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CMOS-compatible Strain Engineering for High-Performance Monolayer Semiconductor Transistors
Authors:
Marc Jaikissoon,
Çağıl Köroğlu,
Jerry A. Yang,
Kathryn M. Neilson,
Krishna C. Saraswat,
Eric Pop
Abstract:
Strain engineering has played a key role in modern silicon electronics, having been introduced as a mobility booster in the 1990s and commercialized in the early 2000s. Achieving similar advances with two-dimensional (2D) semiconductors in a CMOS (complementary metal oxide semiconductor) compatible manner would radically improve the industrial viability of 2D transistors. Here, we show silicon nit…
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Strain engineering has played a key role in modern silicon electronics, having been introduced as a mobility booster in the 1990s and commercialized in the early 2000s. Achieving similar advances with two-dimensional (2D) semiconductors in a CMOS (complementary metal oxide semiconductor) compatible manner would radically improve the industrial viability of 2D transistors. Here, we show silicon nitride capping layers can impart strain to monolayer MoS2 transistors on conventional silicon substrates, enhancing their electrical performance with a low thermal budget (350 °C), CMOS-compatible approach. Strained back-gated and dual-gated MoS2 transistors demonstrate median increases up to 60% and 45% in on-state current, respectively. The greatest improvements are found when both transistor channels and contacts are reduced to ~200 nm, reaching saturation currents of 488 uA/um, higher than any previous reports at such short contact pitch. Simulations reveal that most benefits arise from tensile strain lowering the contact Schottky barriers, and that further reducing device dimensions (including contacts) will continue to offer increased strain and performance improvements.
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Submitted 29 June, 2024; v1 submitted 15 May, 2024;
originally announced May 2024.
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Toward Mass-Production of Transition Metal Dichalcogenide Solar Cells: Scalable Growth of Photovoltaic-Grade Multilayer WSe2 by Tungsten Selenization
Authors:
Kathryn M. Neilson,
Sarallah Hamtaei,
Koosha Nassiri Nazif,
Joshua M. Carr,
Sepideh Rahimisheikh,
Frederick U. Nitta,
Guy Brammertz,
Jeffrey L. Blackburn,
Joke Hadermann,
Krishna C. Saraswat,
Obadiah G. Reid,
Bart Vermang,
Alwin Daus,
Eric Pop
Abstract:
Semiconducting transition metal dichalcogenides (TMDs) are promising for high-specific-power photovoltaics due to desirable band gaps, high absorption coefficients, and ideally dangling-bond-free surfaces. Despite their potential, the majority of TMD solar cells are fabricated in a non-scalable fashion using exfoliated materials due to the absence of high-quality, large-area, multilayer TMDs. Here…
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Semiconducting transition metal dichalcogenides (TMDs) are promising for high-specific-power photovoltaics due to desirable band gaps, high absorption coefficients, and ideally dangling-bond-free surfaces. Despite their potential, the majority of TMD solar cells are fabricated in a non-scalable fashion using exfoliated materials due to the absence of high-quality, large-area, multilayer TMDs. Here, we present the scalable, thickness-tunable synthesis of multilayer tungsten diselenide (WSe$_{2}$) films by selenizing pre-patterned tungsten with either solid source selenium or H$_{2}$Se precursors, which leads to smooth, wafer-scale WSe$_{2}$ films with a layered van der Waals structure. The films have charge carrier lifetimes up to 144 ns, over 14x higher than large-area TMD films previously demonstrated. Such high carrier lifetimes correspond to power conversion efficiency of ~22% and specific power of ~64 W g$^{-1}$ in a packaged solar cell, or ~3 W g$^{-1}$ in a fully-packaged solar module. This paves the way for the mass-production of high-efficiency multilayer WSe$_{2}$ solar cells at low cost.
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Submitted 13 February, 2024;
originally announced February 2024.
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Enhanced Meta-Displays Using Advanced Phase-Change Materials
Authors:
Omid Hemmatyar,
Sajjad Abdollahramezani,
Ioannis Zeimpekis,
Sergey Lepeshov,
Alex Krasnok,
Asir Intisar Khan,
Kathryn M. Neilson,
Christian Teichrib,
Tyler Brown,
Eric Pop,
Daniel W. Hewak,
Matthias Wuttig,
Andrea Alu,
Otto L. Muskens,
Ali Adibi
Abstract:
Structural colors generated due to light scattering from static all-dielectric metasurfaces have successfully enabled high-resolution, high-saturation, and wide-gamut color printing applications. Despite recent advances, most demonstrations of these structure-dependent colors lack post-fabrication tunability. This hinders their applicability for front-end dynamic display technologies. Phase-change…
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Structural colors generated due to light scattering from static all-dielectric metasurfaces have successfully enabled high-resolution, high-saturation, and wide-gamut color printing applications. Despite recent advances, most demonstrations of these structure-dependent colors lack post-fabrication tunability. This hinders their applicability for front-end dynamic display technologies. Phase-change materials (PCMs), with significant contrast of their optical properties between their amorphous and crystalline states, have demonstrated promising potentials in reconfigurable nanophotonics. Herein, we leverage tunable all-dielectric reflective metasurfaces made of newly emerged classes of low-loss optical PCMs, i.e., antimony trisulphide (Sb$_2$S$_3$) and antimony triselenide (Sb$_2$Se$_3$), with superb characteristics to realize switchable, high-saturation, high-efficiency and high-resolution dynamic meta-pixels. Exploiting polarization-sensitive building blocks, the presented meta-pixel can generate two different colors when illuminated by either one of two orthogonally polarized incident beams. Such degrees of freedom (i.e., material phase and polarization state) enable a single reconfigurable metasurface with fixed geometrical parameters to generate four distinct wide-gamut colors. We experimentally demonstrate, for the first time, an electrically-driven micro-scale display through the integration of phase-change metasurfaces with an on-chip heater formed by transparent conductive oxide. Our experimental findings enable a versatile platform suitable for a wide range of applications, including tunable full-color printing, enhanced dynamic displays, information encryption, and anti-counterfeiting.
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Submitted 19 July, 2021;
originally announced July 2021.
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Lateral Transport and Field-Effect Characteristics of Sputtered P-Type Chalcogenide Thin Films
Authors:
Sumaiya Wahid,
Alwin Daus,
Asir Intisar Khan,
Victoria Chen,
Kathryn M. Neilson,
Mahnaz Islam,
Eric Pop
Abstract:
Investigating lateral electrical transport in p-type thin film chalcogenides is important to evaluate their potential for field-effect transistors (FETs) and phase-change memory applications. For instance, p-type FETs with sputtered materials at low temperature (<= 250 C) could play a role in flexible electronics or back-end-of-line (BEOL) silicon-compatible processes. Here, we explore lateral tra…
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Investigating lateral electrical transport in p-type thin film chalcogenides is important to evaluate their potential for field-effect transistors (FETs) and phase-change memory applications. For instance, p-type FETs with sputtered materials at low temperature (<= 250 C) could play a role in flexible electronics or back-end-of-line (BEOL) silicon-compatible processes. Here, we explore lateral transport in chalcogenide films (Sb2Te3, Ge2Sb2Te5, Ge4Sb6Te7) and multilayers, with Hall measurements (in <= 50 nm thin films) and with p-type transistors (in <= 5 nm ultrathin films). The highest Hall mobilities are measured for Sb2Te3/GeTe superlattices (~18 cm2/V/s at room temperature), over 2-3x higher than the other films. In ultrathin p-type FETs with Ge2Sb2Te5, we achieve field-effect mobility up to ~5.5 cm2/V/s with current on/off ratio ~10000, the highest for Ge2Sb2Te5 transistors to date. We also explore process optimizations (e.g., AlOx capping layer, type of developer for lithography) and uncover their trade-offs towards the realization of p-type transistors with acceptable mobility and on/off current ratio. Our study provides essential insights into the optimization of electronic devices based on p-type chalcogenides.
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Submitted 17 July, 2021;
originally announced July 2021.
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Fragility of Fermi arcs in Dirac semimetals
Authors:
Yun Wu,
Na Hyun Jo,
Lin-Lin Wang,
Connor A. Schmidt,
Kathryn M. Neilson,
Benjamin Schrunk,
Przemyslaw Swatek,
Andrew Eaton,
S. L. Bud'ko,
P. C. Canfield,
Adam Kaminski
Abstract:
We use tunable, vacuum ultraviolet laser-based angle-resolved photoemission spectroscopy and density functional theory calculations to study the electronic properties of Dirac semimetal candidate cubic PtBi${}_{2}$. In addition to bulk electronic states we also find surface states in PtBi${}_{2}$ which is expected as PtBi${}_{2}$ was theoretical predicated to be a candidate Dirac semimetal. The su…
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We use tunable, vacuum ultraviolet laser-based angle-resolved photoemission spectroscopy and density functional theory calculations to study the electronic properties of Dirac semimetal candidate cubic PtBi${}_{2}$. In addition to bulk electronic states we also find surface states in PtBi${}_{2}$ which is expected as PtBi${}_{2}$ was theoretical predicated to be a candidate Dirac semimetal. The surface states are also well reproduced from DFT band calculations. Interestingly, the topological surface states form Fermi contours rather than double Fermi arcs that were observed in Na$_3$Bi. The surface bands forming the Fermi contours merge with bulk bands in proximity of the Dirac points projections, as expected. Our data confirms existence of Dirac states in PtBi${}_{2}$ and reveals the fragility of the Fermi arcs in Dirac semimetals. Because the Fermi arcs are not topologically protected in general, they can be deformed into Fermi contours, as proposed by [Kargarian {\it et al.}, PNAS \textbf{113}, 8648 (2016)]. Our results demonstrate validity of this theory in PtBi${}_{2}$.
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Submitted 5 April, 2019;
originally announced April 2019.
