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Memory and Processor
Testing
By:
Sudhanshu Janwadkar
Introduction
• Embedded Processor Cores are used in many systems
• Core based design offer advantages such as : reuse &
Portability
• Design that include processor cores present new
challenges for testing as access to these embedded
processor
• Restrictions from access to pins of SoC
Processor Testing Architecture
LFSR
M
F
S
R
CORE
Instruction
Decode
Logic
TRAM
SRAM
Self
Test
• Processor Self
Test Program
Processor
Description
TRAM consists of:
• A Program and pattern for testing the Processor
• A random Pattern Generator
• Program and pattern for testing Embedded Memories
• Program for testing other cores using UML(Unified Modeling
Language) etc
Description(contd..)
• The program consists of normal instructions that are executed
by processor core.
• The Data is provided by random pattern generated by LFSR
• Faults are targeted during component test generation of the
processor core.
• Component test of the core can be provided as deterministic
or random pattern
• Memory Architecture & Fault Models
• DC / AC / Dynamic Tests
• Built-in Self Testing Schemes
• BIST architecture
Memory Testing
Memory architecture
Fault models
• Stuck-At Fault :-
The logic value of a cell or a line is always 0 or 1.
• Transition Fault :-
A cell or a line that fails to undergo a 0 1 or a 1 0 Transition .
• Coupling Fault :-
A write operation to one cell changes the content of a
second cell.
Neighborhood Pattern Sensitive Fault :-
The content of a cell, or the ability to
change its content, is influenced by the contents of some other cells
in the memory.
Address Decoder Fault (AF) :-
 With a certain address, no cell will be accessed and a certain cell is
never accessed.
 With a certain address, multiple cells are accessed
simultaneously.
 A certain cell can be accessed by multiple addresses.
DC Parametric Testing
• Open / Short test.
• Power consumption test.
• Leakage test.
• Threshold test.
• Output drive current test.
• Output short current test.
AC Parametric Testing
• Output signal: -
the rise & fall times.
• Relationship between input signals:–
the setup & hold times.
• Relationship between input and output signals:–
the delay & access times.
• Successive relationship between input and output signals:–
the speed test.
Dynamic Faults
• Recovery faults:
− Sense amplifier recovery
− Write recovery.
• Retention faults:
− Sleeping sickness
− Refresh line stuck-at
− Static data loss.
• Bit-line precharge voltage imbalance faults.
BIST: Built In Self Testing
 Advantages:
– Minimal use of testers.
– Can be used for embedded RAMs.
 Disadvantages:
– Silicon area overhead.
– Speed; slow access time.
– Extra pins or multiplexing pins.
– Testability of the test hardware itself.
– A high fault coverage is a challenge.
Typical Memory BISTArchitecture
Thank You

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Memory and Processor Testing

  • 2. Introduction • Embedded Processor Cores are used in many systems • Core based design offer advantages such as : reuse & Portability • Design that include processor cores present new challenges for testing as access to these embedded processor • Restrictions from access to pins of SoC
  • 4. Description TRAM consists of: • A Program and pattern for testing the Processor • A random Pattern Generator • Program and pattern for testing Embedded Memories • Program for testing other cores using UML(Unified Modeling Language) etc
  • 5. Description(contd..) • The program consists of normal instructions that are executed by processor core. • The Data is provided by random pattern generated by LFSR • Faults are targeted during component test generation of the processor core. • Component test of the core can be provided as deterministic or random pattern
  • 6. • Memory Architecture & Fault Models • DC / AC / Dynamic Tests • Built-in Self Testing Schemes • BIST architecture Memory Testing
  • 8. Fault models • Stuck-At Fault :- The logic value of a cell or a line is always 0 or 1. • Transition Fault :- A cell or a line that fails to undergo a 0 1 or a 1 0 Transition . • Coupling Fault :- A write operation to one cell changes the content of a second cell.
  • 9. Neighborhood Pattern Sensitive Fault :- The content of a cell, or the ability to change its content, is influenced by the contents of some other cells in the memory. Address Decoder Fault (AF) :-  With a certain address, no cell will be accessed and a certain cell is never accessed.  With a certain address, multiple cells are accessed simultaneously.  A certain cell can be accessed by multiple addresses.
  • 10. DC Parametric Testing • Open / Short test. • Power consumption test. • Leakage test. • Threshold test. • Output drive current test. • Output short current test.
  • 11. AC Parametric Testing • Output signal: - the rise & fall times. • Relationship between input signals:– the setup & hold times. • Relationship between input and output signals:– the delay & access times. • Successive relationship between input and output signals:– the speed test.
  • 12. Dynamic Faults • Recovery faults: − Sense amplifier recovery − Write recovery. • Retention faults: − Sleeping sickness − Refresh line stuck-at − Static data loss. • Bit-line precharge voltage imbalance faults.
  • 13. BIST: Built In Self Testing  Advantages: – Minimal use of testers. – Can be used for embedded RAMs.  Disadvantages: – Silicon area overhead. – Speed; slow access time. – Extra pins or multiplexing pins. – Testability of the test hardware itself. – A high fault coverage is a challenge.