Article

Electrical Modeling of Lithographic Imperfections

Authors:

Tuck-Boon Chan,

Rani S. Ghaida,

Puneet GuptaAuthors Info & Claims

VLSID '10: Proceedings of the 2010 23rd International Conference on VLSI Design

Pages 423 - 428

https://doi.org/10.1109/VLSI.Design.2010.24

Published: 03 January 2010 Publication History

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Abstract

Lithographic wavelength of 193nm has been used for past few generations of patterning and is likely to remain in use for next few technology generations (at least till 28nm technology half-node) as well. This deep sub-wavelength patterning has resulted in wafer shapes not resembling drawn rectilinear shapes. The resulting non-rectangular devices and wires are not handled by current generation modeling and analyses methods. In this paper, we present a survey of electrical modeling methods for such lithographic imperfections especially on transistor layers. We also discuss use contexts of such models as well as briefly present electrical implications of the likely future patterning candidate, namely double patterning.

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Henkel JBauer LDutt NGupta PNassif SShafique MTahoori MWehn N(2013)Reliable on-chip systems in the nano-eraProceedings of the 50th Annual Design Automation Conference10.1145/2463209.2488857(1-10)Online publication date: 29-May-2013
https://dl.acm.org/doi/10.1145/2463209.2488857
Chan TKahng AHu A(2012)Tunable sensors for process-aware voltage scalingProceedings of the International Conference on Computer-Aided Design10.1145/2429384.2429387(7-14)Online publication date: 5-Nov-2012
https://dl.acm.org/doi/10.1145/2429384.2429387
Chan TPant ACheng LGupta PScheffer LPhillips JHu A(2010)Design dependent process monitoring for back-end manufacturing cost reductionProceedings of the International Conference on Computer-Aided Design10.5555/2133429.2133452(116-122)Online publication date: 7-Nov-2010
https://dl.acm.org/doi/10.5555/2133429.2133452
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Electrical Modeling of Lithographic Imperfections
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VLSID '10: Proceedings of the 2010 23rd International Conference on VLSI Design

January 2010

471 pages

ISBN:9780769539287

Publisher

IEEE Computer Society

United States

Publication History

Published: 03 January 2010

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Henkel JBauer LDutt NGupta PNassif SShafique MTahoori MWehn N(2013)Reliable on-chip systems in the nano-eraProceedings of the 50th Annual Design Automation Conference10.1145/2463209.2488857(1-10)Online publication date: 29-May-2013
https://dl.acm.org/doi/10.1145/2463209.2488857
Chan TKahng AHu A(2012)Tunable sensors for process-aware voltage scalingProceedings of the International Conference on Computer-Aided Design10.1145/2429384.2429387(7-14)Online publication date: 5-Nov-2012
https://dl.acm.org/doi/10.1145/2429384.2429387
Chan TPant ACheng LGupta PScheffer LPhillips JHu A(2010)Design dependent process monitoring for back-end manufacturing cost reductionProceedings of the International Conference on Computer-Aided Design10.5555/2133429.2133452(116-122)Online publication date: 7-Nov-2010
https://dl.acm.org/doi/10.5555/2133429.2133452
Gupta P(2010)What is process window?ACM SIGDA Newsletter10.1145/1866975.186697640:8(1-1)Online publication date: 1-Aug-2010
https://dl.acm.org/doi/10.1145/1866975.1866976

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