Unit - 3

UNIT 3
Principle and working and application of unconventional machining processes such as Laser beam machining, Electron beammachining Ultrasonic machining
LASER BEAM MACHINING
INTRODUCTION To LASER
Laser is the abbreviation of light amplification by stimulated emission of radiation. A highly collimated, monochromatic, and coherent light beam is generated and focused to a small spot. High power densities (106 W/mm2) are then obtained. Lasers are widely used in many industrial applications including plating, heat treatment, cladding, alloying, welding, and machining.
INTRODUCTION
Laser Beam Machining (LBM) is a thermal process considering the mechanisms of material removal. However electrical energy is used to generate high-energy coherent photons in case of Laser Beam Machining (LBM). Thus this process is often classified as electro-optical-thermal process.
MATERIAL REMOVAL MECHANISM

As presented in Figure, the unreflected light is absorbed, thus heating the surface of the specimen. On sufficient heat the workpiece starts to melt and evaporates. The physics of laser machining is very complex due to mainly scattering and reflection losses at the machined surface. Additionally, heat diffusion into the bulk material causes phase change, melting, and/or vaporization. Depending on the power density and time of beam interaction, the mechanism progresses from one of heat absorption and conduction to one of melting and then vaporization.
Physical processes occurring during LBM.
Continued
Machining by laser occurs when the power density of the beam is greater than what is lost by conduction, convection, and radiation, and moreover, the radiation must penetrate and be absorbed into the material. In LBM the workpiece material is removed through several effects including reflection, absorption, and conduction of light that is followed by melting and evaporation. The behavior of the work material with respect to these effects determines the material removal rate.
LASER BEAM MACHINING THE LASING PROCESS
LASING ACTION
LASING MEDIUM
Many materials can be used as the heart of the laser. Depending on the lasing medium lasers are classified as solid state and gas laser. Solid-state lasers are commonly of the following type Ruby which is a chromium alumina alloy having a wavelength of 0.7 m Nd-glass lasers having a wavelength of 1.64 m Nd-YAG* laser having a wavelength of 1.06 m These solid-state lasers are generally used in material processing. The generally used gas lasers are Helium Neon Argon CO2 etc. *neodymium-doped yttrium aluminium garnet
LASER CONSTRUCTION
Figure shows a typical Nd-YAG laser. Nd-YAG laser is pumped using flash tube. Flash tubes can be helical, as shown in Fig, or they can be flat. Typically the lasing material is at the focal plane of the flash tube. Though helical flash tubes provide better pumping, they are difficult to maintain.
Figure shows the electrical circuit for operation of a solid-state laser. The flash tube is operated in pulsed mode by charging and discharging of the capacitor. Thus the pulse on time is decided by the resistance on the flash tube side and pulse off time is decided by the charging resistance. There is also a high voltage switching supply for initiation of pulses.
APPLICATIONS
Drilling. Composite materials and some exotic alloys have been widely used in the fabrication of both structural and nonstructural members of the airframes and engines of aircrafts. Laser drilling is performed by the following three methods: Direct drilling: Produces the required hole size by the application of one or more focused laser pulses. The hole size is determined by the input power and the focusing adjustments. While most holes are drilled with a single laser pulse of high energy, it is more efficient to drill deep holes with multiple pulses of low energy. Drill and ream: Consists of drilling a pilot hole and then changing the laser parameters, by increasing the spot size to open out the hole to the required diameter
LASER DRILLING CAPABILITIES
LASER BEAM SELECTION GUIDE
ADVANTAGES
Tool wear and breakage are not encountered. Holes can be located accurately by using an optical laser system for alignment. Very small holes with a large aspect ratio can be produced. A wide variety of hard and difficult-to-machine materials can be tackled. Machining is extremely rapid and the setup times are economical. Holes can be drilled at difficult entrance angles (10 to the surface). Because of its flexibility, the process can be automated easily such as the on-the-fly operation for thin gauge material, which requires one shot to produce a hole. The operating cost is low.
LIMITATIONS
High equipment cost. Tapers are normally encountered in the direct drilling of holes. A blind hole of precise depth is difficult to achieve with a laser. The thickness of the material that can be laser drilled is restricted to 50 mm. Adherent materials, which are found normally at the exit holes, need to be removed.

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UNIT 3

LASER BEAM MACHINING

MATERIAL REMOVAL MECHANISM

Physical processes occurring during LBM.

LASER BEAM MACHINING THE LASING PROCESS

LASER DRILLING CAPABILITIES

LASER BEAM SELECTION GUIDE

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