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Shielding effect of on-chip interconnect inductance

Published: 28 April 2003 Publication History

Abstract

Interconnect inductance introduces a shielding effect which decreases the effective capacitance seen by the driver of a circuit, reducing the gate delay. The effective capacitance of an RLC load driven by a CMOS inverter is analytically modeled. The interconnect inductance decreases the gate delay and increases the time required for the signal to propagate across an interconnect, reducing the overall signal propagation delay to drive an RLC load. Ignoring the line inductance overestimates the circuit delay, inefficiently oversizing the circuit driver. Considering line inductance in the design process saves gate area, thereby reducing the dynamic power dissipation. A reduction in power of 17% and area of 29% is achieved for an example circuit.

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Cited By

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  • (2007)Inductance aware performance and reliability analysis of high performance integrated circuits2007 IEEE International Conference on Electro/Information Technology10.1109/EIT.2007.4374478(91-95)Online publication date: May-2007
  • (2007)Wire shaping of RLC interconnectsIntegration, the VLSI Journal10.1016/j.vlsi.2006.06.00240:4(461-472)Online publication date: 1-Jul-2007
  • (2005)Fault tolerant bus architecture for deep submicron based processorsACM SIGARCH Computer Architecture News10.1145/1055626.105564733:1(148-155)Online publication date: 1-Mar-2005
  • Show More Cited By

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      cover image ACM Conferences
      GLSVLSI '03: Proceedings of the 13th ACM Great Lakes symposium on VLSI
      April 2003
      320 pages
      ISBN:1581136773
      DOI:10.1145/764808
      Permission to make digital or hard copies of all or part of this work for personal or classroom use is granted without fee provided that copies are not made or distributed for profit or commercial advantage and that copies bear this notice and the full citation on the first page. Copyrights for components of this work owned by others than ACM must be honored. Abstracting with credit is permitted. To copy otherwise, or republish, to post on servers or to redistribute to lists, requires prior specific permission and/or a fee. Request permissions from [email protected]

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      Publication History

      Published: 28 April 2003

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      Author Tags

      1. gate delay
      2. interconnect modeling
      3. on-chip inductance
      4. propagation delay
      5. shielding effect

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      GLSVLSI03: Great Lakes Symposium on VLSI 2003
      April 28 - 29, 2003
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      Overall Acceptance Rate 312 of 1,156 submissions, 27%

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      Cited By

      View all
      • (2007)Inductance aware performance and reliability analysis of high performance integrated circuits2007 IEEE International Conference on Electro/Information Technology10.1109/EIT.2007.4374478(91-95)Online publication date: May-2007
      • (2007)Wire shaping of RLC interconnectsIntegration, the VLSI Journal10.1016/j.vlsi.2006.06.00240:4(461-472)Online publication date: 1-Jul-2007
      • (2005)Fault tolerant bus architecture for deep submicron based processorsACM SIGARCH Computer Architecture News10.1145/1055626.105564733:1(148-155)Online publication date: 1-Mar-2005
      • (2005)Shielding effect of on-chip interconnect inductanceIEEE Transactions on Very Large Scale Integration (VLSI) Systems10.1109/TVLSI.2004.84231513:3(396-400)Online publication date: 1-Mar-2005
      • (2005)Gate Delay Estimation Based on Close-Ended Line Model2005 6th International Conference on ASIC10.1109/ICASIC.2005.1611480(934-937)Online publication date: 2005
      • (2005)Design Methodologies for on-Chip Inductive InterconnectInterconnect-Centric Design for Advanced SoC and NoC10.1007/1-4020-7836-6_4(85-124)Online publication date: 2005
      • (2003)Optimum wire shaping of an RLC interconnect2003 46th Midwest Symposium on Circuits and Systems10.1109/MWSCAS.2003.1562571(1459-1464)Online publication date: 2003

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