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Silicon systems have been part of automobiles for a long time. The physical design methodology to address the quality, reliability, and safety challenges of these systems are common knowledge in the leading automotive semiconductor companies. The rise of ...

With the advancements in 2.5/3D fabrication offered by Foundry Technologies for unleashing computing power, EDA tools must adapt and take a direction to be more integrated and IC centric for multi-chiplet system design. 3D stacking introduces extra ...

3D Integrated Circuits (3D-ICs) represent a significant advancement in semiconductor technology, offering enhanced functionality in smaller form factors, improved performance, and cost reductions. These 3D-ICs, particularly those utilizing Through-...

Package routing is typically done by semi-auto or manual manners in order to meet several customized requests for different design styles. However, in recent years, the scale of package designs rapidly enlarges, and routing rules become more and more ...

As technology scaling is coming to an end, 3D integration is a promising technology to continue transistor density scaling in the future and facilitate new architectural designs. However heat removal is a serious chalenge in 3D ICs. A promising solution ...

In 3D ICs, TSV cross coupling can seriously degrade circuit performance if it is not sufficiently considered in a design. Cross coupling is heavily dependent on how TSVs are placed, and should be considered during the floorplanning of the chip. In this ...

The three dimensional circuit (3D-IC) brings forth new challenges to physical design such as allocation and management of through-silicon-vias (TSVs). Meanwhile, the thermal issues in 3D-IC becomes significant necessitating the use of active cooling ...

It is widely known that fabrication and thermal variations influence circuit delay. In three dimensional circuits (3D-ICs), due to the incorporation of through-silicon-vias (TSVs), thermal stress also becomes an increasing contributor to gate delay. As ...

In 3D ICs, interlayer communication is achieved using through-silicon-vias (TSVs), which can suffer from cross coupling if placed naïvely. In this paper, cross coupling between TSVs is modeled, and a chip-scale TSV coupling mitigation scheme is ...

Micro-channel based liquid cooling has significant capability of removing high density heat in 3D-ICs. The conventional micro-channel structures investigated for cooling 3D-ICs use straight channels. However, the presence of TSVs which form obstacles to ...