ITRS MEMS

San Francisco, CA
July 12, 2012
Presentation by Michael Gaitan, NIST
MEMS Technology Working Group
Akihiro Koga
Arthur Morris
Asif Chowdhury
Brian Jamieson
Buzz Hardy
Chengkuo Lee
Chris Apanius
Chris van Hoof
Christian Rembe
Chuck Richardson
Dave Howard
Dimitrios Peroulis
Dominique Schinabeck
Don DeVoe
Edward Chiu
Fabio Pasolini
Fabrice Verjus
Fumihiko Nakazawa
Goro Nakatani
Hebert Bennett
Toshiba
Wispry
Analog Devices
SB Microsystems
MEMSCAP
National U of Singapore
Promeus
IMEC
PolyTec
iNEMI
Jazz Semiconductor
Perdue
Acutronic
University of MD
Asian Pacific Micro
ST Micro
KFM Technology
Fujitsu
Rohm
NIST
Henne van Heeren
Hiroshi Yamada
Ingrid De Wolf
Jae Sung Yoon
Jim Spall
Jim Mrvos
Jianmin Miao
John Rychcik
Josh Molho
Karen Lightman
Kevin Chau
Koji Fukumoto
Marcie Weinstein
Mark Crockett
Mary Ann Maher
Michel Brillouet
Monica Takacs
Patric Salomon
Pete Loeppert
Raj Gupta
enablingMNT
Toshiba
IMEC
KIMM
Delphi
Lexmark
NTU
Solidus
Caliper
MEMS Industry Group
MEMStaff
Sony
Akustica
SEMI, MEMSmart
SoftMEMS
LETI
MEMS Industry Group
4m2c
Knowles Acoustics
Volant Technologies
Chair: Mike Gaitan (NIST), Chair
Co-Chairs: Robert Tsai (TSMC) and Philippe Robert (LETI)
Raji Baskaran
Rakesh Kumar
Randy Wagner
Robert De Nuccio
Ron Lawes
Sacha Revel
Scott Bryant
Shawn Blanton
Stephane Donnay
Steve Breit
Steve Greathouse
Steve Walsh
Takashi Mihara
Tetsu Tanaka
Tony Stamper
Veljko Milanovic
Wei-Leun Fang
Wendy Chen
Xiaoming Wu
Yasutaka Nakashiba
Intel
Global Foundries
NIST
ST Micro
Imperial College
Accutronic
MANCEF
Carnegie Mellon University
IMEC
Coventor
Plexus
MANCEF
Micromachine Center
Tohoku Univ.
IBM
Mirrorcle Technologies
NTHU
KYEC
Lexmark
Renesas Electronics
MEMS Technology Working Group
Akihiro Koga
Arthur Morris
Asif Chowdhury
Brian Jamieson
Buzz Hardy
Chengkuo Lee
Chris Apanius
Chris van Hoof
Christian Rembe
Chuck Richardson
Dave Howard
Dimitrios Peroulis
Dominique Schinabeck
Don DeVoe
Edward Chiu
Fabio Pasolini
Fabrice Verjus
Fumihiko Nakazawa
Goro Nakatani
Hebert Bennett
Toshiba
Wispry
Analog Devices
SB Microsystems
MEMSCAP
National U of Singapore
Promeus
IMEC
PolyTec
iNEMI
Jazz Semiconductor
Perdue
Acutronic
University of MD
Asian Pacific Micro
ST Micro
KFM Technology
Fujitsu
Rohm
NIST
Henne van Heeren
Hiroshi Yamada
Ingrid De Wolf
Jae Sung Yoon
Jim Spall
Jim Mrvos
Jianmin Miao
John Rychcik
Josh Molho
Karen Lightman
Kevin Chau
Koji Fukumoto
Marcie Weinstein
Mark Crockett
Mary Ann Maher
Michel Brillouet
Monica Takacs
Patric Salomon
Pete Loeppert
Raj Gupta
enablingMNT
Toshiba
IMEC
KIMM
Delphi
Lexmark
NTU
Solidus
Caliper
MEMS Industry Group
MEMStaff
Sony
Akustica
SEMI, MEMSmart
SoftMEMS
LETI
MEMS Industry Group
4m2c
Knowles Acoustics
Volant Technologies
Chair: Mike Gaitan (NIST), Chair
Co-Chairs: Robert Tsai (TSMC) and Philippe Robert (LETI)
Raji Baskaran
Rakesh Kumar
Randy Wagner
Robert De Nuccio
Ron Lawes
Sacha Revel
Scott Bryant
Shawn Blanton
Stephane Donnay
Steve Breit
Steve Greathouse
Steve Walsh
Takashi Mihara
Tetsu Tanaka
Tony Stamper
Veljko Milanovic
Wei-Leun Fang
Wendy Chen
Xiaoming Wu
Yasutaka Nakashiba
Intel
Global Foundries
NIST
ST Micro
Imperial College
Accutronic
MANCEF
Carnegie Mellon University
IMEC
Coventor
Plexus
MANCEF
Micromachine Center
Tohoku Univ.
IBM
Mirrorcle Technologies
NTHU
KYEC
Lexmark
Renesas Electronics
MEMS Industry Group
MEMS TWG
Subgroups:
Devices,
Design and
Simulation,
Packaging and
Integration, and
Testing
Len Sheynblat, Qualcomm, Sensors System Integration Problems, MIG M2M Workshop, Spring 2012
Focus: MEMS in Mobile Devices
ITRS MEMS
MEMS Device Technologies
Accelerometers
Gyroscopes
Microphones
RF MEMS
Emerging MEMS

Technology Requirements
Device Performance
Design and Simulation
Packaging and Integration
Device Testing
MEMS Inertial Sensors
MEMS Inertial Sensors continue to
incrementally increase in performance and
lower in cost.
The integration of functionalities (tri axis
accelerometer, gyroscope, magnetometer,
and pressure sensor) towards the IMU has
advanced to 9 DOF in the package.
Driving down the cost of testing of the IMU
continues to be a challenge.
Example - 9 DOF IMU Package Level
ST Microelectronics
Feb 12, 2012
http://www.st.com/internet/com/press_release/p3273.jsp
MEMS Microphones
MEMS microphones are expected to
incrementally increase in performance and
lower in cost.
As the sensitivity of microphones advances to
68 db, testing in the factory environment is an
issue.
Advances in the ASIC include digital output
and adaptive signal processing (such as noise
cancellation).
Testing of MEMS Microphones with adaptive
signal processing is a challenge.
RF MEMS
RF MEMS are intended to lower the power
dissipation of the radio.
RF MEMS are sill in the process of increasing
their reliability and lowering cost before they
can be adopted in mobile devices.
RF MEMS are expected to increase in
performance and reliability.
The biggest challenge in RF MEMS is enhancing
reliability and lifetime (# of operations)
Some of the future performance metrics have no
known solutions, (e.g., signal isolation requirements)
Grand Challenges
Difficult Challenges Potential Solutions
Integration of MEMS in the Package
Standardization for MEMS packaging to support
integration.
Packages are needed that reduce or eliminate
mechanical stress and enhancing hermeticity.
Package data that can be used to accurately
predict the effect of the package on device
performance.

Testing of MEMS
More testing towards the wafer level.
Validated tools to predict device device
performance from wafer tests.
Methodologies for Design for Test or Design
for NO Test.
Validated accelerated life testing for
MEMS

More knowledge of the physics of failure is
required to develop accelerated life tests.
Need to share information. Individual solutions
exist but are not being generalized across the
industry.
MEMS Manufacturing
Packaging
and
Testing
Device
Fabrication
MEMS Manufacturing Cost R&D Investment
Device and
Process
Development
Packaging and Testing
ITRS and iNEMI
The MEMS Technology Working Group is also
affiliated with iNEMI.
The iNEMI MEMS will be expanded to include
consumer health applications: the "Worried
Well."
TWG discussions include the concept of
integration node.
An iNEMI project on MEMS Testing
Requirements is in discussion. The focus will
likely be on defining performance metrics in
data sheets.
MEDICAL MARKET- High Potential
Bubble Chart Ref: IBM Institute for Business Value, The future
of connected health devices
3 BILLION POTENTIAL CUSTOMERS FOR
CONNECTED HEALTH DEVICES
Integration Node
Accelerometer
Tri-Axis
Accelerometer
Gyroscope
Tri-Axis
Gyroscope
Magnetometer
Tri-Axis
Magnetometer
6 DOF Sensor
9 DOF Sensor
Pressure Sensor
10 DOF Sensor
Conclusions
Opportunities for industrial collaboration exist
around issues at the back end (packaging and test)
MEMS Sensor Fusion creates challenges for testing
in increasing complexity while still lowering cost.
MEMS Testing requirements depend on the
application (consumer electronics, automotive,
medical, defense and aerospace).
Our road mapping has so far been on near term (5
years). The concept of integration node might
facilitate longer term road mapping of MEMS and
other More than Moore Technologies.