research-article

SunFloor 3D: a tool for networks on chip topology synthesis for 3D systems on chips

Authors:

Ciprian Seiculescu,

Srinivasan Murali,

Giovanni De MicheliAuthors Info & Claims

DATE '09: Proceedings of the Conference on Design, Automation and Test in Europe

Pages 9 - 14

Published: 20 April 2009 Publication History

Abstract

Three-dimensional integrated circuits are a promising approach to address the integration challenges faced by current Systems on Chips (SoCs). Designing an efficient Network on Chip (NoC) interconnect for a 3D SoC that not only meets the application performance constraints, but also the constraints imposed by the 3D technology, is a significant challenge. In this work we present a design tool, SunFloor 3D, to synthesize application-specific 3D NoCs. The proposed tool determines the best NoC topology for the application, finds paths for the communication flows, assigns the network components on to the 3D layers and performs a placement of them in each layer. We perform experiments on several SoC benchmarks and present a comparative study between 3D and 2D NoC designs. Our studies show large improvements in interconnect power consumption (average of 38%) and delay (average of 13%) for the 3D NoC when compared to the corresponding 2D implementation. Our studies also show that the synthesized topologies result in large power (average of 54%) and delay savings (average of 21%) when compared to standard topologies.

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Cited By

Lee DDas SDoppa JPande PChakrabarty K(2019)Impact of Electrostatic Coupling on Monolithic 3D-enabled Network on ChipACM Transactions on Design Automation of Electronic Systems10.1145/335715824:6(1-22)Online publication date: 17-Sep-2019
https://dl.acm.org/doi/10.1145/3357158
Lee DDas SDoppa JPande PChakrabarty K(2018)Performance and Thermal Tradeoffs for Energy-Efficient Monolithic 3D Network-on-ChipACM Transactions on Design Automation of Electronic Systems10.1145/322304623:5(1-25)Online publication date: 22-Aug-2018
https://dl.acm.org/doi/10.1145/3223046
Lee DDas SKim DDoppa JPande P(2018)Design Space Exploration of 3D Network-on-ChipACM Journal on Emerging Technologies in Computing Systems10.1145/319756714:3(1-26)Online publication date: 23-Oct-2018
https://dl.acm.org/doi/10.1145/3197567
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SunFloor 3D: a tool for networks on chip topology synthesis for 3D systems on chips
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Information & Contributors

Information

Published In

cover image ACM Conferences

DATE '09: Proceedings of the Conference on Design, Automation and Test in Europe

April 2009

1776 pages

ISBN:9783981080155

General Chairs:
Luca Benini
University of Bologna, IT
,
Giovanni De Micheli
EPFL, CH
,
Program Chairs:
Bashir Al-Hashimi
University of Southampton, UK
,
Wolfgang Mueller
University of Paderborn, DE

Sponsors

EDAA: European Design Automation Association
ECSI
EDAC: Electronic Design Automation Consortium
SIGDA: ACM Special Interest Group on Design Automation
The IEEE Computer Society TTTC
The IEEE Computer Society DATC
The Russian Academy of Sciences: The Russian Academy of Sciences

Publisher

European Design and Automation Association

Leuven, Belgium

Publication History

Published: 20 April 2009

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DATE '09

Sponsor:

EDAA
EDAC
SIGDA
The Russian Academy of Sciences

DATE '09: Design, Automation and Test in Europe

April 20 - 24, 2009

Nice, France

Acceptance Rates

Overall Acceptance Rate 518 of 1,794 submissions, 29%

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DATE '25

Sponsor:
sigda

Design, Automation and Test in Europe

March 31 - April 2, 2025

Lyon , France

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Citations

Cited By

Lee DDas SDoppa JPande PChakrabarty K(2019)Impact of Electrostatic Coupling on Monolithic 3D-enabled Network on ChipACM Transactions on Design Automation of Electronic Systems10.1145/335715824:6(1-22)Online publication date: 17-Sep-2019
https://dl.acm.org/doi/10.1145/3357158
Lee DDas SDoppa JPande PChakrabarty K(2018)Performance and Thermal Tradeoffs for Energy-Efficient Monolithic 3D Network-on-ChipACM Transactions on Design Automation of Electronic Systems10.1145/322304623:5(1-25)Online publication date: 22-Aug-2018
https://dl.acm.org/doi/10.1145/3223046
Lee DDas SKim DDoppa JPande P(2018)Design Space Exploration of 3D Network-on-ChipACM Journal on Emerging Technologies in Computing Systems10.1145/319756714:3(1-26)Online publication date: 23-Oct-2018
https://dl.acm.org/doi/10.1145/3197567
Manna KSwami SChattopadhyay SSengupta I(2016)Integrated Through-Silicon Via Placement and Application Mapping for 3D Mesh-Based NoC DesignACM Transactions on Embedded Computing Systems10.1145/296844616:1(1-25)Online publication date: 3-Nov-2016
https://dl.acm.org/doi/10.1145/2968446
Rezaei SMazloumi AModarressi MLotfi-Kamran P(2016)Dynamic Resource Sharing for High-Performance 3-D Networks-on-ChipIEEE Computer Architecture Letters10.1109/LCA.2015.244853215:1(5-8)Online publication date: 1-Jan-2016
https://dl.acm.org/doi/10.1109/LCA.2015.2448532
Lee JKang KChoi K(2015)REDELFACM Journal on Emerging Technologies in Computing Systems10.1145/275156012:3(1-22)Online publication date: 21-Sep-2015
https://dl.acm.org/doi/10.1145/2751560
Zhou PYuh PSapatnekar S(2012)Optimized 3D Network-on-Chip Design Using Simulated AllocationACM Transactions on Design Automation of Electronic Systems10.1145/2159542.215954417:2(1-19)Online publication date: 1-Apr-2012
https://dl.acm.org/doi/10.1145/2159542.2159544
Jang WHe OYang JPan DPhillips JHu AGraeb H(2011)Chemical-mechanical polishing aware application-specific 3D NoC designProceedings of the International Conference on Computer-Aided Design10.5555/2132325.2132372(207-212)Online publication date: 7-Nov-2011
https://dl.acm.org/doi/10.5555/2132325.2132372
Jiao JFu YPalesi MKumar S(2011)B2RACProceedings of the 4th International Workshop on Network on Chip Architectures10.1145/2076501.2076505(17-22)Online publication date: 4-Dec-2011
https://dl.acm.org/doi/10.1145/2076501.2076505
Ebrahimi MDaneshtalab MLiljeberg PPlosila JTenhunen HMarculescu RKishinevsky MGinosar RChatha K(2011)Exploring partitioning methods for 3D Networks-on-Chip utilizing adaptive routing modelProceedings of the Fifth ACM/IEEE International Symposium on Networks-on-Chip10.1145/1999946.1999958(73-80)Online publication date: 1-May-2011
https://dl.acm.org/doi/10.1145/1999946.1999958
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