"Optimized stacking order for 3D-stacked ICs considering the probability ..."

Chang Hao et al. (2014)

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DOI: 10.1109/VLSI-DAT.2014.6834877

access: closed

type: Conference or Workshop Paper

metadata version: 2017-05-26

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Chang Hao, Huaguo Liang, Li Yang, Yiming Ouyang:
Optimized stacking order for 3D-stacked ICs considering the probability and cost of failed bonding. VLSI-DAT 2014: 1-4

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