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"Si-based system-in-package design with broadband interconnection for ..."

Jiao Chu et al. (2021)

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DOI: 10.1587/ELEX.18.20210140

access: open

type: Journal Article

metadata version: 2022-10-13

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  dblp key:
  - journals/ieiceee/ChuLZCCC21
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  - https://dblp.org/rec/journals/ieiceee/ChuLZCCC21
Jiao Chu, Jun Li, Yunyan Zhou, Jia Cao, Pengwei Chen, Liqiang Cao:
Si-based system-in-package design with broadband interconnection for E-band applications. IEICE Electron. Express 18(8): 20210140 (2021)

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