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View all- Flores GPerdigones FAracil CQuero J(2015)Pressurization method for controllable impulsion of liquids in microfluidic platformsMicroelectronic Engineering10.1016/j.mee.2015.05.002140:C(11-17)Online publication date: 1-Jun-2015
A cost-effective, wafer-level package process for microelectromechanical devices (MEMS) is presented. The movable part of MEMS device is encapsulated and protected while in wafer form so that commodity, lead-frame packaging can be used. A polymer ...
In this study, a new wafer bonding method for MEMS (micro electro mechanical systems) packaging is presented. The seal lines of sub-micron size Au particles with a width of 50@mm were formed on wafers by means of screen-printing. The bonding process was ...
This paper presents a fast, easy and low-cost method to create suspended structures using SU-8 photoresist. The method consists of laminating SU-8 foils on top of previously defined topographies, followed by SU-8 foil patterning. This surface-...
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