CEL PS9506-AX

In electronic components, the term "Mount" typically refers to the method or process of physically attaching or fixing a component onto a circuit board or other electronic device. This can involve soldering, adhesive bonding, or other techniques to secure the component in place. The mounting process is crucial for ensuring proper electrical connections and mechanical stability within the electronic system. Different components may have specific mounting requirements based on their size, shape, and function, and manufacturers provide guidelines for proper mounting procedures to ensure optimal performance and reliability of the electronic device.

The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.

refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

The parameter "Supplier Device Package" in electronic components refers to the physical packaging or housing of the component as provided by the supplier. It specifies the form factor, dimensions, and layout of the component, which are crucial for compatibility and integration into electronic circuits and systems. The supplier device package information typically includes details such as the package type (e.g., DIP, SOP, QFN), number of pins, pitch, and overall size, allowing engineers and designers to select the appropriate component for their specific application requirements. Understanding the supplier device package is essential for proper component selection, placement, and soldering during the manufacturing process to ensure optimal performance and reliability of the electronic system.

The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures

The Maximum Operating Temperature is the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

The "Min Operating Temperature" parameter in electronic components refers to the lowest temperature at which the component is designed to operate effectively and reliably. This parameter is crucial for ensuring the proper functioning and longevity of the component, as operating below this temperature may lead to performance issues or even damage. Manufacturers specify the minimum operating temperature to provide guidance to users on the environmental conditions in which the component can safely operate. It is important to adhere to this parameter to prevent malfunctions and ensure the overall reliability of the electronic system.

The maximum power that the MOSFET can dissipate continuously under the specified thermal conditions.

The parameter "Approval Agency" in electronic components refers to the organization responsible for testing and certifying that a component meets specific safety, quality, and performance standards. These agencies evaluate products to ensure compliance with industry regulations and standards, providing assurance to manufacturers and consumers. Approval from recognized agencies can enhance a component's marketability and acceptance in various applications, particularly in sectors like automotive, aerospace, and healthcare. Common approval agencies include Underwriters Laboratories (UL), International Electrotechnical Commission (IEC), and the American National Standards Institute (ANSI).

Voltage - Isolation is a parameter in electronic components that refers to the maximum voltage that can be safely applied between two isolated points without causing electrical breakdown or leakage. It is a crucial specification for components such as transformers, optocouplers, and capacitors that require isolation to prevent electrical interference or safety hazards. The voltage isolation rating ensures that the component can withstand the specified voltage without compromising its performance or safety. It is typically measured in volts and is an important consideration when designing circuits that require isolation between different parts of the system.

The parameter "Voltage - Forward (Vf) (Typ)" in electronic components refers to the typical forward voltage drop across the component when it is conducting current in the forward direction. It is a crucial characteristic of components like diodes and LEDs, indicating the minimum voltage required for the component to start conducting current. The forward voltage drop is typically specified as a typical value because it can vary slightly based on factors such as temperature and manufacturing tolerances. Designers use this parameter to ensure that the component operates within its specified voltage range and to calculate power dissipation in the component.

the flight time of packets over the transmission link and is limited by the speed of light.

In electronic components, the parameter "Direction" refers to the orientation or alignment in which the component is designed to operate effectively. This parameter is particularly important for components such as diodes, transistors, and capacitors, which have specific polarity or orientation requirements for proper functionality. For example, diodes allow current flow in one direction only, so their direction parameter indicates the correct orientation for current flow. Similarly, polarized capacitors have a positive and negative terminal, requiring proper alignment for correct operation. Understanding and adhering to the direction parameter is crucial for ensuring the reliable and efficient performance of electronic components in a circuit.

Output Current per Channel is a specification commonly found in electronic components such as amplifiers, audio interfaces, and power supplies. It refers to the maximum amount of electrical current that can be delivered by each individual output channel of the component. This parameter is important because it determines the capacity of the component to drive connected devices or loads. A higher output current per channel means the component can deliver more power to connected devices, while a lower output current may limit the performance or functionality of the component in certain applications. It is crucial to consider the output current per channel when selecting electronic components to ensure they can meet the power requirements of the intended system or setup.

Fall Time (Typ) is a parameter used to describe the time it takes for a signal to transition from a high level to a low level in an electronic component, such as a transistor or an integrated circuit. It is typically measured in nanoseconds or microseconds and is an important characteristic that affects the performance of the component in digital circuits. A shorter fall time indicates faster switching speeds and can result in improved overall circuit performance, such as reduced power consumption and increased data transmission rates. Designers often consider the fall time specification when selecting components for their circuits to ensure proper functionality and efficiency.

The parameter "Rise / Fall Time (Typ)" in electronic components refers to the time it takes for a signal to transition from a specified low level to a specified high level (rise time) or from a high level to a low level (fall time). It is typically measured in nanoseconds or picoseconds and is an important characteristic in determining the speed and performance of a component, such as a transistor or integrated circuit. A shorter rise/fall time indicates faster signal switching and can impact the overall speed and efficiency of a circuit. Designers often consider this parameter when selecting components for high-speed applications to ensure proper signal integrity and timing.

The parameter "Current - DC Forward (If) (Max)" in electronic components refers to the maximum forward current that can safely pass through the component without causing damage. This parameter is typically specified in datasheets for diodes and LEDs, indicating the maximum current that can flow through the component in the forward direction. Exceeding this maximum current rating can lead to overheating and potentially permanent damage to the component. It is important to ensure that the current flowing through the component does not exceed this specified maximum to maintain proper functionality and reliability.

Propagation delay tpLH and tpHL refer to the time it takes for a digital signal to travel through a logic gate or other electronic component. tpLH is the maximum time delay for the output to transition from a low state to a high state, while tpHL is the maximum time delay for the output to transition from a high state to a low state. These parameters are critical for determining the speed and timing performance of digital circuits, as they impact how quickly signals can propagate through the system and affect overall operation.

Common Mode Transient Immunity (Min) is a parameter that measures the ability of an electronic component to withstand and reject common mode noise or interference signals. Common mode noise refers to unwanted signals that are present on both input and output lines of a component. The minimum value of Common Mode Transient Immunity indicates the minimum level of noise or interference that the component can tolerate without affecting its performance. A higher Common Mode Transient Immunity value signifies better protection against common mode noise, ensuring reliable operation of the component in noisy environments. It is an important specification to consider when designing circuits that are exposed to external disturbances or electromagnetic interference.

Pulse Width Distortion (Max) is a parameter that measures the maximum deviation in the width of a pulse signal from its ideal or expected width. In electronic components such as integrated circuits or signal generators, pulse width distortion can occur due to various factors like signal propagation delays, component tolerances, or noise interference. This parameter is important because it indicates the level of accuracy and consistency in generating or processing pulse signals. A lower value of Pulse Width Distortion (Max) signifies better performance and reliability of the electronic component in maintaining the desired pulse width.

Voltage - Output Supply is a parameter in electronic components that refers to the voltage level required to power the device and provide the necessary output. It specifies the voltage range within which the component can operate effectively and safely. This parameter is crucial for ensuring proper functionality and performance of the electronic component. It is important to match the output supply voltage with the specified requirements to prevent damage to the component and ensure reliable operation.

Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.