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BTM8670
Bluetooth Module Data Sheet
Document Type: Bluetooth Module Datasheet
Document Version: V1.0

Release Date: March 06, 2013
Copyright 2012 by Buddies Technology Limited. All Rights Reserved.
Reproduction of this document, in part of in whole, by any means is prohibited without written permission
From Buddies Technology Limited. The information contained herein is believed to be accurate as of
the date of publication. However, Buddies is not liable for any damages, including indirect or
consequential from the use of software this document represents, or any reliance of the accuracy of
this document. Buddies reserves the right to change the contents of this document at any time
without notice.
This document contains proprietary confidential trade secrets and may be subject to additional
restrictions contained in the licensing agreement under which this document was obtained.
1
http://www.buddies-tech.com BTM8670 DATASHEET
Revision History
Date Version Description Author
2013-03-06 V1.0 First Release
2
CONTENT
1. INTRODUCTION................................................................................................................................. 4
1.1 BLOCK DIAGRAM ................................................................................................................................. 4

1.2 FEATURES ............................................................................................................................................ 5
1.3 APPLICATIONS ..................................................................................................................................... 6
2. GENERAL SPECIFICATION ............................................................................................................ 7
3. PHYSICAL CHARACTERISTIC....................................................................................................... 8
3.1 Pin Description................................................................................................................................... 10
4. PHYSICAL INTERFACE…………………………………………………………………………..14
4.1 POWER SUPPLY ................................................................................................................................... .14
4.2 AUDIO INTERFACES.............................................................................................................................14
4.2.1 Audio Codec Interface ............................................................................................................... 15
4.2.2 ADC ...........................................................................................................................................16
4.2.3 ADC Sample Rate Selection................................................................ ..................................... 16
4.2.4 ADC Digital Gain....................................................................................................................... 16
4.2.5 DAC ........................................................................................................................................... 17
4.2.6 DAC Sample Rate Selection .................................................................................................... 16
4.2.7 DAC Digital Gain....................................................................................................................... 16
4.2.8 DAC Analog Gain ..................................................................................................................... 18
4.2.9 IEC 60958 Interface....................................................................................................................18
4.2.10 Microphone Input ...................................................................................................................... ..18
4.2.11 Digital Microphone Inputs…………………………………………...………………………..18
4.2.12 Line input.................................................................................................................................... 18
4.2.13 Audio Output Stage……………………………………………………………………………19
4.3 PCM Interface.................................................................................................................................... 19
4.4 Digital Audio Interface(I2S)…………………………………………………………………………20
4.5 RF INTERFACE .................................................................................................................................... 20
4.6 GENERAL PURPOSE ANALOG IO ......................................................................................................... 20
4.7 GENERAL PURPOSE DIGITAL IO .......................................................................................................... 20
4.8 SERIAL INTERFACES ............................................................................................................................ 20
4.8.1 UART ......................................................................................................................................... 20
4.8.2 I2C……………………………………………………………………………...……………...21
4.8.3 SPI .............................................................................................................................................. 21
5. ELECTRICAL CHARACTERISTIC ................................................................................................22
5.1 ABSOLUTE MAXIMUM RATING ........................................................................................................... 22

5.2 RECOMMENDED OPERATING CONDITIONS .......................................................................................... 23
5.3 INPUT/OUTPUT TERMINAL CHARACTERISTICS .................................................................................... 23
5.3.1 Internal CODEC - Analogue to Digital Converter .....................................................................24
5.3.2 Internal CODEC - Digital to Analogue Converter .....................................................................25
6. RECOMMENDED TEMPERATURE REFLOW PROFILE......................................................... 26
7. PACKAGING INFORMATION ....................................................................................................... 27
3
The BTM8670 Bluetooth® module is a perfect consumer audio solution for wireless
applications, such as wireless sound bars, wireless stereo speakers and headphones.
It can be connected with any Bluetooth® devices in an operating range. It is slim and
light so the designers can have better flexibilities for the product shapes.
The BTM8670 Bluetooth® module complies with Bluetooth® specification version 4.0. It
supports HSP,HFP,A2DP,AVRCP,PBAP,MAP,SPP….profiles. It integrates an
ultra-low-power DSP and application processor with embedded flash memory, a
high-performance stereo codec, a power management subsystem, LED and LCD
drivers and capacitive touch sensor inputs in a SOC IC. The dual-core architect with
flash memory enables manufactures to easily differentiate the products with new
features without extending development cycles. It integrates RF Baseband controller,
antenna,… etc. and provide UART interface, programmable I/O, stereo speaker output,
microphone input,… etc.
The detail information of BTM8670 Bluetooth® module is presented in this document

below.
Figure 1
4
Small overall dimension(22mm x 15mm x 2mm )
Bluetooth Specification V4.0(Dual Mode)
Class1,Class 2and Class 3 support
Physical connection as SMD type
80MHz RISC MCU and 80MIPS Kalimba DSP
16Mb internal flash memory(64-bit wide,45ns);optional support for 64Mb of

external SPI flash
Stereo codec with 2 channels ADC and up to 6 microphone inputs(include

bias generators and digital microphone support)
Support for CSR’s latest CVC technology for narrow-band and wideband
voice connections including wind noise reduction
Music Enhancements: SBC,MP3,AAC and AAC+, Fast stream

codec,atpX,5-band EQ,3D stereo separation and so on.
Audio Interfaces: I2S,PCM and SPDIF
Serial Interfaces: UART,USB 2.0,I2C and SPI
Support HSP, HFP, A2DP, AVRCP,PBAP,MAP,SPP,iAP profile
Multipoint support for HFP connection to 2 handsets for voice
Multipoint support for A2DP connection to 2 A2DP source for music play back
3 Hardware LED controllers (for RGB) and ability to drive LCD segment
display directly
Support for up to 6 capacitive touch sensor inputs
Built-in RF combo filter, Integrated 26M Crystal.
No radio signal interference, support for 802.11 co-existence

※ Some features are optional for customization on demand.
5
TVs
Smart remote controllers
Wired or wireless sound bars
Wired or wireless speakers and headphones
Wearable audio with sensors(health and well-being applications)
6
! ! " #$!
Bluetooth Specification
Chip Set CSR8670
Module ID BTM8670
BT Standard Bluetooth® V4.0 specification
RF TX Output Power 10dBm (Max)
Sensitivity -90dBm@0.1%BER
Frequency Band 2.402GHz~2.480GHz ISM Band
Baseband Crystal OSC 26MHz

Hopping 1600hops/sec, 1MHz channel space
RF Input Impedance 50 ohms
Microphone : Input (Differential)

Speaker : Output (Differential)
Major Interface UART : Tx/Rx
PIOs
Antenna
Profile HSP, HFP, A2DP, AVRCP,PBAP,MAP,SPP
Voice Processor 80MIPS Kalimba with cVc support

Power
Supply Voltage 3.0V ~ 4.2V DC
Working Current 15mA typical, Depends on profiles
Standby Current <1mA
Operating Environment
Temperature -40ºC to +85ºC
Humidity 10%~90% Non-Condensing
Environmental RoHS Compliant
7
$%&# " % ! #
Dimension
Figure 2
8
Pin Definition
Figure 3
9
Pin# Pin Name Pad Type Description
1 CAP_SENSE_5 Analogue input Capacitive touch sensor input
2 Analogue input Capacitive touch sensor input

CAP_SENSE_2
3 CAP_SENSE_0 Analogue input Capacitive touch sensor input
4 GND Ground Digital Ground

5 AIO_1 Bi-directional Analogue programmable input / output line
Bi-directional with weak Synchronous data input. Alternative function
6 PCM_IN/PIO_17 PIO[17]
pull_down
Bi-directional with weak Synchronous data clock. Alternative function

7 PCM_CLK/PIO_20
pull_down PIO[20]
Bi-directional with weak Synchronous data sync. Alternative function

8 PCM_SYNC/PIO_19 PIO[19]
pull_down
Bi-directional with weak Synchronous data output. Alternative
9 PCM_OUT/PIO_18
pull_down function PIO[18]
Reset if low. Input debouched so
10 BT_RESET Input with strong pull-up
must be low for >5ms to cause a reset
11 SPI_CLK Input with weak pull-down SPI Clock
12 SPI_MOSI Input with weak pull-down SPI data input
13 SPI_CSB Input with strong pull-up Chip select for SPI, active low
14 SPI_MISO Output with weak pull-down SPI data output
Bi-directional with weak UART request to send, active low.

15 UART_RTS
pull_up Alternative function PIO[16]
Bi-directional with weak
16 SPI_CTS UART clear to send, active low
pull_down
Bi-directional with strong
17 UART_RX pull_up UART data input
18 UART_TX UART data output
pull_up
LED driver
20 LED_0 Open drain
Alternative function PO[29]
LED driver
21 LED_1 Open drain
10
LED driver
22 LED_2 Open drain
23 PIO_0 Programmable input/output line
pull_down
pull_down
pull_down
USB data plus with selectable internal

27 USB_DP Bi-directional
1.5kohm pull-up resistor
28 USB_DN Bi-directional USB data minus
29 VDD_USB NC Positive supply for USB ports
pull_down
pull_down
pull_down
pull_down
pull_down
pull_down
pull_down
pull_down
pull_down
pull_down
pull_down
1.7V to 3.6V positive supply input for digital
41 VDD_PADS NC
input/output ports PIO[15:4]
11
Regulator enable input.
Can also be sensed as an input.
Regulator enable and multifunction button. A high

43 PWR Input enable input (tolerant to VBAT) enables the on-chip
regulators, which can then be latched on
internally and the button used as a multifunction
input.
44 VBAT Power supply Battery positive terminal

45 VBAT_SENSE NC Battery charger sense input
Alternative supply via bypass regulator for 1.8V
and 1.35V
46 Power supply Switch mode power supply regulator inputs.

VBUS
Must be connected to the same potential as
VOUT_3V3.
47 CHG_EXT NC External battery charger control
48 +1V8 Open drain output LED driver

49 3V3_OUT NC 3.3V bypass linear regulator output
51 MIC_RN Analogue in Microphone input negative, right

52 MIC_RP Analogue in Microphone input positive, right
53 MIC_BIAS_B Analogue out Microphone bias B
54 MIC_BIAS_A Analogue out Microphone bias A
55 MIC_LN Analogue in Microphone input negative, left

56 MIC_LP Analogue in Microphone input positive, left
57 AGND Ground Analogue Ground
58 SPKR_LN Analogue out Speaker output negative, left
59 SPKR_LP Analogue out Speaker output positive, left

60 SPKR_RN Analogue out Speaker output negative, right
61 SPKR_RP Analogue out Speaker output positive, right
62 AIO_0 Bi-directional Analogue programmable input / output line
63 GND Ground Analogue Ground
12
Bluetooth 50ohm transmitter output/receiver
64 RF_IN RF
input
65 GND Ground Analogue Ground
CAP_SENSE_
1
CAP_SENSE_
3
CAP_SENSE_
4
13
' $%&# " ! !
4.1 Power Supply

The transient response of the regulator is important. If the power rails of the module are
supplied from an external voltage source, the transient response of any regulator used
should be 20 s or less.
4.2 Audio Interfaces
The Audio interface circuit consists of:
Stereo/dual-mono audio codec
Dual analogue audio inputs
Dual analogue audio outputs
6 digit MEMS microphone inputs
A configurable PCM,I2S or SPDIF interface
As below shows the functional blocks of the interface. The codec supports
stereo/dual-mono playback and recording of audio signals at multiple sample rates with a
16-bit resolution. The ADC and DAC of the codec each contain 2 independent
high-quality channels. Any ADC or DAC channel runs at its own independent sample rate.
Figure 4
The interface for the digital audio bus shares the same pins as the PCM codec interface
described in section as below which means each of the audio buses are mutually exclusive
in the usage. As below lists these alternative functions.
Figure 5
14
4.2.1 Audio Codec Interface

The main features of the interface are:
Stereo and mono analogue input for voice band and audio band
Stereo and mono analogue output for voice band and audio band
Support for stereo digital audio bus standards such as I2S
Support for IEC-60958 standard stereo digital audio bus standards, e.g. SPDIF
and AES3(also known as AES/EBU)
Support for PCM interfaces including PCM master codec that require an external
system clock
15
4.2.2 ADC
Figure 3 shows the CSR8670 consists of 2 high-quality ADCs:
Each ADC has a second-order Sigma-Delta converter
Each ADC is a separate channel with identical functionality
There are 2 gain stages for each channel,1 of which is an analogue gain stage and
the other is a digital gain stages
4.2.3 ADC Sample Rate Selection
Each ADC supports the following pre-defined sample rates, although other rates are
progrmmable,e.g.40kHz:
8kHz
11.025 kHz
16kHz
22.050kHz
24kHz
32 kHz
44.1kHz
48 kHz
4.2.4 ADC Digital Gain

A digital gain stage inside the ADC varies from -24dB to 21.5dB,see as below, there is
also a fine gain interface with 9-bit gain setting allowing gain changes in 1/32 steps.
The Firmware controls the audio input gain.
16
4.2.5 DAC
The DAC consists of:
2 fourth-order Sigma-Delta converters enabling 2 separate channels that are
identical functionality, as figure x shows
2 gain stages for each channel, 1 of which is an analogue gain stage and the
other is a digital gain stage
4.2.6 DAC Sample Rate Selection

8kHz
11.025kHz
16kHz
22.050kHz
32kHz
40kHz
44.1kHz
48kHz
96kHz
4.2.7 DAC Digital Gain

A digital gain stage inside the DAC varies from -24dB to 21.5dB,see as below, there is
also a fine gain interface with 9-bit gain setting enabling gain changes in 1/32 steps.
The overall gain control of the ADC is controlled by the firmware. Its setting is a
combined function of the digital and analogue amplifier settings
17
4.2.8 DAC Analogue Gain

As below shows that the DAC analogue gain stage consists of 8 gain selection values that
represent seven 3dB steps
The firmware controls the overall gain control of the DAC. Its setting is a combined
function of the digital and analogue amplifier settings
4.2.9 IEC 60958 Interface

The IEC 60958 interface is a digital audio interface that uses bi-phase coding to minimize
the DC content of the transmitted signal and enables the receiver to decode the clock
information from the transmitted signal. The IEC 60958 specification is based on the 2
industry standards:
AES3(also known as AES/EBU)
Sony and Philips interface specification SPDIF
The interface is compatible with IEC 60958-1, IEC 60958-3 and IEC 60958-4
The SPDIF interface signals are SPDIF-IN and SPDIF-OUT and are shared on the PCM
interface pin.
4.2.10 Microphone Input

BTM8670contains 2 independent low-noise microphone bias generators. The microphone
bias generators are recommended for biasing electro condenser microphones. A biasing
circuit for microphones with a sensitivity between about -40dB to -60dB(0dB=1V/Pa)
4.2.11 Di g i ta l Microphone Inputs

!
" #
$% & '(
' "
) $ "
" ) "
* + * , "
18
4.2.13 Audio Output Stage
The output digital circuitry converts the signal from 16-bit per sample, linear PCM of
variable sampling frequency to a 2Mbits/sec multi-bit stream, which is fed into the analogue
output circuitry.
The output circuit comprises a digital to analogue converter with gain setting and output
amplifier. Its class-AB output-stage is capable of driving a signal on both channels of up to
2V pk-pk-differential into a load of 16 . The output is available as a differential signal
between SPK_R_RP and SPK_R_RN for the left channel; and between SPK_L_LP and
SPK_L_LN for the right channel. The output is capable of driving a speaker directly if its
impedance is at least 8 if only one channel is connected or an external regulator is used.
The gain of the output stage is controlled by a 3-bit programmable resistive divider, which
sets the gain in steps of approximately 3dB.
The multi-bit stream from the digital circuitry is low pass filtered by a second order
bi-quad filter with a pole at 20kHz. The signal is then amplified in the fully differential
output stage, which has a gain bandwidth of typically 1MHz.
4.3 PCM Interface
The audio PCM interface on the BTM8670 supports:
On-chip routing to Kalimba DSP
Continuous transmission and reception of PCM encoded audio data over
Bluetooth.
Processor overhead reduction through hardware support for continual
transmission and reception of PCM data
A bidirectional digital audio interface that routes directly into the baseband
layer of the firmware .It does not pass through the HCI protocol layer.
Hardware on the BTM8670 for sending data to and from a SCO connection.
Up to 3 SCO connections on the PCM interface at any one time.
PCM interface master, generating PCM_SYNC and PCM_CLK.
PCM interface slave, accepting externally generated PCM_SYNC and
PCM_CLK.
Various clock formats including:
Long Frame Sync
Short Frame Sync
GCI timing environments
13-bit or 16-bit linear, 8-bit u-law or A-law compander sample formats.
Receives and transmits on any selection of 3 the first 4 slots following
PCM_SYNC.
The PCM configuration options are enabled by setting the PS Key
PSKEY_PCM_CONFIG32.
19
4.4 Digital Audio Interface(I2S)
The digital audio interface supports the industry standard formats for I2S,left-justified or
right-justified. The interface shares the same pins as the PCM interface ,which means each
audio bus is mutually exclusive in its usage. Table as below lists these alternative
functions
4.5 RF Interface
The module integrates a balun filter. The user can connect a 50ohms antenna directly to the
RF port.
4.6 General Purpose Analog IO

The general purpose analog IOs can be configured as ADC inputs by software. Do not
connect them if not use.
4.7 General Purpose Digital IO

There are nine general purpose digital IOs defined in the module. All these GPIOs can be
configured by software to realize various functions, such as button controls, LED displays
or interrupt signals to host controller, etc. Do not connect them if not use.
4.8 Serial Interfaces

4.8.1 UART
This is a standard UART interface for communicating with other serial devices. The UART
interface provides a simple mechanism for communicating with other serial devices using
the RS232 protocol.
When the module is connected to another digital device, UART_RX and UART_TX
transfer data between the two devices. The remaining two signals, UART_CTS and
UART_RTS, can be used to implement RS232 hardware flow control where both are
active low indicators.
Note: The serial port interface(UART)can be used for system debugging. Don’t
support to use command set for profile function application by UART, such as
HFP/A2DP/AVRCP and so on. These profiles function application can be controlled
only by PIO, such as pairing/connect/answer/play/pause/next/previous function
application and so on.
20
4.8.2 I2C Interface

As this I2C interface is software-driven it is suited to relatively slow functions such as
driving a dot matrix LCD, keyboard scanner or EEPROM. If it is not used, then PIO[7:6]
are available to form a software-driven master I2C interface.
4.8.3 SPI
The synchronous serial port interface (SPI) can be used for system debugging. It can also be
used for in-system programming for the flash memory within the module. SPI interface
uses the SPI_MOSI, SPI_MISO, SPI_CSB and SPI_CLK pins. Testing points for the SPI
interface are reserved on board in case that the firmware shall be updated during
manufacture.
The module operates as a slave and thus SPI_MISO is an output of the module.
SPI_MISO is not in high-impedance state when SPI_CSB is pulled high. Instead, the
module outputs 0 if the processor is running and 1 if it is stopped. Thus the module
should NOT be connected in a multi-slave arrangement by simple parallel connection
of slave SPI_MISO lines.
Figure 6
21
( !"! " % ! # #
5.1 Absolute Maximum Ratings
Rating Min Max Unit
Storage temperature -40 105 °C
Supply Voltage
5V(USB VBUS) VCHG -0.4 5.75 V
3.3V SMPS_3V3 -0.4 3.60 V

VDD_USB
-0.4 3.60 V
LED[2:0] -0.4 4.40 V

Battery
SMP_VBAT -0.4 4.40 V
-0.4 5.75 V
-0.4 4.40 V
VREGENABLE
VDD_AUDIO_DRV -0.4 1.95 V
VDD_AUX_1V8 -0.4 1.95 V
1.8V VDD_PADS_1 -0.4 3.60 V
VDD_PADS_2 -0.4 3.60 V
VDD_PADS_3 -0.4 3.60 V
SMPS_1V8_SENSE -0.4 1.95 V
SMPS_1V35_SENSE -0.4 1.45 V
1.35V VDD_AUDIO -0.4 1.45 V
VREGIN_DIG -0.4 1.95 V
Other terminal voltages VSS - 0.4 VDD + 0.4 V
Table 1
22
5.2 Recommended Operating Conditions
Rating Mi Typ Max Uni
Operating temperature range -40 20 85 °C
Supply Voltage
VCHG 4.75 / 3.10 5.00 5.75 V
3.3V SMPS_3V3 3.10 3.30 3.60 V
VDD_USB 3.10 3.30 3.60 V
LED[2:0] 1.10 3.70 4.25 V

Battery
SMP_VBAT 2.50 3.70 4.25
VBAT_SENSE 0 3.70 4.25 V
VDD_AUDIO_DRV 1.70 1.80 1.95 V

V
VDD_AUX_1V8 1.70 1.80 1.95
V
1.8V VDD_PADS_1 1.70 1.80 3.60
V
VDD_PADS_2 1.70 1.80 3.60
VDD_PADS_3 1.70 1.80 3.60
V
SMPS_1V8_SENSE 1.70 1.80 1.95.
SMPS_1V35_SENSE 1.30 1.35 1.40 V

V
1.35V VDD_AUDIO 1.30 1.35 1.40
V
VREGIN_DIG 1.30 1.35 or 1.80 1.95
Table 2
23
5.3 Input/output Terminal Characteristics
5.3.1 Codec: Analogue to Digital Converter
Analogue to Digital Converter
Parameter Conditions Mi Typ Max Uni
Resolution - - - 16 Bits
Input Sample Rate,

- 8 - 48 kHz
F
Fsample
fin = 1kHz 8kHz - 93 - dB
B/W = 20Hz Fsample/2 16kHz - 92 - dB

SNR
(20kHz 32kHz - 92 - dB
max) 44.1kHz - 92 - dB
A-Weighted 48kHz - 92 - dB
fin = 1kHz Fsample
THD+N B/W = 20Hz Fsample/2 8kHz - 0.004 - %
(20kHz max) 48kHz - 0.008 - %
Digital gain Digital gain resolution = 1/32 -24 - 21.5 dB
Pre-amplifier setting = 0dB, 9dB, 21dB or

Analogue gain 30dB -3 - 42 dB
Analogue setting = -3dB to 12dB in 3dB
steps
Stereo separation(crosstalk) - -89 - dB
Table 3
24
5.3.2 Codec: Digital to Analogue Converter
Digital to Analogue Converter
Parameter Conditions Mi Typ Max Uni
Resolution - - - 16 Bits
Output Sample
- 8 - 96 kHz
Rate, Fsample
Fsample Load
fin = 1kHz
48kHz 100k - 96 - dB
SNR B/W = 20Hz 20kHz
48kHz 32 - 96 - dB
A-Weighted
48kHz 16 - 96 - dB
THD+N < 0.1%
Fsample Load
8kHz 100k - 0.002 - %
8kHz 32 - 0.002 - %
fin = 1kHz
THD+N 8kHz 16 - 0.003 - %
B/W = 20Hz 20kHz
48kHz 100k - 0.003 - %
0dBFS input
48kHz 32 - 0.003 - %
48kHz 16 - 0.004 - %
Digital Gain Digital Gain Resolution = 1/32 -24 - 21.5 dB
Analogue Gain Analogue Gain Resolution = 3dB -21 - 0 dB

Stereo separation(crosstalk) - -88- - dB
Table 4
25
) ! **! ! !*$! ! ! " +$ "!
The soldering profile depends on various parameters necessitating a set up for each
application. The data here is given only for guidance on solder reflow.
Figure 7
26
, $ - *
1. BLUETOOTH® Module: BTM8670
2. Assembly
3. Dimension
27

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http://www.buddies-tech.

com BTM8670 DATASHEET

Document Type: Bluetooth Module Datasheet

Document Version: V1.0

Copyright 2012 by Buddies Technology Limited. All Rights Reserved.

Date Version Description Author

2013-03-06 V1.0 First Release

1.1 BLOCK DIAGRAM ................................................................................................................................. 4

2. GENERAL SPECIFICATION ............................................................................................................ 7

5. ELECTRICAL CHARACTERISTIC ................................................................................................22

5.1 ABSOLUTE MAXIMUM RATING ........................................................................................................... 22

6. RECOMMENDED TEMPERATURE REFLOW PROFILE......................................................... 26

7. PACKAGING INFORMATION ....................................................................................................... 27

The detail information of BTM8670 Bluetooth® module is presented in this document

Small overall dimension(22mm x 15mm x 2mm )

Bluetooth Specification V4.0(Dual Mode)

Class1,Class 2and Class 3 support

Physical connection as SMD type

80MHz RISC MCU and 80MIPS Kalimba DSP

16Mb internal flash memory(64-bit wide,45ns);optional support for 64Mb of

Stereo codec with 2 channels ADC and up to 6 microphone inputs(include

Music Enhancements: SBC,MP3,AAC and AAC+, Fast stream

Audio Interfaces: I2S,PCM and SPDIF

Serial Interfaces: UART,USB 2.0,I2C and SPI

Support HSP, HFP, A2DP, AVRCP,PBAP,MAP,SPP,iAP profile

Multipoint support for HFP connection to 2 handsets for voice

Support for up to 6 capacitive touch sensor inputs

Built-in RF combo filter, Integrated 26M Crystal.

No radio signal interference, support for 802.11 co-existence

Smart remote controllers

Wired or wireless sound bars

Wired or wireless speakers and headphones

Wearable audio with sensors(health and well-being applications)

Frequency Band 2.402GHz~2.480GHz ISM Band

Baseband Crystal OSC 26MHz

Microphone : Input (Differential)

Profile HSP, HFP, A2DP, AVRCP,PBAP,MAP,SPP

Voice Processor 80MIPS Kalimba with cVc support

Humidity 10%~90% Non-Condensing

Environmental RoHS Compliant

Pin# Pin Name Pad Type Description

1 CAP_SENSE_5 Analogue input Capacitive touch sensor input

2 Analogue input Capacitive touch sensor input

4 GND Ground Digital Ground

Bi-directional with weak Synchronous data clock. Alternative function

Bi-directional with weak Synchronous data sync. Alternative function

12 SPI_MOSI Input with weak pull-down SPI data input

Bi-directional with weak UART request to send, active low.

19 GND Ground Digital Ground

26 GND Ground Digital Ground

USB data plus with selectable internal

42 GND Ground Digital Ground

Regulator enable input.

Can also be sensed as an input.

Regulator enable and multifunction button. A high

regulators, which can then be latched on

internally and the button used as a multifunction

44 VBAT Power supply Battery positive terminal