research-article

Data reorganization in memory using 3D-stacked DRAM

Authors:

Franz Franchetti,

James C. HoeAuthors Info & Claims

ISCA '15: Proceedings of the 42nd Annual International Symposium on Computer Architecture

Pages 131 - 143

https://doi.org/10.1145/2749469.2750397

Published: 13 June 2015 Publication History

Abstract

In this paper we focus on common data reorganization operations such as shuffle, pack/unpack, swap, transpose, and layout transformations. Although these operations simply relocate the data in the memory, they are costly on conventional systems mainly due to inefficient access patterns, limited data reuse and roundtrip data traversal throughout the memory hierarchy. This paper presents a two pronged approach for efficient data reorganization, which combines (i) a proposed DRAM-aware reshape accelerator integrated within 3D-stacked DRAM, and (ii) a mathematical framework that is used to represent and optimize the reorganization operations.

We evaluate our proposed system through two major use cases. First, we demonstrate the reshape accelerator in performing a physical address remapping via data layout transform to utilize the internal parallelism/locality of the 3D-stacked DRAM structure more efficiently for general purpose workloads. Then, we focus on offloading and accelerating commonly used data reorganization routines selected from the Intel Math Kernel Library package. We evaluate the energy and performance benefits of our approach by comparing it against existing optimized implementations on state-of-the-art GPUs and CPUs. For the various test cases, in-memory data reorganization provides orders of magnitude performance and energy efficiency improvements via low overhead hardware.

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Akbarzadeh NDarabi SGheibi-Fetrat AMirzaei ASadrosadati MSarbazi-Azad H(2024)H3DM: A High-bandwidth High-capacity Hybrid 3D Memory Design for GPUsProceedings of the ACM on Measurement and Analysis of Computing Systems10.1145/36390388:1(1-28)Online publication date: 21-Feb-2024
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Index Terms

Data reorganization in memory using 3D-stacked DRAM
1. Hardware
  1. Hardware validation
  2. Integrated circuits
    1. Semiconductor memory
      1. Dynamic memory

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cover image ACM Conferences

ISCA '15: Proceedings of the 42nd Annual International Symposium on Computer Architecture

June 2015

768 pages

ISBN:9781450334020

DOI:10.1145/2749469

General Chair:
Debbie Marr
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Program Chair:
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ACM SIGARCH Computer Architecture News Volume 43, Issue 3S
ISCA'15
June 2015
745 pages
ISSN:0163-5964
DOI:10.1145/2872887
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