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Low-temperature wafer bonding for MEMS packaging utilizing screen-printed sub-micron size Au particle patterns

Authors:

J. MizunoAuthors Info & Claims

Microelectronic Engineering, Volume 88, Issue 8

Pages 2275 - 2277

https://doi.org/10.1016/j.mee.2011.02.083

Published: 01 August 2011 Publication History

Abstract

In this study, a new wafer bonding method for MEMS (micro electro mechanical systems) packaging is presented. The seal lines of sub-micron size Au particles with a width of 50@mm were formed on wafers by means of screen-printing. The bonding process was carried out at 300^oC under reduced pressure, 1x10^-^3mbar. The bonded wafers were diced into 5mmx5mm individual chips. The bond strength of each chips was about 20MPa measured by a tensile test and about 40MPa by a shear test in the average. It was confirmed that two wafers were successfully bonded with screen-printed Au particle seal lines. The proposed method can be applied to practical MEMS packaging.

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Index Terms

Low-temperature wafer bonding for MEMS packaging utilizing screen-printed sub-micron size Au particle patterns
1. Hardware
2. Networks
  1. Network types
    1. Ad hoc networks
      1. Mobile ad hoc networks

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Elsevier Science Ltd.

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Published: 01 August 2011

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Abstract

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Recommendations

Glass frit bonding: an universal technology for wafer level encapsulation and packaging

Wafer level encapsulation of microsystems using glass frit bonding

Packaging-compatible wafer level capping of MEMS devices

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