Location via proxy:   [ UP ]  
[Report a bug]   [Manage cookies]                
skip to main content
10.1145/3505170.3511474acmconferencesArticle/Chapter ViewAbstractPublication PagesispdConference Proceedingsconference-collections
invited-talk

Challenges for Automating Package Routing

Published: 13 April 2022 Publication History

Abstract

Package routing is typically done by semi-auto or manual manners in order to meet several customized requests for different design styles. However, in recent years, the scale of package designs rapidly enlarges, and routing rules become more and more complicated, such that the engineering effort of the manual solution increases dramatically. Therefore, the need of full-auto solution becomes necessary and critical. In addition, in order to build an automatic design flow for 3D-IC, full-auto package routing is one of most important pieces. There are many challenges for realizing full-auto package routing solution. Some of the challenges will be introduced in this paper.

Cited By

View all
  • (2023)Delay-Matching Routing for Advanced Packages2023 IEEE/ACM International Conference on Computer Aided Design (ICCAD)10.1109/ICCAD57390.2023.10323679(1-8)Online publication date: 28-Oct-2023
  • (2023)Any-Angle Routing for Redistribution Layers in 2.5D IC Packages2023 60th ACM/IEEE Design Automation Conference (DAC)10.1109/DAC56929.2023.10247899(1-6)Online publication date: 9-Jul-2023
  1. Challenges for Automating Package Routing

    Recommendations

    Comments

    Information & Contributors

    Information

    Published In

    cover image ACM Conferences
    ISPD '22: Proceedings of the 2022 International Symposium on Physical Design
    April 2022
    240 pages
    ISBN:9781450392105
    DOI:10.1145/3505170
    Permission to make digital or hard copies of part or all of this work for personal or classroom use is granted without fee provided that copies are not made or distributed for profit or commercial advantage and that copies bear this notice and the full citation on the first page. Copyrights for third-party components of this work must be honored. For all other uses, contact the Owner/Author.

    Sponsors

    Publisher

    Association for Computing Machinery

    New York, NY, United States

    Publication History

    Published: 13 April 2022

    Check for updates

    Author Tags

    1. 3d-ic
    2. chip-package-board co-design
    3. package routing

    Qualifiers

    • Invited-talk

    Conference

    ISPD '22
    Sponsor:
    ISPD '22: International Symposium on Physical Design
    March 27 - 30, 2022
    Virtual Event, Canada

    Acceptance Rates

    Overall Acceptance Rate 62 of 172 submissions, 36%

    Upcoming Conference

    ISPD '25
    International Symposium on Physical Design
    March 16 - 19, 2025
    Austin , TX , USA

    Contributors

    Other Metrics

    Bibliometrics & Citations

    Bibliometrics

    Article Metrics

    • Downloads (Last 12 months)43
    • Downloads (Last 6 weeks)4
    Reflects downloads up to 11 Feb 2025

    Other Metrics

    Citations

    Cited By

    View all
    • (2023)Delay-Matching Routing for Advanced Packages2023 IEEE/ACM International Conference on Computer Aided Design (ICCAD)10.1109/ICCAD57390.2023.10323679(1-8)Online publication date: 28-Oct-2023
    • (2023)Any-Angle Routing for Redistribution Layers in 2.5D IC Packages2023 60th ACM/IEEE Design Automation Conference (DAC)10.1109/DAC56929.2023.10247899(1-6)Online publication date: 9-Jul-2023

    View Options

    Login options

    View options

    PDF

    View or Download as a PDF file.

    PDF

    eReader

    View online with eReader.

    eReader

    Figures

    Tables

    Media

    Share

    Share

    Share this Publication link

    Share on social media