Module--3
Module--3
Electrochemistry - Corrosion
Electrochemistry
Deals with the production of electric current
through chemical reactions
or
Electrochemical cells:
• systems utilizing a redox reaction to produce or use electrical energy
Oxidation Number
Hypothetical charges called oxidation numbers to atoms with polar
covalent bonds.
The general idea is to assign the shared electrons in each bond to the
more electronegative element.
H O H
(+1) (−2) (+1)
N(−3) H3(+1)
C(+4) O3(−2)
• Oxidation numbers are assigned to each element in a chemical
reaction to help us learn which element is oxidized and which is
reduced.
The oxidizing agent that gains electrons is chlorine, and the reducing
agent that loses electrons is zinc.
Use Oxidation numbers for balancing reactions. The goal is to keep the
total number of electrons lost in the oxidation equal to the total number
gained in the reduction.
Assignment:
Balance the following reaction in both basic and acidic medium:
Fe2+ + Cr2O72- 🡪 Cr3+ + Fe3+
Redox Reactions
• The energy producing reactions in industry as well as in the body.
• The core of a redox reaction is the passing of one or more electrons
from one species to another.
Reduction Half-Reaction:
Cu2+(aq) + 2 e– → Cu(s)
The Cu2+ gains two electrons to form copper.
Redox Reactions
Zn(s) + Cu2+ (aq) → Cu(s) + Zn2+ (aq)
Electrochemical Cells
Zn(s) → Zn2+(aq) + 2 e–
Oxidation of metal releases metal ions into the solution, leaving behind the
electron at the surface of the metal electrode.
Cu2+(aq) + 2 e– → Cu(s)
Movement of metal ions from the solution to the electrode leads to accumulation
of positive charge at the surface of the electrode.
• Salt bridge:
completes circuit (provides charge balance). Serves as a bridge to
complete the electric circuit and maintain electro neutrality in the
electrolyte.
Cell Representation
• Phase boundaries are represented by “ | ”, and salt bridge is represented by “ | | ”.
Ox Red
Anode: Zn (s) → Zn2+ (aq) + 2e-
Cathode: Sn4+ (aq) + 2e- → Sn2+ (aq)
1 M HCl
Electrode Potential
Electrochemical Series
At Anode: M → Mn+ + n e–
At Cathode: Mn+ + n e– → M
Ox Red
• Cell voltage ΔV = VR – VL
• ΔG = – wnon PV = – n F E0
ΔG0 = – n F E0
• EMF depends on the concentrations of reactant and products in the cell
reaction.
Problem
M1 + M2n+ → M2 + M1n+
Ni|Ni2+ (0.01M)||Cu2+ (0.5M)|Cu
Write the electrode reactions and calculate the EMF of the cell at 298 K
(Std. reduction potentials of Ni and Cu are -0.25 and 0.34 V respectively.)
Solution:
Solution:
Solution:
Solution:
Corrosion
Patina
Corrosion
• Corrosion is the deterioration or destruction and consequent loss of a
solid metallic material due to chemical, electrochemical and other
reactions of the exposed material surface with the surrounding
environment.
• For example, when exposed to air, iron rusts, silver tarnishes, and
copper and brass acquire a bluish-green surface called a patina.
Corrosion
Why are metals not found in their free state?
OR Zinc
•Zinc blende
•Calamine
•ZnS
•ZnCO3
•Zincite •ZnO
E •Haematite •FeO3
METAL Iron
•Magnetite
•Iron Pyrites
•Fe3O4
•FeS2
•Spathic Iron Ore •FeCO3
•Malachite •CuCO3•Cu(OH)2
Copper •Chalcopyrite •CuFeS2
•Copper Glance •Cu2S
Why most metals undergo corrosion but not Au, Ag and Pt.
Consequences of Corrosion
Need:
1. An Anode (where oxidation is taking place)
2. A Cathode (where reduction is taking place)
3. Conductive electrolyte
4. Electrical contact between the Anode and Cathode
Basics of Corrosion
Corrosion is essentially the oxidation of metal
Different Theories of Corrosion
Corrosion
Chemical Electrochemical
or or
Dry Corrosion Galvanic
or
Wet Corrosion
55
Dry or Chemical corrosion
Dry corrosion is due to the attack of metal surfaces by the atmospheric
gases such as oxygen, hydrogen sulphide, sulphur dioxide, nitrogen,
inorganic liquids etc.
M2+
O2-
Mn+
O2-
MO (Metal oxide)
Oxidation Corrosion
The nature of oxide film formed on the metal surface plays in important role in
oxidation corrosion.
• Stable oxide layer: a protective coating and no further corrosion can occur.
Example: Al, Sn, Pb etc.
• Unstable oxide layer: mainly produced on the surface of noble metals, which
decomposes back to the metal and oxygen.
• Volatile oxide layer: The oxide layer volatilizes as soon as it is formed, leaving the
metal surface for further corrosion.
• Porous oxide layer: Metal oxides having pores and cracks allow penetration of
oxygen to the underlying metal, resulting in the complete conversion of metal into
its oxide.
Example: Rust
The ratio of the volume of the oxide formed to the volume of the metal
consumed is called “Pilling-Bedworth ratio”.
• In dry atmosphere, these gases react with metal and form corrosion
products which may be protective or non-protective.
Al
Ga
Gallium is corrosive
Liquid metal
Solid metal base to Aluminium
Wet or Electrochemical Corrosion
Wet corrosion occurs under the following conditions,
• When two dissimilar metals are in contact with each other in the
presence of an aqueous solution or moisture.
Zn undergoes corrosion
Electrolyte Electrolyte
Anodic
M 🡪 M2++ 2e-
At cathode: Reduction takes place using the electrons released at the anode.
Fe Fe2+ + 2e-
Electrochemical Corrosion
Differential Metallic or
Localized
Bimetallic
• Pitting
Galvanic
• Stress Corrosion
• Waterline Corrosion More negative electrode
potential act as an anode
• Concentration Corrosion
• Inter-granular Corrosion
• Fatigue Corrosion 67
Inter-granular corrosion
• Metals and alloys have micro-structures that are made up of grains, and
these grains have boundaries. Intergranular corrosion is an attack along or
near the boundaries of several grains while the rest of the grain remains
unaffected. This type of attack is caused by local differences in
composition.
Zn
Water rod
line More oxygenated part (Cathodic
part)
1/2O2 + H2O + 2e- 2OH-
Brine solution
Zn2
+
• Fretting corrosion occurs when metals slide over each other and cause
mechanical damage to one or both.
• During relative movement of metals, two process may occur, (i)
frictional heat is generated, which oxidize the metal to form oxide
films. (ii) removal of the protective films resulting in exposure of fresh
surface to corrosion attack.
• This can be avoided by using harder materials, minimizing friction by
lubrication or by proper designing of the equipment.
Corrosion Fatigue
Fe undergoes corrosion
Electrolyte
Rusting of a screw
in an door knob
Chemical vs Electrochemical corrosion
Reducing bacteria
Hydrogen Calcium
Sulphate Sulphite Sulphite
Anaerobic
On Iron in
Soil
Iron Sulphide
Corrosion pdt
Galvanic Series
Factors Affecting the Rate of Corrosion
80
Factors influencing corrosion
• Solution pH.
• Oxidizing agent.
• Temperature.
• Velocity.
• Surface Films.
• Other Factors.
Solution pH
• Metals such as iron dissolve rapidly in acidic solution. In the middle pH
range (4 to 10), the conc of H+ ions is low. Hence, the corrosion rate is
controlled by the rate of transport of oxygen.
• Noble metals are not affected by pH. E.g. gold and platinum.
⚫ Oxidizing agents such as oxygen react with hydrogen to form water. Once
hydrogen is removed, corrosion is accelerated. E.g. copper in NaCl
Inter-granular Corrosion
1.
Control
Materials selection
of corrosion
2. Alteration of the Environment
3. Proper Design of articles – Avoid Crevice and sharp bends
4. Cathodic protection methods:
a) Sacrificial Anodic Protection
b) Impressed Current Cathodic Protection method
5. Anodic protection method:
6. Corrosion Inhibitors:
a) Anodic inhibitors
b) Cathodic inhibitors
c) Vapour phase inhibitors
7. Protective coating:
a) Electroplating and electro-less plating
b) Physical vapour deposition
c) Chemical vapour deposition
Materials selection
Materials selection
– Lowering temperature –
• Since, there will not be any anodic area on the metal, corrosion will
not occur.
Sacrificial Zn or
Ship hull Mg
IMPRESSED CURRENT CATHODIC PROTECTION
• In this method, an impressed current is applied in the opposite direction to nullify
the corrosion current and convert the corroding metal from anode to cathode
• This can be done by connecting negative terminal of the battery to the metallic
structure to be protected
• Positive terminal of battery is connected to an inert anode. Inert anode used for
this purpose is graphite (or) platinised titanium.
Anodic Protection Method
• The principle involved in anodic protection is to force the metal to be
protected to behave like a “more anodic”.
• Used for metals which form protective layer, like Al, Cr, Ni etc.
• During the initial stage, the current increases indicating the dissolution of the
metal.
• When the current reaches a critical point, passivisation occur, i.e., the oxide
layers set in suitable oxidizing environment. The potential at the critical point
is called passivating potential.
• Above this passivating potential, the current flows decreases to a very small
value called passivating current, the minimum protective current density
required to maintain passivisation.
• At this stage, an increase in potential will not be corrode the metal since the
later is in highly passive state.
CORROSION INHIBITORS
A corrosion inhibitors is a substance which when added to in small
quantities to the aqueous corrosive environment effectively decreases the
rate of corrosion of the metal.
• They are absorbed on the metal surface forming a protective film or barrier
thereby reducing corrosion rate.
• This kind of corrosion rate is not fully reliable since certain areas left uncovered
by the film can produce severe corrosion.
Inhibitor
Iron metal rod immersed in
NiCrO4
corrosive medium
corrosive medium
Protective metal
chromate layer Ni2+ CrO42- + Fe3+ 🡪 Fe2(CrO4)3
Iron (III) Chromate
CATHODIC INHIBITORS
• In acidic solution, the main cathodic reaction is evolution of hydrogen.
2H+(aq) +2e- → H2 (g)
• This can be done by adding organic inhibitors like amines, pyridine, azoles, etc.
They absorb over the cathodic metal surface and act as a protective layer.
Cathode
H2
2e-
Anode
Fe2+
2H+
2H+ 2Cl-
• In a neutral solution, the cathodic reaction is,
• By eliminating the oxygen from the medium, the corrosion rate can be reduced.
• Salts of Zn, Mg, Ni are employed as they form insoluble metallic hydroxide
which forms impermeable self barriers.
VAPOUR PHASE INHIBITORS
Vapour phase inhibitors are organic substances which readily sublime
and form a protective layer on the metal/material surface.
100
Protective coatings
Thick film coating methods Thin film coating methods
Organic Coating
Sample (or) substrate Preparation
• Mechanical cleaning :– To remove loose scale and rust, using hammer,
wire-brushing, grinding and polishing.
• Sandblasting :– To clean large surface areas in order to produce enough roughness
for good adherence of protective coating, using sand with air stream at 25-100
atm.
• Solvent Cleaning :– To remove oil, grease, rust using organic solvents like alcohol,
xylene, toluene, hydrocarbons followed by cleaning hot water or steam.
• Alkali Cleaning : To remove old paints that are soluble in alkaline medium using
chemicals like NaOH, Na3PO4 etc. After cleaning, the metal is washed with 1%
chromic acid solution.
• Acid pickling and etching: Base metal is dipped inside acid solution at a higher
tempt for a long duration. Acids used are HCl, H2SO4, H3PO4, HNO3, under dilute
conditions.
Metallic coatings
Anodic coating – Galvanization:
Crack
Zn film
Crack
Sn film
1. Hot dipping
2. Metal cladding
3. Electroplating
4. Cementation
5. Vacuum metalizing
6. Metal spraying
Hot Dipping
• It is one of the common method of applying metallic coating on the surface of
base metals.
• Hot dipping is a process of coating the base metal by immersing it in the
molten liquid of the metal to be coated.
Examples: Galvanizing and Tinning
Galvanization process
NH4Cl flux to
avoid ZnO
formation
Hot air Galvanized
Steel sheet Steel Sheet
Pair of Hot
rollers
Annealing
chamber
250oC
Hot air
Hot rollers
Dil. H2SO4 at
60 – 90oC
Molten Sn Palm oil
Acid Pickling
• Used for the coating of steel, Cu and brass sheets that store food
stuffs.
Metal Cladding
• It is the process of sandwiching the base metal between two thin layers of
coating metal by hot-rolling the composite to produce a firm bonding.
• The coat metals are usually metals of least reactivity (Cu, Ni, Ag, Pt, Ti)
• The cladding layer should be very thin and its thickness is only 5% of the total
composite metal.
• Duraluminium (90% Al and Cu, Mg, Mn) sandwiched between Al sheets and
hot rolled to produce Alclad composite which is free from stress corrosion
109
Electroplating
Electroplating is the process in which the metal to be coated is deposited
on the base metal (substrate) by passing a direct current in the presence
of electrolytic solution containing the soluble salt of the metal to be
coated.
Objectives of electroplating:
(i) To increase the resistance to corrosion and chemical attack of the
plated metal.
(ii) To obtain a polished surface
(iii) To improve hardness and wear resistance
Uses :
(i) It is often used in electronic industries for making printed circuit
boards, edge connectors, semiconductor lead-out connection
(ii) It is also used in the manufacture of jewelry, refrigerator, electric iron
etc.
Electroplating of Cu
• The base metal to be plated is made cathode of an electrolyte cell, whereas the anode is
either made of the coating metal itself or an inert material of good electrical conductivity.
• If the anode is made of coating metal itself in the electrolytic cell, during electrolysis, the
concentration of electrolytic bath remains unaltered, since the metal ions deposited from
the bath on cathode are replenished continuously by the reaction of free anions with the
anode.
DC battery
Cu2+ SO42-
Cu deposited
surface
Process
Ionization reaction of electrolyte:
CuSO4 Cu2+ + SO42- ; H2SO4 2H+ + SO42-
On passing current:
Cu2+ + 2e- Cu (at cathode)
Cu + SO42- CuSO4 + 2e- (at anode)
Thin-Film Depositions
• PVD Coating (Physical Vapor Deposition)
• CVD Coating (Chemical Vapor Deposition)
bonding pad
Evaporation Techniques:
Substrate
TiN film
View Port
Heater
N2 / H 2 Suction valve
Ti Metal
2000oC
To vacuum pump
Chemical Vapour Deposition
• In typical CVD, the substrate is exposed to one or more volatile
precursors, which react and/or decompose on the substrate surface to
produce the desired deposit.
Polysilicon
Silicon dioxide
SiH4 + O2 → SiO2 + 2 H2
SiCl2H2 + 2 N2O → SiO2 + 2 N2 + 2 HCl
Si(OC2H5)4 → SiO2 + byproducts
Silicon nitride
• Organic coatings are easy to apply with the help of brushes, sprays, rollers,
dips, or by electrostatic means.