This document presents a computational fluid dynamics (CFD) analysis of different heat sink shield profiles for electronic cooling. Three shield profiles - trapezoidal with curved inclination, trapezoidal with plane inclination, and slope shield - were modeled and simulated under a heat load of 75W. The trapezoidal shield with curved inclination achieved the lowest maximum temperature of 325.58K, highest heat transfer coefficient of 29.32, and highest surface Nusselt number of 1211.604, indicating it has the best thermal performance of the three profiles analyzed.