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Inter-pixel cross-talk as background to two-photon interference effects in SPAD arrays
Authors:
Sergei Kulkov,
Tereza Potuckova,
Ermanno Bernasconi,
Claudio Bruschini,
Tommaso Milanese,
Edoardo Charbon,
Mst Shamim Ara Shawkat,
Andrei Nomerotski,
Peter Svihra
Abstract:
Cross-talk is a well-known feature of single-photon avalanche detectors. It is especially important to account for this effect in applications involving coincidences of two or more photons registered by the sensor since in this case the cross-talk may mimic the useful signal. In this work, we characterize the cross-talk of the LinoSPAD2 detector, as well as perform joint measurements of the cross-…
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Cross-talk is a well-known feature of single-photon avalanche detectors. It is especially important to account for this effect in applications involving coincidences of two or more photons registered by the sensor since in this case the cross-talk may mimic the useful signal. In this work, we characterize the cross-talk of the LinoSPAD2 detector, as well as perform joint measurements of the cross-talk and Hanbury Brown - Twiss two-photon interference, comparing and cross-calibrating both effects. With a median dark count rate of 125 cps/pixel, we report the average cross-talk probability of $0.22~\%$ for the nearest neighbor and also observe a long-range cross-talk of the order $2 \cdot 10^{-5}~\%$ for channels separated by up to 20 pixels.
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Submitted 30 June, 2024; v1 submitted 21 June, 2024;
originally announced June 2024.
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Multifrequency-resolved Hanbury Brown-Twiss Effect
Authors:
Joseph Ferrantini,
Jesse Crawford,
Sergei Kulkov,
Jakub Jirsa,
Aaron Mueninghoff,
Lucas Lawrence,
Stephen Vintskevich,
Tommaso Milanese,
Samuel Burri,
Ermanno Bernasconi,
Claudio Bruschini,
Michal Marcisovsky,
Peter Svihra,
Andrei Nomerotski,
Paul Stankus,
Edoardo Charbon,
Raphael A. Abrahao
Abstract:
The Hanbury Brown-Twiss (HBT) effect holds a pivotal place in intensity interferometry and gave a seminal contribution to the development of quantum optics. To observe such an effect, both good spectral and timing resolutions are necessary. Most often, the HBT effect is observed for a single frequency at a time, due to limitations in dealing with multifrequencies simultaneously, halting and limiti…
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The Hanbury Brown-Twiss (HBT) effect holds a pivotal place in intensity interferometry and gave a seminal contribution to the development of quantum optics. To observe such an effect, both good spectral and timing resolutions are necessary. Most often, the HBT effect is observed for a single frequency at a time, due to limitations in dealing with multifrequencies simultaneously, halting and limiting some applications. Here, we report a fast and data-driven spectrometer built with a one-dimensional array of single-photon-sensitive avalanche diodes. We report observing the HBT effect for multifrequencies at the same time. Specifically, we observed the HBT for up to 5 lines of the Ne spectrum, but this can be improved even further. Our work represents a major step to make spectral binning and multifrequencies HBT more widely available. The technology we present can benefit both classical and quantum applications.
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Submitted 19 June, 2024;
originally announced June 2024.
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The LHCb VELO Upgrade Module Construction
Authors:
K. Akiba,
M. Alexander,
C. Bertella,
A. Biolchini,
A. Bitadze,
G. Bogdanova,
S. Borghi,
T. J. V. Bowcock,
K. Bridges,
M. Brock,
A. T. Burke,
J. Buytaert,
W. Byczynski,
J. Carroll,
V. Coco,
P. Collins,
A. Davis,
O. De Aguiar Francisco,
K. De Bruyn,
S. De Capua,
K. De Roo,
F. Doherty,
L. Douglas,
L. Dufour,
R. Dumps
, et al. (62 additional authors not shown)
Abstract:
The LHCb detector has undergone a major upgrade for LHC Run 3. This Upgrade I detector facilitates operation at higher luminosity and utilises full-detector information at the LHC collision rate, critically including the use of vertex information. A new vertex locator system, the VELO Upgrade, has been constructed. The core element of the new VELO are the double-sided pixelated hybrid silicon dete…
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The LHCb detector has undergone a major upgrade for LHC Run 3. This Upgrade I detector facilitates operation at higher luminosity and utilises full-detector information at the LHC collision rate, critically including the use of vertex information. A new vertex locator system, the VELO Upgrade, has been constructed. The core element of the new VELO are the double-sided pixelated hybrid silicon detector modules which operate in vacuum close to the LHC beam in a high radiation environment. The construction and quality assurance tests of these modules are described in this paper. The modules incorporate 200 \mum thick, n-on-p silicon sensors bump-bonded to 130 \nm technology ASICs. These are attached with high precision to a silicon microchannel substrate that uses evaporative CO$_2$ cooling. The ASICs are controlled and read out with flexible printed circuits that are glued to the substrate and wire-bonded to the chips. The mechanical support of the module is given by a carbon fibre plate, two carbon fibre rods and an aluminium plate. The sensor attachment was achieved with an average precision of 21 $\mathrm{μm}$, more than 99.5\% of all pixels are fully functional, and a thermal figure of merit of 3 \mathrm{Kcm^{2}W^{-1}}$ was achieved. The production of the modules was successfully completed in 2021, with the final assembly and installation completed in time for data taking in 2022.
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Submitted 21 April, 2024;
originally announced April 2024.
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Pixel detector hybridization and integration with anisotropic conductive adhesives
Authors:
Alexander Volker,
Janis Viktor Schmidt,
Dominik Dannheim,
Peter Svihra,
Mateus Vicente Barreto Pinto,
Rui de Oliveira,
Justus Braach,
Xiao Yang,
Marie Ruat,
Débora Magalhaes,
Matteo Centis Vignali,
Giovanni Calderini,
Helge Kristiansen
Abstract:
A reliable and cost-effective interconnect technology is required for the development of hybrid pixel detectors. The interconnect technology needs to be adapted for the pitch and die sizes of the respective applications. For small-scale applications and during the ASIC and sensor development phase, interconnect technologies must also be suitable for the assembly of single-dies typically available…
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A reliable and cost-effective interconnect technology is required for the development of hybrid pixel detectors. The interconnect technology needs to be adapted for the pitch and die sizes of the respective applications. For small-scale applications and during the ASIC and sensor development phase, interconnect technologies must also be suitable for the assembly of single-dies typically available from Multi-Project-Wafer submissions. Within the CERN EP R&D program and the AIDAinnova collaboration, innovative and scalable hybridization concepts are under development for pixel-detector applications in future colliders. This contribution presents recent results of a newly developed in-house single-die interconnection process based on Anisotropic Conductive Adhesives (ACA). The ACA interconnect technology replaces solder bumps with conductive micro-particles embedded in an epoxy layer applied as either film or paste. The electro-mechanical connection between the sensor and ASIC is achieved via thermocompression of the ACA using a flip-chip device bonder. A specific pixel-pad topology is required to enable the connection via micro-particles and create cavities into which excess epoxy can flow. This pixel-pad topology is achieved with an in-house Electroless Nickel Immersion Gold process that is also under development within the project. The ENIG and ACA processes are qualified with a variety of different ASICs, sensors, and dedicated test structures, with pad diameters ranging from 12 μm to 140 μm and pitches between 20 μm and 1.3 mm. The produced assemblies are characterized electrically, with radioactive-source exposures, and in tests with high-momentum particle beams. A focus is placed on recent optimization of the plating and interconnect processes, resulting in an improved plating uniformity and interconnect yield.
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Submitted 18 March, 2024; v1 submitted 15 December, 2023;
originally announced December 2023.
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Test-beam Performance Results of the FASTPIX Sub-Nanosecond CMOS Pixel Sensor Demonstrator
Authors:
Justus Braach,
Eric Buschmann,
Dominik Dannheim,
Katharina Dort,
Thanushan Kugathasan,
Magdalena Munker,
Walter Snoeys,
Peter Švihra,
Mateus Vicente
Abstract:
Within the ATTRACT FASTPIX project, a monolithic pixel sensor demonstrator chip has been developed in a modified 180 nm CMOS imaging process technology, targeting sub-nanosecond timing precision for single ionising particles. It features a small collection electrode design on a 25 micrometers-thick epitaxial layer and contains 32 mini matrices of 68 hexagonal pixels each, with pixel pitches rangin…
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Within the ATTRACT FASTPIX project, a monolithic pixel sensor demonstrator chip has been developed in a modified 180 nm CMOS imaging process technology, targeting sub-nanosecond timing precision for single ionising particles. It features a small collection electrode design on a 25 micrometers-thick epitaxial layer and contains 32 mini matrices of 68 hexagonal pixels each, with pixel pitches ranging from 8.66 to 20 micrometers. Four pixels are transmitting an analog output signal and 64 are transmitting binary hit information. Various design variations are explored, aiming at accelerating the charge collection and making the timing of the charge collection more uniform over the pixel area. Signal treatment of the analog waveforms, as well as reconstruction of digital position, time and charge information, is carried out off-chip. This contribution introduces the design of the sensor and readout system and presents performance results for various pixel designs achieved in recent test beam measurements with external tracking and timing reference detectors. A time resolution below 150 ps is obtained at full efficiency for all pixel pitches.
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Submitted 25 September, 2023; v1 submitted 9 June, 2023;
originally announced June 2023.
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The LHCb upgrade I
Authors:
LHCb collaboration,
R. Aaij,
A. S. W. Abdelmotteleb,
C. Abellan Beteta,
F. Abudinén,
C. Achard,
T. Ackernley,
B. Adeva,
M. Adinolfi,
P. Adlarson,
H. Afsharnia,
C. Agapopoulou,
C. A. Aidala,
Z. Ajaltouni,
S. Akar,
K. Akiba,
P. Albicocco,
J. Albrecht,
F. Alessio,
M. Alexander,
A. Alfonso Albero,
Z. Aliouche,
P. Alvarez Cartelle,
R. Amalric,
S. Amato
, et al. (1298 additional authors not shown)
Abstract:
The LHCb upgrade represents a major change of the experiment. The detectors have been almost completely renewed to allow running at an instantaneous luminosity five times larger than that of the previous running periods. Readout of all detectors into an all-software trigger is central to the new design, facilitating the reconstruction of events at the maximum LHC interaction rate, and their select…
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The LHCb upgrade represents a major change of the experiment. The detectors have been almost completely renewed to allow running at an instantaneous luminosity five times larger than that of the previous running periods. Readout of all detectors into an all-software trigger is central to the new design, facilitating the reconstruction of events at the maximum LHC interaction rate, and their selection in real time. The experiment's tracking system has been completely upgraded with a new pixel vertex detector, a silicon tracker upstream of the dipole magnet and three scintillating fibre tracking stations downstream of the magnet. The whole photon detection system of the RICH detectors has been renewed and the readout electronics of the calorimeter and muon systems have been fully overhauled. The first stage of the all-software trigger is implemented on a GPU farm. The output of the trigger provides a combination of totally reconstructed physics objects, such as tracks and vertices, ready for final analysis, and of entire events which need further offline reprocessing. This scheme required a complete revision of the computing model and rewriting of the experiment's software.
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Submitted 17 May, 2023;
originally announced May 2023.
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Digital Pixel Test Structures implemented in a 65 nm CMOS process
Authors:
Gianluca Aglieri Rinella,
Anton Andronic,
Matias Antonelli,
Mauro Aresti,
Roberto Baccomi,
Pascal Becht,
Stefania Beole,
Justus Braach,
Matthew Daniel Buckland,
Eric Buschmann,
Paolo Camerini,
Francesca Carnesecchi,
Leonardo Cecconi,
Edoardo Charbon,
Giacomo Contin,
Dominik Dannheim,
Joao de Melo,
Wenjing Deng,
Antonello di Mauro,
Jan Hasenbichler,
Hartmut Hillemanns,
Geun Hee Hong,
Artem Isakov,
Antoine Junique,
Alex Kluge
, et al. (27 additional authors not shown)
Abstract:
The ALICE ITS3 (Inner Tracking System 3) upgrade project and the CERN EP R&D on monolithic pixel sensors are investigating the feasibility of the Tower Partners Semiconductor Co. 65 nm process for use in the next generation of vertex detectors. The ITS3 aims to employ wafer-scale Monolithic Active Pixel Sensors thinned down to 20 to 40 um and bent to form truly cylindrical half barrels. Among the…
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The ALICE ITS3 (Inner Tracking System 3) upgrade project and the CERN EP R&D on monolithic pixel sensors are investigating the feasibility of the Tower Partners Semiconductor Co. 65 nm process for use in the next generation of vertex detectors. The ITS3 aims to employ wafer-scale Monolithic Active Pixel Sensors thinned down to 20 to 40 um and bent to form truly cylindrical half barrels. Among the first critical steps towards the realisation of this detector is to validate the sensor technology through extensive characterisation both in the laboratory and with in-beam measurements. The Digital Pixel Test Structure (DPTS) is one of the prototypes produced in the first sensor submission in this technology and has undergone a systematic measurement campaign whose details are presented in this article.
The results confirm the goals of detection efficiency and non-ionising and ionising radiation hardness up to the expected levels for ALICE ITS3 and also demonstrate operation at +20 C and a detection efficiency of 99% for a DPTS irradiated with a dose of $10^{15}$ 1 MeV n$_{\mathrm{eq}}/$cm$^2$. Furthermore, spatial, timing and energy resolutions were measured at various settings and irradiation levels.
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Submitted 10 July, 2023; v1 submitted 16 December, 2022;
originally announced December 2022.
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Intensified Tpx3Cam, a fast data-driven optical camera with nanosecond timing resolution for single photon detection in quantum applications
Authors:
Andrei Nomerotski,
Matthew Chekhlov,
Denis Dolzhenko,
Rene Glazenborg,
Brianna Farella,
Michael Keach,
Ryan Mahon,
Dmitry Orlov,
Peter Svihra
Abstract:
We describe a fast data-driven optical camera, Tpx3Cam, with nanosecond scale timing resolution and 80 Mpixel/sec throughput. After the addition of intensifier, the camera is single photon sensitive with quantum efficiency determined primarily by the intensifier photocathode. The single photon performance of the camera was characterized with results on the gain, timing resolution and afterpulsing…
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We describe a fast data-driven optical camera, Tpx3Cam, with nanosecond scale timing resolution and 80 Mpixel/sec throughput. After the addition of intensifier, the camera is single photon sensitive with quantum efficiency determined primarily by the intensifier photocathode. The single photon performance of the camera was characterized with results on the gain, timing resolution and afterpulsing reported here. The intensified camera was successfully used for measurements in a variety of applications including quantum applications. As an example of such application, which requires simultaneous detection of multiple photons, we describe registration of photon pairs from the spontaneous parametric down-conversion source in a spectrometer. We measured the photon wavelength and timing with respective precisions of 0.15~nm and 3~ns, and also demonstrated that the two photons are anti-correlated in energy.
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Submitted 23 November, 2022; v1 submitted 24 October, 2022;
originally announced October 2022.
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Pixel detector hybridisation with Anisotropic Conductive Films
Authors:
J. V. Schmidt,
J. Braach,
D. Dannheim,
R. De Oliveira,
P. Svihra,
M. Vicente Barreto Pinto
Abstract:
Hybrid pixel detectors require a reliable and cost-effective interconnect technology adapted to the pitch and die sizes of the respective applications. During the ASIC and sensor R&D phase, and in general for small-scale applications, such interconnect technologies need to be suitable for the assembly of single-dies, typically available from Multi-Project-Wafer submissions. Within the CERN EP R&D…
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Hybrid pixel detectors require a reliable and cost-effective interconnect technology adapted to the pitch and die sizes of the respective applications. During the ASIC and sensor R&D phase, and in general for small-scale applications, such interconnect technologies need to be suitable for the assembly of single-dies, typically available from Multi-Project-Wafer submissions. Within the CERN EP R&D programme and the AIDAinnova collaboration, innovative hybridisation concepts targeting vertex-detector applications at future colliders are under development. This contribution presents recent results of a newly developed in-house single-die interconnection process based on Anisotropic Conductive Film (ACF). The ACF interconnect technology replaces the solder bumps with conductive particles embedded in an adhesive film. The electro-mechanical connection between the sensor and the read-out chip is achieved via thermo-compression of the ACF using a flip-chip device bonder. A specific pad topology is required to enable the connection via conductive particles and create cavities into which excess epoxy can flow. This pixel-pad topology is achieved with an in-house Electroless Nickel Immersion Gold (ENIG) plating process that is also under development within the project. The ENIG and ACF processes are qualified with the Timepix3 ASIC and sensors, with 55 um pixel pitch and 14 um pad diameter. The ACF technology can also be used for ASIC-PCB/FPC integration, replacing wire bonding or large-pitch solder bumping techniques. This contribution introduces the ENIG plating and ACF processes and presents recent results on Timepix3 hybrid assemblies.
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Submitted 24 October, 2022;
originally announced October 2022.
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Development of novel single-die hybridisation processes for small-pitch pixel detectors
Authors:
Peter Svihra,
Justus Braach,
Eric Buschmann,
Dominik Dannheim,
Katharina Dort,
Thomas Fritzsch,
Helge Kristiansen,
Mario Rothermund,
Janis Viktor Schmidt,
Mateus Vicente Barreto Pinto,
Morag Williams
Abstract:
Hybrid pixel detectors require a reliable and cost-effective interconnect technology adapted to the pitch and die sizes of the respective applications. During the ASIC and sensor R\&D phase, especially for small-scale applications, such interconnect technologies need to be suitable for the assembly of single dies, typically available from Multi-Project-Wafer submissions. Within the CERN EP R&D pro…
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Hybrid pixel detectors require a reliable and cost-effective interconnect technology adapted to the pitch and die sizes of the respective applications. During the ASIC and sensor R\&D phase, especially for small-scale applications, such interconnect technologies need to be suitable for the assembly of single dies, typically available from Multi-Project-Wafer submissions. Within the CERN EP R&D programme and the AIDAinnova collaboration, innovative hybridisation concepts targeting vertex-detector applications at future colliders are under development. Recent results of two novel interconnect methods for pixel pitches of 25um and 55um are presented in this contribution -- an industrial fine-pitch SnAg solder bump-bonding process adapted to single-die processing using support wafers, as well as a newly developed in-house single-die interconnection process based on ACF.
The fine-pitch bump-bonding process is qualified with hybrid assemblies from a recent bonding campaign at Frauenhofer IZM. Individual CLICpix2 ASICs with 25um pixel pitch were bump-bonded to active-edge silicon sensors with thicknesses ranging from 50um to 130um. The device characterisation was conducted in the laboratory as well as during a beam test campaign at the CERN SPS beam-line, demonstrating an interconnect yield of about 99.7%.
The ACF interconnect technology replaces the solder bumps by conductive micro-particles embedded in an epoxy film. The electro-mechanical connection between the sensor and ASIC is achieved via thermocompression of the ACF using a flip-chip device bonder. The required pixel pad topology is achieved with an in-house ENIG plating process. This newly developed ACF hybridisation process is first qualified with the Timepix3 ASICs and sensors with 55um pixel pitch. The technology can be also used for ASIC-PCB/FPC integration, replacing wire bonding or large-pitch solder bumping techniques.
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Submitted 5 October, 2022;
originally announced October 2022.
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Comparison of different sensor thicknesses and substrate materials for the monolithic small collection-electrode technology demonstrator CLICTD
Authors:
Katharina Dort,
Rafael Ballabriga,
Justus Braach,
Eric Buschmann,
Michael Campbell,
Dominik Dannheim,
Lennart Huth,
Iraklis Kremastiotis,
Jens Kröger,
Lucie Linssen,
Magdalena Munker,
Walter Snoeys,
Simon Spannagel,
Peter Švihra,
Tomas Vanat
Abstract:
Small collection-electrode monolithic CMOS sensors profit from a high signal-to-noise ratio and a small power consumption, but have a limited active sensor volume due to the fabrication process based on thin high-resistivity epitaxial layers. In this paper, the active sensor depth is investigated in the monolithic small collection-electrode technology demonstrator CLICTD. Charged particle beams ar…
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Small collection-electrode monolithic CMOS sensors profit from a high signal-to-noise ratio and a small power consumption, but have a limited active sensor volume due to the fabrication process based on thin high-resistivity epitaxial layers. In this paper, the active sensor depth is investigated in the monolithic small collection-electrode technology demonstrator CLICTD. Charged particle beams are used to study the charge-collection properties and the performance of devices with different thicknesses both for perpendicular and inclined particle incidence. In CMOS sensors with a high-resistivity Czochralski substrate, the depth of the sensitive volume is found to increase by a factor two in comparison with standard epitaxial material and leads to significant improvements in the hit-detection efficiency and the spatial and time resolution.
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Submitted 30 August, 2022; v1 submitted 22 April, 2022;
originally announced April 2022.
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Microchannel cooling for the LHCb VELO Upgrade I
Authors:
Oscar Augusto De Aguiar Francisco,
Wiktor Byczynski,
Kazu Akiba,
Claudia Bertella,
Alexander Bitadze,
Matthew Brock,
Bartosz Bulat,
Guillaume Button,
Jan Buytaert,
Stefano De Capua,
Riccardo Callegari,
Christine Castellana,
Andrea Catinaccio,
Catherine Charrier,
Collette Charvet,
Victor Coco,
Paula Collins,
Jordan Degrange,
Raphael Dumps,
Diego Alvarez Feito,
Julian Freestone,
Mariusz Jedrychowski,
Vinicius Franco Lima,
Abraham Gallas,
Wouter Hulsbergen
, et al. (35 additional authors not shown)
Abstract:
The LHCb VELO Upgrade I, currently being installed for the 2022 start of LHC Run 3, uses silicon microchannel coolers with internally circulating bi-phase \cotwo for thermal control of hybrid pixel modules operating in vacuum. This is the largest scale application of this technology to date. Production of the microchannel coolers was completed in July 2019 and the assembly into cooling structures…
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The LHCb VELO Upgrade I, currently being installed for the 2022 start of LHC Run 3, uses silicon microchannel coolers with internally circulating bi-phase \cotwo for thermal control of hybrid pixel modules operating in vacuum. This is the largest scale application of this technology to date. Production of the microchannel coolers was completed in July 2019 and the assembly into cooling structures was completed in September 2021. This paper describes the R\&D path supporting the microchannel production and assembly and the motivation for the design choices. The microchannel coolers have excellent thermal peformance, low and uniform mass, no thermal expansion mismatch with the ASICs and are radiation hard. The fluidic and thermal performance is presented.
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Submitted 23 December, 2021;
originally announced December 2021.
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Science Requirements and Detector Concepts for the Electron-Ion Collider: EIC Yellow Report
Authors:
R. Abdul Khalek,
A. Accardi,
J. Adam,
D. Adamiak,
W. Akers,
M. Albaladejo,
A. Al-bataineh,
M. G. Alexeev,
F. Ameli,
P. Antonioli,
N. Armesto,
W. R. Armstrong,
M. Arratia,
J. Arrington,
A. Asaturyan,
M. Asai,
E. C. Aschenauer,
S. Aune,
H. Avagyan,
C. Ayerbe Gayoso,
B. Azmoun,
A. Bacchetta,
M. D. Baker,
F. Barbosa,
L. Barion
, et al. (390 additional authors not shown)
Abstract:
This report describes the physics case, the resulting detector requirements, and the evolving detector concepts for the experimental program at the Electron-Ion Collider (EIC). The EIC will be a powerful new high-luminosity facility in the United States with the capability to collide high-energy electron beams with high-energy proton and ion beams, providing access to those regions in the nucleon…
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This report describes the physics case, the resulting detector requirements, and the evolving detector concepts for the experimental program at the Electron-Ion Collider (EIC). The EIC will be a powerful new high-luminosity facility in the United States with the capability to collide high-energy electron beams with high-energy proton and ion beams, providing access to those regions in the nucleon and nuclei where their structure is dominated by gluons. Moreover, polarized beams in the EIC will give unprecedented access to the spatial and spin structure of the proton, neutron, and light ions. The studies leading to this document were commissioned and organized by the EIC User Group with the objective of advancing the state and detail of the physics program and developing detector concepts that meet the emerging requirements in preparation for the realization of the EIC. The effort aims to provide the basis for further development of concepts for experimental equipment best suited for the science needs, including the importance of two complementary detectors and interaction regions.
This report consists of three volumes. Volume I is an executive summary of our findings and developed concepts. In Volume II we describe studies of a wide range of physics measurements and the emerging requirements on detector acceptance and performance. Volume III discusses general-purpose detector concepts and the underlying technologies to meet the physics requirements. These considerations will form the basis for a world-class experimental program that aims to increase our understanding of the fundamental structure of all visible matter
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Submitted 26 October, 2021; v1 submitted 8 March, 2021;
originally announced March 2021.
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Novel imaging technique for $α$-particles using a fast optical camera
Authors:
Gabriele D'Amen,
Michael Keach,
Andrei Nomerotski,
Peter Svihra,
Alessandro Tricoli
Abstract:
A new imaging technique for $α$-particles using a fast optical camera focused on a thin scintillator is presented. As $α$-particles interact in a thin layer of LYSO fast scintillator, they produce a localized flash of light. The light is collected with a lens to an intensified optical camera, Tpx3Cam, with single photon sensitivity and excellent spatial & temporal resolutions. The interactions of…
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A new imaging technique for $α$-particles using a fast optical camera focused on a thin scintillator is presented. As $α$-particles interact in a thin layer of LYSO fast scintillator, they produce a localized flash of light. The light is collected with a lens to an intensified optical camera, Tpx3Cam, with single photon sensitivity and excellent spatial & temporal resolutions. The interactions of photons with the camera is reconstructed by means of a custom algorithm, capable of discriminating single photons using time and spatial information.
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Submitted 28 October, 2020;
originally announced October 2020.
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Direct Observation of Ion Micromotion in a Linear Paul Trap
Authors:
Liudmila A. Zhukas,
Maverick J. Millican,
Peter Svihra,
Andrei Nomerotski,
Boris B. Blinov
Abstract:
In this paper, direct observation of micromotion for multiple ions in a laser-cooled trapped ion crystal is discussed along with a novel measurement technique for micromotion amplitude. Micromotion is directly observed using a time-resolving, single-photon sensitive camera that provides both fluorescence and position data for each ion on the nanosecond time scale. Micromotion amplitude and phase f…
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In this paper, direct observation of micromotion for multiple ions in a laser-cooled trapped ion crystal is discussed along with a novel measurement technique for micromotion amplitude. Micromotion is directly observed using a time-resolving, single-photon sensitive camera that provides both fluorescence and position data for each ion on the nanosecond time scale. Micromotion amplitude and phase for each ion in the crystal are measured, allowing this method to be sensitive to tilts and shifts of the ion chain from the null of the radiofrequency quadrupole potential in the linear trap. Spatial resolution makes this micromotion detection technique suitable for complex ion configurations, including two-dimensional geometries. It does not require any additional equipment or laser beams, and the modulation of the cooling lasers or trap voltages is not necessary for detection, as it is in other methods.
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Submitted 21 April, 2021; v1 submitted 30 September, 2020;
originally announced October 2020.
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The HEV Ventilator
Authors:
J. Buytaert,
A. Abed Abud,
P. Allport,
A. Pazos Álvarez,
K. Akiba,
O. Augusto de Aguiar Francisco,
A. Bay,
F. Bernard,
S. Baron,
C. Bertella,
J. Brunner,
T. Bowcock,
M. Buytaert-De Jode,
W. Byczynski,
R. De Carvalho,
V. Coco,
P. Collins,
R. Collins,
N. Dikic,
N. Dousse,
B. Dowd,
R. Dumps,
P. Durante,
W. Fadel,
S. Farry
, et al. (49 additional authors not shown)
Abstract:
HEV is a low-cost, versatile, high-quality ventilator, which has been designed in response to the COVID-19 pandemic. The ventilator is intended to be used both in and out of hospital intensive care units, and for both invasive and non-invasive ventilation. The hardware can be complemented with an external turbine for use in regions where compressed air supplies are not reliably available. The stan…
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HEV is a low-cost, versatile, high-quality ventilator, which has been designed in response to the COVID-19 pandemic. The ventilator is intended to be used both in and out of hospital intensive care units, and for both invasive and non-invasive ventilation. The hardware can be complemented with an external turbine for use in regions where compressed air supplies are not reliably available. The standard modes provided include PC-A/C(Pressure Assist Control),PC-A/C-PRVC(Pressure Regulated Volume Control), PC-PSV (Pressure Support Ventilation) and CPAP (Continuous Positive airway pressure). HEV is designed to support remote training and post market surveillance via a web interface and data logging to complement the standard touch screen operation, making it suitable for a wide range of geographical deployment. The HEV design places emphasis on the quality of the pressure curves and the reactivity of the trigger, delivering a global performance which will be applicable to ventilator needs beyond theCOVID-19 pandemic. This article describes the conceptual design and presents the prototype units together with their performance evaluation.
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Submitted 23 July, 2020;
originally announced July 2020.
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The Upgrade I of LHCb VELO -- towards an intelligent monitoring platform
Authors:
P. Kopciewicz,
T. Szumlak,
M. Majewski,
K. Akiba,
O. Augusto,
J. Back,
D. S. Bobulska,
G. Bogdanova,
S. Borghi,
T. Bowcock,
J. Buytaert,
E. Lemos Cid,
V. Coco,
P. Collins,
E. Dall'Occo,
K. de Bruyn,
S. de Capua,
F. Dettori,
K. Dreimanis,
D. Dutta,
L. Eklund,
T. Evans,
M. Ferro-Luzzi W. Funk,
L. Meyer Garcia,
O. Boente García
, et al. (41 additional authors not shown)
Abstract:
The Large Hadron Collider beauty (LHCb) detector is designed to detect decays of b- and c- hadrons for the study of CP violation and rare decays. At the end of the LHC Run 2, many of the LHCb measurements remained statistically dominated. In order to increase the trigger yield for purely hadronic channels, the hardware trigger will be removed, and the detector will be read out at 40 MHz. This, in…
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The Large Hadron Collider beauty (LHCb) detector is designed to detect decays of b- and c- hadrons for the study of CP violation and rare decays. At the end of the LHC Run 2, many of the LHCb measurements remained statistically dominated. In order to increase the trigger yield for purely hadronic channels, the hardware trigger will be removed, and the detector will be read out at 40 MHz. This, in combination with the five-fold increase in luminosity, requires radical changes to LHCb's electronics, and, in some cases, the replacement of entire sub-detectors with state-of-the-art detector technologies. The Vertex Locator (VELO) surrounding the interaction region is used to reconstruct the collision points (primary vertices) and decay vertices of long-lived particles (secondary vertices). The upgraded VELO will be composed of 52 modules placed along the beam axis divided into two retractable halves. The modules will each be equipped with 4 silicon hybrid pixel tiles, each read out by 3 VeloPix ASICs. The total output data rate anticipated for the whole detector will be around 1.6 Tbit/s. The highest occupancy ASICs will have pixel hit rates of approximately 900 Mhit/s, with the corresponding output data rate of 15 Gbit/s. The LHCb upgrade detector will be the first detector to read out at the full LHC rate of 40 MHz. The VELO upgrade will utilize the latest detector technologies to read out at this rate while maintaining the required radiation-hard profile and minimizing the detector material.
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Submitted 22 July, 2022; v1 submitted 16 June, 2020;
originally announced June 2020.
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The HEV Ventilator Proposal
Authors:
J. Buytaert,
A. Abed Abud,
K. Akiba,
A. Bay,
C. Bertella,
T. Bowcock,
W. Byczynski,
V. Coco,
P. Collins,
O. Augusto De Aguiar Francisco,
N. Dikic,
R. Dumps,
P. Durante,
A. Fernández Prieto,
V. Franco Lima,
R. Guida,
K. Hennessy,
D. Hutchcroft,
S. Ilic,
A. Jevtic,
K. Kapusniak,
E. Lemos Cid,
J. Lindner,
M. Milovanovic,
D. Murray
, et al. (6 additional authors not shown)
Abstract:
We propose the design of a ventilator which can be easily manufactured and integrated into the hospital environment to support COVID-19 patients. The unit is designed to support standard ventilator modes of operation, most importantly PRVC (Pressure Regulated Volume Control) and SIMV-PC (Synchronised Intermittent Mandatory Ventilation) modes. The unit is not yet an approved medical device and is i…
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We propose the design of a ventilator which can be easily manufactured and integrated into the hospital environment to support COVID-19 patients. The unit is designed to support standard ventilator modes of operation, most importantly PRVC (Pressure Regulated Volume Control) and SIMV-PC (Synchronised Intermittent Mandatory Ventilation) modes. The unit is not yet an approved medical device and is in the concept and prototyping stage. It is presented here to invite fast feedback for development and deployment in the face of the COVID-19 pandemic.
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Submitted 2 April, 2020; v1 submitted 1 April, 2020;
originally announced April 2020.
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PymePix: A python library for SPIDR readout of Timepix3
Authors:
Ahmed Al-Refaie,
Melby Johny,
Jonathan Correa,
David Pennicard,
Peter Svihra,
Andrei Nomerotski,
Sebastian Trippel,
Jochen Küpper
Abstract:
PymePix is a new Python 3 library that provides control and acquisition for the Timepix3-SPIDR hardware. The rich set of data-structures and intuitive routines reduces time and coding effort to quickly configure, acquire, and visualize data from Timepix3. The highly extensible high-performance data-pipeline allows for alteration of the Timepix3 datastream into a form that is convinient for the use…
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PymePix is a new Python 3 library that provides control and acquisition for the Timepix3-SPIDR hardware. The rich set of data-structures and intuitive routines reduces time and coding effort to quickly configure, acquire, and visualize data from Timepix3. The highly extensible high-performance data-pipeline allows for alteration of the Timepix3 datastream into a form that is convinient for the user. This library is intended to be easily inserted into a standard scientific software stack as well as to allow for more direct interaction of Timepix3 with interactive flavors of Python. Included with the library are two example programs using PymePix: pymepix-acq is a command line control and acquisition program that can capture UDP packets and decode them into pixels and triggers. The second is PymePix-Viewer, an online control and data-acquisition program for general use, but with features geared toward mass-spectroscopy and ion imaging.
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Submitted 16 August, 2019; v1 submitted 20 May, 2019;
originally announced May 2019.
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First demonstration of 3D optical readout of a TPC using a single photon sensitive Timepix3 based camera
Authors:
A. Roberts,
P. Svihra,
A. Al-Refaie,
H. Graafsma,
J. Küpper,
K. Majumdar,
K. Mavrokoridis,
A. Nomerotski,
D. Pennicard,
B. Philippou,
S. Trippel,
C. Touramanis,
J. Vann
Abstract:
The ARIADNE project is developing innovative optical readout technologies for two-phase liquid Argon time projection chambers (LArTPCs). Optical readout presents an exciting alternative to the current paradigm of charge readout. Optical readout is simple, scalable and cost effective. This paper presents first demonstration of 3D optical readout of TPC, using CF4 gas as a proof of principle. Both c…
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The ARIADNE project is developing innovative optical readout technologies for two-phase liquid Argon time projection chambers (LArTPCs). Optical readout presents an exciting alternative to the current paradigm of charge readout. Optical readout is simple, scalable and cost effective. This paper presents first demonstration of 3D optical readout of TPC, using CF4 gas as a proof of principle. Both cosmic rays and an Americium-241 alpha source have been imaged in 100 mbar CF4. A single-photon sensitive camera was developed by combining a Timepix3 (TPX3) based camera with an image intensifier. When a pixel of TPX3 is hit, a packet containing all information about the hit is produced. This packet contains the x,y coordinates of the pixel, time of arrival (ToA) and time over threshold (ToT) information. The z position of the hit in the TPC is determined by combining drift velocity with ToA information. 3D event reconstruction is performed by combining the pixels x,y location with this calculated z position. Calorimetry is performed using time over threshold, a measure of the intensity of the hit.
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Submitted 25 May, 2019; v1 submitted 23 October, 2018;
originally announced October 2018.
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Coincidence velocity map imaging using Tpx3Cam, a time stamping optical camera with 1.5 ns timing resolution
Authors:
Arthur Zhao,
Martin van Beuzekom,
Bram Bouwens,
Dmitry Byelov,
Irakli Chakaberia,
Chuan Cheng,
Erik Maddox,
Andrei Nomerotski,
Peter Svihra,
Jan Visser,
Vaclav Vrba,
Thomas Weinacht
Abstract:
We demonstrate a coincidence velocity map imaging apparatus equipped with a novel time stamping fast optical camera, Tpx3Cam, whose high sensitivity and ns timing resolution allow for simultaneous position and time-of-flight detection. This single detector design is simple, flexible and capable of highly differential measurements. We show detailed characterization of the camera and its application…
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We demonstrate a coincidence velocity map imaging apparatus equipped with a novel time stamping fast optical camera, Tpx3Cam, whose high sensitivity and ns timing resolution allow for simultaneous position and time-of-flight detection. This single detector design is simple, flexible and capable of highly differential measurements. We show detailed characterization of the camera and its application in strong field ionization experiments.
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Submitted 13 October, 2017; v1 submitted 19 July, 2017;
originally announced July 2017.
