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    M. Sahith Chandan Roll. No: 05P71A0438 B.TECH 4/4 E.C.E Ph. No: 9985066696

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    D S Rao
    MEMS are microelectromechanical systems that integrate mechanical and electrical components on a common silicon substrate using microfabrication techniques. MEMS can be as small as a grain of salt and are used in applications like sensors, actuators, and biomedical devices. They operate using energy domains like thermal, mechanical, chemical, magnetic, radiant, and electrical. MEMS are fabricated using deposition, photolithography, etching, and other microfabrication processes and can be made from materials like silicon, polymers, and metals. They provide advantages over larger devices like lower power consumption, greater precision and functionality.

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    M. Sahith Chandan Roll. No: 05P71A0438 B.TECH 4/4 E.C.E Ph. No: 9985066696

    Uploaded by

    D S Rao
    23 views27 pages
    MEMS are microelectromechanical systems that integrate mechanical and electrical components on a common silicon substrate using microfabrication techniques. MEMS can be as small as a grain of salt and are used in applications like sensors, actuators, and biomedical devices. They operate using energy domains like thermal, mechanical, chemical, magnetic, radiant, and electrical. MEMS are fabricated using deposition, photolithography, etching, and other microfabrication processes and can be made from materials like silicon, polymers, and metals. They provide advantages over larger devices like lower power consumption, greater precision and functionality.

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    A presentation on World of Microelectronics

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    MEMS are microelectromechanical systems that integrate mechanical and electrical components on a common silicon substrate using microfabrication techniques. MEMS can be as small as a grain of salt and are used in applications like sensors, actuators, and biomedical devices. They operate using energy domains like thermal, mechanical, chemical, magnetic, radiant, and electrical. MEMS are fabricated using deposition, photolithography, etching, and other microfabrication processes and can be made from materials like silicon, polymers, and metals. They provide advantages over larger devices like lower power consumption, greater precision and functionality.

    Copyright:

    © All Rights Reserved
    Download as PPTX, PDF, TXT or read online from Scribd
    Download as pptx, pdf, or txt
    23 views27 pages

    M. Sahith Chandan Roll. No: 05P71A0438 B.TECH 4/4 E.C.E Ph. No: 9985066696

    Uploaded by

    D S Rao
    MEMS are microelectromechanical systems that integrate mechanical and electrical components on a common silicon substrate using microfabrication techniques. MEMS can be as small as a grain of salt and are used in applications like sensors, actuators, and biomedical devices. They operate using energy domains like thermal, mechanical, chemical, magnetic, radiant, and electrical. MEMS are fabricated using deposition, photolithography, etching, and other microfabrication processes and can be made from materials like silicon, polymers, and metals. They provide advantages over larger devices like lower power consumption, greater precision and functionality.

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    © All Rights Reserved
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    of 27

    M.

    SAHITH CHANDAN
    Roll. No: 05P71A0438
    B.TECH 4/4 E.C.E
    Ph. No: 9985066696
    Evolution of MEMS
     Imagine a machine so small that it is imperceptible to the
    human eye. Imagine working machines no bigger than a
    grain of pollen. Imagine thousands of these machines
    batch fabricated on a single piece of silicon, for just a few
    pennies each. Imagine a world where gravity and inertia
    are no longer important, but atomic forces and surface
    science dominate.
     You are now entering the microdomain, a world occupied
    by an explosive technology known as MEMS. A world of
    challenge and opportunity, where traditional engineering
    concepts are turned upside down, and the realm of the
    "possible" is totally redefined.
    What Is ‘MEMS’?
     MEMS is an acronym derived from MICRO ELECTRO
    MECHANICAL SYSTEMS. 'Smart sensors' is probably the
    most appropriate designation for emerging new product
    technologies.

     As their name implies, micro-electro- mechanical- systems


    (MEMS), fabricated using micro-machining techniques,
    which enables many different components to fit on a small
    silicon microchip, which produce greater functionality
    and precision than larger devices.
    Energy Domains
     Thermal (temperature, heat and heat flow)
     Mechanical (force, pressure, velocity, acceleration,
    position)
     Chemical (concentration, pH, reaction rate)
     Magnetic (field intensity, flux density, magnetization)
     Radiant (intensity, wavelength, polarization, phase)
     Electrical (voltage, charge, current)
    How Small are MEMS?
     Tomorrow, if you see a bug, be careful, because that may be
    a spy sent by the enemies. With the advent of MEMS you
    can create any machine at microscopic or perhaps at
    nanoscale. They are the size of a grain of salt or the eye of a
    needle that integrate mechanical elements, sensors and
    actuators on a common silicon substrate.

     MEMS are made up of components between 1 to 100


    micrometers in size (i.e. 0.001 to 0.1 mm) and MEMS
    devices generally range in size from 20 micrometers (20
    millionths of a meter) to a millimeter.
    Necessity of MEMS
     The small mass MEMS components greatly reduce the familiar design
    constraints of gravity and inertia.
     Each MEMS application has a unique set of design specifications.
    There is no single technical barrier to the implementation of MEMS
    manufacturing.

    Principles of MEMS
     MEMS technology extends conventional microelectronics technology
    by adding physical motion to the movement of electrons in circuits.
     The micromechanical components are fabricated using compatible
    “micromachining” processes that selectively etch away the parts of the
    silicon wafer or add new structural layers to form the mechanical and
    electromechanical devices.
    Materials used in MEMS
     MEMS technology can be implemented using a number of
    different materials and manufacturing techniques; the choice of
    which will depend on the device being created and the market
    sector in which it has to operate.
     Silicon: Silicon is the material used to create most integrated circuits. In
    single crystal form, silicon is an almost perfect Hookean material, meaning
    that when it is flexed there is virtually no hysteresis and hence almost no
    energy dissipation.
     Polymers: crystalline silicon is still a complex and relatively expensive
    material to produce. Polymers on the other hand can be produced in huge
    volumes, with a great variety of material characteristics. MEMS devices can
    be made from polymers by processes such as injection moulding,
    embossing or stereolithography.
     Metals: Metals can be deposited by electroplating, evaporation, and
    sputtering processes. Commonly used metals include gold, nickel,
    aluminum, chromium, titanium, tungsten, platinum, and silver.
    Microelectromechanical Systems
    Processes
     Deposition processes
     Photolithography
     Etching processes
     Wet etching
     Dry etching
     Reactive ion etching (RIE)
     Deep reactive ion etching (DRIE)
     Xenon difluoride etching
    Why Micromachines?
     Minimize energy and materials use in manufacturing
     Redundancy and arrays
     Integration with electronics
     Reduction of power budget and faster devices
     Increased selectivity and sensitivity
     Exploitation of new effects through the breakdown of
    continuum theory in the micro-domain
     Cost/performance advantages
     Improved reproducibility (batch fabrication)
     Improved accuracy and reliability
     Minimally invasive (e.g. pill camera)
    Fabrication Technologies
     The three characteristic features of MEMS fabrication
    technologies:
     Miniaturization: Miniaturization enables the production of
    compact, quick-response devices.
     Multiplicity: Multiplicity refers to the batch fabrication
    inherent in semiconductor processing, which allows
    thousands or millions of components to be easily and
    concurrently fabricated.
     Microelectronics: Microelectronics provides the intelligence
    to MEMS and allows the monolithic merger of sensors,
    actuators, and logic to build closed-loop feedback
    components and systems.
    IC Fabrication
     The successful miniaturization and multiplicity of
    traditional electronics systems would not have been
    possible without IC fabrication technology.

     The major steps in IC fabrication technology are film


    growth, doping, lithography, etching, dicing, and
    packaging.

     Manufacturing processes allow for the monolithic


    integration of microelectromechanical structures with
    driving, controlling, and signal-processing electronics.
    Bulk Micromachining and Wafer Bonding
     Bulk micromachining is an extension of IC technology for
    the fabrication of 3D structures.

     The two key capabilities that make bulk micromachining a


    viable technology are:
     Anisotropic etchants of Si
     Etch masks and etch-stop techniques

     Two additional processing techniques have extended the


    range of traditional bulk micromachining technology: deep
    anisotropic dry etching and wafer bonding.
    Surface Micromachining

     Surface micromachining enables the fabrication of


    complex multicomponent integrated micromechanical
    structures that would not be possible with traditional bulk
    micromachining.

     This technique encases specific structural parts of a device


    in layers of a sacrificial material during the fabrication
    process.

     Surface micromachining uses layers deposited on the


    surface of a substrate as the structural materials, rather
    than using the substrate itself.
    Micromolding
     In the micromolding process, microstructures are
    fabricated using molds to define the deposition of the
    structural layer.

     The structural material is deposited only in those areas


    constituting the microdevice structure, in contrast to bulk
    and surface micromachining, which feature blanket
    deposition of the structural material followed by etching to
    realize the final device geometry.

     This process can be used for the manufacture of high-


    aspect-ratio 3D microstructures in a wide variety of
    materials such as metals, polymers, ceramics, and glasses.
    Applications of MEMS
     Resonant Gate Transistor:
     Automotives:
     MEMS tuning fork gyro:
     Measures angular rotation rate

     A proof mass attached to springs is forced to oscillate in the


    horizontal plane. A voltage is applied to a sensing electrode (sense
    plate) below the proof mass, creating an electrical field.
     The Coriolis force imparted by angular rotation causes the proof
    mass to oscillate in the vertical direction, which, in turn, changes
    the gap between the proof mass and the sense plate
     This generates an AC current with amplitude proportional to the
    rotation rate
     Blood Pressure Sensors:
     Medical Diagnostics:
     Pill Camera
     MEMS Market for Mobile Phones:
     Silicon microphone: Improves the manufacturability of
    microphones for similar performance compared to Electret
    Condensor Microphone (ECD)
     3D accelerometers: Adds functions for man machine interface and
    silent mode activation
     RF MEMS passive and active devices: Provides better integration
    of passive devices for RF module and faster frequency agility
     Gyroscope for camera stabilisation and GPS: Enables real digital
    imaging, preserves the GPS signal
     Microfuel cell: Provides longer lifetime for the batteries

     Chemical and Biochip: Personal weather station and health care


    monitor MS Market for Mobile Phones
     1 GHz NEMS Resonator:

    Si double-ended tuning fork


     Security purposes:
     MEMS fingerprint sensor
     capacitance change ∆c
     Computers and Communications:
     Using MEMS technology can significantly improve electrical
    components such as inductors and tunable capacitors compared to
    their integrated counterparts. This will improve the overall
    performance of communication circuits, while the total circuit area,
    power consumption and cost will be reduced.

     Bio-MEMS:
     Applications in medical and health related technologies from Lab-
    On-Chip to MicroTotalAnalysis (biosensor, chemosensor).

     Optical switching technology:


     Which is used for switching technology and alignment for data
    communications.
    Conclusion
     MEMS prove to be a promising technology for future
    sensors and actuators.
     Tend to decrease size, enhance performance, and lower the
    cost of transducer in market is made possible by the
    success of MEMS technology.
     An almost infinite number of radial applications are
    possible because of its potential, nearly limitless
    functionality.
     The promise of MEMS is increasingly capturing the
    attention of new and old industries as more and more of
    their challenges are solved with MEMS.
    Information Resources
     Journals:
     Journal of Micromechanical Systems (JMEMS)
     Journal of Micromechanics and Microengineering (JMM)
     Micromachine Devices
     Sensors Magazine

     Online Resources:
     http://en.wikipedia.org/wiki/MEMS#Surface_micromachining
     http://www.csa.com/discoveryguides/mems/overview.php
     Introduction to Microengineering:
    http://www.dbanks.demon.co.uk/ueng/
     MEMS Exchange http://www.mems-exchange.org/
     MEMS Clearinghouse http://www.memsnet.org/
    THANKING YOU

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