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"A Novel Wafer-Level Packaging Solution For Mems."

Zhenfeng Wang et al. (2003)

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DOI: 10.1142/S1465876303001228

access: closed

type: Journal Article

metadata version: 2020-07-09

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  - journals/ijces/WangQWLJW03
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  - https://dblp.org/rec/journals/ijces/WangQWLJW03
Zhenfeng Wang, G. J. Qi, Jun Wei, Peck Cheng Lim, Yufeng Jin, C. K. Wong:
A Novel Wafer-Level Packaging Solution For Mems. Int. J. Comput. Eng. Sci. 4(2): 339-342 (2003)

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