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research-article

Strategy for electromagnetic interconnect modeling

Published: 01 November 2006 Publication History

Abstract

In order to design on-chip interconnect structures in a flexible way, a computer-aided design approach is advocated in three dimensions, describing high-frequency effects such as current redistribution due to the skin effect or eddy currents and the occurrence of slow-wave modes. The electromagnetic environment is described by a scalar electric potential and a magnetic vector potential. These potentials are not uniquely defined and in order to obtain a consistent discretization scheme, a gauge transformation field is introduced. The displacement current is taken into account to describe current redistribution and a small-signal analysis solution scheme is proposed based upon existing techniques for fields in semiconductors

Cited By

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  • (2017)Coupled circuit/EM simulation for radio frequency circuitsProceedings of the 54th Annual Design Automation Conference 201710.1145/3061639.3062219(1-6)Online publication date: 18-Jun-2017
  • (2016)Holistic coupled field and circuit simulationProceedings of the 2016 Conference on Design, Automation & Test in Europe10.5555/2971808.2971879(307-312)Online publication date: 14-Mar-2016
  • (2016)A fast time-domain EM-TCAD coupled simulation framework via matrix exponential with stiffness reductionInternational Journal of Circuit Theory and Applications10.1002/cta.210944:4(833-850)Online publication date: 1-Apr-2016
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cover image IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems  Volume 20, Issue 6
November 2006
105 pages

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IEEE Press

Publication History

Published: 01 November 2006

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Cited By

View all
  • (2017)Coupled circuit/EM simulation for radio frequency circuitsProceedings of the 54th Annual Design Automation Conference 201710.1145/3061639.3062219(1-6)Online publication date: 18-Jun-2017
  • (2016)Holistic coupled field and circuit simulationProceedings of the 2016 Conference on Design, Automation & Test in Europe10.5555/2971808.2971879(307-312)Online publication date: 14-Mar-2016
  • (2016)A fast time-domain EM-TCAD coupled simulation framework via matrix exponential with stiffness reductionInternational Journal of Circuit Theory and Applications10.1002/cta.210944:4(833-850)Online publication date: 1-Apr-2016
  • (2012)Efficient variation-aware EM-semiconductor coupled solver for the TSV structures in 3D ICProceedings of the Conference on Design, Automation and Test in Europe10.5555/2492708.2493053(1409-1412)Online publication date: 12-Mar-2012
  • (2012)A fast time-domain EM-TCAD coupled simulation framework via matrix exponentialProceedings of the International Conference on Computer-Aided Design10.1145/2429384.2429472(422-428)Online publication date: 5-Nov-2012
  • (2007)Three-dimensional on-chip inductance and resistance extractionProceedings of the 20th annual conference on Integrated circuits and systems design10.1145/1284480.1284540(218-223)Online publication date: 3-Sep-2007

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