12-Bit, 1-GSPS Analog-to-Digital Converter: Features

ADS5400
www.ti.com SLAS611B OCT 2009 REVISED MARCH 2010
12-Bit, 1-GSPS Analog-to-Digital Converter

Check for Samples: ADS5400
1
FEATURES
1-GSPS Sample Rate 12-Bit Resolution 2.1 GHz Input Bandwidth SFDR = 66 dBc at 1.2 GHz SNR = 57.6 dBFS at 1.2 GHz 7 Clock Cycle Latency Interleave Friendly: Internal Adjustments for Gain, Phase, and Offset 1.5V to 2V Selectable Full-Scale Range LVDS-Compatible Outputs, 1 or 2 Bus Options Total Power Dissipation: 2.15 W

23
On-Chip Analog Buffer 100-Pin TQFP PowerPAD Package (16-mm 16-mm Footprint With Leads) Industrial Temperature Range = 40C to 85C
APPLICATIONS
Test and Measurement Instrumentation Ultra-Wide Band Software-Defined Radio Data Acquisition Power Amplifier Linearization Signal Intelligence and Jamming Radar
DESCRIPTION
The ADS5400 is a 12-bit, 1-GSPS analog-to-digital converter (ADC) that operates from both a 5-V supply and 3.3-V supply, while providing LVDS-compatible digital outputs. The analog input buffer isolates the internal switching of the track and hold from disturbing the signal source. The simple 3-stage pipeline provides extremely low latency for time critical applications. Designed for the conversion of signals up to 2 GHz of input frequency at 1 GSPS, the ADS5400 has outstanding low noise performance and spurious-free dynamic range over a large input frequency range. The ADS5400 is available in a TQFP-100 PowerPAD package. The combination of the PowerPAD package and moderate power consumption of the ADS5400 allows for operation without an external heatsink. The ADS5400 is built on Texas Instrument's complementary bipolar process (BiCom3) and is specified over the full industrial temperature range (40C to 85C).
BLOCK DIAGRAM
CLKINP CLKINN
ADS5400
CLOCK DIVIDE
RESETP (SYNCINP) RESETN (SYNCINN)
INP BUFFER INN 12-bit ADC (3 stage pipeline)
12
CLKOUTAP CLKOUTAN 12
BUS A
OUTA [0-11]P OUTA[0-11]N
VCM VREF SCLK SDIO SDO SDENB ENEXTREF ENPWD ENA1BUS
REFERENCE OVER RANGE DETECTOR, SYNC and DEMUX 12

BUS B
OVRAP (SYNCOUTAP ) OVRAN (SYNCOUTAN) CLKOUTBP CLKOUTBN PHASE ADJUST
GAIN ADJUST
CONTROL OFFSET ADJUST TEMP SENSOR
OUTB[0-11]P OUTB[0-11]N OVRBP (SYNCOUTBP) OVRBN (SYNCOUTBN)
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PowerPAD is a trademark of Texas Instruments. All other trademarks are the property of their respective owners.
Copyright 20092010, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.
ADS5400
SLAS611B OCT 2009 REVISED MARCH 2010 www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.
Table 1. PACKAGE/ORDERING INFORMATION

PRODUCT PACKAGE-LEAD HTQFP-100 PowerPAD PACKAGE DESIGNATOR PZP
(1)
SPECIFIED TEMPERATURE RANGE 40C to 85C
PACKAGE MARKING ADS5400I
ORDERING NUMBER ADS5400IPZP ADS5400IPZPR
TRANSPORT MEDIA, QUANTITY Tray, 90 Tape and reel, 1000
ADS5400 (1)
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com.
ABSOLUTE MAXIMUM RATINGS

over operating free-air temperature range (unless otherwise noted) (1)
VALUE AVDD5 to GND Supply voltage AVDD3 to GND DVDD3 to GND AINP, AINN to GND (2)
(2)
UNIT V V V V V V V V V V V V V
6 5 5 voltage difference between pin and ground voltage difference between pins, common mode at AVDD5/2
(2)
0.5 to 4.5 0.3 to (AVDD5 + 0.3) 1.25 to 3.75 1.75 to 3.25 0.5 to 4.5 1.1 to 3.9 2 to 3 0.3 to (AVDD5 + 0.3) 1.1 to 3.9 2 to 3 0.3 to (DVDD3 + 0.3)
short duration continuous AC signal continuous DC signal
AINP to AINN
CLKINP, CLKINN to GND CLKINP to CLKINN

(2)
voltage difference between pin and ground voltage difference between pins, common mode at AVDD5/2 continuous AC signal continuous DC signal
RESETP, RESETN to GND RESETP to RESETN

(2)
(2)
voltage difference between pin and ground voltage difference between pins continuous AC signal continuous DC signal
Data/OVR Outputs to GND
(2)
SDENB, SDIO, SCLK to GND (2) ENA1BUS, ENPWD, ENEXTREF to GND (2) Operating temperature range Maximum junction temperature, TJ Storage temperature range ESD, human-body model (HBM)
voltage difference between pin and ground
0.3 to (AVDD3 + 0.3) 0.3 to (AVDD5 + 0.3) 40 to 85 150 65 to 150 2
C C C kV
(1)
(2)
Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not implied. Kirkendall voidings and current density information for calculation of expected lifetime is available upon request. Valid when supplies are within recommended operating range.
THERMAL CHARACTERISTICS (1)

PARAMETER RqJA RqJP (1) (2) (3)
(2)
TEST CONDITIONS Soldered thermal pad, no airflow Soldered thermal pad, 150-LFM airflow Soldered thermal pad, 250-LFM airflow Bottom of package (thermal pad)
TYP 28.4 16.6 13.5 0.16
UNIT C/W C/W
(3)
Using 25 thermal pad vias (5 5 array). See PowerPAD Package in the Application Information section. RqJA is the thermal resistance from the junction to ambient. RqJP is the thermal resistance from the junction to the thermal pad.
2 Product Folder Link(s): ADS5400
ADS5400
RECOMMENDED OPERATING CONDITIONS

MIN SUPPLIES Analog supply voltage, AVDD5 Analog supply voltage, AVDD3 Digital supply voltage, DVDD3 ANALOG INPUT Full-scale differential input range VCM Input common mode Differential output load CLOCK INPUT CLK input sample rate (sine wave) Clock amplitude, differential Clock duty cycle TA Open free-air temperature 100 0.6 45% 40 50% 1000 1.5 55% 85 C MSPS Vpp DIGITAL OUTPUT 5 pF 1.52 AVDD5/2 2 Vpp V 4.75 3.135 3.135 5 3.3 3.3 5.25 3.465 3.465 V V V TYP MAX UNIT
ELECTRICAL CHARACTERISTICS
Typical values at TA = 25C, minimum and maximum values over full temperature range TMIN = 40C to TMAX = 85C, sampling rate = 1 GSPS, 50% clock duty cycle, AVDD5 = 5 V, AVDD3 = 3.3 V, DVDD3 = 3.3 V, 1-dBFS differential input, and 1.5 VPP differential clock (unless otherwise noted)
PARAMETER ANALOG INPUTS Full-scale differential input range VCM RIN CIN CMRR VREF Common-mode input Input resistance, differential (dc) Input capacitance Common-mode rejection ratio Reference voltage Resolution DNL INL Differential linearity error Integral nonlinearity error Offset error Offset temperature coefficient Gain error Gain temperature coefficient 5 0.03 No missing codes fIN = 125 MHz fIN = 125 MHz default is trimmed near 0mV 12 -1 -4 2.5 0.7 2 0 0.02 5 2 4.5 2.5 Estimated to ground from each AIN pin, excluding soldered package Common mode signal = 125 MHz Programmable Self-biased to AVDD5 / 2 85 1.52 AVDD5/2 100 0.8 40 2 115 2 VPP V pF dB V Bits LSB LSB mV mV/C %FS %FS/C TEST CONDITIONS/NOTES MIN TYP MAX UNIT
INTERNAL REFERENCE VOLTAGE DYNAMIC ACCURACY
ADS5400
ELECTRICAL CHARACTERISTICS (continued)

PARAMETER POWER SUPPLY (1) 5-V analog supply current (Bus A and B active) 5-V analog supply current (Bus A active) 3.3-V analog supply current (Bus A and B active) 3.3-V analog supply current (Bus A active) 3.3-V digital supply current (Bus A and B active) 3.3-V digital supply current (Bus A active) Total power dissipation (BUS A and B active) Total power dissipation (Bus A active) Total power dissipation Wake-up time from sleep PSRR Power-supply rejection ratio 1MHz injected to each supply, measured without external decoupling fIN = 125 MHz fIN = 600 MHz SNR Signal-to-noise ratio fIN = 850 MHz fIN = 1200 MHz fIN = 1700 MHz fIN = 125 MHz fIN = 600 MHz SFDR Spurious-free dynamic range fIN = 850 MHz fIN = 1200 MHz fIN = 1700 MHz fIN = 125 MHz fIN = 600 MHz HD2 Second harmonic fIN = 850 MHz fIN = 1200 MHz fIN = 1700 MHz fIN = 125 MHz fIN = 600 MHz HD3 Third harmonic fIN = 850 MHz fIN = 1200 MHz fIN = 1700 MHz 65 63 60 65 63 60 65 63 60 57 56.5 56 ENPWD = logic High (sleep enabled) fIN = 125 MHz, fS = 1 GSPS 220 225 219 226 136 71 2.28 2.15 13 1.8 50 234 241 234 242 154 81 2.45 2.25 50 mA mA mA mA mA mA W W mW ms dB TEST CONDITIONS/NOTES MIN TYP MAX UNIT
I(AVDD5)
I(AVDD3)
I(DVDD3)
DYNAMIC AC CHARACTERISTICS 58.5 58.2 57.8 57.6 55.7 75 72 71 66 56 78 78 71 66 56 80 72 72 70 65 dBc dBc dBc dBFS
(1) 4
All power values assume LVDS output current is set to 3.5mA.

Product Folder Link(s): ADS5400
ADS5400
ELECTRICAL CHARACTERISTICS (continued)

PARAMETER TEST CONDITIONS/NOTES fIN = 125 MHz fIN = 600 MHz Worst harmonic/spur (other than HD2 fIN = 850 MHz and HD3) fIN = 1200 MHz fIN = 1700 MHz fIN = 125 MHz fIN = 600 MHz THD Total Harmonic Distortion fIN = 850 MHz fIN = 1200 MHz fIN = 1700 MHz fIN = 125 MHz fIN = 600 MHz SINAD Signal-to-noise and distortion fIN = 850 MHz fIN = 1200 MHz fIN = 1700 MHz fIN1 = 247.5 MHz, fIN2 = 252.5 MHz, each tone at 7 dBFS fIN1 = 247.5 MHz, fIN2 = 252.5 MHz, each tone at 11 dBFS fIN1 = 1197.5 MHz, fIN2 = 1202.5 MHz, each tone at 7 dBFS fIN1 = 1197.5 MHz, fIN2 = 1202.5 MHz, each tone at 11 dBFS fIN = 125 MHz ENOB Effective number of bits (using SINAD in dBFS) fIN = 600 MHz fIN = 850 MHz RMS idle-channel noise Inputs tied to common-mode 9 8.84 8.67 56 55 54 63 62 59 MIN 65 63 60 TYP 80 72 72 66 64 71.7 67 66.5 65.1 55.7 58.5 58.2 57.8 57.5 54.2 74.6 80.4 dBFS 70 78.3 9.42 9.37 9.3 1.41 60.2 LSB rms dBFS Bits dBFS dBc dBc MAX UNIT
Two-tone SFDR
SWITCHING CHARACTERISTICS
Typical values at TA = 25C, Min and Max values over full temperature range TMIN = 40C to TMAX = 85C, sampling rate = 1 GSPS, 50% clock duty cycle, AVDD5 = 5 V, AVDD3 = 3.3 V, DVDD3 = 3.3 V, and 1.5 VPP differential clock (unless otherwise noted)
PARAMETER VOD VOC VID VIC RIN CIN Differential output voltage () Common mode output voltage Differential input voltage () Common mode input voltage Input resistance Input capacitance Each pin to ground TEST CONDITIONS/NOTES MIN 247 1.125 175 0.1 85 TYP 350 1.25 350 1.25 100 0.6 2.4 115 MAX 454 1.375 UNIT mV V mV V pF LVDS DIGITAL OUTPUTS (DATA, OVR/SYNCOUT, CLKOUT) Terminated 100 differential
LVDS DIGITAL INPUTS (RESET) Each input pin
ADS5400
SWITCHING CHARACTERISTICS (continued)

PARAMETER DIGITAL INPUTS (SCLK, SDIO, SDENB) VIH VIL IIH IIL CIN VIH VIL IIH IIL CIN VOH VOL RIN CIN High level input voltage Low level input voltage High level input current Low level input current Input capacitance High level input voltage Low level input voltage High level input current Low level input current Input capacitance High level output voltage Low level output voltage Differential input resistance Input capacitance IOH = 250 A IOL = 250 A CLKINP, CLKINN Estimated to ground from each CLKIN pin, excluding soldered packaged 130 160 0.8 2.8 0.4 190 ~40k internal pull-down 2 0 125 20 2 2 0 1 1 2 AVDD5 + 0.3 0.8 AVDD3 + 0.3 0.8 V V mA mA pF V V mA mA pF V V pF TEST CONDITIONS/NOTES MIN TYP MAX UNIT
DIGITAL INPUTS ( ENEXTREF, ENPWD, ENA1BUS)
DIGITAL OUTPUTS (SDIO, SDO)
CLOCK INPUTS
TIMING CHARACTERISTICS (1)

PARAMETER ta Aperture delay Aperture jitter, rms Uncertainty of sample point due to internal jitter sources Bus A, using Single Bus Mode Latency Bus A, using Dual Bus Mode Aligned Bus B, using Dual Bus Mode Aligned Bus A and B, using Dual Bus Mode Staggered LVDS OUTPUT TIMING (DATA, CLKOUT, OVR/SYNCOUT) tCLK tCLKH tCLKL tPD-CLKDIV2 tPD-CLKDIV4 tPD-ADATA tPD-BDATA (1) (2) Clock period Clock pulse duration, high Clock pulse duration, low Clock propagation delay Clock propagation delay Bus A data propagation delay Bus B data propagation delay Assuming worst case 45/55 duty cycle Assuming worst case 55/45 duty cycle CLKIN rising to CLKOUT rising in divide by 2 mode CLKIN rising to CLKOUT rising in divide by 4 mode
(2)
TEST CONDITIONS/NOTES
MIN
TYP 250 125 7 7.5 8.5 7.5
MAX
UNIT ps fs
Cycles
1 0.45 0.45 700 700 700 CLKIN falling to Data Output transition 700 1400 1200 1200 1400
10
ns ns ns
1700 1700 2100 2100
ps ps ps ps
Timing parameters are specified by design or characterization, but not production tested. LVDS output timing measured with a differential 100 load placed ~4 inches from the ADS5400. Measured differential load capacitance is 3.5pF. Measurement probes and other parasitics add ~1pF. Total approximate capacitive load is 4.5pF differential. All timing parameters are relative to the device pins, with the loading as stated.
ADS5400
TIMING CHARACTERISTICS (1) (continued)

PARAMETER tSU-SBM tH-SBM tSU-DBM tH-DBM tr tf tRSU tRH
(3)
TEST CONDITIONS/NOTES Data valid to CLKOUT edge, 50% CLKIN duty cycle CLKOUT edge to Data invalid, 50% CLKIN duty cycle Data valid to CLKOUT edge, 50% CLKIN duty cycle CLKOUT edge to Data invalid, 50% CLKIN duty cycle Mmeasured 20% to 80%
MIN 290p 410p 550p 1150p
TYP (tCLK/2) 185p (tCLK/2) 65p tCLK - 425p tCLK + 175p 400 400
MAX
UNIT s s s s ps ps ps ps
Setup time, single bus mode Hold time, single bus mode Setup time, dual bus mode Hold time, dual bus mode LVDS rise time LVDS output fall time RESET setup time RESET hold time RESET input capacitance RESET input current
LVDS INPUT TIMING (RESETIN) RESETP going HIGH to CLKINP going LOW CLKINP going LOW to RESETP going LOW Differential 300 300 1 1 SDENB falling to SCLK rising SCLK falling to SENDB rising SDIO valid to SCLK rising SCLK rising to SDIO transition 20 25 10 10 10 100 40 40 10pF 10pF Data output (SDO/SDIO) delay after SCLK falling, 10pF load 75 10 10
pF A ns ns ns ns MHz ns ns ns ns ns ns
SERIAL INTERFACE TIMING tS-SDENB tH-SDENB tS-SDIO tH-SDIO fSCLK tSCLK tSCLKH tSCLKL tr tf tDDATA (3) Setup time, serial enable Hold time, serial enable Setup time, SDIO Hold time, SDIO Frequency SCLK period Minimum SCLK high time Minimum SCLK low time Rise time Fall time Data output delay
In single bus mode at 1GSPS (1ns clock), the minimum output setup/hold times over process and temperature provide a minimum 700ps of data valid window, with 300ps of uncertainity.
ADS5400
INTERLEAVING ADJUSTMENTS
PARAMETER OFFSET ADJUSTMENTS Resolution LSB magnitude DNL INL Differential linearity error Integral Non-Linearity error Recommended Min Offset Setting Recommended Max Offset Setting GAIN ADJUSTMENTS Resolution LSB magnitude DNL INL Differential linearity error Integral Non-Linearity error Min Gain Setting Max Gain Setting INPUT CLOCK FINE PHASE ADJUSTMENT Resolution LSB magnitude DNL INL Differential linearity error Integral Non-Linearity error Max Fine Clock Skew setting INPUT CLOCK COARSE PHASE ADJUSTMENT Resolution LSB magnitude DNL INL Differential linearity error Integral Non-Linearity error Max Coarse Clock Skew setting -1 -1 73 5 2.4 1 5 Bits ps LSB LSB ps -2 -2.5 7.4 6 116 2.5 4 Bits fs LSB LBS ps -4 -8 12 120 -2, +1 -2, +4 1.52 2 4 8 Bits V LSB LSB VPP VPP from default offset value, to maintain AC performance at full scale range of 2VPP -2.5 -3 -8 8 9 120 2.5 3 Bits V LSB LSB mV mV TEST CONDITIONS MIN TYP MAX UNIT
ADS5400
Timing Diagrams
DIFFERENTIAL ANALOG INPUT (INP-INN) N Aperture delay
ta
Sample N and RESET pulse captured here
N+1 N+2
N output N+1 output
tCLKH tCLKL
CLKINP tRSU RESETP tRH

CLKOUT is reset after 3.5 CLKIN cycles (+ tPD-CLKDIV2 ) tPD-CLKDIV2
Phase 0: CLKOUT in desired CLKOUTAP state after power up Phase 1: misaligned by 1 clock after power up
tPD-ADATA tsu Latency of N and SYNCOUTA are matched to 7 CLKIN cycles th
DATA BUS A SYNCOUTA (OVRA pins)

If SYNC mode is enabled, the OVRA pins become SYNCOUTA pins
N-1
N+1
N+2
Sync
Propagation delays and setup/hold times not drawn to scale. RESET and SYNCOUT are optional. Any clock phase will work properly, but makes synchronization of data capture across multiple ADCs difficult without a known CLKOUT phase. RESET can be a single pulse (as shown), low-to-high step or repetitive pulse input signal. The frequency of repetitive RESET pulses should not exceed CLKIN/2, and should be an even divisor of CLKIN, in order to keep the CLKOUT phase the same with each RESET event. SYNCOUTA transitions with the same latency as the sample that is present when the RESET pulse is captured, shown here as sample N. Each RESET captured generates a SYNCOUT pulse, which behaves as a data bit. Bus B is not active in single bus mode.
Figure 1. Single Bus Mode
ADS5400
Timing Diagrams (continued)

Sample N and RESET pulse captured here N+1 N, N+1 output

CLKOUTAP CLKOUTBP
Phase 0: CLKOUT in desired state after power up Phase 1: misaligned by 1 clock after power up tPD-BDATA Latency of N and SYNCOUTB are matched to 8.5 CLKIN cycles
tsu th
N N+2
DATA BUS B SYNCOUTB (OVRB pins) DATA BUS A
The phase of data shown prior to reset matches CLKOUT in phase 0 If SYNC mode is enabled, the OVRB pins become SYNCOUTB pins
Sync
The phase of data shown prior to reset matches CLKOUT in phase 0
N+1
N+3
Latency of N+1 is 7.5 CLKIN cycles
tPD-ADATA
Propagation delays and setup/hold times not drawn to scale. RESET and SYNCOUT are optional. Any clock phase will work properly, but makes synchronization of data capture across multiple ADCs difficult without a known CLKOUT phase. RESET can be a single pulse (as shown), low-to-high step or repetitive pulse input signal. The frequency of repetitive RESET pulses should not exceed CLKIN/2, and should be an even divisor of CLKIN, in order to keep the CLKOUT phase the same with each RESET event. SYNCOUTB transitions with the same latency as the sample that is present when the RESET pulse is captured, shown here as sample N. Each RESET captured generates a SYNCOUT pulse, which behaves as a data bit.
Figure 2. Dual Bus Mode - Aligned, CLKOUT Divide By 2
ADS5400

Sample N and RESET pulse captured here N+1 N output N+1 output
CLKINP tRSU RESETP
tRH
Phase 0: CLKOUT in desired state after power up
CLKOUTAP
Phase 1: misaligned by 1 clock after power up
Phase 0: CLKOUT in desired state after power up
CLKOUTBP
Phase 1: misaligned by 1 clock after power up tPD-BDATA Latency of N and SYNCOUTB are matched to 7.5 CLKIN cycles
tsu th
N N+2
If SYNC mode is enabled, the OVRB pins become SYNCOUTB pins
Sync
N+1
N+3
tPD-ADATA
Figure 3. Dual Bus Mode - Staggered, CLKOUT Divide By 2
ADS5400

Sample N and RESET pulse captured here N+1 N, N+1 output
CLKINP tRSU RESETP

Phase 0: CLKOUT in desired state after power up Phase 1: misaligned by 1 clock after power up Phase 2: misaligned by 2 clocks after power up Phase 3: misaligned by 3 clocks after power up tPD-BDATA
Latency of N and SYNCOUTB are matched to 8.5 CLKIN cycles
tRH
CLKOUT is reset after 7.5 CLKIN cycles (+ tPD-CLKDIV4 )
tPD-CLKDIV4
CLKOUTAP CLKOUTBP
tsu th
The phase of data shown prior to reset matches CLKOUT in phase 0 If SYNC mode is enabled, the OVRB pins become SYNCOUTB pins
Sync
The phase of data shown prior to reset matches CLKOUT in phase 0 Latency of N+1 is 7.5 CLKIN cycles
N+1
tPD-ADATA
Figure 4. Dual Bus Mode - Aligned, CLKOUT Divide By 4
ADS5400

Sample N and RESET pulse captured here N+1 sampled N output N+1 output

CLKOUTA is reset after 7.5 CLKIN cycles (+ tPD-CLKDIV4 ) tPD-CLKDIV4
Phase 0: CLKOUT in desired state after power up Phase 1: misaligned by 1 clock after power up
CLKOUTAP
Phase 2: misaligned by 2 clocks after power up Phase 3: misaligned by 3 clocks after power up
CLKOUTB is reset after 6.5 CLKIN cycles (+ tPD-CLKDIV4 ) Phase 0: CLKOUT in desired state after power up Phase 1: misaligned by 1 clock after power up
tPD-CLKDIV4
CLKOUTBP
Phase 2: misaligned by 2 clocks after power up Phase 3: misaligned by 3 clocks after power up tPD-BDATA Latency of N and SYNCOUTB are matched to 7.5 CLKIN cycles
tsu th
The phase of data shown prior to reset matches CLKOUTB in phase 0 If SYNC mode is enabled, the OVRB pins become SYNCOUTB pins
N+2
Sync
The phase of data shown prior to reset matches CLKOUTA in phase 0
N+1
tPD-ADATA
Figure 5. Dual Bus Mode - Staggered, CLKOUT Divide By 4
ADS5400
PIN CONFIGURATION
AGND AVDD5 AGND AVDD5 AGND AINN AINP AGND AVDD5 AGND AVDD5 VCM AGND VREF AVDD5 AVDD3 AGND ENEXTREF ENPWD ENA1BUS SDO SDIO SCLK SDENB AVDD5
100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 80 79 78 77 76
AVDD5 AVDD3 AGND CLKINP CLKINN AGND AVDD3 AGND AVDD3 RESETN RESETP DB11N DB11P DB10N DB10P DB9N DB9P DB8N DB8P DB7N DB7P DB6N DB6P DVDD3 DGND
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25
75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51
ADS5400 (TOP VIEW)
Thermal Pad = AGND
DA11P DA11N DA10P DA10N DA9P DA9N DA8P DA8N DA7P DA7N DGND DVDD3 DA6P DA6N CLKOUTAP CLKOUTAN DA5P DA5N DA4P DA4N DA3P DA3N DA2P DA2N DGND
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
CLKOUTBN CLKOUTBP DB5N DB5P DB4N DB4P DB3N DB3P DB2N DB2P DB1N DB1P DVDD3 DGND DB0N DB0P OVRBN OVRBP OVRAN OVRAP DA0N DA0P DA1N DA1P DVDD3
50
ADS5400
Table 2. PIN FUNCTIONS

PIN NAME AINP, AINN AVDD5 AVDD3 DVDD3 AGND DGND CLKINP, CLKINN DA0N, DA0P NO. 94, 95 1, 76, 86, 90, 92, 97, 99 2, 7, 9, 85 24, 38, 50, 64 3, 6, 8, 84, 88, 91, 93, 96, 98, 100 25, 39, 51, 65 4, 5 46, 47 DESCRIPTION Analog differential input signal (positive, negative). Includes 100- differential load on-chip. Analog power supply (5 V) Analog power supply (3.3 V) Output driver power supply (3.3 V) Analog Ground Digital Ground Differential input clock (positive, negative). Includes 160- differential load on-chip. Bus A, LVDS digital output pair, least-significant bit (LSB) (P = positive output, N = negative output)
DA1NDA10N, 48-49, 52-59, 62-63, Bus A, LVDS digital output pairs (bits 1- 10) DA1P-DA10P 66-73 DA11N, DA11P CLKOUTAN, CLKOUTAP DB0N, DB0P DB1NDB10N, DB1P-DB10P DB11N, DB11P CLKOUTBN, CLKOUTBP OVRAN, OVRAP OVRBN, OVRBP RESETN, RESETP SCLK SDIO SDO SDENB VREF ENA1BUS ENPWD ENEXTREF VCM (1) 74, 75 60, 61 40, 41 14-23, 28-37 12, 13 26, 27 44, 45 42, 43 Bus A, LVDS digital output pair, most-significant bit (MSB) Bus A, Clock Output (Data ready), LVDS output pair Bus B, LVDS digital output pair, least-significant bit (LSB) (P = positive output, N = negative output) Bus B, LVDS digital output pairs (bits 1- 10) Bus B, LVDS digital output pair, most-significant bit (MSB) Bus B, Clock Output (Data ready), LVDS output pair Bus A, Overrange indicator LVDS output. A logic high signals an analog input in excess of the full-scale range. Becomes SYNCOUTA when SYNC mode is enabled in register 0x05. Bus B, Overrange indicator LVDS output. A logic high signals an analog input in excess of the full-scale range. Becomes SYNCOUTB when SYNC mode is enabled in register 0x05. Digital Reset Input, LVDS input pair. Inactive if logic low. When clocked in a high state, this is used for resetting the polarity of CLKOUT signal pair(s). If SYNC mode is enabled in register 0x05, this input also provides a SYNC time-stamp with the data sample present when RESET is clocked by the ADC, as well as CLKOUT polarity reset. Includes 100- differential load on-chip. Serial interface clock. Bi-directional serial interface data in 3-pin mode (default) for programming/reading internal registers. In 4-pin interface mode (reg 0x01), the SDIO pin is an input only. Uni-directional serial interface data in 4-pin mode (reg 0x01) provides internal register settings. The SDO pin is in high-impedance state in 3-pin interface mode (default). Active low serial data enable, always an input. Use to enable the serial interface. Internal 100k pull-up resistor. Reference voltage input (2V nominal). A 0.1mF capacitor to AGND is recommended, but not required. Enable single output bus mode (2-bus mode is default), active high. This pin is logic OR'd with addr 0x02h bit<0>. Enable Powerdown, active high. Places the converter into power-saving sleep mode when high. This pin is logic OR'd with addr 0x05h bit<6>. Enable External Reference Mode, active high. Device uses an external voltage reference when high. This pin is logic OR'd with addr 0x05h bit<2>. Analog input common mode voltage, Output (for DC-coupled applications, nominally 2.5V). A 0.1mF capacitor to AGND is recommended, but not required.
10, 11 78 79 80 77 87 81 (1) 82 (1) 83 (1) 89
This pin contains an internal ~40k pull-down resistor, to ground.
ADS5400
SERIAL INTERFACE
The serial port of the ADS5400 is a flexible serial interface which communicates with industry standard microprocessors and microcontrollers. The interface provides read/write access to all registers used to define the operating modes of ADS5400. It is compatible with most synchronous transfer formats and can be configured as a 3 or 4 pin interface in register 0x01h. In both configurations, SCLK is the serial interface input clock and SDENB is serial interface enable. For 3 pin configuration, SDIO is a bidirectional pin for both data in and data out. For 4 pin configuration, SDIO is data in only and SDO is data out only. Each read/write operation is framed by signal SDENB (Serial Data Enable Bar) asserted low for 2 to 5 bytes, depending on the data length to be transferred (14 bytes). The first frame byte is the instruction cycle which identifies the following data transfer cycle as read or write, how many bytes to transfer, and what address to transfer the data. Table 3 indicates the function of each bit in the instruction cycle and is followed by a detailed description of each bit. Frame bytes 2 to 5 comprise the data transfer cycle. Table 3. Instruction Byte of the Serial Interface
MSB Bit Description 7 R/W 6 N1 5 N0 4 A4 3 A3 2 A2 1 A1 LSB 0 A0
R/W [N1:N0]
Identifies the following data transfer cycle as a read or write operation. A high indicates a read operation from ADS5400 and a low indicates a write operation to the ADS5400. Identifies the number of data bytes to be transferred per Table 4 below. Data is transferred MSB first.
Table 4. Number of Transferred Bytes Within One Communication Frame

N1 0 0 1 1 N0 0 1 0 1 Description Transfer 1 Byte Transfer 2 Bytes Transfer 3 Bytes Transfer 4 Bytes
[A4:A0]
Identifies the address of the register to be accessed during the read or write operation. For multi-byte transfers, this address is the starting address. Note that the address is written to the ADS5400 MSB first and counts down for each byte.
Figure 6 shows the serial interface timing diagram for a ADS5400 write operation. SCLK is the serial interface clock input to ADS5400. Serial data enable SDENB is an active low input to ADS5400. SDIO is serial data in. Input data to ADS5400 is clocked on the rising edges of SCLK.
ADS5400
Instruction Cycle SDENB SCLK SDIO

r/w N1 N0 A4 A3 A2 A1 A0 D7
Data Transfer Cycle (s)
D6
D5
D4
D3
D2
D1
D0
tS (SDENB)
tSCLK
SDENB SCLK SDIO

th (SDIO) tS (SDIO) tSCLKL tSCLKH
Figure 6. Serial Interface Write Timing Diagram Figure 7 shows the serial interface timing diagram for a ADS5400 read operation. SCLK is the serial interface clock input to ADS5400. Serial data enable SDENB is an active low input to ADS5400. SDIO is serial data in during the instruction cycle. In 3 pin configuration, SDIO is data out from ADS5400 during the data transfer cycle(s), while SDO is in a high-impedance state. In 4 pin configuration, SDO is data out from ADS5400 during the data transfer cycle(s). At the end of the data transfer, SDO will output low on the final falling edge of SCLK until the rising edge of SDENB when it will 3-state.
Instruction Cycle SDENB SCLK SDIO SDO
r/w N1 N0 A3 A2 A1 A0 D7 D7 D6 D6 D5 D5 D4 D4 D3 D3 D2 D2 D1 D1 D0 D0 0 0
Data Transfer Cycle(s)
3 pin Configuration Output 4 pin Configuration Output SDENB SCLK SDIO SDO
Data n Data n-1 td (Data)
Figure 7. Serial Interface Read Timing Diagram
ADS5400
Serial Register Map

Table 5 gives a summary of all the modes that can be programmed through the serial interface. Table 5. Summary of Functions Supported by Serial Interface
REGISTER ADDRESS IN HEX Address 00 01 02 03 04 05 06 07 08 09 0A 0B-16 17 18 19 1A 1B 1C 1D 1E 1F Temp Sensor Powerdown BIT 7 BIT 6 BIT 5 REGISTER FUNCTIONS BIT 4 BIT 3 3 or 4-pin SPI BIT 2 BIT 1 BIT 0
Analog Gain Adjustment bits<11:4> continued...Analog Gain Adjustment bits<3:0> Coarse Clock Phase Adjustment bits<4:0> Fine Clock Phase Adjustment bits<5:0> continued...Analog Offset Control bits<7:0> 1 Sync Mode Data Format Reference Stagger Output 0 SPI Reset 0 0 Clock Divider 0 0 Single or Dual Bus Analog Offset bit<8>
Data output mode
LVDS termination 0000 0000
LVDS current
Force LVDS outputs
Die temperature bits<7:0> 000 0000 0000 0000 addresses not implemented, writes have no effect, reads return 0x00 DIE ID<7:0> DIE ID<15:8> DIE ID<23:16> DIE ID<31:24> DIE ID<39:32> DIE ID<47:40> DIE ID<55:48> DIE ID<63:56> Die revision indicator<7:0> Memory error
ADS5400
Description of Serial Registers

Each register function is explained in detail below. Table 6. Serial Register 0x00 (Read or Write)
Address (hex) 0x00 Defaults 0 0 0 BIT 7 BIT 6 BIT 5 BIT 4 0 BIT 3 0 BIT 2 0 BIT 1 0 BIT 0 0 Analog Gain Adjustment bits<11:4>
BIT <7:0>
Analog gain adjustment (most significant 8 bits of a 12 bit word) All 12-bits in this adjustment in address 0x00 and 0x01 set to 0000 0000 0000 = fullscale analog input 2.0VPP All 12-bits in this adjustment in address 0x00 and 0x01 set to 1111 1111 1111 = fullscale analog input 1.52VPP Step adjustment resolution is 120V. Can be used for one-time setting or continual calibration of analog signal path gain. Table 7. Serial Register 0x01 (Read or Write)
Address (hex) 0x01 Defaults
BIT 7 0
BIT 6 0
BIT 5 0
BIT 4 0
BIT 3 3 or 4-pin SPI 0
BIT 2 SPI Reset 0
BIT 1 0 0
BIT 0 0 0
Analog Gain Adjustment bits<3:0>
BIT <0:1> 0 1 BIT <2> 0 1 BIT <3> 0 1 BIT <7:4>
RESERVED set to 0 if writing this register do not set to 1 SPI Register Reset altered register settings are kept resets all SPI registers to defaults (self clearing) Set SPI mode to 3- or 4-pin 3-pin SPI (read/write on SDIO, SDO not used) 4-pin SPI (SDIO is write, SDO is read) Analog gain adjustment continued (least significant 4 bits of a 12-bit word) All 12-bits in this adjustment in address 0x00 and 0x01 set to 0000 0000 0000 = fullscale analog input 2VPP All 12-bits in this adjustment in address 0x00 and 0x01 set to 1111 1111 1111 = fullscale analog input 1.52VPP Step adjustment resolution is 120V. Can be used for one-time setting or continual calibration of analog signal path gain.
ADS5400
Table 8. Serial Register 0x02 (Read or Write)

Address (hex) 0x02 Defaults 0 BIT 7 BIT 6 BIT 5 BIT 4 BIT 3 BIT 2 0 0 0 BIT 1 Clock Divider 0 BIT 0 Single or Dual Bus 0
Coarse Clock Phase Adjustment bits<4:0> 0 0 0
BIT <0> 0 1 BIT <1> 0 1 BIT <2> 0 1 BIT <7:3>
Single or Dual Bus Output Selection dual bus output (A and B) single bus output (A) Output Clock Divider CLKOUT equals CLKIN divide by 4 (not available in single bus mode) CLKOUT equals CLKIN divide by 2 RESERVED set to 0 if writing this register do not set to 1 Input Clock Coarse Phase Adjustment Use as a coarse adjustment of input clock phase. The 5-bit adjustment provides a step size of ~2.4ps across a range from code 00000 = 0 ps to code 11111 = 73ps. Table 9. Serial Register 0x03 (Read or Write)
BIT 7
BIT 6
BIT 5
BIT 4
BIT 3
BIT 2
BIT 1 0
BIT 0 Analog Offset bit<8> factory set
Fine Clock Phase Adjustment bits<5:0> 0 0 0 0 0 0
BIT <0>
Analog Offset control (most significant bit of 9-bit word) All 9-bits in this adjustment in address 0x03 and 0x04 set to 0 0000 0000 = -30mV (TBD) All 9-bits in this adjustment in address 0x03 and 0x04 set to 1 1111 1111 = +30mV (TBD) Step adjustment resolution is 120V (or 1/4 LSB). Adjustments can be used for calibration of analog signal path offset (for instance offset error induced outside of the ADC) or to match multiple ADC offsets. The default setting for this register is factory set to provide ~0mV of ADC offset in the output codes and is unique for each device.
BIT <1> 0 1 BIT <7:2>
RESERVED set to 0 if writing this register do not set to 1 Fine Clock Phase Adjustment Use as a fine adjustment of the input clock phase. The 6-bit adjustment provides a step resolution of ~116fs across a range from code 000000 = 0ps to code 111111 = 7.4ps. Can be used in conjuction with Coarse Clock Phase Adjustment in address 0x02.
ADS5400
Table 10. Serial Register 0x04 (Read or Write)

Address (hex) 0x04 Defaults BIT 7 BIT 6 BIT 5 BIT 4 BIT 3 factory set BIT 2 BIT 1 BIT 0 Analog Offset Control bits<7:0>
BIT <7:0>
Analog Offset control continued (least significant bits of 9-bit word) All 9-bits in this adjustment in address 0x03 and 0x04 set to 0 0000 0000 = -30mV (TBD) All 9-bits in this adjustment in address 0x03 and 0x04 set to 1 1111 1111 = +30mV (TBD) Step adjustment resolution is 120uV (or 1/4 LSB). Adjustments can be used for calibration of analog signal path offset (for instance offset error induced outside of the ADC) or to match multiple ADC offsets. The default setting for this register is factory set to provide ~0mV of ADC offset in the output codes and is unique for each device. Performance of the ADC is not specified across the entire offset control range. Some performance degradation is expected as larger offsets are programmed. Table 11. Serial Register 0x05 (Read or Write)
BIT 7 Temp Sensor 0
BIT 6 Powerdown 0
BIT 5 reserved 1
BIT 4 Sync Mode 0
BIT 3 Data Format 0
BIT 2 Reference 0
BIT 1 Stagger Output 0
BIT 0 0 0
BIT <0> 0 1 BIT <1> 0 1 BIT <2> 0 1 BIT <3> 0 1 BIT <4> 0 1
RESERVED set to 0 if writing this register do not set to 1 Stagger Output Bus Output bus A and B aligned Output bus A and B staggered (see timing diagrams) Enable External Reference Enable internal reference Enable external reference Set Data Output Format Enable offset binary Enable two's complement Set Sync Mode Disable data synchronization mode Enable data synchronization mode When enabled, the OVR pin(s) are replaced with SYNC output signal(s). The SYNC output signal is time-aligned with the output data matching the corresponding input sample and RESET input pulse
BIT <5>
RESERVED
ADS5400
0 1 BIT <6> 0 1 BIT <7> 0 1 set to 1 if writing this register Powerdown device active device in low power mode (sleep mode) Temperature Sensor temperature sensor inactive temperature sensor active, independent of powerdown bit in Bit<6>, allows reading of temp sensor while the rest of the ADC is in sleep mode Table 12. Serial Register 0x06 (Read or Write)
Address (hex) 0x06 Defaults BIT 7 0 BIT 6 0 BIT 5 0 BIT 4 0 BIT 3 0 BIT 2 1 BIT 1 0 BIT 0 0 Data output mode LVDS termination LVDS current Force LVDS outputs
BIT <0:1> 00 and 01 10 11 BIT <3:2> 00 01 10 11 BIT <5:4> 00 and 01 10 11 BIT <7:6> 00 01 10 11
Force LVDS outputs normal operating mode (LVDS is outputting sampled data bits) forces the LVDS outputs to all logic zeros (data and clock out) - for level check forces the LVDS outputs to all logic ones (data and clock out) - for level check Set LVDS output current 2.5mA 3.5mA (default) 4.5mA 5.5mA Set Internal LVDS termination differential resistor (for LVDS outputs only) no internal termination internal 200 resistor selected internal 100 resistor selected Control Data Output Mode normal mode (LVDS is outputting sampled data bits) scrambled output mode (D11:D1 is XOR'd with D0) output data is replaced with PRBS test pattern (7-bit sequence) output data is replaced with toggling test pattern (all 1s, then all 0s, then all 1s, etc.....on all bits)
ADS5400
Table 13. Serial Register 0x08 (Read only)

Address (hex) 0x08 Defaults BIT 7 BIT 6 BIT 5 BIT 4 BIT 3 BIT 2 BIT 1 BIT 0 Die temperature bits<7:0> depends on reading from temperature sensor
BIT <7:0>
Die temperature readout if enabled in register 0x05. To obtain the die temperature in Celsius, convert the 8-bit word to decimal and subtract 78. <7:0> = 0x00 = 00000000, measured temperature is 0-78 = -78C <7:0> = 0x73 = 01110011, measured temperature is 115 - 78 = 37C <7:0> = 0xAF, measured temperature is 175 - 78 = 97C Table 14. Serial Register 0x09 (Read only)
BIT 7
BIT 6
BIT 5
BIT 4 000 0000 000 0000
BIT 3
BIT 2
BIT 1
BIT 0 Memory error 0
BIT <7:1>
RESERVED set to 0 if writing this register do not set to 1
BIT <0>
Memory Error Indicator Registers 0x00 through 0x07 have multiple redundancy. If any copy disagrees with the others, an error is flagged in this bit. This is for systems that require the highest level of assurance that the device remains programmed in the proper state and indication of an error if something changes unexpectedly. Table 15. Serial Register 0x0A (Read only)
Address (hex) 0x0A Defaults
BIT 7
BIT 6
BIT 5
BIT 4
BIT 3 0000 0000 0000 0000
BIT 2
BIT 1
BIT 0
BIT <7:0>
RESERVED set to 0 if writing this register do not set to 1
ADS5400
Table 16. Serial Register 0x17 through 0x1E (Read only)

Address (hex) 0x17 - 0x1E Defaults BIT 7 BIT 6 BIT 5 BIT 4 Die ID factory set BIT 3 BIT 2 BIT 1 BIT 0
BIT <7:0>
Die Identification Bits Each of these eight registers contains 8-bits of a 64-bit unique die identifier. Table 17. Serial Register 0x1F (Read only)
Address (hex) 0x1F Defaults
BIT 7
BIT 6
BIT 5
BIT 4
BIT 3 factory set
BIT 2
BIT 1
BIT 0
Die Revision Number
BIT <7:0>
Die revision Provides design revision information.
ADS5400
TYPICAL CHARACTERISTICS
Typical plots at TA = 25C, sampling rate = 1 GSPS, 50% clock duty cycle, AVDD5 = 5 V, AVDD3 = 3.3 V, DVDD3 = 3.3 V, and 1.5-VPP differential clock, (unless otherwise noted)
SPECTRAL PERFORMANCE FFT FOR 250-MHz INPUT SIGNAL 0 10 20 30 Amplitude dB 40 50 60 70 80 90 100 0 50 100 150 200 250 300 350 400 450 500 f Frequency MHz
G001
SPECTRAL PERFORMANCE FFT FOR 0.9-GHz INPUT SIGNAL 0 ENOB = 9.31 Bits SFDR = 71.5 dBc SINAD = 57.8 dBFS SNR = 58.04 dBFS THD = 69.8 dBc
ENOB = 9.45 Bits SFDR = 75.4 dBc SINAD = 58.7 dBFS SNR = 58.8 dBFS THD = 72.5 dBc Amplitude dB
10 20 30 40 50 60 70 80 90 100 0
50 100 150 200 250 300 350 400 450 500 f Frequency MHz
G002
Figure 8. SPECTRAL PERFORMANCE FFT FOR 1.3-GHz INPUT SIGNAL 0 10 20 30 Amplitude dB 40 50 60 70 80 90 100 0 50 100 150 200 250 300 350 400 450 500 f Frequency MHz
G003
Figure 9. SPECTRAL PERFORMANCE FFT FOR 1.7-GHz INPUT SIGNAL 0 ENOB = 8.6 Bits SFDR = 56.3 dBc SINAD = 53.6 dBFS SNR = 56.4 dBFS THD = 55.8 dBc
ENOB = 9.01 Bits SFDR = 63.5 dBc SINAD = 56 dBFS SNR = 57.1 dBFS THD = 61.7 dBc Amplitude dB
10 20 30 40 50 60 70 80 90 100 0
50 100 150 200 250 300 350 400 450 500 f Frequency MHz
G004
Figure 10.
Figure 11.
ADS5400
TYPICAL CHARACTERISTICS (continued)

DIFFERENTIAL NONLINEARITY 1.0 0.8 DNL Differential Nonlinearity LSB 0.6 0.4 0.2 0.0 0.2 0.4 0.6 0.8 1.0 0 512 1024 1536 2048 2560 3072 3584 4096 ADC Output Code
G005
INTEGRAL NONLINEARITY 2.0 AIN = 0.05 dBFS fIN = 100.33 MHz fS = 1 GSPS
INL Integral Nonlinearity LSB
AIN = 0.05 dBFS fIN = 100.33 MHz fS = 1 GSPS
1.5 1.0 0.5 0.0 0.5 1.0 1.5 2.0 0
512
1024 1536 2048 2560 3072 3584 4096 ADC Output Code
G006
Figure 12. AC PERFORMANCE vs INPUT AMPLITUDE (801.13-MHz INPUT SIGNAL) 100 SFDR (dBFS) 80 SNR (dBFS) Performance dB 60 AC Performance dB 80 100
Figure 13. AC PERFORMANCE vs INPUT AMPLITUDE (247.5-MHz AND 252.5-MHz TWO-TONE INPUT SIGNAL) 120 2F2F1 (dBFS) 2F1F2 (dBFS)
Worst Spur (dBFS)
40
SFDR (dBc) SNR (dBc)
60
20
40
Worst Spur (dBc)
fIN = 801.13 MHz fS = 1 GSPS 16k FFT 0

G007
20
fS = 1 GSPS fIN1 = 247.5 MHz fIN2 = 252.5 MHz 77 67 57 47 37 27 17 7

G019
20 90 80 70 60 50 40 30 20 10 Input Amplitude dBFS Figure 14.
0 87
Input Amplitude dBFS Figure 15.
ADS5400

AC PERFORMANCE vs INPUT AMPLITUDE (747.5-MHz AND 752.5-MHz TWO-TONE INPUT SIGNAL) 120 2F1F2 (dBFS) 2F2F1 (dBFS) 100 100 AC PERFORMANCE vs INPUT AMPLITUDE (1197.5-MHz AND 1202.5-MHz TWO-TONE INPUT SIGNAL) 120 2F2F1 (dBFS) 2F1F2 (dBFS)
AC Performance dB
80
AC Performance dB
Worst Spur (dBFS)
80
Worst Spur (dBFS)
60
60
40
Worst Spur (dBc)
40
Worst Spur (dBc)
20

G020
20

G021
0 87
0 87
Input Amplitude dBFS Figure 16. SFDR vs AVDD5 ACROSS TEMPERATURE 80 SFDR Spurious-Free Dynamic Range dBc
TA = 0C TA = 20C TA = 25C
Input Amplitude dBFS Figure 17. SNR vs AVDD5 ACROSS TEMPERATURE 60.0
TA = 20C TA = 40C TA = 0C
78
SNR Signal-to-Noise Ratio dBFS
59.5
59.0
TA = 25C TA = 55C
76
58.5
TA = 85C
74
TA = 40C
58.0
72
TA = 55C TA = 100C TA = 85C
57.5 fIN = 100.33 MHz fS = 1 GSPS
TA = 100C
fIN = 100.33 MHz fS = 1 GSPS 70 4.7 4.8 4.9 5.0 5.1 5.2 5.3 5.4 5.5
G008
57.0 4.7
4.8
4.9
5.0
5.1
5.2
5.3
5.4
5.5
G009
AVDD Supply Voltage V Figure 18.
AVDD Supply Voltage V Figure 19.
ADS5400

SFDR vs AVDD3 ACROSS TEMPERATURE 80 SFDR Spurious-Free Dynamic Range dBc
TA = 40C TA = 20C TA = 25C
SNR vs AVDD3 ACROSS TEMPERATURE 60

TA = 0C TA = 25C
78
TA = 0C
59
TA = 55C
76
58
TA = 20C TA = 100C
TA = 85C
74
TA = 55C
57
TA = 40C
72
TA = 100C
TA = 85C
fIN = 100.33 MHz fS = 1 GSPS 70 3.0 3.1 3.2 3.3 3.4 3.5 3.6
G010
fIN = 100.33 MHz fS = 1 GSPS 56 3.0 3.1 3.2 3.3 3.4 3.5 3.6
G011
AVDD Supply Voltage V Figure 20. SFDR vs DVDD3 ACROSS TEMPERATURE 80 SFDR Spurious-Free Dynamic Range dBc
TA = 20C TA = 25C TA = 40C
AVDD Supply Voltage V Figure 21. SNR vs DVDD3 ACROSS TEMPERATURE 60.0
TA = 40C TA = 20C TA = 0C
78
TA = 0C
59.5
TA = 25C TA = 55C
59.0
76
58.5
TA = 85C
74
TA = 55C
58.0
72
TA = 85C
TA = 100C
57.5
TA = 100C
fIN = 100.33 MHz fS = 1 GSPS 70 3.0 3.1 3.2 3.3 3.4 3.5 3.6
G012
fIN = 100.33 MHz fS = 1 GSPS 57.0 3.0 3.1 3.2 3.3 3.4 3.5 3.6
G013
DVDD Supply Voltage V Figure 22.
DVDD Supply Voltage V Figure 23.
ADS5400

SNR vs INPUT FREQUENCY AND SAMPLING FREQUENCY
1000 59 900 57 58 56
fS Sampling Frequency MHz
800 700 59 600 57 500 400 59 300 200 10 58 57 56 55 58
56
200
400
600
800
1000
1200
1400
1600
1800
2000 2100
fIN Input Frequency MHz 52 53 54 55 56 57 58 59 60
SNR dBFS
M0048-30
Figure 24.
ADS5400

SFDR vs INPUT FREQUENCY AND SAMPLING FREQUENCY
1000 70 900 75 65 60 55
fS Sampling Frequency MHz
800 700 75 600 500 400 75 300 200 10 70 65 60 55 70 65 60 55
200
400
600
800
1000
1200
1400
1600
1800
2000 2100
fIN Input Frequency MHz 50 55 60 65 70 75 80
SFDR dBc
M0049-30
Figure 25. NORMALIZED GAIN RESPONSE vs INPUT FREQUENCY 2 0 Normalized Gain Response dB 2 4 6 8 10 12 10M
fS = 1 GSPS Measurement every 50 MHz 100M Figure 26. 1G 5G

G018
fIN Input Frequency Hz
ADS5400
APPLICATION INFORMATION Theory of Operation

The ADS5400 is a 12-bit, 1-GSPS, monolithic pipeline ADC. Its bipolar transistor analog core operates from 5-V and 3.3-V supplies, while the output uses a 3.3-V supply to provide LVDS-compatible digital outputs. The conversion process is initiated by the falling edge of the external input clock. At the sampling instant, the differential input signal is captured by the input track-and-hold (T&H), and the input sample is sequentially converted by a series of lower resolution stages, with the outputs combined in a digital correction logic block. Both the rising and the falling clock edges are used to propagate the sample through the pipeline every half clock cycle. This process results in a data latency of 7 - 8.5 clock cycles (output mode dependent), after which the output data is available as a 12-bit parallel word, coded in offset binary or two's complement format. The user can select to accept the data at the full sample rate using one bus (bus A, latency 7 cycles), or demultiplex the data into two buses (bus A and B, latency 7.5 or 8.5 cycles) at half rate. A serial peripheral interface (SPI) is provided for adjusting operational modes, as well as for calibrations of analog gain, analog offset and clock phase for inter-leaving multiple ADS5400. Die temperature readout using the SPI is provided. SYNC and RESET modes exist for synchronizing output data across multiple ADS5400.
Input Configuration
The analog input for the ADS5400 consists of an analog pseudo-differential buffer followed by a bipolar transistor track-and-hold (see Figure 27). The integrated analog buffer isolates the source driving the input of the ADC from sampling glitches on the T&H and allows for the integration of a 100- differential input resistor. The input common mode is set internally through a 500- resistor connected from half of the AVDD5 supply voltage to each of the inputs. The parasitic package capacitance shown is with the package unsoldered. Once soldered, depending on the board characteristics, one can expect another ~1pF at the analog input pins, which is board dependent.
ADS5400 ~5.25 nH Bond Wire AINP ~0.3 pF Package Analog Inputs ~0.2 pF Bondpad 500 W AGND ~5.25 nH Bond Wire AINN ~0.3 pF Package ~0.2 pF Bondpad Bipolar Transistor Buffer AVDD5 112 W 500 W 2.5 V 0.3 pF 0.3 pF AVDD5
Bipolar Transistor Buffer
AGND
Sample and Hold st 1 Stage Of Pipeline
AGND
Figure 27. Analog Input Equivalent Circuit For a full-scale differential input, each of the differential lines of the input signal swing symmetrically between 2.5 V + 0.5 V and 2.5 V 0.5 V. This means that each input has a maximum signal swing of 1 VPP for a total differential input signal swing of 2 VPP. The maximum fullscale range can be programmed from 1.5-2Vpp using the SPI. The maximum swing is determined by the internal reference voltage generator and the fullscale range set using the SPI, eliminating the need for any external circuitry for this purpose. The analog gain adjustment has a resolution of 12-bits across the 1.5-2VPP range, providing for fine calibration of analog gain mismatches across multiple ADS5400 signal chains, primarily for interleaving.
ADS5400
The ADS5400 obtains optimum performance when the analog inputs are driven differentially. The circuit in Figure 28 shows one possible configuration using an RF transformer. Datasheet performance, especially at >1GHz input frequency, can only be obtained with a carefully designed differential drive path to the ADC.
R0 50 W Z0 50 W AIN R 100 W
AC Signal Source
ADS5400
1:1
AIN
Figure 28. Converting a Single-Ended Input to a Differential Signal Using an RF Transformer
Voltage Reference
The 2V voltage reference is provided internal to the ADS5400. A VCM (voltage common mode) pin is provided as an output for use in dc-coupled applications, equal to the AVDD5 supply divided by 2. This provides the analog input common mode voltage to a driving circuit so that the common mode is setup properly. Some systems may prefer the use of an external voltage reference. This mode can be enabled by pulling the ENEXTREF pin high. In this mode, an external reference can be driven onto the VREF pin, which is normally expecting 2V.
Analog Input Over-Range Recovery Error

An over-range condition occurs if the analog input voltage exceeds the full-scale range of the converter (0dBFS). To test recovery from an over-range, the ADC analog input is injected with a sinusoidal input frequency exactly at CLKIN/4 (a four-point sinusoid at the digital outputs). The four sample points of each period occur at the top, mid-scale, bottom and mid-scale of the sinusoid (clipped by the ADC when over-ranged to all 0s or all 1s). Once the amplitude exceeds 0dBFS, the top and bottom of the sinusoidal input becomes out of range, while the mid-scale point is always in-range and measureable with ADC output codes. The graph in Figure 29 indicates the amount of error from the expected mid-scale value of 2048 that occurs after negative over-range (bottom of sinusoid) and positive over-range (top of sinusoid). This equates to the amount of error in a valid sample 1 clock cycle after an over-range occurs, as a function of input amplitude.
25 20 15 Mid-Scale Code Error % 10 5 0 5 10 15 20 25 1 0 1
After Positive Over-range 400MSPS (2.5ns) After Negative Over-range 1GSPS (1ns) After Negative Over-range 200MSPS (5ns) After Positive Over-range 200MSPS (5ns) After Negative Over-range 400MSPS (2.5ns) After Positive Over-range 1GSPS (1ns)
6
G023
Analog Input Amplitude dBFS
Figure 29. Recovery Error 1 Clock Cycle After Over-Range vs Input Amplitude
ADS5400
Clock Inputs
The ADS5400 clock input can be driven with either a differential clock signal or a single-ended clock input. The equivalent clock input circuit can be seen in Figure 30. In low-input-frequency applications, where jitter may not be a big concern, the use of a single-ended clock (as shown in Figure 31) could save cost and board space without much performance tradeoff. When clocked with this configuration, it is best to connect CLK to ground with a 0.01-mF capacitor, while CLK is ac-coupled with a 0.01-mF capacitor to the clock source, as shown in Figure 31.
ADS5400 AVDD5 ~5.25 nH Bond Wire CLKINP ~0.35 pF Package ~0.2 pF Bondpad 400 W 10 W
0.25 pF AVDD5V/2 Internal Clock Buffer GND
GND ~5.25 nH Bond Wire CLKINN ~0.35 pF Package ~0.2 pF Bondpad
200 W AVDD5
0.25 pF 400 W 10 W
GND
Figure 30. Clock Input Circuit

Square Wave or Sine Wave 0.01 mF ADS5400 CLK 0.01 mF
CLK
Figure 31. Single-Ended Clock
ADS5400
80 SFDR Spurious-Free Dynamic Range dBc fIN = 10.05 MHz 75 SNR Signal-to-Noise Ratio dBc
65 fIN = 10.05 MHz 60 fIN = 100.33 MHz
70 65 60 fIN = 1498.5 MHz 55 fIN = 801.13 MHz 50 45 fS = 1 GSPS 40 0.0 0.2 0.4 0.6 0.8 1.0 1.2
G014
fIN = 601.13 MHz
55
fIN = 1498.5 MHz fIN = 801.13 MHz
fIN = 100.33 MHz
50 fIN = 601.13 MHz 45
fS = 1 GSPS 40 0.0 0.2 0.4 0.6 0.8 1.0 1.2

G015
Clock Amplitude VPP
Clock Amplitude VPP
Figure 32. ADS5400 SFDR vs Differential Clock Level
Figure 33. ADS5400 SNR vs Differential Clock Level
The characterization of the ADS5400 is typically performed with a 1.5 VPP differential clock, but the ADC performs well with a differential clock amplitude down to ~400mVPP (200mV swing on both CLK and CLK), as shown in Figure 32 and Figure 33. For jitter-sensitive applications, the use of a differential clock has some advantages at the system level and is strongly recommended. The differential clock allows for common-mode noise rejection at the printed circuit board (PCB) level. With a differential clock, the signal-to-noise ratio of the ADC is better for jitter-sensitive, high-frequency applications because the board level clock jitter is superior. Larger clock amplitude levels are recommended for high analog input frequencies or slow clock frequencies. At high analog input frequencies, the sampling process is sensitive to jitter. At slow clock frequencies, a small amplitude sinusoidal clock has a lower slew rate and can create jitter-related SNR degradation due to the uncertainty in the sampling point associated with a slow slew rate. Figure 34 demonstrates a recommended method for converting a single-ended clock source into a differential clock; it is similar to the configuration found on the evaluation board and was used for much of the characterization. See also Clocking High Speed Data Converters (SLYT075) for more details.
0.1 mF Clock Source CLK
ADS5400 CLK
Figure 34. Differential Clock The common-mode voltage of the clock inputs is set internally to 2.5 V using internal 400 resistors (see Figure 30). It is recommended to use ac coupling in the clock path, but if this scheme is not possible, the ADS5400 features good tolerance to clock common-mode variation, as shown in Figure 35 and Figure 36. The internal ADC core uses both edges of the clock for the conversion process. Ideally, a 50% duty-cycle clock signal should be provided.
ADS5400
80 SFDR Spurious-Free Dynamic Range dBc fIN = 100.33 MHz 75 SNR Signal-to-Noise Ratio dBFS fIN = 901.13 MHz
65 fIN = 601.13 MHz 60
fIN = 100.33 MHz
70 65 60 55 50 45 fS = 1 GSPS 40 0.0 0.5 1.0 fIN = 601.13 MHz fIN = 1498.5 MHz
55
fIN = 1498.5 MHz fIN = 901.13 MHz
50
45
1.5
2.0
2.5
3.0
3.5
G016
fS = 1 GSPS 40 0.0 0.5 1.0
1.5
2.0
2.5
3.0
3.5
G017
Clock Common Mode V
Clock Common Mode V
Figure 35. ADS5400 SFDR vs Clock Common Mode
Figure 36. ADS5400 SNR vs Clock Common Mode
To understand how to determine the required clock jitter, an example is useful. The ADS5400 is capable of achieving 58.7 dBFS SNR at 850 MHz of analog input frequency. To achieve SNR at 850 MHz, the external clock source rms jitter must be at least 210fs when combined with the 125fs of internal aperture jitter in order for the total rms jitter to be 244fs. A summary of maximum recommended rms clock jitter as a function of analog input frequency is provided in Table 18 (using 125fs of internal aperture jitter). The equations used to create the table are also presented. Table 18. Recommended RMS Clock Jitter
INPUT FREQUENCY (MHz) 125 600 850 1200 1700 MEASURED SNR (dBc) 58.1 57.8 57.7 56.6 54.7 TOTAL JITTER (fs rms) 1585 318 244 196 172 MAXIMUM EXT CLOCK JITTER (fs rms) 1580 342 210 151 119
Equation 1 and Equation 2 are used to estimate the required clock source jitter. SNR (dBc) = -20 x LOG10 (2 x p x fIN x jTOTAL)
jTOTAL = (jADC + jCLOCK )
2 2 1/2
(1) (2)
where: jTOTAL = the rms summation of the clock and ADC aperture jitter; jADC = the ADC internal aperture jitter which is located in the data sheet; jCLOCK = the rms jitter of the clock at the clock input pins to the ADC; and fIN = the analog input frequency.
ADS5400
Notice that the SNR is a strong function of the analog input frequency, not the clock frequency. The slope of the clock source edges can have a mild impact on SNR as well and is not taken into account for these estimates. For this reason, maximizing clock source amplitudes at the ADC clock inputs is recommended, though not required (faster slope is desirable for jitter-related SNR). For more information on clocking high-speed ADCs, see Application Note SLWA034, Implementing a CDC7005 Low Jitter Clock Solution For High-Speed, High-IF ADC Devices. Recommended clock distribution chips (CDCs) are the TI CDC7005 and CDCM7005. Depending on the jitter requirements, a band pass filter (BPF) is sometimes required between the CDC and the ADC. If the insertion loss of the BPF causes the clock amplitude to be too low for the ADC, or the clock source amplitude is too low to begin with, an inexpensive amplifier can be placed between the CDC and the BPF. Figure 37 represents a scenario where an LVPECL output is used from a TI CDCM7005 with the clock signal path optimized for maximum amplitude and minimum jitter. The jitter of this setup is difficult to estimate and requires a careful phase noise analysis of the clock path. The BPF (and possibly a low-cost amplifier because of insertion loss in the BPF) can improve the jitter between the CDC and ADC when the jitter provided by the CDC is still not adequate. The total jitter at the CDCM7005 output depends heavily on the phase noise of the VCXO selected. If it is determined that the jitter from the CDCM7005 with a VCXO is sufficient without further conditioning, it is possible to clock the ADS5400 directly from the CDCM7005 using differential LVPECL outputs (see the CDCM7005 data sheet for the exact schematic). A careful analysis of the required jitter and of the components involved is recommended before determining the proper approach.
Low Jitter Clock Distribution Board Master Reference Clock ( High or Low Jitter) 10 MHz REF LVPECL 1000 MHz AMP SAW XFMR
AMP and /or BPF optional , depending on jitter requirements
CLKIN CLKIN ADC
1000 MHz (To Transmit DAC ) 125 MHz (To DSP ) LVPECL or LVCMOS 250 MHz (To FPGA ) CDC (Clock Distribution Chip) Ex : TI CDCM7005 To Other TI ADS5400
Low Jitter Oscillator 1000 MHz
VCO
This is a general block diagram example: Consult the datasheet of the CDCM7005 for proper schematic and for specifications regarding allowable input and output frequency and amplitude ranges .
Figure 37. Clock Source Diagram
ADS5400
Digital Outputs
Output Bus and Clock Options The ADS5400 has two buses, A and B. Using register 0x02, a single or dual bus output can be selected. In single-bus mode, bus A is used at the full clock rate, while in two-bus mode, data is multiplexed at half the clock rate on A and B. While in single bus mode, CLKOUTA will be at frequency CLKIN/2 and a DDR interface is achieved. In two-bus mode, CLKOUTA/CLKOUTB can be either at frequency CLKIN/2 or CLKIN/4, providing options for an SDR or DDR interface. The ADC provides 12 LVDS-compatible data outputs (D11 to D0; D11 is the MSB and D0 is the LSB), a data-ready signal (CLKOUT), and an over-range indicator (OVR) on each bus. It is recommended to use the CLKOUT signal to capture the output data of the ADS5400. Both two's complement and offset binary are available output formats, in register 0x05. The capacitive loading on the digital outputs should be minimized. Higher capacitance shortens the data-valid timing window. The values given for timing were obtained with an estimated 3.5-pF of differential parasitic board capacitance on each LVDS pair. Reset and Synchronization Referencing the timing diagrams starting in Figure 1, the polarity of CLKOUT with respect to the sample N data output transition is undetermined because of the unknown startup logic level of the clock divider that generates the CLKOUT signal, whether in frequency CLKIN/2 or CLKIN/4 mode. The polarity of CLKOUT could invert when power is cycled off/on. If a defined CLKOUT polarity is required, the RESET input pins are used to reset the clock divider to a known state after power on with a reset pulse. A RESET is not commonly required when using only one ADS5400 because a one sample uncertainty at startup is not usually a problem. NOTE: initial samples capture RESET = HIGH on the rising edge of CLKINP. This is being corrected for final samples and will reflect the diagram as drawn, with RESET = HIGH captured on falling edge of CLKINP. In addition to CLKOUT alignment using RESET, a synchronization mode is provided in register 0x05. In this mode, the OVR output becomes the SYNCOUT. The SYNCOUT will indicate which sample was present when the RESET input pulse was captured in a HIGH state. The OVR indicator is not available when sync mode is enabled. In single bus mode, only SYNCOUTA is used. In dual bus mode, only SYNCOUTB is used. LVDS Differential source loads of 100 and 200 are provided internal to the ADS5400 and can be implemented using register 0x06 (as well as no internal load). Normal LVDS operation expects 3.5mA of current, but alternate values of 2.5, 4.5, and 5.5mA are provided to save power or improve the LVDS signal quality when the environment provides excessive loading. Over Range The OVR output equals a logic high when the 12-bit output word attempts to exceed either all 0s or all 1s. This flag is provided as an indicator that the analog input signal exceeded the full-scale input limit set in register 0x00 and 0x01 ( gain error). The OVR indicator is provided for systems that use gain control to keep the analog input signal within acceptable limits. The OVR pins are not available when the sychronization mode is enabled, as they become the SYNCOUT indicator. Data Scramble In normal operation, with this mode disabled, the MSBs have similar energy to the analog input fundamental frequency and can in some instances cause board interference. A data scramble mode is available in register 0x06. In this mode, bits 11-1 are XOR'd with bit 0 (the LSB). Because of the random nature of the LSB, this has the effect of randomizing the data pattern. To de-scramble, perform the opposite operation in the digital chip after receiving the scrambled data.
ADS5400
Test Patterns Determining the closure of timing or validating the digital interface can be difficult in normal operation. Therefore, test patterns are available in register 0x06. One pattern toggles the outputs between all 1s and all 0s. Another pattern generates a 7-bit PRBS (pseudo-random bit sequence). In dual bus mode, the toggle mode could be in the same phase on bus A and B (bus A and B outputting 1s or 0s together), or could be out of phase (bus A outputting 1s while bus B outputs 0s). The start phase cannot be controlled. The PRBS output sequence is a standard 27-1 pseudo-random sequence generated by a feedback shift register where the two last bits of the shift register are exclusive-ORed and fed back to the first bit of the shift register. The standard notation for the polynomial is x7 + x6 + 1. The PRBS generator is not reset, so there is no initial position in the sequence. The pattern may start at any position in the repeating 127-bit long pattern and the pattern repeats as long as the PRBS mode is enabled. The data pattern from the PRBS generator is used for all of the LVDS parallel outputs, so when the pattern is 1 then all of the LVDS outputs are outputting 1 and when the pattern is 0 then all of the LVDS drivers output 0. To determine if the digital interface is operating properly with the PRBS sequence, the user must generate the same sequence in the receiving device, and do a shift-and-compare until a matching sequence is confirmed.
Die Identification and Revision

A unique 64-bit die indentifier code can be read from registers 0x17 through 0x1E. An 8-bit die revision code is available in register 0x1F.
Die Temperature Sensor

In register 0x05, the die temperature sensor can be enabled. The sensor is power controlled independently of global powerdown, so that it and the SPI can be used to monitor the die temperature even when the remainder of the ADC is in sleep mode. Register 0x08 is used to read values which can be mapped to the die temperature. The exact mapping is detailed in the register map. Care should be taken not to exceed a maximum die temperature of 150C for prolonged periods of time in order to maintain the life of the device.
Interleaving
Gain Adjustment A signal gain adjustment is available in registers 0x00 and 0x01. The allowable fullscale range for the ADC is 1.52 - 2VPP and can be set with 12-bit adjustment resolution across this range. For equal up/down gain adjustment of the system and ADC gain mismatches, a nominal starting point of 1.75VPP could be programmed, in which case 250mV of adjustment range would be provided. Offset Adjustment Analog offset adjustment is available in register 0x03 and 0x04. This provides 30mV of adjustment range with 9-bit adjustment resolution of 120uV per step. At production test, the default code for this register setting is set to a value that provides 0mV of ADC offset. For optimum spectral performance, it is not recommended to use more than 8mV adjustment from the default setting Input Clock Coarse Phase Adjustment Coarse adjustment is available in register 0x02. The typical range is approximately 73 ps with a resolution of 2.4ps. Input Clock Fine Phase Adjustment Fine adjustment is available in register 0x03. The typical range is approximately 7.4 ps with a resolution of 116fs.
ADS5400
Power Supplies
The ADS5400 uses three power supplies. For the analog portion of the design, a 5-V and 3.3-V supply (AVDD5 and AVDD3) are used, while the digital portion uses a 3.3-V supply (DVDD3). The use of low-noise power supplies with adequate decoupling is recommended. Linear supplies are preferred to switched supplies; switched supplies generate more noise components that can be coupled to the ADS5400. The PSRR value and the plot shown in Figure 38 were obtained without bulk supply decoupling capacitors. When bulk (0.1 mF) decoupling capacitors are used, the board-level PSRR is much higher than the stated value for the ADC. The power consumption of the ADS5400 does not change substantially over clock rate or input frequency as a result of the architecture and process.
100 PSRR Power Supply Rejection Ratio dB 90 80 70 60 50 40 30 20 10 0 0.01
AVDD5 AVDD3 DVDD3
0.1
1 Frequency MHz
10
100
G022
Figure 38. PSRR versus Supply Injected Frequency
ADS5400
Layout Information
The evaluation board provides a guideline of how to lay out the board to obtain the maximum performance from the ADS5400. General design rules, such as the use of multilayer boards, single ground plane for ADC ground connections, and local decoupling ceramic chip capacitors, should be applied. The input traces should be isolated from any external source of interference or noise, including the digital outputs as well as the clock traces. The clock signal traces should also be isolated from other signals, especially in applications where low jitter is required like high IF sampling. Besides performance-oriented rules, care must be taken when considering the heat dissipation of the device. The thermal heat sink should be soldered to the board as described in the PowerPad Package section. See ADS5400 EVM User Guide (SLAU293) on the TI Web site for the evaluation board schematic.
PowerPAD Package
The PowerPAD package is a thermally enhanced standard-size IC package designed to eliminate the use of bulky heatsinks and slugs traditionally used in thermal packages. This package can be mounted using standard printed circuit board (PCB) assembly techniques, and can be removed or replaced using standard repair procedures. The PowerPAD package is designed so that the leadframe die pad (or thermal pad) is exposed on the bottom of the IC. This provides an extremely low thermal resistance path between the die and the exterior of the package. The thermal pad on the bottom of the IC can then be soldered directly to the printed circuit board (PCB), using the PCB as a heatsink. Assembly Process 1. Prepare the PCB top-side etch pattern including etch for the leads as well as the thermal pad as illustrated in the Mechanical Data section. 2. It is recommended to place a 9 x 9 array of 13-mil-diameter (0.33mm) via holes under the package, with the middle 5 x 5 array of thermal vias exposed. 3. Connect all holes (both those inside and outside the thermal pad area) to an internal copper plane (such as a ground plane). 4. Do not use the typical web or spoke via-connection pattern when connecting the thermal vias to the ground plane. The spoke pattern increases the thermal resistance to the ground plane. 5. The top-side solder mask should leave exposed the terminals of the package and the 5 x 5 via array thermal pad area (6 mm x 6 mm). 6. Cover the entire bottom side of the PowerPAD vias to prevent solder wicking. 7. Apply solder paste to the exposed thermal pad area and all of the package terminals. For more detailed information regarding the PowerPAD package and its thermal properties, see either the PowerPAD Made Easy application brief (SLMA004) or the PowerPAD Thermally Enhanced Package application report (SLMA002).
ADS5400
DEFINITION OF SPECIFICATIONS
Analog Bandwidth The analog input frequency at which the power of the fundamental is reduced by 3 dB with respect to the low-frequency value Aperture Delay The delay in time between the rising edge of the input sampling clock and the actual time at which the sampling occurs Aperture Uncertainty (Jitter) The sample-to-sample variation in aperture delay Clock Pulse Duration/Duty Cycle The duty cycle of a clock signal is the ratio of the time the clock signal remains at a logic high (clock pulse duration) to the period of the clock signal, expressed as a percentage. Differential Nonlinearity (DNL) An ideal ADC exhibits code transitions at analog input values spaced exactly 1 LSB apart. DNL is the deviation of any single step from this ideal value, measured in units of LSB. Common-Mode Rejection Ratio (CMRR) CMRR measures the ability to reject signals that are presented to both analog inputs simultaneously. The injected common-mode frequency level is translated into dBFS, the spur in the output FFT is measured in dBFS, and the difference is the CMRR in dB. Effective Number of Bits (ENOB) ENOB is a measure in units of bits of a converter's performance as compared to the theoretical limit based on quantization noise
ENOB = (SINAD 1.76)/6.02 (3)
Gain Error Gain error is the deviation of the ADC actual input full-scale range from its ideal value, given as a percentage of the ideal input full-scale range. Integral Nonlinearity (INL) INL is the deviation of the ADC transfer function from a best-fit line determined by a least-squares curve fit of that transfer function. The INL at each analog input value is the difference between the actual transfer function and this best-fit line, measured in units of LSB. Offset Error Offset error is the deviation of output code from mid-code when both inputs are tied to common-mode. Power-Supply Rejection Ratio (PSRR) PSRR is a measure of the ability to reject frequencies present on the power supply. The injected frequency level is translated into dBFS, the spur in the output FFT is measured in dBFS, and the difference is the PSRR in dB. The measurement calibrates out the benefit of the board supply decoupling capacitors. Signal-to-Noise Ratio (SNR) SNR is the ratio of the power of the fundamental (PS) to the noise floor power (PN), excluding the power at dc and in the first five harmonics. P SNR + 10log 10 S PN
(4)
SNR is either given in units of dBc (dB to carrier) when the absolute power of the fundamental is used as the reference, or dBFS (dB to full scale) when the power of the fundamental is extrapolated to the converters full-scale range.
ADS5400
Signal-to-Noise and Distortion (SINAD) SINAD is the ratio of the power of the fundamental (PS) to the power of all the other spectral components including noise (PN) and distortion (PD), but excluding dc. PS SINAD + 10log 10 PN ) PD
(5)
SINAD is either given in units of dBc (dB to carrier) when the absolute power of the fundamental is used as the reference, or dBFS (dB to full scale) when the power of the fundamental is extrapolated to the converters full-scale range. Temperature Drift Temperature drift (with respect to gain error and offset error) specifies the change from the value at the nominal temperature to the value at TMIN or TMAX. It is computed as the maximum variation the parameters over the whole temperature range divided by TMIN TMAX. Total Harmonic Distortion (THD) THD is the ratio of the power of the fundamental (PS) to the power of the first five harmonics (PD). P THD + 10log 10 S PD THD is typically given in units of dBc (dB to carrier). Two-Tone Intermodulation Distortion (IMD3) IMD3 is the ratio of the power of the fundamental (at frequencies f1, f2) to the power of the worst spectral component at either frequency 2f1 f2 or 2f2 f1). IMD3 is given in units of either dBc (dB to carrier) when the absolute power of the fundamental is used as the reference, or dBFS (dB to full scale) when the power of the fundamental is extrapolated to the converters full-scale range. SPACER
(6)
REVISION HISTORY
Changes from Original (October 2009) to Revision A
Page
Changed the FEATURES list ................................................................................................................................................ 1 Changed Abs Max, Recommended Op Conditions, and Electrical Specs values. ............................................................... 2 Changed the description of the ANALOG INPUT entry in the Rec Op Condition table From: Differential input range To: Full-scale differential input range .................................................................................................................................... 3 Changed the Rec Op table, VCM - TYP value From: 2.5V To AVDD5/2 ............................................................................... 3 Changed the description of the ANALOG INPUT entry in the Elect Char table From: Differential input range To: Full-scale differential input range .......................................................................................................................................... 3 Changed the Elect Char table, VCM - TYP value From: 2.5V To AVDD5/2 .......................................................................... 3 Changed the Timing Diagrams illustrations .......................................................................................................................... 9 Changed Figure 1 ................................................................................................................................................................. 9 Changed Figure 2 ............................................................................................................................................................... 10 Changed Figure 3 ............................................................................................................................................................... 11 Changed Figure 4 ............................................................................................................................................................... 12 Changed Figure 5 ............................................................................................................................................................... 13 Deleted text "Internal pull-down resistor" from the SCLK, SDIO, and SDO pins in the Pin Functions table ...................... 15 Changed the SDENB pin text From: "Internal pull-up resistor" To: "Internal 100k pull-up resisto" in the Pin Functions table .................................................................................................................................................................... 15 Added Note to the Pin Functions table - This pin contains an internal ~40k pull-down resistor, to ground. ................... 15 Changed Table 8 BIT <7:3>, Title and description ............................................................................................................. 20 Changed Table 9 BIT <0>, Default setting description, and BIT <7:2> description ........................................................... 20 Changed Table 10 BIT <0>, Default setting description ..................................................................................................... 21
ADS5400
Changed Serial Register 0x06 (Read or Write) (Table 12). Bits 4 and 5 From TBD To: 0 ................................................ 22 Deleted Table 12 description comment from BIT <7:6> 11: (this mode is not working properly on early samples - will be fixed) .............................................................................................................................................................................. 22 Changed the TYPICAL CHARACTERISTICS, Conditions Note From: DVDD3 = 3.3 V, and 3.3-VPP differential clock To: DVDD = 3.3V and 1.5 VPP differential clock ................................................................................................................. 25 Added subsection - Analog Input Over-Range Recovery Error .......................................................................................... 32 Changed the Clock Inputs subsection ................................................................................................................................ 33 Changed the Test Patterns subsection ............................................................................................................................... 38 Changed the Interleaving subsection ................................................................................................................................. 38 Changed the Power Supplies subsection ........................................................................................................................... 39 Added Figure 38 - Was TBD .............................................................................................................................................. 39
Changes from Revision A (November 2009) to Revision B
Page
Changed Data sheet From: Product Preview To: Production ............................................................................................... 1 Changed INL - Integral nonlinearity error Max value From: 4 To: 4.5 ................................................................................ 3 Changed Worst harmonic/spur (other than HD2 and HD3), fIN = 1200 MHz TYP value From: 70 To 66 ............................ 5 Changed Worst harmonic/spur (other than HD2 and HD3), fIN = 1700 MHz TYP value From: 66 To 64 ............................ 5 Changed Total Harmonic Distortion, fIN = 125 MHz TYP value From: 73.5 To 71.7 ............................................................ 5 Changed Total Harmonic Distortion, fIN = 600 MHz TYP value From: 68.5 To 67 ............................................................... 5 Changed Total Harmonic Distortion, fIN = 850 MHz TYP value From: 68.5 To 66.5 ............................................................ 5 Changed Total Harmonic Distortion, fIN = 1700 MHz TYP value From: 56.2 To 55.7 .......................................................... 5 Changed Signal-to-noise and distortion, fIN = 125 MHz TYP value From: 58 To 58.5 ......................................................... 5 Changed Signal-to-noise and distortion, fIN = 600 MHz TYP value From: 57.4 To 58.2 ...................................................... 5 Changed Signal-to-noise and distortion, fIN = 850 MHz TYP value From: 57.3 To 57.8 ...................................................... 5 Changed Signal-to-noise and distortion, fIN = 1200 MHz TYP value From: 57.2 To 57.5 .................................................... 5 Changed Signal-to-noise and distortion, fIN = 1700 MHz TYP value From: 54 To 54.2 ....................................................... 5 Changed Effective number of bits (using SINAD in dBFS), fIN = 125 MHz TYP value From: 9.34 To 9.42 ......................... 5 Changed Effective number of bits (using SINAD in dBFS), fIN = 600 MHz TYP value From: 9.24 To 9.37 ......................... 5 Changed Effective number of bits (using SINAD in dBFS), fIN = 850 MHz TYP value From: 9.23 To 9.3 ........................... 5 Changed INPUT CLOCK COARSE PHASE ADJUSTMENT, Integral Non-Linearity error Max value From: 4 To 5 ........... 8 Changed Table 7, BIT 4 From: 1 To: 0 ............................................................................................................................... 19 Deleted note: (was not available on early samples) from SPI Register Reset in Table 7 .................................................. 19
PACKAGE OPTION ADDENDUM

www.ti.com 23-Apr-2010
PACKAGING INFORMATION
Orderable Device ADS5400IPZP ADS5400IPZPR
(1)
Status (1) ACTIVE ACTIVE
Package Type HTQFP HTQFP
Package Drawing PZP PZP
Pins Package Eco Plan (2) Qty 100 100 90 Green (RoHS & no Sb/Br)
Lead/Ball Finish CU NIPDAU CU NIPDAU
MSL Peak Temp (3) Level-3-260C-168 HR Level-3-260C-168 HR
1000 Green (RoHS & no Sb/Br)
The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION

www.ti.com 20-Jul-2010
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins Type Drawing HTQFP PZP 100
SPQ
Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 330.0 24.4 16.6
B0 (mm) 16.6
K0 (mm) 2.0
P1 (mm) 20.0
W Pin1 (mm) Quadrant 24.0 Q2
ADS5400IPZPR
1000
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION

www.ti.com 20-Jul-2010
*All dimensions are nominal
Device ADS5400IPZPR
Package Type HTQFP
Package Drawing PZP
Pins 100
SPQ 1000
Length (mm) 346.0
Width (mm) 346.0
Height (mm) 41.0
Pack Materials-Page 2
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ADS5400

www.ti.com SLAS611B OCT 2009 REVISED MARCH 2010

12-Bit, 1-GSPS Analog-to-Digital Converter

RESETP (SYNCINP) RESETN (SYNCINN)

INP BUFFER INN 12-bit ADC (3 stage pipeline)

OUTA [0-11]P OUTA[0-11]N

VCM VREF SCLK SDIO SDO SDENB ENEXTREF ENPWD ENA1BUS

REFERENCE OVER RANGE DETECTOR, SYNC and DEMUX 12

OVRAP (SYNCOUTAP ) OVRAN (SYNCOUTAN) CLKOUTBP CLKOUTBN PHASE ADJUST

CONTROL OFFSET ADJUST TEMP SENSOR

OUTB[0-11]P OUTB[0-11]N OVRBP (SYNCOUTBP) OVRBN (SYNCOUTBN)

Table 1. PACKAGE/ORDERING INFORMATION

SPECIFIED TEMPERATURE RANGE 40C to 85C

PACKAGE MARKING ADS5400I

ORDERING NUMBER ADS5400IPZP ADS5400IPZPR

TRANSPORT MEDIA, QUANTITY Tray, 90 Tape and reel, 1000

ABSOLUTE MAXIMUM RATINGS

short duration continuous AC signal continuous DC signal

CLKINP, CLKINN to GND CLKINP to CLKINN

RESETP, RESETN to GND RESETP to RESETN

Data/OVR Outputs to GND

voltage difference between pin and ground

0.3 to (AVDD3 + 0.3) 0.3 to (AVDD5 + 0.3) 40 to 85 150 65 to 150 2

THERMAL CHARACTERISTICS (1)

TYP 28.4 16.6 13.5 0.16

UNIT C/W C/W

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RECOMMENDED OPERATING CONDITIONS

INTERNAL REFERENCE VOLTAGE DYNAMIC ACCURACY

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ELECTRICAL CHARACTERISTICS (continued)

All power values assume LVDS output current is set to 3.5mA.

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ELECTRICAL CHARACTERISTICS (continued)

LVDS DIGITAL INPUTS (RESET) Each input pin

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SWITCHING CHARACTERISTICS (continued)

DIGITAL INPUTS ( ENEXTREF, ENPWD, ENA1BUS)

DIGITAL OUTPUTS (SDIO, SDO)

TIMING CHARACTERISTICS (1)

TYP 250 125 7 7.5 8.5 7.5

1700 1700 2100 2100

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TIMING CHARACTERISTICS (1) (continued)

MIN 290p 410p 550p 1150p

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CLKINP tRSU RESETP tRH

DATA BUS A SYNCOUTA (OVRA pins)

Figure 1. Single Bus Mode

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Timing Diagrams (continued)

CLKINP tRSU RESETP tRH