2SA2151A

Audio Amplification Transistor

Features and Benefits Description

▪ Small package (TO-3P) By adapting the Sanken unique wafer-thinner technique, these
▪ High power handling capacity, 160 W PNP power transistors achieve power-up by decreasing thermal
▪ Improved sound output by reduced on-chip impedance resistance, and provide higher voltage avalanche breakdown
▪ For professional audio (PA) applications, VCEO = –230 V rating. The high power-handling capacity of the TO-3P package
versions available allows a smaller footprint on the circuit board design. This
▪ Complementary to 2SC6011A series of transistors is very well suited to not only multichannel

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▪ Recommended output driver: 2SA1668A applications for AV (audio-visual) amplifiers and receivers,
but also parallel connection applications for PA (professional

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audio system) amplifiers.

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Applications include the following:

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Package: 3-Lead TO-3P ▪ Single transistors for audio amplifiers
▪ Home audio amplifiers

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▪ Professional audio amplifiers
▪ Automobile audio amplifiers
▪ Audio market
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▪ Single transistors for general purpose
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Not to scale
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Equivalent Circuit
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3
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B
1

2
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38101, Rev. 1
SANKEN ELECTRIC CO., LTD.
http://www.sanken-ele.co.jp/en/
2SA2151A Audio Amplification Transistor

SELECTION GUIDE
Part Number Type hFE Rating Packing
Range O: 50 to 100
2SA2151A* PNP Range P: 70 tp 140 30 pieces per tube
Range Y: 90 to 180
*Specify hFE range when ordering. If no hFE range is specified, order will be fulfilled with either or both range O and range Y,

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depending upon availability.

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ABSOLUTE MAXIMUM RATINGS at TA = 25°C

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Characteristic Symbol Rating Unit
Collector-Base Voltage VCBO –230 V

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Collector-Emitter Voltage VCEO –230 V
Emitter-Base Voltage VEBO –6 V
Collector Current
Base Current
Collector Power Dissipation
IC
IB
PC
–15
–4
160
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A
W
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Junction Temperature TJ 150 °C
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Storage Temperature Tstg –55 to150 °C

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ELECTRICAL CHARACTERISTICS at TA = 25°C

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Characteristic Symbol Test Conditions Min. Typ. Max. Unit

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Collector-Cutoff Current ICBO VCB = –230 V – – –10 μA

Emitter Cutoff Current IEBO VEB = –6 V – – –10 μA
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Collector-Emitter Voltage V(BR)CEO IC = –50 mA –230 – – V

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DC Current Transfer Ratio* hFE VCE = –4 V, IC = –3 A 50 – 180 –

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Collector-Emitter Saturation Voltage VCE(sat) IC = –5 A, IB = –0.5 A – – –0.5 V

Cutoff Frequency fT VCE = –12 V, IE = 0.5 A – 20 – MHz
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Output Capacitance COB VCB = –10 V, IE = 0 A, f = 1 MHz – 450 – pF

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*hFE rating: 50 to 100 (O brand on package), 70 to 140 (P), 90 to 180 (Y).

38101, Rev. 1 2
SANKEN ELECTRIC CO., LTD.
2SA2151A Audio Amplification Transistor

Performance Characteristics
15 3
1A mA mA A
700 500 300 m
A
200 m

10 2

–VCE(sat) (V)
100 mA
–IC (A)

IC vs. VCE VCE(sat) vs. IB

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50 mA
5 1

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–IB= 20 mA –IC= 10 A

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–IC= 5 A
0 0
0 1 2 3 4 0 0.5 1.0 1.5 2.0

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–VCE (V) –IB (A)
15
1000

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Typ.

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10
100

hFE
–IC (A)

IC vs. VBE hFE vs. IC

–VCE = 4 V Continuous –VCE = 4 V Continuous
°C
25°C

–30°C
125

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5 10
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0 1
0 0.5 1.0 1.5 2.0 0.01 0.1 1 10 100
–VBE (V) –IC (A)
10.00
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1000

125°C
m

25°C
100 1.00
hFE

RθJA (°C/W)
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hFE vs. IC –30°C

–VCE = 4 V Continuous RθJA vs. t
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10 0.10
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1 0.01
0.01 0.1 1 10 100 1 10 100 1000
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–IC (A) t (ms)

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38101, Rev. 1 3
SANKEN ELECTRIC CO., LTD.
2SA2151A Audio Amplification Transistor

Performance Characteristics, continued

Safe Operating Area

TA= 25°C, single pulse, no heatsink, natural cooling
100.0

10
m

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s
10
10.0

0m
DC

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–IC (A)

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1.0

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0.1

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0.01
1 10
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–VCE (V)
100 1000
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30 200

Typ.
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150
20 W
fT (MHz)

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In
fin
ite
PC (W)

fT vs. IE PC vs. TA 100 He

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–VCE = 12 V Continuous sink

10

50
m

0 3.5 Without Heatsink

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0.01 0.1 1 10 100 0

0 25 50 75 100 125 150
IE (A) TA (°C)
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38101, Rev. 1 4
SANKEN ELECTRIC CO., LTD.
2SA2151A Audio Amplification Transistor

Package Outline Drawing, TO-3P

15.8 ±0.2
15.6 ±0.3
14.0 ±0.3

2.0 ±0.2
5.0 ±0.2
6.0 ±0.2
1.8 ±0.3
5.0 MAX Exposed
13.6 ±0.2 heatsink pad

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9.6 ±0.2 2.1 MAX

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Branding

Ø3.2 ±0.1
Area
19.9 ±0.3

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XXXXXXXX

XXXXX XXXXX

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+0.2
1.7 –0.1
3.5

+0.2
2 –0.1

3
+0.2
+0.2
2 –0.1
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+0.2
20.0 MIN

–0.1
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+0.2
1.0 –0.1
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View A View B
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5.45 ±0.1
Terminal dimension at lead tip
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1 2 3
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0.7 MAX 0.7 MAX

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View A View B
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Gate burr: 0.3 mm (max.), mold flash may appear at opposite side Branding codes (exact appearance at manufacturer discretion):
Terminal core material: Cu 1st line, type: A2151A
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Terminal treatment: Ni plating and Pb-free solder dip 2nd line left, lot: YM
Leadform: 100 Where: Y is the last digit of the year of manufacture
Package: TO-3P (M100) M is the month (1 to 9, O, N, D)
Approximate weight: 6 g 2nd line right, subtype: H
Where: H is the hFE rating (O, P, or Y; for values see
Dimensions in millimeters footnote, Electrical Characteristics table)

Leadframe plating Pb-free. Device composition

includes high-temperature solder (Pb >85%),
which is exempted from the RoHS directive.

38101, Rev. 1 5
SANKEN ELECTRIC CO., LTD.
2SA2151A Audio Amplification Transistor

Because reliability can be affected adversely by improper use a flat-head machine screw because of the stress to the
storage environments and handling methods, please observe products. Self-tapping screws are not recommended. When
the following cautions. using self-tapping screws, the screw may enter the hole
Cautions for Storage diagonally, not vertically, depending on the conditions of hole
• Ensure that storage conditions comply with the standard before threading or the work situation. That may stress the
temperature (5°C to 35°C) and the standard relative products and may cause failures.
humidity (around 40% to 75%); avoid storage locations • Recommended screw torque: 0.686 to 0.882 N●m (7 to 9
that experience extreme changes in temperature or kgf●cm).
humidity. • Diameter of Heatsink Hole: < 4 mm. The deflection of the press mold

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when making the hole may cause the case material to crack at the joint
• Avoid locations where dust or harmful gases are present with the heatsink. Please pay special attention for this effect.
and avoid direct sunlight. • For tightening screws, if a tightening tool (such as a driver)

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• Reinspect for rust on leads and solderability of the hits the products, the package may crack, and internal
products that have been stored for a long time.

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stress fractures may occur, which shorten the lifetime of
Cautions for Testing and Handling the electrical elements and can cause catastrophic failure.

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When tests are carried out during inspection testing and Tightening with an air driver makes a substantial impact.
other standard test periods, protect the products from In addition, a screw torque higher than the set torque can

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power surges from the testing device, shorts between be applied and the package may be damaged. Therefore, an
the product pins, and wrong connections. Ensure all test electric driver is recommended.
parameters are within the ratings specified by Sanken for When the package is tightened at two or more places, first
the products.
Remarks About Using Silicone Grease with a Heatsink
• When silicone grease is used in mounting the products on
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with the specified torque. When using a power driver, torque
control is mandatory.
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a heatsink, it shall be applied evenly and thinly. If more Soldering
silicone grease than required is applied, it may produce • When soldering the products, please be sure to minimize
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excess stress. the working time, within the following limits:

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• Volatile-type silicone greases may crack after long periods 260±5°C 10±1 s (Flow, 2 times)
of time, resulting in reduced heat radiation effect. Silicone 350±5°C 3±0.5 s (Soldering iron, 1 time)
greases with low consistency (hard grease) may cause
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• Soldering should be at a distance of at least 1.5 mm from

cracks in the mold resin when screwing the products to a the body of the products.
heatsink.
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Electrostatic Discharge
Our recommended silicone greases for heat radiation • When handling the products, the operator must be
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purposes, which will not cause any adverse effect on the grounded. Grounded wrist straps worn should have at
product life, are indicated below: least 1 MΩ of resistance from the operator to ground to
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prevent shock hazard, and it should be placed near the

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Type Suppliers
operator.
G746 Shin-Etsu Chemical Co., Ltd.
• Workbenches where the products are handled should be
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YG6260 Momentive Performance Materials Inc.

grounded and be provided with conductive table and floor
SC102 Dow Corning Toray Co., Ltd. mats.
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• When using measuring equipment such as a curve tracer,

Cautions for Mounting to a Heatsink the equipment should be grounded.
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• When the flatness around the screw hole is insufficient, such • When soldering the products, the head of soldering irons
as when mounting the products to a heatsink that has an or the solder bath must be grounded in order to prevent
extruded (burred) screw hole, the products can be damaged, leak voltages generated by them from being applied to the
even with a lower than recommended screw torque. For products.
mounting the products, the mounting surface flatness should • The products should always be stored and transported in
be 0.05 mm or less. Sanken shipping containers or conductive containers, or
• Please select suitable screws for the product shape. Do not be wrapped in aluminum foil.

38101, Rev. 1 6
SANKEN ELECTRIC CO., LTD.
2SA2151A Audio Amplification Transistor

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• The contents in this document are subject to changes, for improvement and other purposes, without notice. Make sure that this is the
latest revision of the document before use.

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• Application and operation examples described in this document are quoted for the sole purpose of reference for the use of the prod-
ucts herein and Sanken can assume no responsibility for any infringement of industrial property rights, intellectual property rights or
any other rights of Sanken or any third party which may result from its use.
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• Although Sanken undertakes to enhance the quality and reliability of its products, the occurrence of failure and defect of semicon-
ductor products at a certain rate is inevitable. Users of Sanken products are requested to take, at their own risk, preventative measures
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including safety design of the equipment or systems against any possible injury, death, fires or damages to the society due to device
failure or malfunction.
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• Sanken products listed in this document are designed and intended for the use as components in general purpose electronic equip-
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ment or apparatus (home appliances, office equipment, telecommunication equipment, measuring equipment, etc.).
When considering the use of Sanken products in the applications where higher reliability is required (transportation equipment and
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its control systems, traffic signal control systems or equipment, fire/crime alarm systems, various safety devices, etc.), and whenever
long life expectancy is required even in general purpose electronic equipment or apparatus, please contact your nearest Sanken sales
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representative to discuss, prior to the use of the products herein.

The use of Sanken products without the written consent of Sanken in the applications where extremely high reliability is required
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(aerospace equipment, nuclear power control systems, life support systems, etc.) is strictly prohibited.
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• In the case that you use Sanken products or design your products by using Sanken products, the reliability largely depends on the
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degree of derating to be made to the rated values. Derating may be interpreted as a case that an operation range is set by derating the
load from each rated value or surge voltage or noise is considered for derating in order to assure or improve the reliability. In general,
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derating factors include electric stresses such as electric voltage, electric current, electric power etc., environmental stresses such
as ambient temperature, humidity etc. and thermal stress caused due to self-heating of semiconductor products. For these stresses,
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instantaneous values, maximum values and minimum values must be taken into consideration.
In addition, it should be noted that since power devices or IC's including power devices have large self-heating value, the degree of
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derating of junction temperature affects the reliability significantly.

• When using the products specified herein by either (i) combining other products or materials therewith or (ii) physically, chemically
or otherwise processing or treating the products, please duly consider all possible risks that may result from all such uses in advance
and proceed therewith at your own responsibility.
• Anti radioactive ray design is not considered for the products listed herein.
• Sanken assumes no responsibility for any troubles, such as dropping products caused during transportation out of Sanken's distribu-
tion network.
• The contents in this document must not be transcribed or copied without Sanken's written consent.

38101, Rev. 1 7
SANKEN ELECTRIC CO., LTD.