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Computer Cooling

This document discusses various computer cooling systems and methods. It explains that computer components produce heat during operation so cooling is needed to remove this heat and keep components within safe temperature ranges. It then describes different fans used for cooling specific components like the CPU, chipset, video card, power supply, and intake/exhaust. Additional cooling methods discussed include heat sinks, thermal paste, liquid cooling, heat pipes, Peltier devices, phase-change cooling, and using liquids like nitrogen or helium.

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Mohamed Ali
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© © All Rights Reserved
Available Formats
Download as PPT, PDF, TXT or read online on Scribd
92 views

Computer Cooling

This document discusses various computer cooling systems and methods. It explains that computer components produce heat during operation so cooling is needed to remove this heat and keep components within safe temperature ranges. It then describes different fans used for cooling specific components like the CPU, chipset, video card, power supply, and intake/exhaust. Additional cooling methods discussed include heat sinks, thermal paste, liquid cooling, heat pipes, Peltier devices, phase-change cooling, and using liquids like nitrogen or helium.

Uploaded by

Mohamed Ali
Copyright
© © All Rights Reserved
Available Formats
Download as PPT, PDF, TXT or read online on Scribd
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Lesson 7

Cooling Systems
Computer cooling
is the process of removing heat from computer
components.
Because a computer system's components produce
large amounts of heat during operation, this heat
must be dissipated in order to keep these
components within their safe operating temperatures.
In addition to maintaining normative function, varied
cooling methods are used to either achieve greater
processor performance (overclocking), or else to
reduce the noise pollution caused by typical (ie.
cooling fans) cooling methods
Fans

Front intake fan

Rear exhaust fan


Front intake fan
This fan is used to bring fresh, cool
air into the computer for cooling
purposes.
Rear exhaust fan

This fan is used to take


hot air out of the case.
Power supply exhaust
fan
This fan is usually found at the back
of the power supply and is used to
cool the power supply.
CPU fan
This fan is used to cool the processor.
Typically, this fan is attached to a
large heat sink, which is in turn
attached directly to the processor.
Chipset Fan
This fan aids in the cooling of the
onboard chipset (especially useful
when overclocking).
Video card chipset Fan
This fan aids in the cooling chips
mounted on the Video card adapter,
including the graphics processing
unit (GPU) and graphics memory.
Memory module fan
Memory Cooling
Passive cooling method

heat sinks
heat spreaders.
Memory Cooling
Active cooling method
forcing some kind of cooling medium
(air or water) around the RAM chips
themselves or around their heat
sinks.
Hard Drive Cooling
expansion bay.
Chipset Cooling
CPU Cooling
CPU generate enough heat can burn them self
most motherboards have an internal CPU heat
sensor and a CPU_FAN sensor.
There are a few different types of CPU cooling
methods
Air cooling
Advanced cooling methods.
Liquid Cooling
Heat Pipes
Peltier Cooling Devices
Phase-Change Cooling
Liquid Nitrogen and Helium Cooling
Air cooling

adjustable rheostat
Thermal grease
Its also called thermal transfer compound or
simply thermal compound (alternativelythermal
paste)
Its a compound that helps to bridge the
extremely small gaps between the CPU and the
heat sink, which avoids superheated pockets of
air that can lead to focal damage of the CPU.
Apply the compound by placing a bead in the
center of the heat sink
it is a smart idea to remove the heat sink and old
thermal compound and then apply
fresh thermal compound and reattach the heat
sink.
Be careful, though; if your thermal paste has
already turned into thermal glue, you can wrench
the processor right out of the socket, even with the
release mechanism locked in place. Invariably, this
damages the pins on the chip.

If your new heat sink has a patch of thermal compound preapplied, dont add
Advanced CPU Cooling
Methods
which is a stack of thin aluminum fins
with copper tubing running up
through them.
Liquid Cooling
Advantages
more efficient than air
cooling
silence
Disadvantages
more expensive
The relative
complexity of installing
liquid cooling systems
danger of liquids in CPU
close proximity to
electronics
Heat Pipes
A heat pipe is a simple device that can
quickly transfer heat from one point to
another.
They are often referred to as the
"superconductors"
Laptop computers often using small
heat pipes to conduct heat away
from the CPU
A tubular device that is very efficient in
transferring heat.
Using a metal container (aluminum, copper,
etc.) that holds a liquid (water, acetone, etc.)
under pressure, the inner surface of the tube
is lined with a porous material that acts as a
wick.
When heat is applied to the outer area of the
tube, the liquid inside the tube boils and
vaporizes into a gas that moves through the
tube seeking a cooler location where it
condenses.
Using capillary action, the wick transports the
condensed liquid back to the evaporation area
A graphics card with a
heatpipe cooler design.
Peltier Cooling Devices
Thermoelectric(TEC)
Transfer of heat from one side
of the element, made of one
material, to the other side,
made of a different material.
Thus, they have a hot side and
a cold side.
The cold side should always be
against the CPU surface, and
optimally, the hot side should
be mated with a heat sink or
water block for heat dissipation.
Consequently, TECs are not
meant to replace air-cooling
mechanisms but to
complement them.
Coolermaster V10 Hybrid
T.E.C. CPU Cooler

Price: $129.99

One of the downsides to TECs is the likelihood of condensation because of the


sub ambient temperatures these devices produce.
Closed-cell foams can be used to guard against damage from condensation.
Phase-Change Cooling
This type of cooling, the cooling effect from the change of a
liquid to a gas is used to cool the inside of a PC.
very expensive method of cooling
Normal CPU temperatures between (40C and 50C).
It is possible to get CPU temps in the range of (20C).
higher-humidity conditions, condensation can be a problem.
(shorting out the electronics)
Liquid Nitrogen and
Helium Cooling
It is possible to get CPU
temps in the range From
100 to 240 degrees
The results are short-lived
and only useful in
overclocking with a view to
setting records.
The processor is not likely to
survive the incident, due to
the internal stress from the
extreme temperature
changes.

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