2 Gb 1 Gb 2 Gb 1 Gb 2 Gb 4 Gb DRAM Organization 64 M x 16 128 M x 16 128 M x 8 256 M x 8 64 M x 16 128 M x 16 128 M x 8 256 M x 8 512 M x 8 # of DRAM Devices 8 8 8 8 4 4 16 16 16
System memory configurations are based on availability and are subject to change.
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Product Description

Tested Memory
Refer to:
http://support.intel.com/support/motherboards/desktop/sb /CS-025414.htm
1.4.1
Memory Configurations
Dual channel (Interleaved) mode. This mode offers the highest throughput for real world applications. Dual channel mode is enabled when the installed memory capacities of both SO-DIMM channels are equal. Technology and device width can vary from one channel to the other but the installed memory capacity for each channel must be equal. If different speed SO-DIMMs are used between channels, the slowest memory timing will be used. Single channel (Asymmetric) mode. This mode is equivalent to single channel bandwidth operation for real world applications. This mode is used when only a single SO-DIMM is installed or the memory capacities are unequal. Technology and device width can vary from one channel to the other. If different speed SO-DIMMs are used between channels, the slowest memory timing will be used.
Refer to:
http://www.intel.com/support/motherboards/desktop/sb/cs011965.htm
Processors in the LGA1155 socket support the following types of memory organization:

Memory Configuration Examples
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Figure 4 illustrates the memory channel and SO-DIMM configuration.
Figure 4. Memory Channel and SO-DIMM Configuration
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Product Description
1.5
Intel H61 Express Chipset
Intel H61 Express Chipset with Direct Media Interface (DMI) interconnect provides interfaces to the processor and the USB, SATA, LPC, LAN, and PCI Express interfaces. The Intel H61 Express Chipset is a centralized controller for the boards I/O paths.
For information about The Intel H61 chipset Resources used by the chipset Refer to http://www.intel.com/products/desktop/chipsets/index.htm Chapter 2
1.6
1.6.1
Graphics Subsystem
Integrated Graphics
The board supports graphics through Intel Graphics Technology.
The board supports integrated graphics through the Intel Flexible Display Interface (Intel FDI) for processors with Intel Graphics Technology.
NOTE
If using a processor with integrated graphics, the board can simultaneously support up to two of the three integrated graphics interfaces: HDMI, DVI-I, and Flat Panel Display. Flat Panel Display is supported by eDP and LVDS interfaces, however only one can be used at a time.
1.6.1.1
Intel High Definition (Intel HD) Graphics
The Intel HD graphics controller features the following: 3D Features DirectX* 10.1 and OpenGL* 3.0 compliant DirectX 11.0 CS4.0 only Shader Model 4.0 Video Hi-Definition content at up to 1080p resolution Hardware accelerated MPEG-2, VC-1/WMV and H.264/AVC Hi-Definition video formats Intel HD Technology with Advanced Hardware Video Transcoding Blu-ray* S3D via HDMI 1.4 Dynamic Video Memory Technology (DVMT) 5.0 support Support of up to 1.7 GB Video Memory with 4 GB and above system memory configuration
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1.6.1.2
Video Memory Allocation
Intel Dynamic Video Memory Technology (DVMT) is a method for dynamically allocating system memory for use as graphics memory to balance 2D/3D graphics and system performance. If your computer is configured to use DVMT, graphics memory is allocated based on system requirements and application demands (up to the configured maximum amount). When memory is no longer needed by an application, the dynamically allocated portion of memory is returned to the operating system for other uses.
1.6.1.3
High Definition Multimedia Interface* (HDMI*)
The HDMI port supports standard, enhanced, or high definition video, plus multichannel digital audio on a single cable. It is compatible with all ATSC and DVB HDTV standards and supports eight full range channels at 24-bit/96 kHz audio of lossless audio formats such as Dolby* TrueHD or DTS* HD Master Audio. The maximum supported resolution is 1920 x 1200 (WUXGA). The HDMI port is compliant with the HDMI 1.4 specification. Depending on the type of add-in card installed in the PCI Express x4 connector, the HDMI port will behave as described in Table 6. Table 6. HDMI Port Status Conditions
PCI Express x4 Connector Status No add-in card installed Non-video PCI Express x1/x4 add-in card installed Video PCI Express x1/x4 add-in card installed
Note: Default behavior per BIOS setup option.
HDMI Port Status Enabled Enabled Disabled

(Note)
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Product Description
1.6.1.4
Digital Visual Interface (DVI-I)
The DVI-I port supports both digital and analog DVI displays. The maximum supported resolution is 1920 x 1200 (WUXGA). The DVI port is compliant with the DVI 1.0 specification. DVI analog output can also be converted to VGA using a DVIVGA converter. Depending on the type of add-in card installed in the PCI Express x4 connector, the DVI port will behave as described in Table 7. Table 7. DVI Port Status Conditions
PCI Express x4 Connector Status No add-in card installed Non-video PCI Express x1/x4 add-in card installed Video PCI Express x1/x4 add-in card installed
Notes: 1. DVI analog output can also be converted to VGA with a DVI-VGA converter. 2. Default behavior per BIOS setup option.
DVI Digital (DVI-D) Port Status Enabled Enabled Disabled

(Note 2)
DVI Analog (DVI-A) Port Status(Note 1) Enabled Enabled Disabled

(Note 2)
1.6.1.5
Analog Display (VGA)
The VGA port supports analog displays. The maximum supported resolution is 2048 x 1536 (QXGA).
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1.6.2
Flat Panel Display Interfaces
The board supports flat panel display via the LVDS and Embedded DisplayPort interfaces. Figure 5 shows the flat panel connectors.
Item
A B C D E
Description
Backlight inverter voltage selection header FPD brightness connector LVDS connector Embedded DisplayPort connector Flat panel voltage selection header
Figure 5. Flat Panel Connectors
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Product Description
1.6.2.1

LVDS Interface
The LVDS flat panel display interface supports the following: 1920 x 1200 @ 60 Hz resolution Single-channel and dual-channel interface, up to 135 MHz clock rate 18 bpp and 24 bpp (VESA* and JEIDA mappings) color depth support Multiple EDID data source capability (panel, predefined, and custom payloads) 3.3 V, 5 V, and 12 V flat panel display voltage flexibility, with up to 3 A current 12 V and 19 V backlight inverter voltage flexibility, with up to 3 A current Backlight inverter signal redundancy on dedicated header as well as an LVDS connector (for discrete inverter or panel-integrated inverter support using a single cable) Flat panel brightness control via front panel button input as well as Windows* 7 Screen brightness adjustment slider Spread-spectrum control
1.6.2.2

Embedded DisplayPort (eDP) Interface
The eDP (Embedded DisplayPort) flat panel display interface supports the following: 1920 x 1200 @ 60 Hz resolution 1-lane, 2-lane, and 4-lane bandwidth at 1.62 Gb/s or 2.7 Gb/s Multiple EDID data source capability (panel, predefined, and custom payloads) 3.3 V, 5 V, and 12 V flat panel display voltage flexibility, with up to 3 A current 12 V and 19 V backlight inverter voltage flexibility, with up to 3 A current Backlight inverter signal redundancy on a dedicated header as well as an eDP connector (for discrete inverter or panel-integrated inverter support using a single cable) Flat panel brightness control via front panel button input as well as Windows 7 Screen brightness adjustment slider
1.6.2.3
Configuration Modes
For monitors attached to the HDMI and DVI ports, video modes supported by this board are based on the Extended Display Identification Data (EDID) protocol. Video mode configuration for eDP/LVDS displays is supported as follows: Automatic panel identification via Extended Display Identification Data (EDID) for panels with onboard EDID support Panel selection from common predefined panel types (without onboard EDID) Custom EDID payload installation for ultimate parameter flexibility, allowing custom definition of EDID data on panels without onboard EDID In addition, BIOS setup provides the following configuration parameters for internal flat panel displays: Screen Brightness: allows the end user to set the screen brightness for the display effective through the Power-On Self Test stage (such as while showing the splash screen image and BIOS setup). Windows 7 will ignore this setting in favor of the native screen brightness control provided by the operating system.
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Brightness Steps: allows the system integrator to configure the brightness steps for the operating systems screen brightness control (such as the Screen brightness adjustment slider under the Windows 7 Power Options control panel). Flat Panel Configuration Changes Lock: allows the system integrator to lock critical settings of the LVDS configuration to avoid end users potentially rendering the display unusable. LVDS Interface Type: allows the system integrator to select whether the LVDS panel is a single-channel or dual-channel display. Color Depth: allows the system integrator to select whether the panel is 24 bpp with VESA color mapping (eDP and LVDS), 24 bpp with JEIDA color mapping (LVDS only), or 18 bpp (eDP and LVDS). eDP Interface Type: allows the system integrator to select whether the eDP panel is a 1-lane, 2-lane, or 4-lane display. eDP Data Rate: allows the system integrator to select whether the eDP panel runs at 1.62 Gb/s or 2.7 Gb/s. Inverter Frequency and Polarity: allows the system integrator to set the operating frequency and polarity of the panel inverter board. Maximum and Minimum Inverter Current Limit (%): allows the system integrator to set maximum PWM%, as appropriate, according to the power requirements of the internal flat panel display and the selected inverter board. Panel Power Sequencing: allows the system integrator to adjust panel sequencing parameters, if necessary. LVDS Spread Spectrum Control: allows the system integrator to adjust spread spectrum for the LVDS interface.
NOTE
Support for flat panel display configuration complies with the following: 1. Internal flat panel display connectivity is disabled (and all parameters hidden) by default. 2. Internal flat panel display settings are not exposed through Intel Integrator Toolkit or Intel Integrator Assistant GUIs. 3. Internal flat panel display settings will not be overwritten by loading BIOS setup defaults. 4. Internal flat panel display settings will be preserved across BIOS updates.
28
Product Description
1.6.3
USB
The board supports up to ten USB2.0 ports and two USB 3.0 ports. The Intel H61 Express Chipset provides the USB controller for the USB 2.0 ports. The two USB 3.0 ports are provided by the NEC D720200 controller. The port arrangement is as follows: Two USB 3.0 ports are implemented through two back panel connectors (blue). Two USB 2.0 high-current/fast charging ports are implemented through two back panel connectors (yellow). Four USB 2.0 ports are implemented through two dual-port internal headers (black). One USB 2.0 port is implemented through a single-port internal header (black). One USB 2.0 port is implemented in the PCI Express Half-Mini Card slot. Two USB 2.0 ports are implemented in the PCI Express Full-Mini Card slot.
All ten USB 2.0 ports are high-speed, full-speed, and low-speed capable. USB 3.0 ports are SuperSpeed capable as well as backwards compatible with USB 2.0 high-speed, full-speed, and low-speed modes. USB 2.0 functionality will be enabled on these ports for basic BIOS setup/update operation, however the USB 3.0 driver must be installed for the operating system to use them.
NOTE
Computer systems that have an unshielded cable attached to a USB port may not meet FCC Class B requirements, even if no device is attached to the cable. Use a shielded cable that meets the requirements for full-speed devices.
The location of the USB connectors on the back panel The location of the front panel USB headers
Refer to
Figure 12, page 48 Figure 13, page 49
To download
The USB 3.0 driver
Visit this World Wide Web site:

http://downloadcenter.intel.com
29
1.7

SATA Interfaces
Two internal SATA 3.0 Gb/s connectors (black) One internal mSATA 3.0 Gb/s port (PCI Express Full-/Half-Mini Card slot) One eSATA 3.0 Gb/s connector on the back panel for external connectivity (red)
The board provides four SATA connectors through the PCH, which support one device per connector:
The PCH provides independent SATA ports with a theoretical maximum transfer rate of 3 Gb/s. A point-to-point interface is used for host to device connections. The underlying SATA functionality is transparent to the operating system. The SATA controller can operate in both legacy and native modes. In legacy mode, standard IDE I/O and IRQ resources are assigned (IRQ 14 and 15). In Native mode, standard PCI Conventional bus resource steering is used. Native mode is the preferred mode for configurations using Windows operating systems. The board has an internal SATA power connector and ships with a power cable for powering internal SATA storage devices. The power cable includes: Right-angled 15-pin SATA female connector (for motherboard connectivity) 1 x 4 Molex female connector (for slim optical drive adapter connectivity) 15-pin SATA female connector (for storage connectivity) Vertical 15-pin SATA female connector (for storage connectivity)
NOTE
Board power supplied through SATA power connector is rated at a maximum of: 1.0 A from 12 V rail 2.5 A from 5 V rail 0.5 A from 3.3 V rail
The location of the SATA connectors
Refer to
Figure 13, page 49
1.7.1
AHCI Mode
The board supports AHCI storage mode via the Intel H61 Express Chipset.
NOTE
In order to use AHCI mode, AHCI must be enabled in the BIOS. Also, during Microsoft Windows XP installation, F6 must be pressed to install the AHCI drivers. See your Microsoft Windows XP documentation for more information about installing drivers during installation. Microsoft Windows 7 includes the necessary AHCI drivers without the need to install separate AHCI drivers during the operating system installation process, however, it is always good practice to update the AHCI drivers to the latest available by Intel.
30
Product Description
1.8
Real-Time Clock Subsystem
A coin-cell battery (CR2032) powers the real-time clock and CMOS memory. When the computer is not plugged into a wall socket, the battery has an estimated life of three years. When the computer is plugged in, the standby current from the power supply extends the life of the battery. The clock is accurate to 13 minutes/year at 25 C with 3.3 VSB applied via the power supply 5 V STBY rail.
NOTE
If the battery and AC power fail, date and time values will be reset and the user will be notified during the POST. When the voltage drops below a certain level, the BIOS Setup program settings stored in CMOS RAM (for example, the date and time) might not be accurate. Replace the battery with an equivalent one. Figure 1 on page 15 shows the location of the battery.
1.9

Legacy I/O Controller

Consumer Infrared (CIR) header Serial IRQ interface compatible with serialized IRQ support for PCI systems Intelligent power management, including a programmable wake-up event interface
The I/O controller provides the following features:
The BIOS Setup program provides configuration options for the I/O controller.
1.9.1
Consumer Infrared (CIR)
The Consumer Infrared (CIR) feature is designed to comply with Microsoft Consumer Infrared usage models. Microsoft Windows 7 is the supported operating system for these usage models. The CIR receiving header consists of a filtered translated infrared input compliant with Microsoft CIR specifications, and also a learning infrared input. This learning input is simply a high pass input which the computer can use to learn to speak the infrared communication language of other user remotes. Customers are required to buy or create their own interface modules to connect to Intel Desktop Boards for this feature to work.
Basic CIR Architecture
Refer to
http://msdn.microsoft.com/en-us/library/ff539443.aspx
31
1.10 Audio Subsystem

The board supports Intel HD Audio via the Realtek ALC892 audio codec. The audio subsystem supports the following features: Digital/analog stereo line-out (2-in-1 optical/analog back panel jack) In-chassis stereo speakers support (3 W/4 via internal header) AV-compliant 7.1 surround (see note below) support (analog line-level via internal header) Analog line-in (back panel jack) Signal-to-noise ratios (SNR) of 97 dB for the DACs and 90 dB for the ADCs Support for 44.1 kHz/48 kHz/96 kHz/192 kHz sample rates on all analog inputs and outputs Secondary S/PDIF digital audio output (internal header) Support for 32 kHz/44.1 kHz/48 kHz/88.2 kHz/96 kHz/192 kHz sample rates at 16-bit/20-bit/24-bit resolution on SPDIF outputs DMIC interface (internal header), with support for mono and stereo digital microphones Front panel HD Audio/AC97 headphones/microphone support (internal header) Advanced jack sense for the back panel line-out jack that enables the audio codec to recognize the connected device Microphone input jack that supports a single dynamic, condenser, or electret microphone Windows 7 Ultimate certification
NOTE
AA revision G23736-400 supports up to 5.1 analog surround audio. AA revision G23736-500 supports both 5.1 and 7.1 analog surround audio.
Table 8 lists the supported functions of the front panel and back panel audio jacks. Table 8. Audio Jack Support
Audio Jack FP Green Jack FP Pink Jack Rear Green Jack Rear Pink Jack Internal Stereo Speaker Analog Surround Default Default Microphone Default Default Jack detect Default Headphones Line Out Line In
32
Product Description
1.10.1
Audio Subsystem Software

Refer to Section 1.2, page 19
The latest audio software and drivers are available from Intels World Wide Web site.
For information about Obtaining audio software and drivers
1.10.2

Audio Subsystem Components
The audio subsystem includes the following components: Intel H61 Express Chipset Realtek ALC892 audio codec Two ports for analog input and analog/digital line-out on the back panel 7.1 Analog surround audio header (see note on page 32) Front panel audio header that supports Intel HD audio and AC97 audio (a 2 x 5pin header that provides microphone in and headphones signals for front panel audio connectors) Internal S/PDIF or DMIC header (1 x 6-pin header) Internal stereo speakers connector (1 x 4-pin, shrouded)
The back panel audio connectors are configurable through the audio device drivers. The available configurable back panel audio connectors are shown in Figure 6.
Item
A B
Description
2-in-1 analog and optical line out Microphone in
Figure 6. Back Panel Audio Connectors
NOTE
The analog circuit of the back panel audio line out connector is designed to power headphones or amplified speakers only. Poor audio quality occurs if passive (nonamplified) speakers are connected to this output.
33
Figure 5 shows the location of the internal audio headers.
Item
A B C D
Description
Internal stereo speakers connector Internal S/PDIF / DMIC header Front panel audio header Analog surround audio header
Figure 7. Internal Audio Headers

For information about The signal names of the front panel audio header and S/PDIF / DMIC audio header Refer to Section 2.2.3.1, page 52
34
Product Description
1.11 LAN Subsystem

The LAN subsystem consists of the following: Intel 82579V Gigabit Ethernet Controller (10/100/1000 Mbits/s) Intel H61 Express Chipset RJ-45 LAN connector with integrated status LEDs
Additional features of the LAN subsystem include: CSMA/CD protocol engine Jumbo frame support LAN connect interface between the PCH and the LAN controller Power management capabilities ACPI technology support LAN wake capabilities LAN subsystem software
Refer to

LAN software and drivers
1.11.1

Intel 82579V Gigabit Ethernet Controller
The Intel 82579V Gigabit Ethernet Controller supports the following features: 10/100/1000 BASE-T IEEE 802.3 compliant Energy Efficient Ethernet (EEE) IEEE802.3az support (Low Power Idle (LPI) mode) Dual interconnect between the Integrated LAN Controller and the Physical Layer (PHY): PCI Express-based interface for active state operation (S0) state SMBUS for host and management traffic (Sx low power state) Compliant to IEEE 802.3x flow control support 802.1p and 802.1q TCP, IP, and UDP checksum offload (for IPv4 and IPv6) Full device driver compatibility
35
1.11.2
LAN Subsystem Software

Refer to
LAN software and drivers are available from Intels World Wide Web site.
Obtaining LAN software and drivers
1.11.3
RJ-45 LAN Connector with Integrated LEDs
Two LEDs are built into the RJ-45 LAN connector (shown in Figure 8).
Item
A B
Description
Link LED (Green) Data Rate LED (Green/Yellow)
Figure 8. LAN Connector LED Locations Table 9 describes the LED states when the board is powered up and the LAN subsystem is operating. Table 9. LAN Connector LED States
LED
Link
LED Color
Green
LED State
Off On Blinking Off
Condition
LAN link is not established. LAN link is established. LAN activity is occurring. 10 Mbits/s data rate is selected. 100 Mbits/s data rate is selected. 1000 Mbits/s data rate is selected.
Data Rate
Green/Yellow
Green Yellow
36
Product Description
1.12 Hardware Management Subsystem

The hardware management features enable the board to be compatible with the Wired for Management (WfM) specification. The board has several hardware management features, including thermal and voltage monitoring.
Wired for Management (WfM) Specification
Refer to
www.intel.com/design/archives/wfm/
1.12.1

Hardware Monitoring
The hardware monitoring and fan control subsystem is based on the Nuvoton W83677HG-i device, which supports the following: Processor and system ambient temperature monitoring Chassis fan speed monitoring Voltage monitoring of +12 V, +5 V, +3.3 V, Memory Vcc (V_SM), PCH_Vcc, and Processor Vcc (+VCCP) SMBus interface
1.12.2
Fan Monitoring
Fan monitoring can be implemented using Intel Desktop Utilities or third-party software.
The functions of the fan headers
Refer to
Section 1.13.2.2, page 42
37
1.12.3
Thermal Monitoring
Figure 9 shows the locations of the thermal sensors and fan headers.
Item
A B C D
Description
System fan header Processor fan header Thermal diode, located on the processor die Thermal diode, located on the Intel H61 PCH
Figure 9. Thermal Sensors and Fan Headers
38
Product Description
1.13 Power Management

Power management is implemented at several levels, including: Software support through Advanced Configuration and Power Interface (ACPI) Hardware support: Power connector Fan headers LAN wake capabilities Instantly Available PC technology Wake from USB PCI Express WAKE# signal support Wake from Consumer IR
1.13.1
ACPI
ACPI gives the operating system direct control over the power management and Plug and Play functions of a computer. The use of ACPI with this board requires an operating system that provides full ACPI support. ACPI features include: Plug and Play (including bus and device enumeration) Power management control of individual devices, add-in boards (some add-in boards may require an ACPI-aware driver), video displays, and hard disk drives Methods for achieving less than 15-watt system operation in the power-on/standby sleeping state A Soft-off feature that enables the operating system to power-off the computer Support for multiple wake-up events (see Table 12 on page 41) Support for a front panel power and sleep mode switch
Table 10 lists the system states based on how long the power switch is pressed, depending on how ACPI is configured with an ACPI-aware operating system. Table 10. Effects of Pressing the Power Switch
If the system is in this state Off (ACPI G2/G5 Soft off) On (ACPI G0 working state) On (ACPI G0 working state) Sleep (ACPI G1 sleeping state) Sleep (ACPI G1 sleeping state) and the power switch is pressed for Less than four seconds Less than four seconds More than six seconds Less than four seconds More than six seconds the system enters this state Power-on (ACPI G0 working state) Soft-off/Standby (ACPI G1 sleeping state) Fail safe power-off (ACPI G2/G5 Soft off) Wake-up (ACPI G0 working state) Power-off (ACPI G2/G5 Soft off)
Note
Note: Depending on power management settings in the operating system.
39
1.13.1.1
System States and Power States
Under ACPI, the operating system directs all system and device power state transitions. The operating system puts devices in and out of low-power states based on user preferences and knowledge of how devices are being used by applications. Devices that are not being used can be turned off. The operating system uses information from applications and user settings to put the system as a whole into a low-power state. Table 11 lists the power states supported by the board along with the associated system power targets. See the ACPI specification for a complete description of the various system and power states. Table 11. Power States and Targeted System Power
Processor Global States G0 working state G1 sleeping state G1 sleeping state G2/S5 Sleeping States S0 working S3 Suspend to RAM. Context saved to RAM. S4 Suspend to disk. Context saved to disk. S5 Soft off. Context not saved. Cold boot is required. No power to the system. States C0 working No power Device States D0 working state. D3 no power except for wake-up logic. D3 no power except for wake-up logic. D3 no power except for wake-up logic. D3 no power for wake-up logic, except when provided by battery or external source. Targeted System Power
(Note 1)
Full power > 30 W Power < 5 W

(Note 2)
No power
Power < 5 W
(Note 2)
No power
Power < 5 W
(Note 2)
G3 mechanical off AC power is disconnected from the computer. Notes: 1. 2.
No power
No power to the system. Service can be performed safely.
Total system power is dependent on the system configuration, including add-in boards and peripherals powered by the system chassis power supply. Dependent on the standby power consumption of wake-up devices used in the system.
40
Product Description
1.13.1.2
Wake-up Devices and Events
Table 12 lists the devices or specific events that can wake the computer from specific states. Table 12. Wake-up Devices and Events
Devices/events that wake up the system Power switch RTC alarm LAN USB WAKE# Consumer IR Notes: 1. 2. 3. S4 implies operating system support only. Wake from S4 and S5 is recommended by Microsoft. Wake from device/event not supported immediately upon return from AC loss. from this sleep state S3, S4, S5 S3, S4, S5 S3, S4, S5 S3 S3, S4, S5 S3, S4, S5
(Note 1) (Note 2)
(Note 1)
from this global state G1, G2, G3 G1, G2 G1, G2 G1 G1, G2 G1, G2
(Note 3) (Note 3) (Note 3) (Note 3)
(Note 1) (Note 1)
NOTE
The use of these wake-up events from an ACPI state requires an operating system that provides full ACPI support. In addition, software, drivers, and peripherals must fully support ACPI wake events.
1.13.2

Hardware Support
The board provides several power management hardware features, including: Instantly Available PC technology Fan headers LAN wake capabilities Wake from USB WAKE# signal wake-up support Wake from Consumer IR Wake from Power Button signal Standby Power Indicator LED
NOTE
The use of Wake from USB from an ACPI state requires an operating system that provides full ACPI support.
41
1.13.2.1
Power Input
When resuming from an AC power failure, the computer returns to the power state it was in before power was interrupted (on or off). The computers response can be set using the Last Power State feature in the BIOS Setup programs Boot menu.
For information about The location of the internal power connector The signal names of the internal power connector Refer to Figure 13, page 49 Table 35, page 60
1.13.2.2

Fan Headers
The function/operation of the fan headers is as follows: The fans are on when the board is in the S0 state The fans are off when the board is off or in the S3, S4, or S5 state Each fan header is wired to a fan tachometer input of the hardware monitoring and fan control ASIC All fan headers support closed-loop fan control that can adjust the fan speed as needed All fan headers have a +12 V DC connection Fan headers can support both 4-wire as well as 3-wire fans. 4-wire fans are controlled by Pulse Width Modulation; 3-wire fans are voltage controlled.
Refer to Figure 13, page 49 Figure 9, page 38
For information about The location of the fan headers The location of the fan headers and sensors for thermal monitoring
42
Product Description
1.13.2.3
LAN Wake Capabilities
LAN wake capabilities enable remote wake-up of the computer through a network. The LAN subsystem monitors network traffic at the Media Independent Interface. Upon detecting a Magic Packet* frame, the LAN subsystem asserts a wake-up signal that powers up the computer.
1.13.2.4
Instantly Available PC Technology
Instantly Available PC technology enables the board to enter the ACPI S3 (Suspend-toRAM) sleep-state. While in the S3 sleep-state, the computer will appear to be off (the power supply is off, and the front panel LED is amber if dual colored, or off if single colored.) When signaled by a wake-up device or event, the system quickly returns to its last known wake state. Table 12 on page 41 lists the devices and events that can wake the computer from the S3 state. The use of Instantly Available PC technology requires operating system support and drivers for any installed PCI Express add-in card.
1.13.2.5
Wake from USB
USB bus activity wakes the computer from an ACPI S3 state.
NOTE
Wake from USB requires the use of a USB peripheral that supports Wake from USB.
1.13.2.6
WAKE# Signal Wake-up Support
When the WAKE# signal on the PCI Express bus is asserted, the computer wakes from an ACPI S3, S4, or S5 state.
1.13.2.7
Wake from Consumer IR
CIR activity wakes the computer from an ACPI S3, S4, or S5 state.
1.13.2.8
Wake from S5
When the RTC Date and Time is set in the BIOS, the computer will automatically wake from an ACPI S5 state.
43
1.13.2.9
Standby Power Indicator LED
The standby power indicator LED shows that power is still present even when the computer appears to be off. Figure 10 shows the location of the standby power LED.
CAUTION
If AC power has been switched off and the standby power indicator is still lit, disconnect the power cord before installing or removing any devices connected to the board. Failure to do so could damage the board and any attached devices.
Figure 10. Location of the Standby Power LED
44
2
2.1
2.1.1
Technical Reference
Memory Resources
Addressable Memory
The board utilizes 16 GB of addressable system memory. Typically the address space that is allocated for PCI Conventional bus add-in cards, PCI Express configuration space, BIOS (SPI Flash device), and chipset overhead resides above the top of DRAM (total system memory). On a system that has 16 GB of system memory installed, it is not possible to use all of the installed memory due to system address space being allocated for other system critical functions. These functions include the following: BIOS/SPI Flash device (16 Mbit) Local APIC (19 MB) Direct Media Interface (40 MB) PCI Express configuration space (256 MB) PCH base address registers PCI Express ports (up to 256 MB) Memory-mapped I/O that is dynamically allocated for PCI Express add-in cards (256 MB)
The board provides the capability to reclaim the physical memory overlapped by the memory mapped I/O logical address space. The board remaps physical memory from the top of usable DRAM boundary to the 4 GB boundary to an equivalent sized logical address range located just above the 4 GB boundary. Figure 11 shows a schematic of the system memory map. All installed system memory can be used when there is no overlap of system addresses.
45
Figure 11. Detailed System Memory Address Map
46
Technical Reference
2.1.2
Memory Map
Table 13 lists the system memory map. Table 13. System Memory Map
Address Range (decimal) 1024 K - 16777216 K 960 K - 1024 K 896 K - 960 K 800 K - 896 K Address Range (hex) 100000 400000000 F0000 - FFFFF E0000 - EFFFF C8000 - DFFFF Size 16382 MB 64 KB 64 KB 96 KB Description Extended memory Runtime BIOS Reserved Potential available high DOS memory (open to the PCI Conventional bus). Dependent on video adapter used. Video memory and BIOS Extended BIOS data (movable by memory manager software) Extended conventional memory Conventional memory
640 K - 800 K 639 K - 640 K 512 K - 639 K 0 K - 512 K
A0000 - C7FFF 9FC00 - 9FFFF 80000 - 9FBFF 00000 - 7FFFF
160 KB 1 KB 127 KB 512 KB
2.2
Connectors and Headers
CAUTION
Only the following connectors and headers have overcurrent protection: back panel and front panel USB. The other internal connectors and headers are not overcurrent protected and should connect only to devices inside the computers chassis, such as fans and internal peripherals. Do not use these connectors or headers to power devices external to the computers chassis. A fault in the load presented by the external devices could cause damage to the computer, the power cable, and the external devices themselves. Furthermore, improper connection of USB header single wire connectors may eventually overload the overcurrent protection and cause damage to the board. This section describes the boards connectors and headers. The connectors and headers can be divided into these groups: Back panel I/O connectors On-board I/O connectors and headers (see page 49 and page 51)
47
2.2.1
Back Panel Connectors
Figure 12 shows the location of the back panel connectors for the board.
Item A B C D E F G H I
Description 19 V DC input jack USB 3.0 ports DVI-I connector eSATA connector HDMI connector LAN connector High-current/fast charging USB 2.0 ports Digital/Analog Line out Microphone in
Figure 12. Back Panel Connectors
48
Technical Reference
2.2.2
Connectors and Headers (Top)
Figure 13 shows the locations of the connectors and headers on the top-side of the board.
Figure 13. Connectors and Headers (Top)
49
Table 14 lists the connectors and headers identified in Figure 13. Table 14. Connectors and Headers Shown in Figure 13
Item from Figure 13 A B C D E F G H I J K L M N O P Q R S T U V W
Connector Information
Description Internal stereo speakers header HTPC header Internal power connector PCI Express Full-/Half-Mini Card slot System fan header Single port USB 2.0 header SATA data connectors SATA power connector Processor fan header Consumer IR receiver header Front panel header Flat panel voltage selection header LVDS connector FPD brightness connector Backlight inverter voltage selection header Front panel dual-port USB 2.0 header Debug connector Front panel dual-port USB 2.0 header PCI Express Half-Mini Card slot PCI Express 2.0 x4 connector Front panel audio header Internal S/PDIF / DMIC header Analog surround audio header 2x5, 2.54mm-pitch 1x6, 2.54mm-pitch 2x9, 2.00mm-pitch 4-wire/3-wire fan 1x5, 2.54mm-pitch 7-pin SATA (male) 15-pin SATA (male) 7-pin SATA (female) 15-pin SATA (female) 4-wire fan 2x4, 2.54mm-pitch 2x5, 2.54mm-pitch 2x3, 2.54mm-pitch ACES* 88341-40 Foxconn* HF5508 1x3 2.54mm-pitch Jumper ACES 88441-40 Starcom* 107F40 JWT A2001H02-8P Jumper
Board Connector
JS*-1125-04 Molex* 5566-2
Mating Plug
JWT*-A2001H02-4P
2x4, 2.00mm-pitch Molex 5557-02R
2x5, 2.54mm-pitch 1x11, 1.25mm-pitch 2x5, 2.54mm-pitch
50
Technical Reference
2.2.3
Connectors and Headers (Bottom)
Figure 14 shows the locations of the connectors and headers on the bottom-side of the board.
Figure 14. Connectors and Headers (Bottom) Table 15 lists the connectors and headers identified in Figure 14. Table 15. Connectors and Headers Shown in Figure 14
Item from Figure 14
A
Connector Information Description

eDP connector
Board Connector
ACES 50203-040
Mating Plug
ACES 88441-40 Starconn 107F40
51
2.2.3.1
Signal Tables for the Connectors and Headers
Table 16. Front Panel Audio Header for Intel HD Audio

Pin
1 2 3 4
Signal Name
PORT_1L GND PORT_1R PRESENCE#
Description
Analog Port 1 Left channel (Microphone) Ground Analog Port 1 Right channel (Microphone) Active low signal that signals BIOS that an Intel HD Audio dongle is connected to the analog header. PRESENCE#=0 when an Intel HD Audio dongle is connected Analog Port 2 Right channel (Headphone) Jack detection return for front panel (JACK1) Jack detection sense line from the Intel HD Audio CODEC jack detection resistor network No pin Analog Port 2 Left channel (Headphone) Jack detection return for front panel (JACK2)
5 6 7 8 9 10
PORT_2R SENSE1_RETURN SENSE_SEND KEY PORT_2L SENSE2_RETURN
Table 17. Front Panel Audio Header for AC97 Audio

Pin
1 2 3 4
Signal Name
MIC AUD_GND MIC_BIAS PRESENCE#
Description
Front panel microphone input signal (biased when supporting stereo microphone) Ground used by analog audio circuits Microphone power / additional MIC input for stereo microphone support Active low signal that signals BIOS that an Intel HD Audio dongle is connected to the analog header. PRESENCE#=0 when an Intel HD Audio dongle is connected Right channel audio signal to front panel (headphone drive capable) Ground used by analog audio circuits Reserved No pin Left channel audio signal to front panel (headphone drive capable) Ground used by analog audio circuits
5 6 7 8 9 10
FP_OUT_R AUD_GND RESERVED KEY FP_OUT_L AUD_GND
52
Technical Reference
Table 18. Analog Surround Audio Header for AA Revision G23736-400

Pin
1 3 5 7 9 11 13 15 17
Signal Name
Front_L A_GND NC A_GND Surr_Rear_L A_GND Center A_GND KEY
Description
Front left Analog ground RESERVED Analog ground 5.1 surround rear left Analog ground Center channel Analog ground No pin
Pin
2 4 6 8 10 12 14 16 18
Signal Name
A_GND Front_R A_GND NC A_GND Surr_Rear_R A_GND LFE SENSE
Description
Analog ground Front right Analog ground RESERVED Analog ground 5.1 surround rear right Analog ground Subwoofer/LFE Dongle detection signal
Table 19. Analog Surround Audio Header for AA Revision G23736-500

Pin
1 3 5 7 9 11 13 15 17
Signal Name
Front_L A_GND Surr_Side_L A_GND Surr_Rear_L A_GND Center A_GND KEY
Description
Front left Analog ground 7.1 surround side left Analog ground 5.1/7.1 surround rear left Analog ground Center channel Analog ground No pin
Pin
2 4 6 8 10 12 14 16 18
Signal Name
A_GND Front_R A_GND Surr_Side_R A_GND Surr_Rear_R A_GND LFE SENSE
Description
Analog ground Front right Analog ground 7.1 surround side right Analog ground 5.1/7.1 surround rear right Analog ground Subwoofer/LFE Dongle detection signal
Table 20. Internal Stereo Speakers Header

Pin
1 2 3 4
Signal Name
Front_L Front_L+ Front_R+ Front_R
Description
Analog front left (differential negative) Analog front left (differential positive) Analog front right (differential positive) Analog front right (differential negative)
53
Table 21. Internal S/PDIF or DMIC Header

Pin
1 2 3 4 5 6
Signal Name
+3.3 V DMIC_DATA GND SPDIF_OUT/DMIC_CLK Key (no pin) +5 V
Description
3.3 V power (for DMIC module) DMIC data signal Ground Multiplexed DMIC clock or S/PDIF signal Key (no pin) 5 V power (for optical/TOSLINK module)
Table 22. Dual-Port Front Panel USB 2.0 Headers

Pin
1 3 5 7 9
Signal Name
+5 V DC D D+ Ground KEY (no pin)
Pin
2 4 6 8 10
Signal Name
+5 V DC D D+ Ground No Connect
Table 23. Single-Port USB 2.0 Header

Pin
1 2 3 4 5
Signal Name
+5 V DC D D+ Ground Key (no pin)
Table 24. SATA Connectors

Pin
1 2 3 4 5 6 7
Signal Name
Ground TXP TXN Ground RXN RXP Ground
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Technical Reference
Table 25. SATA Power Connector

Pin
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15
Signal Name
3.3 V DC 3.3 V DC 3.3 V DC Ground Ground Ground 5 V DC 5 V DC 5 V DC Ground Ground Ground 12 V DC 12 V DC 12 V DC
Table 26. Fan Headers

Pin
1 2 3 4 Note:
4-Wire Support
Ground +12 V FAN_TACH FAN_CONTROL
Pin
3 2 1 N/A
3-Wire Support
Ground FAN_POWER FAN_TACH N/A
Fan speed control on this header uses Pulse Width Modulation for 4-wire fans and linear-voltage for 3-wire fans.
Table 27. Front Panel CIR Receiver (Input) Header

Pin
1 2 3 4 5 6 7 8
Signal Name
Ground LED NC Learn-in 5 V standby VCC Key (no pin) CIR input
55
Table 28. HTPC Header

Pin
1 2 3 4 5 6 7 8
Signal Name
Recording LED Ground Key (no pin) SMB_CLK 3.3 V standby SMB_DATA #Power_Button HDMI CEC
Table 29. Panel Voltage Selection Header

Pin
1 2 3 4 5 6
Signal Name
Key 3.3 V 12 V LCD_VCC Key 5V
Description
No pin 3.3 V option (default) 12 V option Send voltage to connector No pin 5 V option
Table 30. Backlight Inverter Voltage Selection Header

Pin
1 2 3
Signal Name
12 V BKLT_PWR 19 V
Description
12 V option Send voltage to connector 19 V option
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Technical Reference
Table 31. 40-Pin LVDS Connector

Pin
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20
Signal Name
ODD_Lane3_P ODD_Lane3_N ODD_Lane2_P ODD_Lane2_N ODD_Lane1_P ODD_Lane1_N ODD_Lane0_P ODD_Lane0_N EVEN_Lane3_P EVEN_Lane3_N EVEN_Lane2_P EVEN_Lane2_N EVEN_Lane1_P EVEN_Lane1_N EVEN_Lane0_P EVEN_Lane0_N EDID_GND LCD_VCC (3.3 V/5 V/12 V) LCD_VCC (3.3 V/5 V/12 V) LCD_VCC (3.3 V/5 V/12 V)
Pin
21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40
Signal Name
N/C EDID_3.3 V LCD_GND LCD_GND LCD_GND ODD_CLK_P ODD_CLK_N BKLT_GND BKLT_GND BKLT_GND EDID_CLK BKLT_ENABLE BKLT_PWM_DIM EVEN_CLK_P EVEN_CLK_N BKLT_PWR (12 V/19 V) BKLT_PWR (12 V/19 V) BKLT_PWR (12 V/19 V) N/C EDID_DATA
57
Table 32. 40-Pin eDP Connector

Pin
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20
Signal Name
NC_Reserved High-speed_GND Lane3_N (DDPD_[3]N) Lane3_P (DDPD_[3]P) High-speed_GND Lane2_N (DDPD_[2]N) Lane2_P (DDPD_[2]P) High-speed_GND Lane1_N (DDPD_[1]N) Lane1_P (DDPD_[1]P) High-speed_GND Lane0_N (DDPD_[0]N) Lane0_P (DDPD_[0]P) High-speed_GND AUX_CH_P (DDPD_AUXP) AUX_CH_N (DDPD_AUXN) High-speed_GND LCD_VCC (3.3 V/5 V/12 V) LCD_VCC (3.3 V/5 V/12 V) LCD_VCC (3.3 V/5 V/12 V)
Pin
21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40
Signal Name
LCD_VCC (3.3 V/5 V/12 V) LCD_Self_Test-or-NC LCD_GND LCD_GND LCD_GND LCD_GND HPD (DDPD_HPD) BKLT_GND BKLT_GND BKLT_GND BKLT_GND BKLT_ENABLE BKLT_PWM_DIM NC_Reserved NC_Reserved BKLT_PWR (12 V/19 V) BKLT_PWR (12 V/19 V) BKLT_PWR (12 V/19 V) BKLT_PWR (12 V/19 V) NC_Reserved
Table 33. 8-Pin FPD Brightness Connector

Pin
1 2 3 4 5 6 7 8
Signal Name
BKLT_EN BKLT_PWM BKLT_PWR (12 V/19 V) BKLT_PWR (12 V/19 V) BKLT_GND/Brightness_GND BKLT_GND/Brightness_GND Brightness_Up Brightness_Down
Description
Backlight enable Backlight control Backlight inverter power Backlight inverter power Ground (shared) Ground (shared) Panel brightness increase Panel brightness decrease
58
Technical Reference
Table 34. PCI Express Full-/Half-Mini Card Connector

Pin
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38
Signal Name
WAKE# 3.3 V Reserved GND Reserved 1.5 V CLKREQ# Reserved GND Reserved REFCLKReserved REFCLK+ Reserved GND Reserved Reserved GND Reserved Reserved GND PERST# PERn0 +3.3 V aux PERp0 GND GND +1.5 V GND SMB_CLK PETn0 SMB_DATA PETp0 GND GND USB_DGND USB_D+
Additional Signal Name
(Extra USB) +5 V_MINI (Extra USB) CARDIN
(Extra USB) LP5(Extra USB) LP5+
continued
59
Table 34. PCI Express Full-/Half-Mini Card Connector (continued)

Pin
39 40 41 42 43 44 45 46 47 48 49 50 51 52
Signal Name
+3.3 Vaux GND +3.3 Vaux LED_WWAN# Reserved LED_WLAN# Reserved LED_WPAN# Reserved +1.5V Reserved GND Reserved +3.3V
Additional Signal Name
(mSATA) Vendor (mSATA) Vendor (mSATA) DA/DSS (mSATA) Presence Detection
2.2.3.2
Add-in Card Connectors
The board has the following add-in card connectors: One PCI Express 2.0 x4 connector. The x4 interface supports simultaneous transfer speeds up to 500 MB/s of peak bandwidth per lane, per direction, for up to 4 GB/s concurrent and bi-directional bandwidth. One PCI Express Half-Mini Card slot One PCI Express Full-/Half-Mini Card slot (removable stand-offs in full-length keep out zone allows repurposing of Full-Mini Card slot into Half-Mini Card slot)
2.2.3.3
Power Supply Connectors
The board has the following power supply connectors: External Power Supply the board can be powered through a 19 V DC connector on the backpanel. The backpanel DC connector is compatible with a 7.4 mm/OD (outer diameter) and 5.1 mm/ID (inner diameter) plug, where the inner contact is +19 (10%) V DC and the shell is GND. The maximum current rating is 12 A. Internal Power Supply the board can alternatively be powered via the internal 19 V DC 1 x 2 power connector, where pin 1 is GND and pin 2 is +19 (10%) VDC.
Table 35. 19 V Internal Power Supply Connector

Pin
1 2
Signal Name
Ground +19 V (10%)

Power supply considerations
Refer to
Section 2.6.1, page 71
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Technical Reference
2.2.3.4
Front Panel Header
This section describes the functions of the front panel header. Table 36 lists the signal names of the front panel header. Figure 15 is a connection diagram for the front panel header. Table 36. Front Panel Header
Pin
1 3 5 7 9
Signal Name
HDD_POWER_LED HDD_LED# GROUND RESET_SWITCH# +5V_DC
Description
Pull-up resistor (750 ) to +5V [Out] Hard disk activity LED Ground [In] Reset switch Power
Pin
2 4 6 8 10
Signal Name
POWER_LED_MAIN POWER_LED_ALT POWER_SWITCH# GROUND Key
Description
[Out] Front panel LED (main color) [Out] Front panel LED (alt color) [In] Power switch Ground No pin
Figure 15. Connection Diagram for Front Panel Header 2.2.3.4.1 Hard Drive Activity LED Header
Pins 1 and 3 can be connected to an LED to provide a visual indicator that data is being read from or written to a hard drive. Proper LED function requires a SATA hard drive or optical drive connected to an onboard SATA connector. 2.2.3.4.2 Reset Switch Header
Pins 5 and 7 can be connected to a momentary single pole, single throw (SPST) type switch that is normally open. When the switch is closed, the board resets and runs the POST.
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2.2.3.4.3
Power/Sleep LED Header
Pins 2 and 4 can be connected to a one- or two-color LED. Table 37 shows the possible LED states. Table 37. States for a One-Color Power LED
LED State
Off Blinking Steady
Description
Power off Standby Normal operation
NOTE
The LED behavior shown in Table 37 is default other patterns may be set via BIOS setup. 2.2.3.4.4 Power Switch Header
Pins 6 and 8 can be connected to a front panel momentary-contact power switch. The switch must pull the SW_ON# pin to ground for at least 50 ms to signal the power supply to switch on or off. (The time requirement is due to internal debounce circuitry on the board.) At least two seconds must pass before the power supply will recognize another on/off signal.
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Technical Reference
2.2.3.5
Front Panel USB 2.0 Headers
Figure 16 and Figure 17 are connection diagrams for the front panel USB 2.0 headers.
NOTE
The +5 V DC power on the USB headers is fused. Use only a front panel USB connector that conforms to the USB 2.0 specification for high-speed USB devices.
Figure 16. Connection Diagram for Front Panel USB 2.0 Dual-Port Headers
Figure 17. Connection Diagram for the Front Panel USB 2.0 Single-Port Header
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2.2.3.6
Debug Header
During the POST, the BIOS generates diagnostic progress codes (POST codes) to I/O port 80h. If the POST fails, execution stops and the last POST code generated is left at port 80h. This code is useful for determining the point where an error occurred. Displaying the POST codes requires a POST card that can interface with the Debug header. The POST card can decode the port and display the contents on a medium such as a seven-segment display. Table 38. Debug Header
Pin
1 2 3 4 5 6 7 8 9 10 11
Signal Name
VCC3 VCC3 PLTRST# LPC_CLK LAD0/FWH0 LAD1/FWH1 LAD2/FWH2 LAD3/FWH3 LFRAME/FWH4# GND GND
2.3

I/O Shields
Half-height I/O shield Standard-height I/O shield
Two I/O shields are provided with the board:
The half-height I/O shield allows access to all back panel connectors while being specifically designed for thin mini-ITX chassis, compliant with version 2.0 of the MiniITX Addendum to the microATX Motherboard Interface Specification. As an added benefit for system configurations with an internal TV tuner in the PCI Express Mini Card form factor, the I/O shield also provides a pre-cut hole for user installation of an F-type external antenna connector. The standard-height I/O shield provides access to all the same connectors as the halfheight I/O shield while being compatible with standard mini-ITX and microATX chassis. In addition to the F-type pre-cut hole, the standard-height I/O shield also provides pre-cut holes for user installation of two external wireless antennas for system configurations with wireless PCI Express Mini Card solutions. Figure 18 and Figure 19 are I/O shield reference diagrams.
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Technical Reference
Figure 18. Half-Height Back Panel I/O Shield
65
Figure 19. Standard-Height Back Panel I/O Shield
For more information about

Thin mini-ITX form factor
Refer to
http://www.formfactors.org/developer%5Cspecs%5CMini_ITX_ Spec_V2_0.pdf
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Technical Reference
2.4
Jumper Block
CAUTION
Do not move the jumper with the power on. Always turn off the power and unplug the power cord from the computer before changing a jumper setting. Otherwise, the board could be damaged. Figure 20 shows the location of the jumper block. The 3-pin jumper block determines the BIOS Setup programs mode. Table 39 describes the jumper settings for the three modes: normal, configure, and recovery. When the jumper is set to configure mode and the computer is powered-up, the BIOS compares the processor version and the microcode version in the BIOS and reports if the two match.
Figure 20. Location of the Jumper Block
67
Table 39. BIOS Setup Configuration Jumper Settings

Function/Mode Normal Configure Jumper Setting 1-2 2-3 Configuration The BIOS uses current configuration information and passwords for booting. After the POST runs, Setup runs automatically. The maintenance menu is displayed. Note that this Configure mode is the only way to clear the BIOS/CMOS settings. Press F9 (restore defaults) while in Configure mode to restore the BIOS/CMOS settings to their default values. Recovery None The BIOS attempts to recover the BIOS configuration. A recovery CD or flash drive is required.
2.5
2.5.1
Mechanical Considerations
Form Factor
The board is designed to fit into a Mini-ITX form-factor chassis. Figure 21 illustrates the mechanical form factor for the board. Dimensions are given in inches [millimeters]. The outer dimensions are 6.7 inches by 6.7 inches [170.18 millimeters by 170.18 millimeters]. Location of the I/O connectors and mounting holes are in compliance with the ATX specification.
NOTE
The board is designed to have a total height of less than 20 mm from the underside of the board to the top of its tallest components, including all back panel I/O ports, internal connectors, installed system memory, and factory-installed thermal solutions, in compliance with thin mini-ITX requirements per version 2 of the Mini-ITX Addendum to the microATX Motherboard Interface Specification.
For more information about
Thin mini-ITX form factor
Refer to
http://www.formfactors.org/developer%5Cspecs%5CMini_ITX_ Spec_V2_0.pdf
68
Technical Reference
Figure 21. Board Dimensions
69
2.5.2
Board 3D View
The Intel Desktop Board DH61AG has a 3D view as shown in Figure 22.
Figure 22. 3D View of Intel Desktop Board DH61AG
NOTE
Adobe* Acrobat* Pro or Adobe Reader, version 8.1 or later, is required for interactive 3D view. Use mouse controls in the 3D view to manipulate the drawing, as follows: mouse wheel for zoom in/out click-and-drag for rotation right-click and Full Screen Multimedia for full-screen mode right-click for other tools
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Technical Reference
2.6
2.6.1
Electrical Considerations
Power Supply Considerations
CAUTION
The external 19 V DC jack is the primary power input connector of Intel Desktop Board DH61AG. However, the desktop board also provides an internal 1 x 2 power connector that can be used in custom-developed systems that have an internal power supply. There is no isolation circuitry between the external 19 V DC jack and the internal 1 x 2 power connector. It is the system integrators responsibility to ensure no more than one power supply unit is or can be attached to the board at any time and to ensure the external 19 V DC jack is covered if the internal 1 x 2 power connector is to be used. A plastic lid for the external 19 V DC jack is provided in the accessories box shall it be useful to the system integrator for this purpose. Simultaneous connection of both external and internal power supply units could result in potential damage to the desktop board, power supplies, or other hardware. System power requirements will depend on actual system configurations chosen by the integrator, as well as end user expansion preferences. It is the system integrators responsibility to ensure an appropriate power budget for the system configuration is properly assessed based on the system-level components chosen. Table 40 lists example power consumption from both the board and typical systemlevel components.
71
Table 40. Typical System-Level Power Consumption Figures

Max Power Rating (W)
35 W processor 65 W processor PCH LCD w/LED backlight 2 x 2 GB RAM 2 x 4 GB RAM 2 x USB3 (incl. cntlr) 2 x USB2 (high current) 5 x USB2 (std current) PCIe* HMC PCIe FMC PCIe x4 SATA power LAN, audio, other ICs Speakers CPU fan System fan Total System Power Notes: 1. 2. 3. 4. 5. 6. 7. Power requirement estimated for 80% VR efficiency. 56% utilization for USB3 refers to current draw of 100 mA on port 1 and 900 mA on port 2; an additional 1 A for controller power is then added to this ratio. 58% utilization for back panel USB2 refers to current draw of 500 mA on port 3 and 1.0 A on port. 36% utilization for internal USB2 headers refers to current draw of 100 mA on ports 5-8 and 500 mA on port 9. 20% utilization for Half-Mini Card refers to ~1 W Wi-Fi card power consumption. 40% utilization for Full-Mini Card refers to ~2 W misc card power consumption. 29% utilization for SATA refers to ~5 W slim ODD and ~2.5 W HDD (2.5) power consumption. 35 65 5 25 4 8 10 13 12.5 5 5 25 26.15 5 6 2.4 3.6
Power Req1 (W)
35 W Slim Desktop Util Budget (W)

41.6
65 W AiO Util Budget (W)

77.2 4.7 29.7
43.8 81.3 6.3 31.3 5 10 12.5 16.3 15.6 6.25 6.25 31.25 32.69 6.25 7.5 3 4.5
95%
95% 75% 4.7 75% 95% 95% 56%2 58%3 36%

4
4.8 95% 6.9 9.4 5.6 1.25 2.5 56%2 58%3 36%
4
9.5 6.9 9.4 5.6 1.25 2.5
20%5 40%6 29%7 95%
20%5 40%6 29%7 95% 100%
9.48 5.94
9.48 5.94 7.5 3 4.5 177.17
100% 100%
3 4.5 99.7
100% 100%
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Technical Reference
2.6.2
Fan Header Current Capability
CAUTION
The processor fan must be connected to the processor fan header, not to a chassis fan header. Connecting the processor fan to a chassis fan header may result in onboard component damage that will halt fan operation. Table 41 lists the current capability of the fan headers. Table 41. Fan Header Current Capability
Fan Header
Processor fan System fan
Maximum Available Current

2.0 A 1.5 A
2.6.3
PCI Express* Add-in Card Considerations
The motherboard is designed to provide up to 25 W to the PCI Express x4 slot. The total power consumption from add-in boards on this slot must not exceed this rating.
2.7
Thermal Considerations
CAUTION
A chassis with a maximum internal ambient temperature of 38 oC at the processor fan inlet is a requirement. Whenever possible, use of a processor heat sink that provides omni-directional airflow to maintain required airflow across the processor voltage regulator area is recommended.
CAUTION
Failure to ensure appropriate airflow may result in reduced performance of both the processor and/or voltage regulator or, in some instances, damage to the board. For a list of chassis that have been tested with Intel desktop boards please refer to the following website: http://www3.intel.com/cd/channel/reseller/asmo-na/eng/tech_reference/53211.htm All responsibility for determining the adequacy of any thermal or system design remains solely with the system integrator. Intel makes no warranties or representations that merely following the instructions presented in this document will result in a system with adequate thermal performance.
CAUTION
Ensure that the ambient temperature does not exceed the boards maximum operating temperature. Failure to do so could cause components to exceed their maximum case temperature and malfunction. For information about the maximum operating temperature, see the environmental specifications in Section 2.9.
73
CAUTION
The processor voltage regulator area (shown in Figure 23) can reach a temperature of up to 120 oC in an open chassis. Ensure that proper airflow is maintained in the processor voltage regulator circuit. Failure to do so may result in shorter than expected product lifetime. Figure 23 shows the locations of the localized high temperature zones.
Item A B C
Description Intel H61 Express Chipset Processor socket Processor voltage regulator area
Figure 23. Localized High Temperature Zones
74
Technical Reference
Table 42 provides maximum case temperatures for the components that are sensitive to thermal changes. The operating temperature, current load, or operating frequency could affect case temperatures. Maximum case temperatures are important when considering proper airflow to cool the board. Table 42. Thermal Considerations for Components
Component
Processor Intel H61 Express Chipset
Maximum Case Temperature

For processor case temperature, see processor datasheets and processor specification updates 104 oC
To ensure functionality and reliability, the component is specified for proper operation when Case Temperature is maintained at or below the maximum temperature listed in Table 43. This is a requirement for sustained power dissipation equal to Thermal Design Power (TDP is specified as the maximum sustainable power to be dissipated by the components). When the component is dissipating less than TDP, the case temperature should be below the Maximum Case Temperature. The surface temperature at the geometric center of the component corresponds to Case Temperature. It is important to note that the temperature measurement in the system BIOS is a value reported by embedded thermal sensors in the components and does not directly correspond to the Maximum Case Temperature. The upper operating limit when monitoring this thermal sensor is Tcontrol. Table 43. Tcontrol Values for Components
Component
Processor Intel H61 Express Chipset
Tcontrol
For processor case temperature, see processor datasheets and processor specification updates 104 oC

Processor datasheets and specification updates Intel 6 Series Chipset Thermal Mechanical Specifications and Design Guidelines
Refer to
Section 1.2, page 19 http://www.intel.com/Products/Desktop/ Chipsets/ec-h61/h61technicaldocuments.htm
75
2.8
Reliability
The Mean Time Between Failures (MTBF) prediction is calculated using component and subassembly random failure rates. The calculation is based on the Telcordia SR-332 Issue 2, Method I, Case 3, 55 C ambient. The MTBF prediction is used to estimate repair rates and spare parts requirements. The MTBF for the board is 298,107 hours.
2.9
Environmental
Table 44 lists the environmental specifications for the board. Table 44. Environmental Specifications
Parameter Temperature Non-Operating Operating Shock Unpackaged 50 g trapezoidal waveform Velocity change of 170 inches/s Packaged Half sine 2 millisecond Product Weight (pounds) <20 21-40 41-80 81-100 Vibration Unpackaged 5 Hz to 20 Hz: 0.01 g Hz sloping up to 0.02 g Hz 20 Hz to 500 Hz: 0.02 g Hz (flat) Packaged 5 Hz to 40 Hz: 0.015 g Hz (flat) 40 Hz to 500 Hz: 0.015 g Hz sloping down to 0.00015 g Hz Free Fall (inches) 36 30 24 18 Velocity Change (inches/s) 167 152 136 118 -20 C to +70 C 0 C to +55 C Specification
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3
3.1
Overview of BIOS Features

Introduction
The board uses an Intel BIOS that is stored in the Serial Peripheral Interface Flash Memory (SPI Flash) and can be updated using a disk-based program. The SPI Flash contains the BIOS Setup program, POST, the PCI auto-configuration utility, LAN EEPROM information, and Plug and Play support. The BIOS displays a message during POST identifying the type of BIOS and a revision code. The initial production BIOSs are identified as AGH6110H.86A. When the BIOS Setup configuration jumper is set to configure mode and the computer is powered-up, the BIOS compares the CPU version and the microcode version in the BIOS and reports if the two match. The BIOS Setup program can be used to view and change the BIOS settings for the computer. The BIOS Setup program is accessed by pressing the <F2> key after the Power-On Self-Test (POST) memory test begins and before the operating system boot begins. The menu bar is shown below.
Maintenance Main Configuration Performance Security Power Boot Exit
NOTE
The maintenance menu is displayed only when the board is in configure mode. Section 2.4 on page 67 shows how to put the board in configure mode.
77
Table 45 lists the BIOS Setup program menu features. Table 45. BIOS Setup Program Menu Bar
ConfiguraMaintenance Clears passwords and displays processor information Main Displays processor and memory configuration tion Configures advanced features available through the chipset Performance Configures Memory, Bus and Processor overrides Security Sets passwords and security features Power Configures power management features and power supply controls Boot Selects boot options Exit Saves or discards changes to Setup program options
Table 46 lists the function keys available for menu screens. Table 46. BIOS Setup Program Function Keys
BIOS Setup Program Function Key
<> or <> <> or <> <Tab> <Enter> <F9> <F10> <Esc>
Description
Selects a different menu screen (Moves the cursor left or right) Selects an item (Moves the cursor up or down) Selects a field (Not implemented) Executes command or selects the submenu Load the default configuration values for the current menu Save the current values and exits the BIOS Setup program Exits the menu
3.2
BIOS Flash Memory Organization
The Serial Peripheral Interface Flash Memory (SPI Flash) includes a 32 Mbit (4096 KB) flash memory device.
78
3.3
System Management BIOS (SMBIOS)
SMBIOS is a Desktop Management Interface (DMI) compliant method for managing computers in a managed network. The main component of SMBIOS is the Management Information Format (MIF) database, which contains information about the computing system and its components. Using SMBIOS, a system administrator can obtain the system types, capabilities, operational status, and installation dates for system components. The MIF database defines the data and provides the method for accessing this information. The BIOS enables applications such as third-party management software to use SMBIOS. The BIOS stores and reports the following SMBIOS information: BIOS data, such as the BIOS revision level Fixed-system data, such as peripherals, serial numbers, and asset tags Resource data, such as memory size, cache size, and processor speed Dynamic data, such as event detection and error logging
Non-Plug and Play operating systems require an additional interface for obtaining the SMBIOS information. The BIOS supports an SMBIOS table interface for such operating systems. Using this support, an SMBIOS service-level application running on a non-Plug and Play operating system can obtain the SMBIOS information. Additional board information can be found in the BIOS under the Additional Information header under the Main BIOS page.
3.4
Legacy USB Support
Legacy USB support enables USB devices to be used even when the operating systems USB drivers are not yet available. Legacy USB support is used to access the BIOS Setup program, and to install an operating system that supports USB. By default, Legacy USB support is set to Enabled. Legacy USB support operates as follows: 1. When you apply power to the computer, legacy support is disabled. 2. POST begins. 3. Legacy USB support is enabled by the BIOS allowing you to use a USB keyboard to enter and configure the BIOS Setup program and the maintenance menu. 4. POST completes. 5. The operating system loads. While the operating system is loading, USB keyboards and mice are recognized and may be used to configure the operating system. (Keyboards and mice are not recognized during this period if Legacy USB support was set to Disabled in the BIOS Setup program.) 6. After the operating system loads the USB drivers, all legacy and non-legacy USB devices are recognized by the operating system, and Legacy USB support from the BIOS is no longer used. 7. Additional USB legacy feature options can be access by using Intel Integrator Toolkit.
79
To install an operating system that supports USB, verify that Legacy USB support in the BIOS Setup program is set to Enabled and follow the operating systems installation instructions.
3.5
BIOS Updates
Intel Express BIOS Update utility, which enables automated updating while in the Windows environment. Using this utility, the BIOS can be updated from a file on a hard disk, a USB drive (a flash drive or a USB hard drive), or a CD-ROM, or from the file location on the Web. Intel Flash Memory Update Utility, which requires booting from DOS. Using this utility, the BIOS can be updated from a file on a hard disk, a USB drive (a flash drive or a USB hard drive), or a CD-ROM. Intel F7 switch during POST allows a user to select where the BIOS .bio file is located and perform the update from that location/device. Similar to performing a BIOS Recovery without removing the BIOS configuration jumper.
The BIOS can be updated using either of the following utilities, which are available on the Intel World Wide Web site:
Both utilities verify that the updated BIOS matches the target system to prevent accidentally installing an incompatible BIOS.
NOTE
Review the instructions distributed with the upgrade utility before attempting a BIOS update.
BIOS update utilities
Refer to
http://support.intel.com/support/motherboards/desktop/sb /CS-022312.htm.
3.5.1
Language Support
The BIOS Setup program and help messages are supported in US English. Check the Intel web site for support.
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3.5.2
Custom Splash Screen
During POST, an Intel splash screen is displayed by default. This splash screen can be augmented with a custom splash screen. The Intel Integrators Toolkit that is available from Intel can be used to create a custom splash screen.
NOTE
If you add a custom splash screen, it will share space with the Intel branded logo.
Refer to
http://developer.intel.com/design/motherbd/software/itk/ http://developer.intel.com/design/motherbd/software.htm

Intel Integrator Toolkit Additional Intel software tools
3.6
BIOS Recovery
It is unlikely that anything will interrupt a BIOS update; however, if an interruption occurs, the BIOS could be damaged. Table 47 lists the drives and media types that can and cannot be used for BIOS recovery. The BIOS recovery media does not need to be made bootable. Table 47. Acceptable Drives/Media Types for BIOS Recovery
Media Type (Note)
Hard disk drive (connected to SATA or USB) CD/DVD drive (connected to SATA or USB) USB flash drive USB diskette drive (with a 1.4 MB diskette)
Can be used for BIOS recovery?

Yes Yes Yes No (BIOS update file is bigger than 1.4 MB size limit)
NOTE
Supported file systems for BIOS recovery: NTFS (sparse, compressed, or encrypted files are not supported) FAT32 FAT16 FAT12 ISO 9660
Refer to
http://www.intel.com/support/motherboards/desktop/sb/cs-023360.htm

BIOS recovery
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3.7
Boot Options
In the BIOS Setup program, the user can choose to boot from a hard drive, optical drive, removable drive, or the network. The default setting is for the optical drive to be the first boot device, the hard drive second, removable drive third, and the network fourth.
3.7.1
Optical Drive Boot
Booting from the optical drive is supported in compliance to the El Torito bootable CD-ROM format specification. Under the Boot menu in the BIOS Setup program, the optical drive is listed as a boot device. Boot devices are defined in priority order. Accordingly, if there is not a bootable CD in the optical drive, the system will attempt to boot from the next defined drive.
3.7.2
Network Boot
The network can be selected as a boot device. This selection allows booting from the onboard LAN or a network add-in card with a remote boot ROM installed. Pressing the <F12> key during POST automatically forces booting from the LAN. To use this key during POST, the User Access Level in the BIOS Setup program's Security menu must be set to Full.
3.7.3
Booting Without Attached Devices
For use in embedded applications, the BIOS has been designed so that after passing the POST, the operating system loader is invoked even if the following devices are not present: Video adapter Keyboard Mouse
3.7.4
Changing the Default Boot Device During POST
Pressing the <F10> key during POST causes a boot device menu to be displayed. This menu displays the list of available boot devices. Table 48 lists the boot device menu options. Table 48. Boot Device Menu Options
Boot Device Menu Function Keys
<> or <> <Enter> <Esc>
Description
Selects a default boot device Exits the menu, and boots from the selected device Exits the menu and boots according to the boot priority defined through BIOS setup
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3.8

Adjusting Boot Speed

Selecting and configuring peripherals properly Optimized BIOS boot parameters Enabling the new Fast Boot feature
These factors affect system boot speed:
3.8.1

Peripheral Selection and Configuration

Choose a hard drive with parameters such as power-up to data ready in less than eight seconds that minimizes hard drive startup delays. Select a CD-ROM drive with a fast initialization rate. This rate can influence POST execution time. Eliminate unnecessary add-in adapter features, such as logo displays, screen repaints, or mode changes in POST. These features may add time to the boot process. Try different monitors. Some monitors initialize and communicate with the BIOS more quickly, which enables the system to boot more quickly.
The following techniques help improve system boot speed:
3.8.2
BIOS Boot Optimizations

In the Boot Menu, set the hard disk drive as the first boot device. As a result, the POST does not first seek a diskette drive, which saves about one second from the POST execution time. In the Peripheral Configuration submenu, disable the LAN device if it will not be used. This can reduce up to four seconds of option ROM boot time.
Use of the following BIOS Setup program settings reduces the POST execution time.
NOTE
It is possible to optimize the boot process to the point where the system boots so quickly that the Intel logo screen (or a custom logo splash screen) will not be seen. Monitors and hard disk drives with minimum initialization times can also contribute to a boot time that might be so fast that necessary logo screens and POST messages cannot be seen. This boot time may be so fast that some drives might be not be initialized at all. If this condition should occur, it is possible to introduce a programmable delay ranging from zero to 30 seconds by 5 second increments (using the Hard Disk Pre-Delay feature of the Advanced Menu in the Drive Configuration Submenu of the BIOS Setup program).
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3.9
BIOS Security Features
The BIOS includes security features that restrict access to the BIOS Setup program and who can boot the computer. A supervisor password and a user password can be set for the BIOS Setup program and for booting the computer, with the following restrictions: The supervisor password gives unrestricted access to view and change all the Setup options in the BIOS Setup program. This is the supervisor mode. The user password gives restricted access to view and change Setup options in the BIOS Setup program. This is the user mode. If only the supervisor password is set, pressing the <Enter> key at the password prompt of the BIOS Setup program allows the user restricted access to Setup. If both the supervisor and user passwords are set, users can enter either the supervisor password or the user password to access Setup. Users have access to Setup respective to which password is entered. Setting the user password restricts who can boot the computer. The password prompt will be displayed before the computer is booted. If only the supervisor password is set, the computer boots without asking for a password. If both passwords are set, the user can enter either password to boot the computer. For enhanced security, use different passwords for the supervisor and user passwords. Valid password characters are A-Z, a-z, and 0-9. Passwords may be up to 16 characters in length.
Table 49 shows the effects of setting the supervisor password and user password. This table is for reference only and is not displayed on the screen. Table 49. Supervisor and User Password Functions
Password Set
Neither Supervisor only User only Supervisor and user set Note:
Supervisor Mode
Can change all options (Note) Can change all options N/A Can change all options
User Mode
Can change all options (Note)
Setup Options
None
Password to Enter Setup

None Supervisor
Password During Boot

None None
Can change a Supervisor Password limited number of options Can change all options Enter Password Clear User Password
User Supervisor or user
User Supervisor or user
Can change a Supervisor Password limited number Enter Password of options
If no password is set, any user can change all Setup options.
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4
4.1
Error Messages and Beep Codes

Speaker
Audible error code (beep code) information during POST is routed to the audio codec and can be heard through attached speakers.
4.2
BIOS Beep Codes
Whenever a recoverable error occurs during POST, the BIOS causes the boards speaker to beep an error message describing the problem (see Table 50). Table 50. BIOS Beep Codes
Type
BIOS update in progress Video error
(Note)
Pattern
None On-off (1.0 second each) two times, then 2.5-second pause (off), entire pattern repeats (beeps and pause) once and the BIOS will continue to boot. On-off (1.0 second each) three times, then 2.5-second pause (off), entire pattern repeats (beeps and pause) until the system is powered off. Alternate high and low beeps (1.0 second each) for eight beeps, followed by system shut down.
Frequency
932 Hz When no VGA option ROM is found. 932 Hz
Memory error
Thermal trip warning
High beep 2000 Hz Low beep 1500 Hz
Note: Disabled per default BIOS setup option.
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4.3
Front-panel Power LED Blink Codes
Whenever a recoverable error occurs during POST, the BIOS causes the boards front panel power LED to blink an error message describing the problem (see Table 51). Table 51. Front-panel Power LED Blink Codes
Type
BIOS update in progress
Pattern
Off when the update begins, then on for 0.5 seconds, then off for 0.5 seconds. The pattern repeats until the BIOS update is complete. On-off (1.0 second each) two times, then 2.5-second pause (off), entire pattern repeats (blink and pause) until the system is powered off. On-off (1.0 second each) three times, then 2.5-second pause (off), entire pattern repeats (blinks and pause) until the system is powered off. Each beep will be accompanied by the following blink pattern: .25 seconds on, .25 seconds off, .25 seconds on, .25 seconds off. This will result in a total of 16 blinks.
Note
Video error
(Note)
When no VGA option ROM is found.
Memory error
Thermal trip warning
Note: Disabled per default BIOS setup option.
4.4
BIOS Error Messages
Table 52 lists the error messages and provides a brief description of each. Table 52. BIOS Error Messages
Error Message
CMOS Battery Low CMOS Checksum Bad Memory Size Decreased No Boot Device Available
Explanation
The battery may be losing power. Replace the battery soon. The CMOS checksum is incorrect. CMOS memory may have been corrupted. Run Setup to reset values. Memory size has decreased since the last boot. If no memory was removed, then memory may be bad. System did not find a device to boot.
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4.5
Port 80h POST Codes
During the POST, the BIOS generates diagnostic progress codes (POST codes) to I/O port 80h. If the POST fails, execution stops and the last POST code generated is left at port 80h. This code is useful for determining the point where an error occurred. Displaying the POST codes requires a POST card that can interface with the Debug header. The POST card can decode the port and display the contents on a medium such as a seven-segment display. Refer to the location of the Debug header in Figure 1. The following tables provide information about the POST codes generated by the BIOS: Table 53 lists the Port 80h POST code ranges Table 54 lists the Port 80h POST codes themselves Table 55 lists the Port 80h POST sequence
NOTE
In the tables listed above, all POST codes and range values are listed in hexadecimal. Table 53. Port 80h POST Code Ranges
Range
0x00 0x05 0x10, 0x20, 0x30, 0x40, 0x50 0x01 0x0F 0x11 0x1F 0x21 0x29 0x2A 0x2F 0x31 0x35 0x36 0x3F 0x41 0x4F 0x50 0x5F 0x60 0x6F 0x70 0x7F 0x80 0x8F 0x90 0x9F 0xA0 0xAF 0xB0 0xBF 0xC0 0xCF 0xD0 0xDF
Subsystem
Entering SX states S0 to S5. Resuming from SX states (0x10 0x20 S2, 0x30 S3, etc.) Security (SEC) phase PEI phase pre MRC execution MRC memory detection PEI phase post MRC execution Recovery Platform DXE driver CPU Initialization (PEI, DXE, SMM) I/O Buses: PCI, USB, ATA etc. 0x5F is an unrecoverable error. Start with PCI. BDS Output devices: All output consoles. For future use Input devices: Keyboard/Mouse. For future use Boot Devices: Includes fixed media and removable media. Not that critical since consoles should be up at this point. For future use For future use
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Table 54. Port 80h POST Codes

Port 80 Code
0x00,0x01,0x02,0x03,0x04,0x05 0x10,0x20,0x30,0x40,0x50 0x08 0x09 0x0A 0x0B 0x0C 0x0D 0x0E 0x0F
Progress Code Enumeration

ACPI S States Entering S0, S2, S3, S4, or S5 state Resuming from S2, S3, S4, or S5 state Security Phase (SEC) Starting BIOS execution after CPU BIST SPI prefetching and caching Load BSP microcode Load APs microcode Platform program baseaddresses Wake Up All APs Initialize NEM Pass entry point of the PEI core PEI before MRC PEI Platform driver
0x11 0x12 0x13 0x14 0x15 0x16 0x17 0x18 0x21 0x22 0x23 0x25 0x28 0x29 0x2A 0x2B
Set bootmode, GPIO init Early chipset register programming including graphics init Basic PCH init, discrete device init (IEEE 1394, SATA) LAN init Exit early platform init driver PEI SMBUS SMBUSriver init Entry to SMBUS execute read/write Exit SMBUS execute read/write Memory MRC entry point Reading SPD from memory DIMMs Detecting presence of memory DIMMs Configuring memory Testing memory Exit MRC driver PEI after MRC Start to Program MTRR Settings Done Programming MTRR Settings
continued
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Table 54. Port 80h POST Codes (continued)

Port 80 Code
0x31 0x34 0x35

PEIMs/Recovery Crisis Recovery has initiated Loading recovery capsule Start recovery capsule / valid capsule is found CPU Initialization CPU PEI Phase
0x41 0x42 0x43 0x44 0x45 0x46 0x47 0x48 0x49 0x4A 0x4B 0x4C 0x4D 0x4E 0x4F 0x50 0x51 0x52 0x58 0x59 0x5A 0x5B
Begin CPU PEI Init XMM instruction enabling End CPU PEI Init CPU PEI SMM Phase Begin CPU SMM Init smm relocate bases Smm relocate bases for APs End CPU SMM Init CPU DXE Phase CPU DXE Phase begin Refresh memory space attributes according to MTRRs Load the microcode if needed Initialize strings to HII database Initialize MP support CPU DXE Phase End CPU DXE SMM Phase CPU DXE SMM Phase begin Relocate SM bases for all APs CPU DXE SMM Phase end I/O BUSES Enumerating PCI buses Allocating resources to PCI bus Hot Plug PCI controller initialization USB Resetting USB bus Reserved for USB ATA/ATAPI/SATA Resetting PATA/SATA bus and all devices Reserved for ATA
continued
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Port 80 Code
0x60 0x61 0x62 0x63 0x64 0x65 0x66 0x67 0x68 0x69 0x6A 0x6B 0x6C 0x6D 0x6E 0x6F 0x90 0x91 0x92 0x93 0x94 0x95 0x98 0x99 0x9B 0xB0 0xB1 0xB2 0xB3

BDS BDS driver entry point initialize BDS service routine entry point (can be called multiple times) BDS Step2 BDS Step3 BDS Step4 BDS Step5 BDS Step6 BDS Step7 BDS Step8 BDS Step9 BDS Step10 BDS Step11 BDS Step12 BDS Step13 BDS Step14 BDS return to DXE core (should not get here) Keyboard (PS/2 or USB) Resetting keyboard Disabling the keyboard Detecting the presence of the keyboard Enabling the keyboard Clearing keyboard input buffer Instructing keyboard controller to run Self Test (PS/2 only) Mouse (PS/2 or USB) Resetting mouse Detecting mouse Detecting presence of mouse Enabling mouse Fixed Media Resetting fixed media Disabling fixed media Detecting presence of a fixed media (IDE hard drive detection etc.) Enabling/configuring a fixed media
continued
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Port 80 Code
0xB8 0xB9 0xBA 0xBC 0xE4 0xE7 0xE8 0xE9 0xEB 0xF8 0xF9

Removable Media Resetting removable media Disabling removable media Detecting presence of a removable media (IDE, CDROM detection etc.) Enabling/configuring a removable media DXE Core Entered DXE phase BDS Waiting for user input Checking password Entering BIOS setup Calling Legacy Option ROMs Runtime Phase/EFI OS Boot EFI boot service ExitBootServices ( ) has been called EFI runtime service SetVirtualAddressMap ( ) has been called
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Table 55. Typical Port 80h POST Sequence

POST Code
21 22 23 25 28 34 E4 12 13 50 51 92 90 94 95 EB 58 5A 92 90 94 5A 28 90 94 E7 01 00
Description
Initializing a chipset component Reading SPD from memory DIMMs Detecting presence of memory DIMMs Configuring memory Testing memory Loading recovery capsule Entered DXE phase Starting application processor initialization SMM initialization Enumerating PCI buses Allocating resourced to PCI bus Detecting the presence of the keyboard Resetting keyboard Clearing keyboard input buffer Keyboard Self Test Calling Video BIOS Resetting USB bus Resetting PATA/SATA bus and all devices Detecting the presence of the keyboard Resetting keyboard Clearing keyboard input buffer Resetting PATA/SATA bus and all devices Testing memory Resetting keyboard Clearing keyboard input buffer Waiting for user input INT 19 Ready to boot
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Regulatory Compliance and Battery Disposal Information

Regulatory Compliance
Safety standards European Union Declaration of Conformity statement Product Ecology statements Electromagnetic Compatibility (EMC) standards Product certification markings
5.1

This section contains the following regulatory compliance information for Intel Desktop Board DH61AG:
5.1.1
Safety Standards
Intel Desktop Board DH61AG complies with the safety standards stated in Table 56 when correctly installed in a compatible host system. Table 56. Safety Standards
Standard
CSA/UL 60950-1 EN 60950-1 IEC 60950-1
Title
Information Technology Equipment Safety - Part 1: General Requirements (USA and Canada) Information Technology Equipment Safety - Part 1: General Requirements (European Union) Information Technology Equipment Safety - Part 1: General Requirements (International)
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5.1.2
European Union Declaration of Conformity Statement
We, Intel Corporation, declare under our sole responsibility that the products Intel Desktop Board DH61AG is in conformity with all applicable essential requirements necessary for CE marking, following the provisions of the European Council Directive 2004/108/EC (EMC Directive), 2006/95/EC (Low Voltage Directive), and 2002/95/EC (ROHS Directive). The product is properly CE marked demonstrating this conformity and is for distribution within all member states of the EU with no restrictions.
This product follows the provisions of the European Directives 2004/108/EC, 2006/95/EC, and 2002/95/EC. etina Tento vrobek odpovd poadavkm evropskch smrnic 2004/108/EC, 2006/95/EC a 2002/95/EC. Dansk Dette produkt er i overensstemmelse med det europiske direktiv 2004/108/EC, 2006/95/EC & 2002/95/EC. Dutch Dit product is in navolging van de bepalingen van Europees Directief 2004/108/EC, 2006/95/EC & 2002/95/EC. Eesti Antud toode vastab Euroopa direktiivides 2004/108/EC, ja 2006/95/EC ja 2002/95/EC kehtestatud nuetele. Suomi Tm tuote noudattaa EU-direktiivin 2004/108/EC, 2006/95/EC & 2002/95/EC mryksi. Franais Ce produit est conforme aux exigences de la Directive Europenne 2004/108/EC, 2006/95/EC & 2002/95/EC. Deutsch Dieses Produkt entspricht den Bestimmungen der Europischen Richtlinie 2004/108/EC, 2006/95/EC & 2002/95/EC. 2004/108/EC, 2006/95/EC 2002/95/EC. Magyar E termk megfelel a 2004/108/EC, 2006/95/EC s 2002/95/EC Eurpai Irnyelv elrsainak. Icelandic essi vara stenst regluger Evrpska Efnahags Bandalagsins nmer 2004/108/EC, 2006/95/EC, & 2002/95/EC. Italiano Questo prodotto conforme alla Direttiva Europea 2004/108/EC, 2006/95/EC & 2002/95/EC. Latvieu is produkts atbilst Eiropas Direktvu 2004/108/EC, 2006/95/EC un 2002/95/EC noteikumiem. Lietuvi is produktas atitinka Europos direktyv 2004/108/EC, 2006/95/EC, ir 2002/95/EC nuostatas. Malti Dan il-prodott hu konformi mal-provvedimenti tad-Direttivi Ewropej 2004/108/EC, 2006/95/EC u 2002/95/EC. Norsk Dette produktet er i henhold til bestemmelsene i det europeiske direktivet 2004/108/EC, 2006/95/EC & 2002/95/EC. Polski Niniejszy produkt jest zgodny z postanowieniami Dyrektyw Unii Europejskiej 2004/108/EC, 206/95/EC i 2002/95/EC.
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Portuguese Este produto cumpre com as normas da Diretiva Europia 2004/108/EC, 2006/95/EC & 2002/95/EC. Espaol Este producto cumple con las normas del Directivo Europeo 2004/108/EC, 2006/95/EC & 2002/95/EC. Slovensky Tento produkt je v slade s ustanoveniami eurpskych direktv 2004/108/EC, 2006/95/EC a 2002/95/EC. Slovenina Izdelek je skladen z dolobami evropskih direktiv 2004/108/EC, 2006/95/EC in 2002/95/EC. Svenska Denna produkt har tillverkats i enlighet med EG-direktiv 2004/108/EC, 2006/95/EC & 2002/95/EC. Trke Bu rn, Avrupa Birliinin 2004/108/EC, 2006/95/EC ve 2002/95/EC ynergelerine uyar.
5.1.3
Product Ecology Statements
The following information is provided to address worldwide product ecology concerns and regulations.
5.1.3.1
Disposal Considerations
This product contains the following materials that may be regulated upon disposal: lead solder on the printed wiring board assembly.
5.1.3.2
Recycling Considerations
As part of its commitment to environmental responsibility, Intel has implemented the Intel Product Recycling Program to allow retail consumers of Intels branded products to return used products to selected locations for proper recycling. Please consult the http://www.intel.com/intel/other/ehs/product_ecology for the details of this program, including the scope of covered products, available locations, shipping instructions, terms and conditions, etc. Intel Product Recycling Program http://www.intel.com/intel/other/ehs/product_ecology Deutsch Als Teil von Intels Engagement fr den Umweltschutz hat das Unternehmen das Intel Produkt-Recyclingprogramm implementiert, das Einzelhandelskunden von Intel Markenprodukten ermglicht, gebrauchte Produkte an ausgewhlte Standorte fr ordnungsgemes Recycling zurckzugeben. Details zu diesem Programm, einschlielich der darin eingeschlossenen Produkte, verfgbaren Standorte, Versandanweisungen, Bedingungen usw., finden Sie auf der http://www.intel.com/intel/other/ehs/product_ecology
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Espaol Como parte de su compromiso de responsabilidad medioambiental, Intel ha implantado el programa de reciclaje de productos Intel, que permite que los consumidores al detalle de los productos Intel devuelvan los productos usados en los lugares seleccionados para su correspondiente reciclado. Consulte la http://www.intel.com/intel/other/ehs/product_ecology para ver los detalles del programa, que incluye los productos que abarca, los lugares disponibles, instrucciones de envo, trminos y condiciones, etc. Franais Dans le cadre de son engagement pour la protection de l'environnement, Intel a mis en uvre le programme Intel Product Recycling Program (Programme de recyclage des produits Intel) pour permettre aux consommateurs de produits Intel de recycler les produits uss en les retournant des adresses spcifies. Visitez la page Web http://www.intel.com/intel/other/ehs/product_ecology pour en savoir plus sur ce programme, savoir les produits concerns, les adresses disponibles, les instructions d'expdition, les conditions gnrales, etc. http://www.intel.com/in tel/other/ehs/product_ecology Malay Sebagai sebahagian daripada komitmennya terhadap tanggungjawab persekitaran, Intel telah melaksanakan Program Kitar Semula Produk untuk membenarkan pengguna-pengguna runcit produk jenama Intel memulangkan produk terguna ke lokasi-lokasi terpilih untuk dikitarkan semula dengan betul. Sila rujuk http://www.intel.com/intel/other/ehs/product_ecology untuk mendapatkan butir-butir program ini, termasuklah skop produk yang dirangkumi, lokasi-lokasi tersedia, arahan penghantaran, terma & syarat, dsb. Portuguese Como parte deste compromisso com o respeito ao ambiente, a Intel implementou o Programa de Reciclagem de Produtos para que os consumidores finais possam enviar produtos Intel usados para locais selecionados, onde esses produtos so reciclados de maneira adequada. Consulte o site http://www.intel.com/intel/other/ehs/product_ecology (em Ingls) para obter os detalhes sobre este programa, inclusive o escopo dos produtos cobertos, os locais disponveis, as instrues de envio, os termos e condies, etc.
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Russian , Intel Intel (Product Recycling Program) Intel . , - http://www.intel.com/intel/other/ehs/product_ecology , , , , .. Trke Intel, evre sorumluluuna bamllnn bir paras olarak, perakende tketicilerin Intel markal kullanlm rnlerini belirlenmi merkezlere iade edip uygun ekilde geri dntrmesini amalayan Intel rnleri Geri Dnm Programn uygulamaya koymutur. Bu programn rn kapsam, rn iade merkezleri, nakliye talimatlar, kaytlar ve artlar v.s dahil btn ayrntlarn grenmek iin ltfen http://www.intel.com/intel/other/ehs/product_ecology Web sayfasna gidin.
5.1.4
EMC Regulations
Intel Desktop Board DH61AG complies with the EMC regulations stated in Table 57 when correctly installed in a compatible host system. Table 57. EMC Regulations
Regulation
FCC 47 CFR Part 15, Subpart B ICES-003 EN55022 EN55024 EN55022 CISPR 22 CISPR 24 VCCI V-3, V-4 KN-22, KN-24 CNS 13438
Title
Title 47 of the Code of Federal Regulations, Part 15, Subpart B, Radio Frequency Devices. (USA) Interference-Causing Equipment Standard, Digital Apparatus. (Canada) Limits and methods of measurement of Radio Interference Characteristics of Information Technology Equipment. (European Union) Information Technology Equipment Immunity Characteristics Limits and methods of measurement. (European Union) Australian Communications Authority, Standard for Electromagnetic Compatibility. (Australia and New Zealand) Limits and methods of measurement of Radio Disturbance Characteristics of Information Technology Equipment. (International) Information Technology Equipment Immunity Characteristics Limits and Methods of Measurement. (International) Voluntary Control for Interference by Information Technology Equipment. (Japan) Korean Communications Commission Framework Act on Telecommunications and Radio Waves Act (South Korea) Bureau of Standards, Metrology, and Inspection (Taiwan)
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FCC Declaration of Conformity This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. For questions related to the EMC performance of this product, contact: Intel Corporation, 5200 N.E. Elam Young Parkway, Hillsboro, OR 97124 1-800-628-8686 This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: Reorient or relocate the receiving antenna. Increase the separation between the equipment and the receiver. Connect the equipment to an outlet on a circuit other than the one to which the receiver is connected. Consult the dealer or an experienced radio/TV technician for help.
Any changes or modifications to the equipment not expressly approved by Intel Corporation could void the users authority to operate the equipment. Tested to comply with FCC standards for home or office use. Canadian Department of Communications Compliance Statement This digital apparatus does not exceed the Class B limits for radio noise emissions from digital apparatus set out in the Radio Interference Regulations of the Canadian Department of Communications. Le prsent appareil numerique nmet pas de bruits radiolectriques dpassant les limites applicables aux appareils numriques de la classe B prescrites dans le Rglement sur le broullage radiolectrique dict par le ministre des Communications du Canada.
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Japan VCCI Statement Japan VCCI Statement translation: This is a Class B product based on the standard of the Voluntary Control Council for Interference from Information Technology Equipment (VCCI). If this is used near a radio or television receiver in a domestic environment, it may cause radio interference. Install and use the equipment according to the instruction manual.
Korea Class B Statement Korea Class B Statement translation: This equipment is for home use, and has acquired electromagnetic conformity registration, so it can be used not only in residential areas, but also other areas.
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5.1.5
ENERGY STAR* 5.0, e-Standby, and ErP Compliance
The US Department of Energy and the US Environmental Protection Agency have continually revised the ENERGY STAR requirements. Intel has worked directly with these two governmental agencies in the definition of new requirements. Intel Desktop Board DH61AG meets the following program requirements in an adequate system configuration, including appropriate selection of an efficient power supply: Energy Star v5.0, category A EPEAT* Korea e-Standby European Union Energy-related Products Directive 2009 (ErP) Lot 6
NOTE
Energy Star compliance is based at the system level not the board level. Use of an Intel Desktop Board alone does not guarantee Energy Star compliance.
ENERGY STAR requirements and recommended configurations Electronic Product Environmental Assessment Tool (EPEAT) Korea e-Standby Program European Union Energy-related Products Directive 2009 (ErP)
Refer to
http://www.intel.com/go/energystar http://www.epeat.net/ http://www.kemco.or.kr/new_eng/pg02/ pg02100300.asp http://ec.europa.eu/enterprise/policies/s ustainable-business/sustainable-productpolicy/ecodesign/index_en.htm
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5.1.6
Regulatory Compliance Marks (Board Level)
Intel Desktop Board DH61AG has the regulatory compliance marks shown in Table 58. Table 58. Regulatory Compliance Marks
Description
UL joint US/Canada Recognized Component mark. Includes adjacent UL file number for Intel Desktop Boards: E210882. FCC Declaration of Conformity logo mark for Class B equipment.
Mark
CE mark. Declaring compliance to the European Union (EU) EMC directive, Low Voltage directive, and RoHS directive.
Australian Communications Authority (ACA) and New Zealand Radio Spectrum Management (NZ RSM) C-tick mark. Includes adjacent Intel supplier code number, N-232. Japan VCCI (Voluntary Control Council for Interference) mark.
Korea Certification mark. Includes an adjacent KCC (Korean Communications Commission) certification number: KCC-REM-CPU-DH61AG. Taiwan BSMI (Bureau of Standards, Metrology and Inspections) mark. Includes adjacent Intel company number, D33025. Printed wiring board manufacturers recognition mark. Consists of a unique UL recognized manufacturers logo, along with a flammability rating (solder side). China RoHS/Environmentally Friendly Use Period Logo: This is an example of the symbol used on Intel Desktop Boards and associated collateral. The color of the mark may vary depending upon the application. The Environmental Friendly Usage Period (EFUP) for Intel Desktop Boards has been determined to be 10 years. V-0
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5.2
Battery Disposal Information
CAUTION
Risk of explosion if the battery is replaced with an incorrect type. Batteries should be recycled where possible. Disposal of used batteries must be in accordance with local environmental regulations.
PRCAUTION
Risque d'explosion si la pile usage est remplace par une pile de type incorrect. Les piles usages doivent tre recycles dans la mesure du possible. La mise au rebut des piles usages doit respecter les rglementations locales en vigueur en matire de protection de l'environnement.
FORHOLDSREGEL
Eksplosionsfare, hvis batteriet erstattes med et batteri af en forkert type. Batterier br om muligt genbruges. Bortskaffelse af brugte batterier br foreg i overensstemmelse med gldende miljlovgivning.
OBS!
Det kan oppst eksplosjonsfare hvis batteriet skiftes ut med feil type. Brukte batterier br kastes i henhold til gjeldende miljlovgivning.
VIKTIGT!
Risk fr explosion om batteriet erstts med felaktig batterityp. Batterier ska kasseras enligt de lokala miljvrdsbestmmelserna.
VARO
Rjhdysvaara, jos pariston tyyppi on vr. Paristot on kierrtettv, jos se on mahdollista. Kytetyt paristot on hvitettv paikallisten ympristmrysten mukaisesti.
VORSICHT
Bei falschem Einsetzen einer neuen Batterie besteht Explosionsgefahr. Die Batterie darf nur durch denselben oder einen entsprechenden, vom Hersteller empfohlenen Batterietyp ersetzt werden. Entsorgen Sie verbrauchte Batterien den Anweisungen des Herstellers entsprechend.
AVVERTIMENTO
Esiste il pericolo di un esplosione se la pila non viene sostituita in modo corretto. Utilizzare solo pile uguali o di tipo equivalente a quelle consigliate dal produttore. Per disfarsi delle pile usate, seguire le istruzioni del produttore.
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PRECAUCIN
Existe peligro de explosin si la pila no se cambia de forma adecuada. Utilice solamente pilas iguales o del mismo tipo que las recomendadas por el fabricante del equipo. Para deshacerse de las pilas usadas, siga igualmente las instrucciones del fabricante.
WAARSCHUWING
Er bestaat ontploffingsgevaar als de batterij wordt vervangen door een onjuist type batterij. Batterijen moeten zoveel mogelijk worden gerecycled. Houd u bij het weggooien van gebruikte batterijen aan de plaatselijke milieuwetgeving.
ATENO
Haver risco de exploso se a bateria for substituda por um tipo de bateria incorreto. As baterias devem ser recicladas nos locais apropriados. A eliminao de baterias usadas deve ser feita de acordo com as regulamentaes ambientais da regio.
ACIAROZNA
, . , , . .
UPOZORNN
V ppad vmny baterie za nesprvn druh me dojt k vbuchu. Je-li to mon, baterie by mly bt recyklovny. Baterie je teba zlikvidovat v souladu s mstnmi pedpisy o ivotnm prosted.
. . .
VIGYZAT
Ha a telepet nem a megfelel tpus telepre cserli, az felrobbanhat. A telepeket lehetsg szerint jra kell hasznostani. A hasznlt telepeket a helyi krnyezetvdelmi elrsoknak megfelelen kell kiselejtezni.
103
AWAS
Risiko letupan wujud jika bateri digantikan dengan jenis yang tidak betul. Bateri sepatutnya dikitar semula jika boleh. Pelupusan bateri terpakai mestilah mematuhi peraturan alam sekitar tempatan.
OSTRZEENIE
Istnieje niebezpieczestwo wybuchu w przypadku zastosowania niewaciwego typu baterii. Zuyte baterie naley w miar moliwoci utylizowa zgodnie z odpowiednimi przepisami ochrony rodowiska.
PRECAUIE
Risc de explozie, dac bateria este nlocuit cu un tip de baterie necorespunztor. Bateriile trebuie reciclate, dac este posibil. Depozitarea bateriilor uzate trebuie s respecte reglementrile locale privind protecia mediului.
. . , .
UPOZORNENIE
Ak batriu vymente za nesprvny typ, hroz nebezpeenstvo jej vbuchu. Batrie by sa mali poda monosti vdy recyklova. Likvidcia pouitch batri sa mus vykonva v slade s miestnymi predpismi na ochranu ivotnho prostredia.
POZOR
Zamenjava baterije z baterijo druganega tipa lahko povzroi eksplozijo. e je mogoe, baterije reciklirajte. Rabljene baterije zavrzite v skladu z lokalnimi okoljevarstvenimi predpisi.
UYARI
Yanl trde pil takldnda patlama riski vardr. Piller mmkn olduunda geri dntrlmelidir. Kullanlm piller, yerel evre yasalarna uygun olarak atlmaldr.
O
, . , . , .
104
105
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DH61AG TechProdSpec04

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Intel Desktop Board DH61AG

Technical Product Specification

October 2011 Order Number: G28731-004

Date May 2011 July 2011 July 2011 October 2011

Board Identification Information

Specification Changes or Clarifications

Description of Changes or Clarifications

What This Document Contains

Notes, Cautions, and Warnings

Intel Desktop Board DH61AG Technical Product Specification

Other Common Notation

Intel Desktop Board DH61AG Technical Product Specification

3 Overview of BIOS Features

4 Error Messages and Beep Codes

5 Regulatory Compliance and Battery Disposal Information

Intel Desktop Board DH61AG Technical Product Specification

Intel Desktop Board DH61AG Technical Product Specification

Intel Desktop Board DH61AG Technical Product Specification

Table 2. Feature Summary (continued)

Board Layout (Top)

Figure 1. Major Board Components (Top)

Intel Desktop Board DH61AG Technical Product Specification

Board Layout (Bottom)

Figure 2. Major Board Components (Bottom)

Table 4. Components Shown in Figure 2

Intel Desktop Board DH61AG Technical Product Specification

Figure 3 is a block diagram of the major functional areas of the board.

Figure 3. Block Diagram

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Intel Desktop Board DH61AG Technical Product Specification

For information about

For information about

Intel Desktop Board DH61AG Technical Product Specification

Figure 4 illustrates the memory channel and SO-DIMM configuration.

Figure 4. Memory Channel and SO-DIMM Configuration

Intel H61 Express Chipset

The board supports graphics through Intel Graphics Technology.

Intel High Definition (Intel HD) Graphics

Intel Desktop Board DH61AG Technical Product Specification

Video Memory Allocation

High Definition Multimedia Interface* (HDMI*)

HDMI Port Status Enabled Enabled Disabled

Digital Visual Interface (DVI-I)

DVI Digital (DVI-D) Port Status Enabled Enabled Disabled

DVI Analog (DVI-A) Port Status(Note 1) Enabled Enabled Disabled

Analog Display (VGA)

Intel Desktop Board DH61AG Technical Product Specification

Flat Panel Display Interfaces

Figure 5. Flat Panel Connectors

Embedded DisplayPort (eDP) Interface

Intel Desktop Board DH61AG Technical Product Specification

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Intel Desktop Board DH61AG Technical Product Specification

Real-Time Clock Subsystem

Legacy I/O Controller

The I/O controller provides the following features:

Consumer Infrared (CIR)

Intel Desktop Board DH61AG Technical Product Specification

1.10 Audio Subsystem